Distribution network cable joint abnormity intelligent monitoring device based on multi-sensor integration

Abstract

A distribution network cable joint abnormity intelligent monitoring device based on multi-sensor integration comprises TEV sensors, a data processing unit, a processor, an LORA module and an antenna. The TEV sensor is electrically connected with the data processing unit; the data processing unit is electrically connected with the processor; the processor is electrically connected with the LORA module; the LORA module is electrically connected with the antenna; three signal processing circuits with different gains are adopted for parallel processing, so that the working efficiency is greatly improved; the voltage comparator is adopted to extract the peak value of the partial discharge signal, the latch is adopted to hold the peak value of the partial discharge signal, acquisition and data processing of the partial signal can be completed only through a common single-chip microcomputer, and the defects that traditional analog quantity acquisition is large in generated data volume, large in occupied memory, long in calculation period and large in power consumption are overcome. In addition, the intelligent sensor integrates a temperature sensor, a sound sensor and measurement of various parameters, and a multi-dimensional data source is provided for subsequent data processing and equipment defect judgment and early warning.

Description

Technical Field

[0001] The present invention belongs to the technical field of abnormal intelligent monitoring of cable joints in distribution networks, and in particular relates to an abnormal intelligent monitoring device for cable joints in distribution networks based on multi-sensor integration. Background Art

[0002] Cable joints are also called cable heads. After the cable is laid, in order to make it a continuous line, each section of the line must be connected as a whole, and these connection points are called cable joints. The cable joints in the middle of the cable line are called intermediate joints, and the cable joints at both ends of the line are called terminal heads. Cable joints are used to lock and fix the incoming and outgoing lines, and play a role in waterproofing, dustproofing and vibration prevention.

[0003] Performing partial discharge detection on cable joints is a necessary guarantee to ensure the normal operation of cable joints. Therefore, the existing technical solution with patent application number "CN202310864254.7" and patent name "A cable joint partial discharge online monitoring device, method and power system" is generally used to perform partial discharge detection on cable joints.

[0004] However, in actual application, during the detection of partial discharge on cable joints, the traditional analog quantity acquisition of partial discharge signals has the disadvantages of generating a large amount of data, occupying a lot of memory, having a long calculation cycle, and high power consumption. Summary of the invention

[0005] In order to solve the defects in the prior art, the present invention proposes an intelligent monitoring device for distribution network cable joint abnormalities based on multi-sensor integration, which only needs an ordinary single-chip microcomputer to complete the collection and data processing of local signals, overcoming the shortcomings of traditional analog quantity acquisition, such as large data volume, large memory occupation, long calculation cycle and high power consumption.

[0006] The present invention uses the following technical solutions.

[0007] An intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration, comprising:

[0008] TEV sensor, data processing unit, processor, LORA module and antenna;

[0009] The TEV sensor is electrically connected to the data processing unit;

[0010] The data processing unit is electrically connected to the processor;

[0011] The processor is electrically connected to the LORA module;

[0012] The LORA module is electrically connected to the antenna.

[0013] Preferably, the distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes:

[0014] Temperature sensor;

[0015] The temperature sensor is electrically connected to the data processing unit;

[0016] The data processing unit is electrically connected to the processor.

[0017] Preferably, the distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes:

[0018] Sound sensor;

[0019] The sound sensor is electrically connected to the data processing unit;

[0020] The data processing unit is electrically connected to the processor.

[0021] Preferably, the processor is also electrically connected to the debugging interface and the status light.

[0022] Preferably, the battery is electrically connected to the TEV sensor, temperature sensor, sound sensor, processor and LORA module through a switch. When the switch is closed, the battery supplies power to the TEV sensor, temperature sensor, sound sensor, processor and LORA module. When the switch is opened, the battery stops supplying power to the TEV sensor, temperature sensor, sound sensor, processor and LORA module.

[0023] Preferably, the processor is a single-chip microcomputer, which is also an MCU main control circuit. The MCU main control circuit is composed of the MCU main chip STM32L151CBT6, a crystal oscillator circuit, a reset circuit, and a debugging circuit. It is responsible for the collection and processing of information from each sensor, power management, and information interaction with the LORA aggregation node.

