Electronic device with triple liquid cooling circulation

Abstract

An electronic device with triple liquid cooling circulation comprises a first closed shell, a circuit mother board and a liquid cooling heat dissipation module, the first closed shell is provided with a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, and the circuit mother board is arranged in the first closed shell and electrically connected with a first heating element. The liquid cooling heat dissipation module is coupled to the first heating element and comprises a first steam cavity element and a second closed shell, and the second closed shell is provided with a second heat exchange cavity, a third liquid inlet and a third liquid outlet. The first heat exchange cavity, the first liquid inlet and the first liquid outlet form a first flow channel for circulating flow of first cooling liquid, and the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for circulating flow of second cooling liquid. A third flow channel is formed in the first steam cavity element, so that third cooling liquid flows in a two-phase flow circulation mode; therefore, different levels of heat exchange and heat transfer can be achieved, better heat dissipation and power saving effects are achieved, the heat dissipation efficiency of the server is effectively improved, and the PUE value is effectively reduced.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device with a triple liquid cooling cycle. The device integrates the functions of a two-phase flow cycle of a vapor chamber, a cold plate type cooling liquid cycle, and an immersion type cooling liquid cycle. When the liquid inlet and liquid outlet of the electronic device are connected to two external cooling liquid circulation systems, the heat generated by various electronic components in the electronic device can be effectively transferred to the outside of the electronic device. Background Art

[0002] Conventional server liquid cooling technologies in data centers mainly include cold plate liquid cooling technology and immersion liquid cooling technology.

[0003] Cold plate liquid cooling is to install a cold plate heat dissipation module on the high computing power chip (such as the central processing unit (CPU), graphics processing unit (GPU) and artificial intelligence (AI) chip) on the circuit motherboard in the server, and then connect the circulating coolant to the water inlet and outlet of the cold plate heat dissipation module. The microchannel in the water-cooled plate is used to exchange heat with the chip, and then the heated hot water is taken away from the water-cooled plate to achieve the purpose of lowering the chip temperature. However, there are some problems with this cold plate liquid cooling technology. First, the water-cooled plate liquid cooling module with microchannel as heat dissipation has an upper limit on the heat dissipation power, which can no longer meet the increasing thermal design power (TDP) trend demand of high computing power chips. According to the current known technology, when the power of a single chip reaches more than 500W, the general water-cooled plate faces the limit of the heat dissipation function. Second, in addition to using the heat dissipation module to dissipate the heat generated by the high computing power chip, there are other electronic heating elements in the server. However, these electronic heating elements are currently only cooled by fans. However, the heat emitted by the fans will be discharged into the computer room of the data center, causing the room temperature in the computer room to rise. Therefore, air conditioning is also needed to reduce the indoor temperature in the computer room, which makes the overall PUE (Power Usage Effectiveness, PUE) value of the data center also face bottlenecks.

[0004] Immersion liquid cooling technology is to immerse the entire circuit motherboard and electronic heating elements of the server directly in a non-conductive liquid, and directly transfer the heat energy generated by the server during operation to the cooling liquid. Conventional immersion liquid cooling technology can be divided into the following two types according to different operating principles. First, the operation mode of single-phase immersion liquid cooling technology: immerse the heat source into a heat-conductive dielectric liquid tank. The non-conductive liquid can be synthesized with hydrocarbons with high boiling point and low viscosity. A circulation pump must be installed in the liquid tank to promote the circulation of the fluid in the liquid tank; second, the operation mode of two-phase immersion liquid cooling technology: immerse the heat source into a low-viscosity, non-conductive coolant, and take away the heat generated by the heat source through direct contact between the coolant and the heat source and liquid circulation; at the same time, due to the low-temperature boiling process of the liquid, the heat is transferred from the liquid pool to the space outside the pool. Through heat exchange, such as a condenser, the vapor is cooled and condensed again and flows back to the cooling liquid pool, and the purpose of heat dissipation is achieved through continuous circulation. However, the coolant (i.e., fluorocarbon) used in conventional two-phase immersion liquid cooling systems is a man-made hazardous chemical. During the heat dissipation process of the system, if the fluorocarbon vapor evaporates, it may be dispersed through the air, which may further cause corrosion and pollution to the human body, the environment, or the equipment.

