Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, the display panel is provided with a display area and a non-display area, and the display panel comprises a substrate; the pixel defining layer is arranged on one side of the substrate, the pixel defining layer comprises a pixel limiting part and a pixel opening which is defined by the pixel limiting part and located in the display area, and the pixel limiting part has a first thickness; the isolation structure is arranged on one side of the substrate and encloses to form an isolation opening communicated with the pixel opening; the light-emitting device is located in the display area and arranged in the pixel opening and the isolation opening; the alignment mark is located in the non-display area and arranged on one side of the substrate; the protection structure covers the side, away from the substrate, of the alignment mark, the protection structure has a second thickness, and the difference value between the second thickness and the first thickness is smaller than or equal to 2000 angstroms. The display panel provided by the embodiment of the invention has relatively good structural reliability.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the structural reliability of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, the display panel having a display area and a non-display area, the display panel comprising: a substrate; a pixel definition layer, arranged on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening located in the display area formed by the pixel defining portion, the pixel defining portion having a first thickness; an isolation structure, arranged on one side of the substrate and enclosing an isolation opening connected to the pixel opening; a light-emitting device, located in the display area and arranged in the pixel opening and the isolation opening; an alignment mark, located in the non-display area and arranged on one side of the substrate; a protective structure, covering the side of the alignment mark facing away from the substrate, the protective structure having a second thickness, and the difference between the second thickness and the first thickness is less than or equal to 2000 angstroms.

[0006] According to an implementation of the first aspect of the present application, the first thickness is the maximum thickness of the pixel defining portion, and the second thickness is the maximum thickness of the protective structure, or the first thickness is the average thickness of the pixel defining portion, and the second thickness is the average thickness of the protective structure.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a first opening and a second opening, the light-emitting device includes a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the light-emitting colors of the first type of device and the second type of device are different, the pixel defining portion includes a first defining portion exposed from the first opening and a second defining portion exposed from the second opening, the first defining portion has a first sub-thickness, and the second thickness is less than or equal to the first sub-thickness.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the second thickness and the first sub-thickness is less than or equal to 2000 angstroms.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, and the second thickness is the average thickness of the protective structure.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the second limiting portion has a second sub-thickness, the second sub-thickness is less than or equal to the first sub-thickness, and / or the second sub-thickness is greater than or equal to the second thickness.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-thickness is the maximum thickness of the first defining portion, the second sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, the second sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the average thickness of the protective structure.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening also includes a third opening, the light-emitting device includes a third type of device arranged corresponding to the third opening, the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the pixel defining portion includes a third defining portion exposed from the third opening, the third defining portion has a third sub-thickness, the first sub-thickness is equal to the third sub-thickness, and / or the second thickness is less than or equal to the third sub-thickness.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the difference between the second thickness and the third sub-thickness is less than or equal to 2000 angstroms.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-thickness is the maximum thickness of the first defining portion, the third sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, the third sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the average thickness of the protective structure.

[0015] According to any of the aforementioned implementations of the first aspect of the present application, the second limiting portion has a second sub-thickness, and the second sub-thickness is less than or equal to the third sub-thickness.

[0016] According to any of the aforementioned implementations of the first aspect of the present application, the protection structure and the pixel defining portion are provided in the same layer and with the same material.

[0017] According to any of the aforementioned implementations of the first aspect of the present application, the protective structure also covers the side wall of the alignment mark.

[0018] An embodiment of the first aspect of the present application also provides a display panel, the display panel having a display area and a non-display area, the display panel comprising: a substrate; a pixel definition layer, arranged on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening located in the display area formed by enclosing the pixel defining portion, the pixel defining portion having a first thickness; an isolation structure, arranged on one side of the substrate and enclosing an isolation opening connected to the pixel opening; a light-emitting device, located in the display area and arranged in the pixel opening and the isolation opening; an alignment mark, located in the non-display area and arranged on one side of the substrate; a protective structure, covering the side of the alignment mark away from the substrate and arranged in the same layer and material as the pixel defining portion, the protective structure having a second thickness, and the second thickness is equal to the first thickness.

[0019] An embodiment of a second aspect of the present application provides a method for preparing a display panel, wherein the display panel has a display area and a non-display area, and the preparation method includes:

[0020] forming a substrate and an alignment mark located in a non-display area and disposed on one side of the substrate;

[0021] An isolation material layer is formed on the substrate, wherein the isolation material layer is located in the display area and the non-display area, and a portion of the isolation material layer is located on a side of the alignment mark away from the substrate;

[0022] The isolation material layer is patterned to form a first opening and a second opening located in the display area, and a first type of device corresponding to the first opening and a second type of device corresponding to the second opening are prepared, and the first type of device and the second type of device have different luminous colors;

[0023] The isolation material layer is patterned to remove a portion of the isolation material layer located on a side of the alignment mark facing away from the substrate.

[0024] According to an implementation of the second aspect of the present application, the step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate further includes:

[0025] The isolation material layer is patterned to form a third opening located in the display area.

[0026] According to any of the aforementioned implementations of the second aspect of the present application, after the step of patterning the isolation material layer to remove a portion of the isolation material layer located on the side of the alignment mark away from the substrate, the step further includes:

[0027] A third type of device corresponding to the third opening is prepared, and the luminous colors of the first type of device, the second type of device and the third type of device are different from each other.

[0028] According to any of the aforementioned implementations of the second aspect of the present application, before the step of forming the isolation material layer on the substrate, the step includes:

[0029] Forming a pixel definition material layer on the substrate, the pixel definition material layer is located in the display area and the non-display area, and the pixel definition material layer covers the side of the alignment mark away from the substrate;

[0030] The step of forming an isolation material layer on the substrate includes:

[0031] forming an isolation material layer on the pixel definition material layer;

[0032] After the step of patterning the isolation material layer to remove a portion of the isolation material layer located on the side of the alignment mark facing away from the substrate, the step further includes:

[0033] The pixel definition material layer is patterned to form a protection structure covering the side of the alignment mark facing away from the substrate.

[0034] According to any of the aforementioned implementations of the second aspect of the present application, after the step of patterning the isolation material layer to form the first opening and the second opening located in the display area, the method further includes:

[0035] The pixel definition material layer is patterned to form a pixel opening communicating with the first opening and the second opening.

[0036] According to any of the aforementioned implementations of the second aspect of the present application, the preparation method further includes: patterning the isolation material layer to form a third opening located in the display area;

[0037] After the step of patterning the pixel definition material layer to form a protection structure covering the side of the alignment mark facing away from the substrate:

[0038] A third type of device corresponding to the third opening is prepared, and the luminous colors of the first type of device, the second type of device and the third type of device are different from each other.

[0039] According to any of the aforementioned implementations of the second aspect of the present application, after the step of patterning the isolation material layer to form a third opening located in the display area, the method further includes:

[0040] The pixel definition material layer is patterned to form a pixel opening communicating with the third opening.

[0041] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the pixel definition material layer to form a protective structure covering the side of the alignment mark facing away from the substrate is located in the step of patterning the pixel definition material layer to form a pixel opening connected to the third opening.

