Substrate wet processing device, processing equipment and processing method

Abstract

The invention provides a substrate wet processing device which comprises a first processing unit and a second processing unit, the first processing unit and the second processing unit are used for processing a substrate, the first processing unit and the second processing unit are communicated through a transfer chamber, a grabbing mechanism is arranged in the transfer chamber, and the grabbing mechanism is used for grabbing the substrate. The substrate processed by the first processing unit is transferred into a second processing unit through the transfer chamber by the manipulator; an opening and closing device is arranged between the first treatment unit and the transfer chamber, and an opening and closing device is arranged between the second treatment unit and the transfer chamber; wherein the distance between the first processing unit and the second processing unit is smaller than a first preset threshold value. The transfer chamber is arranged between the first processing unit and the second processing unit, the substrate is transferred between the first processing unit and the second processing unit in the transfer chamber, and the possibility that the substrate is polluted in the transfer process is reduced.

Description

[0001] Description of claiming priority: This application claims priority based on the patent application filed in China on June 26, 2024 with application number 2024108387073 and patent name “A substrate wet processing device, processing equipment and processing method”. Technical Field

[0002] The present application relates to the field of wafer manufacturing technology, and in particular to a substrate wet processing device, processing equipment and processing method. Background Art

[0003] Generally, semiconductor devices are manufactured from substrates such as wafers with fine circuit patterns formed on their surfaces. During the manufacturing process of the substrates, the surfaces of the substrates may be contaminated by various foreign matter, so the substrates are cleaned to remove the foreign matter. The cleaning process usually includes three main steps: a chemical treatment step to remove contaminants, a rinsing step to eliminate chemical residues, and a drying step to remove moisture from the substrate.

[0004] Taking the scrubbing equipment after single-wafer chemical mechanical polishing (CMP) as an example, the wafer will be processed in the scrubbing unit and the cleaning equipment in the single-wafer scrubbing equipment in turn, and the transfer of the wafer between the scrubbing unit and the cleaning equipment is generally achieved by a robot. Since the cleanliness level of the environment in the scrubbing equipment is usually lower than that in a single processing unit, contaminants are easily adhered to the surface of the wafer during the transfer process. As the semiconductor manufacturing process reaches below 28nm, the control of contaminants during wafer transfer is becoming more and more stringent. Summary of the invention

[0005] In view of this, the embodiment of the present application provides a substrate wet processing device to solve at least one problem existing in the background technology, including a first processing unit and a second processing unit, the first processing unit and the second processing unit are used to process a substrate, the first processing unit and the second processing unit are connected through a transfer chamber, a gripping mechanism is arranged in the transfer chamber, the gripping mechanism is used to transfer the substrate processed by the first processing unit to the second processing unit via the transfer chamber, the gripping mechanism is provided with a gripping part for gripping the wafer, and an opening and closing device is arranged between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber; The first processing unit, the transfer chamber and the second processing unit are arranged along a first preset direction, the distance between the first processing unit and the second processing unit is equal to a first preset threshold, the first preset threshold is smaller than the diameter of the substrate and the first preset threshold is greater than the width value of the gripping mechanism.

[0006] Optionally, the transfer chamber is provided with a drainage mechanism, and the drainage mechanism is used to discharge the liquid remaining in the transfer chamber.

[0007] Optionally, the transfer chamber is provided with a cleaning mechanism for cleaning the gripping mechanism.

[0008] Optionally, the second processing unit is provided with a material unloading window.

[0009] Optionally, the transfer chamber is provided with a gas supply and exhaust assembly.

[0010] Optionally, a liquid leakage tray is provided below the gripping mechanism, and the liquid leakage tray moves along with the gripping mechanism during the process of the gripping mechanism transferring the substrate.

[0011] A substrate wet processing device comprises the above-mentioned substrate cleaning device.

[0012] The present application also provides a substrate wet processing method, which is applied to the above-mentioned substrate cleaning device, and comprises the following steps: Step S1, sending the substrate into a first processing unit, and the first processing unit processes the substrate; Step S2, the gripping part moves from the transfer chamber to the first processing unit, the gripping part transfers the substrate processed in the first processing unit to the second processing unit through the transfer chamber, and the gripping part moves from the second processing unit to the transfer chamber; Step S3, processing the substrate in the second processing unit.

