PCB positioning device and solder paste printing equipment

Abstract

The invention discloses a PCB positioning device and solder paste printing equipment, and relates to the technical field of circuit board production, and the PCB positioning device comprises a first lifting mechanism, a second lifting mechanism and a positioning clamp. Wherein the first lifting mechanism can do lifting motion relative to the base table, the second lifting mechanism is located above the first lifting mechanism and can do lifting motion relative to the first lifting mechanism, the upper portion of the second lifting mechanism is further provided with a carrying table used for carrying a PCB, and the positioning clamp is located above the second lifting mechanism. The positioning clamp forms a clamping space for the PCB, and the object placing table can be driven by the second lifting mechanism to move in the direction close to or away from the clamping space. The two lifting mechanisms lift the PCB to the highest position of the clamping position of the positioning clamp and the height of the printing position, it is guaranteed that the upper surface of the positioning clamp and the printing face of the PCB can make full contact with the lower surface of the steel mesh, it is guaranteed that printing content cannot be lost, the good printing quality is guaranteed, and the final process effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a PCB board positioning device and solder paste printing equipment. Background Art

[0002] The solder paste printer is the front-end equipment of the SMT (surface mount technology) whole-line equipment. The equipment is used to print solder paste evenly onto the corresponding pads of the PCB (printed circuit board), providing precise solder paste coating for subsequent patch and reflow processes, ensuring that electronic components can be accurately and firmly soldered on the PCB. During this process, the PCB is supported on the solder paste printer by a positioning fixture to prevent the PCB from moving or deforming during processing.

[0003] However, due to the certain deviation in the initial clamping position between each PCB board and the positioning fixture, as well as the certain dimensional errors between the PCB boards, the relative positions between the PCB board and the positioning fixture and between the PCB board and the printed steel mesh are difficult to maintain consistency. The PCB board may also have certain warping and deformation problems due to the excessive clamping force applied by the positioning fixture, resulting in the PCB board being unable to form a good surface contact relationship with the printed steel mesh, thereby affecting the final solder paste printing effect, resulting in uneven printing, missing printing, and poor precision, making it difficult to meet the current processing needs for high-end products. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a PCB board positioning device and solder paste printing equipment, which can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions: In a first aspect, a PCB board positioning device is provided, comprising: A first lifting mechanism, disposed on a base of the PCB board positioning device, the first lifting mechanism being capable of lifting and lowering relative to the base along a Z-axis direction; and A second lifting mechanism is provided on the first lifting mechanism and is located above the first lifting mechanism. The second lifting mechanism can move up and down relative to the first lifting mechanism along the Z-axis direction. A storage platform for placing the PCB board is also provided on the upper part of the second lifting mechanism. The positioning fixture is located above the second lifting mechanism, and the positioning fixture forms a clamping space for the PCB board. The storage platform can move towards and away from the clamping space under the drive of the second lifting mechanism.

[0006] As an optional implementation, the first lifting mechanism includes: A supporting base plate, movably disposed on the base; A first screw pair is arranged between the base and the supporting base plate, so that the supporting base plate is transmission-connected to the base through the first screw pair; The first driving mechanism has a first fixed end and a first driving end, wherein the first fixed end is mounted on the supporting base plate or the base, and the first driving mechanism is coupled with the first lead screw pair through the first driving end.

[0007] As an optional implementation, the first screw pair includes: A first lead screw, wherein the first lead screw is provided in a plurality, and the plurality of the first lead screws are evenly distributed in the edge area of ​​the support base plate, at least one of the first lead screws is drivingly engaged with the first driving end, and each of the first lead screws is synchronously rotatably provided between the support base plate and the base; first nuts, the number of which is consistent with the number of the first lead screws, and each of the first nuts is respectively drivingly matched with each of the first lead screws; Each of the first nuts is fixedly connected to the support base, and the first lead screw is axially fixed to the base; or each of the first nuts is fixedly connected to the base, and the first lead screw is axially fixed to the support base.

[0008] As an optional implementation, the second lifting mechanism includes: A supporting top plate, movably disposed above the first lifting mechanism; A second screw pair is arranged between the first lifting mechanism and the supporting top plate, so that the supporting top plate is transmission-connected to the first lifting mechanism through the second screw pair; The second driving mechanism has a second fixed end and a second driving end, the second fixed end is mounted on the first lifting mechanism or the supporting top plate, and the second driving mechanism is coupled with the second lead screw pair through the second driving end.

[0009] As an optional implementation, the second screw pair includes: A second lead screw, wherein the second lead screw is provided in a plurality, and the plurality of second lead screws are evenly distributed in the edge area of ​​the support top plate, at least one second lead screw is drivingly engaged with the second driving end, and each second lead screw is synchronously rotatably provided between the support top plate and the first lifting mechanism; second nuts, the number of which is consistent with the number of the second lead screws, and each of the second nuts is respectively drivingly matched with each of the second lead screws; Each of the second nuts is fixedly connected to the support top plate, and the second lead screw is axially fixed to the first lifting mechanism; or each of the second nuts is fixedly connected to the first lifting mechanism, and the second lead screw is axially fixed to the support top plate.

[0010] As an optional embodiment, a guide rod is further provided between the base, the first lifting mechanism and the second lifting mechanism, one of the base, the first lifting mechanism and the second lifting mechanism is axially fixedly connected to the guide rod, and the other two are movably connected to the guide rod.

[0011] As an optional embodiment, the positioning fixture includes: A fixed carrier plate, fixedly disposed on the first lifting mechanism; and A movable carrier plate is movably arranged on the first lifting mechanism, the inner side surfaces of the movable carrier plate and the fixed carrier plate are arranged opposite to each other and spaced apart to form the clamping space therebetween, and the movable carrier plate can reciprocate in a direction approaching and moving away from the fixed carrier plate to adjust the size of the clamping space; A pressing plate mechanism is movably arranged on the fixed carrier plate and / or the movable carrier plate, and the pressing plate mechanism has a pressing plate position and a releasing position; when the pressing plate mechanism is in the pressing plate position, the pressing plate mechanism at least partially protrudes from the inner side surface of the fixed carrier plate and / or the movable carrier plate; when the pressing plate mechanism is in the releasing position, the pressing plate mechanism is retracted into the inner side surface of the fixed carrier plate and / or the movable carrier plate; A plurality of adsorption structures are evenly distributed on the upper surfaces of the fixed carrier plate and the movable carrier plate.

[0012] As an optional implementation, the base station includes: X-axis adjustment mechanism; A Y-axis adjustment mechanism is arranged on the X-axis adjustment mechanism so as to reciprocate along the X-axis direction; The T-axis adjustment mechanism is disposed on the Y-axis adjustment mechanism so as to be reciprocatingly movable along the Y-axis direction, and the first lifting mechanism is disposed on the T-axis adjustment mechanism so as to be rotatable around the Z-axis.

[0013] As an optional implementation, the T-axis adjustment mechanism includes: An adjustment base, rotatably arranged on the Y-axis adjustment mechanism around a Z-axis rotation axis; The third driving mechanism has a third fixed end and a third driving end. The third driving end can make a linear motion relative to the third fixed end. The third fixed end is installed on the Y-axis adjustment mechanism. The third driving end is connected to the adjustment base through a movable component, so that the third driving end can drive the adjustment base to rotate forward or reverse through the movable component when reciprocating in a linear direction.

[0014] In a second aspect, a solder paste printing device is provided, comprising: The PCB board positioning device as described in the first aspect; An image acquisition unit, disposed above the clamping space, for acquiring image data of the PCB board and the positioning fixture located in the clamping space; The distance meter is arranged above the clamping space and is used to obtain the distance data between the distance meter and the PCB board located in the clamping space.

