Acquisition module integration device, hardware-in-loop test device, signal transmission device and hardware-in-loop test system

Abstract

The invention provides an acquisition module integration device, a hardware-in-loop test device, a signal transmission device and a hardware-in-loop test system. The acquisition module integration device receives an input signal which is formed by a controlled object and is used for testing and transmits an output signal to a tested object, and the acquisition module integration device comprises a signal transmission connector which is electrically connected with the controlled object and receives the input signal; the signal transmission connector is installed on the substrate and comprises a plurality of signal acquisition lines, and the first ends of the signal acquisition lines are integrated in the signal transmission connector and electrically connected with a controlled object so as to receive and transmit input signals; the signal transmission connection unit is electrically connected with the second ends of the plurality of signal acquisition lines and is used for receiving and transmitting the input signal; a signal input part of the acquisition module is electrically connected with the plurality of signal acquisition lines of the substrate and comprises a signal output part, and the signal output part is configured to be electrically connected with a tested object so as to transmit an output signal to the tested object.

Description

Technical Field

[0001] The present disclosure relates to the technical field of hardware-in-the-loop testing, and in particular to an acquisition module integration device, a hardware-in-the-loop testing device, a signal transmission device and a hardware-in-the-loop testing system. Background Art

[0002] Hardware-in-the-loop (HIL) testing is a method for testing controllers, mainly used for the development and verification of embedded control systems. This method simulates the operating state of the controlled object by running a simulation model through a real-time processor, and connects to the object under test through an I / O interface, thereby achieving comprehensive and systematic testing of the object under test. The hardware-in-the-loop test system is conducive to shortening the product development cycle, reducing development costs, and improving software quality. In particular, in the development of core electronic control systems of new energy vehicles (such as vehicle control units (VCU), battery management systems (BMS), and electronic controllers (ECU)), HIL test systems play a key role.

[0003] The acquisition module (e.g., acquisition board) is a key component of the BMS, responsible for collecting key parameters such as voltage, current, and temperature of the battery control unit (BCU). These data are essential for evaluating the performance and safety of the BCU. The acquisition module can be integrated into the HIL test system through the signal acquisition line so that data can be collected and evaluated in a simulated environment. In the related art, since the acquisition module including the acquisition board does not have a standard connector, each contact of the acquisition module needs to be welded or directly connected to the bench of the HIL test system using a spring clip. Therefore, the wiring method is complicated, and the signal acquisition line and the spring clip lead are easy to be entangled with each other, which will waste a lot of time and cost. Since the lead of the spring clip is long, the connection between the spring clip and the acquisition module is easy to loosen, and the reliability is poor, which brings great inconvenience to the test work. In addition, the connection between the acquisition module and the bench of the HIL test system is not reusable. After the acquisition module is updated, the wiring harness needs to be remade and the bench integration needs to be re-performed, resulting in a lot of time and cost waste. Summary of the invention

[0004] The purpose of the present disclosure is to provide an acquisition module integration device, a hardware-in-the-loop test device, a signal transmission device and a hardware-in-the-loop test system, aiming to solve the problem that since the acquisition module does not have a standard connector, each contact of the acquisition module needs to be welded or directly connected with a clip to be integrated into the bench of the HIL test system, so the wiring method is complicated, and the signal acquisition line and the spring clip lead are easily entangled with each other, which will waste a lot of time and cost.

[0005] According to a first aspect of the present disclosure, there is provided an acquisition module integrated device, which is configured to receive an input signal for testing formed by a controlled object and transmit an output signal to the object under test, and the acquisition module integrated device comprises: a signal transmission connector, which is electrically connected to the controlled object and configured to receive the input signal; a substrate, on which the signal transmission connector is mounted, comprising a plurality of signal acquisition lines, wherein the first ends of the plurality of signal acquisition lines are integrated in the signal transmission connector and are electrically connected to the controlled object through the signal transmission connector to receive and transmit the input signal; a signal transmission connection unit, which is electrically connected to the second ends of the plurality of signal acquisition lines and is configured to receive and transmit the input signal; and at least one acquisition module, wherein the signal input portion of the acquisition module is electrically connected to the plurality of signal acquisition lines of the substrate through the signal transmission connection unit and comprises a signal output portion, wherein the signal output portion is electrically connected to the object under test to transmit the output signal formed by the acquisition module according to the input signal to the object under test.

[0006] In some embodiments of the acquisition module integrated device, the signal transmission connection unit includes a plurality of first acquisition module connection line groups arranged one-to-one corresponding to the signal acquisition lines, the first acquisition module connection line groups include at least one first acquisition module connection line, and the first end of the first acquisition module connection line is connected to the corresponding signal acquisition line, and the second end of the first acquisition module connection line is detachably connected to the signal input part of the acquisition module.

[0007] In some embodiments of the acquisition module integrated device, the signal input part of the acquisition module includes a plurality of electrical connection plates; some of the plurality of electrical connection plates are arranged in a one-to-one correspondence with the plurality of first acquisition module connection line groups, and the electrical connection plate is plugged into the first plug-in part of the second end of a first acquisition module connection line of a corresponding first acquisition module connection line group.

[0008] In some embodiments of the acquisition module integrated device, the first plug-in portion of the first acquisition module connection line includes a first spring clip detachably connected to the electrical connection piece; and / or

[0009] The first acquisition module connecting line also includes an insulating layer arranged outside the first plug-in portion.

[0010] In some embodiments of the acquisition module integrated device, the acquisition module integrated device includes at least two acquisition modules; the first acquisition module connecting line group includes at least two first acquisition module connecting lines greater than or equal to the number of the acquisition modules.

[0011] In some embodiments of the acquisition module integrated device, the acquisition module integrated device includes 1-7 acquisition modules.

[0012] In some embodiments of the acquisition module integrated device, the acquisition module integrated device also includes a support plate, which is arranged between the substrate and the acquisition module adjacent to the substrate, the support plate is fixedly mounted on the substrate, and the acquisition module adjacent to the substrate is fixedly mounted on the support plate.

[0013] In some embodiments of the acquisition module integrated device, the support plate and the base plate are connected or bonded via a threaded connector; the acquisition module adjacent to the base plate is connected and / or clamped to the support plate via a threaded connector.

[0014] In some embodiments of the collection module integrated device, the support plate is a foam plate.

[0015] The second aspect of the present disclosure provides a hardware-in-the-loop test device, comprising: a test bench, including two or more simulators and a test bench output signal connector, the test bench output signal connector including two or more electrical connection ports corresponding one-to-one to the two or more simulators; two or more acquisition module integrated devices as described in the first aspect of the present disclosure, the acquisition module integrated device is located outside the test bench, the two or more acquisition module integrated devices are arranged one-to-one with the two or more simulators, and the simulator is configured to provide a simulation signal as the input signal to the corresponding acquisition module integrated device as the controlled object; and two or more wiring harnesses, the two or more wiring harnesses are arranged one-to-one with the two or more simulators, the first end of each of the wiring harnesses is connected to the corresponding electrical connection port of the test bench output signal connector, the second end of the wiring harness is connected to the signal transmission connector of the corresponding acquisition module integrated device, and the wiring harness is configured to transmit the simulation signal from the simulator to the corresponding acquisition module integrated device.

