Turnover mechanism for trimming and forming semiconductor chip

Abstract

The invention discloses an overturning mechanism for semiconductor chip rib cutting and forming, and belongs to the technical field of semiconductor chip processing. The overturning mechanism is characterized in that the upper side wall of a base table is fixedly connected with a first vertical plate and a second vertical plate which are symmetrically arranged, and one side of the first vertical plate is fixedly connected with an overturning mechanism; one end of the overturning mechanism penetrates through the first vertical plate and is fixedly connected with an overturning box shell, the peripheral side walls of the overturning box shell are fixedly connected with storage frames used for storing semiconductor chips, one side of the second vertical plate is fixedly connected with a negative pressure pump, one end of the negative pressure pump is communicated with a fixing pipe, and the fixing pipe is fixedly connected with the first vertical plate. The side, away from the first vertical plate, of the overturning box shell is rotationally connected with a fixed disc through a bearing ring. Through the arrangement of the overturning mechanism, the four storage frames, the negative pressure pump, the conveying mechanism and the valve mechanism, the functions of overturning, automatic discharging and conveying of chips are achieved, alternate overturning transposition machining is conducted on multiple stations, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, in particular to a flipping mechanism for semiconductor chip cutting and forming. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Since the thickness difference between the upper and lower plastic packages of some chip products is too large, if the same side of the strip is used during the strip cutting and molding and separation steps, it will be difficult for the final molded product to meet the requirements. Therefore, a flipping device is required to flip the strip after the cutting step before entering the molding and separation step.

[0003] In the flipping mechanism for semiconductor chip strip cutting and forming equipment in China patent (patent number: CN112660766B), the device includes a flipping guide rail, the flipping guide rail is adapted to be equipped with a strip pusher, the flipping guide rail is driven to flip by a rotating cylinder, and the flipping guide rail is equipped with a lifting cylinder. The strip flipping mechanism of this structure separates the pusher claw of the strip manipulator from the flipping guide rail, and the flipping guide rail moves up and down alone, so that the front and back sides of the flipping guide rail can be fed. The invention has fewer reset steps and effectively improves production efficiency; at the same time, the lower manipulator pusher claw is eliminated, effectively reducing costs. However, the device needs to flip a chip, and then use the pusher claw to push the chip to the forming separation unit before the next chip can be cut and formed. The blank period between processing is long, which affects the processing efficiency. Summary of the invention

[0004] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a flipping mechanism for cutting and forming semiconductor chips. By setting a flipping mechanism, a flipping box shell, four storage frames, a negative pressure pump, a conveying mechanism and a valve mechanism, the flipping operation of the chip is realized and automatic blanking and conveying are performed, and multiple workstations are alternately flipped and processed, thereby reducing the processing blank period and improving work efficiency; it solves the problem proposed in the background technology that the device needs to flip a chip and then use a pusher to move the chip to the forming separation unit before the next chip can be cut and formed, and the processing interval blank period is long, thereby affecting the processing efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: the present invention provides a flip mechanism for semiconductor chip cutting and forming, comprising: a base platform, the upper side walls of the base platform are respectively fixedly connected with a first vertical plate and a second vertical plate symmetrically arranged, one side of the first vertical plate is fixedly connected with a flip mechanism, one end of the flip mechanism passes through the first vertical plate and is fixedly connected with a flip box shell, the four side walls of the flip box shell are fixedly connected with a storage frame for placing semiconductor chips, one side of the second vertical plate is fixedly connected with a negative pressure pump, one end of the negative pressure pump is connected with a fixed pipe, the side of the flip box shell away from the first vertical plate is rotatably connected with a fixed disc through a bearing ring, and the fixed pipe One end of the valve tube passes through the second vertical plate and the fixed disc and is rotatably connected to a negative pressure tube, and the side walls of the negative pressure tube are connected to four valve tubes arranged around with equal intervals. One end of the valve tube is connected to a negative pressure cover, and the negative pressure cover is fixedly connected to the inner wall of the flip box shell. The side wall of the flip box shell is provided with a suction hole connected to the negative pressure cover. Valve mechanisms are provided in the four valve tubes. A mounting bracket is fixedly connected to the inner wall of the fixed disc below the negative pressure tube, and one end of the mounting bracket is fixedly connected to a blocking pulley arranged corresponding to the valve mechanism. The upper side wall of the base platform below the flip box shell is fixedly connected to a conveying mechanism, and one end of the flip mechanism is fixedly connected to the conveying mechanism.

