Component control method and device, computer equipment and storage medium

Abstract

The invention relates to a component control method and device, computer equipment, a storage medium and a computer program product. The method comprises the steps of obtaining device monitoring information of a component and environment monitoring information of an environment where the component is located, determining a device risk level for the component according to a fluctuation degree of a monitoring parameter value in the device monitoring information, and determining an environment risk level for the component according to a difference between the environment monitoring information and environment standard information, and in a plurality of candidate processing modes corresponding to the component, determining a target processing mode matched with the component risk level and the environmental risk level, by adopting the method, starting from the dimension of the component and the dimension of the environment where the component is located, obtaining comprehensive monitoring information, and matching the target processing mode with the component risk level and the environmental risk level, so that the monitoring efficiency is improved. And the components are processed according to the target processing mode, so that the condition of repeated maintenance is avoided, and the maintenance efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of electrical automation technology, and in particular to a component control method, device, computer equipment, storage medium and computer program product. Background Art

[0002] There are many components involved in the electrical system. When the power system is in a normal or faulty state, the components need to work normally and reliably to meet the reliability and stability requirements of the power system. Components are often installed outdoors. The installation location is generally complex and is more susceptible to environmental influences. The probability of failure is high. Once a failure occurs, it will cause huge economic losses and threaten the safe and reliable operation of the power grid.

[0003] In the traditional method, the electrical parameters of the components themselves are monitored, and the maintenance method for the components is determined based on the monitoring results. However, there is still a problem of mismatch between the maintenance method and the component failure, which leads to repeated maintenance and reduces maintenance efficiency. Summary of the invention

[0004] Based on this, it is necessary to provide a component control method, device, computer equipment, computer-readable storage medium and computer program product that can improve the efficiency of maintenance in response to the above technical problems.

[0005] In a first aspect, the present application provides a component control method. The method comprises:

[0006] Obtain device monitoring information of components and environmental monitoring information of the environment in which the components are located; determine the device risk level for the components based on the degree of fluctuation of the monitoring parameter values ​​in the device monitoring information; determine the environmental risk level for the components based on the difference between the environmental monitoring information and the environmental standard information; determine a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the components; and process the components according to the target processing method.

[0007] In one embodiment, the environmental monitoring information includes: the smoke concentration, ambient temperature and ambient light intensity of the environment; determining the environmental risk level for the component based on the difference between the environmental monitoring information and the environmental standard information includes: obtaining environmental standard information; the environmental standard information includes: a smoke concentration threshold corresponding to the smoke concentration, an ambient temperature threshold corresponding to the ambient temperature, and an ambient light intensity threshold corresponding to the ambient light intensity; when the smoke concentration is greater than or equal to the smoke concentration threshold, determining the environmental risk level for the component based on the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold.

[0008] In one of the embodiments, determining the environmental risk level for the component based on the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold, includes: comparing the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with set thresholds, respectively, to determine a comparison result; determining the environmental risk type of the component based on the comparison result; and determining the environmental risk level of the component corresponding to the environmental risk type according to the environmental risk type, and the temperature difference and the light intensity difference.

[0009] In one of the embodiments, the monitoring parameter value includes the device temperature of the component; determining the device risk level for the component based on the degree of fluctuation of the monitoring parameter value in the device monitoring information includes: determining the temperature threshold range of the component based on the device model of the component; determining the degree of fluctuation of the device temperature based on the difference between the device temperature in a current time period and the device temperature in multiple time periods in the device monitoring information; determining the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range.

[0010] In one of the embodiments, determining the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range includes: determining the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range; and determining the device risk level of the component corresponding to the device risk type according to the device risk type and the fluctuation degree.

[0011] In one of the embodiments, determining a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the component includes: obtaining a plurality of candidate processing methods from a processing method library for the component; obtaining a comprehensive risk level of the component by integrating the device risk level and the environmental risk level; and screening each of the candidate processing methods according to the comprehensive risk level to obtain a target processing method that matches the device risk level and the environmental risk level.

[0012] In a second aspect, the present application also provides a component control device. The device comprises:

[0013] An acquisition module is used to acquire device monitoring information of a component and environmental monitoring information of the environment in which the component is located; a device risk level determination module is used to determine the device risk level for the component according to the degree of fluctuation of the monitoring parameter value in the device monitoring information; an environmental risk level determination module is used to determine the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information; a processing method determination module is used to determine a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the component; and a processing module is used to process the component according to the target processing method.

[0014] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0015] Obtain device monitoring information of components and environmental monitoring information of the environment in which the components are located; determine the device risk level for the components according to the degree of fluctuation of the monitoring parameter values ​​in the device monitoring information; determine the environmental risk level for the components according to the difference between the environmental monitoring information and the environmental standard information; determine a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the components; and process the components according to the target processing method. In a fourth aspect, the present application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, and when the computer program is executed by a processor, the following steps are implemented:

[0016] Obtain device monitoring information of components and environmental monitoring information of the environment in which the components are located; determine the device risk level for the components according to the degree of fluctuation of the monitoring parameter values ​​in the device monitoring information; determine the environmental risk level for the components according to the difference between the environmental monitoring information and the environmental standard information; determine a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the components; and process the components according to the target processing method. In a fifth aspect, the present application also provides a computer program product. The computer program product includes a computer program that implements the following steps when executed by a processor:

[0017] Obtain device monitoring information of components and environmental monitoring information of the environment in which the components are located; determine the device risk level for the components based on the degree of fluctuation of the monitoring parameter values ​​in the device monitoring information; determine the environmental risk level for the components based on the difference between the environmental monitoring information and the environmental standard information; determine a target processing method that matches the device risk level and the environmental risk level among a plurality of candidate processing methods corresponding to the components; and process the components according to the target processing method.

