Low-loss W-band RF module based on LoP package

Abstract

The present invention discloses a low-loss W-band radio frequency module based on LoP packaging, the radio frequency module includes a PCB substrate and a control module, a local oscillator chip and a transmitting / receiving module arranged on the PCB substrate, and the transmitting / receiving module includes a LoP packaged frequency conversion chip and a 3D waveguide antenna. The W-band radio frequency module of the present invention can realize the signal output of the W-band high frequency band, and fill the gap of chip products in the W-band high frequency band for millimeter wave radar systems that can be mass-produced; the present invention adopts the method of combining the LoP packaged frequency conversion chip with the 3D waveguide antenna, which effectively reduces the transmission loss and improves the SNR (signal-to-noise ratio); the overall transmission path of the radio frequency module is mostly based on the 3D waveguide cavity, and only transmits a very short length on the PCB, so the PCB does not need to use expensive high-frequency low-loss plates, which effectively reduces the cost.

Description

Technical Field

[0001] The present invention relates to the field of millimeter wave integrated circuit technology, and in particular to a low-loss W-band radio frequency module based on LoP packaging. Background Art

[0002] After several technical iterations, Texas Instruments (TI) released a millimeter wave chip based on LoP (Launch On Package) in 2023 after early FCCSP packaging and AoP (Antenna On Package) packaging, which can directly transmit RF signals to 3D antennas without other conversions. The chip operates in the W low-frequency band, has a 12dBm transmit power and a 13dB receive noise figure, and integrates four transmit and four receive channels.

[0003] For the research results related to the existing W-band millimeter wave chips in China that have been published, there are the following limitations:

[0004] (1) Although domestic and foreign manufacturers have been working in the field of millimeter wave chips for many years and have launched a variety of mature products, commercial competition is fierce, but they are mainly concentrated in the low frequency band of the W band where the W band and the E band overlap. There are few related studies and reports in the higher frequency band of the W band, and most of the results are concentrated on a single module circuit or a single antenna. There are no mature, mass-produced chip products in the high frequency band of the W band for millimeter wave radar systems on the market.

[0005] (2) Currently, most W-band chip solutions at home and abroad focus on complete system packaging modules of active phased array AiP. Nowadays, the application scenarios of millimeter-wave radar are becoming increasingly complex, and more flexible and changeable antenna array designs are often required.

[0006] (3) The existing W-band high-frequency chips have a low level of integration, integrating only a single-channel module or only 2×2 transceiver channels, which cannot meet the design requirements of multi-channel transceiver of millimeter-wave radar, limiting its system performance.

[0007] (4) The existing W-band high-frequency band related modules do not have the frequency conversion function. In millimeter-wave radar, the W-band RF signal needs to be transmitted directly on the PCB (loss). This places strict requirements on the performance of RF high-speed boards, PCB processing accuracy, and the overall design of the radar system, resulting in difficult design, increased costs, and low reliability. Summary of the invention

[0008] The present application provides a low-loss W-band RF module based on LoP packaging to solve the problems that most existing W-band millimeter-wave chips work in the W-band low frequency band, there is a lack of mass-produced chip products in the W-band high frequency band for millimeter-wave radar systems, and the module has low integration, high transmission loss, fixed antenna form, and cannot meet the antenna array requirements of millimeter-wave radars.

[0009] The present invention provides a low-loss W-band radio frequency module based on LoP packaging, the module comprising a PCB substrate and a control module, a local oscillator chip and a transmitting / receiving module arranged on the PCB substrate;

[0010] The transmitting / receiving module includes a LoP packaged frequency conversion chip and a 3D waveguide antenna;

[0011] The LoP packaged frequency conversion chip and the 3D waveguide antenna are respectively arranged on both sides of the PCB substrate, and a PCB through hole is opened on the PCB substrate between the LoP packaged frequency conversion chip and the 3D waveguide antenna; the LoP packaged frequency conversion chip is a transceiver integrated chip, which controls the channel state to receive or transmit by adjusting the internal switch state; the 3D waveguide antenna is used for transmitting and receiving signals;

[0012] In the transmission mode, the main RF chip in the control module generates a RF signal, and is coupled to the 3D waveguide cavity through the microstrip switching structure on the PCB substrate for transmission, and then transmitted to the LoP package frequency conversion chip through the PCB through-hole connected to the 3D waveguide cavity. The LoP package frequency conversion chip mixes the RF signal with the local oscillator signal generated by the local oscillator chip to generate a W-band signal, and feeds it into the 3D waveguide antenna through the PCB through-hole and the 3D waveguide cavity to complete the transmission;

[0013] In the receiving mode, the 3D waveguide antenna receives the W-band signal from the external space and transmits it to the LoP packaged frequency conversion chip through the 3D waveguide cavity and the PCB through-hole. The LoP packaged frequency conversion chip then mixes the received signal with the local oscillator signal and transmits it back to the control module through the PCB through-hole, the 3D waveguide cavity and the microstrip transfer structure on the PCB substrate.

