High-speed connector and preparation process thereof

Abstract

The invention discloses a high-speed connector and a preparation process thereof. The high-speed connector comprises a base material; the signal circuit layer is arranged on the outer surface of the base material through metal plating; the signal circuit layer comprises a plurality of signal circuit patterns; the shielding layer is arranged on the outer surface of the base material through metal plating and extends to the periphery of the signal circuit pattern; and the isolation strip is arranged between the signal circuit pattern and the shielding layer so as to expose the base material. The shielding layer and the signal circuit pattern are directly formed on the base material through a metal plating process, and the isolation strip is arranged on the base material to avoid direct contact between the shielding layer and the signal circuit pattern, so that a traditional signal pin mounting step is canceled, an external shielding device is canceled, and the cost is reduced. Therefore, errors and installation difficulty caused by manual operation in a traditional mode are avoided, and the overall occupied space of the high-speed connector is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of high-speed connectors, and in particular to a high-speed connector and a preparation process thereof. Background Art

[0002] High-speed connectors are widely used to provide an interface between a circuit board and another connector (such as a plug connector, etc.). In the prior art, high-speed connectors need to install signal pins on a substrate to achieve signal transmission, and in order to achieve anti-interference shielding capability, a shield is added outside the substrate; when the number of required signal pins is large, the difficulty of installing the signal pins on the substrate will increase, and the addition of the shield will further occupy the use space of the high-speed connector.

[0003] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0004] The technical problem to be solved by the present invention is that, in view of the above-mentioned defects of the prior art, a high-speed connector and its preparation process are provided, aiming to solve the problem that the high-speed connector in the prior art is installed with signal pins and shields, which makes installation difficult and occupies a large space.

[0005] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0006] A high-speed connector, comprising:

[0007] Base material;

[0008] A signal circuit layer is disposed on the outer surface of the substrate by metal plating; the signal circuit layer includes a plurality of signal circuit patterns;

[0009] A shielding layer, which is disposed on the outer surface of the substrate by metal plating and extends to the periphery of the signal circuit pattern;

[0010] The isolation belt is arranged between the signal circuit pattern and the shielding layer to expose the substrate.

[0011] In the high-speed connector, the substrate is a frame-shaped structure, and the signal circuit layer is arranged on the inner side of the substrate.

[0012] The high-speed connector further comprises:

[0013] A shielding structure, disposed on the substrate and located between two adjacent signal circuit patterns;

[0014] The shielding structure is covered with the shielding layer.

[0015] The high-speed connector, wherein the shielding structure comprises:

[0016] Shielding hole; the shielding hole penetrates the substrate along the thickness direction of the substrate.

[0017] The high-speed connector, wherein the shielding structure comprises:

[0018] Shielding groove; the shielding groove is arranged to extend outward along the inner side surface of the substrate.

[0019] The high-speed connector, wherein the depth of the shielding groove is greater than the height of the signal circuit pattern.

[0020] A preparation process of a high-speed connector according to any one of the above, comprising the following steps:

[0021] A base metal layer is prepared on a substrate by using a metal plating process;

[0022] According to the arrangement of the signal circuit pattern, an isolation belt is prepared on the base metal layer to divide the area on the base metal layer, and a signal circuit base metal layer located inside the isolation belt and a shielding base metal layer located outside the isolation belt are obtained;

[0023] The signal circuit base metal layer and the shielding base metal layer are subjected to metal plating to obtain a shielding layer and a signal circuit layer.

[0024] The preparation process, wherein the metal plating process is used to prepare the base metal layer on the substrate, specifically includes:

[0025] A metal layer is plated on the surface of the substrate by chemical plating to prepare the base metal layer.

[0026] The preparation process, wherein the step of preparing an isolation zone on the base metal layer according to the arrangement of the signal circuit pattern comprises:

[0027] According to the corresponding position of the signal circuit pattern, an isolation zone is obtained by laser processing on the base metal layer, and a part of the base metal layer is retained on the isolation zone to serve as a conductive line; wherein the two ends of the conductive line are respectively connected to the signal circuit base metal layer and the shielding base metal layer.

[0028] The preparation process, wherein the step of metal plating the signal circuit base metal layer and the shielding base metal layer to obtain the shielding layer and the signal circuit layer specifically comprises:

[0029] Performing metal plating on the signal circuit base metal layer and the shielding base metal layer through an electroplating process;

[0030] The conducting line on the isolation tape is removed to obtain a shielding layer and a signal circuit layer isolated by the isolation tape.