[0016] In the hardware-in-the-loop test device of some embodiments, the two or more acquisition module integration devices form two signal acquisition units, and the two signal acquisition units include:

[0017] A first signal acquisition unit, the first signal acquisition unit includes at least one acquisition module integrated device, and the acquisition module integrated device of the first signal acquisition unit includes one acquisition module; and / or

[0018] The second signal acquisition unit includes at least one acquisition module integrated device, and the acquisition module integrated device of the second signal acquisition unit includes at least two acquisition modules.

[0019] The third aspect of the present disclosure provides a hardware-in-the-loop testing system, comprising the hardware-in-the-loop testing device described in the second aspect of the present disclosure; an object under test; and a control device, wherein the control device is electrically connected to the two or more simulators and the object under test, and is configured to debug the simulation signals of the two or more simulators and record the results of the object under test analyzing and controlling the two or more simulators.

[0020] In the hardware-in-the-loop test system of some embodiments, the simulator is configured as a battery cell simulator; the object under test includes a battery control unit; the control device is configured to enable the battery cell simulator to generate a battery cell voltage simulation signal and a battery cell temperature simulation signal, the simulation signal includes the battery cell voltage simulation signal and the battery cell temperature simulation signal, and the battery control unit is configured to respond according to the battery cell voltage simulation signal and the battery cell temperature simulation signal and feed back the response result to the control device.

[0021] In the hardware-in-the-loop test system of some embodiments, the acquisition module includes a temperature collector and a voltage collector; the signal acquisition line includes a plurality of temperature signal acquisition lines and a plurality of voltage signal acquisition lines, the plurality of temperature signal acquisition lines are electrically connected to the temperature collector and are configured to transmit the battery cell temperature simulation signal to the temperature collector, and the plurality of voltage signal acquisition lines are electrically connected to the voltage collector and are configured to transmit the battery cell voltage simulation signal to the voltage collector.

[0022] The fourth aspect of the present disclosure provides a signal transmission device of the hardware-in-the-loop test device of the second aspect of the present disclosure, comprising: a wiring harness, a first end of the wiring harness is configured to be electrically connected to an electrical connection port of a bench output signal connector of a bench of the hardware-in-the-loop test device; a signal transmission connector, a second end of the wiring harness is electrically connected to the signal transmission connector; a substrate, the signal transmission connector is mounted on the substrate, the substrate comprises a plurality of signal acquisition lines, the first ends of the plurality of signal acquisition lines are integrated on the signal transmission connector and are electrically connected to the bench output signal connector through the signal transmission connector to receive and transmit signals as a controlled object An input signal for testing formed by the simulator of the test bench; and a signal transmission connection unit, which is arranged on the substrate and electrically connected to the second ends of the plurality of signal acquisition lines, and is configured to receive and transmit the input signal, the signal transmission connection unit includes a plurality of first acquisition module connection line groups arranged one-to-one corresponding to the signal acquisition lines, the first acquisition module connection line groups include at least one first acquisition module connection line, and the first end of the first acquisition module connection line is electrically connected to the corresponding signal acquisition line, and the second end of the first acquisition module connection line includes a plurality of first plug-in parts for detachably connecting to the signal input part of the acquisition module.

[0023] In the signal transmission device of some embodiments, the first plug-in portion includes a first spring clip detachably connected to the electrical connection piece of the signal input portion of the acquisition module; and / or

[0024] The first acquisition module connecting line also includes an insulating layer arranged on the outside of the first plug-in portion.

[0025] The fifth aspect of the present disclosure provides a hardware-in-the-loop testing system, comprising: a test bench, the test bench comprising two or more simulators and a test bench output signal connector, the test bench output signal connector comprising two or more electrical connection ports corresponding one-to-one to the two or more simulators; and the signal transmission device described in the fourth aspect of the present disclosure, the wiring harness of the signal transmission device is arranged one-to-one corresponding to the two or more simulators, and the first end of the wiring harness is electrically connected to the corresponding electrical connection port of the test bench output signal connector of the test bench of the hardware-in-the-loop testing device.

[0026] The acquisition module integrated device provided by the present disclosure is provided with a signal transmission connection unit and integrates multiple signal acquisition lines in a substrate, which is conducive to compressing the space occupied by the signal acquisition lines, so that the signal acquisition lines are arranged in an orderly manner in the substrate and are spatially independent of the signal transmission connection unit, avoiding interference between the signal acquisition lines and the signal transmission connection unit, thereby facilitating improving wiring efficiency. Integrating the first ends of multiple signal acquisition lines in a signal transmission connector to electrically connect to a controlled object is conducive to simplifying wiring to improve line construction efficiency. In addition, the acquisition module integrated device can integrate multiple acquisition modules, which is conducive to increasing the number of acquisition modules and increasing the channels for input signal and output signal transmission, so as to improve the accuracy of the test. The acquisition module integrated device allows the acquisition modules to be centrally arranged, which is conducive to reducing the space occupied by the structure.

[0027] The hardware-in-the-loop test device disclosed in the present invention includes the acquisition module integrated device disclosed in the present invention, thereby having the advantages of the acquisition module integrated device disclosed in the present invention. In addition, the test bench is conducive to realizing the partition processing of the simulator. The electrical connection port and the wiring harness of the test bench output signal connector correspond the simulator and the acquisition module integrated device one by one to form independent signal channels. On the one hand, it is conducive to avoiding mutual interference between the simulators, thereby improving the accuracy of the input signal generated by the corresponding simulator received by the acquisition module integrated device. On the second aspect, the setting facilitates the replacement of the wiring harness, so as to facilitate the replacement of the wiring harness according to different test needs, thereby facilitating the reuse of the acquisition module and increasing the test conditions (for example, working conditions) of the object under test. On the third aspect, the setting is also conducive to organizing the wiring between the simulator and the acquisition module integrated device and reducing the number of wiring.

[0028] The hardware-in-the-loop test system of the present disclosure includes the hardware-in-the-loop test device of the present disclosure, thereby having the advantages of the hardware-in-the-loop test device of the present disclosure. The control device of the hardware-in-the-loop test system is conducive to providing test commands and realizing visualization by communicating with the simulator.

[0029] The signal transmission device disclosed in the present invention includes a wiring harness, a signal transmission connector and a signal transmission connection unit, the signal transmission connection unit includes a plurality of first acquisition module connection line groups arranged in one-to-one correspondence with the signal acquisition lines, the first acquisition module connection line groups include at least one first acquisition module connection line, and the first end of the first acquisition module connection line is electrically connected to the corresponding signal acquisition line, and the second end of the first acquisition module connection line includes a first plug-in part for detachably connecting to the signal input part of the acquisition module. This arrangement is conducive to the rapid connection between the simulator and the acquisition module of the test bench and the transmission of input signals, reducing the number of wiring required to transmit input signals, and the first plug-in part is convenient for operators to perform wiring operations, thereby improving the efficiency of testing the object under test using the hardware-in-the-loop test device. On the other hand, the conversion of different test items can be achieved by replacing the wiring harness, which is conducive to improving the reuse rate of the acquisition module.

