Printed circuit board, manufacturing method thereof and electronic equipment

Abstract

The invention relates to the technical field of circuit board manufacturing, and discloses a printed circuit board and a manufacturing method thereof, and electronic equipment, and the printed circuit board comprises at least two sub-circuit boards which are arranged in a matrix; wherein a corresponding golden finger area is arranged at the position of one vertex angle of each sub-circuit board; and the golden finger areas of the two adjacent sub-circuit boards are arranged in a non-adjacent manner and / or staggered manner. Therefore, typesetting optimization is carried out on the sub-circuit boards in the printed circuit board, adjacent open areas of the multiple sub-circuit boards can be avoided, it is ensured that resin can flow uniformly and fill all the areas in the pressing process, the copper wrinkle phenomenon of the golden finger areas in the printed circuit board in the pressing process is effectively reduced, and the yield of the printed circuit board is improved. The whole electrical connection performance and reliability of the product are improved, the production efficiency and the yield are increased, meanwhile, reworking and scrapping caused by the copper wrinkle problem are reduced, the production cost is saved, and wide application prospects and market values are achieved in the field of circuit board manufacturing.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a printed circuit board and a manufacturing method thereof, and electronic equipment. Background Art

[0002] Printed Circuit Board (PCB) is the support and interconnection basis of electronic components. Its performance and quality are directly related to the stability and reliability of the entire electronic product. The gold finger part on the circuit board is not only a physical connection bridge between components on the circuit board, but also a key channel for signal and current transmission. Through the gold finger, various electronic components can be closely connected together to form a complete and stable circuit system.

[0003] However, during the manufacturing process of circuit boards, a defect called "copper wrinkles" often occurs in the gold finger area. Since the gold fingers are located at the edges of both sides of each circuit board, there is a height difference between the copper area and the copper-free area below the gold fingers. During the lamination process, the resin is likely to form low-pressure areas at these height differences when filling the glue, causing the copper foil to wrinkle under pressure, especially when two adjacent gold finger areas are connected to form a large copper-free area, which is prone to obvious wrinkles. Copper wrinkles not only seriously affect the appearance quality of the product, but may also reduce the electrical connection performance, increase contact resistance, and even cause circuit failures and product failures. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a printed circuit board and a manufacturing method thereof, and an electronic device, which can avoid the adjacent open areas of multiple sub-circuit boards, solve the problem of pressing wrinkles in the gold finger area of ​​the printed circuit board, and improve the overall electrical connection performance and reliability of the product.

[0005] In order to solve the above technical problems, the present invention provides a printed circuit board, comprising: at least two sub-circuit boards arranged in a matrix;

[0006] Wherein, a corresponding gold finger area is arranged at the position of one of the vertex corners of each sub-circuit board;

[0007] The gold finger areas of two adjacent sub-circuit boards are arranged non-adjacently and / or staggered.

[0008] In a first aspect, in the above-mentioned printed circuit board provided by the present invention, the gold finger areas of two adjacent sub-circuit boards are arranged in a staggered manner.

[0009] On the other hand, in the above-mentioned printed circuit board provided by the present invention, each of the sub-circuit boards comprises a plurality of inner layer boards stacked;

[0010] The copper-free areas of every two adjacent inner-layer boards are stacked and staggered with each other in the vertical direction.

[0011] On the other hand, in the above-mentioned printed circuit board provided by the present invention, each of the sub-circuit boards is stacked in a rotating manner;

[0012] In each of the sub-circuit boards, a horizontal direction of the circuit board of the first inner layer board and a horizontal direction of the circuit board of the second inner layer board located on the first inner layer board are 180 degrees apart.

[0013] On the other hand, in the above-mentioned printed circuit board provided by the present invention, a partition steel plate is provided between the first inner layer plate and the second inner layer plate;

[0014] The partition steel plate is used to separate the resin flow between the first inner layer plate and the second inner layer plate.

[0015] On the other hand, in the above-mentioned printed circuit board provided by the present invention, the surface copper foil thickness of each sub-circuit board ranges from 0.4 mil to 0.65 mil;

[0016] The prepreg resin content of each of the sub-circuit boards is greater than 65%.

