Electroluminescent display device

Abstract

An electroluminescent display device is provided. The electroluminescent display device includes: a substrate including a display area and a non-display area surrounding the display area; a plurality of transistors disposed on the substrate in the display area; a light emitting diode connected to the plurality of transistors and including an anode, an emission layer, and a cathode; an encapsulation layer disposed on the light emitting diode and including a first inorganic encapsulation layer, an organic encapsulation layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer disposed on the organic encapsulation layer; and a plurality of structural bodies disposed on the substrate in the non-display area. Each of the first inorganic encapsulation layer and the second inorganic encapsulation layer may be separated with respect to a first structure disposed in an outermost region of the substrate among the plurality of structures.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0077443 filed on June 16, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to an electroluminescent display device, and more particularly, to an electroluminescent display device in which expansion of cracks occurring in an outer region is suppressed. Background Art

[0004] Applications of liquid crystal display devices (LCD) and organic light emitting display devices (OLED), which have been widely used, are gradually increasing.

[0005] LCD and OLED have limitations in reducing the size of the border area, where the border area can be visually identified by the user as an area where no image is displayed. For example, in the case of LCD, a sealant is required to seal the liquid crystal and combine (or bond) the upper substrate and the lower substrate. Therefore, there are limitations in reducing the size of the border area. In addition, in the case of OLED, the organic light emitting diode is mainly made of organic materials that are susceptible to moisture or oxygen (in other words, it includes organic materials that are susceptible to moisture or oxygen). Therefore, it is necessary to set an encapsulation unit (or encapsulation layer) to protect the organic light emitting diode. Therefore, there are limitations in reducing the size of the border area. In particular, it is impossible to realize a very large screen using one panel. Therefore, when a very large screen is realized by arranging multiple liquid crystal display panels or multiple organic light emitting display panels in the form of a mosaic (or tiled block), the border area between adjacent panels can be visually identified by the user. Summary of the invention

[0006] One object to be achieved by the present disclosure is to provide an electroluminescent display device, in which an inorganic layer is separated by arranging a structure (or structural member / structural component) in an outer area (or peripheral / peripheral area) of the electroluminescent display device, thereby suppressing the expansion of cracks.

[0007] Another object to be achieved by the present disclosure is to provide an electroluminescent display device in which an inorganic layer is separated in a non-display area and thus moisture penetration (or infiltration) can be suppressed.

[0008] Another object to be achieved by the present disclosure is to provide an electroluminescent display device, in which the non-display area can be reduced, and thereby the frame area can be reduced and the reliability can be improved.

[0009] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0010] According to one aspect of the present disclosure, an electroluminescent display device is provided. The electroluminescent display device includes: a substrate, the substrate including a display area and a non-display area surrounding (or surrounding) the display area; a plurality of transistors arranged on the substrate and in the display area; a light-emitting diode connected to (especially electrically connected to) the plurality of transistors and including an anode, an emission layer and a cathode; an encapsulation layer arranged on the light-emitting diode and including a first inorganic encapsulation layer, an organic encapsulation layer arranged on the first inorganic encapsulation layer, and a second inorganic encapsulation layer arranged on the organic encapsulation layer; and a plurality of structures arranged on the substrate and in the non-display area. The plurality of structures are configured to inhibit the expansion of cracks or the penetration of moisture and oxygen from the outside of the electroluminescent display device. For example, each of the first inorganic encapsulation layer and the second inorganic encapsulation layer is separated relative to the first structure arranged in the outermost area of ​​the substrate among the plurality of structures.

[0011] According to another aspect of the present disclosure, an electroluminescent display device is provided. The electroluminescent display device includes a substrate, the substrate including a display area and a non-display area surrounding the display area. The electroluminescent display device includes a plurality of transistors arranged on the substrate in the display area. The electroluminescent display device includes a light-emitting diode, which is connected to the plurality of transistors and includes an anode, an emission layer and a cathode. The electroluminescent display device includes an encapsulation layer, which is arranged on the light-emitting diode and includes a first inorganic encapsulation layer, an organic encapsulation layer arranged on the inorganic encapsulation layer, and a second inorganic encapsulation layer arranged on the organic encapsulation layer. The electroluminescent display device includes a first structure (e.g., an undercut structure) arranged in the non-display area and in the outermost area of ​​the substrate. Each of the first inorganic encapsulation layer and the second inorganic encapsulation layer is separated relative to the first structure.

[0012] Additional details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0013] According to the present disclosure, cracks occurring in the outer region can be suppressed from extending to the display region.

[0014] According to the present disclosure, the bezel area of ​​the electroluminescent display device can be reduced, and moisture penetration can also be suppressed.

[0015] According to the present disclosure, the reliability of the electroluminescent display device can be improved, and thus the life of the electroluminescent display device can be improved. Therefore, low energy consumption (or low power consumption) can be achieved.

[0016] According to the present disclosure, a processing margin of an inorganic layer provided in an outer region of a display device can be ensured.

[0017] The effects according to the present disclosure are not limited to the above-exemplified contents, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a schematic plan view of a spliced ​​display device according to an exemplary embodiment of the present disclosure;

[0020] Figure 2 is a schematic plan view of an electroluminescent display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 3 is a cross-sectional view of a sub-pixel of an electroluminescent display device according to an exemplary embodiment of the present disclosure;

[0022] Figure 4 is along Figure 2 A schematic cross-sectional view taken along line IV-IV′ of ;

[0023] Figure 5 is along Figure 2 A schematic cross-sectional view taken along line VV′ of ;

[0024] Figure 6 is a cross-sectional view for describing a method of manufacturing an electroluminescent display device according to an exemplary embodiment of the present disclosure; and

[0025] Figure 7 is a cross-sectional view of an electroluminescent display device according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] By referring to the exemplary embodiments described in detail below in conjunction with the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving these advantages and features will be clear. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0027] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings used to describe the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including (or comprising)", "having" and "consisting of..." used herein are generally intended to allow the addition of other components unless these terms are used together with the terms "only" or "only". Unless otherwise expressly stated, the plural may be included when referring to the singular.

[0028] Even if not explicitly stated, the parts are interpreted as including the usual error range.

[0029] When terms such as "on", "above", "below", "beneath", "near" are used to describe the positional relationship between two parts, one or more parts may be positioned between the two parts unless the terms are used together with the terms "immediately" or "directly".

[0030] When one element or layer is disposed on another element or layer, the further element or layer may be directly interposed on or between the other element or layer.

[0031] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component to be mentioned below can be the second component in the technical concept of the present disclosure.

[0032] Throughout the specification, like reference numerals generally refer to like elements.

[0033] For convenience of description, the size and thickness of each component shown in the drawings are illustrated, and the present disclosure is not limited to the size and thickness of the components shown.

[0034] The features of the various embodiments of the present disclosure can be partially or completely attached or combined with each other, and can be technically interlocked and operated in various ways, and these embodiments can be performed independently or in association with each other.

[0035] Hereinafter, an electroluminescent display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0036] Figure 1 is a schematic plan view of a spliced ​​display device according to an exemplary embodiment of the present disclosure. Figure 2 is a schematic plan view of an electroluminescent display device according to an exemplary embodiment of the present disclosure.

[0037] refer to Figure 1, a spliced ​​display device TD according to an exemplary embodiment of the present disclosure may include a plurality of electroluminescent display devices 100 according to an exemplary embodiment of the present disclosure.

[0038] The plurality of electroluminescent display devices 100 may be arranged in the form of a mosaic block to realize a single mosaic display device TD. For ease of description, Figure 1 The electroluminescent display device 100 is shown to be arranged in the form of a 2×3 tile array. However, the present disclosure is not limited to this. The multiple electroluminescent display devices 100 can be spliced ​​into two rows. The end portion of the electroluminescent display device 100 provided with the flexible film 160 and the printed circuit board 170 has a large width. Therefore, when the multiple electroluminescent display devices 100 are spliced ​​by coupling (or coupling) their end portions, the user is able to recognize the wide border. Therefore, the multiple electroluminescent display devices 100 can be spliced ​​to be adjacent to each other by coupling the portions other than the portions provided with the flexible film 160 and the printed circuit board 170 (that is, the portions except the portions provided with the flexible film 160 and the printed circuit board 170).