[0024] Preferably, the connection structure of the TEV sensor and the data processing unit forms a TEV partial discharge signal acquisition and conditioning circuit, which is composed of three signal processing circuits. The difference between the three signal processing circuits is that the preamplifier circuit, i.e., the video amplifier circuit, has different gains;

[0025] Each signal processing circuit is composed of a video amplifier circuit, a peak level generating circuit, a high-speed differential comparator circuit, and a latch circuit which are electrically connected in sequence.

[0026] Preferably, the video amplifier circuit uses a monolithic two-stage video amplifier UA733 with 200MHz bandwidth, differential input and differential output.

[0027] Preferably, the peak level generating circuit comprises an LT1490 operational amplifier.

[0028] Preferably, the 2.8V working voltage of the power circuit of the MCU is generated by the TPS7A0328 chip.

[0029] Preferably, the analog ±5V voltage required for the operation of the TEV power supply circuit is generated by a TPS65133 chip.

[0030] The beneficial effect of the present invention is that, compared with the prior art, the present invention includes: using three signal processing circuits with different gains for parallel processing, greatly improving work efficiency; using a voltage comparator to extract the peak value of the local discharge signal and a latch to hold it, only an ordinary single-chip microcomputer is needed to complete the collection and data processing of the local signal, overcoming the shortcomings of traditional analog quantity collection, such as large data volume, large memory usage, long calculation cycle, and high power consumption. In addition, the intelligent sensor also integrates temperature sensors, sound sensors, and measurement of multiple parameters, providing a multi-dimensional data source for subsequent data processing and equipment defect identification and early warning. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration described in the present invention. DETAILED DESCRIPTION

[0032] The detection of partial discharge on cable joints is a necessary guarantee to ensure the normal operation of cable joints, so the existing technical solution with patent application number "CN202310864254.7" and patent name "A cable joint partial discharge online monitoring device, method and power system" is generally used to detect partial discharge on cable joints. However, in actual application, during the detection of partial discharge on cable joints, the traditional analog quantity acquisition of partial discharge signals has the disadvantages of large data volume, large memory usage, long calculation cycle and high power consumption.

[0033] The present invention uses three signal processing circuits with different gains for parallel processing, which greatly improves work efficiency; a voltage comparator is used to extract the peak value of the local discharge signal and a latch is used to maintain it. Only an ordinary single-chip microcomputer is needed to complete the acquisition and data processing of the local signal, overcoming the shortcomings of traditional analog quantity acquisition, such as large data volume, large memory usage, long calculation cycle, and high power consumption. In addition, the intelligent sensor also integrates temperature sensors, sound sensors, and measurement of multiple parameters, providing a multi-dimensional data source for subsequent data processing and equipment defect identification and early warning.

[0034] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely expressed in combination with the drawings in the embodiments of the present invention. The embodiments expressed in this application are only embodiments of a part of the present invention, not all embodiments. Based on the spirit of the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0035] like Figure 1 As shown, the present invention provides a distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration, comprising:

[0036] TEV sensor, data processing unit, processor, LORA module and antenna;

[0037] The TEV sensor is electrically connected to the data processing unit;

[0038] The data processing unit is electrically connected to the processor;

[0039] The processor is electrically connected to the LORA module;

[0040] The LORA module is electrically connected to the antenna.

[0041] In a preferred but non-limiting embodiment of the present invention, the distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes:

[0042] Temperature sensor;

[0043] The temperature sensor is electrically connected to the data processing unit;

[0044] The data processing unit is electrically connected to the processor.

[0045] In a preferred but non-limiting embodiment of the present invention, the distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes:

[0046] Sound sensor;

[0047] The sound sensor is electrically connected to the data processing unit;

[0048] The data processing unit is electrically connected to the processor.

[0049] In a preferred but non-limiting embodiment of the present invention, the processor is also electrically connected to the debug interface and the status light.

[0050] In a preferred but non-limiting embodiment of the present invention, the battery is electrically connected to the TEV sensor, temperature sensor, sound sensor, processor and LORA module through a switch. When the switch is closed, the battery supplies power to the TEV sensor, temperature sensor, sound sensor, processor and LORA module. When the switch is disconnected, the battery stops supplying power to the TEV sensor, temperature sensor, sound sensor, processor and LORA module.