[0017] On the other hand, in the above-mentioned printed circuit board provided by the present invention, in each of the sub-circuit boards, the sub-circuit board is divided into a first area, a second area, a third area and a fourth area in a clockwise direction according to four vertices of the sub-circuit board;

[0018] The two adjacent sub-circuit boards are respectively a first sub-circuit board and a second sub-circuit board;

[0019] When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the first area, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the first area or the third area;

[0020] When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the second area, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the second area or the fourth area;

[0021] When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the third area, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the third area or the first area;

[0022] When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the fourth region, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the fourth region or the second region;

[0023] The gold finger areas of other sub-circuit boards adjacent to each of the sub-circuit boards are distributed in the same manner or in a staggered manner.

[0024] In order to solve the above technical problems, the present invention further provides a method for manufacturing a printed circuit board, wherein the printed circuit board comprises at least two sub-circuit boards arranged in a matrix, and the manufacturing method comprises:

[0025] A corresponding gold finger area is formed at a position where one of the vertex corners of each of the sub-circuit boards is located;

[0026] At the same time, the gold finger areas are formed in two adjacent sub-circuit boards in a non-adjacent arrangement and / or staggered arrangement manner.

[0027] On the other hand, in the method for manufacturing the printed circuit board provided by the present invention, the method further comprises:

[0028] In each of the sub-circuit boards, the boards are stacked in a rotating manner. After the first inner layer board is stacked, when the second inner layer board is stacked on the first inner layer board, the circuit board of the second inner layer board is rotated 180 degrees in the horizontal direction for stacking.

[0029] After the lamination is completed, a pressing process is performed, and after the pressing process, the thickness of the outer copper foil is thinned through a copper reduction process.

[0030] In order to solve the above technical problem, the present invention further provides an electronic device, comprising the above printed circuit board provided by the present invention.

[0031] It can be seen from the above technical solution that a printed circuit board provided by the present invention comprises: at least two sub-circuit boards arranged in a matrix; wherein a corresponding gold finger area is arranged at the position of one of the vertex corners of each sub-circuit board; and the gold finger areas of two adjacent sub-circuit boards are non-adjacently arranged and / or staggered.

[0032] The beneficial effect of the present invention is that the above-mentioned printed circuit board provided by the present invention optimizes the layout of the sub-circuit boards in the printed circuit board, and a corresponding gold finger area is set at the position of one of the vertex corners of each sub-circuit board. The gold finger areas between two adjacent sub-circuit boards are staggered and / or not adjacent to each other, which can avoid the adjacent empty areas of multiple sub-circuit boards, ensure that the resin can flow evenly and fill each area during pressing, thereby effectively reducing the copper wrinkle phenomenon in the gold finger area of ​​the printed circuit board during the pressing process, improving the overall electrical connection performance and reliability of the product, increasing production efficiency and yield, while reducing rework and scrap caused by copper wrinkle problems, saving production costs, and having broad application prospects and market value in the field of circuit board manufacturing.

[0033] In addition, the present invention also provides a corresponding manufacturing method and electronic device for a printed circuit board, which have the same or corresponding technical features as the above-mentioned printed circuit board, further making the above-mentioned printed circuit board more practical, and the manufacturing method and electronic device have corresponding advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 One of the schematic diagrams of the layout of a printed circuit board provided in an embodiment of the present invention;

[0036] Figure 2 A second schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention;

[0037] Figure 3 The third schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention;

[0038] Figure 4 A fourth schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention;

[0039] Figure 5 A fifth schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention;

[0040] Figure 6 A sixth schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention;

[0041] Figure 7 A seventh schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention;

[0042] Figure 8 A schematic diagram corresponding to the lamination of sub-circuit boards provided in an embodiment of the present invention;

[0043] Fig. 9 A schematic diagram corresponding to the lamination of printed circuit boards provided in an embodiment of the present invention.