[0031] Beneficial effect: The shielding layer and the signal circuit pattern in the present application are directly formed on the substrate through a metal plating process, and the isolation belt is arranged on the substrate to avoid direct contact between the shielding layer and the signal circuit pattern, thereby eliminating the traditional signal pin installation steps and the external shielding device, which not only avoids the errors and installation difficulties of manual operation in the traditional method, but also reduces the overall space occupied by the high-speed connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a structural schematic diagram of the high-speed connector when the shielding structure described in the present application adopts a shielding hole;

[0033] Figure 2 is a structural schematic diagram of the high-speed connector when the shielding structure described in the present application adopts a shielding slot;

[0034] Figure 3 is a schematic structural diagram of the substrate;

[0035] Figure 4 It is a reference diagram of the use state of the base metal layer obtained by chemical plating in this application;

[0036] Figure 5 It is a reference diagram of the use state of obtaining the shielding base metal layer and the signal circuit base metal layer by laser-processing the isolation belt on the base metal layer and retaining the conducting line in the present application;

[0037] Figure 6 The conductive line in the present application is removed, and a reference diagram of the use state of the shielding layer and the signal circuit layer is obtained;

[0038] Figure 7 is a flow chart of a process for preparing a high-speed connector described in this application;

[0039] Figure 8 It is a comparative structural schematic diagram in which the depth of the shielding groove described in the present application is greater than the height of the signal circuit pattern. DETAILED DESCRIPTION

[0040] The following will describe the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.

[0041] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0042] The present invention provides a high-speed connector, such as Figure 1 , Figure 2 and Figure 6 As shown, the high-speed connector includes a substrate 1 (such as Figure 3 As shown), a signal circuit layer 2, a shielding layer 3 and an isolation belt 4; the signal circuit layer 2 is arranged on the outer surface of the substrate 1 by metal plating; the signal circuit layer 2 includes a plurality of signal circuit patterns 21; the shielding layer 3 is arranged on the outer surface of the substrate 1 by metal plating, and extends to the periphery of the signal circuit pattern 21; the isolation belt 4 is arranged between the signal circuit pattern 21 and the shielding layer 3 to expose the substrate 1.

[0043] Specifically, the substrate 1 is a plastic substrate 1 made of low-loss engineering plastics such as LCP (industrial liquid crystal polymer) or SPS (sodium polydisulfide propane sulfonate) or PEEK (polyetheretherketone) through an injection molding process. A metal layer is obtained on the outer surface of the substrate 1 through a metal plating process, thereby forming the signal circuit layer 2 and the shielding layer 3.

[0044] The isolation belt 4 is arranged between the signal circuit pattern 21 and the shielding layer 3. The isolation belt 4 is arranged on the periphery of the signal circuit pattern 21 and exposes the substrate 1, that is, the isolation belt 4 is not covered by metal, so as to isolate the signal circuit pattern 21 from the shielding layer 3, ensuring that there is no direct conduction between the shielding layer 3 and the signal circuit. The main function of the shielding layer 3 is to block and absorb electromagnetic interference, while the signal circuit pattern 21 acts as a signal needle for transmitting high-speed signals; if there is no isolation belt 4 between the two, the electric field and magnetic field between them may interfere with each other. Therefore, in the present application, the isolation belt 4 is directly arranged on the substrate 1, so as to achieve effective electromagnetic shielding and avoid signal circuit failure or even equipment failure caused by short circuit due to direct contact between the shielding layer 3 and the signal circuit pattern 21.

[0045] In the present application, the shielding layer 3 and the signal circuit pattern 21 are directly formed on the substrate 1 through a metal plating process, and the isolation belt 4 is arranged on the substrate 1 to avoid direct contact between the shielding layer 3 and the signal circuit pattern 21, thereby eliminating the traditional signal pin installation steps and the external shielding device, which not only avoids the errors and installation difficulties of manual operation in the traditional method, but also reduces the overall space occupied by the high-speed connector.

