Slice fishing machine

Abstract

The invention is suitable for the technical field of silicon wafer treatment, and provides a wafer fishing machine which comprises a degumming frame, a wafer fishing water tank assembly, a conveying mechanism, a degumming frame discharging manipulator, a wafer fishing assembly and a discharging water tank. An end plate is arranged at one end of the degumming frame, an opening is formed in the other end of the degumming frame, a flexible roller is mounted on the degumming frame, and a self-locking swing device is arranged on the end plate; the conveying mechanism is used for conveying the degumming frame; the degumming frame discharging manipulator is used for pretreating the degumming frame; the slice fishing assembly comprises a water spraying pressing mechanism, a slice fishing clamp, a six-axis robot, a circulating water spraying system and a pressing clamping rod mechanism. The discharging water tank is used for receiving the silicon wafers placed in the wafer fishing clamp. According to the invention, silicon wafers can be automatically separated and automatically loaded into the silicon wafer clip, and unmanned operation from degumming to wafer insertion is realized. In addition, flexible separation of the silicon wafers can be achieved, the product quality is guaranteed, the silicon wafers can be accurately placed in the silicon wafer clips, and the production efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a wafer scooping machine. Background Art

[0002] In the semiconductor manufacturing industry, the precision and efficiency of silicon wafer processing are directly related to the performance and production cost of the final product. Traditional silicon wafer processing methods, especially in the two steps of debonding and inserting, face many challenges. Debonding refers to the process of separating the silicon wafer that has completed wafer processing from the adhesive film or blue film it carries, while inserting is to place the debonded silicon wafer neatly and safely into the silicon wafer tray for subsequent cleaning, etching, photolithography and other process processing.

[0003] At present, after silicon wafers are debonded, they usually need to be manually picked up and flat-inserted, which is not only time-consuming and labor-intensive, but also easily causes damage to the silicon wafers due to the instability of manual operation, affecting subsequent production efficiency and product quality. Therefore, a wafer picking machine is proposed. Summary of the invention

[0004] The object of the present invention is to provide a slice scooping machine, aiming to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A slice scooping machine comprises an integral bracket, a degumming rack, a slice scooping water tank assembly, a conveying mechanism, a degumming rack unloading manipulator, a slice scooping assembly and a discharging water tank;

[0007] The degumming rack is used to load silicon wafers. One end of the degumming rack is provided with an end plate, and the other end is open. A flexible roller is installed on the degumming rack. A self-locking swing device is provided on the end plate to drive the flexible roller to clamp the silicon wafer.

[0008] The conveying mechanism is used for conveying the degumming rack;

[0009] The degumming rack unloading manipulator is used to pre-process the degumming rack and is driven by a servo motor to achieve lateral movement and lifting;

[0010] The scooping assembly comprises:

[0011] Water spray down-pressing mechanism, used for silicon wafer finishing;

[0012] The wafer catching fixture is used to catch the silicon wafer from the degumming rack and put it into the discharge water tank; the wafer catching fixture is equipped with a connecting rod type proximity switch and a laser sensor, the connecting rod type proximity switch is used to detect the position of the silicon wafer, and the laser sensor is used to detect the position of the discharge water tank;

[0013] Six-axis robot, used to drive the slice-picking fixture to move;

[0014] The circulating water spraying system is connected to the slice catching water tank assembly through a water pipeline and is used to provide circulating water for the water spraying downward pressure mechanism and the slice catching fixture;

[0015] A pressing clamping lever mechanism is used to control the opening and closing of the self-locking swing device;

[0016] The discharge water tank is used to receive the silicon wafers placed from the wafer catching fixture.

[0017] Furthermore, a crystal support bracket is provided on the debonding rack, and a crystal support for fixing the silicon wafer is provided inside the crystal support bracket.

[0018] Furthermore, the sheet-lifting trough assembly includes an integrated sheet-lifting trough, an auxiliary trough, an inlet and outlet pipeline, and a circulation pipeline, and the auxiliary trough is connected to a circulating water spraying system.

[0019] Furthermore, 2 to 4 center positioning mechanisms are provided in the film catching groove, which are respectively used for docking the degumming rack to discharge materials, manual inspection, taking and placing the crystal support bracket and the empty degumming rack, and the film catching positioning station.

[0020] Furthermore, the conveying mechanism comprises:

[0021] Mobile trolley, used to drive the degumming rack to move;

[0022] Cylinders: Cylinders are provided at the four corners of the mobile trolley for lifting the degumming rack;

[0023] Servo motor for traverse drive.

