Semiconductor chip etching device

Abstract

The invention discloses a semiconductor chip etching device which comprises a base, an etching box is installed on the base, etching liquid is contained in the etching box, a filtering box capable of being reset is arranged in the etching box, a liquid drainage groove is formed in the bottom of the filtering box in a penetrating mode, a filtering net is installed in the liquid drainage groove, and a liquid outlet is formed in the bottom of the filtering box. A detachable supporting plate is installed in the filter box, a placement hole is formed in the supporting plate in a penetrating mode, a supporting net is fixed to the bottom of the supporting plate, the supporting net blocks the placement hole, a semiconductor chip is placed in the placement hole and can be supported by the supporting net, and a moving box capable of moving up and down is installed on the base. The motor continuously works to carry out pulse type washing and pulse type cleaning on the surface of the etched semiconductor chip, suspended solids can be collected in the process that the semiconductor chip is etched and moves upwards, and meanwhile, the surface of the semiconductor chip can be air-dried and cleaned.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip etching, and in particular to a semiconductor chip etching device. Background Art

[0002] A semiconductor chip is a semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet.

[0003] At present, in the etching process, the semiconductor chip is generally directly placed in the etching device to contact with the etching liquid for etching, but the semiconductor chip will sink and stack in the etching device, which will cause some semiconductor chips to not be completely etched. If the immersion liquid is stirred, it will cause wear between the semiconductors.

[0004] In addition, some suspended impurities will float on the surface of the etching solution after use. If it is not cleaned in time, when the semiconductor chip is taken out from the etching device, these suspended impurities will adhere to the surface of the semiconductor chip, affecting subsequent processing. Therefore, the semiconductor chip needs to be processed again after it is taken out, which increases the processing steps. After the semiconductor chip is taken out from the etching solution, etching liquid will remain on the surface. If it is not cleaned, it will affect the subsequent removal by the staff; if it is manually processed, it may be necessary to stop the etching process of the semiconductor chip, which will reduce the etching efficiency of the semiconductor chip; for this reason, the present application proposes a semiconductor chip etching device. Summary of the invention

[0005] The purpose of the present invention is to solve the above technical problems and to propose a semiconductor chip etching device.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A semiconductor chip etching device comprises a base, an etching box is installed on the base, the etching box contains etching liquid, a filter box that can be reset is arranged in the etching box, a drainage groove is penetrated at the bottom of the filter box, a filter screen is installed in the drainage groove, a detachable support plate is installed in the filter box, a placement hole is penetrated on the support plate, a support net is fixed on the bottom of the support plate, the support net blocks the placement hole, a semiconductor chip placed in the placement hole can be supported by the support net, and a movable plate that can be moved up and down is installed on the base A moving box, a sealing plate is fixed on the inner wall of the moving box, a diversion cavity is formed between the sealing plate and the moving box, a plurality of liquid supply pipes opposite to the placement holes are penetrated on the sealing plate, the moving box moves down to connect with the filter box and drives the filter box to sink in the etching liquid, so as to etch the semiconductor chip, a pumping mechanism capable of conveying the etching liquid into the moving box is installed on the moving box, the etching liquid flows into the placement holes through the liquid supply pipes to flush the semiconductor chip, and when the moving box and the filter box are reset, the etching liquid can be filtered and stored in the filter box.

[0008] Preferably, four support columns are fixedly connected to the base, a mounting plate is installed on the four support columns, two electric push rods are installed on the mounting plate, a pull rod is fixed to the output end of the electric push rod, and the pull rod is fixedly connected to the upper end of the moving box.

[0009] Preferably, four guide columns are fixed in the etching box, and the four guide columns are each provided with a slider slidably connected thereto, the slider is fixedly connected to the filter box, a spring is fixed at the bottom of the slider, the lower end of the spring is fixedly connected to the inner bottom of the etching box, and the spring is sleeved on the outside of the guide column.

[0010] Preferably, a drain pipe is installed on the etching box, and a control valve is installed on the drain pipe.

[0011] Preferably, a support frame is fixed to the inner wall of the etching box, and the support plate is placed on the support frame.

[0012] Preferably, a rectangular frame is fixed to the inner wall of the movable box, and the outer wall of the rectangular frame is slidably matched with the inner wall of the filter box.

[0013] Preferably, when the movable box abuts against the filter box, the liquid supply pipe and the placement hole are arranged opposite to each other.

