Conformal electronic refrigeration device and manufacturing method and using method thereof

Abstract

The invention discloses a shape follow-up electronic refrigeration device and a manufacturing method and a using method thereof, and belongs to the technical field of refrigeration equipment. The conformal electronic refrigeration device comprises a heat dissipation layer, a P-type semiconductor material layer, a refrigeration layer, an N-type semiconductor material layer and a base layer which are sequentially arranged in a stacked mode, and the heat dissipation layer, the refrigeration layer and the base layer are all made of electric conduction and heat conduction materials. The heat dissipation layer is used for exchanging heat with heat dissipation fluid; a refrigerating inner flow channel is arranged in the refrigerating layer, the refrigerating inner flow channel is provided with an inlet end and an outlet end, and the refrigerating layer is used for conducting heat exchange with refrigerating fluid. The method has the following advantages that the 3D printing technology and the material injection technology are adopted, the manufacturing process is simplified, and the production efficiency and economical efficiency are improved; by optimizing the structural design, the influence of the external environment is reduced, and excellent heat dissipation performance can be provided; efficient refrigeration can be carried out, thermoelectric power generation can be carried out, and energy recovery and utilization are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration equipment, and in particular to a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof. Background Art

[0002] With the rapid development of science and technology and the continuous improvement of electronic equipment performance, the heat dissipation problem of electronic equipment has become increasingly prominent. Modern high-performance electronic equipment, such as aerospace engines, high-density electronic equipment, and micro-electronic equipment, have put forward higher requirements for cooling devices. Traditional electronic refrigeration devices are difficult to meet these requirements, mainly in the following aspects: Modern electronic equipment tends to be lightweight and integrated. Traditional refrigeration devices are large in size and difficult to adapt to the trend of equipment miniaturization. Existing electronic refrigeration systems are often complex in structure and occupy a large space, which is not conducive to integrated design. This limits the application of refrigeration devices in compact spaces and restricts the overall design of the equipment. As the computing power and functions of electronic devices increase, the heat generated increases dramatically. Existing cooling technologies often have difficulty managing this heat efficiently, resulting in reduced performance or even damage to the equipment. Insufficient cooling efficiency makes the equipment unstable, seriously affecting its service life and reliability; The manufacturing process of traditional refrigeration devices is relatively backward and cannot meet the requirements of modern electronic equipment for complex shapes and multi-functional integration. Traditional manufacturing methods are mostly step-by-step processing and assembly, which is not only cumbersome and costly, but also difficult to achieve precise customized design.

[0003] With the development of rapid manufacturing technologies such as 3D printing, how to apply them to the manufacture of electronic refrigeration devices has become a key issue. Existing conformal cooling devices are complex in structure and involve multiple materials, so traditional manufacturing methods are difficult to achieve integrated manufacturing. At present, there are also problems with manufacturing based on 3D printing technology. For example, the melting points of different materials in electronic refrigeration devices vary greatly, making it a challenge to simultaneously manufacture and weld multiple materials well.

[0004] In addition, traditional electronic refrigeration devices have the following problems: The cooling area of ​​traditional electronic refrigeration devices is usually set on the outer surface of the core device. This design is easily affected by the external ambient temperature, and the contact area between the refrigerant or gas and the effective cooling area is small, resulting in low cooling efficiency. Traditional electronic refrigeration devices usually have a single function, mainly used for cooling or heat exchange, and fail to fully utilize the functional potential of the equipment. Summary of the invention

[0005] One of the purposes of the present invention is to provide a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof in view of the existing technical status, which adopts 3D printing technology and material injection process to simplify the manufacturing process and improve production efficiency and economy.

[0006] The second purpose of the present invention is to provide a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof in view of the existing technical status, which reduces the influence of the external environment by optimizing the structural design and can provide excellent heat dissipation performance.

[0007] The third purpose of the present invention is to provide a form-fitting electronic refrigeration device and its manufacturing method and use method in response to the existing technical status, which can not only perform efficient refrigeration, but also carry out temperature difference power generation to achieve energy recovery and utilization.

[0008] In order to achieve the above object, the present invention adopts the following technical scheme: A conformable electronic refrigeration device, comprising a heat dissipation layer, a P-type semiconductor material layer, a refrigeration layer, an N-type semiconductor material layer and a base layer stacked in sequence, wherein the heat dissipation layer, the refrigeration layer and the base layer are all made of conductive and thermal conductive materials; The heat dissipation layer is used for heat exchange with the heat dissipation fluid; A refrigeration inner flow channel is arranged inside the refrigeration layer. The refrigeration inner flow channel has an inlet end and an outlet end. The refrigeration layer is used for heat exchange with the refrigeration fluid.

[0009] Furthermore, a heat dissipation inner flow channel is provided inside the heat dissipation layer, and the heat dissipation inner flow channel has an inlet end and an outlet end.