[0024] Furthermore, the degumming rack unloading robot is equipped with an electromagnetic adsorption mechanism for electromagnetically adsorbing the crystal support bracket.

[0025] Furthermore, the magazines are placed at an angle at the bottom of the discharge water tank.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The present invention can automatically separate silicon wafers and automatically load them into silicon wafer clips, realizing unmanned operation from debonding to wafer insertion.

[0028] 2. The present invention can automatically sense the starting position of the silicon wafer and accurately place the silicon wafer into the silicon wafer clip according to the number set by the user, thereby greatly improving the production efficiency.

[0029] 3. The present invention avoids damage to the silicon wafer caused by contact with hard objects and realizes flexible separation of the silicon wafer.

[0030] 4. The present invention can adapt to various connection modes between the degumming machine and the sheet inserting machine, including the connection between degumming and sheet catching, the connection between sheet catching and sheet inserting, the integrated connection of degumming-sheet catching-sheet inserting, the separate arrangement of degumming, sheet catching and sheet inserting, etc., so that the layout of the production line is more flexible and not restricted by the site.

[0031] 5. The present invention can complete the loading of a tray at one time, avoiding the defects caused by multiple contacts by personnel, and further improving the quality of the product and the reliability of production. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural schematic diagram of the present invention.

[0033] Figure 2 It is a structural schematic diagram of the degumming rack in the present invention.

[0034] Figure 3 It is a structural schematic diagram of the slice scooping water tank assembly in the present invention.

[0035] Figure 4 It is a structural schematic diagram of the conveying mechanism in the present invention.

[0036] Figure 5 It is a structural schematic diagram of the unloading robot of the degumming rack in the present invention.

[0037] Figure 6 It is a schematic diagram of the structure of the driving component in the present invention.

[0038] Figure 7 It is a structural schematic diagram of the water spray downward pressure mechanism in the present invention.

[0039] Figure 8 It is a schematic diagram of the structure of the slice scooping fixture and the six-axis robot in the present invention.

[0040] Fig. 9 It is a structural schematic diagram of the pressing and clamping rod mechanism in the present invention.

[0041] Fig.10 It is a structural schematic diagram of the discharge water tank in the present invention.

[0042] In the figure: degumming rack 01, end plate 11, hole 12, slice catching water trough assembly 02, conveying mechanism 03, mobile trolley 31, cylinder 32, degumming rack unloading robot 04, driving assembly 41, water spraying and pressing mechanism 51, slice catching fixture 52, six-axis robot 53, pressing and clamping rod mechanism 54, operating rod 541, discharge water tank 06, clip 61, integral bracket 07. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0044] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0045] like Figure 1-10 As shown, a flake scooping machine provided by an embodiment of the present invention includes an integral bracket 07 for supporting the entire device, and also includes a degumming rack 01, a flake scooping water tank assembly 02, a conveying mechanism 03, a degumming rack unloading manipulator 04, a flake scooping assembly and a discharge water tank 06;

[0046] The degumming rack 01 is used for loading silicon wafers. An end plate 11 is provided at one end of the degumming rack 01 and the other end is open. A flexible roller is installed on the degumming rack 01. A self-locking swing device (including an elastic opening mechanism and a locking mechanism) is provided on the end plate 11, which is used to drive the flexible roller to clamp the silicon wafer. A hole 12 is provided on the self-locking swing device. A crystal support bracket is provided on the upper part of the degumming rack 01. A crystal support bracket is provided in the crystal support bracket. The crystal support is used to fix the silicon wafer and can be removed when fishing out the wafer.

[0047] The slice scooping trough assembly 02 includes a slice scooping trough, an auxiliary trough, an inlet and outlet pipe and a circulation pipe that are integrated into one body, and is connected to a circulation water spraying system through a water pipe.

[0048] The conveying mechanism 03 is used to convey the degumming rack 01 .

[0049] The degumming rack unloading robot 04 is used for pre-processing the degumming rack 01; the degumming rack unloading robot 04 is equipped with an electromagnetic crystal support plate function (i.e., an electromagnetic adsorption mechanism), which is mainly used to control the crystal support bracket on the degumming rack 01; the degumming rack unloading robot 04 is connected to the driving component 41, and the driving component 41 is arranged on the integral bracket 07, and the lateral movement and lifting are realized by the servo motor drive.

