Wafer drying machine and wafer support assembly and lifting mechanism thereof

Abstract

The invention discloses a wafer drying machine and a wafer support assembly and a lifting mechanism thereof, relates to the field of wafer cleaning equipment, and can solve the problem that a clamped area cannot be effectively cleaned and dried in the cleaning process of a wafer in the prior art. The wafer bracket assembly comprises a wafer bracket which is connected to the inner bottom wall of the drying tank body and is used for bearing a plurality of wafers, and a limiting assembly which is connected to the inner side wall of the drying tank body and is used for cooperating with the wafer bracket to limit the postures of the plurality of wafers; the wafer support comprises a supporting assembly connected to the drying groove body and a plurality of supporting comb plates connected to the supporting assembly, the ends, away from the supporting assembly, of the supporting comb plates are provided with a plurality of supporting grooves in the length direction of the supporting comb plates, and the supporting grooves form two supporting bevel edges used for abutting against the two sides of the wafer respectively so that the supporting bevel edges can make point contact with the wafer. And the plurality of supporting comb plates are connected to the supporting assembly at intervals, so that the plurality of supporting comb plates are supported on the bottom side of the wafer along the arc-shaped extension direction of the edge of the wafer.

Description

Technical Field

[0001] The present application relates to the field of wafer cleaning equipment, and in particular to a wafer dryer and a wafer support assembly and a lifting mechanism thereof. Background Art

[0002] Marangoni dryer is a wafer cleaning equipment used for wafer cleaning and drying. The Marangoni effect it utilizes refers to the flow phenomenon caused by the difference in liquid surface tension. Through this effect, the moisture or solvent on the wafer surface can be effectively removed, thereby achieving a water mark-free and pollution-free drying effect.

[0003] In the prior art, wafer holders usually clamp wafers through structures such as Y-shaped grooves, but this design results in a large contact area between the wafer and the holder. Due to the large clamping area, the part of the wafer in contact with the holder cannot be fully exposed to the cleaning liquid and dry airflow, resulting in these areas being unable to be effectively cleaned and dried. This not only affects the overall cleanliness of the wafer, easily leaving water marks or chemical residues on the surface, but also affects the quality of the wafer and the yield of subsequent processes. Summary of the invention

[0004] To this end, the present application provides a wafer dryer and a wafer support assembly and a lifting mechanism thereof to solve the problem in the prior art that the clamped area of ​​the wafer cannot be effectively cleaned during the cleaning process.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A wafer support assembly of a wafer dryer, the wafer dryer comprising a main body, a drying tank body connected to the main body, a liquid inlet pipe connected to the drying tank body and used to inject a cleaning liquid into the drying tank body, a solution box connected to the drying tank body and used to inject isopropyl alcohol vapor into the drying tank body, a liquid discharge pipe connected to the drying tank body and used to discharge the cleaning liquid in the drying tank body, a lifting mechanism connected to the main body and used to lift a plurality of wafers into the drying tank body, the wafer support assembly comprising a wafer support connected to the inner bottom wall of the drying tank body and used to carry a plurality of wafers and a connecting rod A limiting component is provided on the inner wall of the drying trough body and is used to cooperate with the wafer holder to limit the posture of multiple wafers. The wafer holder includes a supporting component connected to the drying trough body and multiple supporting comb plates connected to the supporting component. The supporting comb plates are provided with multiple supporting grooves along their own length direction at the end away from the supporting component. The supporting grooves are formed with two supporting bevels respectively used to abut against both sides of the wafer so that the supporting bevels are in point contact with the wafer. Multiple supporting comb plates are connected to the supporting component at intervals so that the multiple supporting comb plates are supported on the bottom side of the wafer along the arc-shaped extension direction of the edge of the wafer.

[0007] Optionally, the support assembly is connected to a support portion of the inner bottom wall of the drying trough body, a support column connected to the support portion away from the inner bottom wall of the drying trough body, and a support plate connected to one end of the support column away from the support portion, a plurality of support comb plates are connected to the support plate, a drainage port cooperating with the drainage pipe is provided on the inner bottom wall of the drying trough body, the drainage port is located at the bottom of the support portion, and the support portion is connected to the inner bottom wall of the drying trough body through a plurality of connecting columns so that the support portion and the drainage port are arranged at intervals.

[0008] Optionally, the support plate is provided with a plurality of drainage grooves running through the support plate, and a guide arc plate is connected to a side of the support plate away from the support comb plate, the guide arc plate is provided with a guide hole for avoiding the support column, the guide hole is matched with the support column gap, and the guide hole is located at the lowest point of the guide arc plate, so that the liquid remaining on the support plate can drip into the drying tank body through the drainage groove and the guide hole; the two support bevels intersect to form the support groove into a V-shaped groove, one side of the support comb plate is formed as a vertical plane matching the V-shaped groove, and the other side respectively forms two guide inclined surfaces matching the support bevels, and the two guide inclined surfaces correspond to the two support bevels one to one.

[0009] Optionally, the support portion includes a first connecting plate connected to the plurality of connecting columns, a second connecting plate connected to a side of the first connecting plate away from the connecting column, a third connecting plate connected to a side of the second connecting plate away from the first connecting plate, and a fourth connecting plate connected to a side of the third connecting plate away from the second connecting plate, and one end of the support column is connected to the fourth connecting plate;

[0010] The connecting column is provided with a first threaded hole, the first connecting plate is provided with a plurality of first oblong holes matching the first threaded hole, the second connecting plate is provided with a second threaded hole, the third connecting plate is provided with a plurality of second oblong holes matching the second threaded hole, the third connecting plate is provided with a third threaded hole, and the fourth connecting plate is provided with a plurality of third oblong holes matching the third threaded holes;

[0011] The length extension direction of the first oblong hole is in the same direction as the length extension direction of the second oblong hole, and the length extension direction of the third oblong hole is perpendicular to the length extension direction of the second oblong hole.

[0012] Optionally, two opposite sides of the first connecting plate are both threadedly connected with a plurality of first limiting bolts for abutting against the inner side wall of the drying tank body, and the length extension direction of the first limiting bolts is in the same direction as the length extension direction of the first oblong hole;

[0013] Two opposite sides of the third connecting plate are integrally formed with first limiting plates, the two first limiting plates are respectively against two opposite sides of the second connecting plate, and the first limiting plates are connected to the sides of the second connecting plate through second limiting bolts;

[0014] The other two opposite sides of the third connecting plate are both integrally formed with a second limiting plate, and the second limiting plate is threadedly connected with a plurality of third limiting bolts, one end of which abuts against the side wall of the fourth connecting plate.

[0015] Optionally, the support comb plate is detachably connected to the support plate by bolts, there are three support comb plates, the three support comb plates are flush with each other, and the support groove of the middle support comb plate is lower than the support grooves of the support comb plates on both sides;

[0016] A transition piece is connected between the support plate and the support column, and the transition piece includes a sleeve plate mounted on the support column and two wing plates integrally formed on opposite sides of the sleeve plate, the support column is formed with an annular step for limiting the downward sliding of the sleeve plate, the outer wall of the sleeve plate is threadedly connected with a plurality of fourth limit bolts for tightening the outer wall of the support column, and two connecting members are integrally formed at the bottom of the support plate, the connecting member is provided with a positioning groove for embedding the wing plate, the wing plate is provided with a fourth threaded hole, and the outer wall of the connecting member is provided with a fourth oblong hole connected to the positioning groove and matched with the fourth threaded hole, and the length extension direction of the fourth oblong hole is perpendicular to the length extension direction of the third oblong hole.