[0018] The above-mentioned component control method, device, computer equipment, storage medium and computer program product obtain the device monitoring information of the component and the environmental monitoring information of the environment where the component is located, determine the device risk level for the component according to the fluctuation degree of the monitoring parameter value in the device monitoring information, determine the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information, and determine the risk level in multiple dimensions, which is conducive to the subsequent determination of accurate target processing methods. Among the multiple candidate processing methods corresponding to the component, determine the target processing method that matches the device risk level and the environmental risk level. Using the above method, starting from the dimension of the component itself and the dimension of the environment, obtain comprehensive monitoring information, match the target processing method with the device risk level and the environmental risk level, and process the component according to the target processing method, avoiding repeated maintenance and improving maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 An application environment diagram of a component control method in an embodiment;

[0020] Figure 2 A schematic diagram of a flow chart of a component control method in an embodiment;

[0021] Figure 3 A schematic diagram of a process flow of a circuit breaker status early warning processing method in one embodiment;

[0022] Figure 4 is a structural block diagram of a component control device in an embodiment;

[0023] Figure 5 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] The component control method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown in FIG. 1 , the control terminal 102 communicates with the component 104.

[0026] The control terminal 102 obtains the device monitoring information of the component and the environmental monitoring information of the environment in which the component is located from the component 104. The control terminal 102 determines the device risk level for the component according to the degree of fluctuation of the monitoring parameter value in the device monitoring information. The control terminal 102 determines the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information. The control terminal 102 determines the target processing method that matches the device risk level and the environmental risk level from the multiple candidate processing methods corresponding to the component, and the control terminal 102 processes the component according to the target processing method.

[0027] The control terminal 102 may be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, IoT devices, and portable wearable devices. IoT devices may be smart speakers, smart TVs, smart air conditioners, smart vehicle-mounted devices, etc. Portable wearable devices may be smart watches, smart bracelets, head-mounted devices, etc. The control terminal 102 may also be a programmable logic controller PLC in an industrial environment, or other industrial control equipment. The components 104 may be devices with electrical signal processing capabilities in the power system, such as circuit breakers, contactors, or other switches.

[0028] In one embodiment, Figure 2 As shown, a component control method is provided, which is applied to Figure 1 The control terminal in is used as an example to illustrate, including:

[0029] S202, obtaining device monitoring information of the components and environmental monitoring information of the environment where the components are located.

[0030] Among them, components can be basic devices that constitute circuits in the electrical field, and components can also represent nodes in the power system, such as circuit breakers, contactors, or other devices with electrical control capabilities.

[0031] Device monitoring information refers to the monitoring results of the components themselves. Device monitoring information includes the monitoring results of the temperature, current, voltage and other dimensions of the components themselves. Device monitoring information also includes the location, number and node location of the components in the power system. This helps to locate abnormal components for subsequent operators and improve the efficiency of maintenance.

[0032] The environment represents the electrical environment where the component is located, for example, the electrical cabinet where the component is located, the factory area where the component is located, etc.

[0033] Environmental monitoring information refers to the monitoring results of the environment where the components are located. Environmental monitoring information includes environmental parameters such as temperature, light intensity, air visibility, and air humidity of the environment where the components are located. Since abnormalities in components may be accompanied by changes in the surrounding environment, and the surrounding environment may also affect whether the components are abnormal and the degree of abnormality, it is necessary to obtain environmental detection information.

[0034] Specifically, the control terminal obtains the device monitoring information from the component. The control terminal may also obtain the device monitoring information of the component from the server. In one embodiment, the component is an intelligent component, and the intelligent component collects the device monitoring information of the component in each preset period, and the control terminal obtains the device monitoring information from the intelligent component at a regular interval.

[0035] Specifically, the control terminal can obtain environmental monitoring information of the environment where the component is located from the component, or from other information collection devices. In one embodiment, the control terminal obtains environmental monitoring information of the environment where the component is located from an image collection device. The image collection device is oriented toward the environment where the component is located, and the image collection device is used to collect images of the environment where the component is located. The control terminal can perform image analysis on the image to obtain environmental monitoring information of the environment where the component is located.

[0036] S204: Determine a device risk level for the component according to the degree of fluctuation of the monitoring parameter value in the device monitoring information.

[0037] The monitoring parameter value represents the monitoring value of each monitoring dimension in the device monitoring information. For example, the current value, voltage value, and temperature value of the component itself. The monitoring parameter value is changeable in real time.

[0038] The fluctuation degree of the monitoring parameter value indicates the change of the monitoring parameter value in multiple monitoring periods. In other words, the fluctuation degree indicates the change of the monitoring parameter value over time. The fluctuation degree of the monitoring parameter value reflects the risk level of the component.

[0039] The device risk level indicates the risk degree of the component in the device dimension. The larger the device risk level, the higher the probability of risk existing in the component, the more risk types there are in the component, and the greater the economic loss caused by the component under the risk type.

