Microphone packaging structure and electronic equipment

Abstract

The invention discloses a microphone packaging structure and electronic equipment. The microphone packaging structure comprises a shell, a cavity is formed in the shell, and a mounting groove is formed in the inner wall of the shell; an MEMS (Micro Electro Mechanical System) chip, wherein the MEMS chip is arranged in the cavity; the MEMS chip is provided with a mounting groove, at least part of the ASIC chip is embedded in the mounting groove, and the ASIC chip is electrically connected with the MEMS chip. According to the microphone packaging structure, the cavity is formed in the shell, the mounting groove is formed in the inner wall of the shell, and the ASIC chip is embedded in the mounting groove, so that the volume of the cavity can be increased, and miniaturization design of the microphone packaging structure is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of acoustic-electric conversion, and more specifically, to a microphone packaging structure and an electronic device. Background Art

[0002] In the related art, the packaging structure of the microphone usually includes a shell, a MEMS chip and an ASIC chip. A sound pickup hole is provided on the shell. The diaphragm of the MEMS chip is opposite to the sound pickup hole. The cavity of the packaging structure of the microphone plays a role in adjusting the sound pickup effect. The larger the volume of the cavity, the better the sound pickup effect; the smaller the volume of the cavity, the worse the sound pickup effect. In the current packaging structure, the ASIC chip and the MEMS chip are arranged side by side in the cavity, which will reduce the volume of the cavity and reduce the acoustic performance of the microphone.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution for a microphone packaging structure.

[0005] According to a first aspect of the present invention, a microphone packaging structure is provided. The microphone packaging structure comprises:

[0006] A shell body, wherein a cavity is formed inside the shell body, and an inner wall of the shell body is provided with a mounting groove;

[0007] A MEMS chip, wherein the MEMS chip is disposed in the cavity;

[0008] An ASIC chip is at least partially embedded in the mounting groove, and the ASIC chip is electrically connected to the MEMS chip.

[0009] Optionally, the shell includes a cover body and a substrate, the cover body and the substrate surround the cavity, and the substrate is provided with the mounting groove.

[0010] Optionally, the MEMS chip is mounted on the substrate, and a portion of the MEMS chip is opposite to the mounting groove.

[0011] Optionally, the MEMS chip covers part of the ASIC chip, and the ASIC chip has a pad, and the pad can avoid the MEMS chip.

[0012] Optionally, the cross-sections of the MEMS chip and the ASIC chip are rectangular, and a corner of the ASIC chip is located below an edge of the MEMS chip.

[0013] Optionally, the cross-sections of the MEMS chip and the ASIC chip are rectangular, and one corner of the ASIC chip is located below one corner of the MEMS chip.

[0014] Optionally, the MEMS chip is mounted on the substrate, and the mounting groove is located on one side of the MEMS chip.

[0015] Optionally, the substrate includes a PCB board, and the PCB board is provided with the mounting groove.

[0016] Optionally, the top of the ASIC chip is flush with the open end of the mounting slot.

[0017] Optionally, the microphone packaging structure further includes a light shielding layer, and the light shielding layer covers the ASIC chip.

[0018] Optionally, the light-shielding layer includes light-shielding glue.

[0019] Optionally, the ASIC chip is bonded into the mounting groove, and / or the MEMS chip is bonded into the cavity.

[0020] According to a second aspect of the present invention, a microphone packaging structure is provided. The microphone packaging structure comprises:

[0021] The housing comprises a base plate, wherein the base plate is provided with a mounting groove;

[0022] A MEMS chip, wherein the MEMS chip is mounted on the substrate, and a portion of the MEMS chip is opposite to the mounting groove;

[0023] An ASIC chip is embedded in the mounting groove, and the ASIC chip is electrically connected to the MEMS chip.

[0024] Optionally, the MEMS chip covers part of the ASIC chip, and the ASIC chip has a pad, and the pad can avoid the MEMS chip.

[0025] Optionally, the cross-sections of the MEMS chip and the ASIC chip are rectangular, and a corner of the ASIC chip is located below an edge of the MEMS chip.

[0026] Optionally, the cross-sections of the MEMS chip and the ASIC chip are rectangular, and one corner of the ASIC chip is located below one corner of the MEMS chip.