[0039] The electroluminescent display device 100 may include a substrate 101 (eg, Figure 3 shown).

[0040] The substrate 101 includes a display area AA and a non-display area NA. Figure 2 shown.

[0041] The display area AA is an area for displaying an image. A plurality of sub-pixels for displaying an image and a pixel circuit for driving the plurality of sub-pixels may be arranged in the display area AA. Each of the plurality of sub-pixels is a separate unit that emits light, and may be provided with a light-emitting diode (LED). The plurality of sub-pixels may include red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels, but is not limited thereto. The pixel circuit may include various transistors, storage capacitors, and lines for driving the plurality of sub-pixels. For example, the pixel circuit may be composed of various components such as a driving transistor, a switching transistor, a sensing transistor, a storage capacitor, a gate line, a data line, etc., but is not limited thereto.

[0042] The non-display area NA is an area where no image is displayed. The non-display area NA may be arranged to surround the display area AA. In the non-display area NA, various lines, driver circuits, etc. for driving sub-pixels arranged in the display area AA are arranged. For example, a driver circuit such as a gate driver circuit and various lines and a plurality of pads may be arranged in the non-display area NA. However, the present disclosure is not limited thereto. The plurality of electroluminescent display devices 100 can be realized (or implemented) as a spliced ​​display device TD. Therefore, various components may be arranged to minimize the size of the non-display area NA.

[0043] refer to Figure 1 and Figure 2 , a plurality of flexible films 160 are connected to the end of the electroluminescent display device 100. Each of the plurality of flexible films 160 is a film in which various components are provided on a base film having ductility. The plurality of flexible films 160 are used to supply signals to the plurality of sub-pixels provided in the display area AA. The plurality of flexible films 160 may be provided at one end of the non-display area NA of the electroluminescent display device 100 to supply data voltages, etc., to the plurality of sub-pixels provided in the display area AA.

[0044] Driver units such as gate drivers and data drivers may be disposed on the plurality of flexible films 160. The driver units may be mounted by a chip on glass (COG) method, a chip on film (COF) method, or a tape carrier package (TCP) method depending on a mounting method, but are not limited thereto.

[0045] at the same time, Figure 1 and Figure 2 The shapes and numbers of the plurality of flexible films 160 shown are merely examples, but are not limited thereto. The shapes and numbers of the plurality of flexible films 160 may be variously modified according to their designs.

[0046] refer to Figure 1 and Figure 2 The printed circuit board 170 is connected to the plurality of flexible films 160. The printed circuit board 170 is a component configured to supply a signal to the driver IC. Various components configured to supply various driving signals such as a driving signal, a data voltage, etc. to the driver IC may be provided on the printed circuit board 170.

[0047] refer to Figure 2 The electroluminescent display device 100 may include a plurality of structures (or referred to as structural members or structural components) ST. The plurality of structures ST may be disposed in the non-display area NA of the substrate 101.

[0048] The plurality of structure bodies ST may include a first structure body ST1 , a second structure body ST2 , a third structure body ST3 , and a fourth structure body ST4 .

[0049] The first structure body ST1 may be disposed in an outermost region of the substrate 101 .

[0050] The first structure body ST1 may be disposed on other surfaces of the substrate 101 except for the surface on which the flexible film 160 is disposed. Figure 2As shown, the first structure body ST1 may be disposed on three side surfaces of the electroluminescent display device 100 on which the flexible film 160 is not disposed, among the four side surfaces of the electroluminescent display device 100. However, the present disclosure is not limited thereto.

[0051] The second structure body ST2 may be disposed in the non-display area NA to be closest to the display area AA among the plurality of structure bodies ST. The third structure body ST3 may be disposed outside the second structure body ST2, and the fourth structure body ST4 may be disposed between the third structure body ST3 and the first structure body ST1.

[0052] The second structure body ST2, the third structure body ST3 and the fourth structure body ST4 may be disposed in the non-display area NA to surround the display area AA. That is, the second structure body ST2, the third structure body ST3 and the fourth structure body ST4 may be disposed in a manner such that Figure 2 Closed loop shape setup shown.

[0053] The following will refer to Figure 4 and Figure 5 The details of the plurality of structures ST are described.

[0054] Figure 3 is a cross-sectional view of a sub-pixel of an electroluminescent display device 100 according to an exemplary embodiment of the present disclosure.

[0055] refer to Figure 3 According to an exemplary embodiment of the present disclosure, an electroluminescent display device 100 may include a substrate 101, a transistor 110, a light shielding layer LS, a buffer layer 102, and a gate insulating layer GI. The electroluminescent display device 100 may also include an interlayer insulating layer 103, a passivation layer 104, a planarization layer 105, a light emitting diode 150, a bank 106, and an encapsulation layer 120.

[0056] The substrate 101 is a supporting member for supporting other components of the electroluminescent display device 100, and may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. In addition, the substrate 110 may be made of a polymer or plastic, such as polyimide (PI), or may be made of a flexible material.

[0057] The light shielding layer LS may be provided on the substrate 101. The light shielding layer LS is provided to overlap at least the active layer 111 of the transistor 110, and thus serves to block light incident on the active layer 111. Although the light shielding layer LS is shown in the drawings as being configured by a single layer, the light shielding layer LS may also be configured by a plurality of layers. The light shielding layer LS may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au) or alloys thereof.

[0058] The buffer layer 102 may be disposed on the light shielding layer LS. The buffer layer 102 is a functional layer for protecting various electrodes and wires from impurities (e.g., alkali ions) leaking from the substrate 101 or the lower layer / bottom layer. The buffer layer 102 may have a multilayer structure, but is not limited thereto. The buffer layer 102 may be configured of silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof.

[0059] The buffer layer 102 may delay the diffusion of moisture and / or oxygen penetrating into the substrate 101. In addition, the buffer layer 102 may include a multiple buffer and / or an active buffer. The active buffer is used to protect the active layer 111 composed of the semiconductor of the transistor 110 and block various types of defects introduced from the substrate 101. The active buffer may be made of amorphous silicon (a-Si), but is not limited thereto.

[0060] The transistor 110 may be disposed on the buffer layer 102. The transistor 110 may have a structure in which an active layer 111, a gate insulating layer GI, a gate electrode 113, an interlayer insulating layer 103, a source electrode 112a, and a drain electrode 112b are sequentially stacked. The transistor 110 may be electrically connected to the light emitting diode 150 through the connecting electrode 114, and may be used to transmit current or signals to the light emitting diode 150.

[0061] The active layer 111 may be disposed on the buffer layer 102. The active layer 111 may be made of polycrystalline silicon (p-Si). In this case, a predetermined region may be doped with impurities. Alternatively, the active layer 111 may be made of amorphous silicon (a-Si) or various organic semiconductor materials such as pentacene. In addition, the active layer 111 may be made of an oxide semiconductor.

[0062] A gate insulating layer GI may be disposed on the active layer 111. The gate insulating layer GI may be made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or an organic insulating material.

[0063] Figure 3 It is shown that the gate insulating layer GI is disposed only in a region overlapping with the gate electrode 113 . However, the present disclosure is not limited thereto. The gate insulating layer GI may be disposed to overlap with the entire surface of the substrate 101 .

[0064] The gate electrode 113 may be disposed on the gate insulating layer GI. The gate electrode 113 may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0065] The interlayer insulating layer 103 may be disposed on the gate electrode 113. The interlayer insulating layer 103 may be made of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or an organic insulating material.