[0046] At the same time, as an external component, the external shielding device may become loose or fall off due to external force or environmental changes during long-term use, affecting the shielding effect and the reliability of the connector; and the present application uses injection molding and metal plating processes to make the shielding layer 3 and the signal circuit pattern 21 directly molded on the substrate 1, reducing the risk of separation under mechanical stress and significantly improving the long-term reliability and durability of the high-speed connector.

[0047] In one embodiment of the present application, the substrate 1 is a frame-shaped structure, and the signal circuit layer 2 is arranged on the inner side of the substrate 1 .

[0048] Specifically, the substrate 1 is a frame-like structure, so that the center of the substrate 1 is hollowed out and a layout space for the signal circuit pattern 21 is formed inside; the signal circuit layer 2 is located on the inner side of the substrate 1, and the shielding layer 3 is close to the outer side of the substrate 1 and is arranged on the periphery of the signal circuit layer 2.

[0049] In this embodiment, the frame-like structure provides a closed or semi-closed environment for the signal circuit pattern 21 inside, which helps to place the signal circuit pattern 21 in a relatively isolated area and form a more effective shielding structure around the signal circuit layer 2; the plastic part outside the frame and the shielding layer 3 together form a protective shell to prevent external electromagnetic interference from entering, thereby better reducing external electromagnetic interference.

[0050] In one implementation of this embodiment, a plurality of mounting posts 7 (such as Figure 1 and Figure 2 The mounting post 7 is used to cooperate with the external circuit board to assemble the high-speed connector on the external circuit board. The frame-like structure of the substrate 1 can provide better physical support, ensuring that the signal circuit pattern 21 has sufficient structural stability during assembly and use to avoid circuit damage due to vibration or mechanical stress.

[0051] In one embodiment of the present application, the high-speed connector further includes a shielding structure, which is disposed on the substrate 1 and located between two adjacent signal circuit patterns 21 .

[0052] Specifically, since high-frequency signals are more susceptible to interference, the shielding structure is set between two adjacent signal circuit patterns 21 in the present application to provide a physical and electrical shielding area, which effectively reduces the crosstalk between signal circuits (i.e., the phenomenon of signal transmission from one line to another), thereby reducing the propagation of electromagnetic interference between adjacent signal lines, ensuring the stability and clarity of the signal, helping to optimize the electromagnetic compatibility of the signal line, and further improving the overall anti-interference capability of the system in which the high-speed connector is used.

[0053] It should be noted that the shielding structure is covered with the shielding layer 3 to enhance the electromagnetic shielding effect and protect the signal integrity, forming an all-round shielding structure around the signal circuit graphic 21 signal circuit, further reducing the crosstalk between signals and the impact of external interference on the signal, thereby ensuring the stability of the high-speed connector in a complex electromagnetic environment.

[0054] In one implementation of this embodiment, the shielding structure includes a shielding hole 6 (such as Figure 1 As shown in FIG. 1 , the shielding hole 6 penetrates the substrate 1 along the thickness direction of the substrate 1. In this embodiment, the shielding hole 6 is used to provide shielding between two adjacent signal circuit patterns 21, while effectively ensuring the strength of the structure of the substrate 1 itself, and is more suitable for achieving specific local shielding.

[0055] In another implementation of this embodiment, the shielding structure includes a shielding slot 5 (such as Figure 2 The shielding groove 5 is arranged to extend outward along the inner side surface of the substrate 1.

[0056] Specifically, the shielding slot 5 is a long strip isolation area; compared with the shielding hole 6, the shielding slot 5 can provide continuous shielding over a larger area, and is suitable for applications on large-scale and complex circuit boards; using the shielding slot 5, signal integrity is more easily guaranteed, especially for crosstalk and attenuation problems in high-speed signal transmission. At the same time, the structural design of the shielding slot 5 is usually also conducive to heat dissipation, which can effectively reduce heat accumulation.

[0057] like Figure 8 As shown, the depth b of the shielding groove 5 is greater than the height d of the signal circuit pattern 21 to form a stronger shielding effect; by increasing the depth b of the shielding groove 5, the shielding layer 3 can better surround the signal circuit layer 2 and isolate external interference sources, thereby improving the electromagnetic compatibility of the entire system.