[0005] Furthermore, with the development of technology and consumer demand, the performance requirements of electronic products are getting higher and higher. For example, the power of a single chip in a data center server has reached 500W or 700W, and there will even be a demand for high-computing power chip product design with a power of more than 1,000W in the future. In general, the power usage efficiency (PUE) is often used as a standard to measure the energy saving and power saving of computing data centers. The lower the PUE value, the less power is consumed. The ideal PUE value is 1 (that is, 100% of the electricity can be converted into computer computing). However, in actual applications, during the operation (computation) of conventional servers, the chips and the operation process will generate a lot of heat energy. If there is no good heat dissipation system, it will cause the chip to overheat or even burn. Therefore, in view of the shortcomings of conventional technology and the development of more and higher-power high-computing power chips in the future, it is necessary to design a cooling system with higher efficiency heat dissipation so that the PUE value approaches 1, thereby reducing electricity costs and meeting environmental protection requirements. Summary of the invention

[0006] In view of this, the object of the present invention is to provide an electronic device with a triple liquid cooling cycle, which can achieve different levels of The heat exchange and heat transfer can achieve better heat dissipation and power saving effects, and the server itself can also be made into an independent electronic device with both cold plate and immersion liquid cooling functions. When the liquid inlet and outlet of the server are connected to the external circulating coolant, the heat generated by all the electronic components in the server can be efficiently transferred and discharged to the outside of the server cabinet, or even transferred and discharged to the outdoor of the data center for centralized processing and effective application, thereby effectively improving the heat dissipation efficiency of the entire server and reducing the PUE value of the entire data center to solve the above-mentioned conventional problems.

[0007] To achieve the above object, the present invention discloses an electronic device with triple liquid cooling cycle, which is characterized by comprising:

[0008] A first closed shell having a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the first liquid inlet and the first liquid outlet are respectively connected to the first heat exchange cavity;

[0009] A motherboard is disposed in the first closed shell and located in the first heat exchange cavity, and the motherboard is electrically connected to a first heating element; and

[0010] A liquid cooling heat dissipation module is coupled to the first heating element and includes a second closed shell and a first steam chamber element, the second closed shell has a second heat exchange cavity, a third liquid inlet and a third liquid outlet, the third liquid inlet and the third liquid outlet are respectively connected to the second liquid inlet and the second liquid outlet, and the first steam chamber element is arranged in the second heat exchange cavity, and the first steam chamber element has a heat absorption end and a condensation end;

[0011] Among them, the first heat exchange chamber, the first liquid inlet and the first liquid outlet form a first flow channel for a first coolant to circulate, the second heat exchange chamber, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for a second coolant to circulate, a third flow channel is formed inside the first steam chamber element for a third coolant to flow in a two-phase flow circulation form, the heat absorption end of the first steam chamber element is closely attached to the first heating element, and the condensation end of the first steam chamber element is immersed in the second coolant.

[0012] The first closed shell is a closed shell that meets the 1u size specification, the electronic device can be placed in a modular cabinet frame, and the electronic device can be a server or a communication device.

[0013] It also includes a circuit daughter board electrically connected to the circuit mother board. The first heating element is arranged on the circuit daughter board. The circuit daughter board, the first heating element and the liquid cooling module form an electronic component with heat dissipation function.

[0014] In which, a second heating element is further provided on the circuit board, and the liquid cooling heat dissipation module includes a copper upper cover and a copper lower cover, the copper lower cover has a first area and a second area relative to the copper upper cover, the first area has a first lower surface, the second area has a second lower surface and a second upper surface, when the copper upper cover is joined to the first area of ​​the copper lower cover, the first steam chamber element is formed, the first lower surface of the first area is used to contact the first heating element, and the second lower surface of the second area is used to contact the second heating element.