[0050] The scooping assembly comprises:

[0051] The water spraying and pressing mechanism 51 is used for tidying up silicon wafers; it is equipped with a water jet blowing function in combination with servo pulse control to tidy up irregular silicon wafers, with strong flexibility and high quality assurance;

[0052] The wafer catching fixture 52 is used to catch the silicon wafer from the degumming rack 01 and put it into the discharge water tank 06; the wafer catching fixture 52 is composed of a downward clamping mechanism and a swing clamping mechanism on both sides, and the upper and lower parts and the swing clamping mechanism on both sides are equipped with a water spraying device; the wafer catching fixture 52 is equipped with a connecting rod type proximity switch and a laser sensor, the connecting rod type proximity switch is used to detect the position of the silicon wafer, and the laser sensor is used to detect the position of the material tray in the discharge water tank 06; the wafer catching fixture 52 adopts servo control, the wafer is accurately caught, and the number of wafers per time can be set, and it is equipped with a cylinder flexible mechanism to improve the quality of the silicon wafer;

[0053] The six-axis robot 53 is used to drive the wafer catching fixture 52 to move, separate and catch the silicon wafers, and provide power and precise positioning;

[0054] The circulating water spraying system is connected to the auxiliary tank and is used to provide circulating water for the water spraying and pressing mechanism 51 and the film catching fixture 52. The water in the film catching tank overflows to the auxiliary tank, and the auxiliary tank is pumped by the circulating water spraying system pump and supplied to the film catching fixture 52 and the water spraying and pressing mechanism 51.

[0055] The pressing clamping rod mechanism 54 is used to control the opening and closing of the self-locking swing device, and uses a servo to perform precise torque control. The pressing clamping rod mechanism 54 includes an operating rod 541, and the operating rod 541 is inserted into the hole 12 to open the self-locking swing device.

[0056] The discharge water tank 06 is used to receive the silicon wafers placed in the wafer catching fixture 52, and prepare for the next wafer insertion. The bottom of the discharge water tank 06 adopts an angled clip 61 to prevent the wafer from falling during the AGV transportation. The discharge water tank 06 can grab the wafer support and the debonding rack 01 and move to one side to dock with the AGV for loading and unloading. After the discharge water tank 06 is filled, it is transported to the wafer insertion machine by the AGV. At the same time, the discharge water tank 06 can integrate a wafer support pick-up and placement device and a thick wafer removal device.

[0057] In the embodiment of the present invention, the degumming rack 01 enters the chip catching machine with the silicon wafers, and after being placed in the chip catching slot, the conveying mechanism 03 drives the degumming rack 01 to move to the predetermined position to perform various operations. The degumming rack unloading manipulator 04 performs preliminary processing on the silicon wafers on the degumming rack 01, and then passes through the water spraying and pressing mechanism 51, which arranges the uneven silicon wafers in a regular manner. After the arrangement is completed, the silicon wafers are transported to the chip catching positioning station, and the operating rod 541 of the clamping rod mechanism 54 is pressed to insert the hole 12 to open the self-locking swing device. Then the six-axis robot 53 drives the chip catching fixture 52 to move, and the position of the silicon wafer is detected by the connecting rod proximity switch, and the position of the discharge water tank 06 in the discharge water tank 06 is detected by the laser sensor. The chip catching fixture 52 cooperates with the six-axis robot 53 to grab the silicon wafers in the degumming rack 01, arrange them, and then put them into the clip 61 in the discharge water tank 06. After the discharge water tank 06 is filled with silicon wafers, it is transported to the chip inserting machine by the AGV.

[0058] like Figure 1-3 As shown, as a preferred embodiment of the present invention, 2 to 4 centering positioning mechanisms are provided in the film catching groove, which are respectively used for docking the debonding rack 01 for discharging, manual inspection, taking and placing the crystal support bracket and the empty debonding rack 01, and the film catching positioning station.

[0059] like Figure 1-4 As shown, as a preferred embodiment of the present invention, the conveying mechanism 03 includes:

[0060] The mobile trolley 31 is used to drive the degumming rack 01 to move;

[0061] Cylinders 32, the four corners of the mobile trolley 31 are provided with cylinders 32, which are used to lift the degumming rack 01;

[0062] Servo motor for traverse drive.