[0044] Among them, 1 is the first inner layer board, 2 is the second inner layer board, 3 is the partition steel plate, 4 is the circuit board, A is the gold finger area, and B is the copper-free area. DETAILED DESCRIPTION

[0045] In today's highly integrated and sophisticated electronic equipment manufacturing field, printed circuit boards (PCBs) serve as the support and interconnection basis for electronic components, and their performance and quality are directly related to the stability and reliability of the entire electronic product. The metal contact points on the printed circuit board (PCB), especially the gold finger parts located on the edges of both sides, are responsible for important tasks such as signal transmission, current conduction, and physical connection. The material selection, structural design, and manufacturing process optimization of gold fingers have always been a hot topic in the field of printed circuit board (PCB) manufacturing. However, during the manufacturing process of printed circuit boards (PCBs), copper wrinkles often occur in the gold finger area. Copper wrinkles are mainly caused by the height difference between the copper-free area below the gold finger area and the copper-containing area. During the lamination process, the resin is prone to form low-pressure areas at these height differences during the filling process, causing the copper foil to wrinkle under pressure, especially when two adjacent gold finger areas are connected to form a larger copper-free area, which is prone to obvious wrinkles. Copper wrinkles not only seriously affect the appearance quality of the product, but may also reduce the electrical connection performance, increase contact resistance, and even cause circuit failures and product failures.

[0046] In order to solve the above technical problems, the present invention provides a printed circuit board, which can avoid the adjacent open areas of multiple sub-circuit boards, solve the problem of pressing wrinkles in the gold finger area of ​​the printed circuit board, and improve the overall electrical connection performance and reliability of the product.

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. A printed circuit board provided in an embodiment of the present invention comprises: at least two sub-circuit boards arranged in a matrix;

[0049] Wherein, a corresponding gold finger area is arranged at the position of one of the top corners of each sub-circuit board;

[0050] The gold finger areas of two adjacent sub-circuit boards are arranged non-adjacently and / or staggered.

[0051] It should be noted that non-adjacent arrangement refers to the state that the two gold finger areas are not adjacent to each other in space, that is, the two gold finger areas are not directly adjacent. Staggered arrangement refers to the deviation or staggered placement of the two gold finger areas so that they are not completely aligned.

[0052] In the above-mentioned printed circuit board provided by the embodiment of the present invention, the layout of the sub-circuit boards in the printed circuit board is optimized, and a corresponding gold finger area is set at the position of one of the vertex corners of each sub-circuit board. The gold finger areas between two adjacent sub-circuit boards are staggered and / or not adjacent to each other, which can avoid the adjacency of the empty areas of multiple sub-circuit boards, ensure that the resin can flow evenly and fill each area during pressing, and thus effectively reduce the copper wrinkle phenomenon in the gold finger area of ​​the printed circuit board during the pressing process, improve the overall electrical connection performance and reliability of the product, increase production efficiency and yield, and at the same time reduce rework and scrap caused by copper wrinkle problems, save production costs, and have broad application prospects and market value in the field of circuit board manufacturing.

[0053] Figure 1 One of the schematic diagrams of the layout of the printed circuit board provided in the embodiment of the present invention is as follows: Figure 1 As shown, the printed circuit board includes two sub-circuit boards, a corresponding gold finger area A is set at the upper right corner of the left sub-circuit board, and a corresponding gold finger area A is set at the lower left corner of the right sub-circuit board. At this time, the two gold finger areas A are staggered, that is, the copper-free areas under the two gold finger areas A are also staggered, avoiding the adjacent open areas of the two sub-circuit boards, thereby reducing the low-voltage area formed during the pressing process. Figure 1 The positions of the copper area and the copper-free area of ​​the sub-circuit board on the left are different from those of the copper area and the copper-free area of ​​the sub-circuit board on the right.

[0054] Figure 2 The second schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention is as follows: Figure 2 As shown, the printed circuit board includes two sub-circuit boards, a corresponding gold finger area A is set at the upper right corner of the left sub-circuit board, and a corresponding gold finger area A is also set at the upper right corner of the right sub-circuit board. At this time, the two gold finger areas A are not adjacent to each other, that is, the copper-free areas under the two gold finger areas A are also not adjacent to each other, which avoids the open areas of the two sub-circuit boards being adjacent to each other, thereby reducing the low-voltage area formed during the pressing process. Figure 1 The positions of the copper area and the copper-free area of ​​the sub-circuit board on the left are the same as the positions of the copper area and the copper-free area of ​​the sub-circuit board on the right.

