High-computing-power edge computing equipment with active heat dissipation and heating functions

Abstract

A high-computing-power edge computing device with active heat dissipation and heating functions comprises a shell, the shell comprises an outer shell, a bottom plate and a side panel, and the outer shell, the bottom plate and the side panel are connected to form a closed shell; a plurality of radiating fins are distributed on the shell, a fan mounting slot is formed in the shell, a fan is arranged in the fan mounting slot, a fan cover plate covering the fan mounting slot is arranged on the shell, and meshes are formed in the fan cover plate; a heat conduction copper pipe is embedded in the inner wall of the shell, a heat conduction boss is arranged below the heat conduction copper pipe, and heat conduction gel layers are arranged between the heat conduction copper pipe and the inner wall of the shell and on the upper face and the lower face of the heat conduction boss. The size and the weight of the product are reduced under the condition that the heat dissipation performance of the heat dissipation fins is not reduced, and compared with a traditional framework product, the product is easier to place in a narrow space. Multiple heat management measures of the fan, the ceramic heating piece and the heat conduction copper pipe are adopted, the active heat dissipation and heating functions are achieved, and normal work under the high-temperature and severe cold conditions can be met.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electrical equipment, and in particular to a high-computing-power edge computing device with active heat dissipation and heating functions. Background Art

[0002] High-computing edge computing devices are an important type of equipment that has emerged in recent years with the development of edge computing technology. They usually have powerful computing power, data storage capacity and network connection capabilities, and can perform efficient data processing and analysis at the edge of the network. In the field of vehicle-road collaboration, they analyze the signals collected by road-side equipment such as radars and cameras, communicate with the cloud in real time, and achieve real-time road condition monitoring, traffic planning, and danger perception through system-level algorithm planning, helping vehicles achieve unmanned driving and intelligent warnings for traffic participants.

[0003] Existing MEC products have problems such as poor heat dissipation performance under high computing power, complex assembly process, and low expansion flexibility. In actual use, they require a large installation space, and when placed in a cabinet, poor heat dissipation causes the device to slow down, affecting computing performance. Summary of the invention

[0004] According to the problems raised in the background technology, the present invention provides a high-computing-power edge computing device with active heat dissipation and heating functions to solve the problems. The present invention will be further elaborated below.

[0005] A high-computing-power edge computing device with active heat dissipation and heating functions comprises a shell, the shell comprising an outer shell, a bottom plate and a side panel, the outer shell, the bottom plate and the side panel are connected to form a closed shell; a plurality of heat dissipation fins are distributed on the outer shell, a fan mounting slot is provided on the outer shell, a fan is built in the fan mounting slot, a fan cover covering the fan mounting slot is provided on the outer shell, and mesh holes are provided on the fan cover; a heat-conducting copper tube is embedded on the inner wall of the outer shell, a heat-conducting boss is provided below the heat-conducting copper tube, and a heat-conducting gel layer is provided between the heat-conducting copper tube and the inner wall of the outer shell, and on the upper and lower surfaces of the heat-conducting boss.

[0006] Preferably, the heat dissipation fins are provided with serrated grooves, which can reduce the volume and weight and increase the heat dissipation surface area of ​​the fins, thereby further improving the heat dissipation effect.

[0007] Preferably, the shell adopts a U-shaped structure, with sides and the top forming edges, and heat dissipation ribs are provided on the surface of the edges to further enhance the heat dissipation effect of the shell.

[0008] Preferably, grooves are provided on both sides of the heat-conducting boss, and ceramic heating plates are built in the grooves. When the ambient temperature is too low, the ceramic heating plates will start the heating module to ensure low-temperature cold start performance.

[0009] Preferably, the housing has an AGX module built in, and the AGX module is arranged under the heat-conducting boss. The heat generated by the AGX module is transferred to the heat-conducting copper tube through the heat-conducting boss and then to the heat-dissipating housing, which can quickly dissipate the heat to the environment, achieving the effect of rapid cooling of the module.

[0010] Preferably, a mainboard is arranged under the AGX module, and the mainboard is fastened to the housing by fasteners, and there are fasteners passing through the mainboard to connect the AGX module with the heat sink fins and the heat conduction bosses, so as to make the AGX module fit more closely with the heat sink fins and the heat conduction bosses, improve the heat conduction efficiency and increase the installation firmness.

[0011] Preferably, a temperature sensor is provided on the mainboard to detect the ambient temperature, and when the set value is reached, the fan and the PTC ceramic heating plate are turned on and off.