[0015] The beneficial effects of the present invention are as follows: the PCB board can enter the clamping space formed by the positioning fixture under the action of the second lifting mechanism, so that the PCB board can be adjusted to a clamping position that meets the subsequent solder paste printing requirements before being attached to the printing steel mesh, thereby improving the positioning accuracy of the PCB board, reducing the warping deformation of the PCB board and the situation that the PCB board cannot form a surface contact relationship with the printing steel mesh due to the step difference between the PCB board and the positioning fixture, thereby improving the final process effect; On the basis of achieving precise positioning with the positioning fixture through the second lifting mechanism, the PCB board can further move up and down under the action of the first lifting mechanism, so that the product printing surface of the PCB board forms a surface contact relationship with the lower surface of the printing steel mesh, eliminating the gap between the product printing surface and the steel mesh, ensuring that the printed content (solder paste) will not be lost and good printing quality; The first lifting mechanism and the second lifting mechanism can also make adaptive adjustments to the clamping position of the PCB board on the positioning fixture and the relative position of the PCB board and the printing steel mesh according to different PCB board sizes and types, avoiding the need for re-debugging due to changing the PCB board type, reducing the operating difficulty of the solder paste printing equipment, and improving the operating efficiency of the PCB board solder paste printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0017] Figure 1 This is one of the structural schematic diagrams of the solder paste printing equipment according to an embodiment of the present invention; Figure 2 This is the second structural schematic diagram of the solder paste printing equipment according to the embodiment of the present invention; Figure 3This is one of the exploded views of the solder paste printing equipment described in the embodiment of the present invention; Figure 4 This is the second exploded view of the solder paste printing equipment according to the embodiment of the present invention; Figure 5 This is a schematic diagram of the cooperation between the base and the adjustment base according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the cooperation between the base and the first screw pair according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the cooperation between the base and the first lifting mechanism according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the cooperation between the base, the first lifting mechanism, and the second screw pair according to an embodiment of the present invention; Fig. 9 It is a schematic diagram of the coordination of the base, the first lifting mechanism and the second lifting mechanism according to an embodiment of the present invention.

[0018] In the figure: 10, first lifting mechanism; 11, supporting bottom plate; 111, supporting plate; 12, first screw pair; 121, first screw; 13, first driving mechanism; 131, first fixed end; 132, first driving end; 20, second lifting mechanism; 21, supporting top plate; 22, second screw pair; 221, second screw; 23, second driving mechanism; 231, second fixed end; 232, second driving end; 30, storage table; 40, positioning fixture; 41, fixed carrier plate; 42, movable carrier plate; 43, pressing plate mechanism; 44, adsorption structure; 45, gantry support frame; 46, spacing adjustment structure; 47 , spacing adjustment motor; 48, adjustment screw; 50, base; 51, X-axis adjustment mechanism; 511, X-axis bottom plate; 512, X-axis screw pair; 513, X-axis guide rail; 52, Y-axis adjustment mechanism; 521, Y-axis bottom plate; 522, Y-axis top plate; 5221, frustum structure; 523, Y-axis screw pair; 524, Y-axis guide rail; 53, T-axis adjustment mechanism; 531, adjustment base; 5311, rotating slot; 532, third driving mechanism; 5321, third fixed end; 5322, third driving end; 533, movable component; 60, guide rod; 70, image acquisition unit; 80, rangefinder. DETAILED DESCRIPTION

[0019] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention are further described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0022] The solder paste printer is the front-end equipment of the SMT (surface mount technology) whole-line equipment and one of the mainstream equipment in the SMT industry. The equipment is used to print solder paste or red glue evenly onto the corresponding pads of the PCB board (printed circuit board), providing precise solder paste coating for subsequent patch and reflow soldering processes, ensuring that electronic components can be accurately and firmly soldered on the PCB board.

[0023] Specifically, the PCB board to be printed is transported by the CV conveyor line (Conveyor Line) to the printing positioning table, and is fixed to the solder paste printer with the help of corresponding clamps. Then the scraper of the printer prints the solder paste or red glue through the printing steel mesh and prints it on the corresponding pads of the PCB board.

[0024] However, as can be seen from the background technology, since there is a certain deviation in the initial clamping position between each PCB board and the positioning fixture, the clamping position of the positioning fixture is different each time when clamping the PCB board to be printed, which makes it difficult to keep the relative position between the PCB board and the printing steel mesh consistent, affecting the accuracy of solder paste printing. In addition, since there will be a certain size error between PCB boards, the clamping force generated by the positioning fixture on the PCB board when clamping different PCB boards will also be different. The PCB board will be warped and deformed due to the excessive clamping force applied by the positioning fixture. If the clamping force is too small, the PCB board will be offset during the printing process, resulting in the inability to accurately align the PCB board with the printing steel mesh, thereby affecting the final solder paste printing effect, and causing problems such as uneven printing and missing printing, which is difficult to meet the current processing needs for high-end products.

[0025] In view of this, the present embodiment provides a PCB board positioning device, which adopts a double-stage lifting mechanism so that the relative position of the PCB board and the positioning fixture and the relative position of the PCB board and the printing steel mesh can be adjusted separately, thereby solving the problem of low quality of PCB board solder paste printing.

[0026] Please refer to the instruction manual Figure 1-Figure 4 , Figure 6-Figure 9 The PCB board positioning device includes a first lifting mechanism 10 and a second lifting mechanism 20. The first lifting mechanism 10 is arranged on a base 50 of the PCB board positioning device, and the base 50 can be understood as a supporting base of the PCB board positioning device to stably support the PCB board positioning device on the solder paste printing device. In different embodiments, the base 50 and the first lifting mechanism 10 can be set to be relatively fixed in all directions except the Z axis, or the first lifting mechanism 10 can be set to have a freedom of movement in the Z axis, and the base 50 can also drive the first lifting mechanism 10 to move in other directions.

[0027] In this embodiment, the first lifting mechanism 10 is configured to be able to perform lifting motion along the Z-axis direction relative to the base 50. The first lifting mechanism 10 is the basic lifting part of the PCB board positioning device, which is used to provide the positioning device as a whole with a lifting function in the Z-axis direction. In the actual application scenario of the solder paste printing device, the first lifting mechanism 10 can lift the PCB board or its supporting platform placed on the PCB board positioning device to a certain height, so that the printing surface formed on the upper surface of the PCB board can fit with the lower surface of the printing steel mesh, which is convenient for the subsequent tin brushing operation.

[0028] On the basis of the above, the second lifting mechanism 20 is arranged on the first lifting mechanism 10 and is located above the first lifting mechanism 10, that is, the second lifting mechanism 20 is located on the side of the first lifting mechanism 10 away from the base 50 along the Z-axis direction. In this embodiment, a placement table 30 for placing PCB boards is arranged on the upper part of the second lifting mechanism 20. The placement table 30 can be provided with a corresponding placement surface according to the actual structure type of the PCB board to be placed, so as to ensure that the PCB board can be stably placed on the placement table in the initial state. Since the second lifting mechanism 20 is arranged on the first lifting mechanism 10, the second lifting mechanism 20 can be lifted and lowered along with the lifting and lowering of the first lifting mechanism 10 in the Z-axis direction, so that the first lifting mechanism 10 can drive the PCB board to move between the printing position (attached to the printing steel mesh) and the standby position (away from the printing steel mesh) by driving the second lifting mechanism 20 to lift and lower.