[0051] In a preferred but non-limiting embodiment of the present invention, the processor is a single-chip microcomputer, which is also an MCU main control circuit. The MCU main control circuit is composed of the main chip STM32L151CBT6 (hereinafter referred to as MCU) as the MCU, a crystal oscillator circuit, a reset circuit, a debugging circuit and other circuits. It is the core of the entire intelligent sensor and is responsible for the collection and processing of information from each sensor, power management, and information interaction with the LORA aggregation node. The ultra-low power MCU adopts a high-performance The 32-bit RISC core has a memory protection unit (MPU), up to 128KB of flash memory and up to 16KB of RAM, as well as various enhanced I / Os and peripherals connected to two APB buses: a 12-bit ADC, 2 DACs, 2 ultra-low-power comparators, 6 general-purpose 16-bit timers and two basic timers, two I2C and SPI, three USARTs and one USB, etc., which meet the data acquisition, processing, communication and other requirements of smart sensors.

[0052] In a preferred but non-limiting embodiment of the present invention, the connection structure of the TEV sensor and the data processing unit forms a TEV partial discharge signal acquisition and conditioning circuit, and the TEV partial discharge signal acquisition and conditioning circuit is composed of three signal processing circuits, and the difference between the three signal processing circuits is that the preamplifier circuit, i.e., the video amplifier circuit, has different gains;

[0053] Each signal processing circuit is composed of a video amplifier circuit, a peak level generating circuit, a high-speed differential comparator circuit, a latch circuit, and components such as resistors, capacitors, and inductors, which are electrically connected in sequence. The multi-channel signal acquisition and processing design accelerates the speed of partial discharge pulse measurement and screening.

[0054] In a preferred but non-limiting embodiment of the present invention, the video amplifier circuit uses a monolithic two-stage video amplifier UA733 with a bandwidth of 200MHz, differential input and differential output, and its internal series-parallel feedback provides wide bandwidth, low phase distortion and excellent gain stability. Fixed differential amplification of 10V / V, 100V / V or 400V / V can be selected without external components, or the amplification can be adjusted from 10V / V to 400V / V by using a single external resistor connected between 1A and 1B. No external frequency compensation components are required for any gain option. Its bandwidth, gain and other characteristics are suitable for the amplification requirements of TEV signals.

[0055] In a preferred but non-limiting embodiment of the present invention, the peak level generating circuit includes an LT1490 operational amplifier, and the CPU can set the peak level by outputting different PWM waveforms. The peak signal of the PWM waveform output by the CPU is relatively stable after passing through a two-stage RC filter circuit, but the driving capability is limited, it is easily affected by the load, and the anti-interference capability is relatively poor. Therefore, it is necessary to design a voltage follower to improve the load capacity. The LT1490 is a micro-power, rail-to-rail input and output operational amplifier. This operational amplifier operates with a full single power supply and a split power supply, with a total voltage of 2V to 44V, and each amplifier absorbs only 40μA of quiescent current. These amplifiers have reverse power supply protection; under reverse power supply voltage conditions of up to 18V, their absorption current is almost zero. The input range of the LT1490 / LT1491 includes two power supplies and an output swing to the two power supplies. Unlike most micro-power operational amplifiers, the LT1490 / LT1491 can drive heavy loads; its rail-to-rail output drives 20mA. The LT1490 / LT1491 has a stable unity gain and can drive a full capacitive load of up to 10,000pF when using the optional 0.22μF and 150Ω compensation. Therefore, the peak generation circuit uses the LT1490 as the main component to form a voltage follower circuit to improve the load capacity of the peak voltage circuit.

[0056] In a preferred but non-limiting embodiment of the present invention, the 2.8V voltage used for the power circuit of the MCU is generated by the TPS7A0328 chip, which is an ultra-small, ultra-low quiescent current low-dropout linear regulator (LDO) that can provide 200mA of current and excellent transient performance. The TPS7A03 has an ultra-low IQ (200nA) and is designed for applications where ultra-low quiescent current is a key parameter. This device can maintain low IQ consumption even in voltage drop mode to further extend battery life. In shutdown mode or disabled mode, the device consumes ultra-low (3nAIQ), which helps to extend battery life. The TPS7A03 is equipped with an intelligent enable circuit with an internally controlled pull-down resistor, which keeps the LDO in a disabled state even when the EN pin is floating, helping to minimize external components used to pull down the EN pin. This circuit also helps to minimize the current flowing in the external pull-down circuit when the device is disabled.