[0042] According to any of the aforementioned implementations of the second aspect of the present application, after the step of patterning the isolation material layer to form a first opening located in the display area, the method includes:

[0043] performing patterning on the pixel definition material layer to form a pixel opening communicating with the first opening;

[0044] After the step of patterning the isolation material layer to form a second opening located in the display area, the method further comprises:

[0045] The pixel definition material layer is patterned to form a pixel opening communicating with the second opening.

[0046] According to any of the aforementioned implementations of the second aspect of the present application, the step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate further includes:

[0047] Performing patterning on the isolation material layer to form a third opening located in the display area;

[0048] The step of patterning the pixel definition material layer to form a protection structure covering the side of the alignment mark facing away from the substrate also includes:

[0049] The pixel definition material layer is patterned to form a pixel opening communicating with the third opening.

[0050] An embodiment of the third aspect of the present application provides a display device, including a display panel according to any of the above embodiments, or a display panel prepared by a preparation method according to any of the above embodiments.

[0051] In a display panel provided in an embodiment of the present application, the display panel has a display area and a non-display area, and the display panel includes a substrate, a pixel definition layer, an isolation structure, a light-emitting device, an alignment mark, and a protection structure. The pixel definition layer is arranged on one side of the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening located in the display area formed by the pixel defining portion, the isolation structure is arranged on one side of the substrate and encloses an isolation opening connected to the pixel opening, the light-emitting device is located in the display area and is arranged in the pixel opening and the isolation opening, and both the pixel definition layer and the isolation structure can be used by the user to divide the sub-pixels of the display panel.

[0052] The alignment mark is located in the non-display area and is arranged on one side of the substrate. During the preparation of the display panel, the arrangement of the alignment mark can facilitate the alignment of the display panel. By arranging a protective structure on the side of the alignment mark away from the substrate, during the preparation of the display panel, the protective structure provides protection for the alignment mark, making the alignment mark less likely to be damaged, thereby better improving the structural reliability of the alignment mark.

[0053] The pixel defining portion has a first thickness, and the protective structure has a second thickness. By setting the difference between the second thickness and the first thickness to be less than or equal to 2000 angstroms, the protective structure can have a more appropriate thickness to enhance the protective effect of the protective structure on the alignment mark, and the setting of the protective structure is not easy to interfere with the identification of the alignment mark during the display panel preparation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0055] Figure 1 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0056] Figure 2 is a partial schematic diagram of an isolation structure provided in an embodiment of the present application;

[0057] Figure 3 It is a partial schematic diagram of a positioning mark provided in an embodiment of the present application;

[0058] Figure 4 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0059] Figure 5 is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0060] Figure 6 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0061] Figures 7 to 22 It is a schematic diagram of the preparation process of a method for preparing a display panel provided in an embodiment of the present application.

[0062] Description of reference numerals:

[0063] 10. display panel; 11. pixel definition material layer; 12. isolation material layer; 12a. first isolation material layer; 12b. second isolation material layer; 12c. third isolation material layer;

[0064] 100, substrate; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, driving circuit; 151, transistor; 151a, gate; 151b, source and drain; 152, storage capacitor; 152a, first plate; 152b, second plate; 160, planarization layer;

[0065] 200, pixel definition layer; 210, pixel defining portion; 211, first defining portion; 212, second defining portion; 213, third defining portion; 220, pixel opening

[0066] 300, isolation structure; 301, isolation opening; 301a, first opening; 301b, second opening; 301c, third opening; 310, first isolation part; 320, second isolation part; 330, conductive part;

[0067] 400, light emitting device; 401, first type device; 402, second type device; 403, third type device; 410, first electrode; 420, light emitting unit; 430, second electrode;

[0068] 500, first packaging layer; 510, packaging unit;

[0069] M, alignment mark;

[0070] P, protection structure;

[0071] AA, display area;

[0072] NA, non-display area. DETAILED DESCRIPTION

[0073] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0074] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0075] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0076] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described below in conjunction with the accompanying drawings.

[0077] Figure 1 is a schematic structural diagram of a display panel 10 provided in an embodiment of the present application, Figure 2 is a partial schematic diagram of an isolation structure 300 provided in an embodiment of the present application, Figure 3 is a partial schematic diagram of a positioning mark provided in an embodiment of the present application. Figure 4 It is a partial cross-sectional view of a display panel 10 provided in an embodiment of the present application.

[0078] like Figures 1 to 4 As shown, an embodiment of the first aspect of the present application provides a display panel 10, the display panel 10 has a display area AA and a non-display area NA, and the display panel 10 includes: a substrate 100; a pixel definition layer 200, which is arranged on one side of the substrate 100, the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 located in the display area AA formed by the pixel defining portion 210, and the pixel defining portion 210 has a first thickness; an isolation structure 300, which is arranged on one side of the substrate 100 and encloses an isolation opening 301 connected to the pixel opening 220; a light-emitting device 400, which is located in the display area AA and is arranged in the pixel opening 220 and the isolation opening 301; an alignment mark M, which is located in the non-display area NA and is arranged on one side of the substrate 100; a protective structure P, which covers the side of the alignment mark M away from the substrate 100, and the protective structure P has a second thickness, and the difference between the second thickness and the first thickness is less than or equal to 2000 angstroms.

[0079] In a display panel 10 provided in an embodiment of the present application, the display panel 10 has a display area AA and a non-display area NA, and the display panel 10 includes a substrate 100, a pixel definition layer 200, an isolation structure 300, a light emitting device 400, an alignment mark M, and a protection structure P. The pixel definition layer 200 is disposed on one side of the substrate 100, and the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210 and located in the display area AA. The isolation structure 300 is disposed on one side of the substrate 100 and encloses an isolation opening 301 connected to the pixel opening 220. The light emitting device 400 is located in the display area AA and is disposed in the pixel opening 220 and the isolation opening 301. Both the pixel definition layer 200 and the isolation structure 300 can be used by the user to divide the sub-pixels of the display panel 10.

[0080] Regarding the relevant schemes of the isolation structure 300 (also called partition structure, etc.), the structure, materials and preparation methods are described in patents (applications) CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, etc., and their contents are incorporated into this application by reference for reference.

[0081] The alignment mark M is located in the non-display area NA and is disposed on one side of the substrate 100. During the preparation of the display panel 10, the arrangement of the alignment mark M can facilitate the alignment of the display panel 10. For example, during the preparation of the display panel 10, the preparation equipment can identify and confirm the position of the display panel 10 through the alignment mark M, so as to achieve the alignment of the preparation equipment to the display panel 10. Exemplarily, during the preparation of the display panel 10, the alignment mark M can be used to achieve the alignment of the mask.

[0082] Optionally, there may be a plurality of alignment marks M, and the plurality of alignment marks M may be arranged at intervals, so as to facilitate alignment of the display panel 10 during the preparation process of the display panel 10 .

[0083] By setting a protective structure P on the side of the alignment mark M away from the substrate 100, the protective structure P provides protection to the alignment mark M during the preparation of the display panel 10, making the alignment mark M less likely to be damaged, thereby improving the structural reliability of the alignment mark M.

[0084] Optionally, there may be a plurality of protection structures P, and a single protection structure P may cover a side of a single alignment mark M that is away from the substrate 100. The protection structures P may be arranged at intervals.