[0014] Preferably, the pumping mechanism includes a motor and a support seat installed at the upper end of the moving box, a piston cylinder is installed on the support seat, a moving piston that can move back and forth is slidably connected in the piston cylinder, a connecting rod is hingedly connected to the moving piston, an axle is fixed to the output end of the motor, a circular plate is fixed on the axle, the connecting rod is eccentrically hingedly connected to the upper end of the circular plate, a liquid inlet pipe and a liquid outlet pipe are installed on the piston cylinder, a first one-way valve is installed on the liquid inlet pipe, the liquid outlet pipe is connected to the diversion chamber, and a second one-way valve is installed on the liquid outlet pipe.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The etching liquid enters the filter box through the drainage trough and the filter and finally submerges the semiconductor chip, so that the semiconductor chip can be etched. In this way, the suspended matter filtered by the filter during the last etching process can be backwashed to avoid the filter being blocked and affecting the discharge of the etching liquid.

[0017] 2. The etching liquid is discharged through the liquid supply pipe and impacts the semiconductor chip, which can flush the semiconductor chip to make it move, and move the part that is against the support network, so that the semiconductor chip can be etched more effectively.

[0018] 3. The etching liquid is discharged through the liquid supply pipe and impacts the semiconductor chip, which can flush out the impurities produced by the etching of the semiconductor chip.

[0019] 4. When the moving box is filled with etching liquid, the etching liquid is intermittently delivered to the diversion chamber, which causes the pressure in the diversion chamber to increase intermittently. In this way, the liquid supply pipe is discharged in a pulsed manner, and then the etching liquid has a pulsed impact on the semiconductor chip, which makes the semiconductor chip more effectively impacted and vibrated, which is beneficial to the etching and cleaning of the semiconductor chip.

[0020] 5. Transport air into the diversion chamber to increase the pressure in the diversion chamber and speed up the discharge of the etching liquid through the liquid supply pipe. The rapidly discharged etching liquid will drive the suspended matter to be discharged through the liquid supply pipe, which is not easy to remain in the diversion chamber, thus avoiding accumulation in the diversion chamber.

[0021] 6. The etching solution falls on the semiconductor chip. Due to the rapid flow of the etching solution, it is difficult for suspended matter to fall on the semiconductor chip.

[0022] 7. The air is discharged in pulses through the liquid supply pipe and blown onto the semiconductor chip, which can dry the semiconductor chip and quickly remove the etching liquid on the surface, so that the staff can take the semiconductor chip.

[0023] 8. It can effectively avoid the drawbacks of semiconductor chip stacking being unable to be effectively etched and semiconductor chips being scratched by collision.

[0024] 9. The motor works continuously. During the etching process of the semiconductor chip, the semiconductor chip can be flushed and moved, so that the semiconductor chip can be etched more comprehensively. At the same time, the impurities generated by the etching of the semiconductor chip can be flushed and cleaned, so as to better etch the semiconductor chip. When the semiconductor chip leaves the etching solution, the suspended matter suspended in the etching solution can be discharged and filtered and collected, and the suspended matter can be prevented from remaining on the semiconductor chip. When the semiconductor chip leaves the etching solution, the etching solution remaining on the semiconductor chip can be cleaned for the staff to take. The whole process is smooth, and the suspended matter can be collected and processed during the etching process of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of a semiconductor chip etching device proposed by the present invention;

[0026] Figure 2 This is a schematic diagram of the front side of a piston cylinder in a semiconductor chip etching device proposed by the present invention;

[0027] Figure 3 A schematic diagram of the rear side of a piston cylinder in a semiconductor chip etching device proposed by the present invention;

[0028] Figure 4 This is a schematic diagram of the structure of an etching box in a semiconductor chip etching device proposed by the present invention;

[0029] Figure 5 This is a schematic structural diagram of a spring in a semiconductor chip etching device proposed by the present invention;

[0030] Figure 6 A cross-sectional view of a movable box in a semiconductor chip etching device proposed by the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of a filter screen in a semiconductor chip etching device proposed by the present invention;

[0032] Figure 8 This is a bottom view of a semiconductor chip etching device proposed by the present invention.

[0033] In the figure: 1 base, 2 support column, 3 mounting plate, 4 electric push rod, 5 moving box, 6 pull rod, 7 etching box, 8 drainage pipe, 9 motor, 10 shaft rod, 11 round plate, 12 moving piston, 13 support seat, 14 piston cylinder, 15 rectangular frame, 16 first one-way valve, 17 second one-way valve, 18 liquid inlet pipe, 19 liquid outlet pipe, 20 filter box, 21 support plate, 22 slider, 23 spring, 24 guide column, 25 support frame, 26 drainage trough, 27 filter screen, 28 sealing plate, 29 liquid supply pipe, 30 diversion cavity, 31 connecting rod, 32 placement hole. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0035] Reference Figure 1-Figure 8 A semiconductor chip etching device includes a base 1, an etching box 7 is installed on the base 1, the etching box 7 contains etching liquid, a drain pipe 8 is installed on the etching box 7, and a control valve is installed on the drain pipe 8. The control valve can be opened to discharge the etching liquid in the etching box 7 for replacement.