[0030] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present application. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0032] Figure 1 A schematic diagram of the structure of a hardware-in-the-loop test device according to an embodiment of the present disclosure;

[0033] Figure 2 for Figure 1 A structural schematic diagram of an acquisition module integration device of a first signal acquisition part of a hardware-in-the-loop test device shown;

[0034] Figure 3 for Figure 2 The exploded structural diagram of the acquisition module integrated device shown;

[0035] Figure 4 for Figure 1 A structural schematic diagram of an acquisition module integration device of a second signal acquisition part of a hardware-in-the-loop test device shown;

[0036] Figure 5 for Figure 4 The exploded structural diagram of the acquisition module integrated device shown;

[0037] Figure 6 for Figure 2 and Figure 4 The electrical principle structure diagram of the substrate of the acquisition module integrated device is shown.

[0038] Figure 1-6 In the figure, each reference numeral represents:

[0039] 1. Collection module integrated device, 11. Base plate, 12. Support plate, 130. First collection module connecting wire group, 131. First collection module connecting wire, 132. First spring clip, 140. Second collection module connecting wire group, 141. Second collection module connecting wire, 142. Second spring clip, 14. Signal transmission connector, 200. Collection module, 201. Electrical connecting piece, 210. Temperature collector, 211. Voltage collector, 2. Test stand, 24. Test stand output signal connector. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present disclosure and its application or use. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0041] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present disclosure. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0042] In the description of the present disclosure, it should be understood that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present disclosure.

[0043] In the description of the present disclosure, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, upright, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0044] The embodiment of the present disclosure provides an acquisition module integrated device. The acquisition module integrated device 1 is configured to receive an input signal for testing formed by a controlled object and transmit an output signal to the object under test. The acquisition module integrated device 1 includes: a signal transmission connector 14, a substrate 11, a signal transmission connection unit and at least one acquisition module 200. The signal transmission connector 14 is electrically connected to the controlled object and is configured to receive an input signal. The signal transmission connector 14 is installed on the substrate 11 and includes a plurality of signal acquisition lines. The first ends of the plurality of signal acquisition lines are integrated in the signal transmission connector 14 and are electrically connected to the controlled object through the signal transmission connector 14 to receive and transmit input signals. The signal transmission connection unit is electrically connected to the second ends of the plurality of signal acquisition lines and is configured to receive and transmit input signals. The signal input part of the acquisition module 200 is electrically connected to the plurality of signal acquisition lines of the substrate 11 through the signal transmission connection unit and includes a signal output part. The signal output part is configured to be electrically connected to the object under test to transmit the output signal formed by the acquisition module 200 according to the input signal to the object under test.

[0045] The acquisition module integrated device 1 provided by the present disclosure is provided with a signal transmission connection unit and integrates multiple signal acquisition lines in the substrate 11, which is conducive to compressing the space occupied by the signal acquisition lines, so that the signal acquisition lines are arranged in an orderly manner in the substrate 11 and are spatially independent of the signal transmission connection unit, avoiding interference between the signal acquisition lines and the signal transmission connection unit, thereby facilitating improving wiring efficiency. The first ends of multiple signal acquisition lines are integrated in the signal transmission connector 14 to be electrically connected to the controlled object, which is conducive to simplifying wiring and improving the efficiency of line construction. The acquisition module integrated device 1 integrates the acquisition module 200, which is conducive to the rapid and accurate electrical connection of the acquisition module 200 with the controlled object, so that the acquisition module 200 is centrally arranged, which is conducive to reducing the space occupied by the structure. When the acquisition module integrated device 1 integrates multiple acquisition modules 200, it is also conducive to increasing the number of acquisition modules 200 and increasing the channels for transmitting input signals and output signals to meet the requirements of the measured object for output signals.

[0046] like Figure 2 and 3As shown, in some embodiments, the substrate 11 may be a PCB board and is located at the bottom of the acquisition module integrated device 1. The acquisition module integrated device 1 may include one or more acquisition modules 200. In addition, the signal transmission connector 14 may be fixedly mounted on the substrate 11 and located on one side of the short side of the substrate 11, and may be arranged toward the controlled object, so as to facilitate the electrical connection of multiple signal acquisition lines integrated in the signal transmission connector 14 with the controlled object.

[0047] In some embodiments, the signal transmission connection unit includes a plurality of first acquisition module connection line groups 130 arranged one-to-one corresponding to the signal acquisition lines. The first acquisition module connection line group 130 includes at least one first acquisition module connection line 131, and the first end of the first acquisition module connection line 131 is connected to the corresponding signal acquisition line, and the second end of the first acquisition module connection line 131 is detachably connected to the signal input part of the acquisition module 200.

[0048] The first acquisition module connection line 131 of the first acquisition module connection line group 130 is detachably connected to the acquisition module 200, which is beneficial to improving the operating efficiency of the operator and reducing the wiring time. In addition, the acquisition module 200 and the substrate 11 are located in a centralized position, which is beneficial to shortening the length of the first acquisition module connection line 131, and is beneficial to avoiding the problem that the connection points at both ends of the first acquisition module connection line 131 are easy to loosen, which is beneficial to improving the reliability of electrical connection. When the first acquisition module connection line group 130 includes multiple first acquisition module connection lines 131, the input signal of the same signal acquisition line can be synchronously transmitted to multiple acquisition modules 200.

[0049] like Figures 2 to 5 As shown, in some embodiments, the signal transmission connection unit also includes a second acquisition module connection line group 140, the second acquisition module connection line group 140 includes at least one second acquisition module connection line 141, and the first end of the second acquisition module connection line 141 is grounded, and the second end of the second acquisition module connection line 141 is detachably connected to the signal input part of the acquisition module 200.

[0050] In some embodiments, the signal input portion of the acquisition module 200 includes a plurality of electrical connection sheets 201. Some of the electrical connection sheets 201 are arranged in one-to-one correspondence with the plurality of first acquisition module connection wire groups 130, and the electrical connection sheet 201 is plugged into the first plug-in portion of the second end of a first acquisition module connection wire 131 of the corresponding first acquisition module connection wire group 130.

[0051] The provision of the electrical connection sheet 201 is conducive to improving the conductive efficiency, reducing the resistance and energy loss, and thus improving the stability of the input signal transmission. On the other hand, the plug-in method is convenient for operators to perform wiring operations, improve the connection stability, reduce signal interruption or data errors caused by poor contact or looseness, and ensure the stability and continuity of the input signal received by the acquisition module 200.

[0052] In some embodiments, some of the electrical connecting pieces 201 among the multiple electrical connecting pieces 201 are electrically connected to the second acquisition module connecting wire 141 of the second acquisition module connecting wire group 140. One second acquisition module connecting wire group 140 may correspond to one electrical connecting piece 201 or may correspond to multiple electrical connecting pieces 201. The electrical connecting piece 201 is plugged into the second plug-in portion of the second end of a second acquisition module connecting wire 141 of the corresponding second acquisition module connecting wire group 140.