[0085] Optionally, the protection structure P also covers the side wall of the alignment mark M, so that the protection structure P can be better coated on the surface of the yield mark, thereby better improving the protection effect of the protection structure P on the positioning mark.

[0086] The pixel defining portion 210 has a first thickness, and the protective structure P has a second thickness. By setting the difference between the second thickness and the first thickness to be less than or equal to 2000 angstroms, the protective structure P can have a more suitable thickness to enhance the protective effect of the protective structure P on the alignment mark M, and the setting of the protective structure P is not easy to interfere with the identification of the alignment mark M during the preparation process of the display panel 10.

[0087] Exemplarily, by setting the difference between the second thickness and the first thickness to be less than or equal to 2000 angstroms, the protective structure P is less likely to have a smaller thickness, so that during the preparation process of the display panel 10, the protective structure P is less likely to be damaged, so that the protective structure P can better protect the alignment mark M, and the alignment mark M is less likely to be damaged, thereby better improving the structural reliability of the alignment mark M.

[0088] Moreover, by setting the difference between the second thickness and the first thickness to be less than or equal to 2000 angstroms, the protective structure P is less likely to have a larger thickness. Therefore, during the preparation process of the display panel 10, the setting of the protective structure P is less likely to interfere with the preparation equipment's recognition of the alignment mark M, thereby greatly improving the preparation efficiency of the display panel 10.

[0089] The second thickness may be greater than or equal to the first thickness, or the second thickness may be less than or equal to the first thickness. For ease of description, the following embodiments are described by taking the second thickness being less than or equal to the first thickness as an example.

[0090] In some embodiments of the present application, there are multiple ways to set the first thickness and the second thickness.

[0091] In some optional embodiments, the first thickness may be the maximum thickness of the pixel defining portion 210, and the second thickness may be the maximum thickness of the protective structure P; or, the first thickness may be the average thickness of the pixel defining portion 210, and the second thickness may be the average thickness of the protective structure P.

[0092] In some embodiments of the present application, there are multiple ways to set the substrate 100. The substrate 100 may include, for example, a substrate 110 and a driving circuit 150 disposed on the substrate 110. Optionally, the substrate 100 includes a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 that are stacked. Exemplarily, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and a driving signal line for connecting various devices. The transistor 151 may include a semiconductor, a gate 151a, and a source and drain 151b. The storage capacitor 152 includes a first plate 152a and a second plate 152b.

[0093] As an example, the gate 151a and the first electrode 152a can be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b can be located between the first insulating layer 120 and the second insulating layer 130, the source and drain 151b can be located between the second insulating layer 130 and the third insulating layer 140, and the give way mark can be located on the side of the third insulating layer 140 away from the substrate 110.

[0094] Optionally, the substrate 100 may further include a planarization layer 160, and the isolation structure 300, the pixel definition layer 200 and the light emitting device 400 may be at least partially located on a side of the planarization layer 160 away from the substrate 110. Optionally, the clearance mark and the protection structure P may be spaced apart from the planarization layer 160.

[0095] In some optional embodiments, in a direction away from the substrate 100 , the light emitting device 400 may include a first electrode 410 , a light emitting unit 420 , and a second electrode 430 stacked in sequence.

[0096] Optionally, the light-emitting unit 420 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0097] Optionally, the first electrode 410 and the second electrode 430 may be used as pixel electrodes of the display panel 10, one of the first electrode 410 and the second electrode 430 may be used as an anode, and the other may be used as a cathode to drive the light-emitting unit 420 to emit light. In the embodiment of the present application, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 430 is used as the cathode of the display panel 10 for illustration.

[0098] In some embodiments of the present application, the number of the isolation openings 301 and the pixel openings 220 may be multiple, and a single isolation opening 301 is connected to a single pixel opening 220 .

[0099] Optionally, both the isolation structure 300 and the pixel definition layer 200 may be mesh-shaped, and the hollowed-out areas in the mesh-shaped isolation structure 300 may form isolation openings 301 , and the hollowed-out areas in the mesh-shaped pixel definition layer 200 may form pixel openings 220 .

[0100] Optionally, there are multiple ways to set the relative position between the pixel defining portion 210 and the isolation structure 300. For example, the isolation structure 300 can be set on the side of the pixel defining portion 210 away from the substrate 100, that is, the isolation structure 300 can be directly set on the pixel defining portion 210. Or for example, the pixel defining portion 210 can be provided with a receiving groove (not shown in the figure), and at least part of the isolation structure 300 can be located in the receiving groove, so that the isolation structure 300 is not easy to have an excessive height compared to the substrate 100, thereby being able to better reduce the thickness of the display panel 10. For the convenience of description, the following embodiments are described by taking the isolation structure 300 being set on the side of the pixel defining portion 210 away from the substrate 100 as an example.

[0101] In some optional embodiments, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on a side of the first isolation portion 310 facing away from the substrate 100 . The second isolation portion 320 may be disposed protruding from the first isolation portion 310 toward the isolation opening 301 .

[0102] By setting the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 301, when preparing the light-emitting device 400 of the display panel 10, the material of the light-emitting device 400 (for example, the material of the light-emitting unit 420 and the material of the second electrode 430) can be directly vapor-deposited on the entire surface, and the second isolation portion 320 can block at least part of the material used to prepare the light-emitting device 400 to separate the material of the light-emitting device 400 between adjacent sub-pixels, so as to form a plurality of light-emitting devices 400 that are spaced apart and located in different isolation openings 301, so that when preparing the light-emitting device 400 of the display panel 10, there is no need to set a mask with high precision, for example, when vapor-depositing the material of the light-emitting device 400, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM), thereby effectively reducing the production and preparation cost of the display panel 10.

[0103] In some optional embodiments, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 may be connected to the isolation structure 300 , so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate control of the second electrodes 430 .

[0104] In some optional embodiments, the isolation structure 300 further includes a conductive portion 330 disposed on a side of the first isolation portion 310 facing the substrate 100 , and the conductive portion 330 is disposed protruding from the first isolation portion 310 toward the isolation opening 301 .

[0105] Optionally, the second electrode 430 may be connected to the conductive part 330 .

[0106] In these optional embodiments, by arranging the conductive portion 330 to protrude from the first isolation portion 310 toward the isolation opening 301 , the conductive portion 330 can have a larger area and be convenient for connection with the second electrode 430 , thereby facilitating electrical connection between the second electrode 430 and the isolation structure 300 .

[0107] Optionally, the second electrode 430 may also be connected to the first isolation portion 310 , so that the second electrodes 430 of adjacent sub-pixels may also be electrically connected through the first isolation portion 310 .

[0108] In some optional embodiments, the isolation opening 301 may include a first opening 301a and a second opening 301b, and the light emitting device 400 may include a first type device 401 disposed corresponding to the first opening 301a and a second type device 402 disposed corresponding to the second opening 301b.

[0109] Optionally, the first type device 401 disposed corresponding to the first opening 301a may mean that the first type device 401 may be at least partially located in the first opening 301a. Optionally, the second type device 402 disposed corresponding to the second opening 301b may mean that the second type device 402 may be at least partially located in the second opening 301b.