[0058] Based on any of the high-speed connectors described above, the present application also provides a preparation process for the high-speed connector; the preparation process is described in detail below by taking the shielding structure using the shielding slot 5 as an example. Figure 7 As shown, the preparation process comprises the following steps:

[0059] S100, preparing a base metal layer on a substrate by using a metal plating process;

[0060] Specifically, the substrate 1 is a plastic part made of low-loss engineering plastics such as LCP, SPS or PEEK through an injection molding process; when the substrate 1 is obtained by injection molding, a shielding groove 5 or a shielding hole 6 is simultaneously set on the substrate 1 at a position corresponding to the position between two adjacent signal circuit patterns 21; after the substrate 1 is obtained by injection molding, the outer surface of the substrate 1 is roughened by a sandblasting material roughening process or a chemical roughening process by immersion in chemical solutions.

[0061] The roughening process can form a microscopic concave-convex structure on the surface of the substrate 1, increasing the effective contact area of ​​the surface; this tiny rough surface can provide more physical bonding points for the subsequent chemical plating or electroplating process, helping the metal coating to better adhere to the plastic surface, and preventing the metal coating from peeling off or falling off during subsequent use. At the same time, the surface of the substrate 1 after roughening can form a uniform concave-convex structure, which can ensure that the subsequent metal coating is more evenly covered on the surface of the substrate 1, avoiding the uneven deposition of the metal coating and affecting the conductivity and overall shielding effect of the signal circuit pattern 21.

[0062] The metal plating process described above is used to prepare the base metal layer 8 on the substrate 1, specifically comprising:

[0063] A metal layer is plated on the surface of the substrate 1 by chemical plating to obtain the base metal layer 8 .

[0064] Specifically, since the substrate 1 is made of plastic, there is no conductive material on its surface; and chemical plating is a self-catalytic reaction, and metal can be deposited on the surface of non-conductive materials (such as plastic) without applying an external current. Therefore, a metal layer is plated on the surface of the roughened substrate 1 by chemical plating, and the metal layer forms the base metal layer 8 (such as Figure 4 The base metal layer 8 is used to form a preliminary conductive layer on the surface of the non-conductive plastic, providing a conductive basis for the subsequent electroplating process.

[0065] If the chemical plating layer is too thick, it may affect the accuracy and uniformity of subsequent electroplating, while if it is too thin, uniform conduction of current may not be ensured; based on this, the base metal layer 8 described in the present application is a base copper layer or a base nickel layer, and the thickness of the base metal layer 8 ranges from 0.005μm to 0.3μm, which not only forms a conductive layer, but also provides a good surface for the adhesion of subsequent metal layers, so that the base metal layer 8 can be well combined with the thicker metal layer in the subsequent electroplating to prevent the plating from falling off.

[0066] S200, preparing an isolation belt on the base metal layer according to the arrangement of the signal circuit pattern, so as to divide the area on the base metal layer, and obtain a signal circuit base metal layer located inside the isolation belt and a shielding base metal layer located outside the isolation belt;

[0067] The base metal layer 8 is formed by a chemical plating process and uniformly and completely covers the surface of the substrate 1 layer. In order to directly form the signal circuit layer 2 and the shielding layer 3 on the substrate 1, in this application, an isolation belt 4 is prepared on the base metal layer 8 according to the arrangement of the signal circuit pattern 21, so that an isolation belt 4 is prepared at the position where each signal circuit pattern 21 is located, thereby dividing the area on the base metal layer 8 to obtain a signal circuit base metal layer 11 and a shielding base metal layer 10; the signal circuit base metal layer 11 is located on the inner side of the isolation belt 4, and the shielding base metal layer 10 is located on the outer side of the isolation belt 4.

[0068] The method of preparing the isolation zone 4 on the base metal layer 8 according to the arrangement of the signal circuit pattern 21 includes:

[0069] According to the corresponding position of the signal circuit pattern 21, an isolation band 4 is obtained by laser processing on the base metal layer 8, and a part of the base metal layer 8 is retained on the isolation band 4 to serve as a conductive line 9; wherein the two ends of the conductive line 9 are respectively connected to the signal circuit base metal layer 11 and the shielding base metal layer 10.

[0070] Specifically, Figure 5As shown, the periphery of the position of each signal circuit pattern 21 is obtained by laser lithography to obtain an isolation zone 4; and, the base metal layer 8 on the isolation zone 4 is not completely lithographyed, but a portion of the base metal layer 8 is retained, and the signal circuit base metal layer 11 and the shielding base metal layer 10 are connected through this portion of the base metal layer 8 to form a conductive circuit 9.