[0036] A filter box 20 capable of being reset is provided in the etching box 7. Four guide columns 24 are fixed in the etching box 7. Slide blocks 22 slidably connected thereto are sleeved on the four guide columns 24. The slide blocks 22 are fixedly connected to the filter box 20. A spring 23 is fixed at the bottom of the slide block 22. The lower end of the spring 23 is fixedly connected to the inner bottom of the etching box 7. The spring 23 is sleeved on the outside of the guide column 24. The slide block 22 and the filter box 20 can be supported by the spring 23. In the initial state, the filter box 20 is located above the etching liquid.

[0037] A drainage trough 26 is provided through the bottom of the filter box 20, and a filter screen 27 is installed in the drainage trough 26. A detachable support plate 21 is installed in the filter box 20. A support frame 25 is fixed to the inner wall of the etching box 7. The support plate 21 is placed on the support frame 25. The support plate 21 can be supported by the support frame 25, so that its stability in the filter box 20 can be ensured, and the support plate 21 can be taken out by pulling up.

[0038] A placement hole 32 is penetrated through the support plate 21, and the inner diameter of the placement hole 32 is larger than the diameter of the semiconductor chip; a support net is fixed to the bottom of the support plate 21, and the support net blocks the placement hole 32. The semiconductor chip placed in the placement hole 32 can be supported by the support net. The support net can not only support the semiconductor chip, but also enable the etching solution to be discharged through the placement hole 32.

[0039] A moving box 5 capable of moving up and down is installed on the base 1, four supporting columns 2 are fixedly connected to the base 1, a mounting plate 3 is installed on the four supporting columns 2, two electric push rods 4 are installed on the mounting plate 3, a pull rod 6 is fixed to the output end of the electric push rod 4, the pull rod 6 is fixedly connected to the upper end of the moving box 5, the output end of the electric push rod 4 moves to drive the pull rod 6 to move, so that you can realize the moving box 5 to move up and down.

[0040] A sealing plate 28 is fixed to the inner wall of the movable box 5, and a diversion cavity 30 is formed between the sealing plate 28 and the movable box 5. A plurality of liquid supply pipes 29 opposite to the placement holes 32 are penetrated through the sealing plate 28. When the movable box 5 and the filter box 20 are against each other, the liquid supply pipes 29 are arranged opposite to the placement holes 32, so that the etching liquid can be more effectively and concentratedly impacted on the semiconductor chip.

[0041] The movable box 5 moves downward to connect with the filter box 20 and drives the filter box 20 to sink in the etching liquid, so as to etch the semiconductor chip. The movable box 5 is equipped with a pumping mechanism capable of conveying the etching liquid into the movable box 5. The etching liquid flows into the placement hole 32 through the liquid supply pipe 29 to flush the semiconductor chip. When the movable box 5 and the filter box 20 are reset, the etching liquid can be filtered and stored in the filter box 20.

[0042] The pumping mechanism is explained as follows: the pumping mechanism includes a motor 9 and a support seat 13 installed at the upper end of the moving box 5, a piston cylinder 14 is installed on the support seat 13, a moving piston 12 that can move back and forth is slidably connected in the piston cylinder 14, a connecting rod 31 is hingedly connected to the moving piston 12, a shaft 10 is fixed to the output end of the motor 9, a circular plate 11 is fixed to the shaft 10, the connecting rod 31 is eccentrically hingedly connected to the upper end of the circular plate 11, a liquid inlet pipe 18 and a liquid outlet pipe 19 are installed on the piston cylinder 14, a first one-way valve 16 is installed on the liquid inlet pipe 18, wherein the first one-way valve 16 only allows the etching liquid to enter the piston cylinder 14 through the liquid inlet pipe 18; the liquid outlet pipe 19 is connected to the diversion chamber 30, a second one-way valve 17 is installed on the liquid outlet pipe 19, and the second one-way valve 17 only allows the etching liquid to be transported to the liquid outlet pipe 19 through the piston cylinder 14.