[0017] Optionally, a plurality of fifth threaded holes are provided on both side edges of the support plate, and a plurality of sixth threaded holes matching the fifth threaded holes are provided on the support comb plates installed on the two side edges of the support plate. Both sides of the support plate extend outward to form installation steps, and the installation steps are threadedly connected with a plurality of fifth limiting bolts, one end of which is used to abut against the bottom wall of the support comb plate.

[0018] Optionally, the limiting assembly includes a rotating part rotatably connected to the inner wall of the drying trough body, a limiting comb plate connected to the rotating part, and a driving assembly connected to the outer wall of the drying trough body and used to drive the rotating part to rotate, the limiting comb plate is provided with a plurality of limiting grooves matching the supporting grooves along its own length direction, the limiting groove is formed with two supporting inclined surfaces respectively used to abut against two sides of the wafer, the plurality of limiting grooves and the plurality of supporting grooves correspond one to one, and the driving assembly is used to drive the limiting comb plate to approach the supporting comb plate.

[0019] Optionally, there are two driving assemblies, the two driving assemblies are respectively connected to two opposite outer walls of the drying tank body, the rotating member includes two rotating rods respectively connected to the driving assemblies, a rotating plate group connected between the two rotating rods, the rotating plate group includes a fifth connecting plate connected to the limited position combing plate, two extension plates respectively integrally formed at one end of the fifth connecting plate and perpendicular to the fifth connecting plate, two sixth connecting plates respectively connected to one end of the two rotating rods and perpendicular to the rotating rods, and an adjustment plate connected between the extension plate and the sixth connecting plate;

[0020] The adjustment plate is provided with adjustment grooves at both ends for embedding the sixth connecting plate and the extension plate respectively, a plurality of seventh threaded holes are provided at the bottom of one end of the adjustment groove, the sixth connecting plate is provided with a plurality of eighth threaded holes for matching the seventh threaded holes, the plurality of seventh threaded holes and the plurality of eighth threaded holes correspond one to one, a plurality of ninth threaded holes are provided at the bottom of the other end of the adjustment groove, and the extension plate is provided with a plurality of fifth oblong holes for matching the ninth threaded holes.

[0021] Optionally, the driving assembly includes a mounting shell connected to the outer wall of the drying tank body, a mounting plate frame connected to the mounting shell, a rotating cylinder connected to the mounting plate frame, and the rotating member is connected to the output shaft of the rotating cylinder.

[0022] Optionally, the first connecting plate is connected to a plurality of positioning columns for supporting a support plate of the lifting mechanism, one end of each of the four positioning columns extends out to the top of the second connecting plate, and the heights of the four positioning columns decrease sequentially from high to low.

[0023] The present application also discloses a lifting mechanism of a wafer dryer, the wafer dryer includes a main body, a drying trough body connected to the main body, and a lifting mechanism connected to the main body and used for lifting multiple wafers into the drying trough body, the drying trough body is connected to the wafer support assembly as described above, the lifting mechanism includes an electric slide connected to the main body, a first mounting plate group connected to the slider of the electric slide, a second mounting plate group connected to an end of the first mounting plate group away from the slider, a pulling plate connected to an end of the second mounting plate group away from the first mounting plate group, a support frame connected to the pulling plate away from the second mounting plate group, and a tray connected to the support frame and used for supporting a wafer box, and a plurality of positioning members that cooperate with the wafer box are connected to one side of the tray.

[0024] Optionally, two opposite inner walls of the support frame are respectively connected with support members for supporting the pallet, and the support members include a support block connected to the support frame via fasteners and a positioning block connected to the support block, and the pallet is provided with a positioning groove that passes through itself and cooperates with the positioning block, and the side of the pallet away from the positioning member is provided with a plurality of positioning holes that cooperate with the positioning columns of the wafer holder.

[0025] Optionally, the second mounting plate group includes a first mounting plate connected to the first mounting plate group, a second mounting plate connected to an end of the first mounting plate away from the first mounting plate group, and a third mounting plate connected to an end of the second mounting plate away from the first mounting plate, and the pulling plate is connected to the third mounting plate;

[0026] The two sides of the first mounting plate are bent to form a first bent plate, the two sides of the second mounting plate are bent to form a second bent plate, and the two sides of the third mounting plate are bent to form a third bent plate;

[0027] The second bent plate abuts against the outer side of the first bent plate. The first bent plate is provided with a plurality of tenth threaded holes. The second bent plate is provided with a plurality of sixth oblong holes matching the tenth threaded holes.

[0028] Optionally, the third mounting plate is connected to the second mounting plate via a plurality of fasteners, the third mounting plate is threadedly connected with a plurality of sixth limiting bolts whose one end abuts against the second mounting plate to adjust the distance between the third mounting plate and the second mounting plate, and the third bending plate is threadedly connected with a plurality of seventh limiting bolts whose one end abuts against the outer wall of the second bending plate to adjust the distance between the third bending plate and the second bending plate.

[0029] Optionally, a universal bearing is connected between the third mounting plate and the second mounting plate.

[0030] The present application also discloses a wafer dryer, comprising a main body, a drying trough body connected to the main body, and a lifting mechanism connected to the main body and used to lift multiple wafers into the drying trough body, the drying trough body is connected to the wafer support assembly as described above, and the lifting mechanism is the lifting mechanism as described above.

[0031] Compared with the prior art, this application has at least the following beneficial effects:

[0032] During the cleaning process, the lifting mechanism slowly lifts the wafer box containing multiple wafers into the drying tank body of the wafer dryer. During the descent of the wafer box, the multiple wafers in the wafer box are transferred and supported on the multiple support comb plates of the wafer holder. The multiple support comb plates are supported on the bottom of the wafer. The two sides of the bottom of the wafer are against the two support bevels of the support tank. The support bevels and the wafer are in point contact, and the contact area is relatively small. Afterwards, the limit assembly is limited to the top of the wafer, and cooperates with the multiple support comb plates to maintain the posture of the wafer, so that the support bevels and the wafer maintain a point contact state. Cleaning liquid is injected into the drying tank body through the liquid inlet pipe. The cleaning liquid level gradually rises until it covers the surface of the wafer, and then the cleaning liquid is set at a set speed. The flow rate discharges the cleaning liquid from the drying tank through the drain pipe, and isopropyl alcohol vapor is injected into the drying tank through the solution box. Since isopropyl alcohol has a low surface tension, when the vapor contacts the wafer surface, a Marangoni effect is generated, causing the liquid on the wafer surface to diffuse and evaporate rapidly, achieving a water mark-free and pollution-free drying effect until the cleaning liquid is completely discharged from the drying tank. Compared with the larger clamping area in the prior art, the present application maximizes the cleaning exposure area of ​​the wafer surface due to the point contact between the wafer and the multiple support comb plates of the wafer holder, which has a small contact area. This effectively solves the problem of incomplete local cleaning caused by the large contact area in the prior art, and improves the cleaning quality of the wafer and the subsequent process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more intuitively illustrate the prior art and the present application, several exemplary drawings are given below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing the present application; for example, those skilled in the art are capable of easily making conventional adjustments or further optimizations to the addition / reduction / attribution division, specific shapes, positional relationships, connection methods, dimensional ratios, etc. of certain units (components) based on the technical concepts and exemplary drawings disclosed in the present application.