[0071] During the electroplating process, the deposition of the metal layer depends on the current passing through the conductive path; if there is no conductive line 9 between the shielding layer 3 and the signal circuit pattern 21, the two are completely isolated after the laser is completed, and the current cannot flow to the parts that need to be plated during electroplating. The conductive line 9 is used to provide a temporary current channel for electroplating, which allows the current to be smoothly conducted to various areas of the shielding layer 3 and the signal circuit pattern 21, ensuring that the thickness and quality of the subsequently formed electroplated layers of the shielding layer 3 and the signal circuit pattern 21 are consistent.

[0072] In one embodiment of the present application, the width of the conductive line 9 is 0.05 mm to 0.3 mm.

[0073] The width of the conductive line 9 directly affects the current density; during the electroplating process, if the conductive line 9 is too narrow, the current may be concentrated in certain areas, resulting in excessive or uneven coating thickness in these areas. In this embodiment, the width of the conductive line 9 is designed to be 0.05mm to 0.3mm, which can ensure that the connection between the shielding layer 3 and the signal circuit layer 2 is controllable during the electroplating process, ensure sufficient conductive strength, and will not be easily broken during subsequent processing; and the width of the conductive line 9 is designed to be 0.05mm to 0.3mm, which can ensure the conductivity and the smooth progress of the electroplating process, while not affecting the subsequent precise removal operation of the conductive line 9 due to being too wide.

[0074] It should be noted that the base metal layer 8 described in the present application is made by a chemical plating process, and the isolation band 4 is obtained by a laser process. Then, when the base metal layer 8 on the isolation band 4 is removed by laser, the area corresponding to the isolation band 4 on the substrate 1 (referring to the area on the isolation band 4 except the conductive line 9) is no longer covered with metal. Therefore, even if electroplating is used subsequently, these areas will not be electroplated to form a metal layer, thereby ensuring the isolation effect of the isolation band 4.

[0075] S300, performing metal plating on the signal circuit base metal layer and the shielding base metal layer to obtain a shielding layer and a signal circuit layer (such as Figure 6 shown).

[0076] The method of performing metal plating on the signal circuit base metal layer 11 and the shielding base metal layer 10 to obtain the shielding layer 3 and the signal circuit layer 2 specifically includes:

[0077] S301, performing metal plating on the signal circuit base metal layer and the shielding base metal layer through an electroplating process;

[0078] Specifically, through the electroplating process, the outer layer of the substrate 1 is energized again, so that on the basis of the base metal layer 8, electroplating will deposit a thicker metal layer on the conductive area retained by the previous chemical plating to form the final shielding layer 3 and the signal circuit layer 2.

[0079] The shielding base metal layer 10 is located outside the signal circuit base metal layer 11. After the shielding base metal layer 10 is electroplated, the metal layer at the location of the shielding base metal layer 10 is thickened to form a complete metal covering layer to prevent electromagnetic interference; under the conduction action of the conductive line 9, the signal circuit base metal layer 11 can also be electroplated, so that the metal layer at the location of the signal circuit base metal layer 11 is thickened to form a highly conductive signal transmission path.

[0080] The signal circuit layer 2 and all shielding layers 3 need to have good conductivity to ensure the transmission of high-speed signals and the effectiveness of electromagnetic shielding; if the metal plating is too thin, it may cause increased resistance, thereby affecting the signal transmission quality and stability. Therefore, in one embodiment of the present application, the signal circuit base metal layer 11 and the shielding base metal layer 10 are metal plated with a thickness greater than 15 μm through an electroplating process; in this step, the thickness of the electroplated metal layer is greater than the thickness of the base metal layer 8 deposited by chemical plating to ensure sufficiently low resistance and optimize the conductivity of the circuit; especially in high-frequency and high-current application scenarios, such a thickness can effectively reduce signal loss and resistance heating problems.

[0081] A copper layer thicker than 15um is plated by electroplating, or a copper layer + a tin layer, or a copper layer + a silver layer, or a copper layer + a gold layer, with a total thickness of >15um. In order to achieve the anti-oxidation and corrosion resistance of the high-speed connector and improve the weather resistance of the metal plating layer, a protective layer (copper-plated protective layer or tin-silver-gold protective layer) is also electroplated in this application.