[0013] Optionally, in step S2, after the substrate enters the transfer chamber and completely leaves the first processing unit, the opening and closing device between the first processing unit and the transfer chamber is closed, and another substrate is sent to the first processing unit for processing.

[0014] Optionally, the method further includes step S4, wherein the gripping portion moves to the transfer chamber, and the opening and closing devices between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber are closed, and the gripping mechanism is cleaned and dried by the cleaning mechanism.

[0015] The beneficial effects of this application are: In the present application, a transfer chamber is set between the first processing unit and the second processing unit, and the substrate is transferred between the first processing unit and the second processing unit in the transfer chamber. Compared with the space in the equipment, the space of the transfer chamber is smaller. Therefore, the cost of maintaining the cleanliness of the environment in the transfer chamber is lower. Furthermore, by reducing the width of the transfer chamber, the operation efficiency of the wafer between the first processing unit and the second processing unit is improved.

[0016] In the device of the present invention, the grabbing mechanism is arranged in the transfer chamber, and a cleaning mechanism is arranged in the transfer chamber. After the grabbing mechanism has been running for a period of time, some pollutants are accumulated on the surface of the grabbing mechanism. Cleaning the grabbing mechanism in the transfer chamber can reduce the contamination of the substrate caused by the unclean grabbing mechanism.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A schematic structural diagram of a substrate processing device involved in an embodiment of the present application; Figure 2 This is a schematic structural diagram of a substrate wet processing device involved in an embodiment of the present application; Figure 3 This is a schematic diagram of a transfer chamber structure involved in an embodiment of the present application; in: 100 loading unit, 200 substrate wet processing device, 210 scrubbing unit, 220 cleaning unit, 230 drying unit, 240 first processing unit, 250 second processing unit, 260 transfer chamber, 2601 drainage mechanism, 2602 leakage tray, 2603 gas supply and exhaust assembly, 2604 cleaning mechanism, 270 grabbing mechanism, 280 opening and closing device, 300 grabbing mechanism, 400 unloading unit W substrate DETAILED DESCRIPTION

[0019] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.

[0020] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0021] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0022] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has the first element, component, region, layer or part.

[0023] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0024] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0025] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0026] The present invention provides a substrate wet processing device: like Figure 1 As shown, a substrate wet processing equipment includes a loading unit 100 , a substrate wet processing device 200 , a gripping mechanism 300 , a control unit and a unloading unit 400 .

[0027] In this embodiment, the substrate wet processing device is composed of a plurality of processing units. Any two processing units performing adjacent processing on the same substrate are connected through a transfer chamber. During the transfer of the substrate between two adjacent processing units, the substrate is isolated from the external environment through the transfer chamber.

[0028] It is understandable that as the semiconductor process technology develops to 28nm or even below 28nm, the cleanliness requirements of the substrate during the cleaning process are getting higher and higher. During the substrate transportation process, the contamination of the substrate by the internal environment of the equipment also needs to be strictly controlled. Compared with the internal space of the processing unit, the internal space of the equipment is larger. Therefore, if the cleanliness level of the internal space environment of the equipment is to be maintained at the same level as the cleanliness level of the internal space environment of the processing unit, a lot of cost will be required.

[0029] By arranging a transfer chamber between two adjacent processing units, the transfer chamber is used to provide a relatively clean environment for the substrate. At the same time, the transfer chamber has a small volume, so the cost of maintaining the cleanliness of the interior can be greatly reduced.

[0030] In the above embodiment, the processing unit includes a scrubbing unit 210 , a cleaning unit 220 and a drying unit 230 .

[0031] In this embodiment, the substrate after chemical mechanical polishing is sent into the substrate wet processing device through the loading unit, and is processed in the scrubbing unit, the cleaning unit and the drying unit in sequence. The scrubbing unit scrubs the pollutants adhering to the surface of the substrate with a cleaning brush; the cleaning unit further cleans the substrate by cleaning liquid cleaning, megasonic cleaning, two-fluid cleaning and the like; the drying unit dries the surface of the substrate by gas purging, IPA drying, supercritical fluid drying and the like.