[0066] Each of the source electrode 112a and the drain electrode 112b may be configured on the interlayer insulating layer 103 through a single-layer or multi-layer structure made of an electrode material. The source electrode 112a and the drain electrode 112b may be connected to the active layer 111 through a contact hole provided in the interlayer insulating layer 103. The source electrode 112a and the drain electrode 112b may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0067] A passivation layer 104 may be disposed on the transistor 110. The passivation layer 104 is an insulating layer for protecting lower layer (or bottom layer) components. For example, the passivation layer 104 may be made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx) or an organic insulating material, but is not limited thereto. In some embodiments, the passivation layer 104 may be omitted.

[0068] The planarization layer 105 may be disposed on the passivation layer 104. Figure 3 As shown, the planarization layer 105 may include a first planarization layer 105a and a second planarization layer 105b disposed on the first planarization layer 105a, but is not limited thereto. The first planarization layer 105a and the second planarization layer 105b may include an organic insulating material. For example, the first planarization layer 105a and the second planarization layer 105b may be made of polyimide or an acryl or benzocyclobutene (BCB) based resin, but is not limited thereto.

[0069] The first planarization layer 105a may be provided to cover the transistor 110. The first planarization layer 105a may be provided to expose a portion of the source electrode 112a and the drain electrode 112b of the transistor 110.

[0070] The connection electrode 114 may be disposed on the first planarization layer 105a to electrically connect the transistor 110 and the light emitting diode 150. Figure 3 Although not shown in the figure, various metal layers used as lines / electrodes such as data lines, signal lines, etc. may be disposed on the first planarization layer 105a.

[0071] In addition, the second planarization layer 105b may be disposed on the first planarization layer 105a and the connection electrode 114. The second planarization layer 105b may be provided (or formed) to expose a portion of the connection electrode 114. In addition, the source electrode 112a of the transistor 110 may be electrically connected to the anode 151 of the light emitting diode 150 through the connection electrode 114.

[0072] The light emitting diode 150 may have a structure in which an anode 151, an emission layer 152, and a cathode 153 are sequentially stacked. That is, the light emitting diode 150 may be composed of an anode 151 disposed on the planarization layer 105, an emission layer 152 disposed on the anode 151, and a cathode 153 disposed on the emission layer 152.

[0073] The display device can be implemented in a top emission mode or a bottom emission mode. According to the top emission mode, a reflective layer made of an opaque conductive material with high reflectivity can be added below the anode 151. Thus, the light emitted from the emission layer 152 is reflected by the anode 151 and directed upward (i.e., toward the cathode 153). Here, the opaque conductive material can be, for example, silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) or an alloy thereof. According to the bottom emission mode, the anode 151 can be made only of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the following, it will be assumed and described that the electroluminescent display device 100 of the present disclosure is a top emission electroluminescent display device.

[0074] The anode 151 is disposed on the second planarization layer 105b. The anode 151 may correspond to each of the plurality of sub-pixels. That is, the anode 151 may be patterned to correspond to each of the plurality of sub-pixels. The anode 151 may be electrically connected to the connection electrode 114 and the transistor 110 through contact holes disposed in the second planarization layer 105b and the first planarization layer 105a, respectively.

[0075] The anode 151 may include a first anode 151a and a second anode 151b located on the first anode 151a. The first anode 151a may have a structure in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of ITO are stacked. The second anode 151b may have a structure in which a layer made of ITO, a layer made of silver (Ag) or an Ag alloy, and a layer made of ITO are stacked.

[0076] The bank 106 is disposed on the anode 151 and the second planarization layer 105 b. The bank 106 may be provided (or disposed) on the second planarization layer 105 b to cover the edge of the anode 151.

[0077] The bank 106 is an insulating layer disposed between a plurality of sub-pixels to define the plurality of sub-pixels. The bank 106 may be made of an organic insulating material. For example, the bank 106 may be made of polyimide or an acryl or benzocyclobutene (BCB) based resin, but is not limited thereto.

[0078] The emission layer 152 is disposed on the anode 151 and the bank 106. The emission layer 152 may be disposed on the entire surface of the substrate 101. That is, the emission layer 152 may be a common layer corresponding to all sub-pixels in the plurality of sub-pixels. The emission layer 152 may be an organic layer for emitting light of a specific color. The emission layer 152 may include various layers such as a hole transport layer, a hole injection layer, a hole blocking layer, an electron injection layer, an electron blocking layer, an electron transport layer, and the like.

[0079] The cathode 153 is disposed on the emission layer 152. The cathode 153 may be provided (or formed) on the entire surface of the substrate 101 as a single layer. That is, the cathode 153 may be a common layer corresponding to all sub-pixels in the plurality of sub-pixels. The cathode 153 supplies electrons to the emission layer 152, and thus may be made of a conductive material having a low work function. The cathode 153 may be made of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO), a metal alloy such as MgAg, or an ytterbium (Yb) alloy. The cathode 153 may also include a metal doping layer. However, the present disclosure is not limited thereto.

[0080] The encapsulation layer 120 is disposed on the light emitting diode 150. The encapsulation layer 120 protects the light emitting diode 150 from moisture or the like penetrating from the outside of the electroluminescent display device 100. The encapsulation layer 120 includes a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123.

[0081] The first inorganic encapsulation layer 121 is disposed on the cathode 153 and serves to suppress the penetration of moisture or oxygen. The first inorganic encapsulation layer 121 may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon nitride oxide (SiNxOy), or aluminum oxide (AlyOz), but is not limited thereto.

[0082] The organic encapsulation layer 122 is disposed on the first inorganic encapsulation layer 121 and is used to planarize the surface of the first inorganic encapsulation layer 121. In addition, the organic encapsulation layer 122 can cover foreign matter or particles that may be generated during the manufacturing process of the display device. The organic encapsulation layer 122 can be made of an organic insulating material such as silicon oxycarbon (SiOxCz) or an acryl or epoxy resin, but is not limited thereto.

[0083] The second inorganic encapsulation layer 123 is disposed on the organic encapsulation layer 122. Like the first inorganic encapsulation layer 121, the second inorganic encapsulation layer 123 is used to suppress the penetration of moisture or oxygen. Here, the second inorganic encapsulation layer 123 and the first inorganic encapsulation layer 121 can be used to seal the organic encapsulation layer 122. Therefore, the second inorganic encapsulation layer 123 can effectively reduce the moisture or oxygen that penetrates into the light-emitting diode 150. The second inorganic encapsulation layer 123 may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), or aluminum oxide (AlyOz), but is not limited thereto.

[0084] In the following, reference will be made to Figure 4 and Figure 5 The non-display area NA is described in detail.

[0085] Figure 4 is along Figure 2 Schematic cross-sectional view taken along line IV-IV′. Figure 5 is along Figure 2 Schematic cross-sectional view taken along line VV′. Figure 4 is a cross-sectional view of one surface of the substrate 101 to which the flexible film 160 is bonded (or attached). Figure 5 1 is a cross-sectional view of the other surfaces of the substrate 101 except for one surface on which the flexible film 160 is disposed (or bonded). For ease of description, Figure 4 The flexible membrane 160 is not shown.

[0086] refer to Figure 4 and Figure 5 , the substrate 101, the buffer layer 102, the interlayer insulating layer 103, the passivation layer 104, the planarization layer 105 and the bank 106 may be disposed in the non-display area NA. In addition, the encapsulation layer 120, the plurality of pads PAD, the crack detection unit PCD and the plurality of inorganic layers L may be disposed in the non-display area NA. In addition, the pad protection layer 191, the transparent conductive layer 192 and the plurality of structures ST may be disposed in the non-display area NA.

[0087] The plurality of structure bodies ST may be disposed on the substrate 101 , the buffer layer 102 , and the interlayer insulating layer 103 .