[0006] Preferably, the flipping mechanism includes a concave frame fixed on one side of the first vertical plate, one side of the concave frame is fixedly connected to a driving motor, the main shaft end of the driving motor passes through the concave frame and is fixedly connected to a rotating shaft, one end of the rotating shaft passes through the first vertical plate and is fixedly connected to the flip box shell, and one end of the conveying mechanism is fixedly connected to the rotating shaft.

[0007] Preferably, the conveying mechanism includes two first fixed frames and two second fixed frames symmetrically fixed on the base platform, a first conveying roller is rotatably connected between the two first fixed frames, a second conveying roller is rotatably connected between the two second fixed frames, a conveyor belt is wound around the first conveying roller and the second conveying roller, one end of the first conveying roller passes through the first fixed frame and is fixedly connected to a rotating pin, one end of the rotating pin is fixedly connected to a driven wheel, a driving wheel is fixedly connected to the rotating shaft, and the driving wheel is transmission-connected to the driven wheel through a transmission belt.

[0008] Preferably, one end of the fixed tube is rotatably connected to the negative pressure tube through a rotating sleeve.

[0009] Preferably, the valve mechanism includes a fixed cylinder connected to one side of the valve tube, a slide is slidably connected to the inner wall of the fixed cylinder, a push rod is fixedly connected to the first end of the slide, one end of the push rod passes through the outside of the fixed cylinder and is fixedly connected to a wedge-shaped push block, the wedge-shaped push block is arranged corresponding to the blocking pulley, a tension spring is sleeved on the push rod located between the slide and the fixed cylinder, the second end of the slide is fixedly connected to the valve plate, and one end of the valve plate extends into the valve tube.

[0010] Preferably, a sealing edge ring is fixedly connected to the inner wall of the communication port between the valve tube and the fixed cylinder, and the inner wall of the sealing edge ring is arranged to abut against the side wall of the valve plate.

[0011] Preferably, the number of the suction holes opened on the four side walls of the flip box shell is at least four.

[0012] Preferably, a circular hole is provided on the side wall of the flip box shell, and the circular hole is rotatably connected to the fixed disc through a bearing ring.

[0013] The beneficial effects of the present invention are:

[0014] 1. In the present invention, a flip mechanism, a flip box shell, four storage frames and a negative pressure pump are provided, the chip is placed in the storage frame, the negative pressure pump is started, and negative pressure is generated at the negative pressure cover connected to the valve pipe through the negative pressure pipe via the fixed pipe. At this time, the suction hole can adsorb and fix the chip to prevent the chip from falling during the flipping process. The flip mechanism can drive the flip box shell to rotate to realize the flipping operation of the chip thereon. The operation is stable, and multiple stations are alternately flipped and switched for processing, which reduces the processing blank period and improves work efficiency.

[0015] 2. In the present invention, by setting a conveying mechanism, when the driving motor is working, it can drive the driving wheel fixed to the rotating shaft to rotate. Since the driving wheel is transmitted to the driven wheel through the transmission belt, at this time, it drives the rotating pin fixed to the driven wheel to rotate, and then drives the first conveying roller to rotate. Since the first conveying roller is transmitted to the second conveying roller through the conveyor belt, it drives the conveyor belt to drive and convey, and the chips dropped thereon can be automatically conveyed to the next level of rib cutting and separation processing equipment, replacing the way of conveying by the robot claw, conveying displacement, saving the layout of electrical equipment, saving costs, and facilitating maintenance.

[0016] 3. In the present invention, by arranging a blocking pulley and a valve mechanism, when the chip on the flip box shell flips to the bottom, during this process, the wedge-shaped push block will contact the blocking pulley, and with the displacement of the wedge-shaped push block, it will be blocked by the blocking pulley, and the wedge-shaped push block will push the slide plate fixed to the push rod to slide in the fixed cylinder. At this time, the tension spring is stretched to generate a contraction elastic force until the chip flips to the bottom. At this time, the valve plate completely blocks the valve tube and the negative pressure at the negative pressure cover can be closed. At this time, the suction hole loses its adsorption force on the chip, and the chip automatically falls and is removed from the material to the conveyor belt, which is convenient for removing the material. When the flip box shell continues to rotate, the wedge-shaped push block gradually separates from the blocking pulley. At this time, the contraction elastic force of the tension spring is used to drive the valve plate to reset, open the valve tube, and restore the adsorption effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0019] Figure 2 For the present invention Figure 1 A is an enlarged structural diagram of FIG.

[0020] Figure 3 It is a front cross-sectional structural schematic diagram of the flip box shell in the present invention.

[0021] Figure 4 It is a schematic diagram of the right side cross-sectional structure of the flip box shell in the present invention.