[0032] like Figure 2 and Figure 3 As shown, in another optional embodiment, the substrate wet processing device includes a first processing unit 240 and a second processing unit 250, the first processing unit and the second processing unit are used to process substrates, the first processing unit and the second processing unit are connected through the transfer chamber 260, the transfer chamber is provided with a gripping mechanism 270, and the substrate processed by the first processing unit is transferred to the second processing unit through the transfer chamber through the gripping mechanism; an opening and closing device 280 is provided between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber; The first processing unit, the transfer chamber and the second processing unit are arranged along a first preset direction, and a distance between the first processing unit and the second processing unit is less than a first preset threshold.

[0033] In this embodiment, the first processing unit and the second processing unit are two independent processing chambers. When the substrate is processed inside, the opening and closing device located on the side wall remains in a closed state, and a closed processing space is formed inside the processing chamber. When the opening and closing device is opened, a channel for transferring the substrate is formed by the transfer chamber between the two processing units, and the substrate is grabbed and driven to be transferred in the transfer chamber through the grabbing part of the grabbing mechanism.

[0034] It can be understood that the first processing unit, the transfer chamber and the second processing unit are arranged in a straight line, and the geometric centers of the three are on the same straight line, so the distance between the first processing unit and the second processing unit is the length of the transfer chamber, and the length of the transfer chamber determines the space inside the transfer chamber and the span that the robot needs to transfer the substrate. By limiting the length of the transfer chamber, it is ensured that the robot can stably transfer the substrate in the transfer chamber, while reducing the gas volume in the transfer chamber, which is conducive to improving the cleanliness of the environment in the transfer chamber.

[0035] In an optional embodiment, the opening and closing device is an opening and closing door, and the opening and closing of the opening and closing door is controlled by a control unit.

[0036] In an optional embodiment, the first preset threshold is between one time the diameter of the substrate and two times the diameter of the substrate.

[0037] During the transfer of substrates between the first processing unit and the second processing unit, if there are still substrates being processed in the second processing unit, the substrates can be temporarily stored in the transfer chamber and placed in the second processing unit after the basic processing in the second processing unit is completed.

[0038] In another optional embodiment, the first preset threshold is smaller than the diameter of the substrate and the first preset threshold is larger than the width of the robot.

[0039] Compared with the previous embodiment, the length of the transfer chamber in this embodiment is shorter, and the shorter length is conducive to further reducing the space in the cache chamber, thereby reducing the cost of maintaining the cleanliness of the transfer chamber. Furthermore, by shortening the length of the transfer chamber, the time required for transferring the substrate from the first processing chamber to the second processing chamber is reduced, thereby improving the processing efficiency of the entire chamber.

[0040] In an optional embodiment, the transfer chamber is provided with a drainage mechanism 2601, and the drainage mechanism is used to discharge the liquid remaining in the transfer chamber.

[0041] It is understandable that after the substrate is processed in the first processing unit, the surface of the substrate remains wet. When the substrate is transferred in the transfer unit, the liquid remaining on the surface of the substrate drips onto the surface of the transfer chamber, thereby causing contamination of the transfer chamber. The liquid in the transfer chamber is immediately discharged by the liquid discharge mechanism provided at the bottom of the transfer chamber, thereby avoiding the accumulation of liquid in the transfer chamber and ensuring the cleanliness of the environment in the transfer chamber.

[0042] In an optional embodiment, the bottom of the transfer chamber is tilted, and the tilted structure is conducive to the discharge of liquid in the transfer chamber.

[0043] In an optional embodiment, the inclination angle of the bottom of the transfer chamber is between 3-15°.

[0044] In an optional embodiment, a leakage tray 2602 is provided below the gripping mechanism, and the leakage tray moves along with the gripping mechanism during the process of the gripping mechanism transferring the substrate.

[0045] It can be understood that during the transfer of the substrate between the first processing unit and the second processing unit, the liquid remaining on the surface of the substrate may fall off. The leakage plate moves synchronously with the robot arm so that the leakage plate is always under the substrate during the transfer process to prevent the liquid from dripping into the transfer chamber.

[0046] In an optional embodiment, the transfer chamber is provided with a gas supply and exhaust assembly 2603 .

[0047] The gas supply and exhaust assembly includes a gas supply assembly, through which clean air is introduced into the transfer chamber, the fluidity of the gas in the transfer chamber is improved, and the exhaust of the gas containing pollutants in the transfer chamber is accelerated. Furthermore, the air inlet of the gas supply assembly is arranged at the top of the transfer chamber, and the gas introduced into the transfer chamber flows from top to bottom in the transfer chamber, thereby avoiding the accumulation of pollutants in the transfer chamber.

