Jacking device

Abstract

The invention provides a jacking device, which is applied to semiconductor process equipment and comprises a driving part, a gas pipeline and an ejector pin, a gas passage is formed in the ejector pin in the axial direction; the gas passage is communicated with a gas outlet hole; the air outlet holes are formed in the side face of the ejector pin in the circumferential direction; the ejector pin is arranged in the through hole of the chuck; the driving part is used for driving the ejector pin to move up and down along the through hole of the chuck; the gas pipeline is connected with the ejector pin so as to convey gas into the gas channel, and then the gas is discharged out of the ejector pin through the gas outlet hole. The resistance of the ejector pin during jacking can be reduced, so that the stress of the ejector pin is reduced, and finally the success rate of substrate lifting is improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing, and specifically relates to a lifting device suitable for lifting a substrate. Background Art

[0002] When semiconductor process equipment processes a substrate (such as a wafer), after the substrate has completed the process, it is necessary to lift the pin in the chuck of the process chamber, which is used to push the substrate up after contacting the substrate. During the pin lifting process, the pin pushes the substrate up after contacting the substrate, so that the substrate rises from the initial position to the target position. After the substrate reaches the target position, it is convenient for the machine to perform related operations on the substrate, such as facilitating the robot to take the substrate at the target position, or facilitating the film thickness meter to detect the thickness, contour, curvature, warping, surface, etc. of the substrate. However, in the prior art, the problem of failure of the pin lifting is often encountered. Therefore, it is necessary to design a new lifting device to ensure the success rate of substrate lifting.

[0003] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, the purpose of the present application is to provide a lifting device, which aims to introduce gas to destroy the van der Waals force between the chuck and the substrate before the ejector moves, and then move the ejector, thereby reducing the resistance of the ejector during lifting, and further reducing the force on the ejector.

[0005] To achieve the above-mentioned purpose, the present application provides a lifting device, which is applied to semiconductor process equipment, and includes: a driving component, a gas pipeline and a lift pin; the lift pin is arranged in a through hole of a chuck; the driving component is used to drive the lift pin to move up and down along the through hole of the chuck; a gas passage is opened axially inside the lift pin; a gas outlet is connected to the gas passage; the gas outlet is opened on the side of the lift pin along the circumferential direction; the gas pipeline is connected to the lift pin to transport gas into the gas passage, and then the gas is discharged from the lift pin through the gas outlet.

[0006] Optionally, one end of the gas passage passes through the bottom of the ejector pin, and the other end of the gas passage does not pass through the top of the ejector pin, and the bottom of the ejector pin is used to connect a gas pipeline.

[0007] Optionally, a joint is provided at the bottom of the ejector pin, and the joint is used to be embedded in the gas pipeline.

[0008] Optionally, the distance from the other end of the gas passage to the top of the ejector pin is 2 mm to 3 mm.

[0009] Optionally, at least one of the air outlet holes is arranged close to the top of the ejector pin.

[0010] Optionally, there are a plurality of the gas outlet holes, and the plurality of the gas outlet holes are distributed along at least one of the axial direction and the circumferential direction of the ejector pin, and / or the plurality of the gas outlet holes are symmetrically arranged on both sides of the gas passage.

[0011] Optionally, the maximum outer diameter of the ejector pin is 3 mm to 4 mm.

[0012] Optionally, the lifting device further comprises: a lifting bracket and a sealing member;

[0013] The lifting bracket is connected to the ejector pin and the driving component respectively; the driving component is used to drive the lifting bracket to drive the ejector pin to move up and down along the through hole of the chuck;

[0014] The sealing member is arranged outside the bottom end of the through hole of the chuck and surrounds the ejector pin.

[0015] Optionally, a penetrating connecting hole is provided on the lifting bracket, and the bottom of the ejector pin is arranged in the connecting hole and is threadedly connected to the connecting hole.

[0016] Optionally, the lifting device further comprises a pressure monitoring component and a control component in communication connection;

[0017] The pressure monitoring component is used to monitor the gas pressure; the control component is provided with a start-up control condition, and when the gas pressure monitored by the pressure monitoring component meets the start-up control condition, the control component controls the drive component to start, thereby driving the ejector pin to rise.