[0027] According to a third aspect of the present invention, an electronic device is provided, which includes the microphone packaging structure of the above embodiment.

[0028] One technical effect of the present application is that a cavity is formed inside the shell, and an installation groove is provided on the inner wall of the shell. The ASIC chip is embedded in the installation groove, thereby increasing the volume of the cavity, which is conducive to the miniaturized design of the microphone packaging structure.

[0029] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0031] Figure 1 It is a schematic diagram of the structural decomposition of a microphone packaging structure according to an embodiment of the present invention.

[0032] Figure 2 It is a cross-sectional view of a microphone packaging structure according to an embodiment of the present invention.

[0033] Figure 3 1 is a top view of a substrate of a microphone packaging structure according to an embodiment of the present invention.

[0034] Figure 4 FIG. 4 is a top view of a substrate of a microphone packaging structure according to another embodiment of the present invention.

[0035] Reference numerals:

[0036] 1. Shell; 11. Cavity; 12. Mounting groove; 13. Cover; 14. Substrate; 141. Sound pickup hole; 2. MEMS chip; 21. Diaphragm; 3. ASIC chip; 31. Pad; 4. Shading layer; 5. Wire; 7. Adhesive layer. DETAILED DESCRIPTION

[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0039] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0040] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0041] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] According to one embodiment of the present application, a microphone packaging structure is provided. Figures 1 to 4 As shown, the microphone packaging structure includes a housing 1, a MEMS chip 2 and an ASIC chip 3. A cavity 11 is formed inside the housing 1, and an installation groove 12 is provided on the inner wall of the housing 1; the MEMS chip 2 is disposed in the cavity 11; the ASIC chip 3 is at least partially embedded in the installation groove 12, and the ASIC chip 3 is electrically connected to the MEMS chip 2.

[0043] In this example, a cavity 11 is formed inside the housing 1, and the MEMS chip 2 is installed in the cavity 11. The inner wall of the housing 1 is provided with a mounting groove 12, and the ASIC chip 3 is at least partially embedded and installed in the mounting groove 12, so that the volume of the cavity 11 can be increased, thereby improving the acoustic performance of the microphone. In addition, when the ASIC chip 3 is embedded and installed in the mounting groove 12, the volume of the housing 1 can be reduced when the volume of the cavity 11 is the same, that is, when the same acoustic performance is met, which is conducive to the miniaturization design of the microphone.

[0044] In this example, the MEMS chip 2 is disposed in the cavity 11. The MEMS chip 2 is used to convert the sound signal into an electrical signal. For example, the MEMS chip 2 includes a substrate and a diaphragm 21. The substrate is a hollow structure, and a back cavity is formed inside it. For example, the cross section of the substrate is annular. The substrate is made of insulating material, such as silicon dioxide, silicon nitride, etc. The diaphragm 21 is fixed on the substrate and corresponds to the back cavity. Figure 2 As shown, the MEMS chip 2 is arranged on the inner wall of the cavity 11, and the housing 1 is provided with a sound pickup hole 141 connecting the cavity 11 and the external space. External sound enters the cavity 11 through the sound pickup hole 141 and drives the diaphragm 21 to vibrate. The vibration of the diaphragm 21 causes a change in capacitance, thereby forming an electrical signal.

[0045] like Figure 2As shown, the ASIC chip 3 is arranged in the mounting groove 12, for example, the ASIC chip 3 is fixed and bonded in the mounting groove 12 by glue. Preferably, the adhesive layer 7 is located at the bottom of the mounting groove 12. The adhesive layer 7 is bonded to the bottom of the ASIC chip 3. Compared with the method of burying the ASIC chip 3 in the shell 1, this setting method can directly open the mounting groove 12 on the finished shell 1, and there is no need to set the ASIC chip 3 in the shell 1 during the preparation process of the shell 1, thereby making the processing technology of the microphone packaging structure simpler. The ASIC chip 3 is electrically connected to the MEMS chip 2 through a wire 5. The ASIC chip 3 is used to provide a bias voltage to the MEMS chip 2, and the ASIC chip 3 can amplify the electrical signal of the MEMS chip 2 and output the amplified electrical signal.