[0034] Figure 1 A schematic diagram of the overall structure of a wafer drying machine provided in one embodiment of the present application;

[0035] Figure 2 for Figure 1 A partial schematic diagram of

[0036] Figure 3 A schematic diagram of the coordination of a drying tank and a lifting mechanism of a wafer drying machine provided in one embodiment of the present application;

[0037] Figure 4 for Figure 3 A partial schematic diagram of

[0038] Figure 5 A schematic structural diagram of a drying tank body of a wafer drying machine provided in one embodiment of the present application;

[0039] Figure 6 for Figure 5 Another perspective of the picture;

[0040] Figure 7 for Figure 5 A partial schematic diagram of

[0041] Figure 8 A schematic structural diagram of a wafer holder of a wafer holder assembly of a wafer dryer provided in one embodiment of the present application;

[0042] Fig. 9 for Figure 8 A partial schematic diagram of

[0043] Fig.10 for Fig. 9 A partial schematic diagram of

[0044] Fig.11 for Fig.10 Explosion diagram of

[0045] Fig.12 A schematic diagram of the structure of a third connecting plate provided in one embodiment of the present application;

[0046] Fig.13 A schematic diagram of the structure of a first connecting plate provided in one embodiment of the present application;

[0047] Fig.14 A schematic diagram of the cooperation between the first connecting plate and the supporting plate provided in one embodiment of the present application;

[0048] Fig.15 for Fig.14 A partial schematic diagram of

[0049] Fig.16 for Fig. 9 A partial schematic diagram of

[0050] Fig.17 for Fig.16 A partial exploded view of

[0051] Fig.18 for Fig.16 Exploded diagram of some structures;

[0052] Fig.19 for Fig.18 A partial schematic diagram of

[0053] Fig. 20 for Fig.19 A magnified image of point A;

[0054] Fig.21 A schematic diagram of the coordination of a plurality of support comb plates and a support plate provided in one embodiment of the present application;

[0055] Fig. 22 for Fig.21 Side view of

[0056] Fig.23 A schematic diagram of the coordination of multiple support comb plates, support plates and wafers provided in one embodiment of the present application;

[0057] Fig.24 A schematic diagram of the structure of a supporting comb plate provided in one embodiment of the present application;

[0058] Fig.25 A schematic diagram of the cooperation between a support comb plate and a wafer provided in one embodiment of the present application;

[0059] Fig.26 for Fig.25 A magnified view of point B;

[0060] Fig. 27 A schematic diagram of the cooperation between a drying tank body and a limiting assembly provided in one embodiment of the present application;

[0061] Fig.28 A partial schematic diagram of a limit assembly provided in one embodiment of the present application;

[0062] Fig.29 for Fig.28 Exploded diagram of some structures;

[0063] Fig.30 A schematic diagram of the structure of a limit comb plate provided in one embodiment of the present application;

[0064] Fig.31 A schematic diagram of the coordination of a limiting comb plate, a wafer and a supporting comb plate provided in one embodiment of the present application;

[0065] Fig.32 A schematic diagram of the structure of a lifting mechanism of a wafer dryer provided in one embodiment of the present application;

[0066] Fig.33 A schematic diagram of the coordination of a support frame, a pallet and a wafer box provided in one embodiment of the present application;

[0067] Fig.34 A schematic diagram of the coordination of a support frame and a support plate provided in one embodiment of the present application;

[0068] Fig.35 for Fig.34 Another perspective of the picture;

[0069] Fig.36 for Fig.34 Explosion diagram of

[0070] Fig.37A schematic diagram of the structure of a second mounting plate group of a lifting mechanism provided by one embodiment of the present application;

[0071] Fig.38 for Fig.37 Schematic diagram of part of the structure.

[0072] Description of reference numerals:

[0073] 1. Main body; 2. Drying tank; 21. Connecting column; 3. Solution tank; 4. Drain pipe; 5. Inlet pipe; 6. Wafer support assembly; 61. Support assembly; 611. Support part; 6111. First connecting plate; 6111a. First limiting bolt; 6111b. First oblong hole; 6112. Second connecting plate; 6113. Third connecting plate; 6113a. Second limiting bolt; 6113b. Second oblong hole; 6113c. First limiting plate; 6113d. Second limiting plate; 6114. Fourth connecting plate; 6114a. Third limiting bolt bolt; 6114b, third oblong hole; 612, support column; 613, support plate; 6131, drain trough; 6132, connector; 6132a, positioning groove; 6132b, fourth oblong hole; 6133, mounting step; 6133a, fifth limiting bolt; 62, support comb plate; 621, support groove; 6211, support bevel; 6212, guide slope; 63, positioning column; 64, guide arc plate; 65, transition piece; 651, sleeve plate; 6511, fourth limiting bolt; 652, wing plate; 7, limiting assembly; 71, rotating piece; 711, rotating rod; 7111, sixth connecting plate; 712, rotating plate group; 7121, fifth connecting plate; 7121a, extension plate; 7121b, fifth oblong hole; 7122, adjusting plate; 72, limit comb plate; 72, limit comb plate; 721, limit groove; 7211, supporting inclined plane; 73, driving assembly; 731, mounting shell; 732, mounting plate frame; 733, rotating cylinder; 8, lifting mechanism; 81, electric slide; 811, slider; 812, first mounting plate group; 813, second mounting plate group; 8131, first mounting Plate; 8131a, first bent plate; 8132, second mounting plate; 8132a, second bent plate; 8132b, sixth oblong hole; 8133, third mounting plate; 8133a, third bent plate; 8133b, sixth limiting bolt; 8133c, seventh limiting bolt; 8133d, universal bearing; 814, pulling plate; 815, support frame; 8151, support member; 8151a, support block; 8151b, positioning block; 816, support plate; 8161, positioning member; 8162, positioning hole; 9, wafer box; 91, wafer. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0075] In the description of this application: unless otherwise specified, "plurality" means two or more. The terms "first", "second", "third", etc. in this application are intended to distinguish the objects referred to, and do not have special meanings in terms of technical connotations (for example, they should not be understood as emphasizing the importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0076] refer to Figure 1-9 , Figure 23-26 and Fig.31 The present application discloses a wafer support assembly 6 of a wafer dryer, the wafer dryer comprising a main body 1, a drying tank body 2 connected to the main body 1, a liquid inlet pipe 5 connected to the drying tank body 2 and used to inject a cleaning liquid into the drying tank body 2, a solution box 3 connected to the drying tank body 2 and used to inject isopropyl alcohol vapor into the drying tank body 2, a liquid discharge pipe 4 connected to the drying tank body 2 and used to discharge the cleaning liquid in the drying tank body 2, a lifting mechanism 8 connected to the main body 1 and used to lift a plurality of wafers 91 into the drying tank body 2, the wafer support assembly 6 comprising a wafer 91 support connected to the inner bottom wall of the drying tank body 2 and used to carry a plurality of wafers 91, and an inner bottom wall of the drying tank body 2 connected to the drying tank body 2. The side wall is used to cooperate with the wafer 91 support to limit the posture of multiple wafers 91. The wafer 91 support includes a support component 61 connected to the drying tank body 2, and multiple support comb plates 62 connected to the support component 61. The support comb plate 62 is provided with multiple support grooves 621 along its own length direction at the end away from the support component 61. The support groove 621 is formed with two support bevels 6211 respectively used to abut against both sides of the wafer 91, so that the support bevels 6211 are in point contact with the wafer 91. The multiple support comb plates 62 are connected to the support component 61 at intervals, so that the multiple support comb plates 62 are supported on the bottom side of the wafer 91 along the arc extension direction of the edge of the wafer 91.