[0055] It should be added that if a corresponding gold finger area A is set at the upper right corner of the left sub-circuit board, and a corresponding gold finger area A is also set at the upper left corner of the right sub-circuit board, the two gold finger areas A are set adjacent to each other, which may easily cause copper wrinkles.

[0056] Figure 3 The third schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention is as follows: Figure 3As shown, the printed circuit board includes two sub-circuit boards, a corresponding gold finger area A is set at the upper right corner of the left sub-circuit board, and a corresponding gold finger area A is also set at the lower right corner of the right sub-circuit board. At this time, the two gold finger areas A are not adjacent to each other but staggered, that is, the copper-free areas under the two gold finger areas A are also not adjacent to each other but staggered, which avoids the open areas of the two sub-circuit boards being adjacent to each other, thereby reducing the low-voltage area formed during the pressing process. Figure 1 The positions of the copper area and the copper-free area of ​​the sub-circuit board on the left are different from those of the copper area and the copper-free area of ​​the sub-circuit board on the right.

[0057] It should be noted that the gold finger can be made of precious metal materials such as gold, gold plating or gold alloy. Gold and its alloys have extremely low resistivity and excellent conductivity, which can ensure that signals and currents are transmitted quickly and stably on the gold finger, reducing signal attenuation and energy loss. Gold has extremely high chemical stability and can resist erosion by most chemicals, including oxidation and corrosion, which enables the gold finger to maintain a stable electrical connection for a long time in a harsh working environment and extend the service life of the product. The gold finger needs to withstand frequent plug-in and unplug operations and mechanical stress, so it must have sufficient mechanical strength. The hardness of gold and its alloys is moderate, and it is not easy to deform or break, which can meet the mechanical strength requirements of the gold finger.

[0058] Furthermore, in a specific implementation, in the above-mentioned printed circuit board provided by the embodiment of the present invention, the gold finger areas A of two adjacent sub-circuit boards are arranged in a staggered manner.

[0059] Figure 4 The fourth schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention. Figure 4 As shown, the printed circuit board includes four sub-circuits, wherein in the first row, the gold finger areas A of two adjacent sub-circuits are arranged in a staggered manner, and the second row is arranged in the same manner as the first row. This layout method helps the resin to flow evenly during the lamination process, reduces the risk of copper foil wrinkles, and simplifies the manufacturing process in a regular manner.

[0060] Furthermore, in a specific implementation, in the above-mentioned printed circuit board provided by the embodiment of the present invention, in each sub-circuit board, the sub-circuit board is divided into a first area, a second area, a third area and a fourth area in a clockwise direction according to four vertices of the sub-circuit board;

[0061] The two adjacent sub-circuit boards are respectively a first sub-circuit board and a second sub-circuit board;

[0062] When more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the first area, more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the first area or the third area;

[0063] When more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the second area, more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the second area or the fourth area;

[0064] When more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the third area, more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the third area or the first area;

[0065] When more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the fourth area, more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the fourth area or the second area;

[0066] The gold finger areas A of other sub-circuit boards adjacent to each sub-circuit board are distributed in the same manner or in a staggered manner.

[0067] In implementation, the sub-circuit board is divided into the first area, the second area, the third area and the fourth area in a clockwise direction according to the four vertices of the sub-circuit board, which can be understood as dividing the sub-circuit board into the upper left area, the upper right area, the lower left area and the lower right area. In order to ensure that the gold finger areas A of two adjacent sub-circuits are non-adjacent and / or staggered, when the gold finger area A of the first sub-circuit board is mostly located in the first area, the gold finger area A of the second sub-circuit board is mostly located in the first area or the third area; when the gold finger area A of the first sub-circuit board is mostly located in the second area, the gold finger area A of the second sub-circuit board is mostly located in the second area or the fourth area; when the gold finger area A of the first sub-circuit board is mostly located in the third area, the gold finger area A of the second sub-circuit board is mostly located in the third area or the first area; when the gold finger area A of the first sub-circuit board is mostly located in the fourth area, the gold finger area A of the second sub-circuit board is mostly located in the fourth area or the second area.