[0088] The plurality of structure bodies ST may include a first structure body ST1 , a second structure body ST2 , a third structure body ST3 , and a fourth structure body ST4 .

[0089] The second, third, and fourth structure bodies ST2, ST3, and ST4 may be disposed in the non-display area NA to surround the display area AA.

[0090] refer to Figure 4 and Figure 5The second structure body ST2 may be disposed most adjacent to the display area AA among the plurality of structure bodies ST, and the third structure body ST3 may be disposed outside the second structure body ST2. The fourth structure body ST4 may be disposed between the third structure body ST3 and the first structure body ST1.

[0091] The second structure body ST2 and the fourth structure body ST4 can suppress the penetration of moisture and oxygen from the outside of the electroluminescent display device 100. In addition, the second structure body ST2 and the fourth structure body ST4 can minimize the damage caused by moisture and oxygen to the organic materials disposed inside the electroluminescent display device 100. When the emission layer 152 is formed, it can be disconnected by the undercut shape of each of the second structure body ST2 and the fourth structure body ST4. Thus, a portion of the emission layer 152 can be disposed on each of the second structure body ST2 and the fourth structure body ST4. In addition, for each of the second structure body ST2 and the fourth structure body ST4, the emission layer 152 can be separated. Therefore, it is possible to suppress moisture and oxygen from the outside of the electroluminescent display device 100 from penetrating into the display area AA through the emission layer 152 disposed in the non-display area NA. In addition, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are disposed to surround the surfaces of the second structure body ST2 and the fourth structure body ST4. Therefore, the penetration of moisture and oxygen may be slowed down by increasing the penetration path of moisture and oxygen from the outside of the electroluminescent display device 100 .

[0092] Here, the second structure body ST2 and the fourth structure body ST4 may have the same shape. That is, except for their positions, the second structure body ST2 and the fourth structure body ST4 may have the same configuration and shape. For example, each of the second structure body ST2 and the fourth structure body ST4 may have a structure in which the material identical to the passivation layer 104 and the material identical to the first anode 151a are stacked. For example, the second structure body ST2 may have a structure in which a first layer ST2a made of the same material as the passivation layer 104 and a second layer ST2b made of the same material as the first anode 151a are stacked. The fourth structure body ST4 may have a structure in which a first layer ST4a made of the same material as the passivation layer 104 and a second layer ST4b made of the same material as the first anode 151a are stacked. However, the configuration and material of the second structure body ST2 and the fourth structure body ST4 are not limited thereto.

[0093] In addition, each of the second structure body ST2 and the fourth structure body ST4 may have an undercut shape. Specifically, the lower surface of the second layer ST2b of the second structure body ST2 may have a larger size than the upper surface of the first layer ST2a of the second structure body ST2. In addition, the lower surface of the second layer ST4b of the fourth structure body ST4 may have a larger size than the upper surface of the first layer ST4a of the fourth structure body ST4.

[0094] The third structure body ST3 is configured to control the formation area of ​​the organic encapsulation layer 122. The height of the third structure body ST3 can be controlled, and thus, the third structure body ST3 can be used as a dam to suppress overflow of the organic encapsulation layer 122. Therefore, the third structure body ST3 can have a greater height than the second structure body ST2 and the fourth structure body ST4. Therefore, the second structure body ST2 can be disposed below the organic encapsulation layer 122, and the end of the organic encapsulation layer 122 can be disposed to overlap with the third structure body ST3.

[0095] The third structure body ST3 may have a structure in which the same material as the passivation layer 104, the same material as the planarization layer 105, and the same material as the bank 106 are stacked. For example, the third structure body ST3 may have a structure in which a first layer ST3a made of the same material as the passivation layer 104, a second layer ST3b made of the same material as the first planarization layer 105a, a third layer ST3c made of the same material as the second planarization layer 105b, and a fourth layer ST3d made of the same material as the bank 106 are stacked. However, the configuration and material of the third structure body ST3 are not limited thereto.

[0096] Here, the third structure body ST3 may have an inverted tapered shape. That is, the lower surface of the second layer ST3b of the third structure body ST3 may have a larger size than the upper surface of the first layer ST3a of the third structure body ST3. Thus, the third structure body ST3 can also inhibit moisture and oxygen from penetrating from the outside of the electroluminescent display device 100 through the emission layer 152 disposed in the non-display area NA into the display area AA. In addition, the third structure body ST3 can delay the penetration of moisture and oxygen by increasing the penetration path of moisture and oxygen from the outside of the electroluminescent display device 100.

[0097] Figure 4 and Figure 5 It is shown that the interlayer insulating layer 103 disposed under the plurality of structure bodies ST is continuously disposed between the plurality of structure bodies ST. However, the present disclosure is not limited thereto. The interlayer insulating layer 103 may be discontinuously disposed between the plurality of structure bodies ST.

[0098] The emission layer 152 and the cathode 153 may be disposed on the plurality of structures ST. For each of the plurality of structures ST, the emission layer 152 and the cathode 153 may be separated. For example, the emission layer 152 and the cathode 153 may be discontinuously disposed between the plurality of structures ST to cover some portions of the upper surface of the interlayer insulating layer 103 located between the plurality of structures ST. However, the present disclosure is not limited thereto.

[0099] The encapsulation layer 120 including the first inorganic encapsulation layer 121 , the organic encapsulation layer 122 , and the second inorganic encapsulation layer 123 may be disposed on the cathode 153 .

[0100] The first inorganic encapsulation layer 121 may extend from the display area AA to the non-display area NA.

[0101] The organic encapsulation layer 122 is disposed on the first inorganic encapsulation layer 121 and is disposed in the display area AA and a portion of the non-display area NA extending from the display area AA. For example, the organic encapsulation layer 122 may be disposed inside the third structure body ST3.

[0102] The second inorganic encapsulation layer 123 may extend from the display area AA to the non-display area NA. The second inorganic encapsulation layer 123 may contact the first inorganic encapsulation layer 121 at the outer side (or outside the end) of the end of the organic encapsulation layer 122. For example, the second inorganic encapsulation layer 123 may contact the first inorganic encapsulation layer 121 at the outer side of the third structure body ST3.

[0103] refer to Figure 4 and Figure 5 , each of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may be continuously disposed to cover (or be adjacent to) the surfaces of the second structure body ST2, the third structure body ST3, and the fourth structure body ST4, and the first inorganic encapsulation layer 121 may be in contact with the surfaces of the second structure body ST2, the third structure body ST3, and the fourth structure body ST4. That is, each of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may extend from the display area AA to a region overlapping with the surface of the fourth structure body ST4.

[0104] refer to Figure 4 , a plurality of pads PAD are provided on one surface of the substrate 101 and outside the plurality of structures ST. Figure 4 Not shown, such as Figure 2 The plurality of flexible films 160 shown may be disposed on the plurality of pads PAD.

[0105] The plurality of pads PAD may include a first pad PAD1 and a second pad PAD2 located on the first pad PAD1.

[0106] The first pad PAD1 may be made of the same material as the active layer 111. However, the semiconductor material of the first pad PAD1 may be conductive, but is not limited thereto.

[0107] The second pad PAD2 may be made of the same material as the source electrode 112a and the drain electrode 112b. For example, the second pad PAD2 may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. However, the present disclosure is not limited thereto.

[0108] The pad protection layer 191 may be provided to surround (or cover) the plurality of pads PAD. The pad protection layer 191 may be made of the same material as the transparent conductive layer 192 provided on the substrate 101 and below the first structure body ST1. For example, the pad protection layer 191 may be made of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto.

[0109] refer to Figure 5 , the crack detection unit PCD may be disposed on the substrate 101, outside the fourth structure body ST4. The crack detection unit PCD may be disposed outside the fourth structure body ST4 to surround the display area AA. However, the present disclosure is not limited thereto.