[0110] Optionally, the first type of device 401 and the second type of device 402 emit different colors of light, so as to achieve color display of the display panel 10 .

[0111] Optionally, the isolation opening 301 further includes a third opening 301 c , and the light-emitting device 400 includes a third type device 403 disposed corresponding to the third opening 301 c .

[0112] Optionally, the luminous colors of the first type device 401 , the second type device 402 and the third type device 403 are different from each other, that is, the luminous colors of the first type device 401 , the second type device 402 and the third type device 403 are all different, so as to realize color display of the display panel 10 .

[0113] For example, the first type of device 401 is a light emitting device 400 that emits blue light, the second type of device 402 is a light emitting device 400 that emits green light, and the third type of device 403 is a light emitting device 400 that emits red light.

[0114] In some optional embodiments, the display panel 10 may further include a first encapsulation layer 500, and the first encapsulation layer 500 may include a plurality of encapsulation units 510, and the encapsulation units 510 may be located in the isolation opening 301 and encapsulate the light-emitting device 400 in the isolation opening 301. The encapsulation units 510 may be arranged at intervals, and a single encapsulation unit 510 may be located in a single isolation opening 301 and encapsulate the light-emitting device 400 in the single isolation opening 301 relatively independently.

[0115] In some embodiments of the present application, the light emitting devices 400 of different colors can be prepared separately by utilizing the shielding and isolating effect of the isolation structure 300 on the light emitting device 400 .

[0116] In some optional embodiments, the isolation structure 300 may be used to prepare the first type device 401 , the second type device 402 , and the third type device 403 , respectively.

[0117] In the first optional preparation method embodiment, the first electrode 410 of each light-emitting device 400 may be prepared first. Then, the preparation of the first opening 301a is completed, and the preparation of the pixel opening 220 connected to the first opening 301a is completed. Then, the material of the light-emitting unit 420 and the second electrode 430 in the first type device 401 may be evaporated on the whole surface, and the isolation structure 300 may separate the material of the light-emitting unit 420 and the second electrode 430 in part of the first type device 401, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the first opening 301a, the material of the second electrode 430 of the first type device 401, and the material of the light-emitting unit 420 of the first type device 401 are removed in sequence to form the first type device 401 corresponding to the first opening 301a and the encapsulation unit 510 for encapsulating the first type device 401.

[0118] Then, the preparation of the second opening 301b is completed, and the preparation of the pixel opening 220 connected to the second opening 301b is completed. Then, the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402 is evaporated on the whole surface. The isolation structure 300 can isolate the material of the light-emitting unit 420 and the second electrode 430 in part of the second type device 402, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the second opening 301b, the material of the second electrode 430 of the second type device 402, and the material of the light-emitting unit 420 of the second type device 402 are removed in sequence to form the second type device 402 set corresponding to the second opening 301b and the encapsulation unit 510 for encapsulating the second type device 402.

[0119] Then, the preparation of the third opening 301c and the preparation of the pixel opening 220 connected to the third opening 301c are completed. Then, the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 can be evaporated on the whole surface, and the isolation structure 300 can separate the material of the light-emitting unit 420 and the second electrode 430 in part of the third type device 403, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the third opening 301c, the material of the second electrode 430 of the third type device 403, and the material of the light-emitting unit 420 of the third type device 403 are removed in sequence to form the third type device 403 set corresponding to the third opening 301c and the encapsulation unit 510 for encapsulating the third type device 403.

[0120] In the second optional preparation method embodiment, the first electrode 410 of each light-emitting device 400 may be prepared first. Then, the first opening 301a and the second opening 301b are prepared at the same time, and the pixel opening 220 connected to the first opening 301a and the pixel opening 220 connected to the second opening 301b are prepared at the same time. Then, the material of the light-emitting unit 420 and the second electrode 430 in the first type device 401 may be evaporated on the whole surface, and the isolation structure 300 may separate the material of the light-emitting unit 420 and the second electrode 430 in part of the first type device 401, and then the material of the first encapsulation layer 500 may be evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the first opening 301a, the material of the second electrode 430 of the first type device 401, and the material of the light-emitting unit 420 of the first type device 401 are removed in sequence to form the first type device 401 corresponding to the first opening 301a and the encapsulation unit 510 for encapsulating the first type device 401.

[0121] Then, the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402 is evaporated on the whole surface. The isolation structure 300 can isolate the material of the light-emitting unit 420 and the second electrode 430 in part of the second type device 402, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the second opening 301b, the material of the second electrode 430 of the second type device 402, and the material of the light-emitting unit 420 of the second type device 402 are removed in sequence to form the second type device 402 set corresponding to the second opening 301b and the encapsulation unit 510 for encapsulating the second type device 402.

[0122] Then, the preparation of the third opening 301c and the preparation of the pixel opening 220 connected to the third opening 301c are completed. Then, the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 can be evaporated on the whole surface, and the isolation structure 300 can separate the material of the light-emitting unit 420 and the second electrode 430 in part of the third type device 403, and then the material of the first encapsulation layer 500 is evaporated on the whole surface. Then, the material of the first encapsulation layer 500 outside the third opening 301c, the material of the second electrode 430 of the third type device 403, and the material of the light-emitting unit 420 of the third type device 403 are removed in sequence to form the third type device 403 set corresponding to the third opening 301c and the encapsulation unit 510 for encapsulating the third type device 403.

[0123] In the first optional preparation method embodiment and the second optional preparation method embodiment, by making the preparation of the third opening 301c independent of the preparation of the first opening 301a and the second opening 301b, and by making the preparation of the pixel opening 220 connected to the third opening 301c independent of the preparation of the pixel opening 220 connected to the first opening 301a and the preparation of the pixel opening 220 connected to the second opening 301b, when patterning the materials of the light-emitting unit 420 and the second electrode 430 in the first type of device 401 and the second type of device 402, the etching material is not easy to damage the inner wall of the subsequently prepared third opening 301c, and the pixel defining portion 210 and the first electrode 410 exposed from the third opening 301c, thereby being able to better improve the structural reliability of the display panel 10.

[0124] Among them, compared with the first optional preparation method embodiment, the second optional preparation method embodiment can improve the preparation efficiency of the display panel 10 by simultaneously preparing the first opening 301a and the second opening 301b, and simultaneously preparing the pixel opening 220 connected to the first opening 301a and the pixel opening 220 connected to the second opening 301b.

[0125] In some optional embodiments, the protection structure P can be set in the same layer and material as the pixel defining portion 210, so that the protection structure P and the pixel defining portion 210 can be prepared using the same preparation equipment and the same preparation process, thereby better improving the preparation efficiency of the display panel 10.

[0126] Optionally, when preparing the pixel definition layer 200 , the material of the pixel defining portion 210 can be prepared on the entire surface, wherein the material of the portion of the pixel defining portion 210 located in the non-display area NA can be used to form the protective structure P, and the material of the portion of the pixel defining portion 210 located in the display area AA can be used to form the pixel defining portion 210 .

[0127] Optionally, while preparing the pixel opening 220 communicating with the third opening 301 c , the material of the pixel defining portion 210 in the non-display area NA may be patterned to form a protection structure P in the non-display area NA. The protection structure P may be spaced apart from the pixel defining portion 210 .