[0010] Furthermore, a heat dissipation fin structure is provided on the side of the heat dissipation layer away from the P-type semiconductor material layer.

[0011] A method for manufacturing a form-fitting electronic refrigeration device, applied to the above-mentioned form-fitting electronic refrigeration device, comprises the following steps: S1. In a three-dimensional modeling software, a refrigeration device skeleton is designed and constructed. The refrigeration device skeleton includes a heat dissipation layer, a molding cavity of a P-type semiconductor material layer, a refrigeration layer, a molding cavity of an N-type semiconductor material layer, and a base layer which are stacked in sequence; S2. Select metal raw materials and manufacture the entity of the refrigeration device skeleton by 3D printing technology; S3, injecting a P-type semiconductor raw material and an N-type semiconductor raw material into the molding cavity of the P-type semiconductor material layer and the molding cavity of the N-type semiconductor material layer in the body of the refrigeration device skeleton, respectively, and then solidifying the injected P-type semiconductor raw material and N-type semiconductor raw material in their respective molding cavities; S4. The side walls of the P-type semiconductor material layer's molding cavity that are not in contact with the heat dissipation layer and the refrigeration layer, as well as the side walls of the N-type semiconductor material layer's molding cavity that are not in contact with the base layer and the refrigeration layer, are removed from the entity of the refrigeration device skeleton, and the conformable electronic refrigeration device is manufactured.

[0012] Furthermore, the 3D printing technology includes selective laser melting technology, photocuring technology, or ink direct writing technology.

[0013] A method for using a form-fitting electronic refrigeration device, applied to the form-fitting electronic refrigeration device, comprises the following steps: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target heat dissipation position, and then the conformable electronic refrigeration device is fixed to the target heat dissipation position. Subsequently, the base layer and the heat dissipation layer of the conformable electronic refrigeration device are respectively connected to the positive electrode and the negative electrode of the DC power supply, and finally the refrigeration fluid is connected to the refrigeration inner flow channel; Start the DC power supply to cool down the cooling layer and heat up the heat dissipation layer, and make the cooling fluid flow. At this time, the cooling fluid cools down and the heat dissipation layer dissipates heat.

[0014] Furthermore, the temperature of the refrigerant fluid is controlled by adjusting the current of the DC power supply or the flow rate of the refrigerant fluid.

[0015] A method for using a form-fitting electronic refrigeration device, applied to the form-fitting electronic refrigeration device, comprises the following steps: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target power generation position, and then the conformable electronic refrigeration device is fixed to the target power generation position. Subsequently, the base layer and the heat dissipation layer of the conformable electronic refrigeration device are respectively connected to the positive and negative electrodes of the external circuit. Finally, the refrigerant fluid is connected to the refrigeration internal flow channel, and the heat dissipation layer is heated by the heat dissipation fluid. The conformable electronic refrigeration device generates electricity and outputs it to the external circuit.

[0016] Furthermore, by adjusting the flow rates of the refrigeration fluid and the heat dissipation fluid, the temperature difference range between the refrigeration layer and the heat dissipation layer is adjusted, and the power generation efficiency of the conformable electronic refrigeration device is controlled.

[0017] Furthermore, a first temperature sensor and a second temperature sensor are respectively provided in the refrigeration layer and the heat dissipation layer. The first temperature sensor is used to monitor the temperature of the refrigeration layer, and the second temperature sensor is used to monitor the temperature of the heat dissipation layer.

[0018] The beneficial effects of the present invention are: 1. The present invention provides a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof. The 3D printing technology is used to first manufacture the entity of the refrigeration device skeleton, and then the semiconductor material is injected and the side walls of the P-type semiconductor material layer in the entity of the refrigeration device skeleton that are not in contact with the heat dissipation layer and the refrigeration layer and the side walls of the N-type semiconductor material layer in the molding cavity that are not in contact with the base layer and the refrigeration layer are removed to complete the manufacture of the form-fitting electronic refrigeration device. This method can not only quickly manufacture complex structures, but also solve the problem that 3D printing is difficult to simultaneously print composite materials with large melting point differences, simplify the manufacturing process, and reduce the manufacturing difficulty. At the same time, 3D printing technology can be used to manufacture complex, multi-layered three-dimensional refrigeration structures, greatly increase the heat exchange area, and thus achieve a more efficient and uniform refrigeration effect; 2. The present invention provides a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof, wherein the effective refrigeration area is designed inside the form-fitting electronic refrigeration device. This design avoids the direct influence of the external environment temperature on the effective refrigeration area, thereby providing a more stable cooling effect; 3. The present invention provides a form-fitting electronic refrigeration device and a manufacturing method and a use method thereof, which can be converted into a temperature difference power generation device without adjustment. This multifunctional design can not only realize the heat dissipation of electronic equipment, but also be used for energy recovery. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a portable electronic refrigeration device of the present invention; Figure 2 This is a schematic diagram of the disassembled structure of a form-fitting electronic refrigeration device of the present invention (a heat dissipation fin structure is provided on the heat dissipation layer, and a continuous internal flow channel is provided in the refrigeration layer); Figure 3 It is a schematic diagram of the disassembled structure of a conformable electronic refrigeration device of the present invention (a continuous inner flow channel is provided in the heat dissipation layer, and a lattice inner flow channel is provided in the refrigeration layer); Figure 4 It is a schematic cross-sectional structure diagram of a form-fitting electronic refrigeration device of the present invention (the form-fitting electronic refrigeration device is a hemispherical cover structure); Figure 5 A schematic diagram of the disassembled structure of a form-fitting electronic refrigeration device of the present invention (the form-fitting electronic refrigeration device is a hemispherical cover structure); Figure 6 It is a three-dimensional diagram of a form-fitting electronic refrigeration device of the present invention (the form-fitting electronic refrigeration device is a hemispherical cover structure).