[0110] The crack detection unit PCD may be made of the same material as the light shielding layer LS. For example, the crack detection unit PCD may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au) or alloys thereof. However, the present disclosure is not limited thereto.

[0111] The crack detection unit PCD may be disposed under the first structure body ST1 to overlap with the first structure body ST1.

[0112] A plurality of inorganic layers L may be disposed on the crack detection unit PCD. The plurality of inorganic layers L may be disposed between the crack detection unit PCD and the first structure body ST1 to cover the side surface and the upper surface of the crack detection unit PCD.

[0113] The plurality of inorganic layers L may be made of the same material as the inorganic insulating layer disposed in the display area AA. For example, the plurality of inorganic layers L may include a first inorganic layer L1 made of the same material as the buffer layer 102, and a second inorganic layer L2 disposed on the first inorganic layer L1 and made of the same material as the interlayer insulating layer 103. Thus, the first inorganic layer L1 and the second inorganic layer L2 may be made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). However, the present disclosure is not limited thereto.

[0114] The transparent conductive layer 192 may be disposed on the substrate 101, between the plurality of inorganic layers L and the first structure body ST1. In addition, the transparent conductive layer 192 may be disposed to surround the upper surface and the side surface of the plurality of inorganic layers L disposed on the crack detection unit PCD, and may be disposed to contact the upper surface of the substrate 101. That is, the transparent conductive layer 192 may extend from the upper surface and the side surface of the plurality of inorganic layers L to cover a portion of the upper surface of the substrate 101. However, the present disclosure is not limited thereto.

[0115] When a component disposed on the transparent conductive layer 192 is etched, the transparent conductive layer 192 serves to suppress damage to the plurality of inorganic layers L disposed below the transparent conductive layer 192. Thus, the transparent conductive layer 192 may serve as an etching stopper. The transparent conductive layer 192 may be made of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto.

[0116] like Figure 2 As shown, the first structure body ST1 may be disposed on the other surface of the substrate 101 except for the surface on which the flexible film 160 is disposed. Among the plurality of structure bodies ST, the first structure body ST1 may be disposed in the outermost region of the substrate 101.

[0117] refer to Figure 5 The first structure body ST1 includes a first layer ST1a and a second layer ST1b located on the first layer ST1a. The lower surface of the second layer ST1b may have a larger size than the upper surface of the first layer ST1a. Thus, the first structure body ST1 may be referred to as an undercut structure body (or undercut structure).

[0118] The first layer ST1a may be made of the same material as the insulating layer covering the upper portion of the plurality of transistors 110, and the second layer ST1b may be made of the same material as the anode 151. For example, the first layer ST1a may be made of the same material as the passivation layer 104. For example, the first layer ST1a may be made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The second layer ST1b may be made of the same material as the first anode 151a. For example, the second layer ST1b may have a structure in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of ITO are stacked. However, the present disclosure is not limited thereto.

[0119] Here, each of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may be separated relative to the first structure body ST1 disposed in the outermost region among the plurality of structure bodies ST (in other words, separated by the first structure body ST1). The first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed on the transparent conductive layer 192 may be separated from the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed on the first layer ST1a of the first structure body ST1, respectively.

[0120] refer to Figure 5 , the end of the substrate 101 may overlap with the end of the emission layer 152, the end of the first inorganic encapsulation layer 121, and the end of the second inorganic encapsulation layer 123. That is, the end of the substrate 101 may be arranged on the same plane (specifically, perpendicular to the plane of the substrate 101) as the end of the emission layer 152, the end of the first inorganic encapsulation layer 121, and the end of the second inorganic encapsulation layer 123.

[0121] In the following, reference will be made to Figure 6 A method of manufacturing an electroluminescent display device according to an exemplary embodiment of the present disclosure is described.

[0122] Figure 6 is a cross-sectional view for describing a method of manufacturing an electroluminescent display device according to an exemplary embodiment of the present disclosure. Figure 6 is a cross-sectional view of the other surfaces of the substrate 101 except for one surface on which the flexible film 160 is provided.

[0123] refer to Figure 6 , a plurality of structures ST may be provided in the non-display area NA. The plurality of structures ST may include a first structure ST1, a second structure ST2, a third structure ST3, and a fourth structure ST4. Here, in the manufacturing process of the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the first structure ST1 may be provided in plurality (in other words, a plurality of first structure bodies ST1 may be included). Figure 6 Three first structure bodies ST1 are shown. However, the number of the first structure bodies ST1 is not limited thereto.

[0124] refer to Figure 6 The grinder (or grinder) GR disposed outside the substrate 101 can grind (or grind) the side surface of the substrate 101 while rotating around the rotation axis. The grinder GR can grind the substrate 101 and the plurality of first structure bodies ST1 on the substrate 101 to the same size as the electroluminescent display device 100.

[0125] After the grinding process is completed, the end of the emission layer 152 and the ends of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed on the first structure body ST1 may be disposed (or located) on the same plane as the end of the substrate 101. Figure 5 shown.

[0126] For organic light-emitting display devices, organic light-emitting diodes are mainly made of organic materials and are thus very susceptible to moisture or oxygen. As a result, it is necessary to provide an encapsulation layer for protecting the organic light-emitting diodes. Therefore, there are limitations in reducing the size of the border area. For example, in the process of grinding the substrate to the same size as the display device, the substrate is ground from the outside of the inorganic layer to suppress the appearance and expansion of cracks in the inorganic layer. That is, in order not to grind the inorganic layer during the grinding process, the grinding process can be performed outside the ends of the first inorganic encapsulation layer and the second inorganic encapsulation layer provided on the substrate. In this case, the machining allowance of the first inorganic encapsulation layer and the second inorganic encapsulation layer needs to be considered. Therefore, after the grinding process, the size of the border area of ​​the display device may increase. In this case, when a spliced ​​display device is manufactured by using a plurality of display devices, the user can visibly identify the boundaries between the plurality of display devices.

[0127] Thus, during the grinding process, the first inorganic encapsulation layer and the second inorganic encapsulation layer disposed on the substrate may be ground together with the substrate in consideration of the processing allowance. However, inorganic materials are very sensitive to external impacts. Therefore, during the grinding process, cracks may occur in the first inorganic encapsulation layer and the second inorganic encapsulation layer. The cracks may extend to the display area as well as the non-display area. When cracks occur in the first inorganic encapsulation layer and the second inorganic encapsulation layer, moisture and oxygen may penetrate into the display device.

[0128] Thus, in the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the first structure body ST1 is disposed in the non-display area NA to separate the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 in the non-display area NA. Figure 5As described above, each of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 can be separated relative to the first structural body ST1. That is, during the manufacturing process of the display device, each of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 can be disconnected by the undercut shape of the first structural body ST1. Therefore, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 can be ground together with the substrate 101 during the grinding process to minimize the size of the border area. Thus, even when cracks appear in the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed adjacent to the end of the substrate 101, the cracks will not extend to the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed adjacent to the display area AA than the first structural body ST1. Therefore, in the electroluminescent display device 100 according to an exemplary embodiment of the present disclosure, the penetration of moisture and oxygen into the electroluminescent display device 100 can be minimized.

[0129] In addition, in the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are ground together with the substrate 101. Thus, the size of the frame area of ​​the electroluminescent display device 100 can be designed without taking into account the processing margin of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123. Therefore, during the process of grinding the outer area of ​​the electroluminescent display device 100, the size of the frame area can be minimized. Thus, a more comfortable margin can be obtained. Therefore, the size of the non-display area NA can be reduced, and a narrow frame can be achieved.