[0068] by Figure 4 For example, assuming that the first sub-circuit board is the first sub-circuit board in the first row, its gold finger area A is mostly located in the second area (i.e., the upper right area), and there are two sub-circuit boards adjacent to the first sub-circuit board, among which the gold finger area of ​​the sub-circuit board adjacent to the right of the first sub-circuit board is mostly located in the fourth area (i.e., the lower left area), and the gold finger area of ​​the sub-circuit board adjacent to the bottom of the first sub-circuit board is mostly located in the second area (i.e., the upper right area).

[0069] Figure 5 The fifth schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention. Figure 5For example, assuming that the first sub-circuit board is the first sub-circuit board in the second row, its gold finger area A is mostly located in the fourth area (i.e., the lower left area), and there are two adjacent sub-circuit boards. Among them, the gold finger area of ​​the sub-circuit board adjacent to the right of the first sub-circuit board is mostly located in the fourth area (i.e., the lower left area), and the gold finger area of ​​the sub-circuit board adjacent to the top of the first sub-circuit board is mostly located in the second area (i.e., the upper right area).

[0070] Figure 6 The fifth schematic diagram of the layout of the printed circuit board provided by the embodiment of the present invention. Figure 6 For example, assuming that the first sub-circuit board is the first sub-circuit board in the first row, most of its gold finger area A is located in the fourth area (i.e., the lower left area), and there are two adjacent sub-circuit boards. Among them, the gold finger area of ​​the sub-circuit board adjacent to the right of the first sub-circuit board is mostly located in the second area (i.e., the upper right area), and the gold finger area of ​​the sub-circuit board adjacent to the bottom of the first sub-circuit board is mostly located in the fourth area (i.e., the lower left area).

[0071] Figure 7 FIG7 is a schematic diagram of the layout of a printed circuit board provided in an embodiment of the present invention. Figure 7 For example, assuming that the first sub-circuit board is the first sub-circuit board in the first row, its gold finger area A is mostly located in the first area (i.e., the upper left area), and there are two adjacent sub-circuit boards. Among them, the gold finger area of ​​the sub-circuit board adjacent to the right of the first sub-circuit board is mostly located in the third area (i.e., the lower right area), and the gold finger area of ​​the sub-circuit board adjacent to the bottom of the first sub-circuit board is mostly located in the first area (i.e., the upper left area).

[0072] It should be added that, when more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the first area, and more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the second area, the first sub-circuit board and the second sub-circuit board can be arranged alternately, and the arrangement of the first circuit board and the second circuit board in each row is the same. Similarly, when more than half of the area of ​​the gold finger area A of the first sub-circuit board is located in the third area, and more than half of the area of ​​the gold finger area A of the second sub-circuit board is located in the fourth area, the first sub-circuit board and the second sub-circuit board can be arranged alternately, and the arrangement of the first circuit board and the second circuit board in each row is the same. The above method can also achieve that the gold finger areas A of two adjacent sub-circuit boards are not set adjacently, with regularity, avoid the adjacent open areas of the two sub-circuit boards, and reduce the generation rate of copper foil wrinkles.

[0073] Furthermore, in a specific implementation, in the above-mentioned printed circuit board provided in the embodiment of the present invention, each sub-circuit board may include a plurality of inner-layer boards stacked in layers; the copper-free areas of each two adjacent inner-layer boards are stacked staggered in the vertical direction. This can further reduce the mutual influence between the layers and the risk of copper foil wrinkles.

[0074] In practice, the present invention can first prepare materials, position multiple inner layer boards, and then stack them to obtain multiple inner layer boards stacked in layers. The inner layer boards of the present invention are provided with copper areas and copper-free areas. During the layout and assembly process, the copper-free areas of two inner layer boards can be stacked alternately. Figure 8 The schematic diagram corresponding to the lamination of the sub-circuit boards provided in the embodiment of the present invention is shown in FIG. Figure 8 As shown, the copper-free area B of the first inner layer board 1 and the copper-free area B of the second inner layer board are obviously staggered and stacked.

[0075] In a specific implementation, in the above-mentioned printed circuit board provided in an embodiment of the present invention, each sub-circuit board can be stacked in a rotating manner; in each sub-circuit board, the horizontal direction of the circuit board of the first inner layer board is 180 degrees from the horizontal direction of the circuit board of the second inner layer board located on the first inner layer board.