[0018] Compared with the prior art, the lifting device provided by the present application has at least the following advantages:

[0019] Since the ejector pin of the present application is provided with a gas passage and an air outlet inside, gas can be delivered to the ejector pin through a gas pipeline before the ejector pin moves (i.e., lifts). After the gas is discharged from the ejector pin through the air outlet, it can follow the gap between the substrate and the chuck, fill the entire contact surface between the chuck and the substrate, and then destroy the van der Waals force between the chuck and the substrate. In this way, the resistance of the ejector pin during lifting can be reduced, and the force on the ejector pin during lifting can be reduced, thereby increasing the success rate of substrate lifting. After the force on the ejector pin is reduced, it is not easy to deform, and it does not need to be replaced frequently, thereby improving the operating efficiency of the machine. In addition, after the force on the ejector pin is reduced, it is not easy to loosen during the lifting process, so that the height difference of the ejector pin can meet the horizontality requirements of the machine during the substrate lifting process, and does not affect subsequent related operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present application and do not constitute any limitation on the scope of the present application.

[0021] Figure 1 A schematic diagram of a top view of a chuck according to an embodiment of the present application;

[0022] Figure 2 This is a schematic structural diagram of a lifting device according to an embodiment of the present application;

[0023] Figure 3 This is a schematic diagram of the axial cross-sectional structure of an ejector pin according to an embodiment of the present application; wherein the arrow indicates the flow direction of the gas;

[0024] Figure 4 Schematic diagram of the structure of an ejector pin according to an embodiment of the present application.

[0025] [The reference numerals are as follows]:

[0026] 1- ejector pin; 11- gas passage; 12- air outlet; 13- connector; 2- chuck; 21- through hole; 3- lifting bracket; 31- connecting hole; 4- sealing member; 5- gas pipeline; 10- substrate; T- distance from the other end of the gas passage to the top of the ejector pin. DETAILED DESCRIPTION

[0027] The following describes the implementation of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present application in a schematic manner, so the diagram only shows the components related to the present application rather than drawing according to the number, shape and size of the components during actual implementation. The type, quantity and proportion of each component during actual implementation can be a random change, and its component layout type may also be more complicated.

[0028] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present application and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present application.

[0029] As used in this specification, the singular forms "one", "an", and "the" include plural objects, the plural form "a plurality" includes two or more objects, and unless the content clearly indicates otherwise, "several" is used to indicate an indefinite quantity. As used in this specification, the term "or" is usually used to include the meaning of "and / or", unless the content clearly indicates otherwise, and the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0030] To facilitate understanding, the research background of this application is first described. Specifically, the inventors of this application have found in practice that in the process chamber of semiconductor process equipment, when the chuck adsorbs a substrate (such as a wafer, etc.), a certain van der Waals force is easily generated between the substrate and the chuck because the surface of the suction cup is too smooth, which leads to the following problems:

[0031] 1. The substrate is adsorbed on the chuck. If the power is insufficient, the lifting force of the ejector pin will be insufficient, which may easily lead to lifting failure;

[0032] 2. The ejector pin is too thin. After being forcibly driven and lifted, the ejector pin is easily deformed and needs to be replaced frequently, which reduces the operating efficiency of the machine.

[0033] 3. The bottom of the ejector pin is fixed to the bracket by threads, and cannot be subjected to force for easy adjustment. However, the chuck is easily contaminated after long-term use. Therefore, the ejector pin is also prone to loosening during the lifting process due to excessive force caused by contamination, which in turn causes the height difference of the three ejector pins to increase, exceeding the horizontality requirement of the machine during the substrate lifting process.

[0034] In view of the above-mentioned problems, the present application provides a lifting device, which can first introduce gas to destroy the van der Waals force between the chuck and the substrate before the ejector moves, and then move the ejector, thereby reducing the resistance of the ejector during lifting, thereby reducing the force on the ejector. The following is a description with reference to the accompanying drawings.

[0035] Please refer to Figures 1 to 4 An embodiment of the present application provides a semiconductor process equipment, which includes a chuck 2 and a lifting device; wherein the lifting device includes: a lift pin 1, a driving component and a gas pipeline 5.

[0036] Please refer to Figure 1 , and combined with Figure 2 The chuck 2 may be an electrostatic chuck or a vacuum chuck. The function of the chuck 2 is to adsorb and fix the substrate 10. Here, the specific type of the substrate 10 is not limited. Optionally, the substrate 10 is a wafer. The chuck 2 is provided with a through hole 21, and the through hole 21 runs through the entire chuck 2 along the axial direction of the chuck 2. At the same time, the ejector pin 1 is arranged in the through hole 21 and can move up and down along the through hole 21.