[0046] Furthermore, if Figure 1 , Figure 3 , Figure 4 As shown, the bottom side of the ASIC chip 3 facing away from the mounting groove 12 is exposed in the cavity 11. The pad 31 of the ASIC chip 3 is usually located on its top surface. This arrangement makes it easy to connect the ASIC chip 3 with the MEMS chip 2. In addition, the heat dissipation effect of the ASIC chip 3 is better.

[0047] In an example, Figure 1 and Figure 2 As shown, the housing 1 includes a cover body 13 and a substrate 14 . The cover body 13 and the substrate 14 surround the cavity 11 , and the substrate 14 is provided with the mounting groove 12 .

[0048] like Figure 1 and Figure 2 As shown, in this example, the housing 1 includes a cover 13 and a substrate 14, and the open end of the cover 13 is connected to one end of the substrate 14, so that a cavity 11 can be formed with the substrate 14. The surface of the substrate 14 facing the cover 13 is provided with a mounting groove 12, and the cover 13 can be covered in the mounting groove 12, so that the mounting groove 12 is located inside the cavity 11. The substrate 14 is penetrated with a sound pickup hole 141, and the MEMS chip 2 is mounted on the substrate 14 and opposite to the sound pickup hole 141. The ASIC chip 3 is at least partially embedded and installed in the mounting groove 12, which is conducive to increasing the volume of the cavity 11.

[0049] In this example, the substrate 14 includes a PCB board, and the PCB board is provided with the mounting groove 12. The substrate 14 can be a PCB board (printed circuit board), and the open end of the cover body 13 is connected to the PCB board. The ASIC chip 3 and the MEMS chip 2 are connected to the PCB board. The PCB board is provided with a mounting groove 12, and the SIC chip is embedded and installed in the mounting groove 12. The conductor layer inside the PCB can play an electromagnetic shielding effect on the ASIC chip 3.

[0050] Furthermore, by using the PCB board as the substrate 14 of the housing 1 , it is unnecessary to provide other additional substrates 14 , thereby reducing the overall thickness of the substrate 14 .

[0051] In an example, Figures 2 to 4 As shown, the MEMS chip 2 is mounted on the substrate 14 , and a portion of the MEMS chip 2 is opposite to the mounting groove 12 .

[0052] like Figure 2 As shown, in this example, the MEMS chip 2 is covered at one end of the sound pickup hole 141, and the MEMS chip 2 is connected to the substrate 14. A mounting groove 12 is provided at one end of the substrate 14, and a portion of the MEMS chip 2 is opposite to the mounting groove 12, that is, the MEMS chip 2 partially covers the open end of the mounting groove 12. The ASIC chip 3 is disposed in the mounting groove 12, and the MEMS chip 2 can partially cover the ASIC chip 3, that is, the ASIC chip 3 and the MEMS chip 2 can be stacked vertically, so that the size of the substrate 14 can be reduced, so as to reduce the overall size of the microphone, which is conducive to the miniaturization design of the microphone.

[0053] During assembly, the ASIC chip 3 is first assembled into the mounting groove 12 , and then the MEMS chip 2 is installed.

[0054] In this example, the MEMS chip 2 and the ASIC chip 3 can be arranged along the length direction of the substrate 14, and the MEMS chip 2 partially covers the open end of the mounting groove 12. The ASIC chip 3 is set in the mounting groove 12 so that the ASIC chip 3 and the MEMS chip 2 can be stacked vertically. Therefore, while meeting the same acoustic performance requirements, the length of the substrate 14 can be appropriately reduced, thereby reducing the overall size of the microphone.

[0055] In an example, Figure 3 and Figure 4 As shown, the MEMS chip 2 covers a portion of the ASIC chip 3 , and the ASIC chip 3 has a pad 31 , and the pad 31 can avoid the MEMS chip 2 .

[0056] In this example, the MEMS chip 2 partially covers the open end of the mounting groove 12. After the ASIC chip 3 is installed in the mounting groove 12, the MEMS chip 2 will cover part of the ASIC chip 3. The ASIC chip 3 has a pad 31. During assembly, the ASIC chip 3 can be rotated to a suitable angle so that the pad 31 of the ASIC chip 3 is exposed to the outside to avoid being blocked by the MEMS chip 2, so that the pad 31 on the ASIC chip 3 can avoid the MEMS chip 2, so that the wire 5 is connected to the pad 31 on the ASIC chip 3.