[0029] Furthermore, the second lifting mechanism 20 on the first lifting mechanism 10 can make an independent lifting movement along the Z-axis direction relative to the first lifting mechanism 10, thereby driving the storage table 30 to be lifted and lowered. In this way, the storage table 30 has two levels of lifting freedom on the PCB board positioning device, so that when a PCB board is placed on the storage table 30, the PCB board has a higher degree of adjustment freedom, allowing the PCB board positioning device to meet different positioning operation requirements.

[0030] In addition, please refer to the instructions attached Figure 1-Figure 4 The PCB board positioning device is provided with a first lifting mechanism 10 and a second lifting mechanism 20, and also includes a positioning fixture 40. The main function of the positioning fixture 40 in the positioning device is to clamp and fix the PCB board on the second lifting mechanism 20, so that it remains stable during the printing process, and the PCB board is accurately aligned with the printing steel mesh to prevent poor printing caused by movement or deformation. Since the PCB board on the storage table 30 needs to be clamped and fixed, the positioning fixture 40 in this embodiment is located above the second lifting mechanism 20, and the positioning fixture 40 forms a clamping space for the PCB board. In actual application scenarios, the positioning fixture 40 can adjust the size of the clamping space according to whether it needs to clamp the PCB board, and the size type of the PCB board, and the positioning fixture 40 will not rise and fall with the lifting of the second lifting mechanism 20, so as to ensure that the storage table 30 can move in the direction of approaching and moving away from the clamping space along the Z-axis direction when the second lifting mechanism 20 drives the storage table 30 to move up and down.

[0031] The following briefly describes the operation process of the PCB board positioning device in the solder paste printing equipment according to the above implementation mode: S10, the PCB board is transported from the previous equipment station to the placement table 30 by the conveying mechanism (the CV conveying line as described above), and is placed on the placement table 30. At this time, the PCB board is at a position away from the clamping space and the printed steel mesh to be attached; S20, the second lifting mechanism 20 drives the storage platform 30 to lift, so that the PCB board moves toward the clamping space, and stops lifting when the PCB board moves to a position where it can be accurately clamped by the positioning fixture 40, and applies a clamping force to the PCB board through the positioning fixture 40, so that the PCB board can be stably clamped and fixed on the storage platform 30 by the positioning fixture 40; S30, the first lifting mechanism 10 drives the second lifting mechanism 20 to lift, and the positioning fixture 40 also moves synchronously with the second lifting mechanism 20 (this can be achieved by setting the positioning fixture 40 on the first lifting mechanism 10), so that the PCB board moves from the standby position to the printing position under the constraints of the storage table 30 and the positioning fixture 40, and fits with the corresponding printing steel mesh; S40. Finally, the solder paste printing equipment uses a scraper to print the solder paste or red glue through the printing steel screen onto the corresponding pads of the PCB board.

[0032] According to the operation process provided above, it can be understood that the PCB board positioning device can respectively realize the precise alignment between the PCB board and the positioning fixture 40 and the printing steel mesh through the first lifting mechanism 10 and the second lifting mechanism 20, so as to complete the clamping and lifting of the fixture to the printing position in the printing preparation work. The clamping force applied by the positioning fixture 40 to the PCB board and the height of the second lifting mechanism 20 to lift the storage table 30 can be determined according to the actual situation of the PCB board to be printed, so that the clamping position and clamping force of the PCB board on the positioning fixture 40 are determined before the PCB board and the printing steel mesh are bonded, avoiding the gap problem generated during the bonding process. The first lifting mechanism 10 and the second lifting mechanism 20 can also make adaptive adjustments to the clamping position of the PCB board on the positioning fixture 40 and the relative position of the PCB board and the printing steel mesh according to different PCB board sizes and types, avoiding the situation where the PCB board type needs to be re-debugged, reducing the difficulty of operating the solder paste printing equipment, and improving the operating efficiency of the PCB board solder paste printing. That is to say, in actual application scenarios, the lifting of the two Z-axis sections will lift the PCB board to the highest point of the clamping position of the positioning fixture 40 and the height of the printing position respectively, eliminating the step difference between the PCB board and the positioning fixture 40, ensuring that the upper surface of the positioning fixture 40 together with the printing surface of the PCB board can be in complete contact with the lower surface of the steel mesh, thereby eliminating the gap between the printing surface of the product and the steel mesh, ensuring that the printed content will not be lost and the printing quality is good, thereby achieving an improvement in the final process effect.

[0033] Based on the above embodiment, this embodiment further provides at least one specific structural form of the first lifting mechanism 10 and the second lifting mechanism 20 .

[0034] Please refer to the instruction manual Figure 1-Figure 4 , Figure 6-Figure 7The first lifting mechanism 10 includes a supporting base plate 11, a first screw pair 12 and a first driving mechanism 13. The supporting base plate 11 serves as a supporting base for the first lifting mechanism 10 on the base 50, and is preferably made of a material with high rigidity (such as metal or alloy) to ensure its stability and durability. The supporting base plate 11 provides a sufficient plane area for installing and supporting the first screw pair 12 and the second lifting mechanism 20. The first screw pair 12 is arranged between the base 50 and the supporting base plate 11, and the supporting base plate 11 is connected to the base 50 through the first screw pair 12. The first driving mechanism 13 has a first fixed end 131 and a first driving end 132, and the first driving end 132 can move relative to the first fixed end 131. The first fixed end 131 is installed on the supporting base plate 11 or the base 50, and the first driving mechanism 13 is connected to the first screw pair 12 through the first driving end 132.

[0035] When the first lifting mechanism 10 needs to perform lifting movement, the first driving mechanism 13 (such as a motor or other driving device) is started, based on the support base plate 11 or the base 50, so that the first driving end 132 moves relative to the first fixed end 131 (support base plate 11 or base 50), thereby driving the first screw pair 12 to move, thereby pushing the support base plate 11 to rise or fall along the axis direction of the first screw pair 12. It can be understood that the first lifting mechanism 10 uses the first screw pair 12 as a transmission mechanism to drive the support base plate 11, especially a ball screw pair, which can make the relative movement of the support base plate 11 and the base 50 have a high transmission efficiency. At the same time, the screw pair also has excellent positioning accuracy and self-locking characteristics, so that the support base plate 11 can accurately drive the PCB board to stably fit to the lower surface of the printing steel mesh, and can remain stable without the action of the first driving mechanism 13 in different position states, and no additional self-locking device is required, thereby ensuring the operation accuracy during solder paste printing.

[0036] In addition, since the adjustment range of the screw pair depends on the length of its screw and the stroke of the nut, the first screw pair 12 also has excellent adjustable performance. In the process of driving different types of PCB boards, the PCB board positioning device can drive the support base plate 11 to rise and fall to the corresponding position through the first screw pair 12 according to actual conditions, so that the first lifting mechanism 10 can adapt to PCB boards of different sizes and shapes to meet different processing requirements.

[0037] In order to further improve the transmission stability between the supporting base plate 11 and the base 50, the first screw pair 12 of this embodiment is specifically implemented by the following scheme, please continue to refer to the attached Figure 3-Figure 7 , the first screw pair 12 comprises: The first lead screw 121 is provided in a plurality of pieces, and the plurality of first lead screws 121 are evenly distributed in the edge area of ​​the support base plate 11. The edge area of ​​the support base plate 11 refers to the peripheral area of ​​the PCB board. Evenly distributing each first lead screw 121 in the edge area of ​​the support base plate 11 can more effectively support and fix the support base plate 11 on the base 50, and reduce the shaking or offset phenomenon generated by the support base plate 11 during the lifting and lowering movement of the first lead screw pair 12 relative to the base 50. In addition, this layout method helps to disperse the force points of the first lead screw pair 12 on the support base plate 11, and each first lead screw 121 transmits power to the support base plate 11 more evenly, reducing the error caused by uneven force, making it more uniform and stable, thereby improving the structural stability of the entire system.