[0012] Beneficial effects: Compared with the prior art, the heat dissipation fins provided in the present invention reduce the product volume and weight without reducing the heat dissipation performance, and are easier to place in a small space than traditional architecture products. The present invention adopts multiple thermal management measures such as fans, ceramic heating plates and heat-conducting copper tubes, has active heat dissipation and heating functions, and can meet normal operation under high temperature and severe cold conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 : A structural cross-sectional view of a high computing power edge computing device of the present invention;

[0014] Figure 2 : A three-dimensional diagram of the structure of high-computing edge computing equipment;

[0015] In the figure: housing 1, fan mounting slot 101, bottom plate 2, mounting ear 201, heat sink fin 3, serrated groove 301, fan 4, fan cover 5, thermal copper tube 6, thermal boss 7, AGX module 8, ceramic heating plate 9, mainboard 10, power heat sink 11, side panel 12. DETAILED DESCRIPTION

[0016] Next, combine with Figure 1-2 A specific embodiment of the present invention is described in detail.

[0017] A high-computing-power edge computing device with active heat dissipation and heating functions includes a shell, wherein the shell includes an outer shell 1, a bottom plate 2, a side panel 12 and a fan cover 5. The outer shell 1 adopts a U-shaped structure, with sides and a top forming a surrounding edge, which is fixedly connected to the bottom plate 2, and the side panel 12 is connected to the outer shell 1 and the bottom plate 2 to form a closed shell.

[0018] The housing 1 is preferably formed by extrusion molding of aluminum alloy, and a plurality of heat dissipation fins 3 are distributed on the housing 1, and heat is dissipated to the outside through radiation heat dissipation of the heat dissipation fins 3. The heat dissipation fins 3 are provided with sawtooth grooves 301, which can reduce the volume and weight and increase the heat dissipation surface area of ​​the fins, further improving the heat dissipation effect. The surrounding surface of the housing 1 is provided with heat dissipation ribs, which further improve the heat dissipation effect of the housing.

[0019] A fan installation slot 101 is provided in the middle area of ​​the housing 1, and a fan 4 is built in the fan installation slot 101. A fan cover 5 covering the fan installation slot is provided on the housing, and mesh holes are provided on the fan cover 5 to ensure the air intake. When the operating temperature is reached in the edge computing device, the fan will automatically turn on, and the air will enter through the fan cover, and then be guided to cool the heat sink fins 3. The generated airflow flows between the heat sink fins 3 and exchanges heat with the surface of the heat sink fins.

[0020] A thermally conductive copper tube 6 is embedded on the inner wall of the shell 1, and a high thermal conductivity gel layer is filled between the thermally conductive copper tube 6 and the inner wall of the shell 1 to ensure that the thermally conductive copper tube is in full contact with the inner wall of the shell. Multiple thermally conductive copper tubes are evenly distributed on the installation path of the AGX module to quickly export the heat generated by the AGX module to the heat sink.

[0021] A heat-conducting boss 7 is provided below the heat-conducting copper tube 6 , and both upper and lower surfaces of the heat-conducting boss 7 are coated with a high thermal conductivity gel layer to ensure full contact with the heat-conducting copper tube 6 and the AGX module 8 built into the housing.

[0022] The heat-conducting boss 7 is provided with grooves on both sides for placing the PTC ceramic heating plate 9. When the ambient temperature is too low, the ceramic heating plate 9 will start the heating module to ensure low-temperature cold start performance. The heat-conducting boss 7 is preferably a CNC structural part, which can be made of aluminum or copper. The overall shape and slot size can be customized according to the size of the module and the ceramic heating plate to meet different heat dissipation and heating requirements.

[0023] The AGX module 8 is arranged under the thermal conductive boss. The heat generated by the AGX module is transferred to the thermal conductive copper tube 6 through the thermal conductive boss 7 and then to the heat dissipation housing 1. Since the thermal conductive copper tube can distribute the heat to the entire heat dissipation fin area of ​​the housing, the heat can be quickly dissipated into the environment, achieving the effect of quickly cooling the module.

[0024] A main board 10 (PCBA) is arranged under the AGX module. The main board is fastened to the outer shell by screws on all sides. At the same time, at least 4 screws thereon pass through the main board to connect the AGX module, the heat sink fins 3 and the thermal boss. This makes the screws more tightly pressed on the AGX module, ensuring a tighter fit between the AGX module, the heat sink fins 3 and the thermal boss, thereby improving the thermal conductivity efficiency and increasing the installation firmness.