[0077] During the cleaning process, the lifting mechanism 8 slowly lifts the wafer box 9 containing multiple wafers 91 into the drying tank body 2 of the wafer dryer. During the descending process of the wafer box 9, the multiple wafers 91 in the wafer box 9 are transferred and supported on the multiple support comb plates 62 of the wafer 91 bracket. The multiple support comb plates 62 are supported on the bottom of the wafer 91. The two sides of the bottom of the wafer 91 are against the two support bevels 6211 of the support groove 621. The support bevels 6211 and the wafer 91 are in point contact, and the contact area is relatively small. Afterwards, the limiting component 7 is limited to the top of the wafer 91, and cooperates with the multiple support comb plates 62 to maintain the posture of the wafer 91, so that the support bevels 6211 and the wafer 91 maintain a point contact state, and the cleaning liquid is injected into the drying tank body 2 through the liquid inlet pipe 5, and the cleaning liquid level gradually rises until it covers The surface of wafer 91 is cleaned, and then the cleaning liquid is discharged from the drying tank 2 through the drain pipe 4 at a set flow rate, while isopropyl alcohol vapor is injected into the drying tank 2 through the solution tank 3. Since isopropyl alcohol has a lower surface tension, when the vapor contacts the surface of wafer 91, a Marangoni effect is generated, causing the liquid on the surface of wafer 91 to diffuse and evaporate rapidly, thereby achieving a water mark-free and pollution-free drying effect until the cleaning liquid is completely discharged from the drying tank 2. Compared with the larger clamping area in the prior art, the present application has a point contact between wafer 91 and multiple supporting comb plates 62 of the wafer 91 bracket, and the contact area is small, thereby maximizing the cleaning exposure area on the surface of wafer 91, effectively solving the problem of incomplete local cleaning caused by the large contact area in the prior art, and improving the cleaning quality of wafer 91 and the subsequent process yield.

[0078] It should be noted that the solution tank 3 and the lifting mechanism 8 are both prior art parts. The solution tank 3 contains an isopropyl alcohol solution, which can generate isopropyl alcohol vapor by heating or other means during the cleaning process, enter the drying tank body 2, and form a gas-liquid interface on the surface of the wafer 91 to achieve the Marangoni drying effect. The lifting mechanism 8 is used to lower the wafer box 9 containing the wafer 91 into the drying tank body 2, and during the lowering process of the wafer box 9, the wafer 91 is smoothly transferred to the support comb plate 62. Other pipeline structures of the wafer dryer are not shown in the figure.

[0079] refer to Figure 7-9The support assembly 61 is connected to the support part 611 of the inner bottom wall of the drying tank body 2, the support column 612 connected to the support part 611 away from the inner bottom wall of the drying tank body 2, and the support plate 613 connected to one end of the support column 612 away from the support part 611. A plurality of support combing plates 62 are connected to the support plate 613. The inner bottom wall of the drying tank body 2 is provided with a drainage port for matching the drainage pipe 4. The drainage port is located at the bottom of the support part 611. The support part 611 is connected to the inner bottom wall of the drying tank body 2 through a plurality of connecting columns 21, so that the support part 611 and the drainage port are arranged at intervals. The support part 611 of the support assembly 61 is connected to the inner bottom wall of the drying tank body 2 through a plurality of connecting columns 21, so that the support part 611 and the drainage port are arranged at a certain interval. The structure of the support column 612 raises the support part 611, avoids the support part 611 directly covering the drainage port, and prevents the drainage port from being blocked by the support part 611.

[0080] refer to Figure 21-26 The support plate 613 is provided with a plurality of drainage grooves 6131 penetrating the support plate 613. A guide arc plate 64 is connected to the side of the support plate 613 away from the support comb plate 62. The guide arc plate 64 is provided with a guide hole for avoiding the support column 612. The guide hole and the support column 612 are gap-matched. The guide hole is located at the lowest point of the guide arc plate 64, so that the liquid remaining on the support plate 613 can drip into the drying tank body 2 through the drainage groove 6131 and the guide hole; the two supporting bevels 6211 intersect to form the support groove 621 into a V-shaped groove, one side of the support comb plate 62 is formed into a vertical plane matching the V-shaped groove, and the other side respectively forms two guide inclined surfaces 6212 matching the supporting bevels 6211, and the two guide inclined surfaces 6212 correspond to the two supporting bevels 6211 one by one.

[0081] In the process of discharging the cleaning liquid, the cleaning liquid remaining on the support plate 613 will flow to the guide arc plate 64 through the drainage groove 6131. ​​The guide arc plate 64 allows the cleaning liquid to flow along its arc surface and finally gather to the guide hole at the lowest point, so that the cleaning liquid can smoothly drip into the gradually descending liquid level in the drying tank body 2 through the guide hole, avoiding the accumulation of residual liquid on the support assembly 61. In addition, the vertical plane of the support comb plate 62 and the guide slope 6212 cooperate with each other, so that the cleaning liquid on the support comb plate 62 is in a state of flowing toward the drainage groove 6131, reducing the possibility of liquid residue.

[0082] In some embodiments, there are three supporting comb plates 62 and two drainage grooves 6131 , and the two drainage grooves 6131 are respectively located between two adjacent supporting comb plates 62 .

[0083] refer to Figure 8-12The support portion 611 includes a first connection plate 6111 connected to the plurality of connection pillars 21, a second connection plate 6112 connected to a side of the first connection plate 6111 away from the connection pillars 21, a third connection plate 6113 connected to a side of the second connection plate 6112 away from the first connection plate 6111, and a fourth connection plate 6114 connected to a side of the third connection plate 6113 away from the second connection plate 6112, and one end of the support pillar 612 is connected to the fourth connection plate 6114;

[0084] The connecting column 21 is provided with a first threaded hole, the first connecting plate 6111 is provided with a plurality of first oblong holes 6111b matching the first threaded hole, the second connecting plate 6112 is provided with a second threaded hole, the third connecting plate 6113 is provided with a plurality of second oblong holes 6113b matching the second threaded hole, the third connecting plate 6113 is provided with a third threaded hole, and the fourth connecting plate 6114 is provided with a plurality of third oblong holes 6114b matching the third threaded hole;

[0085] The length extension direction of the first oblong hole 6111b is in the same direction as the length extension direction of the second oblong hole 6113b, and the length extension direction of the third oblong hole 6114b is perpendicular to the length extension direction of the second oblong hole 6113b.

[0086] The support part 611 is formed by connecting a plurality of connecting plates in sequence, and the position of the supporting column 612 can be adjusted in multiple directions by setting the oblong holes in different directions. The first connecting plate 6111 can adjust its position along the length extension direction of the hole through the first oblong hole 6111b thereon; similarly, the second connecting plate 6112 can adjust its position along the length extension direction of the second oblong hole 6113b, and the third connecting plate 6113 provides an adjustment direction perpendicular to the first two through the third oblong hole 6114b. In this way, the supporting column 612 on the fourth connecting plate 6114 can freely adjust its position in two mutually perpendicular directions, thereby realizing the control of the position of the supporting comb plate 62. Through the multi-directional adjustable structure, the supporting column 612 can be adjusted in position according to specific installation requirements, so that the supporting comb plate 62 can be accurately aligned with the wafer 91.

[0087] It should be noted that the threaded hole and the oblong hole are fixed by bolts.

