Glue overflowing process for photovoltaic module

Abstract

The invention relates to the technical field of photovoltaics, in particular to a photovoltaic module glue overflowing process which comprises the following steps: preparing a laminated piece with a set thickness; trimming and cleaning the laminated part; aB glue with a set proportion is used for gluing in the vertical direction of the frame; the laminated part is firstly lifted to a safe distance through a servo system and then slowly descends after the frame is assembled, and the servo system is used for stably extruding the assembly from top to bottom; a first curing room and a second curing room are arranged to cure the frame glue and the junction box glue respectively; and after curing is completed, glue overflowing from the edge of the front glass of the assembly is cleaned. After glue overflowing, the thickness of the assembly is kept 30 + / -0.5 mm, the glue overflowing height reaches 2 mm, due to the fact that the front face of the assembly is not provided with a frame, no dust accumulation is achieved, the photoelectric conversion efficiency is greatly improved, and the method further has the requirements for the glass thickness, glue materials, glass edge smoothness, the gluing mode, the pressing distance and the line body layout. The method is further suitable for processing a novel photovoltaic module with a frame free of the A surface.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic technology, and in particular to a photovoltaic component glue overflow process. Background Art

[0002] The photovoltaic module glue overflow process is an important link in the photovoltaic module production process. By precisely controlling the injection, pressing and curing process of the sealant, the sealing effect and long-term stability of the module are ensured.

[0003] The existing announcement number CN103367529B discloses a method for making a photovoltaic module overflow sealant, which includes the following steps: 1) adjusting the glue output of an automatic glue injection machine; 2) pre-treating the laminate; 3) using an automatic glue injection machine to inject glue into the frame, and the amount of glue injection must be sufficient to allow the glue to overflow after the frame and the laminate are framed; 4) using a frame assembly machine to frame the frame and the laminate; 5) using a frame assembly and corner assembly machine to frame the frame and the laminate after framing to form a photovoltaic module; 6) taking out the photovoltaic module after framing. Compared with the existing technology, it has the advantages of high production efficiency, low cost, good product sealing, and wide application range.

[0004] However, traditional photovoltaic module frames usually have an A-side, which is the side close to the frame groove and facing the front of the photovoltaic panel. It is directly exposed to the external environment and is easily affected by pollutants such as dust and dirt, which in turn affects the power generation efficiency of the photovoltaic module. There is currently a new type of photovoltaic module frame without an A-side, which achieves no dust accumulation and greatly improves the photoelectric conversion efficiency. However, this new type of photovoltaic module has very high requirements on glass thickness, glue material, glass edge smoothness, gluing method, pressing distance and line layout, and thus the above-mentioned photovoltaic module overflow sealing production method is not applicable. Summary of the invention

[0005] The purpose of the present invention is to provide a photovoltaic module glue overflow process, which solves the problem that the existing photovoltaic module glue overflow sealing production method is not suitable for a new photovoltaic module with a frame without an A surface.

[0006] To achieve the above object, the present invention provides a photovoltaic module glue overflow process, comprising the following steps:

[0007] preparing a laminate of a set thickness;

[0008] De-edging and cleaning the laminate;

[0009] Use AB glue with a set ratio to glue in the vertical direction of the frame;

[0010] The laminate is first raised to a safe distance by a servo system, and then slowly lowered after the frame is assembled, using the servo system to smoothly squeeze the components from top to bottom;

[0011] Set up curing room No. 1 and curing room No. 2 to cure the frame glue and junction box glue respectively;

[0012] After curing is complete, clean the glue that overflows from the edge of the component's front glass.

[0013] Wherein, preparing a laminate of a set thickness, the step further comprises:

[0014] The layers are stacked in the order of glass-EVA film-cell-EVA film-glass, where the front and back glass misalignment is ≤1mm, and the edges of the glass are free of EVA overflowing onto the front and back glass surfaces;

[0015] Put the laminated components into the laminator, start the heating and pressurizing process, and start the vacuum system of the laminator to extract the air inside the components while heating and pressurizing;

[0016] When the EVA film is melted by heat, a certain constant temperature curing time is maintained to allow the EVA film to fully bond with the glass and battery cells. After curing, a cooling process is performed to gradually cool the component to room temperature. The thickness of the component after lamination is in the range of 5±0.2mm.

[0017] Wherein, the laminate is subjected to edge removal and cleaning, and the step further comprises:

[0018] Use an automatic edge trimming machine to remove burrs from EVA film;

[0019] Clean the laminate after edge trimming.

[0020] Wherein, the glue is applied in a vertical direction of the frame using AB glue of a set ratio, and the step further includes:

[0021] Use 1:1 AB glue and a special glue nozzle to apply glue perpendicular to the frame, ensuring that the glue is flat and 3mm away from the frame.