[0130] In addition, in the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the anode 151 includes a first anode 151a and a second anode 151b. Since the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure is a top-emitting electroluminescent display device, the anode 151 needs to contain a material with high reflectivity. Thus, the anode 151 may include a second anode 151b, in which a layer made of indium tin oxide (ITO), a layer made of silver (Ag) or an Ag alloy, and a layer made of ITO are stacked. However, silver (Ag) may be easily etched by an etchant used to etch other components other than the second anode 151b. Therefore, when the multiple structures ST are formed by using the second anode 151b, the undercut shape of the multiple structures ST may be lost during the manufacturing process of the display device. Thus, in the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the anode 151 includes a first anode 151a, and the first anode 151a has a structure in which a layer made of indium tin oxide (ITO), a layer made of molybdenum titanium (MoTi) alloy, and a layer made of ITO are stacked. In addition, each of the first structure body ST1, the second structure body ST2, and the fourth structure body ST4 may include a layer made of the same material as the first anode 151a. Therefore, in the electroluminescent display device 100 according to the exemplary embodiment of the present disclosure, the reflectivity of the anode 151 can be maintained, and the undercut shape of the plurality of structures ST can also be maintained.

[0131] In addition, in the electroluminescent display device 100 according to an exemplary embodiment of the present disclosure, the second anode 151b with high reflectivity and high conductivity is stacked on the first anode 151a in the display area AA. Thus, the resistance of the anode 151 in the display area AA can be reduced, and the conductivity can be improved. Compared with other metal materials, the MoTi alloy as the material of the first anode 151a can have lower reflectivity and lower conductivity. Thus, the second anode 151b made of a material with high reflectivity and high conductivity (such as an Ag alloy) is stacked in the display area AA. Therefore, the resistance of the anode 151 in the display area AA can be reduced, and the conductivity can be improved.

[0132] Figure 7 is a cross-sectional view of an electroluminescent display device according to another exemplary embodiment of the present disclosure. Figure 7 1 is a cross-sectional view of the other surfaces of the substrate 101 except for one surface on which the flexible film 160 is provided. In addition to the crack detection unit PCD, the plurality of inorganic layers L, the transparent conductive layer 792, the first inorganic encapsulation layer 721, the second inorganic encapsulation layer 723, and the added dummy structure (Dummy structure) DST, Figure 7The electroluminescent display device 700 shown is substantially the same as Figures 1 to 6 The electroluminescent display device 100 shown is the same. Therefore, a redundant description thereof will be omitted.

[0133] refer to Figure 7 , the crack detection unit PCD may be disposed on the substrate 101 and outside the fourth structure body ST4.

[0134] The crack detection unit PCD may be disposed below the first structure body ST1 and the dummy structure body DST to overlap the first structure body ST1 and the dummy structure body DST. Here, an end of the crack detection unit PCD may overlap an end of the substrate 101 .

[0135] A plurality of inorganic layers L may be disposed on the crack detection unit PCD. The plurality of inorganic layers L may be disposed in a region overlapping with the first structure body ST1 to cover a side surface and an upper surface of the crack detection unit PCD.

[0136] The plurality of inorganic layers L may be disposed in an area overlapping with the dummy structure DST to cover the upper surface of the crack detection unit PCD and one side surface of the crack detection unit PCD. Here, the ends (in other words, the end surfaces) of the plurality of inorganic layers L may be disposed to overlap with (in other words, be flush with) the other side surface of the crack detection unit PCD. For example, the ends of the plurality of inorganic layers L may overlap with the ends of the crack detection unit PCD and the ends of the substrate 101.

[0137] The transparent conductive layer 792 may be disposed on the substrate 101 , between the plurality of inorganic layers L and the first structure body ST1 , and between the plurality of inorganic layers L and the dummy structure body DST.

[0138] The transparent conductive layer 792 may be disposed in a region overlapping the first structure body ST1 to surround the upper and side surfaces of the plurality of inorganic layers L disposed on the crack detection unit PCD. In addition, the transparent conductive layer 792 may be disposed to contact the upper surface of the substrate 101 .

[0139] In addition, the transparent conductive layer 792 may be provided in the region overlapping with the dummy structure DST to surround the upper surface and one side surface of the plurality of inorganic layers L provided on the crack detection unit PCD. In addition, the transparent conductive layer 792 may be provided to contact with the upper surface of the substrate 101. Here, the end of the transparent conductive layer 792 may overlap with the end of the plurality of inorganic layers L and the end of the crack detection unit PCD.

[0140] like Figure 7As shown, the dummy structure DST may be disposed on other surfaces of the substrate 101 except for one surface on which the flexible film 160 is disposed. In addition, the dummy structure DST may be closer to the outermost region of the substrate 101 than the first structure ST1.

[0141] Meanwhile, the dummy structure DST may have a shape corresponding to a portion of the first structure ST1. For example, the dummy structure DST may have the same shape as the first structure ST1 from which a portion of the outer region adjacent to the substrate 101 has been removed. That is, the dummy structure DST may be the same as the first structure ST1 remaining after the process of grinding the substrate 101 to the same size as the electroluminescent display device 700.

[0142] refer to Figure 7 , the dummy structure body DST may include a first layer DSTa and a second layer DSTb located on the first layer DSTa. In addition, a lower surface of the second layer DSTb may have a larger size than an upper surface of the first layer DSTa.

[0143] The first layer DSTa of the dummy structure DST may be made of the same material as the insulating layer covering the upper portion of the plurality of transistors 110, and the second layer DSTb may be made of the same material as the anode 151. For example, the first layer DSTa of the dummy structure DST may be made of the same material as the passivation layer 104. For example, the first layer DSTa may be made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The second layer DSTb may be made of the same material as the first anode 151a. For example, the second layer DSTb may have a structure in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of ITO are stacked. However, the present disclosure is not limited thereto.

[0144] refer to Figure 7 , each of the first inorganic encapsulating layer 721 and the second inorganic encapsulating layer 723 may be separated with respect to the first structure body ST1 and the dummy structure body DST.

[0145] refer to Figure 7 , the end of the substrate 101 may overlap with the end of the crack detection unit PCD, the ends of the multiple inorganic layers L, the end of the transparent conductive layer 792, the end of the emission layer 152, the end of the first inorganic encapsulation layer 721, the end of the second inorganic encapsulation layer 723, and the end of the dummy structure DST.

[0146] In the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, the first structure body ST1 is disposed in the non-display area NA. Thus, each of the first inorganic encapsulation layer 721 and the second inorganic encapsulation layer 723 can be disconnected by the undercut shape of the first structure body ST1. Therefore, the penetration of moisture and oxygen into the electroluminescent display device 700 can be minimized.

[0147] In addition, in the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, the first inorganic encapsulation layer 721 and the second inorganic encapsulation layer 723 are ground together with the substrate 101. Therefore, the size of the non-display area NA can be reduced, and a narrow frame can be achieved.

[0148] Furthermore, in the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, the anode 151 includes the first anode 151a and the second anode 151b. Therefore, the reflectivity of the anode 151 can be maintained, and the undercut shape of the plurality of structures ST can also be maintained.

[0149] In addition, in the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, the second anode 151b having high reflectivity and high conductivity is stacked on the first anode 151a in the display area AA. Therefore, the resistance of the anode 151 in the display area AA can be reduced, and the conductivity can be improved.

[0150] In addition, in the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, the dummy structure DST is set to have a shape corresponding to a portion of the first structure ST1. The dummy structure DST may be the same as the first structure ST1 remaining after the process of grinding the substrate 101 to the same size as the electroluminescent display device 700. Thus, each of the first inorganic encapsulation layer 721 and the second inorganic encapsulation layer 723 separated from the first structure ST1 may be further separated from the dummy structure DST. Therefore, even when the first inorganic encapsulation layer 721 and the second inorganic encapsulation layer 723 are ground together with the substrate 101 during the grinding process, cracks occurring in the first inorganic encapsulation layer 721 and the second inorganic encapsulation layer 723 can be effectively suppressed from extending to the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 disposed adjacent to the display area AA. Therefore, in the electroluminescent display device 700 according to another exemplary embodiment of the present disclosure, moisture and oxygen can be effectively suppressed from penetrating into the electroluminescent display device 700.