[0128] In some optional embodiments, when preparing the isolation structure 300, the material of the isolation structure 300 can be prepared entirely on the material of the pixel defining portion 210, that is, the material of the isolation structure 300 can be located in the display area AA and the non-display area NA, wherein the material of the isolation structure 300 located in the non-display area NA can cover the material of the pixel defining portion 210 used to form the protective structure P, so as to protect the material of the pixel defining portion 210 used to form the protective structure P during the preparation process of the display panel 10.

[0129] Optionally, the material of the isolation structure 300 located in the non-display area NA may be patterned when the third opening 301c is prepared to expose the material used to form the protection structure P, so as to facilitate the subsequent preparation of the protection structure P. Therefore, before the third opening 301c is prepared, the material of the isolation structure 300 located in the non-display area NA can better cover and protect the material used to form the protection structure P.

[0130] Specifically, when preparing the light-emitting unit 420 and the second electrode 430 in the first type device 401 and the second type device 402, and preparing the packaging unit 510 above the first type device 401 and the second type device 402, the material of the isolation structure 300 located in the non-display area NA can better protect the material used to form the protection structure P below, so that the etching material is not easy to damage the material used to form the protection structure P, so that the subsequently formed protection structure P can have a better thickness to protect the alignment mark M, thereby better improving the structural reliability of the display panel 10.

[0131] In some embodiments of the present application, the thickness of the protection structure P may be set according to the thickness of the pixel defining portion 210 exposed from different isolation openings 301 .

[0132] In some optional embodiments, the pixel defining portion 210 includes a first defining portion 211 exposed from the first opening 301 a and a second defining portion 212 exposed from the second opening 301 b , the first defining portion 211 has a first sub-thickness, and the second thickness is less than or equal to the first sub-thickness.

[0133] Optionally, the difference between the second thickness and the first sub-thickness is less than or equal to 2000 angstroms.

[0134] Optionally, the first sub-thickness is the maximum thickness of the first defining portion 211 , and the second thickness is the maximum thickness of the protection structure P; or, the first sub-thickness is the average thickness of the pixel defining portion 210 , and the second thickness is the average thickness of the protection structure P.

[0135] In these optional embodiments, when the display panel 10 is prepared using the above-mentioned two optional preparation method embodiments, since the preparation steps of the first opening 301a, the first type device 401 and the packaging unit 510 above the first type device 401 are relatively early, therefore, when the material of the packaging unit 510 above the second type device 402, the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402, the material of the packaging unit 510 above the third type device 403 and the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 are subsequently patterned, under the blocking of the already formed first type device 401 and the packaging unit 510 above the first type device 401, the etching material is not easy to cause damage to the first limiting portion 211 at the first opening 301a, so that the first limiting portion 211 can have a larger thickness. Therefore, by reasonably setting the thickness relationship between the protective structure P and the first limiting portion 211, the protective structure P can have a better protection effect on the alignment mark M.

[0136] Figure 5 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0137] In some optional embodiments, the second defining portion 212 has a second sub-thickness, such as Figure 4 As shown, the second sub-thickness may be equal to the first sub-thickness, or as Figure 5 As shown, the second sub-thickness may be smaller than the first sub-thickness.

[0138] Optionally, the second sub-thickness is greater than or equal to the second thickness.

[0139] Optionally, the first sub-thickness is the maximum thickness of the first defining portion 211, the second sub-thickness is the maximum thickness of the first defining portion 211, and the second thickness is the maximum thickness of the protective structure P, or the first sub-thickness is the average thickness of the pixel defining portion 210, the second sub-thickness is the maximum thickness of the first defining portion 211, and the second thickness is the average thickness of the protective structure P.

[0140] In these optional embodiments, when the display panel 10 is prepared using the above-mentioned two optional preparation method embodiments, since the preparation steps of the second opening 301b, the second type device 402 and the packaging unit 510 above the second type device 402 are located before the third type device 403 and the packaging unit 510 of the third type device 403, therefore, when the material of the packaging unit 510 above the third type device 403 and the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 are subsequently patterned, under the blocking of the already formed second type device 402 and the packaging unit 510 above the second type device 402, the etching material is not easy to cause damage to the second limiting portion 212 at the second opening 301b, so that the second limiting portion 212 can have a better thickness. Therefore, by reasonably setting the thickness relationship between the protective structure P and the second limiting portion 212, the protective structure P can have a better protection effect on the alignment mark M.

[0141] Among them, when the display panel 10 is prepared using the first optional preparation method embodiment described above, since the second opening 301b has not been opened when preparing the light-emitting unit 420 and the second electrode 430 in the first type of device 401 and preparing the packaging unit 510 above the first type of device 401, therefore, when the material of the packaging unit 510 above the first type of device 401 and the material of the light-emitting unit 420 and the second electrode 430 in the first type of device 401 are patterned, the etching material is not easy to damage the second limiting portion 212 at the second opening 301b, so that the second limiting portion 212 can have a larger thickness, for example, the second sub-thickness can be equal to the first sub-thickness.

[0142] When the display panel 10 is prepared using the aforementioned second optional preparation method embodiment, since the second opening 301b has been opened when preparing the light-emitting unit 420 and the second electrode 430 in the first type device 401 and preparing the packaging unit 510 above the first type device 401, when patterning the material of the packaging unit 510 above the first type device 401 and the material of the light-emitting unit 420 and the second electrode 430 in the first type device 401, the etching material is likely to affect the second limiting portion 212 at the second opening 301b, thereby making it easy to thin the thickness of the second limiting portion 212 to a certain extent, for example, the second sub-thickness can be made smaller than the first sub-thickness.

[0143] In some optional embodiments, the pixel defining portion 210 includes a third defining portion 213 exposed from the third opening 301c, the third defining portion 213 has a third sub-thickness, the first sub-thickness is equal to the third sub-thickness, and / or the second thickness is less than or equal to the third sub-thickness.

[0144] Optionally, the second defining portion 212 has a second sub-thickness, and the second sub-thickness is less than or equal to the third sub-thickness.

[0145] Optionally, the difference between the second thickness and the third sub-thickness is less than or equal to 2000 angstroms.

[0146] Optionally, the first sub-thickness is the maximum thickness of the first defining portion 211, the third sub-thickness is the maximum thickness of the first defining portion 211, and the second thickness is the maximum thickness of the protective structure P, or the first sub-thickness is the average thickness of the pixel defining portion 210, the third sub-thickness is the maximum thickness of the first defining portion 211, and the second thickness is the average thickness of the protective structure P.

[0147] In these optional embodiments, when the display panel 10 is prepared using the above-mentioned two optional preparation method embodiments, since the preparation of the third opening 301c is located after the preparation steps of the packaging unit 510 above the first type device 401, the first type device 401, the packaging unit 510 above the second type device 402, and the second type device 402, therefore, when the material of the packaging unit 510 above the first type device 401, the material of the light-emitting unit 420 and the second electrode 430 in the first type device 401, the material of the packaging unit 510 above the second type device 402, and the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402 are patterned, under the blocking of the material of the isolation structure 300, the etching material is not easy to damage the third limiting portion 213 formed subsequently from the third opening 301c, so that the third limiting portion 213 can have a larger thickness. Therefore, by reasonably setting the thickness relationship between the protection structure P and the third limiting portion 213, the protection structure P can have a better protection effect on the alignment mark M.