[0040] The greater the fluctuation of the monitoring parameter value, the greater the device risk level of the component to a certain extent. For example, if the current of the component itself changes dramatically during the current period, it means that the component is very likely to be short-circuited and the device risk level is high.

[0041] Specifically, the control terminal may determine the device risk level for the component according to the degree of fluctuation of the current value and the temperature value in the device monitoring information.

[0042] In one embodiment, the control terminal may first determine the device current risk level for the component according to the current value in the device monitoring information, and when the device current risk level is higher than the preset current risk level, the control terminal may then determine the device temperature risk level for the component according to the temperature value in the device monitoring information. The control terminal may combine the device current risk level and the device temperature risk level to obtain the device risk level for the component.

[0043] In one of the embodiments, the control terminal may also determine the device temperature risk level as the device risk level for the component.

[0044] S206, determining the environmental risk level for the components according to the difference between the environmental monitoring information and the environmental standard information.

[0045] The environmental standard information refers to the environmental information of the steady-state environment where the components are located. The environmental standard information may include the environmental information of each environmental dimension. For example, the environmental standard information includes: environmental standard temperature, environmental standard humidity, environmental standard light intensity, environmental standard visibility, etc.

[0046] The difference between the environmental monitoring information and the environmental standard information can represent the difference between the parameter values ​​of the ambient light, ambient temperature and other dimensions of the environment where the component is located in the current period and the ambient standard temperature, ambient standard humidity, ambient standard light intensity, ambient standard visibility, etc. The larger the difference, the more likely the component is to be abnormal, or the more likely the environment is to cause the component to be abnormal.

[0047] For example, taking the environmental monitoring information as the ambient temperature and the environmental standard information as the ambient standard temperature of 25 degrees Celsius as an example, if the ambient temperature is 70 degrees Celsius, the temperature difference between the ambient temperature and the ambient standard temperature is large, and the environmental risk level is high. Conversely, if the ambient temperature is 30 degrees Celsius, it is considered that the environmental dimension is the normal temperature of the environment when the components are working normally, and the environmental risk level is low.

[0048] The environmental risk level indicates the degree of risk of components in the environmental dimension. The larger the environmental risk level, the higher the probability of risks in the environment where the components are located. It can also represent that there are more risk types in the environment where the components are located, and the greater the economic losses caused by the components under the risk types.

[0049] Specifically, the control terminal determines the environmental risk level for the components according to the differences between the various environmental monitoring information and the respective environmental standard information.

[0050] In one of the embodiments, the control terminal first determines the environmental visibility risk level for the components based on the difference between the environmental visibility and the environmental standard visibility. When the environmental visibility risk level exceeds the preset visibility risk level, the control terminal then determines the environmental risk level for the components based on the differences between the ambient temperature and ambient light and the environmental standard temperature and ambient standard light, respectively.

[0051] In one of the embodiments, the control terminal determines the ambient temperature risk level based on the difference between the ambient temperature and the ambient standard temperature, and the control terminal determines the ambient lighting risk level based on the difference between the ambient lighting and the ambient standard lighting. The control terminal combines the ambient temperature risk level and the ambient lighting level to determine the environmental risk level for the components.

[0052] S208, determining a target processing method that matches the risk level of the component and the environmental risk level among a plurality of candidate processing methods corresponding to the component.

[0053] Among them, the candidate processing methods represent the processing methods used for components. For example, when the component is a circuit breaker, the candidate processing methods may include: reducing the power at both ends of the circuit breaker, shutting down the circuit breaker, using a backup line, no risk and no processing required, fire extinguishing processing, etc.

[0054] The target treatment method indicates the treatment method used to address the device risk level and environmental risk level.

[0055] Specifically, the control terminal screens candidate processing methods according to the device risk level and the environmental risk level, and obtains a target processing method that matches the device risk level and the environmental risk level.

[0056] In one of the embodiments, the control terminal obtains multiple candidate processing methods from the component processing method library, comprehensively considers the component risk level and the environmental risk level, obtains the comprehensive risk level of the component, and screens the candidate processing methods according to the comprehensive risk level to obtain a target processing method that matches the component risk level and the environmental risk level.

[0057] S210, processing the components according to the target processing method.

[0058] Specifically, taking a circuit breaker as an example, the component is processed according to the target processing method, including: (1) the control terminal reduces the power at both ends of the circuit breaker; (2) the control terminal cuts off the current at both ends of the circuit breaker and uses a backup line to replace the original circuit breaker; (3) the control terminal determines that the circuit breaker is risk-free and does not process it; (4) the control terminal turns on the fire extinguishing device to extinguish the fire on the circuit breaker.

[0059] In the above-mentioned component control method, the device monitoring information of the component and the environmental monitoring information of the environment where the component is located are obtained. According to the fluctuation degree of the monitoring parameter value in the device monitoring information, the device risk level for the component is determined. According to the difference between the environmental monitoring information and the environmental standard information, the environmental risk level for the component is determined. Determining the risk level in multiple dimensions is conducive to the subsequent determination of accurate target processing methods. Among the multiple candidate processing methods corresponding to the component, determine the target processing method that matches the device risk level and the environmental risk level. Using the above method, starting from the dimension of the component itself and the dimension of the environment, obtain comprehensive monitoring information. The target processing method matches the device risk level and the environmental risk level. The components are processed according to the target processing method, which avoids repeated maintenance and improves maintenance efficiency.