[0038] At least one of the multiple first lead screws 121 is drivingly connected to the first driving end 132, and each first lead screw 121 is synchronously rotatably arranged between the support base plate 11 and the base 50, so that the first lead screw 121 can achieve synchronous rotation under the drive of the first driving mechanism 13. Specifically, the definition of multiple first lead screws 121 being synchronously connected can be understood as that when at least one of the multiple first lead screws 121 is driven by the first driving mechanism 13, the multiple first lead screws 121 move in a coordinated manner according to a predetermined synchronous ratio or at the same speed and position, so that each first lead screw 121 can simultaneously play a corresponding function and role between the base 50 and the support base plate 11, driving the support base plate 11 to be stably lifted and lowered.

[0039] The first lead screws 121 may be connected to each other by transmission components such as synchronous belts, chains, gears, etc., but are not limited to these, and the present embodiment does not impose strict limitations or requirements on this.

[0040] Exemplarily, in this embodiment, four first lead screws 121 are provided, and the four first lead screws 121 are respectively provided at the four corners of the support base plate 11, and the four first lead screws 121 are rotated synchronously and in the same direction by means of a synchronous belt. According to the embodiment in which the first fixed end 131 can be provided on the support base plate 11 or the base 50, taking the first drive mechanism 13 using a motor as an example, the first fixed end 131 is defined as the stator (housing) of the motor, and the first drive end 132 is defined as the output shaft of the motor. The motor can be installed on the supporting base plate 11 or the base 50 through its stator, and the first lead screw 121 can be driven by being coaxially connected to the at least one first lead screw 121 through its output shaft, or by being connected to the first lead screw 121 through a transmission component such as a synchronous belt, a chain, or a gear. In this example, a support plate 111 protruding from the base 50 is extended outward from one side of the supporting base plate 11, and the first drive mechanism 13 is installed on the support plate 111 through its first fixed end 131, and its first drive end 132 is connected to one of the first lead screws 121 through a synchronous belt to save the space occupied by the PCB board positioning device in the height direction and improve the structural compactness of the device.

[0041] When the first screw pair 12 includes multiple first screws 121, the first screw pair 12 should also include first nuts (not shown) whose number is the same as the first screws 121. Each first screw 121 is provided with a first nut that cooperates with it in transmission, so that the first nut can make axial movement relative to the first screw 121 when the first screw 121 rotates.

[0042] Hereinafter, this embodiment provides two ways of disposing the first nut in the first screw pair 12 according to the above: 1. Each first nut is fixedly connected to the support base plate 11, and the first lead screw 121 is axially fixed to the base 50. In this embodiment, when the first lead screw 121 is driven by the first driving mechanism 13, a transmission relationship will occur between the first lead screw 121 and the first nut. Since the first lead screw 121 is rotatably axially fixed to the base 50, the first nut will move along the rotation axis direction of the first lead screw 121, thereby driving the support base plate 11 to move up and down in the axial direction of the first lead screw 121.

[0043] Second, each first nut is fixedly connected to the base 50, and the first lead screw 121 is axially fixed to the support base plate 11. In this embodiment, when the first lead screw 121 is driven by the first driving mechanism 13, since the first nut is fixed on the base 50, the first lead screw 121 will move up and down along the axial direction of the first nut, thereby driving the support base plate 11 to move up and down through the movement of the first lead screw 121 relative to the first nut.

[0044] Please continue to refer to the attached Figure 3-Figure 9The technical solution adopted by the second lifting mechanism 20 can refer to the structural form provided by the first lifting mechanism 10, which specifically includes a support top plate 21, a second screw pair 22 and a second mechanism. Among them, the support top plate 21 serves as the support base of the second lifting mechanism 20 on the first lifting mechanism 10, and it provides a sufficient plane area so that the storage table 30 can be stably set on the support top plate 21. The support top plate 21 can be movably arranged above the first lifting mechanism 10, so that it can drive the storage table 30 to rise and fall by making a lifting movement relative to the first lifting mechanism 10. In the embodiment in which the first lifting mechanism 10 includes a support bottom plate 11, a first screw pair 12 and a first driving mechanism 13, the support top plate 21 can be movably arranged above the support bottom plate 11. The second screw pair 22 is arranged between the first lifting mechanism 10 and the support top plate 21, so that the support top plate 21 is connected to the first lifting mechanism 10 through the second screw pair 22. The second driving mechanism 23 has a second fixed end 231 and a second driving end 232 . The second fixed end 231 is mounted on the first lifting mechanism 10 or the supporting top plate 21 . The second driving mechanism 23 is drivingly connected and matched with the second screw pair 22 via the second driving end 232 .

[0045] It can be understood that the structure of the second lifting platform on the first lifting platform is similar to the structure of the first lifting platform on the base 50, and both drive the support top plate 21 through a screw pair to ensure that the second lifting mechanism 20 can achieve precise alignment of the PCB board and the positioning fixture 40 when driving the storage table 30 to rise and fall.

[0046] Similar to the first screw pair 12, please continue to refer to the attached Figure 8-Figure 9 , the second screw pair 22 comprises: The second lead screw 221 is provided with a plurality of second lead screws 221, and the plurality of second lead screws 221 are evenly distributed in the edge area of ​​the support top plate 21, and at least one second lead screw 221 is drivingly connected and cooperated with the second driving end 232, and each second lead screw 221 can be synchronously rotatably provided between the support top plate 21 and the first lifting mechanism 10.

[0047] The number of second nuts (not shown) corresponding to the second lead screws 221 is such that each second lead screw 221 is provided with a second nut for transmission cooperation therewith, so that each second nut can make relative axial movement with the second lead screw 221 when the corresponding second lead screw 221 rotates.

[0048] Exemplarily, in this embodiment, four second lead screws 221 are provided, and the four second lead screws 221 are respectively provided at the four corners of the support top plate 21, and the four second lead screws 221 are rotated synchronously and in the same direction by means of a synchronous belt. According to the embodiment in which the second fixed end 231 can be provided on the first lifting mechanism 10 (support bottom plate 11) or the support top plate 21, taking the second drive mechanism 23 using a motor as an example, the second fixed end 231 is defined as the stator (housing) of the motor, and the second drive end 232 is defined as the output shaft of the motor. The motor can be installed on the supporting base plate 11 or the supporting top plate 21 through its stator, and the second lead screw 221 can be driven by being coaxially connected to the at least one second lead screw 221 through its output shaft, or by being connected to the second lead screw 221 through a transmission component such as a synchronous belt, a chain, or a gear. In this example, a support plate 111 protruding from the base 50 extends outward from one side of the supporting base plate 11, and the second drive mechanism 23 is installed on the support plate 111 through its second fixed end 231, and its second drive end 232 is connected to one of the second lead screws 221 through a synchronous belt to save the space occupied by the PCB board positioning device in the height direction and improve the structural compactness of the device.

[0049] It can be seen from the above content that in this embodiment, the first driving mechanism 13 and the second driving mechanism 23 can both be set on the supporting base plate 11. Therefore, the first driving mechanism 13 and the second driving mechanism 23 can both be set on the supporting base plate 11 using the position of the supporting plate 111 set on the supporting base plate 11, so as to avoid the need to reserve installation positions for the first driving mechanism 13 and the second driving mechanism 23 on the base 50 and the supporting top plate 21 respectively, thereby reducing the assembly difficulty of the PCB board positioning device and simplifying the structure of the positioning device.