[0020] Label instructions: 1. Heat dissipation layer, 2. P-type semiconductor material layer, 3. Refrigeration layer, 4. N-type semiconductor material layer, 5. Base layer, 6. DC power supply, 7. Guide device, 8. Heat insulation board. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] See also Figure 1 to Figure 6 As shown, a conformable electronic refrigeration device comprises a heat dissipation layer 1, a P-type semiconductor material layer 2, a refrigeration layer 3, an N-type semiconductor material layer 4 and a base layer 5 which are stacked in sequence.

[0023] Among them, the heat dissipation layer 1, the cooling layer 3 and the base layer 5 are all made of conductive and thermally conductive materials, including but not limited to copper alloy, aluminum alloy, silver alloy, and stainless steel; the P-type semiconductor material layer 2 and the N-type semiconductor material layer 4 use semiconductor raw materials with different compositions or impurities, including but not limited to silicon-based semiconductors, germanium-based semiconductors, III-V compound semiconductors (such as gallium nitride, gallium arsenide), and thermoelectric material semiconductors (such as bismuth telluride compounds, lead telluride compounds, and tin antimony compounds).

[0024] The heat dissipation layer 1 is used for heat exchange with the heat dissipation fluid. The heat dissipation fluid is the fluid to be dissipated or a heat dissipation medium, such as water or air; A refrigeration inner flow channel is provided inside the refrigeration layer 3, and the refrigeration inner flow channel has an inlet end and an outlet end. The refrigeration layer is used for heat exchange with a refrigeration fluid. The refrigeration fluid is the refrigeration fluid itself or a refrigeration medium, such as water or air.

[0025] Among them, the refrigeration internal flow channel includes but is not limited to a continuous internal flow channel (such as a straight internal flow channel, a bent internal flow channel, a spiral internal flow channel) and a lattice-type internal flow channel (truss lattice, curved lattice).

[0026] It should be noted that when the refrigeration fluid is a non-powered fluid, the inlet end and / or the outlet end of the refrigeration internal flow channel are connected to the flow guide device 7, while when the refrigeration fluid is a powered fluid, it is not necessary to set it.

[0027] The above technical solution is preferably designed as follows to improve the heat dissipation effect of the heat dissipation layer 1: A heat dissipation inner flow channel is provided inside the heat dissipation layer 1 , and the heat dissipation inner flow channel has an inlet end and an outlet end; and / or, a heat dissipation fin structure is provided on the side of the heat dissipation layer 1 away from the P-type semiconductor material layer 2 .

[0028] Among them, the heat dissipation internal flow channel includes but is not limited to a continuous internal flow channel (such as a straight internal flow channel, a bent internal flow channel, a spiral internal flow channel) and a lattice-type internal flow channel (truss lattice, curved surface lattice).

[0029] It should be noted that when the heat dissipation fluid is an unpowered fluid, the inlet end and / or outlet end of the heat dissipation inner flow channel is connected to a flow guide device (not shown in the figure), but when the heat dissipation fluid is a powered fluid, no flow guide device is required.

[0030] See also Figure 1 to Figure 6 As shown, a method for manufacturing a conformable electronic refrigeration device is applied to the conformable electronic refrigeration device, comprising the following steps: S1. In a three-dimensional modeling software, a refrigeration device skeleton is designed and constructed. The refrigeration device skeleton includes a heat dissipation layer 1, a molding cavity of a P-type semiconductor material layer 2, a refrigeration layer 3, a molding cavity of an N-type semiconductor material layer 4, and a base layer 5 which are stacked in sequence; S2. Select metal raw materials and manufacture the entity of the refrigeration device skeleton by 3D printing technology; S3, injecting P-type semiconductor raw materials and N-type semiconductor raw materials into the molding cavity of the P-type semiconductor material layer 2 and the molding cavity of the N-type semiconductor material layer 4 in the entity of the refrigeration device skeleton respectively, and then solidifying the injected P-type semiconductor raw materials and N-type semiconductor raw materials in their respective molding cavities; S4, removing the side walls of the P-type semiconductor material layer 2 that are not in contact with the heat dissipation layer and the refrigeration layer and the side walls of the N-type semiconductor material layer 4 that are not in contact with the base layer and the refrigeration layer in the entity of the refrigeration device skeleton, and the conformable electronic refrigeration device is manufactured.

