Laser soldering process for low-voltage connector, low-voltage connector and laser equipment

Through laser welding technology, the gap problem between the low-voltage connector pad and the welding column is solved, the uniform distribution of the arbor molding is achieved, the electrical performance and mechanical strength are improved, and the reliability and production efficiency of welding are ensured.

CN119209156AActive Publication Date: 2024-12-27SHENZHEN AILEI LASER TECH CO LTD
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Patent Information

Application Number
CN202411659322.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2024-12-27
Estimated Expiration
2044-11-20

AI Technical Summary

Technical Problem

There are easy gaps between the pads and the soldering columns of low-voltage connectors, resulting in unstable electrical connections and reduced mechanical strength. It is difficult to ensure uniform molding with existing soldering iron heating tin wire process.

Method used

Using laser welding technology, the pads and welding columns of the low-voltage connector are heated simultaneously through laser welding equipment, so that the tin ring can absorb heat evenly and flow into the gap, forming a uniform soldering body, and using the continuous heat of the laser to remove excess rosin acid to ensure that Even distribution after arthroplasty molding.

Benefits of technology

A uniform molding between the pad and the welding column is achieved, the electrical performance and mechanical strength of the low-voltage connector are improved, and the reliability and production efficiency of welding are ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of laser welding, in particular to a laser tin soldering process for a low-voltage connector, the low-voltage connector and laser device.The laser tin soldering process comprises the steps that the low-voltage connector to be welded is fixed to the laser welding device, and a welding column of the low-voltage connector to be welded is sleeved with a tin bar; the tin bar is arranged along the radial direction of the welding column; and laser welding equipment is used for heating the welded low-voltage connector, at least part of welding laser of the laser welding equipment irradiates a bonding pad of the to-be-welded low-voltage connector, and the other part of the welding laser of the laser welding equipment irradiates a welding column of the to-be-welded low-voltage connector. The invention mainly aims at providing a laser tin soldering process which aims at improving the effect that welding rods can be uniformly distributed between a bonding pad and a welding column after being subjected to hot melting forming.
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Description

Technical Field

[0001] The present invention relates to the technical field of laser welding, and in particular to a laser soldering process for a low-voltage connector, a low-voltage connector and laser equipment. Background Art

[0002] A low-voltage connector is a coupling device used to connect wires, cables, printed circuit boards and electronic components. Its main function is to form circuits to transmit data, power and signals. It is commonly used in BMS (BATTERY MANAGEMENT SYSTEM), air-conditioning systems, car lights, etc. Its operating voltage is generally 14V.

[0003] In the related art, in order to ensure that there is no gap between the soldering pad and the soldering column of the low-voltage connector, the current conventional process is to use a soldering iron to heat the tin wire and flux paste for a long time to fuse them. In this way, the tin is unevenly distributed between the soldering pad and the soldering column after being formed, which can easily cause problems such as unstable electrical connection and reduced mechanical strength. Summary of the invention

[0004] The main purpose of the present invention is to provide a laser soldering process, which aims to improve the uniform distribution of the soldering rod between the soldering pad and the soldering column after the soldering rod is hot-melted and formed.

[0005] To achieve the above object, the laser soldering process proposed by the present invention includes: Fixing the low-voltage connector to be welded on the laser welding equipment, wherein the welding column sleeve of the low-voltage connector to be welded is provided with a tin bar, and the tin bar is arranged along the radial direction of the welding column; The welded low-voltage connector is heated using a laser welding device, wherein at least a portion of the welding laser of the laser welding device is irradiated onto the welding pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding device is irradiated onto the welding column of the low-voltage connector to be welded.

[0006] In one embodiment of the present invention, the laser energy irradiated on the pad by the laser welding equipment is defined as J1, the laser energy irradiated on the welding column by the laser welding equipment is defined as J2, and the ratio of J1 to J2 is 7:3.

[0007] In one embodiment of the present invention, the laser shape of the welding laser is a ring laser.

[0008] In one embodiment of the present invention, two ends of the solder bar are connected to each other, so that the solder bar is a ring-shaped solder bar.

[0009] In one embodiment of the present invention, the welding time of the laser welding equipment is 15 seconds.