[0022] The laminate is first raised to a safe distance by a servo system, and then slowly lowered after the frame is assembled, and the servo system is used to smoothly squeeze the components from top to bottom, and the steps also include:

[0023] Before framing, use machine vision or positioning devices to ensure that the centering distance of the component glass is consistent;

[0024] Use the hook frame method to fit the frame onto the pad, with profile A facing upwards;

[0025] By adjusting the position of the positioning cylinder, the distance between the component and the frame is kept consistent and centered;

[0026] The laminate is first raised to a safe distance by the servo system, and then slowly lowered after the frame is assembled to ensure there is no shaking or blocking;

[0027] Use the servo system to squeeze the component smoothly from top to bottom, ensuring that the distance between the pressing block and the edge of the component is 5mm and the pressing speed is uniform and stable;

[0028] After pressing, the thickness of the component is 30±0.5mm, and the glue overflows the glass surface by 2mm.

[0029] Wherein, a first curing room and a second curing room are set to respectively cure the frame glue and the junction box glue, and the steps further include:

[0030] Use a transfer fork to place the components on the curing tray to avoid contact and adhesion between components.

[0031] A photovoltaic module glue overflow process of the present invention is applied to a new photovoltaic module with a frame without an A-side. After the glue overflow, the thickness of the module is maintained at 30±0.5mm and the height of the glue overflow reaches 2mm, thereby avoiding the formation of voids between the module and the frame gap and ensuring the stability of the module structure. Since the front of the module has no frame, no dust accumulation is achieved, the photoelectric conversion efficiency is greatly improved, showing great development potential. According to experimental data statistics, the photoelectric conversion efficiency of this new module is 5% higher than that of conventional modules. The method further requires the glass thickness, glue material, glass edge smoothness, gluing method, pressing distance and line layout, and is therefore suitable for processing a new photovoltaic module with a frame without an A-side. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0033] Figure 1 It is a flow chart of the steps of the photovoltaic module glue overflow process according to the first embodiment of the present invention. DETAILED DESCRIPTION

[0034] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0035] The first embodiment of the present application is:

[0036] See also Figure 1 ,in, Figure 1 1 is a flow chart of the steps of the photovoltaic module glue overflow process of the first embodiment of the present invention. The present invention provides a photovoltaic module glue overflow process, comprising the following steps:

[0037] S100: preparing a laminate of a set thickness;

[0038] Specifically, the layers are stacked in the order of glass-EVA film-battery cell-EVA film-glass, wherein the misalignment will cause the gap between the glass and the frame to be too small or no gap, resulting in the glue being unable to overflow. The front and back glass misalignment is achieved by precise laminating molds and positioning devices ≤1mm, and the laminating process and EVA distribution control are optimized to ensure that no EVA overflows from the glass edge to the front and back glass surfaces, otherwise it will affect the glue overflow effect and the thickness of the component; the laminated components are placed in a laminator, and the heating and pressurizing procedures are started. While heating and pressurizing, the vacuum system of the laminator is started to extract the air inside the component; when the EVA film is melted by heat, a certain constant temperature curing time is maintained to fully bond the EVA film to the glass and battery cell. After curing is completed, a cooling treatment is performed to gradually cool the component to room temperature, and monitoring and adjustment are performed by precise laminators and thickness measuring equipment to ensure that the thickness of the laminated component is in the range of 5±0.2mm.

[0039] S200: removing edges and cleaning the laminate;

[0040] Specifically, use an automatic trimming machine to remove EVA burrs. There should be no EVA burrs after trimming, otherwise it will affect the glue overflow effect. There should be no residual glue at the trimming corners, otherwise it will affect the glue overflow effect at the corners. Ensure that there is no residual glue and burrs after trimming. Clean the laminate after trimming, check and confirm that there is no residue.

[0041] S300: Use AB glue with a set ratio to glue in the vertical direction of the frame;

[0042] Specifically, use 1:1 AB glue to ensure the glue mixing ratio is accurate and has a 3-minute surface drying characteristic. The glue nozzle is glued perpendicular to the frame to ensure that the glue is flat and 3mm away from the frame. The glue weight is: 165±5g.

[0043] S400: The laminate is first raised to a safe distance by a servo system, and then slowly lowered after the frame is assembled, and the servo system is used to smoothly squeeze the components from top to bottom;

[0044] Specifically, when framing, first ensure that the centering distance of the component glass is consistent (to ensure uniform glue discharge after pressing), the framing robot grabs the frame and puts it into the framing machine, and uses the hook frame method to fit the frame on the pad (profile A faces up), and by adjusting the position of the positioning cylinder, the distance from the component to the frame is kept consistent and centered (the distance between the long and short glass edges and the frame is equal). The framing method adopts the frame assembly first, but before the framing is assembled, the laminate is first raised by the servo to a safe distance beyond the frame, and then slowly falls down by the servo after the framing is completed, and the laminate is bonded with the glue. During operation, ensure that there is no jitter or blockage, otherwise it will affect the glue overflow effect. The servo is used to squeeze the component from top to bottom to ensure that the distance between the pressure block and the edge of the component is about 5mm (to prevent the glue from overflowing and contacting the pressure block to affect the glue type). The pressing speed is kept stable, otherwise it will cause the component and the frame to be delaminated. The pressure block of the press must be kept horizontal, otherwise the overflow will be uneven after the glue overflows. The pad of the press must be accurately level, otherwise the overflow will be uneven after the glue overflows. After pressing, ensure that the component thickness is 30±0.5mm and the glue overflows 2mm from the glass surface. S500: Set up curing room No. 1 and curing room No. 2 to cure the frame glue and junction box glue respectively;

