Device and system for simulating heat flow of heat experiment under normal pressure and use method

Abstract

The invention provides a thermal experiment heat flow simulation device under normal pressure. The thermal experiment heat flow simulation device comprises a thin plate, a thermocouple and an infrared lamp array, the thermocouple is arranged on the surface of a satellite through a thin plate, and the infrared lamp arrays are sequentially and uniformly arranged around the surface of the satellite and are opposite to the thermocouple; and the thermocouple adjusts the temperature of the test box according to a signal sent by the temperature detection system. The device further comprises a lamp array baffle, the lamp array baffle is connected with the infrared lamp array through a supporting piece, and the lamp array baffle isolates heat generated by a thermal experiment. The integrated lamp array design is adopted, the trundles and the supporting bases are arranged, and the constant-pressure heat test device is suitable for constant-pressure heat tests and is convenient to install and easy to operate in a constant-pressure heat test box. The thermocouple is used for replacing a heat flow meter in a vacuum thermal test for temperature control, the baffle is used for isolating heat flows of different partitions, and the temperature checking requirements of different single machines of products in a normal-pressure environment can be met.

Description

Technical Field

[0001] The present application relates to the field of instrument measurement technology, and in particular, to a thermal flow simulation device, system and use method for thermal experiments under normal pressure. Background Art

[0002] Spacecraft experience extreme thermal environments when entering the atmosphere or performing orbital operations. These thermal environments have a significant impact on the materials, structures, and electronic equipment of spacecraft, so these factors must be thoroughly studied and tested during the design phase. In order to ensure the safety and reliability of spacecraft during the mission, thermal experiments and thermal flow simulations are very critical.

[0003] Spacecraft will encounter various heat flow conditions during operation, such as solar radiation, reflected radiation from the earth, aerodynamic heating caused by atmospheric friction, etc. The heat flow characteristics determine the distribution of spacecraft surface temperature and the thermal response of materials, which have a direct impact on the performance, life and safety of the spacecraft. Therefore, accurate simulation and testing of heat flow characteristics is a key step in the spacecraft design and verification process.

[0004] During the development of spacecraft, thermal experiments are used to simulate the thermal environment under different working conditions, which can truly reproduce the thermodynamic behavior of the spacecraft during operation. Thermal experiments usually include thermal vacuum environment, thermal balance test, and material thermal property test. Through these experiments, the design of the spacecraft thermal control system can be verified, its thermal performance can be evaluated, and necessary improvements can be made.

[0005] Thermal flow simulators are devices designed to reproduce the thermal flow conditions that spacecraft may encounter in actual environments. These devices can simulate a variety of thermal flow inputs, such as radiation, convection, and conduction, and precisely control experimental conditions by adjusting parameters such as temperature, flow rate, and direction. Modern thermal flow simulators usually use computer control systems that can accurately simulate the thermal flow distribution of spacecraft in different orbits and different postures, providing key data support for spacecraft design.

[0006] The main technical challenges faced by thermal flow simulation devices are how to accurately reproduce complex thermal environments, such as the superposition effect of multi-source heat flow, and how to accurately measure and record experimental data. At the same time, with the complexity of space missions and the application of new materials, higher requirements are placed on the accuracy and versatility of thermal flow simulation devices. In recent years, with the development of computer simulation technology, the combination of thermal flow simulation and numerical simulation has become a trend, which can estimate and optimize the thermal flow situation before the experiment, further improving the efficiency and accuracy of the experiment.

[0007] Compared with the previous thermal vacuum test assessment method, the normal pressure thermal test has outstanding advantages such as short test cycle and low cost. The normal pressure thermal test is different from the infrared simulation method of the vacuum thermal test. The infrared lamp array is the best choice for the normal pressure thermal test. In the normal pressure thermal cycle box, there are few ground installation interfaces, and the box cannot be equipped with a crane. Unlike ordinary horizontal tanks, there are no guide rails in the box. The traditional installation method of the infrared lamp array in the vacuum tank-column support + crane auxiliary lifting is not applicable to the high and low temperature test chamber. Therefore, it is necessary to provide a normal pressure heat flow simulation device that is simple to install and operate. In addition, under normal pressure environment, it is difficult to achieve the differentiation of the surface temperature of the star through airflow convection heat exchange, which brings great challenges to the assessment of the temperature conditions of the entire star. The heat flow meter cannot be used in a normal pressure environment, and a new temperature control method is also needed. Summary of the invention

[0008] In view of the defects in the prior art, the purpose of the present application is to provide a thermal flow simulation device for thermal experiments under normal pressure.