[0060] In one embodiment, the environmental monitoring information includes: the smoke concentration, the ambient temperature and the ambient light intensity of the environment. According to the difference between the environmental monitoring information and the environmental standard information, the environmental risk level for the components is determined, including: obtaining environmental standard information; the environmental standard information includes: a smoke concentration threshold corresponding to the smoke concentration, an ambient temperature threshold corresponding to the ambient temperature, and an ambient light intensity threshold corresponding to the ambient light intensity. When the smoke concentration is greater than or equal to the smoke concentration threshold, the environmental risk level for the components is determined according to the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold.

[0061] The smoke concentration indicates the smoke concentration in the environment where the component is located, and the smoke concentration threshold indicates the smoke concentration threshold of the component in a steady-state environment. If the smoke concentration is greater than the smoke concentration threshold, it indicates that the component may be generating smoke.

[0062] The ambient light intensity indicates the light intensity of the environment where the component is located, and the ambient light intensity threshold indicates the light intensity threshold of the component in a steady-state environment. If the ambient light intensity is greater than the ambient light intensity threshold, it means that the component may be emitting light, for example, the component produces an open flame.

[0063] The ambient temperature indicates the temperature of the environment where the component is located. The ambient temperature threshold indicates the temperature threshold of the component in a steady-state environment. If the ambient temperature is greater than the ambient temperature threshold, it means that the component may be abnormally heated, for example, the component generates open flames or the component is short-circuited.

[0064] When the smoke concentration is greater than or equal to the smoke concentration threshold, it means that the component may generate smoke, and the environmental risk level of the component needs to be further determined.

[0065] Specifically, the control terminal determines the environmental risk level for the component according to the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold.

[0066] In one of the embodiments, the control terminal qualitatively determines the environmental risk type of the component based on the temperature difference and the light intensity difference, and the control terminal quantitatively determines the environmental risk level for the component based on the matching weights, temperature differences, and light intensity differences of the multiple environmental risk types.

[0067] In one of the implementations, the control terminal first determines a comparison result by comparing the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with the set thresholds. The control terminal determines the environmental risk type of the component based on the comparison result. The control terminal determines the environmental risk level of the component corresponding to the environmental risk type according to the environmental risk type, the temperature difference and the light intensity difference.

[0068] In this embodiment, the environmental monitoring information includes: the smoke concentration, ambient temperature and ambient light intensity of the environment, and the environmental standard information is obtained; the environmental standard information includes: the smoke concentration threshold corresponding to the smoke concentration, the ambient temperature threshold corresponding to the ambient temperature, and the ambient light intensity threshold corresponding to the ambient light intensity. When the smoke concentration is greater than or equal to the smoke concentration threshold, the environmental risk level for the components is determined based on the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold. The environmental risk level is quantitatively determined, which is conducive to the subsequent determination of accurate target processing methods and improves maintenance efficiency.

[0069] In one embodiment, the environmental risk level for components is determined based on the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold, including: comparing the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with set thresholds, respectively, to determine the comparison results, determine the environmental risk type of the component based on the comparison results, and determine the environmental risk level of the component corresponding to the environmental risk type according to the environmental risk type, as well as the temperature difference and the light intensity difference.

[0070] The set threshold value refers to a threshold value set for a temperature difference value and a light intensity difference value. More specifically, the set threshold value includes a temperature difference set threshold value set for a temperature difference value and a light difference set threshold value set for a light intensity difference value.

[0071] The comparison result represents the size relationship between the temperature difference value and the temperature difference setting threshold value, and the size relationship between the light intensity difference value and the light intensity setting threshold value.

[0072] The environmental risk type indicates the type of environmental risk that may occur to the components, for example, smoke risk type, open flame risk type, etc.

[0073] If the temperature difference in the comparison result is greater than the temperature difference setting threshold, and / or the light intensity difference is greater than the light difference setting threshold, the environmental risk type is considered to be an open flame risk type.

[0074] If the temperature difference in the comparison result is less than or equal to the temperature difference setting threshold, and the light intensity difference is less than or equal to the light difference setting threshold, then the environmental risk type is considered to be a smoke risk type.

[0075] Different environmental risk types correspond to different weights of the matching of the quantitative analysis. For example, the weight of the smoke risk type is smaller than that of the open fire risk type.

[0076] Specifically, the control terminal compares the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with the set thresholds, to determine the comparison result, and the control terminal determines the environmental risk type of the component based on the comparison result. The control terminal determines the environmental risk level of the component corresponding to the environmental risk type according to the environmental risk type, the weight of the environmental risk type matching, and the temperature difference and the light intensity difference.

[0077] In one of the embodiments, the control terminal performs weighted processing on the temperature difference and the light intensity difference according to the weight of the smoke risk type matching, or the weight of the open flame risk type matching, to obtain the environmental risk level of the component corresponding to the environmental risk type.

[0078] In one of the embodiments, the control terminal determines the smoke risk type for the component when the temperature difference and the light intensity difference are both less than zero, and the control terminal determines the open flame risk type for the component when either the temperature difference or the light intensity difference is greater than zero.