[0048] In an optional embodiment, the transfer chamber is provided with a cleaning mechanism 2604 for cleaning the gripping mechanism.

[0049] It is understandable that during the use of the gripping mechanism, contaminants will adhere to the surface of the gripping mechanism. When the gripping mechanism contacts the substrate, the contaminants on the gripping mechanism are easily attached to the substrate, causing contamination to the substrate. By arranging a cleaning mechanism in the transfer chamber and cleaning the gripping mechanism through the cleaning mechanism, the gripping mechanism can maintain a clean and dry state when gripping the substrate, thereby reducing the contamination of the substrate by the gripping mechanism.

[0050] Furthermore, the cleaning mechanism is arranged in the transfer chamber, and the grabbing mechanism in the transfer chamber is only responsible for transferring the substrate from the first processing unit to the second processing unit. When the substrate does not need to be transferred, the grabbing mechanism is located in the transfer chamber, and the robot arm on standby in the transfer chamber is cleaned, which will not affect the efficiency of processing substrates of the entire device.

[0051] Furthermore, the cleaning mechanism can clean the inner wall of the transfer chamber simultaneously while cleaning the gripping mechanism, thereby further improving the cleanliness of the transfer chamber.

[0052] In an optional embodiment, the cleaning mechanism includes a spray assembly and a gas purge assembly, wherein the spray assembly is used to spray cleaning liquid onto the gripping mechanism, and the gas purge assembly is used to remove the cleaning liquid remaining on the surface of the gripping mechanism to keep the surface dry. Those skilled in the art can select the type of the spray assembly and the gas purge assembly according to actual conditions, as long as the above-mentioned effects can be achieved, and the structures of the spray assembly and the gas purge assembly are not specifically limited here.

[0053] In an optional embodiment, the second processing unit is provided with a material unloading window.

[0054] The substrate processed by the second processing unit is sent into the unloading station through the unloading window by an external action mechanism. The unloading station is directly connected to the second processing unit to avoid secondary contamination of the processed substrate.

[0055] The present application also provides a substrate wet processing method, comprising the following steps: Step S1, sending the substrate into a first processing unit, and the first processing unit processes the substrate; In this step, the substrate is transferred to the first processing unit by an external robot. At this time, the opening and closing device between the first processing unit and the transfer chamber is in a closed state. The first processing unit is a closed chamber, and the substrate is processed in the first processing unit.

[0056] Step S2, the gripping part moves from the transfer chamber to the first processing unit, the gripping part transfers the substrate processed in the first processing unit to the second processing unit through the transfer chamber, and the gripping part moves from the second processing unit to the transfer chamber; In this step, when the first processing unit completes processing of the substrate, the substrate needs to be transferred from the first processing unit to the second processing unit for corresponding processing. At this time, the opening and closing device between the first processing unit and the transfer chamber is opened, and the gripping part of the gripping mechanism rotates from the transfer chamber to the first processing unit, and grips the substrate in the first processing unit, and drives the movement of the substrate through the rotation of the gripping mechanism. When the substrate and the gripping part completely leave the first processing unit, the opening and closing device between the first processing unit and the transfer chamber is closed. When the substrate moves in the transfer chamber to approach the second processing unit, the opening and closing device between the second processing unit and the transfer chamber is opened, and the substrate enters the second processing unit through the opening and closing device. The gripping part places the substrate at the processing station of the second processing unit, and the gripping part is reset again. When the gripping part completely leaves the second processing unit, the opening and closing device between the second processing unit and the transfer chamber is closed.

[0057] Step S3, processing the substrate in the second processing unit.

[0058] In this step, the substrate is processed accordingly in a closed second processing unit.

[0059] It can be understood that the grabbing mechanism in standby state is located in the transfer chamber. By closing the opening and closing device, the transfer chamber is isolated from the first processing unit and the second processing unit, thereby preventing pollutants and cleaning fluids in the first processing unit and the second processing unit from splashing into the transfer chamber and causing contamination to the transfer chamber and the grabbing mechanism.

[0060] During the process of the gripping mechanism transferring the substrate, the substrate is always located in the transfer chamber. The substrate is isolated from the external environment through the transfer chamber. By controlling the cleanliness of the environment in the transfer chamber, the contaminants in the substrate transfer process can be controlled.