[0031] Among them, 3D printing technology includes selective laser melting (SLM / SLS) technology or light curing (DLP) technology or ink direct writing (DIW) technology; P-type semiconductor raw materials and N-type semiconductor raw materials can be in the form of powder or paste (a mixture of powder and adhesive). When using powder raw materials, first inject them into the molding cavity through the injection port, and then solidify them through a heat treatment process; when using paste raw materials, first inject them into the molding cavity through the injection port, and then use heat treatment or degreasing to volatilize the adhesive from the discharge port and solidify the effective ingredients.

[0032] See also Figure 1 to Figure 6 As shown, a method for using a form-fitting electronic refrigeration device is applied to the above-mentioned form-fitting electronic refrigeration device, comprising the following steps: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target heat dissipation position, and then the conformable electronic refrigeration device is fixed to the target heat dissipation position, and then the base layer 5 and the heat dissipation layer 1 of the conformable electronic refrigeration device are respectively connected to the positive and negative electrodes of the DC power supply 6, and finally the refrigeration fluid is connected to the refrigeration inner flow channel; The DC power supply 6 is started to cool down the cooling layer 3 and heat up the heat dissipation layer 1, and the cooling fluid is made to flow. At this time, the cooling fluid cools down, and at the same time, the heat dissipation layer 1 dissipates heat. Specifically, if the cooling fluid is the fluid to be cooled, a cooling effect is directly formed; if the cooling fluid is the medium to be cooled, the object to be cooled is cooled by the cooling fluid.

[0033] The above technical solution is to control the temperature of the refrigerant fluid, which can be achieved by adjusting the current of the DC power supply 6 or the flow rate of the refrigerant fluid.

[0034] See also Figure 1 to Figure 6 As shown, a method for using a form-fitting electronic refrigeration device is applied to the above-mentioned form-fitting electronic refrigeration device, comprising the following steps: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target power generation position, and then the conformable electronic refrigeration device is fixed to the target power generation position. Subsequently, the base layer 5 and the heat dissipation layer 1 of the conformable electronic refrigeration device are respectively connected to the positive and negative electrodes of the external circuit. Finally, the refrigeration fluid (cold source) is connected to the refrigeration internal flow channel, and the heat dissipation layer 1 is heated by the heat dissipation fluid (heat source). The conformable electronic refrigeration device generates electricity and outputs it to the external circuit.

[0035] When a heat dissipation inner flow channel is provided inside the heat dissipation layer 1, the heat dissipation fluid (heat source) is connected to the heat dissipation inner flow channel to heat the heat dissipation layer 1; when no heat dissipation inner flow channel is provided inside the heat dissipation layer 1, the heat dissipation layer 1 is directly heated by the heat dissipation fluid (heat source).

[0036] The above technical solution is to control the power generation efficiency of the conformable electronic refrigeration device by adjusting the flow rate of the refrigeration fluid (cold source) and the heat dissipation fluid (heat source) to adjust the temperature difference range between the refrigeration layer 3 and the heat dissipation layer 1.

[0037] The first temperature sensor and the second temperature sensor are respectively provided in the cooling layer 3 and the heat dissipation layer 1, wherein the first temperature sensor is used to monitor the temperature of the cooling layer 3 and the second temperature sensor is used to monitor the temperature of the heat dissipation layer 1. Exemplarily, the first temperature sensor and the second temperature sensor are thermocouples or other temperature sensors.

[0038] The present invention will be further described below with regard to specific embodiments.

[0039] Embodiment 1: See also Figure 1~Figure 3 As shown, this embodiment provides a manufacturing method of a conformable electronic refrigeration device, more specifically, a manufacturing method of a conformable electronic refrigeration device based on SLM 3D printing technology. Selective Laser Melting (SLM) technology is a high-precision additive manufacturing technology suitable for manufacturing complex structures of metal parts. The specific description is as follows: 1. Structural design To achieve the best thermal management effect, the conformable electronic cooling device is designed to include the following key parts: Heat dissipation layer 31: The heat dissipation inner flow channel is designed as a continuous inner flow channel with a circular cross section. The flow channel diameter is set to 1~5 mm, depending on the required heat dissipation capacity and fluid flow rate. The number and layout of the heat dissipation inner flow channels are optimized according to the heat load and heat dissipation area.