[0057] It should be noted that by rotating the ASIC chip 3 to a suitable angle, the pad 31 of the ASIC chip 3 can be exposed to the outside without changing the structure of the ASIC chip, so as to avoid being blocked by the MEMS chip 2. This avoids the customized design of the ASIC chip 3, saves costs, and also realizes the miniaturization design of the microphone, so that the microphone can be applied to a variety of scenarios with limited space.

[0058] In this example, the structure of the mounting groove 12 can be determined according to the angular position of the ASIC chip 3 after rotation, that is, the mounting groove 12 is rotated by a certain angle, so as to adapt the structure of the mounting groove 12 to the ASIC chip 3 to improve the assembly stability of the ASIC chip 3.

[0059] In this example, the MEMS chip 2 can be rotated to a suitable angle so that the MEMS chip 2 can avoid the position of the pad 31 on the ASIC chip 3. Alternatively, the MEMS chip 2 and the ASIC chip 3 can be rotated to a suitable angle at the same time so that the MEMS chip 2 can cover a larger area of ​​the ASIC chip 3 and the MEMS chip 2 can avoid passing over the pad 31 on the ASIC chip 3.

[0060] For example, in this example, Figure 3 As shown, the cross-sections of the MEMS chip 2 and the ASIC chip 3 are rectangular, and one corner of the ASIC chip 3 is located below one side of the MEMS chip 2. The MEMS chip 2 and the ASIC chip 3 are both rectangular parallelepiped structures as a whole, the ASIC chip 3 is arranged in the mounting groove 12, and one corner of the ASIC chip 3 is located below one side of the MEMS chip 2 to avoid the pad 31 of the ASIC chip 3, which allows a larger operating space for the connection between the pad 31 of the MEMS chip 2 and the pad 31 of the ASIC chip 3.

[0061] Or, if Figure 4 As shown, in this example, the cross-sections of the MEMS chip 2 and the ASIC chip 3 are rectangular, and one corner of the ASIC chip 3 is located below one corner of the MEMS chip 2. The MEMS chip 2 and the ASIC chip 3 are both rectangular parallelepiped structures as a whole, the ASIC chip 3 is arranged in the mounting groove 12, and one corner of the ASIC chip 3 is located below one corner of the MEMS chip 2. This arrangement can also avoid the pad 31 of the ASIC chip 3, so that the connection between the pad 31 of the MEMS chip 2 and the pad 31 of the ASIC chip 3 has a larger operating space.

[0062] In an example, Figure 1As shown, the MEMS chip 2 is mounted on the substrate 14 , and the mounting groove 12 is located on one side of the MEMS chip 2 .

[0063] like Figure 1 As shown, when there is enough space on the substrate 14, the mounting groove 12 can also be arranged on one side of the MEMS chip 2, that is, the mounting groove 12 can also be arranged side by side with the MEMS chip 2 along the length direction of the substrate 14, which can facilitate the processing of the mounting groove 12 on the substrate 14. The specific distance between the mounting groove 12 and the MEMS chip 2 can be determined by those skilled in the art according to actual conditions and is not specifically limited here.

[0064] In an example, Figure 2 As shown, the top of the ASIC chip 3 is flush with the open end of the mounting slot 12 .

[0065] like Figure 2 As shown, in this example, the top of the ASIC chip 3 is flush with the open end of the mounting groove 12 , thereby ensuring that the volume of the cavity 11 is larger and facilitating reducing the thickness of the substrate 14 .

[0066] It should be noted that the top of the ASIC chip 3 is flush with the open end of the mounting groove 12, that is, the ASIC chip 3 can be completely embedded in the mounting groove 12, thereby increasing the volume of the cavity 11. In addition, the overall thickness of the substrate 14 can be determined according to the thickness of the ASIC chip 3, so that the thickness of the substrate 14 is kept as small as possible.

[0067] In this example, the top of the ASIC chip 3 may also be flush with the opening end of the mounting slot 12, or the top of the ASIC chip 3 may also be slightly higher than the opening end of the mounting slot 12. Those skilled in the art may determine this according to actual conditions, and no specific limitation is made here.

[0068] In an example, Figure 1 and Figure 2 As shown, the microphone packaging structure further includes a light shielding layer 4 , and the light shielding layer 4 covers the ASIC chip 3 .