[0079] In this embodiment, the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold are respectively compared with the set threshold to determine the comparison result, and the environmental risk type of the component is determined according to the comparison result. According to the environmental risk type, the temperature difference and the light intensity difference, the environmental risk level of the component corresponding to the environmental risk type is determined, and the temperature difference and the light intensity difference are weighted according to the weight matching the environmental risk type to obtain an accurate environmental risk level. The environmental risk level is quantitatively determined, which is conducive to the subsequent determination of an accurate target processing method and improves maintenance efficiency.

[0080] In one embodiment, the monitoring parameter value includes the device temperature of the component, and the device risk level for the component is determined according to the fluctuation degree of the monitoring parameter value in the device monitoring information, including: determining the temperature threshold range of the component according to the device model of the component, determining the fluctuation degree of the device temperature according to the difference between the device temperature in a current time period and the device temperature in multiple time periods in the device monitoring information, and determining the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range.

[0081] The device model number may represent a unique identification number of a component. Different components have different tolerances to temperature. In other words, different components have different normal operating temperature ranges.

[0082] The temperature threshold range represents the set of the normal working temperature range and abnormal working range of the component. Generally speaking, the temperature threshold range includes a first temperature threshold and a second temperature threshold. The first temperature threshold is less than the second temperature threshold.

[0083] The device temperature refers to the temperature of the component itself. The device temperature can be the internal temperature of the component or the surface temperature of the component.

[0084] The device temperature in the current period indicates the device temperature in the current monitoring period.

[0085] The device temperatures in multiple time periods may represent the device temperatures in multiple non-overlapping time periods before the current time period, for example, the device temperature of the component the day before yesterday and the device temperature yesterday.

[0086] The difference between the device temperature in the current period and the device temperature in multiple periods can be expressed as the dispersion coefficient The coefficient of dispersion represents the standard deviation of the device temperature in each time period (including the current time period and multiple time periods). , and the average value of the device temperature in each time period (including the current time period and multiple time periods) Ratio , that is, the degree of fluctuation of device temperature.

[0087] When the fluctuation degree is less than the first temperature threshold, the device risk level for the component is determined to be a safety level.

[0088] When the fluctuation degree is greater than or equal to the first temperature threshold and less than the second temperature threshold, it is determined that the device risk level for the component is the first warning level.

[0089] When the fluctuation degree is greater than or equal to the second temperature threshold, the device risk level for the component is determined to be the second warning level. The safety level is less than the first warning level and less than the second warning level.

[0090] Specifically, the control terminal determines the temperature threshold range of the component according to the device model of the component, determines the degree of fluctuation of the device temperature according to the difference between the device temperature in the current time period and the device temperature in multiple time periods in the device monitoring information, and determines the device risk level for the component according to the difference between the degree of fluctuation and the temperature threshold range.

[0091] In one embodiment, the control terminal quantitatively determines the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range. The greater the difference, the greater the device risk level of the component.

[0092] In one embodiment, the monitoring parameter value also includes the device current of the component, and the device current represents the current value flowing through the component. The control terminal determines the current threshold range of the component according to the device model of the component, determines the fluctuation degree of the device current according to the difference between the device current in the current period and the device current in multiple periods in the device monitoring information, and determines the device risk level for the component according to the difference between the fluctuation degree and the current threshold range.

[0093] In this embodiment, the monitoring parameter value includes the device temperature of the component. According to the device model of the component, the temperature threshold range of the component is determined. According to the difference between the device temperature in the current time period and the device temperature in multiple time periods in the device monitoring information, the degree of fluctuation of the device temperature is determined. According to the difference between the degree of fluctuation and the temperature threshold range, the device risk level for the component is determined, and an accurate device risk level is obtained. The device risk level is quantitatively determined, which is conducive to the subsequent determination of an accurate target processing method and improves maintenance efficiency.

[0094] In one embodiment, a device risk level for a component is determined according to a difference between a fluctuation degree and a temperature threshold range, including: determining a device risk type for the component according to a difference between a fluctuation degree and a temperature threshold range, and determining a device risk level for the component corresponding to the device risk type according to the device risk type and the fluctuation degree.

[0095] The device risk types include a safety type, a first risk type, and a second risk type.

[0096] When the fluctuation degree is less than the first temperature threshold, the device risk type for the component is determined to be a safety type. When the fluctuation degree is greater than or equal to the first temperature threshold and less than the second temperature threshold, the device risk type for the component is determined to be a first-level risk type. When the fluctuation degree is greater than or equal to the second temperature threshold, the device risk type for the component is determined to be a second-level risk type.

[0097] Different device risk types correspond to different weights, and the weight of the second risk type is greater than the weight of the first risk type, which is greater than the weight of the safety type.

[0098] Specifically, the control terminal determines the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range, and determines the device risk level of the component corresponding to the device risk type according to the device risk type and the fluctuation degree.

[0099] In one of the embodiments, the control terminal determines the device risk level of the component corresponding to the device risk type according to the device risk type, the weight corresponding to the risk type, and the degree of fluctuation.

[0100] In this embodiment, the control terminal determines the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range, and determines the device risk level of the component corresponding to the device risk type according to the device risk type and the fluctuation degree, so as to obtain an accurate device risk level and quantitatively determine the device risk level, which is beneficial to the subsequent determination of the accurate target processing method and improves the maintenance efficiency.