[0009] According to the application, a thermal flow simulation device for thermal experiments under normal pressure is provided, comprising: a thin plate, a thermocouple and an infrared lamp array;

[0010] The thermocouple is arranged on the satellite surface through a thin plate, and the infrared lamp array is evenly arranged in sequence around the satellite surface and arranged opposite to the thermocouple;

[0011] The thermocouple adjusts the temperature of the test chamber according to the signal sent by the temperature detection system.

[0012] Preferably, it also includes a lamp array baffle, which is connected to the infrared lamp array through a support member, and the lamp array baffle insulates the heat generated by the thermal experiment.

[0013] Preferably, it also includes an aluminum profile frame, casters and a support base;

[0014] The aluminum profile frame is connected to the light array baffle, the support seat and casters are both installed at the bottom of the aluminum profile frame, the casters drive the aluminum profile frame to move / stand still, and the support seat has a lifting and lowering adjustment function.

[0015] The present application also provides a thermal flow simulation system for thermal experiments under normal pressure, characterized in that it comprises at least two thermal flow simulation devices for thermal experiments under normal pressure as described in claims 1-3.

[0016] Preferably, three of the thermal flow simulation devices for thermal experiments under normal pressure are included, and the three thermal flow simulation devices for thermal experiments under normal pressure are placed in a T shape around the satellite.

[0017] The present application also provides a method for using a thermal flow simulation device for thermal experiments under normal pressure, characterized in that the thermal flow simulation device / system for thermal experiments under normal pressure is used, comprising:

[0018] Step 1: Determine the error range of the temperature control temperature based on the satellite on-orbit temperature data or the satellite thermal balance test data;

[0019] Step 2: Use a normal pressure heat test chamber to provide ambient temperature;

[0020] Step 3: Using the thermocouple temperature as the temperature control target value, a closed-loop control algorithm is used to perform initial temperature control on the internal temperature of the satellite;

[0021] Step 4: After the temperature inside the satellite reaches thermal equilibrium, the thermocouple temperature is compared with the previous data. If it is within the error range, the experimental temperature is considered to be up to standard and the experiment is started. If it is beyond the error range, the thermocouple temperature control temperature is further adjusted.

[0022] Step 5: Return to step 1 until all test conditions are completed.

[0023] Preferably, the aluminum profile frame is No. 30 or No. 40 aluminum profile.

[0024] Preferably, the thin plate may be made of aluminum plate.

[0025] Preferably, the light array baffle is made of aluminum or stainless steel.

[0026] Preferably, the infrared lamp array adopts an integrated structure design.

[0027] Compared with the prior art, this application has the following beneficial effects:

[0028] 1. This application adopts an integrated lamp array design with casters and support seats, which is suitable for normal pressure thermal testing. It is easy to install and simple to operate in a normal pressure thermal test chamber.

[0029] 2. This application uses thermocouples to replace the heat flow meter in the vacuum thermal test for temperature control, and uses baffles to isolate the heat flow in different partitions, so as to achieve the temperature assessment requirements of different single products under normal pressure environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0031] Figure 1 This application mainly embodies the schematic diagram of the structure of the heat flow simulation device for thermal experiments under normal pressure;

[0032] Figure 2 This application mainly reflects the structural schematic diagram of the heat flow simulation system for thermal experiments under normal pressure.

[0033] As shown in the figure: 1. Satellite body; 2. Onboard single unit; 3. Thermocouple; 4. Thin plate; 5. Light array baffle; 6. Infrared light array; 7. Aluminum profile frame; 8. Casters; 9. Support base. DETAILED DESCRIPTION

[0034] The present application is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present application, but do not limit the present application in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present application. These all belong to the protection scope of the present application.