[0025] The bottom plate 2 is located below the main board 10. A power heat sink 11 is designed on the bottom plate. The power heat sink 11 is in contact with the power module and can export the heat on the power module to the housing, thereby enhancing the heat dissipation of the main board.

[0026] The base plate 2 is preferably an aluminum alloy plate, with hanging ears 201 on both sides for installing and fixing the overall high-computing power edge computing equipment. At the same time, different fixed anchor points can be designed on the base plate according to the installation requirements to adapt to different installation scenarios.

[0027] An interface is provided on the side panel 12, and the interface form can be customized and developed according to the requirements. Customization does not require changing the mold or disassembling the machine, and only the side panel needs to be replaced.

[0028] A temperature sensor is designed on the mainboard to detect the ambient temperature. When the set value is reached, the fan and PTC ceramic heater are turned on and off.

[0029] The outer shell and heat sink of the present invention are integrated into one piece, which improves the heat dissipation capacity of the whole machine while improving the overall strength. At the same time, the one-piece molding solution greatly saves the mold cost. The existence of the thermal conductive boss structure facilitates the adjustment and adaptation of AGX modules of different specifications without changing its mold, saving product development cycle and cost. The heat dissipation fins reduce the volume and weight of the product without reducing the heat dissipation performance, and are easier to place in a small space than traditional architecture products. The present invention adopts multiple thermal management measures such as fans, ceramic heaters and thermal conductive copper tubes, and has active heat dissipation and heating functions, which can meet normal operation under high temperature and severe cold conditions.

[0030] The present invention optimizes the product structure and adopts aluminum extrusion and sheet metal combination, so the product solution has strong combination scalability. The whole machine is easy to assemble and disassemble for maintenance. Compared with traditional equipment that requires disassembly of multiple parts to remove the mainboard for maintenance, the present invention only needs to remove the bottom plate for maintenance.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-computing power edge computing device with active heat dissipation and heating functions, comprising a housing, the housing comprising an outer shell (1), a bottom plate (2) and a side panel (12), the outer shell (1), the bottom plate (2) and the side panel (12) being connected to form a closed housing; characterized in that: A plurality of heat dissipation fins (3) are distributed on the outer shell (1); a fan installation slot (101) is provided on the outer shell (1); a fan (4) is built into the fan installation slot; a fan cover (5) covering the fan installation slot is provided on the outer shell; and mesh holes are provided on the fan cover (5); a heat-conducting copper tube (6) is embedded on the inner wall of the outer shell (1); a heat-conducting boss (7) is provided below the heat-conducting copper tube (6); and a heat-conducting gel layer is provided between the heat-conducting copper tube (6) and the inner wall of the outer shell (1), and on the upper and lower surfaces of the heat-conducting boss (7).

2. The high computing power edge computing device according to claim 1, characterized in that: The heat dissipation fins (3) are provided with sawtooth grooves (301), which can reduce the volume and weight and increase the heat dissipation surface area of ​​the fins, thereby further improving the heat dissipation effect.

3. The high computing power edge computing device according to claim 1, characterized in that: The outer shell (1) adopts a U-shaped structure, with two sides and a top forming surrounding edges.

4. The high computing power edge computing device according to claim 3, characterized in that: The peripheral surface of the housing (1) is provided with heat dissipation ribs.

5. The high computing power edge computing device according to claim 1, characterized in that: Grooves are arranged on both sides of the heat-conducting boss (7), and ceramic heating plates (9) are built into the grooves.

6. The high computing power edge computing device according to claim 1, characterized in that: The shell body has an AGX module (8) built in, and the AGX module (8) is arranged below the heat-conducting boss (7).

7. The high computing power edge computing device according to claim 1, characterized in that: A main board (10) is arranged below the AGX module, and the main board is fastened to the housing via fasteners, and there are fasteners passing through the main board to connect the AGX module, the heat dissipation fins (3) and the heat-conducting boss.

8. The high computing power edge computing device according to claim 7, characterized in that: The bottom plate (2) is provided with a power cooling block (11), and the power cooling block (11) is in contact with the power module.

9. The high computing power edge computing device according to claim 1, characterized in that: The bottom plate (2) is provided with hanging ears on both sides; and the side panel (12) is provided with an interface.

10. The feature of the invention according to claim 1 is that a temperature sensor is provided on the mainboard to detect the ambient temperature, and when the set value is reached, the fan and the PTC ceramic heating plate are turned on and off.

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