[0053] In some embodiments, the electrical connection sheet 201 may be, for example, a nickel sheet. The nickel sheet has good corrosion resistance, which is beneficial for extending the service life of the acquisition module 200. In addition, the nickel sheet is easy to manufacture and process, which is also beneficial for reducing the production cost.

[0054] like Figure 2 and Figure 3 As shown, in some embodiments, the first plug-in portion of the first acquisition module connecting line 131 includes a first spring clip 132 detachably connected to the electrical connecting piece 201 .

[0055] This arrangement facilitates the operator to perform wiring, reduces the time for connecting the first acquisition module connecting line 131 to the acquisition module 200, and is conducive to improving operation efficiency.

[0056] The first acquisition module connection line 131 also includes an insulating layer disposed outside the first plug-in portion (e.g., the first spring clip 132) of the first acquisition module connection line 131. Providing an insulating layer outside the first plug-in portion of the first acquisition module connection line 131 is beneficial to improving the operating safety of the operator, preventing the operator from getting an electric shock during the wiring process, and is also beneficial to isolating the second end of the first acquisition module connection line 131 from the air, thereby increasing the service life of the first acquisition module connection line 131.

[0057] like Figure 2 and Figure 3 As shown, in some embodiments, the second plug-in portion of the second acquisition module connecting line 141 includes a second spring clip 142 detachably connected to the electrical connecting piece 201 .

[0058] The second acquisition module connecting line 141 further includes an insulating layer disposed outside the second plug-in portion (eg, the second spring clip 142 ) of the second acquisition module connecting line 141 .

[0059] In some embodiments (not shown), the signal input portion of the acquisition module 200 may also include multiple signal input connectors, and the multiple signal input connectors are arranged in a one-to-one correspondence with the first acquisition module connecting wire group 130 and the second acquisition module connecting wire group 140. The first plug-in portion of the first acquisition module connecting wire 131 may also include a first substrate output connector that can be plugged and connected to the signal input connector, and the second plug-in portion of the second acquisition module connecting wire 141 may also include a second substrate output connector that can be plugged and connected to the signal input connector.

[0060] In some embodiments, the acquisition module integrated device 1 includes at least two acquisition modules 200 . The first acquisition module connecting wire group 130 includes at least two first acquisition module connecting wires 131 , which is greater than or equal to the number of the acquisition modules 200 .

[0061] The acquisition module integrated device 1 includes at least two acquisition modules 200. This arrangement has a compact layout and is also conducive to matching signal transmission between the controlled object and the measured object, thereby helping to reduce energy consumption and operating costs. At the same time, this arrangement is conducive to reducing the number of acquisition module integrated devices 1, thereby reducing maintenance and repair costs. The first acquisition module connection line group 130 includes at least two first acquisition module connection lines 131 greater than or equal to the number of acquisition modules 200, which is conducive to the operator to perform wiring operations, and is also conducive to replacing other first acquisition module connection lines 131 when the first acquisition module connection line 131 is damaged, and is also conducive to adding acquisition modules 200 according to the measured object's demand for the number of output data.

[0062] In some embodiments, the acquisition module integrated device 1 includes 1-7 acquisition modules 200 .

[0063] The acquisition module integrated device 1 may include a single acquisition module 200 or multiple acquisition modules 200. The fewer acquisition modules 200 included in the acquisition module integrated device 1, the higher the accuracy of the output signal. The more acquisition modules 200 included in the acquisition module integrated device 1, the more resources are saved. The number of acquisition modules 200 of the acquisition module integrated device 1 can be configured according to the accuracy and quantity requirements of the measured object for the received output signal, which is conducive to the allocation of input signals and achieving a better balance between the accuracy and quantity requirements of the measured object for the received output signal. On the other hand, limiting the acquisition module integrated device 1 to include a maximum of 7 acquisition modules 200 is conducive to reducing the accuracy problem caused by the reuse of acquisition modules 200.

[0064] In some embodiments, the acquisition module integrated device 1 further includes a support plate 12. The support plate 12 is disposed between the substrate 11 and the acquisition module 200 adjacent to the substrate 11. The support plate 12 is fixedly mounted on the substrate 11, and the acquisition module 200 adjacent to the substrate 11 is fixedly mounted on the support plate 12.

[0065] The support plate 12 is provided to space the substrate 11 and the acquisition module 200 from each other, thereby facilitating the formation of an installation space for the electrical connection sheet 201. In addition, the support plate 12 is provided to facilitate the assembly and disassembly of the acquisition module 200, thereby facilitating the replacement of the acquisition module 200.

[0066] In some embodiments, the support plate 12 is connected or bonded to the base plate 11 through a threaded connector. The acquisition module 200 adjacent to the base plate 11 is connected or clamped to the support plate 12 through a threaded connector. In some embodiments, the threaded connector can be, for example, a PCB bolt or a self-tapping screw.

[0067] This arrangement is conducive to improving the connection stability between the substrate 11, the support plate 12 and the acquisition module 200 adjacent to the substrate 11. The snap-fit ​​connection between the acquisition module 200 and the support plate 12 facilitates replacement of the acquisition module 200, thereby improving the operating efficiency of the operator.

[0068] like Figure 2 and Figure 3 The collection module integrated device 1 shown includes a collection module 200. The support plate 12 is fixedly connected to the base plate 11 and the support plate 12 is located above the base plate 11. The collection module 200 is fixedly connected to the support plate 12 through two threaded connectors and is located above the support plate 12. Each first collection module connecting wire group 130 includes a first collection module connecting wire 131.

[0069] like Figure 4 and Figure 5 The collection module integrated device 1 shown includes two collection modules 200. One of the two collection modules 200 is fixedly connected to the support plate 12, and the other collection module 200 is connected to the upper part of the collection module 200 connected to the support plate 12 through a threaded connector. This connection method is stable and convenient for replacing the collection module 200. Each first collection module connection line group 130 includes two first collection module connection lines 131, and the first spring clips 132 of the two first collection module connection lines 131 are respectively connected to the electrical connection pieces 201 of the signal input parts of the two collection modules 200. The simulation signal transmitted by the signal collection line as the input signal is simultaneously transmitted to the two first collection module connection lines 131, and is transmitted to the two collection modules 200 respectively through the two first collection module connection lines 131.

[0070] In some embodiments, the support board 12 is a foam board. The support board 12 may also be a wooden board, a plastic board, etc.

[0071] The foam board is light and easy to process, and is easy to cut and shape. It can be precisely adjusted according to the required size to meet the needs of different specifications of the collection module 200 or the threaded connector. In addition, the foam board, wooden board, plastic board and other materials are relatively soft, which is conducive to threaded connection through the threaded connector, thereby facilitating the replacement of the collection module 200.