[0035] According to the thermal flow simulation device for thermal experiments under normal pressure provided in the present application, it includes: a thin plate 4, a thermocouple 3 and an infrared lamp array 6; the thermocouple 3 is arranged on the surface of the satellite through the thin plate 4, and the infrared lamp array 6 is arranged uniformly in sequence around the surface of the satellite and is arranged opposite to the thermocouple 3; the thermocouple 3 adjusts the temperature of the test box according to the signal sent by the temperature detection system.

[0036] The heat flow simulation device for thermal experiments under normal pressure provided in the present application also includes a lamp array baffle 5, an aluminum profile frame 7, casters 8 and a support seat 9. The lamp array baffle 5 is connected to the infrared lamp array 6 through a support member. The lamp array baffle 5 isolates the heat generated by the thermal experiment. The aluminum profile frame 7 is connected to the lamp array baffle 5. The support seat 9 and the casters 8 are both installed at the bottom of the aluminum profile frame 7. The casters 8 drive the aluminum profile frame 7 to move / stop, and the support seat 9 has a lifting and adjusting function.

[0037] The present application also provides a thermal flow simulation system for thermal experiments under normal pressure, comprising at least two thermal flow simulation devices for thermal experiments under normal pressure.

[0038] A feasible embodiment of the present application is provided below.

[0039] like Figure 2 As shown, the thermal flow simulation system for thermal experiments under normal pressure includes four thermal flow simulation devices for thermal experiments under normal pressure, and the four thermal flow simulation devices for thermal experiments under normal pressure are placed in a T shape around the satellite.

[0040] The present application also provides a method for using a thermal flow simulation device for thermal experiments under normal pressure, comprising the following steps:

[0041] Step 1: Determine the error range of the temperature control temperature based on the satellite on-orbit temperature data or the satellite thermal balance test data;

[0042] Step 2: Use a normal pressure heat test chamber to provide ambient temperature;

[0043] Step 3: Using the temperature of thermocouple 3 as the temperature control target value, a closed-loop control algorithm is used to perform initial temperature control on the internal temperature of the satellite;

[0044] Step 4: After the temperature in the satellite reaches thermal equilibrium, the temperature of thermocouple 3 is compared with the previous data. If it is within the error range, the experimental temperature is determined to be up to standard and the experiment is started. If it exceeds the error range, the temperature control temperature of thermocouple 3 is continued to be adjusted;

[0045] Step 5: Return to step 1 until all test conditions are completed.

[0046] The aluminum profile frame 7 is a No. 30 or No. 40 aluminum profile. The material of the thin plate 4 can be an aluminum plate. The material of the light array baffle 5 is aluminum or stainless steel.

[0047] The thermal flow simulation device of the embodiment of the present invention includes an infrared lamp array 6, a lamp array baffle 5, an aluminum profile frame 7, casters 8, a support seat 9, a thin plate 4 and a thermocouple 3. The infrared lamp array 6 is installed on the heating surface of the satellite; the lamp array baffle 5 is installed around and inside the lamp array; the infrared lamp array 6 is installed on the aluminum profile frame 7; casters 8 and a support seat 9 are installed at the bottom of the aluminum profile frame 7; the thin plate 4 is pasted on the surface of the open satellite; the thermocouple 3 is pasted on the surface of the thin plate 4, facing the lamp array.

[0048] like Figure 1 As shown, a normal pressure thermal cycle test is carried out in a normal pressure thermal test chamber. After the satellite is in place, the satellite body needs to be modified for certain thermal controls. For the open satellite body 1, in order to conduct temperature assessment on the onboard unit 2, heat flow control is required. A thin plate 4 is pasted on the surface, and a thermocouple 3 is pasted on the thin plate 4. The lamp array tooling is an integrated tooling consisting of a lamp array baffle 5, an infrared lamp array 6, an aluminum profile frame 7, casters 8, and a support seat 9. It is pushed to the heating surface position of the satellite body 1, the casters 8 are braked, and the support seat 9 is lowered for portable installation.

[0049] like Figure 2 As shown, the second light array tooling and the third light array tooling on the side are installed in the same way. For the fourth light array tooling on the bottom of the satellite, due to the limited space, it can be installed in an integrated or split manner on the interface left by the first light array tooling and the second light array tooling.