[0022] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure at B.

[0023] Figure 6 It is a schematic diagram of the three-dimensional structure of the conveying mechanism in the present invention.

[0024] Explanation of the accompanying drawings: 1-base, 2-first vertical plate, 3-second vertical plate, 4-flip box shell, 5-storage frame, 6-negative pressure pump, 7-fixed pipe, 8-fixed disc, 9-negative pressure pipe, 10-valve pipe, 11-negative pressure cover, 12-suction hole, 13-mounting frame, 14-blocking pulley, 15-concave frame, 16-driving motor, 17-rotating shaft, 18-first fixed frame, 19-second fixed frame, 20-first conveying roller, 21-second conveying roller, 22-conveyor belt, 23-rotating pin, 24-driven wheel, 25-driving wheel, 26-transmission belt, 27-rotating sleeve, 28-fixed cylinder, 29-slide plate, 30-push rod, 31-wedge-shaped push block, 32-tension spring, 33-valve plate, 34-sealing edge ring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Embodiment 1:

[0027] like Figures 1 to 6 As shown, the present embodiment provides a flip mechanism for cutting and forming semiconductor chips, comprising: a base platform 1, the upper side walls of the base platform 1 are respectively fixedly connected with a first vertical plate 2 and a second vertical plate 3 symmetrically arranged, one side of the first vertical plate 2 is fixedly connected with a flip mechanism, one end of the flip mechanism penetrates the first vertical plate 2 and is fixedly connected with a flip box shell 4, the four side walls of the flip box shell 4 are fixedly connected with a storage frame 5 for placing semiconductor chips, one side of the second vertical plate 3 is fixedly connected with a negative pressure pump 6, one end of the negative pressure pump 6 is connected with a fixed pipe 7, the side of the flip box shell 4 away from the first vertical plate 2 is rotatably connected with a fixed disc 8 through a bearing ring, one end of the fixed pipe 7 penetrates the second vertical plate 3 and penetrates the fixed The fixed disc 8 is rotatably connected to a negative pressure tube 9, and the side walls around the negative pressure tube 9 are connected to four valve tubes 10 arranged around them at equal intervals. One end of the valve tube 10 is connected to a negative pressure cover 11, and the negative pressure cover 11 is fixedly connected to the inner wall of the flip box shell 4. The side wall of the flip box shell 4 is provided with a suction hole 12 connected to the negative pressure cover 11. Valve mechanisms are provided in the four valve tubes 10. A mounting frame 13 is fixedly connected to the inner wall of the fixed disc 8 below the negative pressure tube 9, and one end of the mounting frame 13 is fixedly connected to a blocking pulley 14 arranged corresponding to the valve mechanism. The upper side wall of the base platform 1 below the flip box shell 4 is fixedly connected to a conveying mechanism, and one end of the flip mechanism is fixedly connected to the conveying mechanism.

[0028] The flipping mechanism includes a concave frame 15 fixed on one side of the first vertical plate 2, and a driving motor 16 is fixedly connected to one side of the concave frame 15. The main shaft end of the driving motor 16 passes through the concave frame 15 and is fixedly connected to a rotating shaft 17. One end of the rotating shaft 17 passes through the first vertical plate 2 and is fixedly connected to the flip box shell 4. One end of the conveying mechanism is fixedly connected to the rotating shaft 17. When the driving motor 16 is started, the rotating shaft 17 is driven to rotate, and then the flip box shell 4 can be driven to flip and rotate to realize the flipping operation of the chip thereon. The operation is stable, and multiple stations are alternately flipped and switched to reduce the processing blank period and improve work efficiency.

[0029] One end of the fixed tube 7 is rotatably connected to the negative pressure tube 9 through the rotating sleeve 27, so that the negative pressure tube 9 can rotate stably.

[0030] The number of suction holes 12 opened on the four side walls of the flip box shell 4 is at least four, and the suction effect is better.

[0031] A circular hole is provided on the side wall of the flip box shell 4, and the circular hole is rotatably connected to the fixed disc 8 through a bearing ring, so as to facilitate the rotation of the flip box shell 4.