[0010] In one embodiment of the present invention, the step of fixing the low-voltage connector to be welded on the laser welding device, wherein after the step of providing the soldering column sleeve of the low-voltage connector to be welded with a tin ring, further comprises: A heat-insulating cover plate is used to cover a partial structure of the welding pad of the low-voltage connector to be welded, the welding column of the low-voltage connector passes through the heat-insulating cover plate, and there is a certain gap between the outer peripheral surface of the welding column and the heat-insulating cover plate.

[0011] The present invention provides a low-voltage connector obtained by the laser soldering process.

[0012] The present invention proposes a laser device for realizing the laser soldering process. The laser device comprises a base frame, a linear movable module and a laser head. The linear movable module is fixed to the base frame, and the laser head is slidably connected to the linear movable module.

[0013] In one embodiment of the present invention, the linear movable module includes a transverse linear module and a longitudinal linear module, the transverse linear module is fixedly arranged on the base frame, the longitudinal linear module is slidably connected to the transverse linear module, and the laser head is movably arranged on the longitudinal linear module.

[0014] In one embodiment of the present invention, the base frame is provided with a positioning fixture, and the positioning fixture is movably arranged on a side of the base frame facing the laser head and can move closer to or away from the transverse linear module.

[0015] In the present technical solution, the soldering pad and soldering column of the low-voltage connector are heated simultaneously by laser welding equipment, thereby melting the tin ring mounted on the soldering column. During this process, the tin ring can evenly absorb the heat of the soldering column and melt into the gap between the soldering pad and the soldering column. In this way, the tin can be evenly distributed between the soldering pad and the soldering column after being formed. In addition, by utilizing the continuous heat of the laser after welding, the soldering pad and the soldering column can dry out the rosin acid in the formed soldering ring and remove excess rosin. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of a process flow of an embodiment of the laser soldering process provided by the present invention; Figure 2 The figure is a schematic structural diagram of an embodiment of the laser device provided by the present invention.

[0018] Description of Figure Numbers: 10. Base frame; 20. Linear moving module; 21. Horizontal linear module; 22. Vertical linear module; 30. Laser head; 40. Positioning fixture.

[0019] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0023] See also Figure 1 , the laser soldering process proposed by the present invention includes: Step S100: fixing the low-voltage connector to be welded on a laser welding device, wherein the welding column sleeve of the low-voltage connector to be welded is provided with a tin bar, and the tin bar is arranged along the radial direction of the welding column; Step S300: Use laser welding equipment to heat and weld the low-voltage connector, at least part of the welding laser of the laser welding equipment is irradiated on the welding pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding equipment is irradiated on the welding column of the low-voltage connector to be welded.

[0024] In the present technical solution, the soldering pad and soldering column of the low-voltage connector are heated simultaneously by laser welding equipment, thereby melting the tin ring mounted on the soldering column. During this process, the tin ring can evenly absorb the heat of the soldering column and melt into the gap between the soldering pad and the soldering column. In this way, the tin can be evenly distributed between the soldering pad and the soldering column after being formed. In addition, by utilizing the continuous heat of the laser after welding, the soldering pad and the soldering column can dry out the rosin acid in the formed soldering ring and remove excess rosin.

[0025] Among them, it needs to be explained that the laser welding equipment is provided with a corresponding workpiece fixing station, and the low-voltage connector to be welded can be fixed on the laser welding equipment by means of snap-in, plug-in, etc. At the same time, the workpiece fixing station has a welding state and a retreated state. In the welding state, the workpiece fixing station is close to the laser head 30 of the laser welding equipment; in the retreated state, the workpiece fixing station is away from the laser head 30 of the laser welding equipment, so that it is convenient to heat and pick up the low-voltage connector.

[0026] The tin bar is arranged along the radial direction of the solder column, which means that after the tin bar is sleeved on the solder column, the plane where the tin bar is located is parallel to the horizontal plane. In this way, the tin bar can ensure consistency when flowing to the gap between the solder pad and the solder column during hot melting.