[0057] In a preferred but non-limiting embodiment of the present invention, the analog ±5V voltage required for the operation of the TEV power supply circuit is generated by the TPS65133 chip, which is an ultra-micro chip that can output a positive and negative power rail. It is usually used to power an operational amplifier that requires a ±5V power supply. This device integrates a boost converter and an inverting buck-boost converter suitable for battery-powered products. In order to reduce power consumption, a power switch tube is added to the front end of the TEV power supply circuit, and the TEV power supply is controlled by the CPU.

[0058] The beneficial effect of the present invention is that, compared with the prior art, the present invention includes: using three signal processing circuits with different gains for parallel processing, greatly improving work efficiency; using a voltage comparator to extract the peak value of the local discharge signal and a latch to hold it, only an ordinary single-chip microcomputer is needed to complete the collection and data processing of the local signal, overcoming the shortcomings of traditional analog quantity collection, such as large data volume, large memory usage, long calculation cycle, and high power consumption. In addition, the intelligent sensor also integrates temperature sensors, sound sensors, and measurement of multiple parameters, providing a multi-dimensional data source for subsequent data processing and equipment defect identification and early warning.

[0059] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0060] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0061] The terms "upper", "lower", "outer side", "inner side", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish the relative relationship in position without giving qualitative description. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0062] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration, characterized in that: include: TEV sensor, data processing unit, processor, LORA module and antenna; The TEV sensor is electrically connected to the data processing unit; The data processing unit is electrically connected to the processor; The processor is electrically connected to the LORA module; The LORA module is electrically connected to the antenna.

2. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 1 is characterized in that: The distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes: Temperature sensor; The temperature sensor is electrically connected to the data processing unit; The data processing unit is electrically connected to the processor.

3. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 1 is characterized in that: The distribution network cable joint abnormality intelligent monitoring device based on multi-sensor integration also includes: Sound sensor; The sound sensor is electrically connected to the data processing unit; The data processing unit is electrically connected to the processor.

4. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 1 is characterized in that: The processor is also electrically connected to the debug interface and the status light; The battery is electrically connected to the TEV sensor, the temperature sensor, the sound sensor, the processor and the LORA module through a switch. When the switch is closed, the battery supplies power to the TEV sensor, the temperature sensor, the sound sensor, the processor and the LORA module. When the switch is opened, the battery stops supplying power to the TEV sensor, the temperature sensor, the sound sensor, the processor and the LORA module.

5. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 1 is characterized in that: The processor is a single-chip microcomputer, which is also the MCU main control circuit. The MCU main control circuit consists of the MCU main chip STM32L151CBT6, a crystal oscillator circuit, a reset circuit, and a debugging circuit. It is responsible for the collection and processing of information from each sensor, power management, and information interaction with the LORA aggregation node.

6. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 5 is characterized in that: The connection structure of the TEV sensor and the data processing unit forms a TEV partial discharge signal acquisition and conditioning circuit. The TEV partial discharge signal acquisition and conditioning circuit is composed of three signal processing circuits. The difference between the three signal processing circuits is that the preamplifier circuit, i.e., the video amplifier circuit, has different gains. Each signal processing circuit is composed of a video amplifier circuit, a peak level generating circuit, a high-speed differential comparator circuit, and a latch circuit which are electrically connected in sequence.

7. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 6 is characterized in that: The video amplifier circuit uses a monolithic two-stage video amplifier UA733 with 200MHz bandwidth, differential input and differential output.

8. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 6 is characterized in that: The peak level generating circuit includes an LT1490 operational amplifier.

9. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 6 is characterized in that: The 2.8V voltage used by the MCU's power circuit is generated by the TPS7A0328 chip.

10. The intelligent monitoring device for abnormal distribution network cable joints based on multi-sensor integration according to claim 6 is characterized in that: The analog ±5V voltage required for the TEV power supply circuit to work is generated by the TPS65133 chip.

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