[0015] The electronic component further includes a half-open shell connected to the copper lower cover to form the second closed shell and the second heat exchange cavity. The second heat exchange cavity is used to accommodate the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell.

[0016] The electronic component further comprises a two-dimensional temperature averaging plate element formed in the second area of ​​the copper lower cover and having a second vapor cavity and a temperature averaging plate lower surface, and the temperature averaging plate lower surface is used to contact the second heating element.

[0017] The two-dimensional temperature plate element includes a flat plate, which has a lower cover cavity relative to the second area of ​​the copper lower cover. When the flat plate is connected to the second area of ​​the copper lower cover, the lower cover cavity forms the second vapor cavity.

[0018] The copper upper cover includes a substrate and a tube body, wherein the substrate has a substrate cavity, an opening and an upper outer surface, and the tube body has a tube body cavity. The tube body is arranged on the upper outer surface and is located above the opening and protrudes outward from the upper outer surface. When the copper upper cover is joined to the first area of ​​the copper lower cover, the tube body cavity and the substrate cavity form an air cavity of the first vapor chamber element.

[0019] The first coolant is a non-conductive single-phase coolant or a non-conductive two-phase coolant, the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water.

[0020] The first flow channel is formed by a first connecting pipe connecting the first liquid inlet, the first heat exchange chamber and the first liquid outlet, and the second flow channel is formed by a second connecting pipe connecting the second liquid inlet, the third liquid inlet, the second heat exchange chamber, the third liquid outlet and the second liquid outlet. The third flow channel is formed by the two-phase flow circulation inside the first steam chamber element.

[0021] In summary, the present invention provides an electronic device with a triple liquid cooling cycle, which uses the triple liquid cooling cycle contained in the electronic device itself to perform different levels of cooling. heat exchange and heat transfer to achieve better heat dissipation and power saving effects. Compared with the conventional technology, the present invention has the following advantages: First, the present invention simultaneously sets up triple liquid cooling cycles in the electronic device, one of which is a two-phase flow liquid cooling cycle corresponding to the vapor chamber, which can directly perform heat exchange and heat transfer with the first heating element (primary heat source), and quickly transfer the heat energy at the heat absorption end to the condensation end through phase change; another group corresponds to the second closed shell, and performs heat exchange and heat transfer with the cooling liquid in the vapor chamber and the second heat exchange chamber; another group corresponds to the first closed shell and is arranged on the entire circuit motherboard, and performs heat exchange and heat transfer with the heating element (secondary heat source) on the circuit motherboard. Therefore, when the present invention is applied to an electronic device, the triple liquid cooling cycle is equivalent to providing three superimposed heat exchange systems at the same time, and the heat is dissipated from the inside to the outside through layered liquid cooling cycles, so the heat transfer and heat dissipation efficiency of the electronic device itself can be greatly improved. In summary, the electronic device with triple liquid cooling cycle of the present invention achieves better heat dissipation effect by effectively exchanging and transferring the heat generated by the primary heat source and the secondary heat source through the application of three-level liquid cooling cycle. In addition to greatly increasing the heat dissipation efficiency of the electronic device so that the PUE value approaches 1, it can also save the cost of using the cooling liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A cross-sectional view of an electronic device with a triple liquid cooling cycle according to an embodiment of the present invention is shown.

[0023] Figure 2 Shows the Figure 1 Top view of the .

[0024] Figure 3 A schematic diagram of an electronic device with a triple liquid cooling cycle according to another embodiment of the present invention is shown.

[0025] Figure 4 A cross-sectional view of an electronic assembly according to another embodiment of the present invention is shown.

[0026] Figure 5 Shows the Figure 4A cross-sectional view of a first vapor chamber element.