[0050] Hereinafter, this embodiment provides two ways of arranging the second nut in the second screw pair 22 according to the above content: 1. Each second nut is fixedly connected to the support top plate 21, and the second lead screw 221 is axially fixed to the first lifting mechanism 10. In this embodiment, when the second lead screw 221 is driven by the second driving mechanism 23, a transmission relationship will occur between the second lead screw 221 and the second nut. Since the second lead screw 221 is rotatably axially fixed to the first lifting mechanism 10 (support bottom plate 11), the second nut will move along the rotation axis direction of the second lead screw 221, thereby driving the support top plate 21 to move up and down in the axial direction of the second lead screw 221.

[0051] 2. Each second nut is fixedly connected to the first lifting mechanism 10, and the second lead screw 221 is axially fixed to the support top plate 21. In this embodiment, when the second lead screw 221 is driven by the second driving mechanism 23, since the second nut is fixed to the first lifting mechanism 10 (support bottom plate 11), the second lead screw 221 will move up and down along the axial direction of the second nut, thereby driving the support top plate 21 to move up and down through the movement of the second lead screw 221 relative to the second nut.

[0052] On the basis of any of the above embodiments, since the lifting direction of the first lifting mechanism 10 relative to the base 50 is the same as the lifting direction of the second lifting mechanism 20 relative to the first lifting mechanism 10, and the first lifting mechanism 10 is located above the base 50, and the second lifting mechanism 20 is located above the first lifting mechanism 10, a guide mechanism can be used between the base 50, the first lifting mechanism 10 and the second lifting mechanism 20 to guide the lifting movement between any two of the above. Specifically, a guide rod 60 is provided between the base 50, the first lifting mechanism 10 and the second lifting mechanism 20, and one of the base 50, the first lifting mechanism 10 and the second lifting mechanism 20 is axially fixedly connected to the guide rod 60, and the other two are movably connected to the guide rod 60.

[0053] In an embodiment in which the first lifting mechanism 10 includes a supporting bottom plate 11 and the second lifting mechanism 20 includes a supporting top plate 21, guide holes for the guide rod 60 to pass through are provided on the base 50, the supporting bottom plate 11 and the supporting top plate 21. The guide hole of one of the above three is fixedly connected to the guide rod 60, and the guide holes of the other two can be movably mounted on the guide rod 60.

[0054] The base 50, the first lifting mechanism 10 and the second lifting mechanism 20 all guide the lifting movement between any two adjacent ones through the guide rod 60. There is no need to set independent guide structures between the base 50 and the first lifting mechanism 10, and between the first lifting mechanism 10 and the second lifting mechanism 20, thereby reducing the number and complexity of the guide structures in the PCB board positioning device, thereby simplifying the overall structure, which is not only conducive to the manufacture and installation of the equipment, but also reduces the difficulty of maintenance and maintenance. In this way, it can also ensure that the movement paths of the first lifting mechanism 10 and the second lifting mechanism 20 are consistent, effectively improving the lifting accuracy among the three. In addition, the existence of the guide rod 60 increases the support points of the first lifting mechanism 10 on the base 50 and the support pads of the second lifting mechanism 20 on the first lifting mechanism 10, making the lifting process of the two more stable, especially in the case of a large lifting height or a large load, the shared guide rod 60 can significantly reduce the shaking and offset generated during the period, thereby improving the overall stability of the system.

[0055] In one embodiment, four guide rods 60 are provided, and the four guide plates are respectively connected to the four corners of the base 50, the supporting bottom plate 11 and the supporting top plate 21 to maximize the supporting and guiding performance of the guide rods 60 for the first lifting mechanism 10 and the second lifting mechanism 20.

[0056] It can be understood that in the above-mentioned implementation mode in which the first lifting mechanism 10 and the second lifting mechanism 20 respectively use the first screw pair 12 and the second screw pair 22 to drive the lifting movement of the support base plate 11 and the support top plate 21, the first screw pair 12 and the second screw pair 22 also have good support formation and guiding performance, but by arranging the guide rod 60 on the base 50, the first lifting mechanism 10 and the second lifting mechanism 20, the radial force acting on the first screw pair 12 and the second screw pair 22 can be effectively reduced, and the service life of the first screw pair 12 and the second screw pair 22 can be extended on the basis of improving the guiding accuracy and stability.

[0057] In addition, it is worth mentioning that in the implementation mode in which the first screw pair 12 only adopts a first screw 121 and a first nut, and the second screw pair 22 only adopts a second screw 221 and a second nut, the existence of the guide rod 60 can also constrain the rotational freedom of the support base plate 11 and the base 50 in the direction around the Z-axis axis, and the rotational freedom of the support top plate 21 and the support base plate 11 in the direction around the Z-axis axis, so as to avoid the situation in which the first screw 121 and the second screw 221 drive the support base plate 11 and the support top plate 21 to rotate during the rotation and cannot be lifted or lowered.

[0058] Please refer to the attached Figure 1-Figure 4 In one embodiment, the positioning fixture 40 includes a fixed carrier plate 41 and a movable carrier plate 42. The fixed carrier plate 41 is fixedly disposed on one of the first lifting mechanism 10 and the base 50, and the movable carrier plate 42 is movably disposed on one of the first lifting mechanism 10 and the base 50. The inner sides of the movable carrier plate 42 and the fixed carrier plate 41 are opposite and spaced apart to form a clamping space therebetween. The movable carrier plate 42 can reciprocate in the direction of approaching and moving away from the fixed carrier plate 41 to adjust the size of the clamping space.

[0059] The fixed carrier plate 41 and the movable carrier plate 42 are arranged on the first lifting mechanism 10 so that the positioning fixture 40 can move synchronously with the second lifting mechanism 20 when the first lifting mechanism 10 drives the second lifting mechanism 20 to perform lifting movement, thereby ensuring the stability of the PCB board placed on the second lifting mechanism 20 (the storage table 30).

[0060] Of course, in the other embodiments mentioned above, the positioning fixture 40 can also be movably set on the outside of the first lifting mechanism 10 through other driving mechanisms, so that it can achieve the effect of synchronous lifting and lowering with the first lifting mechanism 10. However, it is obvious that by setting the positioning fixture 40 in the first lifting mechanism 10, the positioning fixture 40 and the second lifting mechanism 20 can have a higher positioning accuracy, and the relative heights of the two are determined by the first lifting mechanism 10, and there is no need to perform synchronous adjustment processing on the two independent mechanisms.

[0061] It can be understood that, due to the relatively fixed relationship between the fixed carrier 41 and the first lifting mechanism 10, the fixed carrier 41 and the first lifting mechanism 10 can adopt a more rigid connection structure, so that the connection strength between the fixed carrier 41 and the first lifting mechanism 10 is higher. Also, because the fixed carrier 41 is more stable, the positioning accuracy of the fixed carrier 41 on the first lifting mechanism 10 is also higher, so it can be used as a positioning reference for the PCB board during the positioning and clamping process. In the process of clamping the PCB board, the movable carrier 42 pushes against one side of the PCB board so that the other side of the PCB board can be stably pressed against the fixed carrier 41, so that the positioning accuracy of the PCB board in the clamping space is improved, and the clamping force of the PCB board is controlled by the movable adjustment of the movable carrier 42.

[0062] In one embodiment, a plurality of adsorption structures 44 are evenly distributed on the upper surfaces of the fixed carrier 41 and the movable carrier 42, respectively. The adsorption structures 44 are used to adsorb and fix the printed steel mesh that needs to be overlapped with the PCB board in the clamping space onto the positioning fixture 40. Specifically, after the PCB board is lifted by the storage table 30 to a position suitable for being clamped by the positioning fixture 40, the positioning fixture 40 can stably clamp the PCB board on the storage table 30 through the fixed carrier 41 and the movable carrier 42, and the printed steel mesh can move above the clamping space toward the direction close to the PCB board and finally be placed on the fixed carrier 41 and the movable carrier 42, and be adsorbed and fixed by the adsorption structures 44 on the fixed carrier 41 and the movable carrier 42, respectively. The PCB board and the printed steel mesh are both positioned by the positioning fixture 40 as a positioning reference, which can effectively avoid the positioning error problem caused by excessive component materials, improve the stability of the PCB board and the printed steel mesh during the bonding process, and effectively reduce the gap between the PCB board and the printed steel mesh.