[0037] Those skilled in the art should know that the lifting device is usually provided with three ejector pins 1 , and correspondingly, the chuck 2 is provided with three through holes 21 , and the ejector pins 1 and the through holes 21 are provided in a one-to-one correspondence.

[0038] When the substrate 10 is not lifted, the ejector pin 1 is stored in the through hole 21 and does not extend out of the chuck 2; when the substrate 10 needs to be lifted, the ejector pin 1 is driven to extend out of the chuck 2, and then pushes the substrate 10 to the target position after contacting the substrate 10. The three ejectors 1 work together to lift the substrate 10, and during the lifting process, the height difference of the three ejectors 1 should be controlled within the allowable range to ensure the horizontality of the substrate 10 during the lifting process, which is convenient for measuring the substrate 10 or taking the substrate by the robot.

[0039] Although the driving component is not shown in the figure, those skilled in the art should understand that the driving component is mainly arranged below the chuck 2 and can drive the ejector pin 1 to move up and down along the corresponding through hole 21 .

[0040] Furthermore, the lifting device further comprises a lifting bracket 3, which is connected to the ejector pin 1 and a driving component respectively. The driving component can drive the lifting bracket 3 to drive the ejector pin 1 to move up and down along the corresponding through hole 21.

[0041] The driving component may be any device or apparatus capable of outputting linear motion, such as a cylinder, a hydraulic cylinder, a linear motor, etc. More commonly, the driving component is a cylinder.

[0042] Preferably, the bottom of the ejector pin 1 is detachably fixed to the lifting bracket 3, so that the ejector pin 1 can be replaced when necessary. The detachable fixing method between the ejector pin 1 and the lifting bracket 3 can be selected as a threaded connection, a snap connection or other various mechanical structure connections, and more preferably, a threaded connection.

[0043] It should also be understood that the three ejectors 1 are usually fixed on the same lifting bracket 3, and the three ejectors 1 are driven by the same lifting bracket 3 to rise or fall together.

[0044] Please refer to Figures 2 to 4 A gas passage 11 is provided in the axial direction inside the ejector pin 1, and a gas outlet 12 is connected to the gas passage 11. Here, considering that the top of the ejector pin 1 needs to contact the substrate 10, the gas outlet 12 is generally provided on the side of the ejector pin 1 along the circumferential direction, avoiding the position in contact with the substrate 10.

[0045] To this end, the lifting device is further provided with a gas pipeline 5 . The gas pipeline 5 is connected to the gas passage 11 of the ejector pin 1 to transport gas into the gas passage 11 , and then the gas is discharged from the ejector pin 1 through the gas outlet 12 .

[0046] Further, the lifting device further includes a seal 4, which is arranged outside the bottom end of the through hole 21 of the chuck 2 and is arranged around the ejector pin 1. The seal 4 is not arranged in the through hole 21, and the ejector pin 1 directly passes through the seal 4 and enters the through hole 21. It should be understood that a seal 4 is arranged outside the bottom end of each through hole 21, so that each ejector pin 1 and each through hole 21 are sealed by an independent seal 4, and the sealing effect is good.

[0047] The working principle of the lifting device is as follows: before lifting the ejector pin 1, a certain amount of gas is first delivered through the gas pipeline 5, and the gas is discharged into the through hole 21 through the gas passage 11 and the air outlet 12 in the ejector pin 1. Then, the gas will fill the entire contact surface between the substrate 10 and the chuck 2 along with the gap between the substrate 10 and the chuck 2 to destroy the van der Waals force between the contact surfaces. After ventilation for a period of time, the driving component is started again, and the lifting bracket 3 is driven by the driving component to drive the ejector pin 1 to be lifted along the corresponding through hole 21 until the top of the ejector pin 1 contacts the substrate 10 and pushes the substrate 10 up to the target position. It should be noted that during the lifting process of the ejector pin 1, it is not necessary to introduce gas again.