[0027] Figure 6 Shows the Figure 5 Magnified view of area B.

[0028] Figure 7 A cross-sectional view of a first vapor chamber element according to another embodiment of the present invention is shown.

[0029] Figure 8 Shows the Figure 7 Magnified view of area B.

[0030] Fig. 9 Shows the Figure 1 A cross-sectional view of a first vapor chamber element. DETAILED DESCRIPTION

[0031] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the accompanying drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0032] See also Figure 1 , Figure 1 A cross-sectional view of an electronic device with a triple liquid cooling cycle according to an embodiment of the present invention is shown. Figure 1As shown, the present invention provides an electronic device 1 with triple liquid cooling cycle, comprising a first closed shell 10, a circuit motherboard 20 and a liquid cooling heat dissipation module 30. The first closed shell 10 has a first heat exchange cavity 101, a first liquid inlet 1011, a first liquid outlet 1012, a second liquid inlet 1013 and a second liquid outlet 1014, and the first liquid inlet 1011 and the first liquid outlet 1012 are respectively connected to the first heat exchange cavity 101. The circuit motherboard 20 is disposed in the first closed shell 10 and located in the first heat exchange cavity 101, and the circuit motherboard 20 is electrically connected to the first heating element 201. The liquid cooling heat dissipation module 30 is coupled to the first heating element 201 and includes a second closed shell 301 and a first steam chamber element 302. The second closed shell 301 has a second heat exchange cavity 3011, a third liquid inlet 3012 and a third liquid outlet 3013. The third liquid inlet 3012 and the third liquid outlet 3013 are respectively connected to the second liquid inlet 1013 and the second liquid outlet 1014. The first steam chamber element 302 is arranged in the second closed shell 301 and can be in contact with the coolant in the second heat exchange cavity 3011 for heat exchange. The first heat exchange cavity 101, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111 for the first coolant to circulate. The second heat exchange chamber 3011, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014 and the third liquid outlet 3013 form a second flow channel 112 for the second coolant to circulate. The third flow channel 113 is formed inside the first steam chamber element 302 for the third coolant to flow in a two-phase flow circulation form. In addition, the heat absorption end 60 of the first steam chamber element 302 is closely attached to the first heating element 201, and the condensation end 70 of the first steam chamber element 302 is immersed in the second coolant.

[0033] The operating principle of the third flow channel 113 will be described in detail below. Figure 1 ,like Figure 1 As shown, the cooling liquid in the third flow channel 113 flows in the capillary structure disposed inside the first vapor chamber element 302. In practice, when the heat absorbing end of the first vapor chamber element 302 receives heat energy from the first heating element 201, the cooling liquid in the third flow channel 113 absorbs the heat energy and turns into gas. Figure 1 The first vapor chamber element 302 flows in the direction of the upward arrow. Then, the coolant changes from the gas phase back to the liquid phase at the condensation end 70, and then flows along Figure 1 The downward arrow inside the first vapor chamber element 302 causes the working fluid to flow back to the heat absorption end 60 by the capillary phenomenon of the capillary structure to form a two-phase flow cycle.

[0034] Please read Figure 1 as well as Figure 2 , Figure 2 Shows the Figure 1 A top view of the Figure 2 As shown, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111; the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014, and the third liquid outlet 3013 form a second flow channel 112. The position can be clearly seen from a top view, wherein a pump 401 is respectively provided in the first flow channel 111 and the second flow channel 112 to flow the coolant in the first flow channel 111 and the second flow channel 112 into and out of the liquid inlet, so that the first heat exchange chamber 101 and the second heat exchange chamber 3011 have a better heat exchange efficiency. Please note that the coolant in the third flow channel 113 is in the first vapor chamber element 302 through the liquid-gas two-phase circulation flow between the heat absorption end 60 and the condensation end 70 (such as Figure 1 In practice, the first flow channel 111 is formed by the first connecting pipe 1110 connecting the first liquid inlet 1011, the first heat exchange chamber 101 and the first liquid outlet 1012, and the second flow channel 112 is formed by the second connecting pipe 1120 connecting the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange chamber 3011, the third liquid outlet 3013 and the second liquid outlet 1014.