[0043] When in use, the staff places the semiconductor chip in the placement hole 23, and then places the entire support plate 21 in the filter box 20 and against the support frame 25, at which time the filter box 20 is located above the etching liquid; then the electric push rod 4 is started, and the electric push rod 4 drives the moving box 5 to move downward, and as the moving box 5 moves downward, the rectangular frame 15 slides in the filter box 20, and finally the moving box 5 and the filter box 20 are against each other, and as the output end of the electric push rod 4 moves downward, the moving box 5 drives the filter box 20 to move downward, and finally the filter box 20 is located in the etching liquid, and at this time the liquid inlet pipe 18 enters the etching liquid;

[0044] The etching liquid enters the filter box 20 through the drain trough 26 and the filter 27 and finally submerges the semiconductor chip, and the semiconductor chip can be etched. In this way, the suspended matter filtered by the filter 27 during the last etching process can be backwashed to prevent the filter 27 from being blocked and affecting the discharge of the etching liquid.

[0045] The motor 9 is started, and the motor 9 drives the shaft 10 to rotate. The rotation of the shaft 10 drives the circular plate 11 to rotate. The rotation of the circular plate 11 drives the connecting rod 31 to move. The movement of the connecting rod 31 drives the moving piston 12 to reciprocate in the piston cylinder 14. When the moving piston 12 moves close to the motor 9, the etching liquid can be sucked into the piston cylinder 14 through the liquid inlet pipe 18. When the moving piston 12 moves away from the motor 9, the etching liquid in the piston cylinder 14 can be transported to the diverting chamber 30. In this way, the continuous movement of the moving piston 12 can transport the etching liquid to the diverting chamber 30. The etching liquid is discharged through the liquid supply pipe 29 and impacts the semiconductor chip, which can not only flush the semiconductor chip to make it move, but also make the part that is against the support net move, so that the semiconductor chip can be etched more effectively; at the same time, impurities generated by the etching of the semiconductor chip can be flushed and removed;

[0046] When the moving box 5 is filled with the etching liquid, the etching liquid is intermittently delivered to the diverter chamber 30, thereby causing the pressure in the diverter chamber 30 to increase intermittently. In this way, the liquid supply pipe 29 discharges the liquid in a pulsed manner, and then the etching liquid impacts the semiconductor chip in a pulsed manner, so that the semiconductor chip is more effectively impacted and vibrated, which is beneficial to the etching and cleaning of the semiconductor chip.

[0047] Part of the impurities generated by etching of the semiconductor chip enters the filter box 20 through the support net. Since the impurities float on the surface of the etching solution, and since the etching solution is continuously supplied to the movable box 5, part of the impurities will enter the movable box 5.

[0048] After the etching work is completed, the electric push rod 4 drives the moving box 5 to reset. At this time, the motor 9 is still working. As the moving box 5 is reset, the liquid inlet pipe 18 is separated from the etching liquid. Under the action of the spring 23, the slider 22 and the filter box 20 are reset. At this time, the moving piston 12 moves, and air enters the piston cylinder 14 through the liquid inlet pipe 18. Then, the air is transported to the shunt chamber 30, so that the pressure in the shunt chamber 30 can be increased, and the etching liquid can be discharged through the liquid supply pipe 29 quickly. The etching liquid discharged quickly will drive the suspended matter to be discharged through the liquid supply pipe 29, and it is not easy to remain in the shunt chamber 30; the etching liquid falls on the semiconductor chip. Due to the rapid flow of the etching liquid, the suspended matter is not easy to fall on the semiconductor chip, but some of the suspended matter may fall on the semiconductor chip;

[0049] Since air is transported into the diversion chamber 30 at this time, the air is discharged in a pulsed manner through the liquid supply pipe 29 and blown onto the semiconductor chip, so that the semiconductor chip can be air-dried and the etching liquid on the surface can be quickly removed, so that the staff can take the semiconductor chip, and the support plate 21 can be removed as a whole, or the semiconductor chip can be taken out separately;

[0050] Since the used etching liquid falls into the filter box 20, the finally filtered etching liquid flows into the etching box 7 again, can be recycled and there is no suspended matter in the etching liquid; after a period of use, the support plate 21 can be removed and the filter screen 27 can be cleaned;

[0051] This can effectively avoid the drawbacks of the semiconductor chip stack being unable to be effectively etched and the semiconductor chip being scratched by collision;

[0052] Remove the semiconductor chip and place the semiconductor chip to be processed, and repeat the above steps;

[0053] In summary, the motor 9 works continuously, and the semiconductor chip can be flushed and moved during the etching process of the semiconductor chip, so that the semiconductor chip can be etched more comprehensively, and the impurities generated by the etching of the semiconductor chip can be flushed and cleaned, so as to better etch the semiconductor chip; when the semiconductor chip leaves the etching solution, the suspended matter suspended in the etching solution can be discharged and filtered and collected, and the suspended matter can be prevented from remaining on the semiconductor chip, and the etching solution remaining on the semiconductor chip can also be cleaned for the staff to take, and the whole process is smooth, and the suspended matter can be collected and processed during the etching process of the semiconductor chip.