[0048] It can be seen that after applying the lifting device provided by the present application, many problems caused by the traditional method of completely relying on the driving component to forcibly lift the ejector pin are overcome. Specifically, the method of first ventilating to destroy the van der Waals force reduces the resistance of the ejector pin 1 during lifting, and then reduces the force on the ejector pin 1 during lifting, thereby increasing the success rate of lifting the substrate 10. After the force on the ejector pin 1 is reduced, it is not easy to deform and does not need to be replaced frequently, thereby improving the operating efficiency of the machine. In addition, after the force on the ejector pin 1 is reduced, it is not easy to loosen during the lifting process, so that the height difference of the ejector pin 1 can meet the horizontality requirements of the machine during the lifting of the substrate 10, affecting subsequent related operations.

[0049] In addition, the ejector pin 1 of the present application is thickened as a whole and is less likely to deform, which further increases the success rate of lifting and improves the operating efficiency of the machine. Preferably, the maximum outer diameter of the ejector pin 1 is 3 mm to 4 mm, and optionally, 3 mm, 3.5 mm or 4 mm.

[0050] The ejector pin 1 is a cylindrical structure as a whole, which can be a variable diameter design or a constant diameter design. For example, in this embodiment, the overall outer diameter of the ejector pin 1 is the same, and it is a constant diameter cylindrical structure. In other embodiments, the outer diameter of the ejector pin 1 can gradually increase from the top to the bottom, or increase first and then decrease. Optionally, the ejector pin 1 is a spindle-like structure or a conical structure.

[0051] Preferably, one end of the gas passage 11 passes through the bottom of the ejector pin 1, and the other end of the gas passage 11 does not pass through the top of the ejector pin 1. In other words, the top of the ejector pin 1 is solid, and the rest is hollow.

[0052] Preferably, the distance from the other end of the gas passage to the top of the ejector pin is 2 mm to 3 mm, optionally 2 mm, 2.5 mm or 3 mm; this distance can increase the strength of the top.

[0053] Preferably, the gas source is directly connected to the bottom of the ejector pin 1. Specifically, the bottom of the ejector pin 1 is connected to the gas pipeline 5, and the connection method is preferably a detachable connection. When the gas source is introduced from the bottom of the ejector pin 1, there is no need to make major changes to the original structure of the machine, which is easy to implement, has good feasibility, and low transformation cost.

[0054] Please refer to Figure 4 In an exemplary embodiment, a connector 13 is provided at the bottom of the ejector pin 1, and the connector 13 is embedded in the gas pipeline 5 to achieve the connection between the ejector pin 1 and the gas pipeline 5. Optionally, the connector 13 is a hose connector. The ejector pin 1 can be integrally formed with a connector 13 of reduced size to facilitate embedding in the gas pipeline 5.

[0055] Please refer to Figure 2In an exemplary embodiment, a connecting hole 31 is provided through the lifting bracket 3, and the bottom of the ejector pin 1 is directly disposed in the connecting hole 31 and is threadedly connected and fixed to the connecting hole 31. At this time, the gas pipeline 5 can be directly connected to the connector 13 of the ejector pin 1 on one side of the lifting bracket 3, and the installation is very convenient.

[0056] In addition, the gas involved in the present application is an inert gas or nitrogen, etc., preferably nitrogen. Preferably, the gas flow rate delivered by the gas pipeline 5 is 50sccm-100sccm; this gas flow rate achieves a small flow rate to purge the contact surface between the substrate 10 and the chuck 2, which can effectively form a cavity, reduce the van der Waals force, and will not damage the substrate 10.

[0057] In addition, the specific position and specific number of the air outlet 12 are not limited. In practice, the air outlet 12 can be one or more. When there are multiple air outlets 12, the multiple air outlets 12 can be distributed along at least one of the circumferential direction and the axial direction of the ejector pin 11, and the distribution method can be uniform distribution, random distribution, concentrated distribution, dispersed arrangement, etc. Preferably, the multiple air outlets 12 are symmetrically arranged on both sides of the gas passage 11, and the two sides here are the two opposite sides of the gas passage 11 along the central axis.

[0058] Preferably, at least one gas outlet 12 is disposed near the top of the ejector pin 1, so that the gas can enter between the substrate 10 and the chuck 2 more quickly, thereby increasing the exhaust efficiency and thus increasing the working efficiency of the machine.

[0059] Further preferably, as described in the figure, at least one outlet hole 12 is provided on the side of the ejector pin 1 to cross the gas passage 11. In this way, the ejector pin 1 can form outlet holes 12 at symmetrical positions in the diameter direction, and the gas outlet efficiency is high. In addition, in order to ensure the strength of the ejector pin 1, the number of outlet holes 12 can be appropriately reduced, for example, only one outlet hole 12 is provided to cross the gas passage 11.