[0035] in, Figure 2 The positions of the first liquid inlet 1011, the first liquid outlet 1012, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014 and the third liquid outlet 3013 are not limited to this, and can be designed according to the actual server requirements. In addition, in practice, the size of the first closed shell 10 of the electronic device 1 with triple liquid cooling cycle of the present invention meets the 1u size specification of the closed shell in the server, and can be set in the combined cabinet frame of the server, but the size specification is not limited to this, and it can also be a 2u size specification of the closed shell or a cabinet size of the server designed for individual needs. At the same time, it is not limited to the application in the server, and any electronic device, communication device and vehicle device can be used as it.

[0036] In addition to being applicable to the common specifications currently available on the market (i.e., only one main heat source is provided on a set of circuit motherboards), the electronic device 1 with triple liquid cooling cycle of the present invention can also be applied when two main heat sources (or more) are provided on the circuit motherboard. Figure 3 , Figure 3 FIG. 1 is a schematic diagram showing an electronic device with a triple liquid cooling cycle according to another embodiment of the present invention. Figure 3As shown, when two sets of main heat sources are provided (not shown), second heat exchange chambers 3011, 3011' can be provided on the two sets of main heat sources, and a second flow channel 112' is formed through the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange chamber 3011, the third liquid outlet 3013, the fourth liquid inlet 3014, the second heat exchange chamber 3011', the fourth liquid outlet 3015 and the second liquid outlet 1014 to allow the second coolant to circulate.

[0037] In practice, the first coolant is a non-conductive single-phase coolant or a non-conductive two-phase coolant, the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water, but the coolant material is not limited thereto. It is worth noting that water is selected as the third coolant because water has a higher latent heat of vaporization and can quickly and efficiently take away the heat generated by the first heating element 201, and the first heat exchange cavity 101 and the second heat exchange cavity 3011, 3011' are respectively filled with the first coolant and the second coolant, and the absorbed heat can be taken away through circulation. Among them, the first closed shell 10 can be welded to the bottom plate 114 by welding, so that the first heat exchange cavity 101 has better sealing performance and can also avoid leakage of the first coolant, but the joining process method is not limited thereto.

[0038] The first heating element of the present invention can be directly mounted on the circuit motherboard, or can be mounted on the circuit motherboard by using a slot connection method. Figure 4 , Figure 4 A cross-sectional view of an electronic component according to another embodiment of the present invention is shown. Figure 4 As shown, another specific embodiment of the present invention is an electronic device with triple liquid cooling cycle, further comprising a circuit daughter board 21, and electrically connected to a circuit mother board (not shown), a first heating element 201 is disposed on the circuit daughter board 21, and the circuit daughter board 21, the first heating element 201 and the liquid cooling heat dissipation module 30 form an electronic component 50 with heat dissipation function. In practice, the circuit daughter board 21 can be designed as a plate-shaped and can be disposed on the circuit mother board (not shown) in a slot manner.

[0039] In addition to the main heat source with a larger power, a secondary heat source with a lower power may be provided near the main heat source. The following will describe in detail the first vapor chamber element 302 that can be used for both the main heat source and the secondary heat source to dissipate heat. Figure 4, a second heating element 211 is further provided on the circuit board 21, and the liquid cooling heat dissipation module 30 includes a copper upper cover 311 and a copper lower cover 312, wherein the copper lower cover 312 has a first region A and a second region B relative to the copper upper cover 311, wherein the first region A has a first lower surface 313, and the second region B has a second lower surface 315 and a second upper surface 316. When the copper upper cover 311 is joined to the copper lower cover 312, a first vapor chamber element 302 is formed, wherein the first lower surface 313 of the first region A is used to contact the first heating element 201, and the second lower surface 315 of the second region B is used to contact the second heating element 211. In a specific embodiment, the first vapor chamber element 302 is a three-dimensional structure, and may also be a two-dimensional structure.