[0076] In practice, after stacking the first inner layer board 1, the present invention can stack the second inner layer board 2 by rotating the circuit board of the second inner layer board 2 180 degrees horizontally with the first inner layer board 1 as a reference.

[0077] In a specific implementation, in the above-mentioned printed circuit board provided by the embodiment of the present invention, a partition steel plate may be provided between the first inner layer board and the second inner layer board; the partition steel plate may be used to separate the resin flow between the first inner layer board and the second inner layer board.

[0078] In practice, the present invention can add steel plates that are not separated by kraft paper between the laminated layers as a separation layer. Fig. 9 The following is a schematic diagram corresponding to the lamination of printed circuit boards provided in an embodiment of the present invention. Fig. 9 As shown, a steel plate 3 without kraft paper separation is added between the laminated layers as a separation layer; the steel plate 3 is a whole sheet and exists on the entire circuit board 4. These steel plates 3 can not only separate the resin flow between different layers to prevent the occurrence of copper foil wrinkles, but also enhance the overall rigidity and stability of the laminated layers. This laminated method can significantly reduce the risk of copper foil wrinkles and improve the product yield.

[0079] Furthermore, in a specific implementation, in the above-mentioned printed circuit board provided in an embodiment of the present invention, the surface copper foil thickness of each sub-circuit board can range from 0.4 mil to 0.65 mil (i.e., 0.4~0.65 mil); the prepreg resin content of each sub-circuit board can be greater than 65%.

[0080] In practice, in addition to optimizing the layout method and the lamination stack, the present invention can further reduce the generation of copper foil wrinkles by adjusting the thickness of the surface copper foil and the RC% of the prepreg resin content. Specifically, by increasing the thickness of the outer copper foil and the resin content of the prepreg, the rigidity and deformation resistance of the copper foil are improved, thereby avoiding the depression and wrinkles of the copper foil during the lamination process.

[0081] In actual operation, the outer copper foil with a thickness greater than or equal to 1oZ (ounce) can be selected for lamination. At the same time, the numerical content RC% of the semi-cured sheet between the outer copper foil and the core board is adjusted to a level greater than 65% to ensure uniform flow and filling of the resin during lamination. After lamination, the thickness of the outer copper foil can be reduced to the thickness required for circuit etching capability through the copper reduction process, which can range from 0.4 mils to 0.65 mils (such as 0.5oZ) to facilitate subsequent outer layer circuit production and etching processes. Through this adjustment method, the rigidity and deformation resistance of the gold finger area can be significantly improved, thereby effectively reducing the generation of copper foil wrinkles.

[0082] That is to say, after the inner layer board is manufactured, the lamination process is performed. Compared with the traditional manufacturing process, the present invention uses the copper reduction process to reduce the thickness of the outer copper foil to the thickness required for the circuit etching capacity after the lamination is completed, and then drills and subsequent processes, which can significantly avoid the phenomenon of copper foil wrinkles. Among them, the copper reduction process can refer to the etching of the surface copper by chemical solutions, or the thinning of the copper foil by mechanical masking. The specific operation of the copper reduction process can be adjusted according to the actual situation and is not limited here.

[0083] In summary, the present invention can significantly reduce the copper wrinkle problem in the gold finger area of ​​the printed circuit board during the lamination process and improve the product's appearance quality and electrical connection performance by optimizing the typesetting method, improving the lamination lamination technology, and adjusting the surface copper foil thickness and the semi-cured sheet resin content RC% and other comprehensive applications. Among them, the optimized typesetting method and lamination process parameters make the production process smoother and more efficient, thereby improving production efficiency and yield; at the same time, it reduces rework and scrap caused by copper wrinkle problems and reduces production costs. By reducing the occurrence of copper wrinkle problems, the stability and reliability of the equipment are also enhanced, and production interruptions and defective products caused by equipment failures are reduced, which is of great significance for improving the overall efficiency of the production line and product quality.

[0084] In the above embodiments, the printed circuit board is described in detail. Based on the same inventive concept, the embodiments of the present invention also provide a method for manufacturing a printed circuit board and corresponding embodiments of an electronic device.