[0045] Specifically, the curing room is divided into curing room No. 1 and curing room No. 2, which are used to cure the frame glue and junction box glue respectively. The curing room uses a transport fork to take the components to the curing tray for curing. The purpose of using the curing tray is to ensure that each component has no contact and avoid adhesion between components.

[0046] S600: After curing is completed, clean the glue overflowing from the edge of the component's front glass.

[0047] Specifically, after curing is completed, the cleaning station is used, and the glue overflowing from the edge of the front glass of the component needs to be cleaned up. After cleaning, the frame, glue and glass are basically kept at the same level. Due to the front frame assembly of the new photovoltaic component, the C side of the frame is in contact with the assembly line. The assembly line before curing is connected to the single machine and the assembly line is connected to the assembly line. The fork-connected assembly line is used to prevent the component from shaking and pulling during the movement, causing the component and the frame to separate, affecting the structural stability of the component and the overflow effect.

[0048] After the overflow of glue, the thickness of the component is maintained at 30±0.5mm and the height of the overflow of glue reaches 2mm, which avoids the formation of voids between the component and the frame gap and ensures the stability of the component structure. Since the front of the component has no frame, no dust accumulation is achieved, the photoelectric conversion efficiency is greatly improved, showing great development potential. According to experimental data statistics, the photoelectric conversion efficiency of this new component is 5% higher than that of previous conventional components. The method makes further requirements on the glass thickness, glue material, glass edge smoothness, gluing method, pressing distance and line layout, and is therefore suitable for processing a new photovoltaic component with no A-side frame.

[0049] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A photovoltaic module glue overflow process, characterized in that: The following steps are involved: preparing a laminate of a set thickness; De-edging and cleaning the laminate; Use AB glue with a set ratio to glue in the vertical direction of the frame; The laminate is first raised to a safe distance by a servo system, and then slowly lowered after the frame is assembled, using the servo system to smoothly squeeze the components from top to bottom; Set up curing room No. 1 and curing room No. 2 to cure the frame glue and junction box glue respectively; After curing is complete, clean the glue that overflows from the edge of the component's front glass.

2. The photovoltaic module glue overflow process according to claim 1, characterized in that: Preparing a laminate of a set thickness, the step further comprising: The layers are stacked in the order of glass-EVA film-cell-EVA film-glass, where the front and back glass misalignment is ≤1mm, and the edges of the glass are free of EVA overflowing onto the front and back glass surfaces; Put the laminated components into the laminator, start the heating and pressurizing process, and start the vacuum system of the laminator to extract the air inside the components while heating and pressurizing; When the EVA film is melted by heat, a certain constant temperature curing time is maintained to allow the EVA film to fully bond with the glass and battery cells. After curing, a cooling process is performed to gradually cool the component to room temperature. The thickness of the component after lamination is in the range of 5±0.2mm.

3. The photovoltaic module glue overflow process according to claim 2, characterized in that: De-edging and cleaning the laminate, the steps further comprising: Use an automatic edge trimming machine to remove burrs from EVA film; Clean the laminate after edge trimming.

4. The photovoltaic module glue overflow process according to claim 3, characterized in that: Gluing is performed in a vertical direction of the frame using AB glue of a set ratio, and the steps further include: Use 1:1 AB glue and a special glue nozzle to apply glue perpendicular to the frame, ensuring that the glue is flat and 3mm away from the frame.

5. The photovoltaic module glue overflow process according to claim 4, characterized in that: The laminate is first raised to a safe distance by a servo system, and then slowly lowered after the frame is assembled, and the servo system is used to smoothly squeeze the components from top to bottom, and the steps also include: Before framing, use machine vision or positioning devices to ensure that the centering distance of the component glass is consistent; Use the hook frame method to fit the frame onto the pad, with profile A facing upwards; By adjusting the position of the positioning cylinder, the distance between the component and the frame is kept consistent and centered; The laminate is first raised to a safe distance by the servo system, and then slowly lowered after the frame is assembled to ensure there is no shaking or blocking; Use the servo system to squeeze the component smoothly from top to bottom, ensuring that the distance between the pressing block and the edge of the component is 5mm and the pressing speed is uniform and stable; After pressing, the thickness of the component is 30±0.5mm, and the glue overflows the glass surface by 2mm.

6. The photovoltaic module glue overflow process according to claim 5, characterized in that: A first curing room and a second curing room are provided to respectively cure the frame glue and the junction box glue, and the steps further include: Use a transfer fork to place the components on the curing tray to avoid contact and adhesion between components.

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