[0054] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip etching device, comprising a base (1), characterized in that: The base (1) is provided with an etching box (7), wherein the etching box (7) contains etching liquid, wherein the etching box (7) is provided with a filter box (20) which can be reset, wherein a drainage groove (26) is provided through the bottom of the filter box (20), wherein a filter screen (27) is installed in the drainage groove (26), wherein a detachable support plate (21) is installed in the filter box (20), wherein a placement hole (32) is provided through the support plate (21), wherein a support net is fixed to the bottom of the support plate (21), wherein the support net blocks the placement hole (32), wherein a semiconductor chip placed in the placement hole (32) can be supported by the support net, and wherein a movable box (5) which can be moved up and down is provided on the base (1), wherein the movable box (5) can be moved up and down, ... A sealing plate (28) is fixed to the inner wall of the box (5), a flow dividing chamber (30) is formed between the sealing plate (28) and the movable box (5), a plurality of liquid supply pipes (29) are provided through the sealing plate (28) and are opposite to the placement holes (32), the movable box (5) moves downward to connect with the filter box (20) and drives the filter box (20) to sink into the etching liquid, so as to etch the semiconductor chip, the movable box (5) is equipped with a pumping mechanism capable of conveying the etching liquid into the movable box (5), the etching liquid flows into the placement holes (32) through the liquid supply pipes (29) to flush the semiconductor chip, and when the movable box (5) and the filter box (20) are reset, the etching liquid can be filtered and stored in the filter box (20).

2. A semiconductor chip etching device according to claim 1, characterized in that: Four support columns (2) are fixedly connected to the base (1), a mounting plate (3) is installed on the four support columns (2), two electric push rods (4) are installed on the mounting plate (3), a pull rod (6) is fixed to the output end of the electric push rod (4), and the pull rod (6) is fixedly connected to the upper end of the moving box (5).

3. A semiconductor chip etching device according to claim 1, characterized in that: Four guide columns (24) are fixed in the etching box (7), and the four guide columns (24) are all sleeved with a slider (22) slidably connected thereto, and the slider (22) is fixedly connected to the filter box (20), and a spring (23) is fixed at the bottom of the slider (22), and the lower end of the spring (23) is fixedly connected to the inner bottom of the etching box (7), and the spring (23) is sleeved on the outside of the guide column (24).

4. A semiconductor chip etching device according to claim 1, characterized in that: The etching box (7) is provided with a drain pipe (8), and the drain pipe (8) is provided with a control valve.

5. The semiconductor chip etching device according to claim 1, characterized in that: A support frame (25) is fixed to the inner wall of the etching box (7), and the support plate (21) is placed on the support frame (25).

6. A semiconductor chip etching device according to claim 1, characterized in that: A rectangular frame (15) is fixed to the inner wall of the moving box (5), and the outer wall of the rectangular frame (15) is slidably matched with the inner wall of the filter box (20).

7. A semiconductor chip etching device according to claim 1, characterized in that: When the moving box (5) and the filtering box (20) are in contact with each other, the liquid supply pipe (29) and the placement hole (32) are arranged opposite to each other.

8. The semiconductor chip etching device according to claim 1, characterized in that: The pumping mechanism comprises a motor (9) and a support seat (13) mounted on the upper end of the moving box (5); a piston cylinder (14) is mounted on the support seat (13); a moving piston (12) capable of reciprocating movement is slidably connected in the piston cylinder (14); a connecting rod (31) is hingedly connected to the moving piston (12); a shaft (10) is fixed to the output end of the motor (9); a circular plate (11) is fixed to the shaft (10); the connecting rod (31) is eccentrically hingedly connected to the upper end of the circular plate (11); a liquid inlet pipe (18) and a liquid outlet pipe (19) are mounted on the piston cylinder (14); a first one-way valve (16) is mounted on the liquid inlet pipe (18); the liquid outlet pipe (19) is connected to the diversion chamber (30); and a second one-way valve (17) is mounted on the liquid outlet pipe (19).

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