[0040] The electronic component 50 further includes a half-open shell 320, which is connected to the copper lower cover 312 to form a second closed shell 301 and a second heat exchange cavity 3011. The second heat exchange cavity 3011 is used to accommodate the copper upper cover 311 and the second upper surface 316 of the second area B, and the third liquid inlet 3012 and the third liquid outlet 3013 are arranged on the half-open shell 320. In practice, the first heating element 201 is the main heat source (such as a high-power CPU chip, a graphics chip, an AI chip, an IGBT chip); the second heating element 211 is a lower-power secondary heat source (such as a passive component, a memory). Figure 4 The electronic assembly 50 can also be installed in Figure 1 To form an electronic device with a triple liquid cooling cycle, please refer to Figure 4 as well as Figure 1 , considering that the temperature caused by the actual heating of the secondary heat source is lower than that of the primary heat source, if the first region A is located next to the third liquid inlet 3012, when the temperature raised by the heat taken away by the second coolant from the first heating element 201 in the first region A is much higher than the temperature of the second heating element 211, the second region B is not only unable to dissipate heat effectively, but is also likely to increase the temperature of the second heating element 211. Therefore, the second region B in the first vapor chamber element 302 of the present invention is disposed close to the third liquid inlet 3012, but in practice, the flow direction of the second coolant is not limited thereto.

[0041] The electronic component 50 of the electronic device with triple liquid cooling cycle of the present invention further includes a two-dimensional temperature evaporating plate element 330, which can simultaneously dissipate heat for some relatively high power secondary heat sources. The configuration method of the two-dimensional temperature evaporating plate element 330 will be further described below.

[0042] See also Figure 4 , Figure 5 as well as Figure 6 , Figure 5 Shows the Figure 4A cross-sectional view of a first vapor chamber element. Figure 6 Shows the Figure 5 This is an enlarged view of area B. Figure 4 as well as Figure 5 As shown, the two-dimensional temperature plate element 330 is formed in the second area B of the copper lower cover 312, and the second area B can dissipate heat for the second heating element 211. Figure 5 as well as Figure 6 ,like Figure 6 As shown, the two-dimensional temperature plate element 330 includes a flat plate 3302. Relative to the second region B of the copper lower cover 312, the second region B has a lower cover cavity 3303. When the flat plate 3302 is bonded to the second region B of the copper lower cover 312, the lower cover cavity 3303 forms a second vapor cavity 3304. In addition, in this specific embodiment, the flat plate lower surface 3305 of the flat plate 3302 is used to contact the second heating element 211. Therefore, in this specific embodiment, the flat plate lower surface 3305 of the flat plate 3302 and the second lower surface 315 of the copper lower cover 312 are coplanar.

[0043] In addition to the above-mentioned method for setting the flat plate 3302 in the copper lower cover 312, another method for setting the flat plate 3302 in the copper lower cover 312 will be described below. Figure 7 as well as Figure 8 , Figure 7 A cross-sectional view of a first vapor chamber element according to another embodiment of the present invention is shown. Figure 8 Shows the Figure 7 This is an enlarged view of area B. Figure 7 , Figure 8 As shown, when the plate 3302 is connected to the second area B', the lower cover cavity 3303 forms a second vapor cavity 3304 and the plate 3302 is located on the second upper surface 316. At this time, the lower surface 3301 of the temperature vaporizer is used to contact the second heating element 211.