[0050] The control method of the heat flow simulation device of the present invention comprises the following steps:

[0051] Step S1: Determine the lowest environmental benchmark for temperature deviation based on the satellite on-orbit temperature data or the equipment satellite thermal balance test data, and use a normal pressure thermal test chamber to provide the ambient temperature;

[0052] Step S2: taking the temperature of the thermocouple 3 as the temperature control target value, using a closed-loop control algorithm to perform initial temperature control on the single unit in the satellite;

[0053] Step S3: After the temperature of the single machine is balanced, if the difference between the temperature of the single machine and the target temperature of the single machine is within the preset range, it is judged that the single machine meets the assessment requirements; if the temperature of the single machine does not reach the preset range, the temperature control temperature of the thermocouple 3 is adjusted until the temperature of the single machine reaches the preset range, and it is judged that the single machine meets the assessment requirements

[0054] Step S4: Return to step S1 until all test conditions are completed. An integrated structural design is adopted.

[0055] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0056] The above describes the specific embodiments of the present application. It should be understood that the present application is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the substantive content of the present application. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A thermal flow simulation device for thermal experiments under normal pressure, characterized in that: include: A thin plate (4), a thermocouple (3) and an infrared lamp array (6); The thermocouple (3) is arranged on the surface of the satellite through a thin plate (4), and the infrared lamp array (6) is evenly arranged in sequence around the surface of the satellite and is arranged opposite to the thermocouple (3); The thermocouple (3) adjusts the temperature of the test box according to the signal sent by the temperature detection system.

2. The thermal flow simulation device for thermal experiment under normal pressure as claimed in claim 1, characterized in that: It also includes a lamp array baffle (5), the lamp array baffle (5) is connected to the infrared lamp array (6) via a support, and the lamp array baffle (5) isolates heat generated by the thermal experiment.

3. The thermal flow simulation device for thermal experiment under normal pressure as claimed in claim 2, characterized in that: It also includes an aluminum profile frame (7), casters (8) and a support base (9); The aluminum profile frame (7) is connected to the light array baffle (5), the support seat (9) and the caster (8) are both installed at the bottom of the aluminum profile frame (7), the caster (8) drives the aluminum profile frame (7) to move / stand still, and the support seat (9) has a lifting and lowering adjustment function.

4. A thermal flow simulation system for thermal experiments under normal pressure, characterized in that: The device comprises at least two thermal flow simulation devices for thermal experiments under normal pressure as described in claims 1-3.

5. The thermal flow simulation system for thermal experiments under normal pressure as claimed in claim 4, characterized in that: It comprises three heat flow simulation devices for thermal experiments under normal pressure, and the three heat flow simulation devices for thermal experiments under normal pressure are placed in a T shape around the satellite.

6. A method for using a thermal flow simulation device for thermal experiments under normal pressure, characterized in that: The thermal flow simulation device / system for thermal experiments under normal pressure as described in claims 1-5 comprises: Step S1: Determine the error range of the temperature control temperature according to the satellite on-orbit temperature data or the satellite thermal balance test data; Step S2: using a normal pressure heat test chamber to provide an ambient temperature; Step S3: using the temperature of the thermocouple (3) as the temperature control target value and adopting a closed-loop control algorithm to perform initial temperature control on the internal temperature of the satellite; Step S4: After the temperature inside the satellite reaches thermal equilibrium, the temperature of the thermocouple (3) is compared with the previous data. If it is within the error range, the experimental temperature is determined to be up to standard and the experiment is started. If it is beyond the error range, the temperature control temperature of the thermocouple (3) is continuously adjusted. Step S5: Return to step S1 until all test conditions are completed.

7. The thermal flow simulation device / system for thermal experiments under normal pressure as claimed in claim 3, characterized in that: The aluminum profile frame (7) is a No. 30 or No. 40 aluminum profile.

8. The thermal flow simulation device for thermal experiment under normal pressure as claimed in claim 1, characterized in that: The material of the thin plate (4) may be an aluminum plate.

9. The thermal flow simulation device for thermal experiment under normal pressure as claimed in claim 2, characterized in that: The light array baffle (5) is made of aluminum or stainless steel.

10. The thermal flow simulation device for thermal experiment under normal pressure as claimed in claim 1, characterized in that: The infrared lamp array (6) adopts an integrated structural design.

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