[0040] Refrigeration layer 3: The refrigeration inner flow channel is designed as a continuous inner flow channel with a circular cross section. The flow channel diameter is set to 1~5mm to increase the surface area and heat exchange efficiency. The optional design is multi-layer stacking, so as to control the heat flux density and temperature gradient by adjusting the number of layers and spacing.

[0041] Base layer 5: A conformal base surface designed to conform to the shape of the target device, with a thickness usually between 1 and 3 mm, providing sufficient mechanical support.

[0042] 2. 3D printing ① Material selection: This embodiment selects high thermal conductivity conductive and thermal conductive materials to manufacture the refrigeration device skeleton entity. Common materials include: Copper alloy: The thermal conductivity is about 385 W / (m·K), which is suitable for the manufacture of the efficient heat dissipation layer 1; Aluminum alloy: The thermal conductivity is about 237 W / (m·K), with good mechanical strength and thermal conductivity; Silver alloy: The thermal conductivity is about 429 W / (m·K). Although the cost is relatively high, it has excellent thermal conductivity. Stainless steel: has low thermal conductivity but good mechanical strength and corrosion resistance, suitable for structural parts.

[0043] In practical applications, appropriate conductive and thermal conductive materials can be selected for printing according to specific heat dissipation requirements and mechanical strength requirements.

[0044] ② Process control: The key process parameters in the SLM printing process include laser power, scanning speed, layer thickness and scanning strategy. The specific parameters are as follows: Laser power: Depending on the material, it is usually set to 100~400 W to ensure sufficient melting and good density of the material; Scanning speed: generally set to 400~2000 mm / s. Too high a scanning speed may cause an unstable molten pool, while too low a speed may cause excessive melting of the material and increase surface roughness. Layer thickness: usually 20~100 μm. Smaller layer thickness helps to obtain higher surface finish and detail accuracy. Scanning strategy: A cross-scanning strategy is used to reduce internal residual stress and deformation. The scanning direction of each layer during printing is perpendicular or at a certain angle to the previous layer to achieve uniform energy distribution.

[0045] 3. Injection and curing of semiconductor materials After the physical printing of the refrigeration device skeleton is completed, P-type semiconductor raw materials and N-type semiconductor raw materials are respectively injected into the molding cavity of the P-type semiconductor material layer 2 and the molding cavity of the N-type semiconductor material layer 4 in the entity of the refrigeration device skeleton, and then the injected P-type semiconductor raw materials and N-type semiconductor raw materials are solidified in their respective molding cavities. In this embodiment, the raw materials are selected as follows: P-type semiconductor raw materials: bismuth telluride doped with antimony has good thermoelectric properties and moderate electrical and thermal conductivity; N-type semiconductor material: bismuth telluride doped with selenium, which matches well with P-type materials and can form an effective thermocouple pair.

[0046] The form of P-type semiconductor raw materials and N-type semiconductor raw materials can be either powder or paste (a mixture of powder and adhesive), but the process is different, as follows: Powder injection: Powders of P-type semiconductor raw materials and N-type semiconductor raw materials are injected into the corresponding molding cavity from the material injection port through special equipment (such as a powder sprayer) and compacted, followed by heat treatment. The temperature is set to 400~580°C and the holding time is 30~60 minutes to ensure that the materials are welded and solidified.

[0047] Paste injection: The pastes of P-type semiconductor raw materials and N-type semiconductor raw materials are respectively injected into the corresponding molding cavities from the material injection port, and the adhesive and gas are discharged from the material discharge port by heat treatment or degreasing. The temperature is usually set at 300~580°C to ensure that the effective components in the P-type semiconductor raw materials and N-type semiconductor raw materials are melted and solidified in their respective molding cavities.

[0048] 4. Remove the sidewalls After the semiconductor raw material is solidified, the side walls of the P-type semiconductor material layer 2 in the solid body of the refrigeration device skeleton that are not in contact with the heat dissipation layer 1 and the refrigeration layer 3 and the side walls of the N-type semiconductor material layer 4 in the solid body of the refrigeration device skeleton that are not in contact with the base layer 5 and the refrigeration layer 3 need to be removed to expose the surfaces of the P-type semiconductor material layer 2 and the N-type semiconductor material layer 4. This step can be achieved by mechanical processing or chemical etching, as follows: Mechanical processing: Use a CNC milling machine or an EDM machine to accurately remove the side walls of the P-type semiconductor material layer 2 in the solid body of the cold device skeleton that are not in contact with the heat dissipation layer 1 and the refrigeration layer 3, as well as the side walls of the N-type semiconductor material layer 4 in the molding cavity that are not in contact with the base layer 5 and the refrigeration layer 3, to ensure the surface smoothness of the P-type semiconductor material layer 2 and the N-type semiconductor material layer 4.