[0060] The air outlet 12 may be an oblique hole or a straight hole, that is, the air outlet 12 may release gas in a horizontal direction or in an upward direction. Specifically, the axial center line of the air outlet 12 may intersect or not intersect with the axial center line of the ejector pin 11, and not intersecting means being on different planes. The axial center line of the air outlet 12 may be perpendicular to or at an angle to the axial center line of the ejector pin 11. In this embodiment, the axial center line of the air outlet 12 intersects perpendicularly with the axial center line of the ejector pin 11.

[0061] The air outlet 12 can have a suitable shape and size. Preferably, the air outlet 12 is circular for easy processing. The air outlet 12 should not be too small or too large; if it is too small, it will hinder the release of gas, resulting in a decrease in the amount of gas discharged, which will cause a decrease in the force and fail to achieve the desired effect; if it is too large, it will reduce the structural strength of the ejector 1, and the ejector 1 is prone to deformation. In this regard, preferably, the diameter of the air outlet 12 is 1 mm to 2 mm, for example, 1.0 mm, 1.5 mm or 2 mm.

[0062] The axial centerline of the gas passage 11 preferably coincides with the axial centerline of the ejector pin 1. The axial length of the gas passage 11 can be set as required.

[0063] Similar to the gas outlet 12, the gas passage 11 can be of a suitable shape and size, for example, rectangular, elliptical, circular or other shapes. Preferably, the gas passage 11 is a circular channel. Preferably, the diameter of the gas passage 11 is 1 mm to 2 mm, optionally 1 mm, 1.5 mm or 2 mm, etc.

[0064] Furthermore, the seal 4 can achieve sealing through various measures, such as a sealing ring or an O-ring, etc., which is not limited in the present application.

[0065] Please refer to Figure 2 In an exemplary embodiment, the seal 4 is a rubber pad seal structure having a through center hole for the ejector pin 1 to pass through. The seal 4 may have wrinkles in the compression direction or may not have wrinkles.

[0066] Furthermore, the lifting device may also include a pressure monitoring component for monitoring gas pressure. The gas pressure may be used as a start-up control condition for the driving component. When the gas pressure monitored by the pressure monitoring component meets the preset start-up control condition, the driving component is controlled to start, thereby driving the ejector pin 1 to lift.

[0067] In this embodiment, after the driving component is started, the lifting bracket 3 can be used to drive the ejector pin 1 to move to lift the substrate 10. Specifically, it can be judged based on the change curve of the gas pressure. If the van der Waals force is destroyed, the gas pressure will change significantly. When the gas pressure is stable, the driving component can be controlled to start. It can be understood that before the van der Waals force is destroyed, the gas pressure is relatively large. Once the van der Waals force is destroyed, the gas pressure decreases. That is, when the gas pressure suddenly decreases and maintains for a certain period of time, it means that the van der Waals force has been destroyed, and then the ejector pin 1 can be lifted. Here, the driving component can be automatically or manually controlled by the device according to the change of gas pressure.

[0068] In actual use, the display component in the semiconductor process equipment can also display the gas pressure curve online in real time.

[0069] Preferably, the control component in the semiconductor process equipment is in communication with the pressure monitoring component. At the same time, the control component is provided with a start-up control condition. When the gas pressure monitored by the pressure monitoring component meets the start-up control condition, the control component controls the drive component to start, thereby driving the ejector pin 1 to lift. The start-up control condition can be set as a pressure difference or a pressure value. When the pressure difference or the pressure value exceeds a preset threshold, the start-up control condition is met.

[0070] Further, the installation position of the pressure monitoring component is not limited, for example, it can be installed on the gas pipeline 5 to directly detect the pressure in the gas pipeline 5, or it can be installed inside the ejector pin 1 to detect the pressure inside the ejector pin 1, or it can be installed in the through hole 21 to detect the pressure inside the through hole 21, or it can be installed on the chuck 2 to detect the pressure at the contact surface between the chuck 2 and the substrate 10. A more appropriate way is to directly set the pressure monitoring component on the gas pipeline 5.