[0014] Furthermore, the LoP packaged frequency conversion chip includes a silicon wafer, a plastic packaging mold and a packaging substrate. The plastic packaging mold and the packaging substrate are used for packaging the silicon wafer. A radiation patch connected to the silicon wafer is provided on the surface of the packaging substrate. Ground solder balls are provided around the radiation patch. The radiation patch is used for receiving and transmitting signals.

[0015] Furthermore, the control module and the local oscillator chip are respectively arranged on both sides of the PCB substrate, and the control module and the 3D waveguide antenna are arranged on the same side of the PCB substrate, and the local oscillator chip and the LoP package frequency conversion chip are arranged on the same side of the PCB substrate.

[0016] Furthermore, the local oscillator signal generated by the local oscillator chip is transmitted to the LoP packaged frequency conversion chip through a surface local oscillator signal line on the PCB substrate.

[0017] Furthermore, the microstrip transition structure includes a connected microstrip line and a microstrip patch. The radio frequency signal is led out from the main radio frequency chip in the control module and fed into the microstrip line, and then coupled into the 3D waveguide cavity through the microstrip patch.

[0018] Furthermore, the microstrip transition structure is covered with copper foil and provided with grounding through holes to ensure signal transmission.

[0019] Furthermore, the LoP packaged frequency conversion chip includes multiple signal transceiver channels, each of which includes a first transceiver switch, a low noise power amplifier LNA, a power amplifier PA, a second transceiver switch and a mixer;

[0020] The fixed end of the first transceiver switch is used for signal transmission with the 3D waveguide antenna, the first free end of the first transceiver switch is connected to a low noise power amplifier LNA, the second free end of the first transceiver switch is connected to a power amplifier PA, the low noise power amplifier LNA is connected to the first free end of the second transceiver switch, the power amplifier PA is connected to the second free end of the second transceiver switch, and the fixed end of the second transceiver switch is connected to a mixer.

[0021] Further,

[0022] In the transmitting mode, the local oscillator signal LO generated by the local oscillator chip is amplified by the first-stage power amplifier DA1 and then formed into multiple local oscillator signals through a power divider. After being amplified again by the second-stage power amplifier DA2, it is mixed with the RF signal generated by the control module through a mixer. The mixed signal passes through the PA power amplifier and outputs a W-band signal and is fed into the 3D waveguide antenna.

[0023] In the receiving mode, the external W-band signal received by the 3D waveguide antenna is first amplified by the low-noise power amplifier LNA, then mixed with the local oscillator signal by the mixer and returned to the control module.

[0024] Furthermore, the LoP packaged frequency conversion chip adopts four signal transceiver channels.

[0025] Furthermore, the control module also includes a main control chip, and the main control chip is used to control the signal reception and transmission of the entire module.

[0026] The present application provides a low-loss W-band RF module based on LoP packaging, which has the following beneficial effects:

[0027] 1. It can realize the signal output of W-band high frequency band, and fill the blank of chip products in W-band high frequency band for millimeter wave radar system that can be mass-produced;

[0028] 2. The LoP packaged frequency conversion chip can be combined with an external local oscillator signal to realize the multi-channel frequency conversion function of the W band. It has a simple structure and integrates the transceiver function, which can be flexibly adjusted according to actual use;

[0029] 3. For the high-loss W band, the LoP packaged chip is combined with the 3D waveguide antenna to effectively reduce transmission loss and improve SNR (signal-to-noise ratio);

[0030] 4. The overall transmission path of the RF module is mostly based on the 3D waveguide cavity, and only a very short length is transmitted on the PCB. Therefore, the PCB does not need to use expensive high-frequency and low-loss boards, and only FR-4 and other boards are used, which effectively reduces the cost;

[0031] 5. Due to the use of 3D waveguide antenna, there is no need for microvias and the potential number of PCB ground layers is reduced, which can further reduce the total number of PCB layers and save PCB plate making process costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the structure of a low-loss W-band RF module based on LoP packaging provided by one embodiment of the present invention;

[0033] Figure 2 A schematic diagram of a microstrip switching structure in a low-loss W-band radio frequency module based on LoP packaging provided by one embodiment of the present invention;

[0034] Figure 3 The S-parameter simulation results of a microstrip transition structure in a low-loss W-band RF module based on LoP packaging provided by one embodiment of the present invention;

[0035] Figure 4 A circuit schematic diagram of a LoP packaged frequency conversion chip in a low-loss W-band RF module based on LoP packaging provided by one embodiment of the present invention;

[0036] In the figure: 100-PCB substrate; 200-control module; 300-local oscillator chip; 400-LoP package frequency conversion chip; 500-3D waveguide antenna; 110-PCB through hole; 120-microstrip line; 130-microstrip patch; 140-copper sheet; 150-ground through hole; 310-local oscillator signal line; 410-silicon wafer; 420-plastic encapsulation mold; 430-packaging substrate; 440-radiation patch; 450-ground solder ball; 510-3D waveguide cavity. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0038] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0039] The first embodiment of the present invention provides a low-loss W-band RF module based on LoP packaging, such as Figure 1 As shown, the radio frequency module includes a PCB substrate 100 and a control module 200, a local oscillator chip 300 and a transmitting / receiving module arranged on the PCB substrate 100.