[0032] Principle of this embodiment: When the device is used to flip and turn the chip during the process of cutting and forming semiconductor chips, first, the chip is placed in the storage frame 5, the negative pressure pump 6 is started, and the negative pressure cover 11 connected to the valve tube 10 is generated with negative pressure through the fixed tube 7 and the negative pressure tube 9. At this time, the suction hole 12 can adsorb and fix the chip to prevent the chip from falling during the flipping process. The flipping mechanism can drive the flip box shell 4 to rotate, so as to realize the replacement of the work station. At the same time, the chip can be flipped and turned over. When the chip is flipped to the bottom, the valve mechanism is restricted by the blocking pulley 14, and the valve tube 10 here is closed by the valve mechanism and loses its adsorption force. The chip automatically falls to the conveying mechanism for the next level of conveying. This design can not only complete the flipping and turning operation of the chip during the process of cutting and forming, but also realize the automatic conveying and feeding of the chip to the next level of processing, realize linkage, have a more ingenious structure, stable operation, reduce the number of equipment layouts, save costs, and facilitate maintenance.

[0033] Embodiment 2:

[0034] like Figure 1 , Figure 2 and Figure 5As shown, on the basis of retaining all the technical features in the specific embodiment 1, in this embodiment: the conveying mechanism includes two first fixed frames 18 and two second fixed frames 19 symmetrically fixed on the base platform 1, a first conveying roller 20 is rotatably connected between the two first fixed frames 18, and a second conveying roller 21 is rotatably connected between the two second fixed frames 19. A conveying belt 22 is wound around the first conveying roller 20 and the second conveying roller 21. One end of the first conveying roller 20 passes through the first fixed frame 18 and is fixedly connected to a rotating pin 23. One end of the rotating pin 23 is fixedly connected to a driven wheel 24. A driving wheel 25 is fixedly connected to the rotating shaft 17, and the driving wheel 25 is transmission-connected to the driven wheel 24 through a transmission belt 26.

[0035] Principle of this embodiment: When the driving motor 16 is working, it can drive the driving wheel 25 fixed to the rotating shaft 17 to rotate. Since the driving wheel 25 is transmitted to the driven wheel 24 through the transmission belt 26, at this time, it drives the rotating pin 23 fixed to the driven wheel 24 to rotate, and then drives the first conveying roller 20 to rotate. Since the first conveying roller 20 is transmitted to the second conveying roller 21 through the conveying belt 22, it drives the conveying belt 22 to transmit and convey, and the chips falling thereon can be automatically conveyed to the next level of rib cutting and separation processing equipment, replacing the way of conveying by the robot claw, conveying displacement, saving the layout of electrical equipment, saving costs, and facilitating maintenance.

[0036] Embodiment three:

[0037] like Figure 3 , Figure 4 and Figure 5 As shown, on the basis of retaining all the technical features in specific embodiment one and / or embodiment two, in this embodiment: the valve mechanism includes a fixed cylinder 28 connected to one side of the valve tube 10, the inner wall of the fixed cylinder 28 is slidably connected with a slide plate 29, the first end of the slide plate 29 is fixedly connected with a push rod 30, one end of the push rod 30 passes through the outside of the fixed cylinder 28 and is fixedly connected with a wedge-shaped push block 31, the wedge-shaped push block 31 is arranged corresponding to the blocking pulley 14, a tension spring 32 is sleeved on the push rod 30 between the slide plate 29 and the fixed cylinder 28, the second end of the slide plate 29 is fixedly connected with a valve plate 33, and one end of the valve plate 33 extends into the valve tube 10.

[0038] A sealing edge ring 34 is fixedly connected to the inner wall of the communication port between the valve tube 10 and the fixed cylinder 28 , and the inner wall of the sealing edge ring 34 is disposed against the side wall of the valve plate 33 .

[0039] Principle of this embodiment: when the chip on the flip box shell 4 flips to the bottom, during this process, the wedge-shaped push block 31 will contact the blocking pulley 14. As the wedge-shaped push block 31 moves, it is blocked by the blocking pulley 14, and the wedge-shaped push block 31 will push the slide plate 29 fixed to the push rod 30 to slide in the fixed cylinder 28. At this time, the tension spring 32 is stretched to produce a contraction elastic force until the chip flips to the bottom. At this time, the valve plate 33 completely blocks the valve tube 10, and the negative pressure at the negative pressure cover 11 can be closed. At this time, the suction hole 12 loses its adsorption force on the chip, and the chip automatically falls and is removed from the material to the conveyor belt 22, which is convenient for removing the material. When the flip box shell 4 continues to rotate, the wedge-shaped push block 31 is gradually separated from the blocking pulley 14. At this time, the contraction elastic force of the tension spring 32 is used to drive the valve plate 33 to reset, open the valve tube 10, and restore the adsorption effect.