[0148] See also Figures 1 to 5 The embodiment of the first aspect of the present application also provides a display panel 10, the display panel 10 has a display area AA and a non-display area NA, and the display panel 10 includes: a substrate 100; a pixel definition layer 200, which is arranged on one side of the substrate 100, the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 located in the display area AA formed by the pixel defining portion 210, and the pixel defining portion 210 has a first thickness; an isolation structure 300, which is arranged on one side of the substrate 100 and encloses an isolation opening 301 connected to the pixel opening 220; a light-emitting device 400, which is located in the display area AA and is arranged in the pixel opening 220 and the isolation opening 301; an alignment mark M, which is located in the non-display area NA and is arranged on one side of the substrate 100; a protection structure P, which covers the side of the alignment mark M away from the substrate 100 and is arranged in the same layer and material as the pixel defining portion 210, and the protection structure P has a second thickness, and the second thickness is equal to the first thickness.

[0149] In a display panel 10 provided in an embodiment of the present application, the display panel 10 has a display area AA and a non-display area NA, and the display panel 10 includes a substrate 100, a pixel definition layer 200, an isolation structure 300, a light emitting device 400, an alignment mark M, and a protection structure P. The pixel definition layer 200 is disposed on one side of the substrate 100, and the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210 and located in the display area AA. The isolation structure 300 is disposed on one side of the substrate 100 and encloses an isolation opening 301 connected to the pixel opening 220. The light emitting device 400 is located in the display area AA and is disposed in the pixel opening 220 and the isolation opening 301. Both the pixel definition layer 200 and the isolation structure 300 can be used by the user to divide the sub-pixels of the display panel 10.

[0150] The alignment mark M is located in the non-display area NA and is disposed on one side of the substrate 100. During the preparation of the display panel 10, the arrangement of the alignment mark M can facilitate the alignment of the display panel 10. By arranging a protective structure P on the side of the alignment mark M away from the substrate 100, during the preparation of the display panel 10, the protective structure P provides protection to the alignment mark M, so that the alignment mark M is not easily damaged, thereby improving the structural reliability of the alignment mark M. By arranging the protection structure P and the pixel defining portion 210 in the same layer and material, the protection structure P and the pixel defining portion 210 can be prepared in the same preparation process using the same preparation equipment, thereby improving the preparation efficiency of the display panel 10.

[0151] The pixel defining portion 210 has a first thickness, and the protective structure P has a second thickness. By setting the difference between the second thickness and the first thickness to be less than or equal to 2000 angstroms, the protective structure P can have a more suitable thickness to enhance the protective effect of the protective structure P on the alignment mark M, and the setting of the protective structure P is not easy to interfere with the identification of the alignment mark M during the preparation process of the display panel 10.

[0152] Optionally, a display panel 10 provided in an embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, a display panel 10 provided in an embodiment of the present application may have the structure and beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0153] For example, the light-emitting device 400 may be the light-emitting device 400 in any of the foregoing embodiments, and the light-emitting device 400 may include the first type device 401 , the second type device 402 , and the third type device 403 in any of the foregoing embodiments.

[0154] For example, the isolation structure 300 may be the isolation structure 300 in any of the aforementioned embodiments, and the isolation structure 300 may enclose the isolation opening 301 in any of the aforementioned embodiments. Specifically, the isolation opening 301 may include the first opening 301a, the second opening 301b, the third opening 301c, and the fourth opening in any of the aforementioned embodiments. The isolation structure 300 may include the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 in any of the aforementioned embodiments.

[0155] For example, the pixel definition layer 200 may be the pixel definition layer 200 in any of the aforementioned embodiments, the pixel definition layer 200 may include the pixel definition portion 210 and the pixel opening 220 in any of the aforementioned embodiments, and the pixel definition portion 210 may include the first definition portion 211, the second definition portion 212, and the third definition portion 213 in any of the aforementioned embodiments. The thickness relationship between the protection structure P and the pixel definition portion 210 may be set with reference to any of the aforementioned embodiments. In addition, the isolation structure 300, the light emitting device 400, and the preparation method of the pixel definition layer 200 may also be set with reference to any of the aforementioned embodiments.

[0156] Figure 6 is a schematic flow chart of a method for preparing a display panel 10 provided in an embodiment of the present application. Figures 7 to 22 It is a schematic diagram of a preparation process of a method for preparing a display panel 10 provided in an embodiment of the present application.

[0157] The second aspect of the present application provides a method for preparing a display panel 10. The display panel 10 prepared by the preparation method may be the display panel 10 provided by any of the first aspect embodiments described above. Figure 6 Combined with Figures 1 to 5 as well as Figures 7 to 22 The display panel 10 has a display area AA and a non-display area NA, and the preparation method includes:

[0158] Step S10: Figure 7 As shown, a substrate 100 and an alignment mark M located in the non-display area NA and disposed on one side of the substrate 100 are formed.

[0159] Step S20: Figure 8 and Fig. 9 As shown, an isolation material layer 12 is formed on the substrate 100 , the isolation material layer 12 is located in the display area AA and the non-display area NA, and a portion of the isolation material layer 12 is located on the side of the alignment mark M away from the substrate 100 .

[0160] Optionally, the isolation material layer 12 may be used to form the isolation structure 300 in any of the aforementioned embodiments.

[0161] Optionally, in the direction away from the substrate 100, the isolation material layer 12 may include a first isolation material layer 12a, a second isolation material layer 12b and a third isolation material layer 12c stacked in sequence, wherein the first isolation material layer 12a, the second isolation material layer 12b and the third isolation material layer 12c may be used to form the conductive part 330, the first isolation part 310 and the second isolation part 320 in any of the aforementioned embodiments, respectively.

[0162] Step S30: Figures 10 to 19 As shown, the isolation material layer 12 is patterned to form a first opening 301a and a second opening 301b located in the display area AA, and a first type of device 401 corresponding to the first opening 301a and a second type of device 402 corresponding to the second opening 301b are prepared, and the first type of device 401 and the second type of device 402 have different luminous colors.

[0163] Optionally, in step S30 , the packaging unit 510 above the first type device 401 and the second type device 402 may be prepared.

[0164] Step S40: Fig. 20 As shown, the isolation material layer 12 is patterned to remove a portion of the isolation material layer 12 located on the side of the alignment mark M facing away from the substrate 100 .

[0165] In the preparation method of the display panel 10 provided in the embodiment of the present application, after completing the preparation of the packaging unit 510 above the first type device 401, the first type device 401, the packaging unit 510 above the second type device 402, and the second type device 402, a portion of the isolation material layer 12 located on the side of the alignment mark M away from the substrate 100 is removed, so that in the process of patterning the materials of the light-emitting unit 420 and the second electrode 430 in the first type device 401 and the second type device 402, and in the process of patterning the materials of the packaging unit 510 above the first type device 401 and the second type device 402, the isolation material layer 12 located in the non-display area NA can better protect the yield mark below, so that the etching material is not easy to damage the yield mark, thereby better improving the structural reliability of the display panel 10.