[0044] See also Fig. 9 , Fig. 9 Shows the Figure 1 A cross-sectional view of the first vapor chamber element. Fig. 9 As shown, a groove 317 can be milled out by a computer numerical control (CNC) machine. The plurality of grooves 317 are located in the first area A and the second area B of the copper lower cover 312. The grooves 317 can be processed separately according to the number and height of the first heating element (not shown) and the second heating element (not shown), so that the depth of the grooves 317 can better match the height of the first heating element (not shown) and the second heating element, so as to conduct heat more efficiently. Please note that Fig. 9The flat plate 3302 of the two-dimensional temperature equalizing plate element 330 is also disposed on the second upper surface 316 , wherein the configuration of the flat plate 3302 is substantially the same as before and will not be described again.

[0045] Please refer to Fig. 9 ,like Fig. 9 As shown, the copper upper cover 311 includes a substrate 3110 and a tube 3111, the substrate 3110 has a substrate cavity 3112, an opening (not marked) and an upper outer surface (not marked), and the tube 3111 has a tube cavity 3113, wherein the tube 3111 is disposed on the upper outer surface of the substrate 3110 and is located above the opening and protrudes outward from the upper outer surface (i.e. Fig. 9 When the copper upper cover 311 is bonded to the first region A of the copper lower cover 312, the tube cavity 3113 and the substrate cavity 3112 form the air cavity 314 of the first vapor chamber element 302. In practice, the tube 3111 can be formed by continuously stamping and stretching the copper upper cover 311 from a metal plate to form an integrally formed tube 3111, and the shape of the tube 3111 can be a cylinder, a rectangular prism, an elliptical cylinder and a cone, but is not limited thereto.

[0046] Next, the tube body 3111 also has a top end 3114, and the top end 3114 has a nozzle sealing structure 3115. The nozzle sealing structure 3115 is formed by a liquid nozzle pre-set at the top end 3114, after the third coolant is injected into the first steam chamber element 302 through the liquid nozzle, and then the liquid nozzle is sealed. In practical applications, the liquid nozzle can be sealed by welding or the like. In addition, the nozzle sealing structure 3115 and the liquid nozzle in the present specific embodiment are both located at the top end 3114 of the tube body 3111, but the practical application is not limited thereto, and the nozzle sealing structure 3115 and the liquid nozzle can also be set at any position on the tube body 3111. In addition, in other embodiments of the present invention, the first steam chamber element 302 (i.e. Figure 5 as well as Figure 7 ) are the same as above and will not be described in detail here.

[0047] In summary, the present invention provides an electronic device with a triple liquid cooling cycle. First, the heat generated by the high power density component is changed through the phase change of the two-phase flow cycle in the third flow channel of the vapor chamber, so that the third cooling liquid in the capillary structure of the heat absorption zone in the vapor chamber undergoes a phase change and allows the heat energy to be efficiently transferred, and then the second cooling liquid flowing in the second heat exchange cavity of the second flow channel is used to exchange heat with it. The heat generated by the lower power secondary heat source on other circuit motherboards and the residual heat that the liquid cooling heat dissipation module cannot take away are all taken away by the non-conductive first cooling liquid in the first heat exchange cavity through the first flow channel circulation, so that the electronic device has a better heat dissipation effect. Compared with the conventional technology, the electronic device with a triple liquid cooling cycle of the present invention integrates a circuit motherboard and all the heating components with a heat dissipation system to form an electronic device with its own liquid cooling heat dissipation function. This device can be a server or a communication switch. In practical applications, this device can be directly stacked and inserted into a cabinet, and then connected to an external cooling liquid circulation system to achieve the function of self-heat dissipation of the electronic device. The present invention provides an electronic device with triple liquid cooling cycle, which can save the cost of using cooling liquid and greatly increase the heat dissipation efficiency of the electronic device.