[0063] In the embodiment of the present invention, four-corner cylinders 32 are used for lifting and servo motors are used for transverse movement to ensure smooth operation; after the degumming rack 01 is placed in the film scooping slot, the four-corner cylinders 32 of the conveying mechanism 03 are used for lifting and the servo motors are used for transverse movement to move the degumming rack 01 to a predetermined position for various operations.

[0064] The working principle of the present invention is:

[0065] The chip catching machine, the debonding rack 01 carries the silicon wafers into the chip catching machine, and after being placed in the chip catching slot, the debonding rack 01 is moved to a predetermined position for various operations through the lifting of the four-corner cylinder 32 of the conveying mechanism 03 and the lateral movement drive of the servo motor. The debonding rack unloading manipulator 04 performs preliminary processing on the silicon wafers on the debonding rack 01, and then passes through the water spraying and pressing mechanism 51, which tidies the uneven silicon wafers. After the tidying, the silicon wafers are transported to the chip catching positioning station, and the operating rod 541 of the clamping rod mechanism 54 is pressed to insert the hole 12 to open the self-locking swing device. Then the six-axis robot 53 drives the wafer catching fixture 52 to move, detects the position of the silicon wafer through the connecting rod proximity switch, and detects the position of the discharge water tank 06 in the discharge water tank 06 by the laser sensor. The wafer catching fixture 52 cooperates with the six-axis robot 53 to grab the silicon wafers in the degumming rack 01, sort them, and put them into the clip 61 in the discharge water tank 06. After the discharge water tank 06 is filled with silicon wafers, it is transported to the wafer inserting machine by the AGV.

[0066] The above are only preferred embodiments of the present invention. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention. These should also be regarded as the protection scope of the present invention. These will not affect the effect of the implementation of the present invention and the practicality of the patent.

Claims

1. A flake scooping machine, comprising an integral bracket, characterized in that: It also includes a degumming rack, a flake scooping water tank assembly, a conveying mechanism, a degumming rack unloading manipulator, a flake scooping assembly and a material discharge water tank; The degumming rack is used to load silicon wafers. One end of the degumming rack is provided with an end plate, and the other end is open. A flexible roller is installed on the degumming rack. A self-locking swing device is provided on the end plate to drive the flexible roller to clamp the silicon wafer. The conveying mechanism is used for conveying the degumming rack; The degumming rack unloading manipulator is used to pre-process the degumming rack and is driven by a servo motor to achieve lateral movement and lifting; The scooping assembly comprises: Water spray down-pressing mechanism, used for silicon wafer finishing; The wafer catching fixture is used to catch the silicon wafer from the degumming rack and put it into the discharge water tank; the wafer catching fixture is equipped with a connecting rod type proximity switch and a laser sensor, the connecting rod type proximity switch is used to detect the position of the silicon wafer, and the laser sensor is used to detect the position of the discharge water tank; Six-axis robot, used to drive the slice-picking fixture to move; The circulating water spraying system is connected to the slice catching water tank assembly through a water pipeline and is used to provide circulating water for the water spraying downward pressure mechanism and the slice catching fixture; A pressing clamping lever mechanism is used to control the opening and closing of the self-locking swing device; The discharge water tank is used to receive the silicon wafers placed from the wafer catching fixture.

2. The flake scooping machine according to claim 1, characterized in that: A crystal support bracket is arranged on the debonding frame, and a crystal support for fixing the silicon wafer is arranged inside the crystal support bracket.

3. The flake scooping machine according to claim 1, characterized in that: The slice scooping trough assembly comprises a slice scooping trough, an auxiliary trough, an inlet and outlet pipeline and a circulation pipeline which are integrally formed, and the auxiliary trough is connected to a circulation water spraying system.

4. The flake scooping machine according to claim 3, characterized in that: The film scooping groove is provided with 2 to 4 centering positioning mechanisms, which are respectively used for docking the degumming rack to discharge materials, manual inspection, taking and placing the crystal support bracket and the empty degumming rack, and the film scooping positioning station.

5. The scooping machine according to claim 1, characterized in that: The conveying mechanism comprises: Mobile trolley, used to drive the degumming rack to move; Cylinders: Cylinders are provided at the four corners of the mobile trolley for lifting the degumming rack; Servo motor for traverse drive.

6. The flaking machine according to claim 1, characterized in that: The degumming rack unloading robot is equipped with an electromagnetic adsorption mechanism for electromagnetically adsorbing the crystal support bracket.

7. The scooping machine according to claim 1, characterized in that: The bottom of the discharge water tank adopts an oblique angle to place the magazine.

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