[0063] Preferably, in this embodiment, multiple groups of adsorption structures 44 are evenly distributed on the upper surfaces of the fixed carrier 41 and the movable carrier 42, which can ensure that the contact area between the fixed carrier 41 and the movable carrier 42 and the adsorbed steel mesh is maximized, so that the size and distribution of the adsorption force applied by the positioning fixture 40 to the printed steel mesh are uniform, so that the positioning accuracy between the printed steel mesh and the PCB board is guaranteed.

[0064] It should be understood that the adsorption structure 44 arranged on the fixed carrier 41 and the movable carrier 42 can be, but is not limited to, vacuum adsorption (such as vacuum adsorption holes), magnetic adsorption (such as magnets or electromagnets), electrostatic adsorption (such as using electrostatic effects to make the steel mesh adhere to the support part), and adhesive adsorption (such as sticky materials or adsorption pads).

[0065] In addition to the above-mentioned structural form, the positioning fixture 40 also includes a pressing plate mechanism 43, which can be movably arranged on the fixed carrier 41 and / or the movable carrier 42, and the pressing plate mechanism 43 has a pressing plate position and a releasing position. When the pressing plate mechanism 43 is in the pressing plate position, the pressing plate mechanism 43 at least partially protrudes from the inner side surface of the fixed carrier 41 and / or the movable carrier 42, so that the pressing plate mechanism 43 protruding from the inner side surface of the fixed carrier 41 and the inner side surface of the movable carrier 42 can be in the clamping space, and the height position of the PCB board in the clamping space is constrained. When the PCB board is lifted upward below the clamping space, the upper surface of the PCB board can finally abut on the pressing plate mechanism 43 in the pressing plate position, ensuring that the height position of the PCB board meets the subsequent tin brushing requirements, and then the PCB board is further clamped and fixed. When the pressing plate mechanism 43 is in the releasing position, the pressing plate mechanism 43 retracts into the inner side of the fixed carrier 41 and / or the movable carrier 42 to release the PCB board in the clamping space, allowing it to move relative to the positioning fixture 40 and leave the corresponding workstation, or enter the clamping space from the previous workstation.

[0066] In this example, the movable carrier 42 and the fixed carrier 41 are respectively mounted on the first lifting mechanism 10 (supporting base plate 11) through a gantry support frame 45, wherein the gantry support frame 45 for supporting the movable carrier 42 is movably connected to the first lifting mechanism 10 through a spacing adjustment structure 46 (such as a guide rail and a guide block), and a spacing adjustment motor 47 is provided on the first lifting mechanism 10, and an adjusting screw 48 is provided on the output shaft of the spacing adjustment motor 47. The adjusting screw 48 and the gantry support frame 45 for supporting the movable carrier 42 are drivingly connected through an adjusting nut (not shown in the figure), so that by driving the adjusting screw 48 to rotate, the driving adjusting nut drives the gantry support frame 45 to move in the direction guided by the spacing adjustment structure 46, thereby achieving the purpose of moving the movable carrier 42 in the direction close to or away from the fixed carrier 41.

[0067] In this example, in order to make the adjustment stability of the movable carrier 42 and the fixed carrier 41 higher, adjustment screws 48 are provided at the opposite ends of the gantry support frame 45, and the spacing adjustment motor 47 is connected to one of the adjustment screws 48, and the two adjustment screws 48 can be synchronously transmitted through a transmission structure such as a synchronous belt.

[0068] The following briefly describes the operation process of the PCB board positioning device in the solder paste printing equipment according to the above implementation mode: S10, the PCB board is transported from the previous equipment station to the placement table 30 by the conveying mechanism (the CV conveying line as described above), and is placed on the placement table 30. At this time, the PCB board is at a position away from the clamping space and the printed steel mesh to be attached; S20, the second lifting mechanism 20 drives the storage platform 30 to lift, so that the PCB board moves toward the clamping space direction. When the PCB board moves to the point where its upper surface abuts against the pressing plate mechanism 43, the second lifting mechanism 20 stops moving, and then the movable carrier plate 42 in the positioning fixture 40 moves toward the fixed carrier plate 41 to exert a clamping force on the PCB board, so that the PCB board can be stably clamped and fixed on the storage platform 30 by the positioning fixture 40; S30, the first lifting mechanism 10 drives the second lifting mechanism 20 to lift, and the positioning fixture 40 also moves synchronously with the second lifting mechanism 20 (this can be achieved by setting the positioning fixture 40 on the first lifting mechanism 10), so that the PCB board moves from the standby position to the printing position under the constraints of the storage table 30 and the positioning fixture 40, and fits with the corresponding printing steel mesh; S40. Finally, the solder paste printing equipment uses a scraper to print the solder paste or red glue through the printing steel screen onto the corresponding pads of the PCB board.

[0069] It can be seen that the existence of the pressure plate mechanism 43 can constrain the height position of the PCB board before it is clamped and fixed, so that the height position of the PCB board on the positioning fixture 40 can meet the coordination requirements with the steel mesh (being flush or nearly flush with the upper surfaces of the fixed carrier 41 and the movable carrier 42), so that when the printed steel mesh is subsequently placed on the fixed carrier 41 and the movable carrier 42, the printed surface of the PCB board can better fit with the lower surface of the printed steel mesh, thereby improving the final tin brushing effect.

[0070] It can be understood from the above content that the base 50, as an important component of the PCB board positioning device, provides a stable support foundation for the first lifting mechanism 10 and the second lifting mechanism 20. In some embodiments, the base 50 can be a supporting structure for fixing the first lifting mechanism 10 on the solder paste printing equipment. In the present embodiment, the base 50 can also be configured to adjust the position of the first lifting mechanism 10 (and the second lifting mechanism 20) in the horizontal direction, so that the PCB board positioning device can adjust the horizontal position of the PCB board when the PCB board is placed on the storage table 30, thereby achieving the effect of aligning it with the printed steel mesh in the Z-axis direction (vertical direction).

[0071] Of course, in other implementations, the solder paste printing device can also achieve the above purpose by adjusting the position of the printing steel mesh in the horizontal direction.

[0072] Taking the above-mentioned embodiment in which the base 50 is configured to adjust the position of the first lifting mechanism 10 as an example, please refer to the attached manual. Figure 1-Figure 5 The base 50 of this embodiment includes an X-axis adjustment mechanism for adjusting the position of the first lifting mechanism 10 in the X-axis direction, a Y-axis adjustment mechanism for adjusting the position of the first lifting mechanism 10 in the Y-axis direction, and a T-axis adjustment mechanism 53 for adjusting the position of the first lifting mechanism 10 in the Z-axis direction.

[0073] It can be understood that the X-axis direction and the Y-axis direction described in this embodiment are two mutually perpendicular directions of the first lifting mechanism 10 in the horizontal plane rectangular coordinate system. In layman's terms, when the PCB board is placed on the storage table 30 on the second lifting mechanism 20, the X-axis adjustment mechanism 51 and the Y-axis adjustment mechanism 52 are used to adjust the position of the PCB board in its length direction and width direction respectively. The direction around the Z-axis axis described in this embodiment refers to the direction of rotation on the plane formed by the X-axis and the Y-axis, wherein the Z-axis axis is perpendicular to the horizontal plane, so as to adjust the plane rotation angle of the PCB board when it is placed on the storage table 30.