[0072] On the other hand, the embodiment of the present disclosure provides a hardware-in-the-loop test device, which includes: two or more acquisition module integrated devices 1 provided by the embodiment of the present disclosure, a test bench 2 and two or more wiring harnesses. The test bench 2 includes two or more simulators and a test bench output signal connector 24. The test bench output signal connector 24 includes two or more electrical connection ports corresponding to the two or more simulators. The acquisition module integrated device 1 is located outside the test bench 2. The two or more acquisition module integrated devices 1 are arranged in a one-to-one correspondence with the two or more simulators, and the simulator is configured to provide a simulation signal as the input signal to the corresponding acquisition module integrated device 1 as a controlled object. The two or more wiring harnesses are arranged in a one-to-one correspondence with the two or more simulators, and the first end of each wiring harness is connected to the corresponding electrical connection port of the test bench output signal connector 24, and the second end of the wiring harness is connected to the signal transmission connector 14 of the corresponding acquisition module integrated device 1, and the wiring harness is configured to transmit the simulation signal from the simulator to the corresponding acquisition module integrated device 1.

[0073] The hardware-in-the-loop test device of the embodiment of the present disclosure has the advantages of the acquisition module integrated device 1 of the embodiment of the present disclosure. In addition, the test bench 2 is conducive to realizing the partition processing of the simulator. The electrical connection port and the wiring harness of the test bench output signal connector 24 correspond the simulator and the acquisition module integrated device 1 one by one to form independent signal channels. On the one hand, it is conducive to avoiding mutual interference between the simulators, thereby improving the accuracy of the input signal generated by the corresponding simulator received by the acquisition module integrated device 1. On the second aspect, the setting facilitates the replacement of the wiring harness, so as to facilitate the replacement of the wiring harness according to different test needs, thereby facilitating the reuse of the acquisition module 200 and increasing the test conditions (for example, working conditions) of the object under test. On the third aspect, the setting is also conducive to organizing the wiring between the simulator and the acquisition module integrated device 1 and reducing the number of wiring.

[0074] In some embodiments, two or more acquisition module integrated devices 1 form two signal acquisition parts, and the two signal acquisition parts include a first signal acquisition part and a second signal acquisition part. The first signal acquisition part includes at least one acquisition module integrated device 1. The acquisition module integrated device 1 of the first signal acquisition part includes one acquisition module 200. The second signal acquisition part includes at least one acquisition module integrated device 1. The acquisition module integrated device 1 of the second signal acquisition part includes at least two acquisition modules 200.

[0075] Setting up the first signal acquisition unit is conducive to quickly determining whether the acquisition module 200 is faulty, and is convenient for improving the maintenance efficiency of the hardware-in-the-loop test device. On the other hand, the acquisition module integrated device 1 of the first signal acquisition unit includes only one acquisition module 200, and the acquisition module 200 can be used to set special test points (for example, set maximum and minimum values) to improve the accuracy of the test of the object under test. Setting up the second signal acquisition unit is conducive to compact layout, and while ensuring the test requirements, the number of acquisition module integrated devices 1 can be reduced.

[0076] Another aspect of the present disclosure provides a hardware-in-the-loop test system, which includes: a hardware-in-the-loop test device provided in the present disclosure, a test object, and a control device. The control device is electrically connected to two or more simulators and the test object, and is configured to debug simulation signals of the two or more simulators and record the results of the test object analyzing and controlling the two or more simulators.

[0077] The hardware-in-the-loop test system of the embodiment of the present disclosure has the advantages of the acquisition module integration device 1 and the hardware-in-the-loop test device of the embodiment of the present disclosure. The control device of the hardware-in-the-loop test system is conducive to providing test commands for debugging simulation signals and recording or displaying test results, such as visualizing test results.

[0078] In some embodiments, the simulator is configured as a battery cell simulator. The object under test includes a battery control unit (BCU). The control device is configured to enable the battery cell simulator to generate a battery cell voltage simulation signal and a battery cell temperature simulation signal. The simulation signal includes a battery cell voltage simulation signal and a battery cell temperature simulation signal. The acquisition module 200 transmits an output signal formed by the battery cell voltage simulation signal and the battery cell temperature simulation signal to the BCU. The BCU is configured to respond according to the output signal of the acquisition module 200 and feed back the response result to the control device.

[0079] The battery cell simulator simulates the battery cell to generate battery cell voltage simulation signals and battery cell temperature simulation signals, which is conducive to testing the BCU under various extreme conditions and fault conditions without directly operating the actual hardware. This helps to reduce the risk of safety problems in actual applications and also helps to reduce the preparation time and cost required for testing.

[0080] In some embodiments, multiple cell voltage signal channels and cell temperature signal channels can be formed between each cell simulator and the acquisition module integrated device 1 corresponding to the cell simulator. Each cell voltage signal channel transmits a cell voltage signal, and each cell temperature signal channel transmits a cell temperature signal. The number of cell voltage signal channels and cell temperature signal channels can be set according to the test items.

[0081] In some embodiments, the acquisition module 200 includes a temperature collector 210 and a voltage collector 211. The signal acquisition line includes a plurality of temperature signal acquisition lines and a plurality of voltage signal acquisition lines. The plurality of temperature signal acquisition lines are electrically connected to the temperature collector 210 and configured to transmit a cell temperature simulation signal to the temperature collector 210. The plurality of voltage signal acquisition lines are electrically connected to the voltage collector 211 and configured to transmit a cell voltage simulation signal to the voltage collector 211.

[0082] This setting is conducive to supporting multiple data transmission methods (such as serial port, Ethernet, wireless, etc.), and conveniently transmitting the battery cell temperature simulation signal and the battery cell voltage simulation signal to the acquisition module 200 of each acquisition module integration device 1, thereby improving the transmission efficiency of the battery cell temperature simulation signal and the battery cell voltage simulation signal.

[0083] On the other hand, the embodiment of the present disclosure provides a signal transmission device of a hardware-in-the-loop test device, which includes: a wiring harness, a signal transmission connector 14, a substrate 11, and a signal transmission connection unit. The first end of the wiring harness is configured to be electrically connected to the electrical connection port of the bench output signal connector 24 of the bench 2 of the hardware-in-the-loop test device. The second end of the wiring harness is electrically connected to the signal transmission connector 14. The signal transmission connector 14 is mounted on the substrate 11. The substrate 11 includes a plurality of signal acquisition lines, the first ends of which are integrated on the signal transmission connector 14 and are electrically connected to the bench output signal connector 24 through the signal transmission connector 14 to receive and transmit the input signal for the test formed by the simulator of the bench 2 as the controlled object. The signal transmission connection unit is arranged on the substrate 11 and is electrically connected to the second ends of the plurality of signal acquisition lines, and is configured to receive and transmit the input signal. The signal transmission connection unit includes a plurality of first acquisition module connection line groups 130 arranged one-to-one corresponding to the signal acquisition lines. The first acquisition module connection line group 130 includes at least one first acquisition module connection line 131, and the first end of the first acquisition module connection line 131 is electrically connected to the corresponding signal acquisition line. The second end of the first acquisition module connection line 131 includes a first plug-in portion for detachably connecting to the signal input portion of the acquisition module 200.