[0101] In one embodiment, among multiple candidate processing methods corresponding to components, a target processing method that matches the device risk level and the environmental risk level is determined, including: obtaining multiple candidate processing methods in a component processing method library, comprehensively considering the device risk level and the environmental risk level to obtain the comprehensive risk level of the component, and screening each candidate processing method according to the comprehensive risk level to obtain a target processing method that matches the device risk level and the environmental risk level.

[0102] The component processing method library may include processing methods in historical processing records of the components.

[0103] The comprehensive risk level can represent the risk level of components including device dimension and environmental dimension.

[0104] The device risk level includes the safety level, the first warning level, and the second warning level. The environmental risk level includes the safety level, the first processing level, and the second processing level. It should be noted that both the device risk level and the environmental risk level are quantitative results. For example, a device risk level of 30 points belongs to the safety level, and a device risk level of 60 points belongs to the first warning level.

[0105] The comprehensive device risk level and environmental risk level may be determined by averaging the scores corresponding to the device risk level and the environmental risk level to obtain an average score, and then determining the comprehensive risk level corresponding to the average score.

[0106] The risk level ranges corresponding to the candidate processing methods are different. For example, the risk level score corresponding to the candidate processing method of reducing the power at both ends of the circuit breaker can be 40~60 points, and the risk level score corresponding to the candidate processing method of closing the circuit breaker and using a backup line can be 61~80 points.

[0107] Specifically, the control terminal obtains multiple candidate processing methods in the component processing method library, comprehensively considers the component risk level and the environmental risk level, obtains the comprehensive risk level of the component, and screens the candidate processing methods according to the comprehensive risk level to obtain the target processing method that matches the component risk level and the environmental risk level.

[0108] In one of the embodiments, the control terminal integrates the scores of the component risk level and the environmental risk level to obtain the comprehensive risk level of the component corresponding to the average score, and screens each candidate processing method according to the comprehensive risk level to obtain a target processing method that matches the component risk level and the environmental risk level.

[0109] In this embodiment, multiple candidate processing methods are obtained from the component processing method library, and the device risk level and the environmental risk level are comprehensively considered to obtain the comprehensive risk level of the component. According to the comprehensive risk level, the candidate processing methods are screened to obtain a target processing method that matches the device risk level and the environmental risk level. The accurate target processing method is determined, which is beneficial for subsequent processing of the components according to the target processing method, avoiding repeated maintenance and improving maintenance efficiency.

[0110] In one embodiment, Figure 3 As shown, a circuit breaker status early warning processing method is provided, comprising:

[0111] S302, obtaining device monitoring information of the components and environmental monitoring information of the environment where the components are located.

[0112] The component may be a circuit breaker.

[0113] Exemplarily, the circuit breaker number and location information may also be obtained.

[0114] Specifically, the current sensor is used to collect current data passing through the circuit breaker, the first temperature sensor is used to collect temperature data of the circuit breaker, the smoke sensor is used to collect smoke concentration data near the circuit breaker, the second temperature sensor is used to collect air temperature data, and the photoelectric sensor is used to collect light intensity data.

[0115] S304: Determine the device risk level for the component according to the fluctuation degree of the monitoring parameter value in the device monitoring information.

[0116] Among them, environmental monitoring information includes: environmental smoke concentration, ambient temperature and ambient light intensity

[0117] S306, obtaining environmental standard information.

[0118] The environmental standard information includes: a smoke density threshold corresponding to the smoke density, an ambient temperature threshold corresponding to the ambient temperature, and an ambient light intensity threshold corresponding to the ambient light intensity.

[0119] For example, taking the components as circuit breakers, and the smoke concentration, air temperature, and optical information (light intensity) of the environment where the circuit breaker is located as an example, the early warning process of the circuit breaker is described:

[0120] Step 1: Compare the smoke concentration with the preset smoke concentration safety threshold:

[0121] Step 2: If the smoke concentration is lower than the smoke concentration safety threshold, it indicates that there is no fire risk and there is no need to process the air temperature information and optical information;

[0122] Step 3: If the smoke concentration is higher than the smoke concentration safety threshold, extract the air temperature data and light intensity data for processing, and compare the air temperature data and light intensity data with the air temperature safety threshold and light intensity safety threshold:

[0123] Step 4: If the air temperature data and the light intensity data are both lower than the safety threshold, a primary processing signal is generated and sent to the control module for primary processing;

[0124] Step 5: If any of the air temperature data and the light intensity data is higher than the safety threshold, a secondary processing signal is generated and sent to the control module for secondary processing.

[0125] A secondary processing signal is generated based on the smoke concentration, air temperature data or light intensity data. The secondary processing signal indicates that the situation is serious and the circuit breaker is burning.

[0126] The first-level warning processing and the second-level warning processing are cooling processing. The first-level warning processing is to reduce the power at both ends of the circuit breaker. When the temperature dispersion coefficient of the temperature data of the circuit breaker is less than the minimum value of the dispersion coefficient range, it will automatically restore and reduce the power at both ends of the circuit breaker. The second-level warning processing is to shut down the circuit breaker and use the backup line. The first-level processing is to reduce the power at both ends of the circuit breaker and generate the first-level maintenance information to send to the operation and maintenance personnel. The second-level processing is to extinguish the fire at the fire site and generate the second-level maintenance information to send to the operation and maintenance personnel.