[0085] The method for manufacturing a printed circuit board provided in this embodiment includes at least two sub-circuit boards arranged in a matrix. The method for manufacturing the printed circuit board may include:

[0086] A corresponding gold finger area is formed at a position where one of the top corners of each sub-circuit board is located;

[0087] At the same time, the gold finger areas are formed in two adjacent sub-circuit boards in a non-adjacent arrangement and / or staggered arrangement manner.

[0088] In the above-mentioned method for manufacturing a printed circuit board provided in an embodiment of the present invention, the layout of the sub-circuit boards in the printed circuit board can be optimized by executing the above-mentioned steps, a corresponding gold finger area is set at the position of one of the vertex corners of each sub-circuit board, and the gold finger areas between two adjacent sub-circuit boards are staggered and / or not set adjacently to avoid the adjacency of empty areas of multiple sub-circuit boards, ensuring that the resin can flow evenly and fill each area during pressing, thereby effectively reducing the copper wrinkle phenomenon in the gold finger area of ​​the printed circuit board during the pressing process, improving the overall electrical connection performance and reliability of the product, increasing production efficiency and yield, and at the same time reducing rework and scrap caused by copper wrinkle problems, saving production costs, and having broad application prospects and market value in the field of circuit board manufacturing.

[0089] Since the embodiments of the manufacturing method part correspond to the embodiments of the printed circuit board part, the embodiments of the manufacturing method part refer to the description of the embodiments of the printed circuit board part, which will not be repeated here. And it has the same beneficial effects as the printed circuit board mentioned above.

[0090] Furthermore, in the specific implementation, in the method for manufacturing the printed circuit board provided in the embodiment of the present invention, the gold finger areas can be arranged in a staggered manner in two adjacent sub-circuit boards. Taking the printed circuit board including four sub-circuit boards as an example, the gold finger areas A of two adjacent sub-circuit boards in the first row can be arranged in a staggered manner, and the arrangement of the sub-circuit boards in the second row can be the same as that in the first row. This layout helps the resin to flow evenly during the lamination process, reduces the risk of copper foil wrinkles, and simplifies the manufacturing process in a regular manner.

[0091] Furthermore, in a specific implementation, the method for manufacturing the printed circuit board provided in the embodiment of the present invention may further include:

[0092] In each sub-circuit board, the boards are stacked in a rotating manner. After the first inner layer board is stacked, when the second inner layer board is stacked on the first inner layer board, the circuit board of the second inner layer board is rotated 180 degrees in the horizontal direction for stacking.

[0093] In practice, the present invention can prepare materials and position multiple inner layer boards before stacking the boards; then stack the boards to obtain multiple inner layer boards stacked in layers. Copper areas and copper-free areas are set on the inner layer boards of the present invention. During the layout and combination process, the copper-free areas of the two inner layer boards can be staggered and stacked. Specifically, after the first inner layer board is stacked, when the second inner layer board is stacked, the circuit board of the second inner layer board can be rotated 180 degrees in the horizontal direction to stack the boards with the first inner layer board as a reference.

[0094] In addition, it should be noted that after stacking the first inner layer board and before stacking the second inner layer board on the first inner layer board, a partition steel plate that is not isolated by kraft paper can be added as a partition layer. The present invention can use the partition steel plate to separate the resin flow between the first inner layer board and the second inner layer board, prevent the generation of copper foil wrinkles, and enhance the overall rigidity and stability of the stack, thereby improving the product yield. The partition steel plate is a whole sheet and exists on the entire circuit board.

[0095] Furthermore, in a specific implementation, the method for manufacturing the printed circuit board provided in the embodiment of the present invention may further include:

[0096] After the lamination is completed, a pressing process is performed, and after the pressing process, the thickness of the outer copper foil is thinned through a copper reduction process.

[0097] In practice, during the lamination process, the copper foil with an outer copper foil thickness greater than or equal to 1oZ can be selected for lamination. At the same time, the numerical content RC% of the semi-cured sheet between the outer copper foil and the core board is adjusted to a level greater than 65% to ensure uniform flow and filling of the resin during the lamination process. After the lamination process, the thickness of the outer copper foil can be reduced to the thickness required for the circuit etching capability through the copper reduction process, which can range from 0.4 mils to 0.65 mils. Then the outer circuit is made and the etching process is carried out. In this way, the thickness of the outer copper foil and the resin content of the semi-cured sheet are increased to improve the rigidity and deformation resistance of the copper foil, which can avoid the dents and wrinkles of the copper foil during the lamination process.