[0069] like Figure 1 and Figure 2 As shown, in this example, the microphone packaging structure further includes a light shielding layer 4, and the light shielding layer 4 covers the ASIC chip 3. By covering the surface of the ASIC chip 3 with the light shielding layer 4, the ASIC chip 3 can be prevented from being affected by external light noise, that is, the light shielding layer 4 can effectively block external light and avoid external light from interfering with the ASIC chip 3, thereby facilitating further improving the acoustic performance of the microphone.

[0070] In one example, the light shielding layer 4 includes light shielding glue. The light shielding glue is applied to the surface of the ASIC chip 3, so that the ability of the ASIC chip to resist light interference can be improved. In addition, the volume of the light shielding layer 4 formed by applying the light shielding glue on the surface of the ASIC chip 3 is small, which is conducive to reducing the overall volume of the ASIC chip 3.

[0071] In this example, the light shielding layer 4 may also be other types of light shielding structures. For example, the light shielding layer 4 may also be a light shielding tape, which is adhered to the position of the ASIC chip 3 that needs to be shielded from light. The light shielding tape also has a certain anti-scratch performance and can protect the surface of the ASIC chip 3 from being scratched.

[0072] Alternatively, the light shielding layer 4 may also be a light shielding shell, which may be made of opaque material, and the light shielding shell may be placed on the surface of the ASIC chip 3 to provide a light shielding effect. Furthermore, by setting the light shielding layer 4 as a light shielding shell, the light shielding layer 4 may be directly placed on the surface of the ASIC chip, thereby improving the convenience of assembling the light shielding layer 4.

[0073] like Figure 2 As shown, in this example, the MEMS chip 2 partially covers the open end of the mounting groove 12, and after the ASIC chip 3 is installed in the mounting groove 12, the MEMS chip 2 will cover part of the ASIC chip 3. The part of the ASIC chip 3 covered by the MEMS chip 2 can be shielded by the MEMS chip 2, and the ASIC chip 3 is embedded in the mounting groove 12, and the inner side wall of the mounting groove 12 can also shield the ASIC chip 3. The light shielding layer 4 can only cover the part of the ASIC chip exposed to the outside, so as to save materials and reduce production costs.

[0074] In one example, the ASIC chip 3 is bonded into the mounting groove 12 , and / or the MEMS chip 2 is bonded into the cavity 11 .

[0075] In this example, the ASIC chip 3 can be fixed in the mounting groove 12 by adhesive bonding, thereby improving the assembly efficiency of the ASIC chip 3. Also, the MEMS chip 2 can be bonded to the inner wall of the housing 1 by adhesive bonding, thereby improving the assembly efficiency of the MEMS chip 2. Both the ASIC chip 3 and the MEMS chip 2 are mounted by adhesive bonding, which is beneficial to improving the overall assembly efficiency of the microphone.

[0076] Of course, the ASIC chip 3 and the MEMS chip 2 can also be installed in other ways, such as fastener connection, etc. Those skilled in the art can determine according to actual conditions, and no specific limitation is made here.

[0077] According to another embodiment of the present application, a microphone packaging structure is provided. Figure 3 and Figure 4 As shown, the microphone packaging structure includes: a shell 1, including a substrate 14, and the substrate 14 is provided with a mounting groove 12; a MEMS chip 2, the MEMS chip 2 is installed on the substrate 14, and part of the MEMS chip 2 is opposite to the mounting groove 12; an ASIC chip 3, the ASIC chip 3 is embedded in the mounting groove 12, and the ASIC chip 3 is electrically connected to the MEMS chip 2.

[0078] In this example, the MEMS chip 2 is covered at one end of the sound pickup hole 141, and the MEMS chip 2 is connected to the substrate 14. A mounting groove 12 is provided at one end of the substrate 14, and a portion of the MEMS chip 2 is opposite to the mounting groove 12, that is, the MEMS chip 2 partially covers the open end of the mounting groove 12. The ASIC chip 3 is provided in the mounting groove 12, and the MEMS chip 2 can partially cover the ASIC chip 3, that is, the ASIC chip 3 and the MEMS chip 2 can be stacked vertically, so that the size of the substrate 14 can be reduced, so as to reduce the overall size of the microphone, which is conducive to the miniaturization design of the microphone.