[0048] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. An electronic device with triple liquid cooling cycle, characterized in that Contains: A first closed shell having a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the first liquid inlet and the first liquid outlet are respectively connected to the first heat exchange cavity; A motherboard is disposed in the first closed shell and located in the first heat exchange cavity, and the motherboard is electrically connected to a first heating element; and A liquid cooling heat dissipation module is coupled to the first heating element and includes a second closed shell and a first steam chamber element, the second closed shell has a second heat exchange cavity, a third liquid inlet and a third liquid outlet, the third liquid inlet and the third liquid outlet are respectively connected to the second liquid inlet and the second liquid outlet, and the first steam chamber element is arranged in the second heat exchange cavity, and the first steam chamber element has a heat absorption end and a condensation end; Among them, the first heat exchange chamber, the first liquid inlet and the first liquid outlet form a first flow channel for a first coolant to circulate, the second heat exchange chamber, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for a second coolant to circulate, a third flow channel is formed inside the first steam chamber element for a third coolant to flow in a two-phase flow circulation form, the heat absorption end of the first steam chamber element is closely attached to the first heating element, and the condensation end of the first steam chamber element is immersed in the second coolant.

2. An electronic device with triple liquid cooling cycle as claimed in claim 1, characterized in that: The first closed shell is a closed shell that complies with the 1u size specification. The electronic device can be placed in a modular cabinet frame, and the electronic device can be a server or a communication device.

3. The electronic device with triple liquid cooling cycle as claimed in claim 1, characterized in that: It also includes a circuit daughter board electrically connected to the circuit mother board. The first heating element is arranged on the circuit daughter board. The circuit daughter board, the first heating element and the liquid cooling module form an electronic component with heat dissipation function.

4. An electronic device with triple liquid cooling cycle as claimed in claim 3, characterized in that: A second heating element is also provided on the circuit board. The liquid cooling heat dissipation module includes a copper upper cover and a copper lower cover. The copper lower cover has a first area and a second area relative to the copper upper cover. The first area has a first lower surface, and the second area has a second lower surface and a second upper surface. When the copper upper cover is joined to the first area of ​​the copper lower cover, the first steam chamber element is formed. The first lower surface of the first area is used to contact the first heating element, and the second lower surface of the second area is used to contact the second heating element.

5. An electronic device with triple liquid cooling cycle as claimed in claim 4, characterized in that: The electronic component further includes a half-open shell connected to the copper lower cover to form the second closed shell and the second heat exchange cavity. The second heat exchange cavity is used to accommodate the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell.

6. An electronic device with triple liquid cooling cycle as claimed in claim 5, characterized in that: The electronic component further comprises a two-dimensional temperature averaging plate element, which is formed in the second area of ​​the copper lower cover and has a second vapor cavity and a temperature averaging plate lower surface, and the temperature averaging plate lower surface is used to contact the second heating element.

7. An electronic device with triple liquid cooling cycle as claimed in claim 6, characterized in that: The two-dimensional temperature plate element includes a flat plate. Relative to the second area of ​​the copper lower cover, the second area has a lower cover cavity. When the flat plate is connected to the second area of ​​the copper lower cover, the lower cover cavity forms the second vapor chamber.

8. An electronic device with triple liquid cooling cycle as claimed in claim 4, characterized in that: The copper upper cover includes a substrate and a tube body, wherein the substrate has a substrate cavity, an opening and an upper outer surface, and the tube body has a tube body cavity. The tube body is arranged on the upper outer surface and is located above the opening and protrudes outward from the upper outer surface. When the copper upper cover is joined to the first area of ​​the copper lower cover, the tube body cavity and the substrate cavity form an air cavity of the first vapor chamber element.

9. The electronic device with triple liquid cooling cycle as claimed in claim 1, characterized in that: The first coolant is a non-conductive single-phase coolant or a non-conductive two-phase coolant, the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water.

10. The electronic device with triple liquid cooling cycle as claimed in claim 1, characterized in that: The first flow channel is formed by a first connecting pipe connecting the first liquid inlet, the first heat exchange chamber and the first liquid outlet, and the second flow channel is formed by a second connecting pipe connecting the second liquid inlet, the third liquid inlet, the second heat exchange chamber, the third liquid outlet and the second liquid outlet. The third flow channel is formed by the two-phase flow circulation inside the first steam chamber element.

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