[0071] Optionally, the pressure monitoring component adopts a flow controller (MFC), which has functions such as flow control and pressure monitoring, and is easy to use. The flow controller can be arranged at the front end of the gas pipeline 5, and the front end is the position where the gas pipeline 5 starts to transport or transmit gas.

[0072] In summary, in the ejector pin 11 and the lifting device including the ejector pin 11 provided in the present application, before the ejector pin 1 moves, gas can be delivered to the ejector pin 1 through the gas pipeline 5, and the gas can be discharged from the ejector pin 1 through the gas outlet 12, and can follow the gap between the substrate 10 and the chuck 2, filling the entire contact surface between the chuck 2 and the substrate 10, thereby destroying the van der Waals force between the chuck 2 and the substrate 10. This method can reduce the resistance of the ejector pin 1 during lifting, and then reduce the force of the ejector pin 1 during lifting, thereby increasing the success rate of lifting the substrate 10. In addition, after the force on the ejector pin 1 is reduced, it is not easy to deform, and it does not need to be replaced frequently, thereby improving the operating efficiency of the machine. At the same time, after the force on the ejector pin 1 is reduced, it is not easy to loosen during the lifting process, so that the height difference of the ejector pin 1 can meet the horizontality requirements of the machine during the lifting of the substrate 10, and does not affect the subsequent related operations.

[0073] In summary, the technical solutions provided in various embodiments of the present application can effectively solve many problems caused by the prior art of relying solely on the driving component to forcibly lift the ejector pin 1. Moreover, the present application makes few changes to the original machine structure and is easy to implement under existing conditions. Compared with the previous operation method, it only needs to add a ventilation step before lifting, which is simple in structure and convenient to operate.

[0074] The specific embodiments of the present application are described above. It should be understood that the present application is not limited to the above specific implementations, and those skilled in the art can make various changes or modifications within the scope of the present application, which does not affect the substantive content of the present application. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A lifting device, applied to semiconductor process equipment, characterized in that: include: A driving component, a gas pipeline and an ejector pin; the ejector pin is arranged in a through hole of a chuck; the driving component is used to drive the ejector pin to move up and down along the through hole of the chuck; a gas passage is axially provided inside the ejector pin; a gas outlet is connected to the gas passage; the gas outlet is provided on a circumferential side of the ejector pin; the gas pipeline is connected to the ejector pin to transport gas into the gas passage, so that the gas is discharged from the ejector pin through the gas outlet.

2. The lifting device according to claim 1, characterized in that: One end of the gas passage passes through the bottom of the ejector pin, the other end of the gas passage does not pass through the top of the ejector pin, and the bottom of the ejector pin is connected to the gas pipeline.

3. The lifting device according to claim 2, characterized in that: A joint is arranged at the bottom of the ejector pin, and the joint is embedded in the gas pipeline.

4. The lifting device according to claim 2, characterized in that: The distance from the other end of the gas passage to the top of the ejector pin is 2 mm to 3 mm.

5. The lifting device according to claim 1 or 2, characterized in that: At least one of the air outlet holes is disposed near the top of the ejector pin.

6. The lifting device according to claim 1 or 2, characterized in that: There are a plurality of the gas outlet holes, and the plurality of the gas outlet holes are distributed along at least one of the axial direction and the circumferential direction of the ejector pin, and / or the plurality of the gas outlet holes are symmetrically arranged on both sides of the gas passage.

7. The lifting device according to claim 1 or 2, characterized in that: The maximum outer diameter of the ejector pin is 3 mm to 4 mm.

8. The lifting device according to claim 1 or 2, characterized in that: Also includes: lift brackets and seals; The lifting bracket is connected to the ejector pin and the driving component respectively; the driving component is used to drive the lifting bracket to drive the ejector pin to move up and down along the through hole of the chuck; The sealing member is arranged outside the bottom end of the through hole of the chuck and surrounds the ejector pin.

9. The lifting device according to claim 8, characterized in that: The lifting bracket is provided with a penetrating connecting hole, and the bottom of the ejector pin is arranged in the connecting hole and is threadedly connected with the connecting hole.

10. The lifting device according to claim 1 or 2, characterized in that: Also included are a pressure monitoring component and a control component in communication connection; The pressure monitoring component is used to monitor the gas pressure; the control component is provided with a start-up control condition, and when the gas pressure monitored by the pressure monitoring component meets the start-up control condition, the control component controls the drive component to start, thereby driving the ejector pin to rise.

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