[0079] In an example, Figure 3 and Figure 4 As shown, the MEMS chip 2 covers a portion of the ASIC chip 3 , and the ASIC chip 3 has a pad 31 , and the pad 31 can avoid the MEMS chip 2 .

[0080] In this example, the MEMS chip 2 partially covers the open end of the mounting groove 12. After the ASIC chip 3 is installed in the mounting groove 12, the MEMS chip 2 will cover part of the ASIC chip 3. The ASIC chip 3 has a pad 31. During assembly, the ASIC chip 3 can be rotated to a suitable angle so that the pad 31 of the ASIC chip 3 is exposed to the outside to avoid being blocked by the MEMS chip 2, so that the pad 31 on the ASIC chip 3 can avoid the MEMS chip 2, so that the wire 5 is connected to the pad 31 on the ASIC chip 3.

[0081] It should be noted that by rotating the ASIC chip 3 to a suitable angle, the pad 31 of the ASIC chip 3 can be exposed to the outside without changing the structure of the ASIC chip, so as to avoid being blocked by the MEMS chip 2. This avoids the customized design of the ASIC chip 3, saves costs, and also realizes the miniaturization design of the microphone, so that the microphone can be applied to a variety of scenarios with limited space.

[0082] In this example, the structure of the mounting groove 12 can be determined according to the angular position of the ASIC chip 3 after rotation, that is, the mounting groove 12 is rotated by a certain angle, so as to adapt the structure of the mounting groove 12 to the ASIC chip 3 to improve the assembly stability of the ASIC chip 3.

[0083] In this example, the MEMS chip 2 can be rotated to a suitable angle so that the MEMS chip 2 can avoid the position of the pad 31 on the ASIC chip 3. Alternatively, the MEMS chip 2 and the ASIC chip 3 can be rotated to a suitable angle at the same time so that the MEMS chip 2 can cover a larger area of ​​the ASIC chip 3 and the MEMS chip 2 can avoid passing over the pad 31 on the ASIC chip 3.

[0084] For example, in this example, Figure 3 As shown, the cross-sections of the MEMS chip 2 and the ASIC chip 3 are rectangular, and one corner of the ASIC chip 3 is located below one side of the MEMS chip 2. The MEMS chip 2 and the ASIC chip 3 are both rectangular parallelepiped structures as a whole, the ASIC chip 3 is arranged in the mounting groove 12, and one corner of the ASIC chip 3 is located below one side of the MEMS chip 2 to avoid the pad 31 of the ASIC chip 3, which allows a larger operating space for the connection between the pad 31 of the MEMS chip 2 and the pad 31 of the ASIC chip 3.

[0085] Or, if Figure 4 As shown, in this example, the cross-sections of the MEMS chip 2 and the ASIC chip 3 are rectangular, and one corner of the ASIC chip 3 is located below one corner of the MEMS chip 2. The MEMS chip 2 and the ASIC chip 3 are both rectangular parallelepiped structures as a whole, the ASIC chip 3 is arranged in the mounting groove 12, and one corner of the ASIC chip 3 is located below one corner of the MEMS chip 2. This arrangement can also avoid the pad 31 of the ASIC chip 3, so that the connection between the pad 31 of the MEMS chip 2 and the pad 31 of the ASIC chip 3 has a larger operating space.

[0086] According to another embodiment of the present application, an electronic device is provided, which includes the microphone packaging structure of the above embodiment, and the microphone packaging structure is arranged in the device housing.

[0087] In this example, the microphone packaging structure includes a housing 1, a MEMS chip 2, and an ASIC chip 3. A cavity 11 is formed inside the housing 1, and a mounting groove 12 is provided on the inner wall of the housing 1; the MEMS chip 2 is disposed in the cavity 11; the ASIC chip 3 is at least partially embedded in the mounting groove 12, and the ASIC chip 3 is electrically connected to the MEMS chip 2.

[0088] In this example, a cavity 11 is formed inside the housing 1, and the MEMS chip 2 is installed in the cavity 11. The inner wall of the housing 1 is provided with a mounting groove 12, and the ASIC chip 3 is at least partially embedded and installed in the mounting groove 12, so that the volume of the cavity 11 can be increased, thereby improving the acoustic performance of the microphone, thereby improving the sound pickup performance of the electronic device. In addition, by embedding and installing the ASIC chip 3 in the mounting groove 12, when the volume of the cavity 11 is the same, that is, when the same acoustic performance is met, the volume of the housing 1 can be reduced to reduce the volume of the microphone, thereby facilitating the miniaturization design of the electronic device.