[0082] S302: removing the conductive line on the isolation tape to obtain a shielding layer and a signal circuit layer isolated by the isolation tape.

[0083] Specifically, the conductive line 9 between the shielding layer 3 and the signal circuit layer 2 may cause signal interference or interfere with signal transmission; by removing the conductive line 9, this potential interference can be eliminated, ensuring that the shielding layer 3 and the signal circuit layer 2 are completely isolated, avoiding direct electrical contact between them, preventing signal interference, and ultimately ensuring that the shielding layer 3 can effectively provide electromagnetic shielding.

[0084] In summary, the present application provides a high-speed connector and its preparation process, wherein the high-speed connector comprises: a substrate; a signal circuit layer, which is disposed on the outer surface of the substrate by metal plating; the signal circuit layer comprises a plurality of signal circuit patterns; a shielding layer, which is disposed on the outer surface of the substrate by metal plating and extends to the periphery of the signal circuit pattern; an isolation belt, which is disposed between the signal circuit pattern and the shielding layer to expose the substrate. The shielding layer and the signal circuit pattern described in the present application are directly formed on the substrate by a metal plating process, and the isolation belt is disposed on the substrate to avoid direct contact between the shielding layer and the signal circuit pattern, thereby eliminating the traditional signal pin installation step and the external shielding device, which not only avoids the errors and installation difficulties of manual operation in the traditional method, but also reduces the space occupied by the high-speed connector as a whole.

[0085] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A high-speed connector, characterized in that: It includes: Base material; A signal circuit layer is disposed on the outer surface of the substrate by metal plating; The signal circuit layer includes a plurality of signal circuit patterns; A shielding layer, which is disposed on the outer surface of the substrate by metal plating and extends to the periphery of the signal circuit pattern; The isolation belt is arranged between the signal circuit pattern and the shielding layer to expose the substrate.

2. The high-speed connector according to claim 1, characterized in that: The substrate is a frame-shaped structure, and the signal circuit layer is arranged on the inner side of the substrate.

3. The high-speed connector according to claim 1, characterized in that: It also includes: A shielding structure, disposed on the substrate and located between two adjacent signal circuit patterns; The shielding structure is covered with the shielding layer.

4. The high-speed connector according to claim 3, characterized in that: The shielding structure comprises: Shielding hole; the shielding hole penetrates the substrate along the thickness direction of the substrate.

5. The high-speed connector according to claim 3, characterized in that: The shielding structure comprises: Shielding groove; the shielding groove is arranged to extend outward along the inner side surface of the substrate.

6. The high-speed connector according to claim 5, characterized in that: The depth of the shielding groove is greater than the height of the signal circuit pattern.

7. A process for preparing a high-speed connector according to any one of claims 1 to 6, characterized in that: The preparation process comprises the following steps: A base metal layer is prepared on a substrate by using a metal plating process; According to the arrangement of the signal circuit pattern, an isolation belt is prepared on the base metal layer to divide the area on the base metal layer, and a signal circuit base metal layer located inside the isolation belt and a shielding base metal layer located outside the isolation belt are obtained; The signal circuit base metal layer and the shielding base metal layer are subjected to metal plating to obtain a shielding layer and a signal circuit layer.

8. The preparation process according to claim 7, characterized in that: The metal plating process is used to prepare a base metal layer on a substrate, specifically comprising: A metal layer is plated on the surface of the substrate by chemical plating to prepare the base metal layer.

9. The preparation process according to claim 7, characterized in that: The method of preparing an isolation zone on the base metal layer according to the arrangement of the signal circuit pattern includes: According to the corresponding position of the signal circuit pattern, an isolation zone is obtained by laser processing on the base metal layer, and a part of the base metal layer is retained on the isolation zone to serve as a conductive line; wherein the two ends of the conductive line are respectively connected to the signal circuit base metal layer and the shielding base metal layer.

10. The preparation process according to claim 9, characterized in that: The step of performing metal plating on the signal circuit base metal layer and the shielding base metal layer to obtain the shielding layer and the signal circuit layer specifically includes: Performing metal plating on the signal circuit base metal layer and the shielding base metal layer through an electroplating process; The conducting line on the isolation tape is removed to obtain a shielding layer and a signal circuit layer isolated by the isolation tape.

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