[0088] In some embodiments, the first connecting plate 6111 is provided with a clearance groove running through the first connecting plate 6111 so that the cleaning liquid can flow from the clearance groove into the liquid discharge port during the discharge process.

[0089] Two opposite sides of the first connecting plate 6111 are both threadedly connected with a plurality of first limiting bolts 6111a for abutting against the inner wall of the drying tank body 2, and the length extension direction of the first limiting bolts 6111a is in the same direction as the length extension direction of the first oblong hole 6111b;

[0090] Two opposite sides of the third connecting plate 6113 are integrally formed with first limiting plates 6113c, the two first limiting plates 6113c are respectively against two opposite sides of the second connecting plate 6112, and the first limiting plates 6113c are connected to the sides of the second connecting plate 6112 through second limiting bolts 6113a;

[0091] The other two opposite sides of the third connecting plate 6113 are integrally formed with a second limiting plate 6113 d , and the second limiting plate 6113 d is threadedly connected with a plurality of third limiting bolts 6114 a with one end resting against the side wall of the fourth connecting plate 6114 .

[0092] The two opposite sides of the first connecting plate 6111 are abutted against the inner side wall of the drying tank body 2 through a plurality of first limiting bolts 6111a, and the first limiting bolts 6111a extend in the same direction as the first oblong hole 6111b, which can effectively limit the displacement of the first connecting plate 6111 in the horizontal direction, thereby ensuring the stability of the first connecting plate 6111 during the installation process; the first limiting plates 6113c formed integrally on the two opposite sides of the third connecting plate 6113 are fixedly matched with the second connecting plate 6112 through a plurality of second limiting bolts 6113a, thereby limiting the relative position of the third connecting plate 6113 relative to the second connecting plate 6112. In addition, the second limiting plates 6113d formed integrally on the other two opposite sides of the third connecting plate 6113 are connected to the fourth connecting plate 6114 through a plurality of third limiting bolts 6114a, further limiting the relative displacement of the fourth connecting plate 6114 and the third connecting plate 6113.

[0093] Through the combined action of the first, second and third limiting bolts, each connecting plate in the support assembly 61 can effectively limit its own displacement and relative position change, thereby ensuring that the installation position of the support column 612 remains stable during the cleaning and drying process.

[0094] refer to Figure 16-23 The support comb plates 62 are detachably connected to the support plate 613 by bolts. There are three support comb plates 62. The three support comb plates 62 are flush with each other, and the support groove 621 of the middle support comb plate 62 is lower than the support grooves 621 of the support comb plates 62 on both sides.

[0095] A transition piece 65 is connected between the support plate 613 and the support column 612, and the transition piece 65 includes a sleeve plate 651 sleeved on the support column 612 and two wing plates 652 respectively integrally formed on opposite sides of the sleeve plate 651. The support column 612 is formed with an annular step for limiting the sleeve plate 651 from sliding downward. The outer wall of the sleeve plate 651 is threadedly connected with a plurality of fourth limiting bolts 6511 for tightening the outer wall of the support column 612. Two connecting members 6132 are integrally formed at the bottom of the support plate 613. The connecting member 6132 is provided with a positioning groove 6132a for embedding the wing plate 652, and the wing plate 652 is provided with a fourth threaded hole. The outer wall of the connecting member 6132 is provided with a fourth oblong hole 6132b connected to the positioning groove 6132a and matched with the fourth threaded hole, and the length extension direction of the fourth oblong hole 6132b is perpendicular to the length extension direction of the third oblong hole 6114b.

[0096] The support grooves 621 of the three support comb plates 62 have different heights. The middle support comb plate 62 is supported at the lowest point of the wafer 91 , while the support comb plates 62 on both sides are supported at both sides of the lowest point.

[0097] The support comb plate 62 is detachably connected to the support plate 613 by bolts, and the support plate 613 is connected to the support column 612 by a transition piece 65. The transition piece 65 includes a sleeve plate 651 and two wing plates 652 that are sleeved on the support column 612. The wing plates 652 cooperate with the positioning grooves 6132a at the bottom of the support plate 613, so that the transition piece 65 and the support plate 613 have a fixed position during installation to avoid relative rotation. By rotating the sleeve plate 651, the rotational orientation of the transition piece 65 and the support plate 613 on the horizontal plane can be fine-tuned to ensure that the support comb plate 62 can be accurately positioned according to the position requirements. In addition, the outer wall of the sleeve plate 651 is also provided with a fourth limiting bolt 6511 to limit the relative rotation between the sleeve plate 651 and the support column 612.

[0098] The support plate 613 can be positioned along the direction of the third oblong hole 6114b. Combined with the multi-directional adjustment of the first, second and third oblong holes 6114b, the final position and posture of the support comb plate 62 can be finely adjusted through the transition piece 65, so that the support comb plate 62 can maintain the optimal contact position and support posture with the wafer 91.

[0099] A plurality of fifth threaded holes are provided on both sides of the support plate 613, and a plurality of sixth threaded holes matching the fifth threaded holes are provided on the support comb plates 62 installed on the two sides of the support plate 613. Both sides of the support plate 613 extend outward to form installation steps 6133, and the installation steps 6133 are threadedly connected with a plurality of fifth limiting bolts 6133a, one end of which is used to abut against the bottom wall of the support comb plate 62.

[0100] A plurality of fifth threaded holes are provided on both sides of the support plate 613, which cooperate with the sixth threaded holes on the support comb plates 62 installed on both sides of the support plate 613, so that the support comb plates 62 can be fixed to the support plate 613 by fasteners. During the installation process, the fifth limiting bolt 6133a is rotated so that its end abuts against the bottom wall of the support comb plate 62, thereby supporting the support comb plate 62 so that the sixth threaded hole and the fifth threaded hole are aligned. In this way, the installer can more conveniently fix the fasteners in the corresponding holes to ensure the accurate docking of the support comb plate 62 with the support plate 613.

[0101] refer to Figure 27-31 The limiting assembly 7 includes a rotating member 71 rotatably connected to the inner wall of the drying tank body 2, a limiting comb plate 7272 connected to the rotating member 71, and a driving assembly 73 connected to the outer wall of the drying tank body 2 and used to drive the rotating member 71 to rotate. The limiting comb plate 7272 is provided with a plurality of limiting grooves 721 that match the supporting grooves 621 along its length direction. The limiting groove 721 is formed with two supporting inclined surfaces 7211 that are respectively used to abut against both sides of the wafer 91. The plurality of limiting grooves 721 and the plurality of supporting grooves 621 correspond one to one. The driving assembly 73 is used to drive the limiting comb plate 7272 to approach the supporting comb plate 62.

[0102] When multiple wafers 91 are supported by multiple supporting comb plates 62 of the wafer 91 holder, the driving component 73 drives the rotating member 71 to rotate, so that the limiting comb plate 7272 rotates close to the top of the wafer 91, and makes the two sides of the top of the wafer 91 abut against the supporting slope 7211 of the limiting groove 721, cooperating with the wafer 91 holder to limit the posture of multiple wafers 91, avoiding the wafer 91 from shaking during the cleaning process, and making the wafer 91 in a vertical state.