[0166] In some optional embodiments of the present application, there are various methods for setting the sequence of preparation steps of the first opening 301 a and the sequence of preparation steps of the second opening 301 b .

[0167] In some optional embodiments, step S30 may include:

[0168] Step S31: Fig.10As shown, the isolation material layer 12 is patterned to form a first opening 301 a located in the display area AA.

[0169] Step S32: Fig.12 As shown, a first type device 401 arranged corresponding to the first opening 301 a and a packaging unit 510 located above the first type device 401 are prepared.

[0170] Step S33: Fig.13 As shown, the isolation material layer 12 is patterned to form a second opening 301 b located in the display area AA.

[0171] Step S32: Fig.15 As shown, a second type device 402 arranged corresponding to the second opening 301 b and a packaging unit 510 located above the second type device 402 are prepared.

[0172] In this optional embodiment, by separately preparing the first opening 301a and the second opening 301b, when preparing the first type device 401 and the packaging unit 510 located above the first type device 401, the etching material is not easy to damage the partial pixel defining portion 210 subsequently exposed from the second opening 301b due to the blocking of the isolation material layer 12, thereby improving the structural reliability of the display panel 10.

[0173] In some other optional embodiments, step S30 may include:

[0174] Step S31': Fig.16 As shown, the isolation material layer 12 is patterned to form a first opening 301 a and a second opening 301 b located in the display area AA.

[0175] Step S32': Fig.18 As shown, a first type device 401 arranged corresponding to the first opening 301 a and a packaging unit 510 located above the first type device 401 are prepared.

[0176] Step S33': Fig.19 As shown, a second type device 402 arranged corresponding to the second opening 301 b and a packaging unit 510 located above the second type device 402 are prepared.

[0177] In this optional embodiment, by preparing the first opening 301 a and the second opening 301 b simultaneously, the manufacturing efficiency of the display panel 10 can be improved.

[0178] In some optional embodiments, step S40 also includes:

[0179] like Fig. 20As shown, the isolation material layer 12 is patterned to form a third opening 301c located in the display area AA.

[0180] Optionally, after step S40, the following steps may also be included:

[0181] Step S50: Fig. 22 As shown, a third type device 403 corresponding to the third opening 301 c is prepared, and the luminous colors of the first type device 401 , the second type device 402 and the third type device 403 are different from each other.

[0182] Optionally, after the first opening 301 a , the second opening 301 b , and the third opening 301 c are prepared, the isolation structure 300 in any of the aforementioned embodiments may be formed.

[0183] In these optional embodiments, by preparing the third opening 301c and removing the part of the isolation material layer 12 located on the side of the alignment mark M away from the substrate 100, the manufacturing efficiency of the display panel 10 can be improved. In addition, by arranging the preparation step of the third opening 301c after the preparation steps of the first type device 401, the encapsulation unit 510 located above the first type device 401, the second type device 402, and the encapsulation unit 510 located above the second type device 402, when preparing the first type device 401, the encapsulation unit 510 located above the first type device 401, the second type device 402, and the encapsulation unit 510 located above the second type device 402, under the blocking of the isolation material layer 12, the etching material is not easy to damage the part of the pixel defining portion 210 subsequently exposed from the third opening 301c, thereby improving the structural reliability of the display panel 10.

[0184] In some optional embodiments, before step S20, the following may be included: Figure 8 As shown, a pixel definition material layer 11 is formed on the substrate 100 . The pixel definition material layer 11 is located in the display area AA and the non-display area NA, and the pixel definition material layer 11 covers the side of the alignment mark M away from the substrate 100 .

[0185] In step S20, the following steps are included: Fig. 9 As shown, an isolation material layer 12 is formed on the pixel definition material layer 11 .

[0186] Optionally, the pixel definition material layer 11 located in the non-display area NA may be used to form the protection structure P described in any of the aforementioned embodiments.

[0187] Optionally, after step S40, the method further includes: Fig.21 As shown, the pixel definition material layer 11 is patterned to form a protection structure P covering the side of the alignment mark M facing away from the substrate 100 .

[0188] In the method for preparing the display panel 10 provided in the embodiment of the present application, after the preparation of the packaging unit 510 above the first type device 401, the packaging unit 510 above the first type device 401 and the second type device 402, and the second type device 402 are completed, the part of the isolation material layer 12 located on the side of the alignment mark M away from the substrate 100 is removed, so that in the process of patterning the materials of the light-emitting unit 420 and the second electrode 430 in the first type device 401 and the second type device 402, and in the process of patterning the materials of the packaging unit 510 above the first type device 401 and the second type device 402, the isolation material layer 12 located in the non-display area NA can better protect the part of the pixel definition material layer 11 used to form the protection structure P below, so that the etching material is not easy to damage the part of the pixel definition material layer 11 used to form the protection structure P, so that the protection structure P formed subsequently can have a better thickness to protect the alignment mark M, thereby being able to better improve the structural reliability of the display panel 10.

[0189] Optionally, after the step of patterning the isolation material layer 12 to form the first opening 301a located in the display area AA, the following steps may be included:

[0190] The pixel definition material layer 11 is patterned to form a pixel opening 220 communicating with the first opening 301 a .

[0191] For example, after step S31 and step S31', the following may be included:

[0192] like Fig.11 and Fig.17 As shown, the pixel definition material layer 11 is patterned to form a pixel opening 220 communicating with the first opening 301 a .

[0193] Optionally, after the step of patterning the isolation material layer 12 to form the second opening 301b located in the display area AA, the method further includes:

[0194] The pixel definition material layer 11 is patterned to form a pixel opening 220 communicating with the second opening 301 b .

[0195] For example, after step S33 and step S31', the following steps may be included:

[0196] like Fig.14 and Fig.17 As shown, the pixel definition material layer 11 is patterned to form a pixel opening 220 communicating with the second opening 301 b.

[0197] Optionally, after the step of patterning the isolation material layer 12 to form the third opening 301c located in the display area AA, the following steps may be included:

[0198] The pixel definition material layer 11 is patterned to form a pixel opening 220 communicating with the third opening 301 c .

[0199] In some optional embodiments, such as Fig.21 As shown, the step of patterning the pixel definition material layer 11 to form a protection structure P covering the side of the alignment mark M away from the substrate 100 can be located in the step of patterning the pixel definition material layer 11 to form a pixel opening 220 connected to the third opening 301c.

[0200] In this optional embodiment, the manufacturing efficiency of the display panel 10 can be improved by manufacturing the protection structure P and the pixel opening 220 connected to the third opening 301 c in the same manufacturing process.

[0201] Optionally, the step of patterning the pixel definition material layer 11 to form a protective structure P covering the side of the alignment mark M facing away from the substrate 100 may be located before step S50, that is, step S50 is performed only after the step of patterning the pixel definition material layer 11 to form the protective structure P covering the side of the alignment mark M facing away from the substrate 100, so that in the process of preparing the third type of device 403 corresponding to the third opening 301c, for example, when patterning the materials of the light-emitting unit 420 and the second electrode 430 of the third type of device 403, the protective structure P can limit the etching damage of the etching material to the alignment mark M, thereby better improving the structural reliability of the alignment mark M.