[0074] Theoretically, there is no clear limitation or requirement on the setting order of the three adjustment mechanisms. For example, in this embodiment, the Y-axis adjustment mechanism 52 can be arranged on the X-axis adjustment mechanism 51, so that the Y-axis adjustment mechanism 52 can reciprocate along the X-axis direction under the action of the X-axis adjustment mechanism 51, and the T-axis adjustment mechanism 53 is arranged on the Y-axis adjustment mechanism 52, so that the T-axis adjustment mechanism 53 can reciprocate along the Y-axis direction under the action of the Y-axis adjustment mechanism 52, and the first lifting mechanism 10 is arranged on the T-axis adjustment mechanism 53. In this way, the first lifting mechanism 10 can rotate around the Z-axis axis direction under the action of the T-axis adjustment mechanism 53, and it can also realize movement adjustment in the X-axis direction and the Y-axis direction respectively or simultaneously through the X-axis adjustment mechanism 51 and the Y-axis adjustment mechanism 52.

[0075] It is understandable that the X-axis adjustment mechanism 51 and the Y-axis adjustment mechanism 52 proposed in this embodiment can adopt relatively common linear motion structures in the current mechanical field, such as but not limited to linear guide rail structure, screw transmission structure, gear rack structure, air suspension or magnetic suspension structure, etc. The T-axis adjustment mechanism 53 can adopt relatively common rotational motion structures in the current mechanical field, such as but not limited to universal turntable structure, magnetic base structure, gear transmission structure, etc.

[0076] In this embodiment, both the X-axis adjustment mechanism 51 and the Y-axis adjustment mechanism 52 use a screw structure with high transmission accuracy and stability to adjust the X-axis and the Y-axis respectively. Figure 1-Figure 5As shown, the X-axis adjustment mechanism 51 includes an X-axis base plate 511 and an X-axis screw pair 512. The X-axis screw pair 512 is arranged between the Y-axis adjustment mechanism 52 and the X-axis base plate 511. Under the action of the X-axis screw pair 512, the Y-axis adjustment mechanism 52 is pushed to move along the X-axis direction. The Y-axis adjustment mechanism 52 includes a Y-axis bottom plate 521, a Y-axis top plate 522 and a Y-axis lead screw pair 523. The Y-axis bottom plate 521 is located above the X-axis bottom plate 511. The X-axis lead screw pair 512 is respectively connected to the X-axis bottom plate 511 and the Y-axis bottom plate 521. The Y-axis bottom plate 521 is slidably disposed on the X-axis bottom plate 511 via an X-axis guide rail 513 extending along the X-axis direction. The Y-axis top plate 522 is slidably disposed on the Y-axis bottom plate 521 via a Y-axis guide rail 524 extending along the Y-axis direction. The Y-axis lead screw pair 523 is disposed between the Y-axis bottom plate 521 and the Y-axis top plate 522 for driving the Y-axis top plate 522 to move relative to the Y-axis bottom plate 521 along the Y-axis direction. The T-axis adjustment mechanism 53 is rotatably disposed on the Y-axis top plate 522 around the Z-axis axis. The T-axis adjustment mechanism 53 includes an adjustment base 531 and a third driving mechanism 532, wherein the adjustment base 531 can be rotatably arranged on the Y-axis adjustment mechanism 52 around the Z-axis axis rotation axis. In the above-mentioned implementation mode in which the Y-axis adjustment mechanism 52 includes a Y-axis bottom plate 521 and a Y-axis top plate 522, the Y-axis top plate 522 is convexly provided with a truncated cone structure 5221, and the adjustment base 531 is correspondingly provided with a rotation groove 5311 whose structure matches the truncated cone structure 5221. The adjustment base 531 is rotatably arranged on the truncated cone structure 5221 through its rotation groove 5311. In this way, the adjustment base 531 can be rotated around the Z-axis axis direction under the mutual constraint of the rotation groove 5311 and the truncated cone structure 5221. The third driving mechanism 532 has a third fixed end 5321 and a third driving end 5322. The third driving end 5322 can make a linear motion relative to the third fixed end 5321, and the motion trajectory of the third driving end 5322 relative to the third fixed end 5321 is staggered from the rotation axis of the adjusting base 531. The third fixed end 5321 is installed on the Y-axis adjustment mechanism 52 (Y-axis top plate 522). The third driving end 5322 is connected to the adjusting base 531 through a movable component 533, so that when the third driving end 5322 reciprocates in a linear direction, it can drive the adjusting base 531 to rotate forward or reverse along the tangent direction of the adjusting base 531 (cone structure 5221) through the movable component 533.

[0077] This embodiment realizes the forward and reverse adjustment of the adjustment base 531 in the direction around the Z-axis axis through the above-mentioned structure. In addition to meeting the requirements of fine and precise adjustment of the adjustment base 531 in the forward direction and the square brick direction, it also makes the structural layout more compact. There is no need to set a relatively large drive motor and reducer structure between the T-axis adjustment mechanism 53 and the Y-axis adjustment mechanism 52, which is beneficial to the application of the PCB board positioning device in solder paste printing equipment.

[0078] It is worth mentioning that since the activity direction of the third driving mechanism 532 is different from the interaction direction of the adjusting base 531, when the third driving mechanism 532 drives the adjusting base 531 to move, the distance between the third driving end 5322 and the adjusting base 531 will change. Therefore, this embodiment needs to add an active component 533 between the third driving end 5322 and the adjusting base 531 to make corresponding compensation for the position change between the two, thereby ensuring a stable driving connection relationship between the third driving end 5322 and the adjusting base 531.

[0079] In this embodiment, the third driving mechanism 532 can be, but is not limited to, a lead screw pair, a linear motor, etc. The movable component 533 can be a component with certain deformation reset performance, such as a spring or rubber.

[0080] In one embodiment, a solder paste printing device is also provided. In addition to adopting the PCB board positioning device as described in any of the above embodiments, the solder paste printing device also includes an image acquisition unit 70 (such as a camera) and a rangefinder 80. The image acquisition unit 70 and the rangefinder 80 are both arranged above the storage table 30 along the Z-axis direction. Specifically, both are located above the clamping space. When a PCB board is placed on the storage table 30 and the PCB board is clamped and fixed by the positioning fixture 40, the image acquisition unit 70 is used to obtain image data of the PCB board and the positioning fixture 40 located in the clamping space. Specifically, after the image acquisition unit 70 obtains the image data of the PCB board and the positioning fixture 40, the solder paste printing equipment obtains the position of the Mark point (positioning point or reference point) on the PCB board and the identification point on the positioning fixture 40 through an algorithm, and determines the specific clamping position of the PCB board on the positioning fixture 40 by calculating the relative position of the two. In this way, the solder paste printing equipment can adjust the position of the printing steel mesh or adjust the position of the PCB board through the base 50 as mentioned above, so that the PCB board and the printing steel mesh are aligned to meet the subsequent lamination printing requirements. In this embodiment, the rangefinder 80 can be, but is not limited to, a laser rangefinder, an ultrasonic rangefinder, or an infrared rangefinder, which is used to obtain distance data between it and the PCB board located in the clamping space, so as to judge whether the PCB board is arched when being clamped by the positioning fixture 40 according to the change of the distance data, and control the clamping force applied by the positioning fixture 40 (movable carrier plate 42) on the PCB board according to the judgment result, so as to ensure that the PCB board can be stably clamped without deformation due to excessive clamping force, and ensure that the PCB board and the printed steel mesh are in a relatively stable state, so that the positioning accuracy and processing accuracy of the two can be improved.