[0103] There are two driving assemblies 73, and the two driving assemblies 73 are respectively connected to two opposite outer walls of the drying tank body 2. The rotating member 71 includes two rotating rods 711 respectively connected to the driving assemblies 73, and a rotating plate group 712 connected between the two rotating rods 711. The rotating plate group 712 includes a fifth connecting plate 7121 connected to the limited position combing plate 7272, two extension plates 7121a respectively integrally formed at one end of the fifth connecting plate 7121 and perpendicular to the fifth connecting plate 7121, two sixth connecting plates 7111 respectively connected to one end of the two rotating rods 711 and perpendicular to the rotating rods 711, and an adjusting plate 7122 connected between the extension plate 7121a and the sixth connecting plate 7111;

[0104] The adjusting plate 7122 is provided with adjusting grooves at both ends for embedding the sixth connecting plate 7111 and the extension plate 7121a respectively, a plurality of seventh threaded holes are provided at the bottom of one end of the adjusting groove, the sixth connecting plate 7111 is provided with a plurality of eighth threaded holes for matching the seventh threaded holes, the plurality of seventh threaded holes and the plurality of eighth threaded holes correspond one to one, a plurality of ninth threaded holes are provided at the bottom of the other end of the adjusting groove, and the extension plate 7121a is provided with a plurality of fifth oblong holes 7121b for matching the ninth threaded holes.

[0105] The two driving components 73 are respectively located at the two ends of the rotating member 71, and can synchronously drive the rotating member 71 to rotate smoothly to avoid deflection caused by unilateral driving. The middle part of the rotating member 71, namely the fifth connecting plate 7121, is bent to one side to form an avoidance space for the related structures of the lifting mechanism 8 (such as the wafer box 9), so that the wafer 91 is not disturbed during the lifting and lowering process. At the same time, this bending structure allows the fifth connecting plate 7121 to rotate close to the top of the wafer 91, ensuring that the limit comb plate 7272 can accurately contact both sides of the wafer 91.

[0106] In addition, through the fifth oblong hole 7121b, the adjustment plate 7122 can adjust the relative position between the extension plate 7121a and the sixth connecting plate 7111, so as to adjust the distance between the fifth connecting plate 7121 and the rotating rod 711, flexibly adapt to wafers 91 of different sizes, and be able to adaptively support and limit wafers 91 of different sizes during the cleaning and drying process.

[0107] The driving assembly 73 includes a mounting shell 731 connected to the outer wall of the drying tank body 2 , a mounting plate frame 732 connected to the mounting shell 731 , a rotating cylinder 733 connected to the mounting plate frame 732 , and the rotating member 71 is connected to the output shaft of the rotating cylinder 733 .

[0108] refer to Figure 13-15 The first connecting plate 6111 is connected to a plurality of positioning columns 63 for supporting the support plate 816 of the lifting mechanism 8. One end of the four positioning columns 63 extends to the top of the second connecting plate 6112, and the heights of the four positioning columns 63 decrease from high to low. During the descent of the lifting mechanism 8, the multiple supporting comb plates 62 of the wafer 91 holder pass through the through holes at the bottom of the wafer box 9 to prop up the multiple wafers 91 in the wafer box 9, so that the multiple wafers 91 gradually separate from the wafer box 9. As the lifting mechanism 8 continues to descend, the wafer box 9 is always supported on the support plate 816 of the lifting mechanism 8. The four positioning columns 63 can support the support plate 816 and the wafer box 9 together, and the end heights of the four positioning columns 63 are different. The support plate 816 and the wafer box 9 are supported on the positioning columns 63 in a slightly tilted state. This inclination makes it difficult for the wafer box 9 to accumulate liquid during the discharge process of the cleaning liquid. The cleaning liquid can flow out smoothly from the tilted surface of the wafer box 9, reducing the residual cleaning liquid.

[0109] It should be noted that the end of the positioning column 63 is formed into a pointed end, and a positioning hole 8162 is formed at the bottom of the support plate 816 to match the tip of the positioning column 63. The opening of the positioning hole 8162 is large and the aperture gradually decreases. The tip of the positioning column 63 is inserted into the positioning hole 8162 to lift the support plate 816.

[0110] refer to Figure 32-38 The present application also discloses a lifting mechanism 8 of a wafer dryer, the wafer dryer includes a main body 1, a drying trough body 2 connected to the main body 1, and a lifting mechanism 8 connected to the main body 1 and used to lift multiple wafers 91 into the drying trough body 2, the drying trough body 2 is connected to the wafer support assembly 6 as described above, the lifting mechanism 8 includes an electric slide 81 connected to the main body 1, a first mounting plate group 812 connected to a slider 811 of the electric slide 81, a second mounting plate group 813 connected to an end of the first mounting plate group 812 away from the slider 811, a pulling plate 814 connected to an end of the second mounting plate group 813 away from the first mounting plate group 812, a support frame 815 connected to the pulling plate 814 away from the second mounting plate group 813, and a support plate 816 connected to the support frame 815 and used to support a wafer box 9, and a plurality of positioning members 8161 matching the wafer box 9 are connected to one side of the support plate 816.

[0111] The lifting mechanism 8 utilizes the existing electric slide 81 and slider 811, and drives the slider 811 to move through the electric slide 81, thereby realizing the synchronous lifting and lowering of the support frame 815, the pallet 816 and the wafer box 9. When the electric slide 81 drives the slider 811 to move up and down, the slider 811 transmits the movement step by step through the first mounting plate group 812, the second mounting plate group 813 and the pulling plate 814, so that the support frame 815 and the pallet 816 and the wafer box 9 thereon are lifted and lowered smoothly; a plurality of positioning members 8161 are arranged on the pallet 816, and these positioning members 8161 are distributed around the wafer box 9, which can effectively limit the movement of the wafer box 9, and ensure that the position of the wafer box 9 is stable during the lifting process, and there will be no deviation or shaking.

[0112] The electric slide 81, the slider 811 and the positioning member 8161 are all prior arts and will not be described in detail in this application.

[0113] The two opposite inner side walls of the support frame 815 are respectively connected with support members 8151 for supporting the pallet 816. The support member 8151 includes a support block 8151a connected to the support frame 815 by fasteners and a positioning block 8151b connected to the support block 8151a. The pallet 816 is provided with a positioning groove 6132a that penetrates the pallet 816 and cooperates with the positioning block 8151b. The side of the pallet 816 away from the positioning member 8161 is provided with a plurality of positioning holes 8162 that cooperate with the positioning columns 63 of the wafer 91 bracket. The pallet 816 is supported by the positioning groove 6132a thereon through the positioning block 8151b to ensure that the position of the pallet 816 in the support frame 815 is stable. When the lifting mechanism 8 descends, the pallet 816 moves together with the support frame 815 until the wafer box 9 is accurately positioned at the cleaning and drying position;

[0114] After the pallet 816 descends to the designated position, the positioning posts 63 on the wafer 91 support gradually fit into the positioning holes 8162 on the pallet 816 to lift the pallet 816. Thus, when the lifting mechanism 8 continues to descend, the pallet 816 and the wafer box 9 thereon are reliably supported on the wafer 91 support.

[0115] The second mounting plate group 813 includes a first mounting plate 8131 connected to the first mounting plate group 812, a second mounting plate 8132 connected to one end of the first mounting plate 8131 away from the first mounting plate group 812, and a third mounting plate 8133 connected to one end of the second mounting plate 8132 away from the first mounting plate 8131, and the pulling plate 814 is connected to the third mounting plate 8133;

[0116] Both sides of the first mounting plate 8131 are bent to form a first bent plate 8131a, both sides of the second mounting plate 8132 are bent to form a second bent plate 8132a, and both sides of the third mounting plate 8133 are bent to form a third bent plate 8133a;

[0117] The second bent plate 8132a is against the outer side of the first bent plate 8131a. The first bent plate 8131a is provided with a plurality of tenth threaded holes. The second bent plate 8132a is provided with a plurality of sixth oblong holes 8132b matching the tenth threaded holes.