[0202] The embodiment of the third aspect of the present application provides a display device, which includes the display panel 10 of any of the above-mentioned embodiments, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect. Therefore, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect or the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect, which will not be repeated here.

[0203] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0204] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, and the display panel includes: substrate; A pixel definition layer is disposed on one side of the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening located in the display area and enclosed by the pixel definition portion, the pixel definition portion having a first thickness; An isolation structure, disposed on one side of the substrate and enclosing an isolation opening communicating with the pixel opening; A light emitting device, located in the display area and disposed in the pixel opening and the isolation opening; An alignment mark, located in the non-display area and arranged on one side of the substrate; A protection structure covers the side of the alignment mark facing away from the substrate, the protection structure has a second thickness, and the difference between the second thickness and the first thickness is less than or equal to 2000 angstroms.

2. The display panel according to claim 1, characterized in that: The first thickness is the maximum thickness of the pixel defining portion, and the second thickness is the maximum thickness of the protection structure, or the first thickness is the average thickness of the pixel defining portion, and the second thickness is the average thickness of the protection structure.

3. The display panel according to claim 1, characterized in that: The isolation opening includes a first opening and a second opening, the light emitting device includes a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the light emitting colors of the first type of device and the second type of device are different, the pixel defining portion includes a first defining portion exposed from the first opening and a second defining portion exposed from the second opening, the first defining portion has a first sub-thickness, and the second thickness is less than or equal to the first sub-thickness; Preferably, the difference between the second thickness and the first sub-thickness is less than or equal to 2000 angstroms; Preferably, the first sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, and the second thickness is the average thickness of the protective structure.

4. The display panel according to claim 3, characterized in that: The second defining portion has a second sub-thickness, the second sub-thickness is less than or equal to the first sub-thickness, and / or the second sub-thickness is greater than or equal to the second thickness; Preferably, the first sub-thickness is the maximum thickness of the first defining portion, the second sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, the second sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the average thickness of the protective structure.

5. The display panel according to claim 3, characterized in that: The isolation opening further includes a third opening, the light emitting device includes a third type of device arranged corresponding to the third opening, the light emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the pixel defining portion includes a third defining portion exposed from the third opening, the third defining portion has a third sub-thickness, the first sub-thickness is equal to the third sub-thickness, and / or the second thickness is less than or equal to the third sub-thickness; Preferably, the difference between the second thickness and the third sub-thickness is less than or equal to 2000 angstroms; Preferably, the first sub-thickness is the maximum thickness of the first defining portion, the third sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the maximum thickness of the protective structure, or the first sub-thickness is the average thickness of the pixel defining portion, the third sub-thickness is the maximum thickness of the first defining portion, and the second thickness is the average thickness of the protective structure; Preferably, the second limiting portion has a second sub-thickness, and the second sub-thickness is less than or equal to the third sub-thickness.

6. The display panel according to any one of claims 1 to 5, characterized in that: The protection structure and the pixel defining portion are arranged in the same layer and made of the same material.

7. The display panel according to any one of claims 1 to 5, characterized in that: The protection structure also covers the side wall of the alignment mark.

8. A display panel, characterized in that: The display panel has a display area and a non-display area, and the display panel includes: substrate; A pixel definition layer is disposed on one side of the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening located in the display area and enclosed by the pixel definition portion, the pixel definition portion having a first thickness; An isolation structure, disposed on one side of the substrate and enclosing an isolation opening communicating with the pixel opening; A light emitting device, located in the display area and disposed in the pixel opening and the isolation opening; An alignment mark, located in the non-display area and arranged on one side of the substrate; A protection structure covers the side of the alignment mark away from the substrate and is provided in the same layer and material as the pixel defining portion. The protection structure has a second thickness, which is equal to the first thickness.

9. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area, and the preparation method includes: forming a substrate and an alignment mark located in the non-display area and disposed on one side of the substrate; forming an isolation material layer on the substrate, wherein the isolation material layer is located in the display area and the non-display area, and a portion of the isolation material layer is located on a side of the alignment mark away from the substrate; The isolation material layer is patterned to form a first opening and a second opening located in the display area, and a first type of device corresponding to the first opening and a second type of device corresponding to the second opening are prepared, wherein the first type of device and the second type of device have different luminous colors; The isolation material layer is patterned to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate.

10. The preparation method according to claim 9, characterized in that: The step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate also includes: Performing patterning on the isolation material layer to form a third opening located in the display area; Preferably, after the step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate, the method further comprises: A third type of device is prepared and formed corresponding to the third opening, and the luminous colors of the first type of device, the second type of device and the third type of device are different from each other.

11. The preparation method according to any one of claims 9 or 10, characterized in that: The step of forming an isolation material layer on the substrate includes: Forming a pixel definition material layer on the substrate, wherein the pixel definition material layer is located in the display area and the non-display area, and the pixel definition material layer covers a side of the alignment mark away from the substrate; The step of forming an isolation material layer on the substrate includes: forming an isolation material layer on the pixel definition material layer; After the step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate, the step further includes: Performing patterning on the pixel definition material layer to form a protection structure covering a side of the alignment mark facing away from the substrate; Preferably, after the step of patterning the isolation material layer to form the first opening and the second opening located in the display area, the method further comprises: performing patterning on the pixel definition material layer to form a pixel opening communicating with the first opening and the second opening; Preferably, the preparation method further comprises: patterning the isolation material layer to form a third opening located in the display area; After the step of patterning the pixel definition material layer to form a protection structure covering the side of the alignment mark away from the substrate: Prepare a third type of device corresponding to the third opening, wherein the first type of device, the second type of device and the third type of device have different luminous colors; Preferably, after the step of patterning the isolation material layer to form a third opening located in the display area, the method further comprises: performing patterning on the pixel definition material layer to form a pixel opening communicating with the third opening; Preferably, the step of patterning the pixel definition material layer to form a protection structure covering the side of the alignment mark facing away from the substrate is located in the step of patterning the pixel definition material layer to form a pixel opening connected to the third opening.

12. The preparation method according to claim 11, characterized in that: After the step of patterning the isolation material layer to form a first opening located in the display area, the method further comprises: performing patterning on the pixel definition material layer to form a pixel opening communicating with the first opening; After the step of patterning the isolation material layer to form a second opening located in the display area, the method further comprises: The pixel definition material layer is patterned to form a pixel opening communicating with the second opening.

13. The preparation method according to claim 11, characterized in that: The step of patterning the isolation material layer to remove a portion of the isolation material layer located on a side of the alignment mark away from the substrate also includes: Performing patterning on the isolation material layer to form a third opening located in the display area; The step of patterning the pixel definition material layer to form a protection structure covering the side of the alignment mark facing away from the substrate also includes: The pixel definition material layer is patterned to form a pixel opening communicating with the third opening.

14. A display device, characterized in that: A display panel comprising any one of claims 1 to 8, or a display panel prepared by the preparation method according to any one of claims 9 to 13.

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