[0084] The signal transmission device of the disclosed embodiment is conducive to the rapid connection between the simulator of the test bench 2 and the acquisition module 200 and the transmission of input signals, reducing the number of wiring required to transmit input signals, and the first plug-in portion is convenient for operators to perform wiring operations, thereby improving the efficiency of testing the object under test using the hardware-in-the-loop test device. On the other hand, the test conditions simulated by the simulator in different test items are different. For example, when the simulator is a battery cell simulator, the total number of battery strings simulated by the battery cell simulator is different. Therefore, in different test items, the number of strings that each acquisition module 200 actually needs to collect varies according to different test items. The conversion of different test items can be achieved by replacing the wiring harness, so that the same number of acquisition module integrated devices 1 can meet more test items, which is conducive to improving the reuse rate of the acquisition module 200.

[0085] In some embodiments, the first plug-in portion includes a first spring clip 132 detachably connected to the electrical connection piece 201 of the signal input portion of the acquisition module 200. The first acquisition module connection line 131 also includes an insulating layer disposed outside the first plug-in portion.

[0086] This arrangement facilitates the operator to perform wiring, and is beneficial to improving the operator's wiring efficiency. The insulating layer is beneficial to protecting the first plug-in portion, and is also beneficial to ensuring wiring safety.

[0087] On the other hand, an embodiment of the present disclosure provides a hardware-in-the-loop test device, which includes: a bench 2 and a signal transmission device provided by an embodiment of the present disclosure. The bench 2 includes more than two simulators and a bench output signal connector 24. The bench output signal connector 24 includes more than two electrical connection ports corresponding to the more than two simulators. The wiring harness of the signal transmission device is set in a one-to-one correspondence with the more than two simulators. The first end of the wiring harness is electrically connected to the corresponding electrical connection port of the bench output signal connector 24 of the bench 2 of the hardware-in-the-loop test device.

[0088] The hardware-in-the-loop testing device of the embodiment of the present disclosure has the advantages of the signal transmission device of the embodiment of the present disclosure.

[0089] The following combination Figures 1 to 6 The acquisition module integration device 1, the hardware-in-the-loop test device, the signal transmission device and the hardware-in-the-loop test system of the embodiment of the present disclosure are described in detail.

[0090] The hardware-in-the-loop detection system of this embodiment is used to detect the BCU, that is, the BCU is used as the object to be detected. The hardware-in-the-loop detection system includes a control device, a hardware-in-the-loop detection device and a BCU.

[0091] The control device is loaded with test management software, which is configured to debug the simulation signal of the controlled object and record the results of analyzing and controlling the controlled object, so as to realize functions such as hardware configuration management, test command creation, data recording and analysis, so as to facilitate operators to carry out efficient testing work.

[0092] like Figure 1 As shown, the hardware-in-the-loop detection device includes a test bench 2, six wiring harnesses (wiring harness A1-wiring harness A6) and six acquisition module integrated devices 1. The test bench 2 includes six battery cell simulators, which are controlled objects and are configured for partition processing, and are respectively set in a one-to-one correspondence with the six acquisition module integrated devices 1. The control device is electrically connected to the six battery cell simulators, and the operator can debug the simulation signals generated by the six battery cell simulators through the test management software. The simulation signal of each battery cell simulator includes multiple battery cell voltage simulation signals and multiple battery cell temperature simulation signals. The control device is, for example, an electronic device with a display screen.

[0093] The simulation signal generated by the cell simulator is transmitted to the corresponding acquisition module integrated device 1 through the wiring harness, and the simulation signal is then processed by the acquisition module integrated device 1 as an output signal and transmitted to the BCU. The BCU receives the output signal, analyzes and controls the cell simulator according to the output signal, and feeds the result back to the control device.

[0094] In summary, the hardware-in-the-loop test system of this embodiment is equivalent to a test platform that simulates the actual operating environment. It simulates the operating state of the battery cell by running the battery cell simulator, and outputs the simulation signal (battery cell voltage simulation signal and battery cell temperature simulation signal) indicating the operating condition of the battery cell as the input signal of the acquisition module integrated device 1, and then the acquisition module 200 of the acquisition module integrated device 1 detects and collects the simulation signal to form an output signal and transmits it to the BCU. The BCU analyzes the operating conditions (including temperature and voltage) simulated by the battery cell simulator according to the output signal of the acquisition module 200 of the acquisition module integrated device 1 and controls the battery cell simulator to adjust the temperature and voltage, and at the same time feeds back the response result to the control device. The control device receives the response result fed back by the BCU and judges the operating state of the BCU, thereby completing the test of the BCU. The hardware-in-the-loop test system is conducive to testing and developing the BCU in a virtual environment without simulating the actual working conditions. This test method for the BCU improves efficiency and safety, and is conducive to reducing test costs.

[0095] The test bench 2 also includes a test bench output signal connector 24, which includes six electrical connection ports, each of which is set in a one-to-one correspondence with the six battery cell simulators. The wiring harness A1-wiring harness A6 respectively correspond to the corresponding battery cell simulators and the acquisition module integrated device 1. The acquisition module integrated device 1 includes a signal transmission connector 14. Taking the wiring harness A1 as an example, the wiring harness A1 is connected between the signal transmission connector 14 of the acquisition module integrated device 1-AFEHead1 and the electrical connection port corresponding to the acquisition module integrated device 1-AFEHead1. In this way, through the one-to-one corresponding signal transmission connector 14, the wiring harness and the electrical connection port of the test bench output signal connector 24, each battery cell simulator and each acquisition module integrated device 1 form a stable one-to-one correspondence, which is conducive to the accurate transmission of the simulation signal and also conducive to reducing the number of wiring, thereby improving the efficiency of testing using the hardware-in-the-loop test device. In addition, the first ends of the wiring harness A1 to the wiring harness A6 are integrated in the second connector 24 and have corresponding electrical connection ports, which facilitates the operator to perform quick wiring operations.

[0096] Sixteen cell voltage signal channels and four cell temperature signal channels are formed between each cell simulator and the acquisition module integrated device 1 corresponding to the cell simulator. Each cell voltage signal channel transmits a cell voltage signal, and each cell temperature signal channel transmits a cell temperature signal. The twenty channels are integrated in the corresponding wiring harness to simultaneously transmit simulation signals to the acquisition module integrated device 1.

[0097] The acquisition module integrated device 1 includes a substrate 11, a support plate 12, an acquisition module 200 and a signal transmission connector 14. The substrate 11 is a PCB board. Twenty signal acquisition lines are integrated on the substrate 11, including sixteen voltage signal acquisition lines and four temperature signal acquisition lines. The signal transmission connector 14 is installed on one side of the short side of the substrate 11, and the first ends of the twenty signal acquisition lines are integrated in the signal transmission connector 14, and are connected to the sixteen battery cell voltage signal channels and the four battery cell temperature signal channels correspondingly to simultaneously receive the battery cell voltage simulation signal and the battery cell temperature simulation signal.