[0089] Of course, the electronic device of the present application also includes at least all the beneficial effects of the above embodiments, which will not be elaborated here.

[0090] Among them, the electronic device can be a mobile phone, smart glasses, a watch, an earphone, etc.

[0091] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0092] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A microphone packaging structure, characterized in that: include: A housing (1), wherein a cavity (11) is formed inside the housing (1), and an inner wall of the housing (1) is provided with a mounting groove (12); A MEMS chip (2), wherein the MEMS chip (2) is arranged in the cavity (11); An ASIC chip (3), wherein the ASIC chip (3) is at least partially embedded in the mounting groove (12), and the ASIC chip (3) is electrically connected to the MEMS chip (2).

2. The microphone packaging structure according to claim 1, characterized in that: The housing (1) comprises a cover body (13) and a base plate (14); the cover body (13) and the base plate (14) enclose the cavity (11); and the base plate (14) is provided with the mounting groove (12).

3. The microphone packaging structure according to claim 2, characterized in that: The MEMS chip (2) is mounted on the substrate (14), and a portion of the MEMS chip (2) is opposite to the mounting groove (12).

4. The microphone packaging structure according to claim 3, characterized in that: The MEMS chip (2) covers a portion of the ASIC chip (3); the ASIC chip (3) has a solder pad (31); and the solder pad (31) can avoid the MEMS chip (2).

5. The microphone packaging structure according to claim 4, characterized in that: The cross-sections of the MEMS chip (2) and the ASIC chip (3) are rectangular, and a corner of the ASIC chip (3) is located below an edge of the MEMS chip (2).

6. The microphone packaging structure according to claim 4, characterized in that: The cross-sections of the MEMS chip (2) and the ASIC chip (3) are rectangular, and one corner of the ASIC chip (3) is located below one corner of the MEMS chip (2).

7. The microphone packaging structure according to claim 2, characterized in that: The MEMS chip (2) is mounted on the substrate (14), and the mounting groove (12) is located on one side of the MEMS chip (2).

8. The microphone packaging structure according to claim 2, characterized in that: The base plate (14) comprises a PCB board, and the PCB board is provided with the mounting groove (12).

9. The microphone packaging structure according to claim 1, characterized in that: The top end of the ASIC chip (3) is flush with the opening end of the mounting groove (12).

10. The microphone packaging structure according to claim 1, characterized in that: The microphone packaging structure further comprises a light shielding layer (4), wherein the light shielding layer (4) covers the ASIC chip (3).

11. The microphone packaging structure according to claim 10, characterized in that: The light-shielding layer (4) comprises light-shielding glue.

12. The microphone packaging structure according to claim 1, characterized in that: The ASIC chip (3) is bonded into the mounting groove (12), and / or the MEMS chip (2) is bonded into the cavity (11).

13. A microphone packaging structure, characterized in that: include: The housing (1) comprises a base plate (14), wherein the base plate (14) is provided with a mounting groove (12); A MEMS chip (2), the MEMS chip (2) being mounted on the substrate (14), and a portion of the MEMS chip (2) being opposite to the mounting groove (12); An ASIC chip (3), wherein the ASIC chip (3) is embedded in the mounting groove (12), and the ASIC chip (3) is electrically connected to the MEMS chip (2).

14. The microphone packaging structure according to claim 13, characterized in that: The MEMS chip (2) covers a portion of the ASIC chip (3); the ASIC chip (3) has a solder pad (31); and the solder pad (31) can avoid the MEMS chip (2).

15. The microphone packaging structure according to claim 14, characterized in that: The cross-sections of the MEMS chip (2) and the ASIC chip (3) are rectangular, and a corner of the ASIC chip (3) is located below an edge of the MEMS chip (2).

16. The microphone packaging structure according to claim 14, characterized in that: The cross-sections of the MEMS chip (2) and the ASIC chip (3) are rectangular, and one corner of the ASIC chip (3) is located below one corner of the MEMS chip (2).

17. An electronic device, characterized in that: Comprising the microphone packaging structure as described in any one of claims 1 to 16.

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