[0040] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A semiconductor chip cutting and forming turning mechanism, characterized in that: include: A base platform (1), wherein the upper side walls of the base platform (1) are respectively fixedly connected to a symmetrically arranged first vertical plate (2) and a second vertical plate (3), one side of the first vertical plate (2) is fixedly connected to a flip mechanism, one end of the flip mechanism passes through the first vertical plate (2) and is fixedly connected to a flip box shell (4), the four side walls of the flip box shell (4) are fixedly connected to a storage frame (5) for placing semiconductor chips, one side of the second vertical plate (3) is fixedly connected to a negative pressure pump (6), one end of the negative pressure pump (6) is connected to a fixed pipe (7), the side of the flip box shell (4) away from the first vertical plate (2) is rotatably connected to a fixed disc (8) through a bearing ring, one end of the fixed pipe (7) passes through the second vertical plate (3) and the fixed disc (8) and is rotatably connected to the negative pressure pipe (9), the side walls of the negative pressure tube (9) are connected to four valve tubes (10) which are arranged around the negative pressure tube at equal intervals, one end of the valve tube (10) is connected to a negative pressure cover (11), the negative pressure cover (11) is fixedly connected to the inner wall of the flip box shell (4), the side wall of the flip box shell (4) is provided with a suction hole (12) which is connected to the negative pressure cover (11), and valve mechanisms are provided in the four valve tubes (10). The inner wall of the fixed disc (8) below the negative pressure tube (9) is fixedly connected to a mounting frame (13), one end of the mounting frame (13) is fixedly connected to a blocking pulley (14) arranged corresponding to the valve mechanism, the upper side wall of the base platform (1) below the flip box shell (4) is fixedly connected to a conveying mechanism, and one end of the flip mechanism is fixedly connected to the conveying mechanism.

2. The semiconductor chip cutting and molding turning mechanism according to claim 1, characterized in that: The flip mechanism comprises a concave frame (15) fixed on one side of the first vertical plate (2); one side of the concave frame (15) is fixedly connected to a driving motor (16); a main shaft end of the driving motor (16) passes through the concave frame (15) and is fixedly connected to a rotating shaft (17); one end of the rotating shaft (17) passes through the first vertical plate (2) and is fixedly connected to the flip box shell (4); and one end of the conveying mechanism is fixedly connected to the rotating shaft (17).

3. The semiconductor chip cutting and molding turning mechanism according to claim 2, characterized in that: The conveying mechanism comprises two first fixed frames (18) and two second fixed frames (19) symmetrically fixed on a base platform (1); a first conveying roller (20) is rotatably connected between the two first fixed frames (18); a second conveying roller (21) is rotatably connected between the two second fixed frames (19); a conveying belt (22) is wound around the first conveying roller (20) and the second conveying roller (21); one end of the first conveying roller (20) passes through the first fixed frame (18) and is fixedly connected to a rotating pin (23); one end of the rotating pin (23) is fixedly connected to a driven wheel (24); a driving wheel (25) is fixedly connected to the rotating shaft (17); and the driving wheel (25) is transmission-connected to the driven wheel (24) via a transmission belt (26).

4. The semiconductor chip cutting and molding turning mechanism according to claim 1, characterized in that: One end of the fixed tube (7) is rotatably connected to the negative pressure tube (9) via a rotating sleeve (27).

5. The semiconductor chip cutting and molding turning mechanism according to claim 1, characterized in that: The valve mechanism comprises a fixed cylinder (28) connected to one side of the valve tube (10); a slide plate (29) is slidably connected to the inner wall of the fixed cylinder (28); a push rod (30) is fixedly connected to the first end of the slide plate (29); one end of the push rod (30) passes through the outer side of the fixed cylinder (28) and is fixedly connected to a wedge-shaped push block (31); the wedge-shaped push block (31) is arranged corresponding to the blocking pulley (14); a tension spring (32) is sleeved on the push rod (30) between the slide plate (29) and the fixed cylinder (28); a valve plate (33) is fixedly connected to the second end of the slide plate (29); one end of the valve plate (33) extends into the valve tube (10).

6. The semiconductor chip cutting and molding turning mechanism according to claim 5, characterized in that: A sealing edge ring (34) is fixedly connected to the inner wall of the communication port between the valve tube (10) and the fixed cylinder (28), and the inner wall of the sealing edge ring (34) is arranged to abut against the side wall of the valve plate (33).

7. The semiconductor chip cutting and molding turning mechanism according to claim 1, characterized in that: The number of the suction holes (12) formed on the four side walls of the flip box shell (4) is at least four.

8. The semiconductor chip cutting and molding turning mechanism according to claim 1, characterized in that: A circular hole is provided on the side wall of the tilting box shell (4), and the circular hole is rotatably connected to the fixed disc (8) via a bearing ring.

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