[0049] Chemical etching: Select a suitable etching solution (such as acidic or alkaline solution), control the etching rate and depth, and gradually remove the side walls of the P-type semiconductor material layer 2 in the entity of the cold device skeleton that are not in contact with the heat dissipation layer 1 and the refrigeration layer 3, as well as the side walls of the N-type semiconductor material layer 4 in the molding cavity that are not in contact with the base layer 5 and the refrigeration layer 3.

[0050] 5. Quality inspection and performance testing The final conformable electronic cooling device must undergo a series of inspections and tests, including: Dimensional accuracy inspection: Use a three-dimensional coordinate measuring machine (CMM) to check the dimensional accuracy of key components to ensure that they meet design requirements.

[0051] Surface roughness detection: Use a surface roughness meter to detect the surface finish of the heat dissipation layer 1 and the cooling layer 3 to ensure good heat exchange efficiency.

[0052] Thermal Performance Testing: Thermal performance testing is performed in a controlled environment to measure the device's thermoelectric efficiency and cooling capacity to evaluate its performance in actual applications.

[0053] Mechanical performance test: The strength and hardness of the device are tested to ensure that it has sufficient mechanical strength and durability under working conditions.

[0054] 6. Application scenarios The conformable electronic refrigeration device of this embodiment is particularly suitable for electronic devices with high heat flux density, such as cooling systems in the aerospace field, heat dissipation devices in servers and data centers, and thermal management systems for high-performance computers and electronic components. Its high efficiency, compactness, and versatility make it have a wide range of application prospects in modern electronic devices.

[0055] Embodiment 2: See also Figure 4~Figure 6 As shown, this embodiment provides a method for using a portable electronic refrigeration device, and more specifically, a method for realizing the refrigeration function of a portable electronic refrigeration device. The portable electronic refrigeration device of this embodiment is a hemispherical cover structure, which is suitable for the heat dissipation needs of various electronic devices, especially high heat flux density and high temperature stability requirements, such as data centers, supercomputers, aerospace electronic equipment or refrigeration cabins. Through optimized design and system integration, this embodiment provides an efficient and reliable thermal management solution. The specific description is as follows: 1. Fixing the device: Fix the conformable electronic cooling device to the heat dissipation part, around or near the target device. The fixing method can be selected according to the device requirements, such as screw fixing, welding, or bonding with thermal conductive adhesive. At the same time, some areas need to be well insulated (such as using thermal insulation board 8) to form a cooling area / space and maintain the cooling effect of the cooling area / space. Specifically, select a suitable fixing method according to the specific application, such as using high temperature resistant thermal conductive adhesive in a high temperature environment, or using screw fixing in a mechanical vibration environment.

[0056] 2. Connect the DC power supply 6: Connect the positive and negative electrodes of the DC power supply 6 to the base layer 5 and the heat dissipation layer 1 of the conformal electronic refrigeration device, respectively. The materials selected for these two parts have electrical conductivity and thermal conductivity to facilitate the passage of current and effectively conduct heat. During the connection process, ensure that the power polarity is correct to avoid damaging the device or reducing the cooling efficiency. Specifically, the voltage and current of the DC power supply 6 should be selected according to the power requirements of the device and the characteristics of the semiconductor material. For example, when using bismuth telluride compounds as semiconductor materials, the current density should be controlled between 0.5 and 1 A / cm² to prevent overheating of the material. At the same time, the DC power supply 6 can also provide power to other electrical appliances at the same time.

[0057] 3. Heat dissipation and cooling process: Start the DC power supply 6, which provides electrical energy to generate a temperature difference in the semiconductor material inside the conformable electronic cooling device, thereby cooling the cooling layer 3 and heating the heat dissipation layer 1, thereby achieving thermoelectric cooling.

[0058] A refrigeration inner flow channel is provided inside the refrigeration layer 3, and a heat dissipation inner flow channel is provided inside the heat dissipation layer 1. The inlet and / or outlet ends of the refrigeration inner flow channel and the heat dissipation inner flow channel are both connected and provided with a flow guide device 7. The activation of the flow guide device 7 connected to the refrigeration inner flow channel allows the refrigeration fluid to circulate within the refrigeration inner flow channel and the refrigeration area / space, and during the circulation process, absorbs heat from the target device and takes it away through the refrigeration cycle. The activation of the flow guide device (not shown in the figure) connected to the heat dissipation inner flow channel allows the heat dissipation fluid to circulate outside the heat dissipation inner flow channel and the refrigeration area / space, and during the circulation process, takes away the heat accumulated in the heat dissipation layer 1. At the same time, the heat dissipation layer 1 also dissipates heat through the fan fin structure to prevent the device from overheating.