[0127] After counting the number of first-level warning processing and second-level warning processing, it is compared with the preset number threshold. When the number of first-level processing exceeds the first threshold, the first-level maintenance information is generated and sent to the operation and maintenance personnel. When the number of second-level processing exceeds the second threshold, the second-level warning signal is generated and sent to the operation and maintenance personnel.

[0128] S308, when the smoke concentration is greater than or equal to the smoke concentration threshold, the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold are compared with the set thresholds to determine the comparison result.

[0129] S310, determining the environmental risk type of the component according to the comparison result.

[0130] S312, determining a temperature threshold range of the component according to the component model.

[0131] The monitored parameter values ​​include device temperatures of components.

[0132] S314, determining the degree of fluctuation of the device temperature according to the difference between the device temperature in the current time period and the device temperatures in multiple time periods in the device monitoring information.

[0133] For example, taking the circuit breaker as the component and the current of the circuit breaker as the monitored object, the operation time period of the circuit breaker is evenly divided into multiple monitoring time periods, and the current average value μ and standard deviation σ of the current data passing through the circuit breaker in each monitoring time period are calculated, and the dispersion coefficient reflecting the degree of data fluctuation is calculated by the average value μ and standard deviation σ , the coefficient of dispersion Compare with the current dispersion coefficient threshold set in the data processing module: If the current dispersion coefficient is less than the threshold value, a normal circuit signal is generated, indicating that the circuit breaker is working normally and there is no abnormal current data passing through the circuit breaker, and there is no need to process the temperature data; If the current is greater than or equal to the current dispersion coefficient threshold, a circuit abnormality signal is generated, indicating that the circuit breaker is operating abnormally.

[0134] Taking the temperature of a circuit breaker as an example, the temperature data of the circuit breaker in the monitoring period corresponding to the abnormal current data passing through the circuit breaker is extracted, and the temperature dispersion coefficient of the monitoring period is calculated. ,Will Compare with the set discrete coefficient range: If is less than the minimum value of the discrete coefficient range, a safety signal is generated; if If the value is within the range of the discrete coefficient, a first-level warning signal is generated; if If the value is greater than the maximum value of the discrete coefficient range, a secondary warning signal is generated.

[0135] If the circuit breaker displays the first or second warning signal multiple times, it means that the circuit breaker is not in good condition for normal operation and needs to be replaced. The circuit breaker failure can be handled in advance, and the circuit breaker that needs to be replaced can be found without large-scale inspection and troubleshooting.

[0136] S316: Determine the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range.

[0137] S318, determining the device risk level of the component corresponding to the device risk type according to the device risk type and the degree of fluctuation.

[0138] S320, obtaining multiple candidate processing methods from a component processing method library.

[0139] S322, comprehensively analyzing the device risk level and the environmental risk level to obtain the comprehensive risk level of the component.

[0140] S324, screening each candidate processing method according to the comprehensive risk level, and obtaining a target processing method that matches the device risk level and the environmental risk level.

[0141] S326, processing the components according to the target processing method.

[0142] In this embodiment, the device monitoring information of the components and the environmental monitoring information of the environment in which the components are located are obtained. According to the fluctuation degree of the monitoring parameter value in the device monitoring information, the device risk level for the components is determined. According to the difference between the environmental monitoring information and the environmental standard information, the environmental risk level for the components is determined. Determining the risk level in multiple dimensions is conducive to the subsequent determination of accurate target processing methods. Among the multiple candidate processing methods corresponding to the components, the target processing method that matches the device risk level and the environmental risk level is determined. The above method is used to obtain comprehensive monitoring information from the dimensions of the components themselves and the dimensions of the environment in which they are located. The target processing method is matched with the device risk level and the environmental risk level. The components are processed according to the target processing method, which avoids repeated maintenance and improves maintenance efficiency. The method can judge the heating state of the circuit breaker, whether the outer shell of the circuit breaker is burnt, and whether there is an open flame by monitoring the current data of the circuit breaker, the temperature data of the circuit breaker, the smoke concentration data near the circuit breaker, the air temperature data and the light intensity data passing through the circuit breaker, the temperature data of the circuit breaker, the smoke concentration data near the circuit breaker, the air temperature data and the light intensity data, and can also realize online monitoring and alarm, judge the working state of the circuit breaker, locate the faulty components, provide a reliable basis for the staff, and greatly shorten the power outage time.

[0143] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0144] Based on the same inventive concept, the embodiment of the present application also provides a component control device for implementing the component control method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more component control device embodiments provided below can refer to the limitations of the component control method above, and will not be repeated here.

[0145] In one embodiment, Figure 4 As shown, a component control device is provided, including: an acquisition module 402, a component risk level determination module 404, an environmental risk level determination module 406, a processing method determination module 408 and a processing module 410, wherein:

[0146] An acquisition module 402 is used to acquire device monitoring information of components and environmental monitoring information of the environment where the components are located;

[0147] The device risk level determination module 404 is used to determine the device risk level for the component according to the fluctuation degree of the monitoring parameter value in the device monitoring information;

[0148] An environmental risk level determination module 406 is used to determine the environmental risk level for components based on the difference between the environmental monitoring information and the environmental standard information;

[0149] A processing method determination module 408 is used to determine a target processing method that matches the device risk level and the environmental risk level among multiple candidate processing methods corresponding to the component;

[0150] The processing module 410 is used to process the components according to the target processing method.