[0151] Exemplary embodiments of the present disclosure may also be described as follows:

[0152] According to one aspect of the present disclosure, an electroluminescent display device is provided. The electroluminescent display device includes: a substrate including (or containing) a display area and a non-display area surrounding the display area; a plurality of transistors arranged on the substrate in the display area; a light-emitting diode connected to the plurality of transistors and including an anode, an emission layer and a cathode; an encapsulation layer arranged on the light-emitting diode and including a first inorganic encapsulation layer, an organic encapsulation layer arranged on the first inorganic encapsulation layer, and a second inorganic encapsulation layer arranged on the organic encapsulation layer; and a plurality of structures arranged on the substrate in the non-display area. The plurality of structures are configured to inhibit the expansion of cracks or the penetration of moisture and oxygen from the outside of the electroluminescent display device.

[0153] Each of the first inorganic encapsulating layer and the second inorganic encapsulating layer may be separated with respect to a first structure body disposed in an outermost region of the substrate among the plurality of structure bodies.

[0154] An end portion of the substrate may overlap an end portion of the emission layer, an end portion of the first inorganic encapsulation layer, and an end portion of the second inorganic encapsulation layer.

[0155] The first structure body may include a first layer and a second layer disposed on the first layer, and a lower surface of the second layer may have a larger size than an upper surface of the first layer.

[0156] The electroluminescent display device may further include an insulating layer disposed on the substrate and covering upper portions of the plurality of transistors. The first layer may be made of the same material as the insulating layer, and the second layer may be made of the same material as the anode.

[0157] The anode may include a first anode, in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of indium tin oxide (ITO) are stacked, and a second anode is provided on the first anode, and in which a layer made of indium tin oxide (ITO), a layer made of silver (Ag) or a silver alloy, and a layer made of indium tin oxide (ITO) are stacked. The second layer may be made of the same material as the first anode.

[0158] The electroluminescent display device may further include a dummy structure body provided to overlap with an end portion of the substrate, wherein the dummy structure body may have a shape corresponding to a portion of the first structure body.

[0159] The plurality of structures may include a second structure, a third structure disposed outside the second structure, and a fourth structure disposed between the third structure and the first structure. The second structure may be configured to be the same as the fourth structure. The third structure may have a greater height than the second structure and the fourth structure (and thus may be used as a dam to suppress overflow of the organic encapsulation layer).

[0160] The second structure body, the third structure body, and the fourth structure body may be disposed in the non-display area to surround the display area.

[0161] The second structure body, the third structure body, and the fourth structure body may be provided in a closed loop shape.

[0162] The second structure body and the fourth structure body may be configured to suppress penetration of moisture and oxygen from outside the electroluminescent display device.

[0163] The first and second inorganic encapsulating layers may be provided to surround surfaces of the first and fourth structure bodies.

[0164] Each of the second and fourth structure bodies may have an undercut shape, and the emission layer may be disconnected by the undercut shape of each of the second and fourth structure bodies.

[0165] The electroluminescent display device may further include a passivation layer disposed on the substrate and covering the upper portions of the plurality of transistors. The electroluminescent display device may further include a planarization layer disposed on the passivation layer to planarize the upper portion of the passivation layer. The electroluminescent display device may further include a bank disposed on the planarization layer and the anode. Each of the second structure body and the fourth structure body may have a structure in which the same material as the passivation layer and the same material as the anode are stacked. The third structure body may have a structure in which the same material as the passivation layer, the same material as the planarization layer, and the same material as the bank are stacked.

[0166] The anode may include a first anode in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of indium tin oxide (ITO) are stacked, and a second anode is provided on the first anode, and in which a layer made of indium tin oxide (ITO), a layer made of silver (Ag) or a silver alloy, and a layer made of indium tin oxide (ITO) are stacked. Each of the second structure body and the fourth structure body may have a structure in which the same material as the passivation layer and the same material as the first anode are stacked.

[0167] The planarization layer may include a first planarization layer and a second planarization layer arranged on the first planarization layer, and the third structure has a structure in which a first layer made of the same material as the passivation layer, a second layer made of the same material as the first planarization layer, a third layer made of the same material as the second planarization layer, and a fourth layer made of the same material as the embankment are stacked.

[0168] The third structure body may have an inverted tapered shape, and a lower surface of a second layer of the third structure body may have a larger size than an upper surface of a first layer of the third structure body.

[0169] The organic encapsulating layer may be disposed on an inner side of the third structure body, and the second inorganic encapsulating layer may be in contact with the first inorganic encapsulating layer on an outer side of the third structure body.

[0170] The second structure body may be disposed below the organic encapsulation layer. An end portion of the organic encapsulation layer may be disposed to overlap with the third structure body.

[0171] Each of the first inorganic encapsulating layer and the second inorganic encapsulating layer may be continuously provided to cover surfaces of the second structure body, the third structure body, and the fourth structure body.

[0172] The electroluminescent display device may further include a flexible film bonded (or adhered) to one surface of the substrate. The first structure may be provided on other surfaces of the substrate except for the one surface on which the flexible film is provided.

[0173] The electroluminescent display device may further include a crack detection unit disposed below the first structure body to overlap the first structure body.

[0174] The electroluminescent display device may further include a plurality of inorganic layers disposed on the substrate between the crack detection unit and the first structural body. The plurality of inorganic layers may be disposed to cover a side surface and an upper surface of the crack detection unit.

[0175] The plurality of inorganic layers may be made of the same material as an inorganic insulating layer disposed in the display area.

[0176] The electroluminescent display device may further include a transparent conductive layer disposed on the substrate and between the plurality of inorganic layers and the first structure. The transparent conductive layer may be disposed to surround the upper surface and side surfaces of the plurality of inorganic layers and to contact the upper surface of the substrate.

[0177] The electroluminescent display device may further include a plurality of pads disposed on one surface of the substrate and outside the plurality of structures, and a pad protection layer disposed to surround the plurality of pads and made of the same material as the transparent conductive layer.

[0178] The electroluminescent display device may further include a crack detection unit disposed below the first structure body and the dummy structure body to overlap with the first structure body and the dummy structure body.

[0179] The electroluminescent display device may further include a plurality of inorganic layers disposed on the crack detection unit. The plurality of inorganic layers may be disposed in a region overlapping with the first structure to cover the side surface and the upper surface of the crack detection unit, and may be disposed in a region overlapping with the dummy structure to cover the upper surface of the crack detection unit and one side surface of the crack detection unit.

[0180] The electroluminescent display device may further include a transparent conductive layer disposed on the substrate, between the plurality of inorganic layers and the first structure, and between the plurality of inorganic layers and the dummy structure. The transparent conductive layer may be disposed in a region overlapping with the first structure to surround the upper surface and side surfaces of the plurality of inorganic layers disposed on the crack detection unit, and be disposed to contact the upper surface of the substrate. The transparent conductive layer may be disposed in a region overlapping with the dummy structure to surround the upper surface and one side surface of the plurality of inorganic layers disposed on the crack detection unit, and may be disposed to contact the upper surface of the substrate.

[0181] The dummy structure may be disposed on a surface of the substrate other than the one surface on which the flexible film is disposed. The dummy structure may be disposed closer to an outermost region of the substrate than the first structure.

[0182] According to another aspect of the present disclosure, an electroluminescent display device is provided. The electroluminescent display device includes a substrate, the substrate including a display area and a non-display area surrounding the display area. The electroluminescent display device includes a plurality of transistors arranged on the substrate in the display area. The electroluminescent display device includes a light-emitting diode, which is connected to the plurality of transistors and includes an anode, an emission layer, and a cathode. The electroluminescent display device includes an encapsulation layer, which is arranged on the light-emitting diode and includes a first inorganic encapsulation layer, an organic encapsulation layer arranged on the first inorganic encapsulation layer, and a second inorganic encapsulation layer arranged on the organic encapsulation layer. The electroluminescent display device includes a first structural body arranged in the non-display area and in the outermost area of ​​the substrate. Each of the first inorganic encapsulation layer and the second inorganic encapsulation layer is separated relative to the first structural body.