[0059] 4. Real-time adjustment: Based on the temperature data of the refrigeration area / space or target device, adjust the current of the DC power supply 6 and the circulation rate of the flow guide device 7 connected to the refrigeration inner flow channel in real time. By adjusting the current of the DC power supply 6, the temperature difference effect of the semiconductor material can be adjusted, thereby achieving precise control of the refrigeration intensity. By adjusting the circulation rate of the flow guide device 7 connected to the refrigeration inner flow channel, dynamic adjustments can be made according to actual heat dissipation and refrigeration requirements to achieve the best temperature control effect. Specifically, the accuracy of the temperature data of the refrigeration area / space or target device should be within ±0.5°C, the sampling frequency should not be less than 1 Hz, and it should be able to respond to temperature changes in real time, and adjust the current / voltage, airflow / liquid flow in time to ensure the stable operation of the target device.

[0060] This embodiment describes the specific use steps and technical details of the form-fitting electronic refrigeration device in practical applications. Through these steps, the cooling and temperature control of the target device can be effectively achieved to ensure that the device operates stably at the optimal working temperature.

[0061] Embodiment 3: This embodiment provides a method for using a portable electronic refrigeration device, and more specifically, a method for realizing the power generation function of the portable electronic refrigeration device. The specific description is as follows: 1. Fix the device: Fix the conformable electronic refrigeration device to the target power generation location. For installation, mechanical clamping, glue bonding or magnetic fixing can be used to ensure its stability and reliability.

[0062] 2. Construction of power output path: Connect the conformable electronic cooling device to the external circuit, connect the base layer 5 to the positive pole of the external circuit, and connect the heat dissipation layer 1 to the negative pole of the external circuit. Ensure that the connection is firm, and check and confirm the conductivity of the circuit to prevent power loss caused by poor contact.

[0063] 3. Heat source and cold source configuration: Select appropriate heat source and cold source according to the actual application scenario. The heat source can be ambient heat radiation, waste heat liquid or gas from industrial equipment, etc., and the temperature is designed to be between 100°C and 300°C. The cold source can be ambient air, coolant or other low-temperature media, and the temperature is maintained between 25°C and 50°C.

[0064] 4. Cold source circulation: The cold source medium is passed into the refrigeration inner flow channel, and can be used after circulating cooling through an external cooling system, or in a single flow mode. The design of the refrigeration inner flow channel should ensure that the cold source is in full contact with the refrigeration layer 3 or is connected to the external pipeline at a short distance to minimize the temperature of the refrigeration layer 3.

[0065] 5. Heat source circulation: The heat source medium is passed into the heat dissipation inner flow channel. The single-pass or circulating flow method can be selected to ensure that the heat source temperature in the heat dissipation layer 1 is evenly distributed. The design of the heat dissipation inner flow channel needs to consider the flow rate and temperature of the heat source to achieve the best heat exchange effect.

[0066] 6. Pass heat source and cold source: Turn on the circulation system of heat source and cold source to start heating the heat dissipation layer 1 and cooling the cooling layer 3. Adjust the flow rate and temperature of the heat source and cold source to ensure that the temperature of the heat dissipation layer 1 is maintained between 100°C and 300°C, and the temperature of the cooling layer 3 is maintained between 25°C and 50°C. Use the temperature difference effect to generate electrical energy and output it to the external circuit.

[0067] 7. Real-time monitoring and adjustment: The first temperature sensor installed on the heat dissipation layer 1 and the second temperature sensor installed on the cooling layer 3 monitor the temperature of the heat dissipation layer 1 and the cooling layer 3 in real time. According to the monitoring data, the flow rate of the heat source and the cold source is adjusted to maintain the optimal temperature difference range (50°C to 250°C) between the heat dissipation layer 1 and the cooling layer 3 to ensure the maximum efficiency of the temperature difference power generation.

[0068] 8. Application scenarios and optimization Waste heat recovery: In industrial production, such as metallurgy, chemical industry and power industry, equipment often generates a lot of waste heat. Installing this portable electronic refrigeration device can convert this waste heat into electrical energy, provide a stable power supply for the factory, reduce energy waste and improve energy efficiency.

[0069] Renewable energy system: Combined with renewable energy systems such as solar energy, the conformable electronic refrigeration device can generate electricity using the temperature difference between day and night. During the day, the solar device heats up the heat source; at night, the ambient temperature drops, forming a temperature difference and achieving continuous power generation. This system can increase energy output and optimize overall benefits.

[0070] Portable electronic devices: The portable electronic cooling device can also provide power for portable electronic devices, especially in outdoor environments without power supply. For example, during outdoor adventures or field scientific research activities, the temperature difference in the environment can be used to charge the device, ensuring the normal operation of the device and extending the battery life.

[0071] According to this embodiment, the form-fitting electronic refrigeration device can generate electricity through temperature difference to provide stable power support for various application scenarios. The innovative design of this multifunctional device not only improves the energy efficiency of the device, but also broadens its application field.