[0027] After the low-voltage connector to be welded is fixed, the laser welding equipment is started to perform laser welding on the low-voltage connector. Specifically, at least a portion of the welding laser of the laser welding equipment is irradiated on the soldering pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding equipment is irradiated on the soldering column of the low-voltage connector to be welded. In this way, the heat on the soldering column is first absorbed by the tin bar and melted, and flows to the gap between the soldering pad and the soldering column; at the same time, the soldering pad is also in a heat release state. In this way, after the laser welding equipment stops working, the heat released by the soldering pad can continuously heat the tin between the soldering pad and the soldering column, thereby removing excess rosin.

[0028] Furthermore, the laser energy irradiated by the laser welding equipment on the solder pad is defined as J1, and the laser energy irradiated by the laser welding equipment on the solder column is defined as J2. Experiments show that when the ratio of J1 to J2 is 7:3, the hot melting effect of the tin bar is at its best. Under this laser energy distribution, it can ensure that after the tin bar is hot-melted, it can fill the gap between the solder pad and the solder column and cover the surface of the solder pad, thereby ensuring the electrical performance of the low-voltage connector.

[0029] In one embodiment of the present invention, the laser shape of the welding laser is a ring laser, so that the ring laser can adapt to the welding column and the welding pad, thereby ensuring the accuracy of energy distribution, so that 30% of the laser energy is irradiated to the welding column and 70% of the laser energy is irradiated to the welding pad.

[0030] In one embodiment of the present invention, the two ends of the tin bar are connected to each other so that the tin bar is an annular tin bar, and the annular tin bar can completely surround the solder column, ensuring that the solder can be evenly distributed around the solder column, thereby improving the reliability of welding; at the same time, since the two ends of the tin bar are connected to each other to form a ring, this simplifies the process of placing the tin bar, reduces the operation steps, and improves production efficiency In one embodiment of the present invention, the welding time of the laser welding equipment is 15 seconds. It can be understood that for different types of low-voltage connectors, it is only necessary to change the output power of the equipment, and the time is 15 seconds; the welding time is 15 seconds, which refers to the time of laser irradiation and action on a welding pad and a welding column. Since the time for the laser to irradiate the welding pad and the welding column can be ignored, it can be considered that the action time is 15 seconds, thereby ensuring the welding effect; for a low-voltage connector, it has two welding pads and welding columns, so the welding time of a low-voltage connector is 30 seconds.

[0031] In one embodiment of the present invention, after step S100, the method further includes: Step S200: using a heat-insulating cover plate to cover a part of the structure of the welding pad of the low-voltage connector to be welded, the welding column of the low-voltage connector passes through the heat-insulating cover plate, and there is a certain gap between the outer peripheral surface of the welding column and the heat-insulating cover plate.

[0032] It can be understood that the soldering pad is a partial area on the low-voltage connector circuit board, around which electronic components such as capacitors, resistors, and diodes are arranged. In order to prevent the welding laser from burning these electronic components, heat insulation treatment is required before the tin ring is hot-melted; specifically, the thermal insulation cover plate has two through holes, each solder column passes through a through hole, and forms a certain gap with the inner wall of the through hole, this gap is larger than the gap between the soldering pad and the solder column, and part of the surface of the soldering pad exposes the through hole so that the welding laser can irradiate the soldering pad.

[0033] The present invention provides a low-voltage connector obtained by the laser soldering process, so that the gap between the soldering pad and the soldering column of the low-voltage connector can be evenly filled with hot-melted tin, and the surface of the soldering pad can be fully covered with solder.

[0034] The present invention proposes a laser device for realizing the laser soldering process. The laser device includes a base frame 10, a linear moving module 20 and a laser head 30. The linear moving module 20 is fixedly arranged on the base frame 10, and the laser head 30 is slidably connected to the linear moving module 20, wherein the base frame 10 can be directly placed on the bottom surface or the processing surface through the foot pad structure to realize laser welding; the linear moving module 20 includes a translation module 11 including a frame structure, moving parts, a transmission system, etc., wherein the frame structure is usually made of aluminum alloy material, has sufficient strength and rigidity to support the laser head 30, and provides a structural basis for fixing and supporting the moving parts; the moving parts can be a guide rail structure or a linear guide rail structure or a slider structure for the movement of the laser head 30, which is a part or workpiece used to support and guide the movement of the laser head 30, which is not limited here; the transmission system can be a drive motor or a cylinder drive, which is not limited here. Further, under the control of a control system composed of a PLC, a touch screen and a host computer, parameters are set to control the time and position of feeding and retreating of the laser head 30, etc., so as to realize automatic welding, which is not limited here.