[0183] The first structure may be configured as an undercut structure.

[0184] An end portion of the substrate may be disposed on the same plane as an end portion of the emission layer, an end portion of the first inorganic encapsulating layer, and an end portion of the second inorganic encapsulating layer.

[0185] The electroluminescent display device may further include other structures disposed closer to the display area than the first structures in the non-display area, the first structures and the other structures together forming a plurality of structures. Each of the first inorganic encapsulation layer and the second inorganic encapsulation layer may be continuously disposed to cover a surface of the other structures.

[0186] The other structure may include a dam portion surrounding the organic encapsulation layer, and a structure disposed inside and outside the dam portion and having an upper surface having a larger size than a lower surface.

[0187] The other structures may include a second structure, a third structure disposed outside the second structure, and a fourth structure disposed between the third structure and the first structure. The second structure may be configured to be the same as the fourth structure. The third structure may have a greater height than the second structure and the fourth structure.

[0188] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be embodied or implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the following claims, and all technical concepts in their equivalent ranges should be interpreted as falling within the scope of the present disclosure.

Claims

1. An electroluminescent display device, comprising: A substrate comprising a display area and a non-display area surrounding the display area; a plurality of transistors disposed on the substrate and in the display area; a light emitting diode connected to the plurality of transistors and comprising an anode, an emission layer and a cathode; an encapsulation layer disposed on the light emitting diode and comprising a first inorganic encapsulation layer, an organic encapsulation layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer disposed on the organic encapsulation layer; and A plurality of structures are disposed on the substrate and in the non-display area, The plurality of structures are configured to suppress the expansion of cracks or the penetration of moisture and oxygen from the outside of the electroluminescent display device.

2. The electroluminescent display device according to claim 1, wherein: Each of the first inorganic encapsulating layer and the second inorganic encapsulating layer is separated with respect to a first structure body disposed in an outermost region of the substrate among the plurality of structure bodies.

3. The electroluminescent display device according to claim 1, wherein: An end portion of the substrate overlaps an end portion of the emission layer, an end portion of the first inorganic encapsulation layer, and an end portion of the second inorganic encapsulation layer.

4. The electroluminescent display device according to claim 2, wherein: The first structure includes a first layer and a second layer disposed on the first layer, and The lower surface of the second layer has a larger dimension than the upper surface of the first layer.

5. The electroluminescent display device according to claim 4, further comprising: an insulating layer disposed on the substrate and covering upper portions of the plurality of transistors, The first layer is made of the same material as the insulating layer, and the second layer is made of the same material as the anode.

6. The electroluminescent display device according to claim 5, wherein: The anode includes a first anode in which a layer made of indium tin oxide (ITO), a layer made of a molybdenum titanium (MoTi) alloy, and a layer made of indium tin oxide (ITO) are stacked, and a second anode is provided on the first anode and in which a layer made of indium tin oxide (ITO), a layer made of silver (Ag) or a silver alloy, and a layer made of indium tin oxide (ITO) are stacked, and The second layer is made of the same material as the first anode.

7. The electroluminescent display device according to claim 2, further comprising: a dummy structure, which is arranged to overlap with the end of the substrate, The dummy structure has a shape corresponding to a portion of the first structure.

8. The electroluminescent display device according to claim 2, wherein: The plurality of structures include a second structure, a third structure disposed outside the second structure, and a fourth structure disposed between the third structure and the first structure. The second structure body is configured the same as the fourth structure body, and The third structure body has a greater height than the second structure body and the fourth structure body.

9. The electroluminescent display device according to claim 8, wherein: The second structure body, the third structure body, and the fourth structure body are disposed in the non-display area to surround the display area.

10. The electroluminescent display device according to claim 9, wherein: The second structure body, the third structure body, and the fourth structure body are arranged in a closed loop shape.

11. The electroluminescent display device according to claim 8, wherein: Each of the second structure body and the fourth structure body has an undercut shape.

12. The electroluminescent display device according to claim 8, further comprising: a passivation layer disposed on the substrate and covering upper portions of the plurality of transistors; a planarization layer disposed on the passivation layer to planarize an upper portion of the passivation layer; as well as A bank portion provided on the planarization layer and the anode, wherein each of the second structure body and the fourth structure body has a structure in which the same material as the passivation layer and the same material as the anode are stacked, and The third structure body has a structure in which the same material as the passivation layer, the same material as the planarization layer, and the same material as the bank are stacked.

13. The electroluminescent display device according to claim 12, wherein: The planarization layer includes a first planarization layer and a second planarization layer arranged on the first planarization layer, and the third structure has a structure in which a first layer made of the same material as the passivation layer, a second layer made of the same material as the first planarization layer, a third layer made of the same material as the second planarization layer, and a fourth layer made of the same material as the embankment are stacked.

14. The electroluminescent display device according to claim 13, wherein: The third structure body has an inverted tapered shape, and a lower surface of a second layer of the third structure body has a larger size than an upper surface of a first layer of the third structure body.

15. The electroluminescent display device according to claim 8, wherein: The organic encapsulating layer is disposed inside the third structure body, and the second inorganic encapsulating layer is in contact with the first inorganic encapsulating layer outside the third structure body.

16. The electroluminescent display device according to claim 8, wherein: The second structure is disposed below the organic encapsulation layer, and An end portion of the organic encapsulation layer is disposed to overlap with the third structure body.

17. The electroluminescent display device according to claim 8, wherein: Each of the first inorganic encapsulating layer and the second inorganic encapsulating layer is continuously provided to cover surfaces of the second structure body, the third structure body, and the fourth structure body.

18. The electroluminescent display device according to claim 2, further comprising: a flexible film bonded to one surface of the substrate, The first structure is disposed on other surfaces of the substrate except the one surface on which the flexible film is disposed.

19. The electroluminescent display device according to claim 2, further comprising: A crack detection unit is provided below the first structure so as to overlap with the first structure.

20. The electroluminescent display device according to claim 19, further comprising: a plurality of inorganic layers disposed on the substrate and between the crack detection unit and the first structure; The plurality of inorganic layers are arranged to cover the side surface and the upper surface of the crack detection unit.

21. The electroluminescent display device according to claim 20, wherein: The plurality of inorganic layers are made of the same material as an inorganic insulating layer disposed in the display area.

22. The electroluminescent display device according to claim 20, further comprising: A transparent conductive layer is provided on the substrate and between the plurality of inorganic layers and the first structure. The transparent conductive layer is disposed to surround the upper surface and the side surfaces of the plurality of inorganic layers, and is disposed to contact the upper surface of the substrate.

23. The electroluminescent display device according to claim 22, further comprising: a plurality of pads disposed on one surface of the substrate and outside the plurality of structures; as well as A pad protection layer is provided to surround the plurality of pads and is made of the same material as the transparent conductive layer.

24. The electroluminescent display device according to claim 7, further comprising: A crack detection unit is provided below the first structure body and the dummy structure body so as to overlap with the first structure body and the dummy structure body.

25. The electroluminescent display device according to claim 24, further comprising: a plurality of inorganic layers disposed on the crack detection unit, The plurality of inorganic layers are arranged in an area overlapping with the first structure to cover the side surface and the upper surface of the crack detection unit, and are arranged in an area overlapping with the dummy structure to cover the upper surface of the crack detection unit and one side surface of the crack detection unit.

26. The electroluminescent display device according to claim 7, wherein: The dummy structure is disposed on a surface of the substrate other than the one surface on which the flexible film is disposed, and / or the dummy structure is disposed closer to an outermost region of the substrate than the first structure.

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