[0072] The present invention is not limited to the above-mentioned specific implementation modes. A person skilled in the art can implement the present invention in various other specific implementation modes based on the contents disclosed in the present invention. Therefore, any design that adopts the design structure and concept of the present invention and makes some simple changes or modifications shall fall within the scope of protection of the present invention.

Claims

1. A portable electronic refrigeration device, characterized in that: It includes a heat dissipation layer, a P-type semiconductor material layer, a cooling layer, an N-type semiconductor material layer and a base layer which are stacked in sequence, and the heat dissipation layer, the cooling layer and the base layer are all made of conductive and thermal conductive materials; The heat dissipation layer is used for heat exchange with the heat dissipation fluid; A refrigeration inner flow channel is arranged inside the refrigeration layer. The refrigeration inner flow channel has an inlet end and an outlet end. The refrigeration layer is used for heat exchange with the refrigeration fluid.

2. The portable electronic refrigeration device according to claim 1, characterized in that: The heat dissipation layer is provided with a heat dissipation inner flow channel inside, and the heat dissipation inner flow channel has an inlet end and an outlet end.

3. The portable electronic refrigeration device according to claim 1 or 2, characterized in that: A heat dissipation fin structure is provided on the side of the heat dissipation layer away from the P-type semiconductor material layer.

4. A method for manufacturing a conformable electronic refrigeration device, applied to a conformable electronic refrigeration device according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1. In a three-dimensional modeling software, a refrigeration device skeleton is designed and constructed. The refrigeration device skeleton includes a heat dissipation layer, a molding cavity of a P-type semiconductor material layer, a refrigeration layer, a molding cavity of an N-type semiconductor material layer, and a base layer which are stacked in sequence; S2. Select metal raw materials and manufacture the entity of the refrigeration device skeleton by 3D printing technology; S3, injecting a P-type semiconductor raw material and an N-type semiconductor raw material into the molding cavity of the P-type semiconductor material layer and the molding cavity of the N-type semiconductor material layer in the body of the refrigeration device skeleton, respectively, and then solidifying the injected P-type semiconductor raw material and N-type semiconductor raw material in their respective molding cavities; S4. The side walls of the P-type semiconductor material layer's molding cavity that are not in contact with the heat dissipation layer and the refrigeration layer, as well as the side walls of the N-type semiconductor material layer's molding cavity that are not in contact with the base layer and the refrigeration layer, are removed from the entity of the refrigeration device skeleton, and the conformable electronic refrigeration device is manufactured.

5. The method for manufacturing a portable electronic refrigeration device according to claim 4, characterized in that: The 3D printing technology includes selective laser melting technology, photocuring technology or ink direct writing technology.

6. A method for using a form-fitting electronic refrigeration device, applied to a form-fitting electronic refrigeration device according to any one of claims 1 to 3, characterized in that: The following steps are involved: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target heat dissipation position, and then the conformable electronic refrigeration device is fixed to the target heat dissipation position. Subsequently, the base layer and the heat dissipation layer of the conformable electronic refrigeration device are respectively connected to the positive electrode and the negative electrode of the DC power supply, and finally the refrigeration fluid is connected to the refrigeration inner flow channel; Start the DC power supply to cool down the cooling layer and heat up the heat dissipation layer, and make the cooling fluid flow. At this time, the cooling fluid cools down and the heat dissipation layer dissipates heat.

7. The method for using the portable electronic refrigeration device according to claim 6, characterized in that: The temperature of the refrigerant fluid is controlled by adjusting the current of the DC power supply or the flow rate of the refrigerant fluid.

8. A method for using a form-fitting electronic refrigeration device, applied to the form-fitting electronic refrigeration device according to any one of claims 1 to 3, characterized in that: The following steps are involved: First, a conformable electronic refrigeration device is manufactured according to the spatial form of the target power generation position, and then the conformable electronic refrigeration device is fixed to the target power generation position. Subsequently, the base layer and the heat dissipation layer of the conformable electronic refrigeration device are respectively connected to the positive and negative electrodes of the external circuit. Finally, the refrigerant fluid is connected to the refrigeration internal flow channel, and the heat dissipation layer is heated by the heat dissipation fluid. The conformable electronic refrigeration device generates electricity and outputs it to the external circuit.

9. The method for using the portable electronic refrigeration device according to claim 8, characterized in that: By adjusting the flow rate of the refrigeration fluid and the heat dissipation fluid, the temperature difference range between the refrigeration layer and the heat dissipation layer is adjusted, and the power generation efficiency of the conformal electronic refrigeration device is controlled.

10. The method for using the portable electronic refrigeration device according to claim 9, characterized in that: A first temperature sensor and a second temperature sensor are respectively provided in the refrigeration layer and the heat dissipation layer. The first temperature sensor is used to monitor the temperature of the refrigeration layer, and the second temperature sensor is used to monitor the temperature of the heat dissipation layer.

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