[0035] Specifically, the linear movable module 20 includes a transverse linear module 21 and a longitudinal linear module 22. The transverse linear module 21 is fixedly arranged on the base frame 10, and the longitudinal linear module 22 is slidably connected to the transverse linear module 21. The laser head 30 is movably arranged on the longitudinal linear module 22. The longitudinal linear module 22 moves along the direction defined by the transverse linear module 21, so that after one soldering pad and soldering column in the low-voltage connector to be welded is hot-melted, it can be directed to move to another soldering pad and soldering column; during the hot-melting of one soldering pad and soldering column, the laser head 30 can move along the direction defined by the longitudinal linear module 22 to approach or move away from the low-voltage connector.

[0036] In one embodiment of the present invention, the base frame 10 is provided with a positioning jig 40, and the positioning jig 40 is movably arranged on the side of the base frame 10 facing the laser head 30, and can move close to or away from the transverse linear module 21. Specifically, a directional guide rail is provided on the side of the base frame 10 facing the laser head 30, and the base of the positioning jig 40 is provided with a slider structure adapted to the directional guide rail. Through real-time control of the control system, it can be ensured that each time the positioning jig 40 is in the welding state, the positioning jig 40 is aligned with the laser head 30, and in the retreated state, the positioning jig 40 can be away from the laser head 30, thereby forming sufficient avoidance space between the laser head 30 and the laser head 30 to pick up the low-voltage connector.

[0037] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A laser soldering process for low voltage connectors, characterized in that: The laser soldering process includes: Fixing the low-voltage connector to be welded on the laser welding equipment, wherein the welding column sleeve of the low-voltage connector to be welded is provided with a tin bar, and the tin bar is arranged along the radial direction of the welding column; The welded low-voltage connector is heated using a laser welding device, wherein at least a portion of the welding laser of the laser welding device is irradiated onto the welding pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding device is irradiated onto the welding column of the low-voltage connector to be welded.

2. The laser soldering process according to claim 1, characterized in that: It is defined that the laser energy irradiated on the pad by the laser welding equipment is J1, the laser energy irradiated on the welding column by the laser welding equipment is J2, and the ratio of J1 to J2 is 7:

3.

3. The laser soldering process according to claim 2, characterized in that: The laser shape of the welding laser is a ring laser.

4. The laser soldering process according to claim 3, characterized in that: The two ends of the tin bar are connected to each other so that the tin bar is a ring-shaped tin bar.

5. The laser soldering process according to claim 3, characterized in that: The welding time of the laser welding equipment is 15 seconds.

6. The laser soldering process according to any one of claims 1 to 5, characterized in that: The method of fixing the low-voltage connector to be welded on the laser welding equipment, wherein after the step of providing the soldering column sleeve of the low-voltage connector to be welded with a tin ring, further comprises: A heat-insulating cover plate is used to cover a partial structure of the welding pad of the low-voltage connector to be welded, the welding column of the low-voltage connector passes through the heat-insulating cover plate, and there is a gap between the outer peripheral surface of the welding column and the heat-insulating cover plate.

7. A low voltage connector, characterized in that: Obtained by the laser soldering process described in any one of claims 1-6.

8. A laser device for implementing the laser soldering process as claimed in claim 1, characterized in that: The laser device comprises a base frame, a linear moving module and a laser head. The linear moving module is fixed on the base frame, and the laser head is slidably connected to the linear moving module.

9. The laser device according to claim 8, characterized in that The linear moving module comprises a transverse linear module and a longitudinal linear module. The transverse linear module is fixedly arranged on the base frame, and the longitudinal linear module is slidably connected to the transverse linear module. The laser head is movably arranged on the longitudinal linear module.

10. The laser device according to claim 9, characterized in that The base frame is provided with a positioning fixture, and the positioning fixture is movably arranged on a side of the base frame facing the laser head and can move close to or away from the transverse linear module.

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