[0151] In one of the embodiments, the environmental monitoring information includes: the smoke concentration, ambient temperature and ambient light intensity of the environment; the environmental risk level determination module 406 is also used to obtain environmental standard information; the environmental standard information includes: the smoke concentration threshold corresponding to the smoke concentration, the ambient temperature threshold corresponding to the ambient temperature, and the ambient light intensity threshold corresponding to the ambient light intensity; when the smoke concentration is greater than or equal to the smoke concentration threshold, the environmental risk level for the component is determined based on the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold.

[0152] In one of the embodiments, the environmental risk level determination module 406 is further used to compare the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with the set thresholds, respectively, to determine the comparison results; determine the environmental risk type of the component based on the comparison results; and determine the environmental risk level of the component corresponding to the environmental risk type according to the environmental risk type, as well as the temperature difference and the light intensity difference.

[0153] In one of the embodiments, the monitoring parameter value includes the device temperature of the component; the device risk level determination module 404 is further used to determine the temperature threshold range of the component according to the device model of the component; determine the degree of fluctuation of the device temperature according to the difference between the device temperature in the current time period and the device temperature in multiple time periods in the device monitoring information; determine the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range.

[0154] In one of the embodiments, the device risk level determination module 404 is further used to determine the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range; and determine the device risk level of the component corresponding to the device risk type according to the device risk type and the fluctuation degree.

[0155] In one of the embodiments, the processing method determination module 408 is also used to obtain multiple candidate processing methods in the processing method library of components; comprehensively consider the component risk level and the environmental risk level to obtain the comprehensive risk level of the component; and screen each candidate processing method according to the comprehensive risk level to obtain a target processing method that matches the component risk level and the environmental risk level.

[0156] Each module in the above-mentioned component control device can be implemented in whole or in part by software, hardware or a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0157] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 5 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store device monitoring information data and environmental monitoring information data. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a component control method is implemented.

[0158] Those skilled in the art will understand that Figure 5 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0159] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0160] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0161] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0162] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0163] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0164] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A component control method, characterized in that: The method comprises: Obtaining device monitoring information of components and environmental monitoring information of the environment where the components are located; Determining a device risk level for the component according to a degree of fluctuation of a monitoring parameter value in the device monitoring information; Determining the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information; Determine, among a plurality of candidate processing methods corresponding to the component, a target processing method that matches the risk level of the component and the risk level of the environment; The components are processed according to the target processing method.

2. The method according to claim 1, characterized in that The environmental monitoring information includes: the smoke concentration, ambient temperature and ambient light intensity of the environment; Determining the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information includes: Acquire environmental standard information; the environmental standard information includes: a smoke concentration threshold corresponding to the smoke concentration, an ambient temperature threshold corresponding to the ambient temperature, and an ambient light intensity threshold corresponding to the ambient light intensity; When the smoke concentration is greater than or equal to the smoke concentration threshold, the environmental risk level for the component is determined according to the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold.

3. The method according to claim 2, characterized in that The determining of the environmental risk level for the component according to the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold, comprises: Compare the temperature difference between the ambient temperature and the ambient temperature threshold, and the light intensity difference between the ambient light intensity and the ambient light intensity threshold with the set thresholds, respectively, to determine a comparison result; Determining the environmental risk type of the component according to the comparison result; According to the environmental risk type, the temperature difference and the light intensity difference, the environmental risk level of the component corresponding to the environmental risk type is determined.

4. The method according to claim 1, characterized in that: The monitoring parameter value includes the device temperature of the component; Determining the device risk level for the component according to the fluctuation degree of the monitoring parameter value in the device monitoring information includes: Determining a temperature threshold range of the component according to the component model; Determining the degree of fluctuation of the device temperature according to the difference between the device temperature in the current time period and the device temperature in multiple time periods in the device monitoring information; The device risk level for the component is determined according to the difference between the fluctuation degree and the temperature threshold range.

5. The method according to claim 4, characterized in that The determining the device risk level for the component according to the difference between the fluctuation degree and the temperature threshold range includes: Determining the device risk type for the component according to the difference between the fluctuation degree and the temperature threshold range; According to the device risk type and the fluctuation degree, a device risk level of the component corresponding to the device risk type is determined.

6. The method according to claim 1, characterized in that Determining a target processing method that matches the risk level of the device and the risk level of the environment from among the multiple candidate processing methods corresponding to the component includes: Acquire multiple candidate processing methods from a processing method library of the component; Combining the device risk level and the environmental risk level to obtain a comprehensive risk level of the component; According to the comprehensive risk level, each of the candidate processing methods is screened to obtain a target processing method that matches the device risk level and the environmental risk level.

7. A component control device, characterized in that: The device comprises: An acquisition module, used to acquire device monitoring information of components and environmental monitoring information of the environment where the components are located; A device risk level determination module, used to determine the device risk level for the component according to the fluctuation degree of the monitoring parameter value in the device monitoring information; An environmental risk level determination module, used to determine the environmental risk level for the component according to the difference between the environmental monitoring information and the environmental standard information; A processing method determination module, used to determine a target processing method that matches the risk level of the device and the risk level of the environment among a plurality of candidate processing methods corresponding to the component; A processing module is used to process the components according to the target processing method.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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