[0118] The two sides of the second mounting plate 8132 are bent to form a second bent plate 8132a, which is closely attached to the outer side of the first bent plate 8131a of the first mounting plate 8131. The tenth threaded hole on the first bent plate 8131a is matched with the sixth oblong hole 8132b on the second bent plate 8132a, so that the second mounting plate 8132 can be adjusted in position along the length direction of the sixth oblong hole 8132b (the same as the length extension direction of the second mounting plate 8132), and the support plate 816 and the wafer box 9 thereon can be slightly adjusted in displacement on the horizontal plane to ensure the alignment accuracy of the wafer box 9 when the lifting mechanism 8 moves to the drying tank 2.

[0119] The third mounting plate 8133 is connected to the second mounting plate 8132 through a plurality of fasteners. The third mounting plate 8133 is threadedly connected with a plurality of sixth limiting bolts 8133b whose one end abuts against the second mounting plate 8132 to adjust the distance between the third mounting plate 8133 and the second mounting plate 8132. The third bending plate 8133a is threadedly connected with a plurality of seventh limiting bolts 8133c whose one end abuts against the outer wall of the second bending plate 8132a to adjust the distance between the third bending plate 8133a and the second bending plate 8132a.

[0120] The third mounting plate 8133 is connected to the second mounting plate 8132 through a plurality of fasteners, and the spacing between the third mounting plate 8133 and the second mounting plate 8132 is adjusted through a plurality of sixth limiting bolts 8133b, so as to achieve precise control of the height of the support plate 816 and the wafer box 9. One end of the sixth limiting bolt 8133b abuts against the second mounting plate 8132, and after rotation adjustment, the relative position of the third mounting plate 8133 and the second mounting plate 8132 can be changed, so as to fine-tune the height position of the support plate 816 and the wafer box 9 in the vertical direction, and finally the third mounting plate 8133 and the second mounting plate 8132 are connected through a plurality of fasteners.

[0121] At the same time, the third bending plate 8133a is cooperated with the outer wall of the second bending plate 8132a through the seventh limiting bolt 8133c, and one end of multiple seventh limiting bolts 8133c is against the outer wall of the second bending plate 8132a. By rotating and adjusting the seventh limiting bolt 8133c, the distance between the third bending plate 8133a and the second bending plate 8132a can be adjusted, so as to further adjust the horizontal position of the support plate 816 and the wafer box 9.

[0122] Through the combined adjustment of the sixth oblong hole 8132b, the sixth limiting bolt 8133b and the seventh limiting bolt 8133c and other related structures, the positions of the support plate 816 and the wafer box 9 can be precisely fine-tuned in three vertical directions.

[0123] In some embodiments, fasteners may be connected between the first mounting plate 8131 and the second mounting plate 8132 to further fix the position between the first mounting plate 8131 and the second mounting plate 8132 .

[0124] A universal bearing 8133d is connected between the third mounting plate 8133 and the second mounting plate 8132.

[0125] The universal bearing 8133d can ensure the relative connection relationship between the third mounting plate 8133 and the second mounting plate 8132, and facilitate the adjustment of the position relationship between the third mounting plate 8133 and the second mounting plate 8132 through the sixth limiting bolt 8133b and the seventh limiting bolt 8133c.

[0126] The present application also discloses a wafer dryer, comprising a main body 1, a drying trough body 2 connected to the main body 1, and a lifting mechanism 8 connected to the main body 1 and used to lift multiple wafers 91 into the drying trough body 2, the drying trough body 2 is connected to the wafer support assembly 6 as described above, and the lifting mechanism 8 is the lifting mechanism 8 as described above.

[0127] The technical features of the above embodiments may be arbitrarily combined (as long as there is no contradiction in the combination of these technical features). To make the description concise, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written should also be considered to be within the scope of this specification.

[0128] The above is a relatively specific and detailed description of the present application through general description and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not deviate from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the scope of protection of the claims of the present application.

Claims

1. A wafer support assembly of a wafer dryer, the wafer dryer comprising a main body, a drying tank body connected to the main body, a liquid inlet pipe connected to the drying tank body and used to inject a cleaning liquid into the drying tank body, a solution box connected to the drying tank body and used to inject isopropyl alcohol vapor into the drying tank body, a liquid drain pipe connected to the drying tank body and used to discharge the cleaning liquid in the drying tank body, and a lifting mechanism connected to the main body and used to lift a plurality of wafers into the drying tank body, characterized in that: The wafer holder assembly includes a wafer holder connected to the inner bottom wall of the drying trough body and used for carrying multiple wafers, and a limit assembly connected to the inner side wall of the drying trough body and used to cooperate with the wafer holder to limit the posture of the multiple wafers. The wafer holder includes a support assembly connected to the drying trough body, and multiple support comb plates connected to the support assembly. The support comb plates are provided with multiple support grooves along their own length direction at the end away from the support assembly. The support grooves are formed with two support bevels respectively used to abut against both sides of the wafer so that the support bevels are in point contact with the wafer. The multiple support comb plates are connected to the support assembly at intervals so that the multiple support comb plates are supported on the bottom side of the wafer along the arc extension direction of the edge of the wafer.

2. The wafer support assembly according to claim 1, characterized in that: The support assembly is connected to a support portion of the inner bottom wall of the drying trough body, a support column connected to the support portion away from the inner bottom wall of the drying trough body, and a support plate connected to one end of the support column away from the support portion. A plurality of support comb plates are connected to the support plate. A drainage port cooperating with the drainage pipe is provided on the inner bottom wall of the drying trough body. The drainage port is located at the bottom of the support portion. The support portion is connected to the inner bottom wall of the drying trough body through a plurality of connecting columns so that the support portion and the drainage port are arranged at intervals.

3. The wafer support assembly according to claim 2, characterized in that: The support plate is provided with a plurality of drainage grooves penetrating the support plate, a guide arc plate is connected to a side of the support plate away from the support comb plate, the guide arc plate is provided with a guide hole for avoiding the support column, the guide hole is matched with the support column gap, the guide hole is located at the lowest point of the guide arc plate, so that the liquid remaining on the support plate can drip into the drying tank body through the drainage groove and the guide hole; the two support bevels intersect to form the support groove into a V-shaped groove, one side of the support comb plate is formed into a vertical plane matching the V-shaped groove, and the other side respectively forms two guide inclined surfaces matching the support bevels, and the two guide inclined surfaces correspond to the two support bevels one by one.

4. The wafer support assembly according to claim 2, characterized in that: The support portion includes a first connecting plate connected to the plurality of connecting columns, a second connecting plate connected to a side of the first connecting plate away from the connecting columns, a third connecting plate connected to a side of the second connecting plate away from the first connecting plate, and a fourth connecting plate connected to a side of the third connecting plate away from the second connecting plate, and one end of the support column is connected to the fourth connecting plate; The connecting column is provided with a first threaded hole, the first connecting plate is provided with a plurality of first oblong holes matching the first threaded hole, the second connecting plate is provided with a second threaded hole, the third connecting plate is provided with a plurality of second oblong holes matching the second threaded hole, the third connecting plate is provided with a third threaded hole, and the fourth connecting plate is provided with a plurality of third oblong holes matching the third threaded holes; The length extension direction of the first oblong hole is in the same direction as the length extension direction of the second oblong hole, and the length extension direction of the third oblong hole is perpendicular to the length extension direction of the second oblong hole.