[0061] In an optional embodiment, in step S2, after the substrate enters the transfer chamber and completely leaves the first processing unit, the opening and closing device between the first processing unit and the transfer chamber is closed, and then another substrate is sent to the first processing unit for processing.

[0062] In this embodiment, when the first processing unit completes processing of the substrate, and the grabbing mechanism has grabbed the processed substrate and taken the substrate away from the first processing unit, the opening and closing device between the first processing unit and the transfer chamber can be closed. At this time, the first processing unit returns to the standby state, and another substrate to be cleaned is sent into the first processing unit through an external action mechanism, which can improve the working efficiency of the first processing unit.

[0063] Furthermore, by providing an opening and closing device between the first processing unit and the transfer chamber, as well as between the second processing unit and the transfer chamber, not only can cross contamination between the first processing unit, the second processing unit and the transfer chamber be avoided during the cleaning process, but by closing the opening and closing device, the first processing unit, the second processing unit and the transfer chamber all become independent closed chambers, and each chamber can process the substrate relatively independently, thereby improving the processing efficiency of the entire equipment.

[0064] In an optional embodiment, step S4 is further included, wherein the gripping portion moves to the transfer chamber, and the opening and closing devices between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber are closed, and the gripping mechanism is cleaned and dried by the cleaning mechanism.

[0065] In this embodiment, when the gripping mechanism is in a processing standby state, that is, a substrate is being processed in the first processing unit and / or the second processing unit, the gripping mechanism is located in a transfer chamber in a closed state. At this time, cleaning the gripping mechanism will not affect the processing efficiency of the entire device.

[0066] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A substrate wet processing device, characterized in that: The invention comprises a first processing unit and a second processing unit, wherein the first processing unit and the second processing unit are used to process substrates, the first processing unit and the second processing unit are connected through a transfer chamber, a gripping mechanism is arranged in the transfer chamber, the gripping mechanism is used to transfer the substrate processed by the first processing unit to the second processing unit via the transfer chamber, the gripping mechanism is provided with a gripping part for gripping the wafer, and an opening and closing device is arranged between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber; The first processing unit, the transfer chamber and the second processing unit are arranged along a first preset direction, the distance between the first processing unit and the second processing unit is equal to a first preset threshold, the first preset threshold is smaller than the diameter of the substrate and the first preset threshold is greater than the width value of the gripping mechanism.

2. A substrate wet processing device according to claim 1, characterized in that: The transfer chamber is provided with a drainage mechanism, and the drainage mechanism is used to discharge the liquid remaining in the transfer chamber.

3. A substrate wet processing device according to claim 1, characterized in that: The transfer chamber is provided with a cleaning mechanism for cleaning the grabbing mechanism.

4. The substrate wet processing device according to claim 1, characterized in that: The second processing unit is provided with a material unloading window.

5. The substrate wet processing device according to claim 1, characterized in that: The transfer chamber is provided with a gas supply and exhaust assembly.

6. The substrate wet processing device according to claim 1, characterized in that: A liquid leakage tray is provided below the gripping mechanism. During the process of the gripping mechanism transferring the substrate, the liquid leakage tray moves along with the gripping mechanism.

7. A substrate wet processing device, characterized in that: It comprises a substrate cleaning device as described in any one of claims 1-6.

8. A substrate wet processing method, applied to the substrate cleaning device according to any one of claims 1 to 7, characterized in that: The following steps are included: Step S1, sending the substrate into a first processing unit, and the first processing unit processes the substrate; Step S2, the gripping part moves from the transfer chamber to the first processing unit, the gripping part transfers the substrate processed in the first processing unit to the second processing unit through the transfer chamber, and the gripping part moves from the second processing unit to the transfer chamber; Step S3, processing the substrate in the second processing unit.

9. A substrate wet processing method according to claim 8, characterized in that: In the step S2, after the substrate enters the transfer chamber and completely leaves the first processing unit, the opening and closing device between the first processing unit and the transfer chamber is closed, and another substrate is sent to the first processing unit for processing.

10. A substrate wet processing method according to claim 8, characterized in that: The method further includes step S4, wherein the gripping part moves to the transfer chamber, and the opening and closing devices between the first processing unit and the transfer chamber, and between the second processing unit and the transfer chamber are closed, and the gripping mechanism is cleaned and dried by the cleaning mechanism.

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