[0098] For more specific working processes of the above steps, please refer to the corresponding contents disclosed in the above embodiments, which will not be repeated here.

[0099] Based on the same inventive concept, an embodiment of the present invention further provides an electronic device, including the above-mentioned printed circuit board. Since the principle of solving the problem by the electronic device is similar to that of the above-mentioned printed circuit board, the implementation of the electronic device can refer to the implementation of the printed circuit board, and the repeated parts will not be repeated.

[0100] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0101] Finally, it should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "include", "comprise" and "have" and any other variations thereof in the present application are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the elements. In the present application, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0102] For the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the present invention is not limited by the order of the actions described, because according to the present invention, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0103] Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the embodiments of the present invention according to the circumstances without conflict and without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also belong to the scope of protection of the present invention.

[0104] The printed circuit board and its manufacturing method and electronic device provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention, but not to limit the protection scope of the invention; at the same time, for ordinary technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A printed circuit board, characterized in that: include: At least two sub-circuit boards arranged in a matrix; Wherein, a corresponding gold finger area is arranged at the position of one of the vertex corners of each sub-circuit board; The gold finger areas of two adjacent sub-circuit boards are arranged non-adjacently and / or staggered.

2. The printed circuit board according to claim 1, characterized in that: The gold finger areas of two adjacent sub-circuit boards are arranged in a staggered manner.

3. The printed circuit board according to claim 1, characterized in that: Each of the sub-circuit boards comprises a plurality of inner-layer boards stacked in layers; The copper-free areas of every two adjacent inner-layer boards are stacked and staggered with each other in the vertical direction.

4. The printed circuit board according to claim 3, characterized in that: Each of the sub-circuit boards is stacked in a rotating manner; In each of the sub-circuit boards, a horizontal direction of the circuit board of the first inner layer board and a horizontal direction of the circuit board of the second inner layer board located on the first inner layer board are 180 degrees apart.

5. The printed circuit board according to claim 4, characterized in that: A partition steel plate is provided between the first inner plate and the second inner plate; The partition steel plate is used to separate the resin flow between the first inner layer plate and the second inner layer plate.

6. The printed circuit board according to claim 1, characterized in that: The thickness of the surface copper foil of each sub-circuit board is in the range of 0.4 mil to 0.65 mil; The prepreg resin content of each of the sub-circuit boards is greater than 65%.

7. The printed circuit board according to claim 1, characterized in that: In each of the sub-circuit boards, the sub-circuit board is divided into a first area, a second area, a third area and a fourth area in a clockwise direction according to four vertices of the sub-circuit board; The two adjacent sub-circuit boards are respectively a first sub-circuit board and a second sub-circuit board; When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the first area, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the first area or the third area; When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the second region, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the second region or the fourth region; When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the third area, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the third area or the first area; When more than half of the area of ​​the gold finger region of the first sub-circuit board is located in the fourth region, more than half of the area of ​​the gold finger region of the second sub-circuit board is located in the fourth region or the second region; The gold finger areas of other sub-circuit boards adjacent to each of the sub-circuit boards are distributed in the same manner or in a staggered manner.

8. A method for manufacturing a printed circuit board, characterized in that: The printed circuit board includes at least two sub-circuit boards arranged in a matrix, and the manufacturing method includes: A corresponding gold finger area is formed at a position where one of the vertex corners of each of the sub-circuit boards is located; At the same time, the gold finger areas are formed in two adjacent sub-circuit boards in a non-adjacent arrangement and / or staggered arrangement manner.

9. The manufacturing method according to claim 8, characterized in that: Also includes: In each of the sub-circuit boards, the boards are stacked in a rotating manner. After the first inner layer board is stacked, when the second inner layer board is stacked on the first inner layer board, the circuit board of the second inner layer board is rotated 180 degrees in the horizontal direction for stacking. After the lamination is completed, a pressing process is performed, and after the pressing process, the thickness of the outer copper foil is thinned through a copper reduction process.

10. An electronic device, characterized in that: Comprising a printed circuit board as claimed in any one of claims 1 to 7.

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