[0098] like Figure 6As shown, sixteen voltage signal contacts and four temperature signal contacts are arranged in the signal transmission connector 14. The first ends of the sixteen voltage signal acquisition lines are electrically connected to the sixteen voltage signal contacts, and the first ends of the four temperature signal acquisition lines are electrically connected to the four temperature signal contacts. Sixteen voltage ports are arranged on the substrate 11, and the second ends of the sixteen voltage signal acquisition lines are arranged in the sixteen voltage ports respectively. Four temperature ports are arranged on the substrate 11, and the second ends of the four temperature signal acquisition lines are arranged in the temperature ports. A voltage negative electrode port and a temperature negative electrode port are also arranged on the substrate 11, and the voltage negative electrode port and the temperature negative electrode port are used for grounding.

[0099] The signal transmission connection unit includes twenty first acquisition module connection wire groups 130 and two second acquisition module connection wire groups 140. Each first acquisition module connection wire group 130 includes one or more first acquisition module connection wires 131, wherein the first ends of the first acquisition module connection wires 131 of the sixteen first acquisition module connection wire groups 130 are electrically connected to the second ends of the voltage signal acquisition wire at the voltage port to receive the cell voltage simulation signal transmitted by the voltage signal acquisition wire, and the first ends of the first acquisition module connection wires 131 of the four first acquisition module connection wire groups 130 are electrically connected to the second ends of the four temperature signal acquisition wires at the temperature port to receive the cell temperature simulation signal transmitted by the temperature signal acquisition wire. Each second acquisition module connection wire group 140 includes one or more second acquisition module connection wires 141, wherein the first end of the second acquisition module connection wire 141 of one second acquisition module connection wire group 140 is grounded at the voltage negative electrode port, and the first end of the first acquisition module connection wire 141 of another second acquisition module connection wire group 140 is grounded at the temperature negative electrode port.

[0100] The acquisition module 200 includes twenty-five electrical connection pieces 201, a temperature collector 210 and a voltage collector 211. The first spring clips 132 of the first acquisition module connection lines 131 of the four first acquisition module connection line groups 130 are plugged into the four electrical connection pieces 201 in a one-to-one correspondence, the positive terminal of the temperature collector 210 is electrically connected to the four electrical connection pieces 201, the second spring clips 142 of the four second acquisition module connection lines 141 of the second acquisition module connection line group 140 are plugged into the four electrical connection pieces 201 in a one-to-one correspondence, and the negative terminal of the temperature collector 210 is electrically connected to the four electrical connection pieces 201 to collect the battery cell temperature simulation signal. The first spring clips 132 of the first acquisition module connection lines 131 of the sixteen first acquisition module connection line groups 130 are plugged into the remaining sixteen electrical connection pieces 201 in a one-to-one correspondence, and the voltage collector 211 is electrically connected to the sixteen electrical connection pieces 201 to collect the battery cell voltage simulation signal.

[0101] The hardware-in-the-loop test device includes a first signal acquisition unit and a second signal acquisition unit. The first signal acquisition unit includes an acquisition module integrated device 1-AFEHead1, an acquisition module integrated device 1-AFEHead2, an acquisition module integrated device 1-AFEEnd1 and an acquisition module integrated device 1-AFEEnd2. Each acquisition module integrated device 1 of the first signal acquisition unit is configured to receive a first simulation signal (for example, a simulation signal of a cell voltage simulated by a simulator as a maximum value or a simulation signal of a cell voltage simulated by a simulator as a minimum value). The second signal acquisition unit includes an acquisition module integrated device 1-AFEMux1 and an acquisition module integrated device 1-AFEMux2. The acquisition module integrated device 1-AFEMux1 and the acquisition module integrated device 1-AFEMux2 each include four acquisition modules 200. Each acquisition module integrated device 1 of the second signal acquisition unit is configured to receive a second simulation signal (for example, a simulation signal of other cell voltage values ​​between the maximum value and the minimum value of the cell voltage simulated by the simulator). This setting method is conducive to covering all test points of the BCU, so as to form a sufficient amount of data through a limited number of simulators, and is conducive to saving the number of cell voltage signal channels. In addition, the same test bench 2 can be used to test different test items, which is beneficial to improving the applicability of the test bench 2.

[0102] The first acquisition module connection line group 130 of the acquisition module integrated device 1 of the first signal acquisition unit includes a first acquisition module connection line 131, which is correspondingly plugged into the corresponding electrical connection piece 201 of one acquisition module 200. The first acquisition module connection line group 130 of the acquisition module integrated device 1 of the second signal acquisition unit includes four first acquisition module connection lines 131, which are respectively plugged into the corresponding electrical connection pieces 201 of the four acquisition modules 200.

[0103] The acquisition modules 200 of the six acquisition module integrated devices 1 are connected via daisy chain signals. Taking the acquisition module integrated device 1- AFEEnd1 and the acquisition module integrated device 1- AFEEnd2 as examples, the voltage collector 211 of the acquisition module 200 of the acquisition module integrated device 1- AFEEnd2 and the temperature collector 210 of the acquisition module 200 of the acquisition module integrated device 1- AFEEnd1 are connected in series via daisy chain communication. In an embodiment not shown in the figure, each acquisition module 200 can also be connected to the BCU via a CAN bus.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure rather than to limit it. Although the present disclosure has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present disclosure can still be modified or some technical features can be replaced by equivalents, which should all be included in the scope of the technical solution for protection requested by the present disclosure.

Claims

1. A collection module integrated device, characterized in that: The acquisition module integrated device (1) is configured to receive a test input signal generated by a controlled object and transmit an output signal to the object under test. The acquisition module integrated device (1) comprises: A signal transmission connector (14), electrically connected to the controlled object and configured to receive the input signal; A substrate (11), the signal transmission connector (14) being mounted on the substrate (11), comprising a plurality of signal collection lines, the first ends of the plurality of signal collection lines being integrated in the signal transmission connector (14) and electrically connected to the controlled object through the signal transmission connector (14) to receive and transmit the input signal; a signal transmission connection unit, electrically connected to the second ends of the plurality of signal collection lines, and configured to receive and transmit the input signal; and At least one acquisition module (200), the signal input portion of the acquisition module (200) being electrically connected to the plurality of signal acquisition lines of the substrate (11) via the signal transmission connection unit and comprising a signal output portion, the signal output portion being configured to be electrically connected to the object under test so as to transmit the output signal formed by the acquisition module (200) according to the input signal to the object under test.

2. The acquisition module integrated device according to claim 1, characterized in that: The signal transmission connection unit comprises a plurality of first acquisition module connection line groups (130) arranged in one-to-one correspondence with the signal acquisition lines, the first acquisition module connection line group (130) comprises at least one first acquisition module connection line (131), and a first end of the first acquisition module connection line (131) is connected to the corresponding signal acquisition line, and a second end of the first acquisition module connection line (131) is detachably connected to the signal input portion of the acquisition module (200).