[0081] At the same time, since the clamping force applied by the positioning fixture 40 to the PCB board is determined based on the distance data collected by the rangefinder 80, the clamping force applied by the positioning fixture 40 on the board can vary according to the size, type, or deformation coefficient, or dimensional error of the board, so that the clamping effect is unified, thereby enabling the board positioning fixture 40 to meet higher process requirements and achieve improved quality of the final product.

[0082] This embodiment further provides a PCB board positioning method according to the above-mentioned solder paste printing device, and the PCB board positioning method includes the steps of: S10, obtaining the distance data between it and the PCB board located in the clamping space through the distance meter 80; S20, judging whether the PCB board in the clamping space is arched according to the distance data; S30, adjusting the clamping force applied by the movable carrier plate 42 to the plate by using a proportional servo valve according to the judgment result.

[0083] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0084] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0085] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0086] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A PCB board positioning device, characterized in that: include: A first lifting mechanism (10) is arranged on a base (50) of the PCB board positioning device, and the first lifting mechanism (10) can perform lifting movement relative to the base (50) along the Z-axis direction; as well as A second lifting mechanism (20) is arranged on the first lifting mechanism (10) and is located above the first lifting mechanism (10); the second lifting mechanism (20) can perform lifting movement along the Z-axis direction relative to the first lifting mechanism (10); and a storage platform (30) for placing a PCB board is also arranged on the upper part of the second lifting mechanism (20); The positioning fixture (40) is located above the second lifting mechanism (20), and the positioning fixture (40) forms a clamping space for the PCB board. The storage platform (30) can move towards and away from the clamping space under the drive of the second lifting mechanism (20).

2. The PCB board positioning device according to claim 1, characterized in that: The first lifting mechanism (10) comprises: A supporting base plate (11) movably disposed on the base (50); A first screw pair (12) is arranged between the base (50) and the supporting base plate (11), so that the supporting base plate (11) is transmission-connected to the base (50) through the first screw pair (12); The first driving mechanism (13) comprises a first fixed end (131) and a first driving end (132), wherein the first fixed end (131) is mounted on the supporting base plate (11) or the base (50), and the first driving mechanism (13) is drivingly connected and matched with the first screw pair (12) via the first driving end (132).

3. The PCB board positioning device according to claim 2, characterized in that: The first screw pair (12) comprises: A first lead screw (121), wherein the first lead screw (121) is provided in a plurality, and the plurality of first lead screws (121) are evenly distributed in the edge area of ​​the support base plate (11), at least one first lead screw (121) is drivingly engaged with the first driving end (132), and each first lead screw (121) is synchronously rotatably provided between the support base plate (11) and the base (50); first nuts, the number of which is consistent with the number of the first lead screws (121), and each of the first nuts is respectively in transmission cooperation with each of the first lead screws (121); Each of the first nuts is fixedly connected to the supporting base plate (11), and the first lead screw (121) is axially fixed to the base (50); or each of the first nuts is fixedly connected to the base (50), and the first lead screw (121) is axially fixed to the supporting base plate (11).

4. The PCB board positioning device according to claim 1, characterized in that: The second lifting mechanism (20) comprises: A supporting top plate (21) movably disposed above the first lifting mechanism (10); a second screw pair (22) disposed between the first lifting mechanism (10) and the supporting top plate (21), so that the supporting top plate (21) is transmission-connected to the first lifting mechanism (10) through the second screw pair (22); The second driving mechanism (23) comprises a second fixed end (231) and a second driving end (232); the second fixed end (231) is mounted on the first lifting mechanism (10) or the supporting top plate (21); the second driving mechanism (23) is drivingly connected and matched with the second screw pair (22) via the second driving end (232).

5. The PCB board positioning device according to claim 4, characterized in that: The second screw pair (22) comprises: a second lead screw (221), wherein the second lead screw (221) is provided in a plurality, and the plurality of second lead screws (221) are evenly distributed in the edge area of ​​the support top plate (21), at least one second lead screw (221) is drivingly engaged with the second driving end (232), and each second lead screw (221) is synchronously rotatably provided between the support top plate (21) and the first lifting mechanism (10); second nuts, the number of the second nuts being consistent with the number of the second lead screws (221), and each of the second nuts being respectively in transmission cooperation with each of the second lead screws (221); Each of the second nuts is fixedly connected to the support top plate (21), and the second lead screw (221) is axially fixed to the first lifting mechanism (10); or each of the second nuts is fixedly connected to the first lifting mechanism (10), and the second lead screw (221) is axially fixed to the support top plate (21).

6. The PCB board positioning device according to claim 1, characterized in that: A guide rod (60) is also provided between the base (50), the first lifting mechanism (10) and the second lifting mechanism (20); one of the base (50), the first lifting mechanism (10) and the second lifting mechanism (20) is axially fixedly connected to the guide rod (60), and the other two are movably connected to the guide rod (60).

7. The PCB board positioning device according to claim 1, characterized in that: The positioning fixture (40) comprises: A fixed carrier plate (41) fixedly disposed on the first lifting mechanism (10); and A movable carrier plate (42) is movably arranged on the first lifting mechanism (10); the inner side surfaces of the movable carrier plate (42) and the fixed carrier plate (41) are arranged opposite to each other and spaced apart to form the clamping space therebetween; the movable carrier plate (42) can reciprocate in a direction approaching and moving away from the fixed carrier plate (41) to adjust the size of the clamping space; A pressing plate mechanism (43) is movably arranged on the fixed carrier plate (41) and / or the movable carrier plate (42), and the pressing plate mechanism (43) has a pressing plate position and a releasing position; when the pressing plate mechanism (43) is in the pressing plate position, the pressing plate mechanism (43) at least partially protrudes from the inner side surface of the fixed carrier plate (41) and / or the movable carrier plate (42); when the pressing plate mechanism (43) is in the releasing position, the pressing plate mechanism (43) is retracted into the inner side surface of the fixed carrier plate (41) and / or the movable carrier plate (42); Multiple groups of adsorption structures (44) are evenly distributed on the upper surfaces of the fixed carrier plate (41) and the movable carrier plate (42).

8. The PCB board positioning device according to any one of claims 1 to 5, characterized in that: The base (50) comprises: X-axis adjustment mechanism (51); A Y-axis adjustment mechanism (52) is arranged on the X-axis adjustment mechanism (51) so as to be reciprocatingly movable along the X-axis direction; The T-axis adjustment mechanism (53) is arranged on the Y-axis adjustment mechanism (52) so as to be reciprocating along the Y-axis direction, and the first lifting mechanism (10) is arranged on the T-axis adjustment mechanism (53) so as to be rotatable around the Z-axis.

9. The PCB board positioning device according to claim 8, characterized in that: The T-axis adjustment mechanism (53) comprises: An adjustment base (531) is rotatably arranged on the Y-axis adjustment mechanism (52) around the Z-axis; The third driving mechanism (532) comprises a third fixed end (5321) and a third driving end (5322), wherein the third driving end (5322) can perform linear motion relative to the third fixed end (5321), the third fixed end (5321) is mounted on the Y-axis adjustment mechanism (52), and the third driving end (5322) is connected to the adjustment base (531) via a movable component (533), so that the third driving end (5322) can drive the adjustment base (531) to rotate forward or reversely via the movable component (533) when reciprocating in a linear direction.

10. A solder paste printing device, characterized in that: include: A PCB board positioning device as claimed in any one of claims 1 to 9; An image acquisition unit (70) is arranged above the clamping space and is used to acquire image data of the PCB board and the positioning fixture (40) located in the clamping space; A distance meter (80) is arranged above the clamping space and is used to obtain distance data between the distance meter and the PCB board located in the clamping space.

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