5. The wafer support assembly according to claim 4, characterized in that: Two opposite sides of the first connecting plate are both threadedly connected with a plurality of first limiting bolts for abutting against the inner side wall of the drying tank body, and the length extension direction of the first limiting bolts is in the same direction as the length extension direction of the first oblong hole; Two opposite sides of the third connecting plate are integrally formed with first limiting plates, the two first limiting plates are respectively against two opposite sides of the second connecting plate, and the first limiting plates are connected to the sides of the second connecting plate through second limiting bolts; The other two opposite sides of the third connecting plate are both integrally formed with a second limiting plate, and the second limiting plate is threadedly connected with a plurality of third limiting bolts, one end of which abuts against the side wall of the fourth connecting plate.

6. The wafer support assembly according to claim 4, characterized in that: The support comb plate is detachably connected to the support plate by bolts, there are three support comb plates, the three support comb plates are flush with each other, and the support groove of the middle support comb plate is lower than the support grooves of the support comb plates on both sides; A transition piece is connected between the support plate and the support column, and the transition piece includes a sleeve plate mounted on the support column and two wing plates integrally formed on opposite sides of the sleeve plate, the support column is formed with an annular step for limiting the downward sliding of the sleeve plate, the outer wall of the sleeve plate is threadedly connected with a plurality of fourth limit bolts for tightening the outer wall of the support column, and two connecting members are integrally formed at the bottom of the support plate, the connecting member is provided with a positioning groove for embedding the wing plate, the wing plate is provided with a fourth threaded hole, and the outer wall of the connecting member is provided with a fourth oblong hole connected to the positioning groove and matched with the fourth threaded hole, and the length extension direction of the fourth oblong hole is perpendicular to the length extension direction of the third oblong hole.

7. The wafer support assembly according to claim 6, characterized in that: A plurality of fifth threaded holes are provided on both side edges of the support plate, and a plurality of sixth threaded holes matching the fifth threaded holes are provided on the support comb plates installed on the two side edges of the support plate. Both sides of the support plate extend outward to form installation steps, and the installation steps are threadedly connected with a plurality of fifth limiting bolts, one end of which is used to abut against the bottom wall of the support comb plate.

8. The wafer support assembly according to claim 1 or 3, characterized in that: The limiting assembly includes a rotating part rotatably connected to the inner side wall of the drying trough body, a limiting comb plate connected to the rotating part, and a driving assembly connected to the outer wall of the drying trough body and used for driving the rotating part to rotate. The limiting comb plate is provided with a plurality of limiting grooves matching the supporting grooves along its length direction. The limiting groove is formed with two supporting inclined surfaces respectively used to abut against both sides of the wafer. The plurality of limiting grooves and the plurality of supporting grooves correspond one to one. The driving assembly is used to drive the limiting comb plate to approach the supporting comb plate.

9. The wafer support assembly according to claim 8, characterized in that: There are two driving assemblies, and the two driving assemblies are respectively connected to two opposite outer walls of the drying tank body, and the rotating member includes two rotating rods respectively connected to the driving assemblies, and a rotating plate group connected between the two rotating rods, and the rotating plate group includes a fifth connecting plate connected to the limited position combing plate, two extension plates respectively integrally formed at one end of the fifth connecting plate and perpendicular to the fifth connecting plate, two sixth connecting plates respectively connected to one end of the two rotating rods and perpendicular to the rotating rods, and an adjustment plate connected between the extension plate and the sixth connecting plate; The adjustment plate is provided with adjustment grooves at both ends for embedding the sixth connecting plate and the extension plate respectively, a plurality of seventh threaded holes are provided at the bottom of one end of the adjustment groove, the sixth connecting plate is provided with a plurality of eighth threaded holes for matching the seventh threaded holes, the plurality of seventh threaded holes and the plurality of eighth threaded holes correspond one to one, a plurality of ninth threaded holes are provided at the bottom of the other end of the adjustment groove, and the extension plate is provided with a plurality of fifth oblong holes for matching the ninth threaded holes.

10. The wafer support assembly according to claim 8, characterized in that: The driving assembly comprises a mounting shell connected to the outer wall of the drying tank body, a mounting plate frame connected to the mounting shell, a rotating cylinder connected to the mounting plate frame, and the rotating member is connected to the output shaft of the rotating cylinder.

11. The wafer support assembly according to claim 4, characterized in that: The first connecting plate is connected to a plurality of positioning columns for supporting the support plate of the lifting mechanism, one end of each of the four positioning columns extends out to the top of the second connecting plate, and the heights of the four positioning columns decrease in sequence from high to low.

12. A lifting mechanism of a wafer dryer, the wafer dryer comprising a main body, a drying tank connected to the main body, and a lifting mechanism connected to the main body and used to lift a plurality of wafers into the drying tank, the drying tank being connected to a wafer support assembly according to any one of claims 1 to 11, characterized in that: The lifting mechanism includes an electric slide connected to the main body, a first mounting plate group connected to the slider of the electric slide, a second mounting plate group connected to one end of the first mounting plate group away from the slider, a pulling plate connected to one end of the second mounting plate group away from the first mounting plate group, a support frame connected to the pulling plate away from the second mounting plate group, and a tray connected to the support frame and used to support a wafer box, wherein one side of the tray is connected to a plurality of positioning parts that cooperate with the wafer box.

13. The lifting mechanism according to claim 12, characterized in that: The two opposite inner walls of the support frame are respectively connected with support members for supporting the pallet, and the support members include a support block connected to the support frame by fasteners and a positioning block connected to the support block. The pallet is provided with a positioning groove that passes through itself and cooperates with the positioning block, and the side of the pallet away from the positioning member is provided with a plurality of positioning holes that cooperate with the positioning columns of the wafer holder.

14. The lifting mechanism according to claim 12, characterized in that: The second mounting plate group includes a first mounting plate connected to the first mounting plate group, a second mounting plate connected to an end of the first mounting plate away from the first mounting plate group, and a third mounting plate connected to an end of the second mounting plate away from the first mounting plate, and the pulling plate is connected to the third mounting plate; The two sides of the first mounting plate are bent to form a first bent plate, the two sides of the second mounting plate are bent to form a second bent plate, and the two sides of the third mounting plate are bent to form a third bent plate; The second bent plate abuts against the outer side of the first bent plate. The first bent plate is provided with a plurality of tenth threaded holes. The second bent plate is provided with a plurality of sixth oblong holes matching the tenth threaded holes.

15. The lifting mechanism according to claim 14, characterized in that: The third mounting plate is connected to the second mounting plate by a plurality of fasteners, and the third mounting plate is threadedly connected with a plurality of sixth limiting bolts whose one end abuts against the second mounting plate to adjust the distance between the third mounting plate and the second mounting plate, and the third bent plate is threadedly connected with a plurality of seventh limiting bolts whose one end abuts against the outer wall of the second bent plate to adjust the distance between the third bent plate and the second bent plate.

16. The lifting mechanism according to claim 15, characterized in that: A universal bearing is connected between the third mounting plate and the second mounting plate.

17. A wafer drying machine, characterized in that: It includes a main body, a drying trough body connected to the main body, and a lifting mechanism connected to the main body and used for lifting multiple wafers into the drying trough body. The drying trough body is connected to the wafer support assembly according to any one of claims 1-11, and the lifting mechanism is the lifting mechanism according to any one of claims 12-16.

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