3. The acquisition module integrated device according to claim 2, characterized in that: The signal input portion of the acquisition module (200) comprises a plurality of electrical connection sheets (201); Some of the electrical connection sheets (201) among the plurality of electrical connection sheets (201) are arranged in one-to-one correspondence with the plurality of first acquisition module connection line groups (130), and the electrical connection sheet (201) is plugged into a first plug-in portion of a second end of a first acquisition module connection line (131) of a corresponding first acquisition module connection line group (130).

4. The acquisition module integrated device according to claim 3, characterized in that: The first plug-in portion of the first acquisition module connecting line (131) comprises a first spring clip (132) detachably connected to the electrical connecting piece (201); and / or The first acquisition module connecting line (131) further comprises an insulating layer arranged outside the first plug-in portion.

5. The acquisition module integrated device according to claim 2, characterized in that: The acquisition module integrated device (1) comprises at least two acquisition modules (200); The first acquisition module connection line group (130) comprises at least two first acquisition module connection lines (131) whose number is greater than or equal to the number of the acquisition modules (200).

6. The acquisition module integrated device according to claim 1, characterized in that: The acquisition module integrated device (1) comprises 1 to 7 acquisition modules (200).

7. The acquisition module integrated device according to claim 1, characterized in that: The acquisition module integrated device (1) further comprises a support plate (12), wherein the support plate (12) is arranged between the substrate (11) and the acquisition module (200) adjacent to the substrate (11), the support plate (12) is fixedly mounted on the substrate (11), and the acquisition module (200) adjacent to the substrate (11) is fixedly mounted on the support plate (12).

8. The acquisition module integrated device according to claim 7, characterized in that: The support plate (12) and the base plate (11) are connected or bonded via a threaded connection; The acquisition module (200) adjacent to the base plate (11) is connected and / or clamped to the support plate (12) via a threaded connector.

9. The acquisition module integrated device according to claim 8, characterized in that: The support plate (12) is a foam plate.

10. A hardware-in-the-loop testing device, characterized in that: include: A test bench (2) comprising two or more simulators and a test bench output signal connector (24), wherein the test bench output signal connector (24) comprises two or more electrical connection ports corresponding one-to-one to the two or more simulators; Two or more acquisition module integrated devices (1), the acquisition module integrated device (1) being the acquisition module integrated device according to any one of claims 1 to 10, the acquisition module integrated device (1) being located outside the test bench (2), the two or more acquisition module integrated devices (1) being arranged in one-to-one correspondence with the two or more simulators, the simulator being configured to provide a simulation signal as the input signal to the corresponding acquisition module integrated device (1) as the controlled object; and More than two wiring harnesses are arranged in one-to-one correspondence with more than two simulators, the first end of each wiring harness is connected to the corresponding electrical connection port of the test bench output signal connector (24), the second end of the wiring harness is connected to the signal transmission connector (14) of the corresponding acquisition module integrated device (1), and the wiring harness is configured to transmit the simulation signal from the simulator to the corresponding acquisition module integrated device (1).

11. The hardware-in-the-loop testing device according to claim 10, characterized in that: The two or more acquisition module integration devices (1) form two signal acquisition units, and the two signal acquisition units include: a first signal acquisition unit, the first signal acquisition unit comprising at least one acquisition module integrated device (1), the acquisition module integrated device (1) of the first signal acquisition unit comprising one acquisition module (200); and / or A second signal acquisition unit, wherein the second signal acquisition unit comprises at least one acquisition module integrated device (1), and the acquisition module integrated device (1) of the second signal acquisition unit comprises at least two acquisition modules (200).

12. A hardware-in-the-loop test system, characterized in that: include: The hardware-in-the-loop testing device according to claim 10 or 11; The object being measured; and The control device is electrically connected to the two or more simulators and the object under test, and is configured to debug the simulation signals of the two or more simulators and record the results of the object under test analyzing and controlling the two or more simulators.

13. The hardware-in-the-loop test system according to claim 12, characterized in that The simulator is configured as a battery cell simulator; The object under test includes a battery control unit; The control device is configured to enable the battery cell simulator to generate a battery cell voltage simulation signal and a battery cell temperature simulation signal, the simulation signal includes the battery cell voltage simulation signal and the battery cell temperature simulation signal, and the battery control unit is configured to respond according to the battery cell voltage simulation signal and the battery cell temperature simulation signal and feed back the response result to the control device.

14. The hardware-in-the-loop test system according to claim 13, characterized in that: The acquisition module (200) comprises a temperature collector (210) and a voltage collector (211); The signal acquisition lines comprise a plurality of temperature signal acquisition lines and a plurality of voltage signal acquisition lines; the plurality of temperature signal acquisition lines are electrically connected to the temperature collector (210) and are configured to transmit the battery cell temperature simulation signal to the temperature collector (210); the plurality of voltage signal acquisition lines are electrically connected to the voltage collector (211) and are configured to transmit the battery cell voltage simulation signal to the voltage collector (211).

15. A signal transmission device for a hardware-in-the-loop test device, characterized in that: include: A wiring harness, a first end of the wiring harness being configured to be electrically connected to an electrical connection port of a bench output signal connector (24) of a bench (2) of the hardware-in-the-loop test device; a signal transmission connector (14), the second end of the wiring harness being electrically connected to the signal transmission connector (14); A substrate (11), the signal transmission connector (14) being mounted on the substrate (11), the substrate (11) comprising a plurality of signal acquisition lines, the first ends of the plurality of signal acquisition lines being integrated on the signal transmission connector (14) and electrically connected to the test bench output signal connector (24) through the signal transmission connector (14) to receive and transmit a test input signal generated by a simulator of the test bench (2) as a controlled object; and A signal transmission connection unit is arranged on the substrate (11) and is electrically connected to the second ends of the plurality of signal acquisition lines, and is configured to receive and transmit the input signal. The signal transmission connection unit comprises a plurality of first acquisition module connection line groups (130) arranged in one-to-one correspondence with the signal acquisition lines. The first acquisition module connection line groups (130) comprise at least one first acquisition module connection line (131), and the first end of the first acquisition module connection line (131) is electrically connected to the corresponding signal acquisition line. The second end of the first acquisition module connection line (131) comprises a plurality of first plug-in parts for detachably connecting to the signal input part of the acquisition module (200).

16. The signal transmission device according to claim 15, characterized in that: The first plug-in portion comprises a first spring clip (132) detachably connected to the electrical connection piece (201) of the signal input portion of the acquisition module (200); and / or The first acquisition module connecting line (131) further comprises an insulating layer arranged outside the first plug-in portion.

17. A hardware-in-the-loop testing device, characterized in that: include: A test bench (2) comprising two or more simulators and a test bench output signal connector (24), wherein the test bench output signal connector (24) comprises two or more electrical connection ports corresponding one-to-one to the two or more simulators; and According to the signal transmission device according to claim 15 or 16, the wiring harness of the signal transmission device is arranged in a one-to-one correspondence with the more than two simulators, and the first end of the wiring harness is electrically connected to the corresponding electrical connection port of the bench output signal connector (24) of the bench (2) of the hardware-in-the-loop test device.

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