[0040] The transmitting / receiving module includes a LoP packaged frequency conversion chip 400 and a 3D waveguide antenna 500; the LoP packaged frequency conversion chip 400 and the 3D waveguide antenna 500 are respectively arranged on both sides of the PCB substrate 100, and a PCB through hole 110 is opened on the PCB substrate 100 between the LoP packaged frequency conversion chip 400 and the 3D waveguide antenna 500; the LoP packaged frequency conversion chip 400 is a transceiver integrated chip, which controls the channel state to receive or transmit by adjusting the internal switch state; the 3D waveguide antenna 500 is used for transmitting and receiving signals.

[0041] The W-band RF module of this embodiment (signal transmission direction is as follows Figure 1 The working principle is as follows:

[0042] In the transmission mode, the main RF chip in the control module 200 generates a RF signal, and is coupled to the 3D waveguide cavity 510 through the microstrip switching structure on the PCB substrate 100 for transmission, and then transmitted to the LoP package frequency conversion chip 400 through the PCB straight-through hole 110 connected to the 3D waveguide cavity 510. The LoP package frequency conversion chip 400 mixes the RF signal with the local oscillator signal generated by the local oscillator chip 300 to generate a W-band signal, and feeds it into the 3D waveguide antenna 500 through the PCB straight-through hole 110 and the 3D waveguide cavity 510 to complete the transmission;

[0043] In the receiving mode, the 3D waveguide antenna 500 receives the W-band signal from the external space and transmits it to the LoP packaged frequency conversion chip 400 through the 3D waveguide cavity 510 and the PCB through-hole 110. The LoP packaged frequency conversion chip 400 then mixes the received signal with the local oscillator signal and transmits it back to the control module 200 via the PCB through-hole 110, the 3D waveguide cavity 510 and the microstrip switching structure on the PCB substrate 100.

[0044] In this embodiment, the control module 200 and the local oscillator chip 300 are respectively arranged on both sides of the PCB substrate 100, and the control module 200 and the 3D waveguide antenna 500 are arranged on the same side of the PCB substrate 100, and the local oscillator chip 300 and the LoP package frequency conversion chip 400 are arranged on the same side of the PCB substrate 100. The local oscillator signal generated by the local oscillator chip 300 is transmitted to the LoP package frequency conversion chip 400 through the surface local oscillator signal line 310 on the PCB substrate 100.

[0045] The control module 200 includes a main control chip and a main RF chip. The main RF chip in the control module 200 can select a variety of mature chip products that have been mass-produced on the market or other RF processing modules developed in experiments, and can be flexibly selected and matched according to actual needs. In this embodiment, the main RF chip adopts an existing mature mass-produced chip. The main control chip controls the entire system by writing programs, including the main RF chip, LoP package frequency conversion chip 400, local oscillator chip 300, etc.

[0046] In this embodiment, the LoP packaged frequency conversion chip 400 includes a silicon wafer 410, a plastic packaging mold 420 and a packaging substrate 430. The plastic packaging mold 420 and the packaging substrate 430 are used for packaging the silicon wafer 410. A radiation patch 440 connected to the silicon wafer 410 is provided on the surface of the packaging substrate 430. A grounding solder ball 450 is provided around the radiation patch 440. The radiation patch 440 is used for receiving and transmitting signals.

[0047] Specifically, silicon wafer 410: that is, an unpackaged chip die. Plastic encapsulation mold 420, encapsulation substrate 430, and radiation patch 440, these three items are the shell of the packaged chip, and together with the bare chip, they constitute the LoP packaged chip. The radiation patch 440 is used to transmit signals into space. The radiation patch 440 is located at the bottom of the packaged LoP chip, surrounded by ground solder balls 450 (GND solder balls), and other solder balls are local oscillator input ports and other power control pins.

[0048] In this embodiment, the PCB through hole 110 is a metallized through hole on the PCB, which is used for spatial signal transmission.

[0049] In this embodiment, the 3D waveguide cavity 510 is a transmission channel, and the medium is air.

[0050] In this embodiment, the local oscillator chip 300 may be an existing mature mass-produced chip. The chip selected in the present invention can provide any frequency signal within 10 MHz to 20 GHz.

[0051] In this embodiment, the W-band low-frequency signal emitted by the main RF chip in the control module 200 is mixed with the local oscillator signal emitted by the local oscillator chip 300 through the LoP packaged frequency conversion chip 400 to generate a W-band high-frequency signal higher than 90 GHz, thereby realizing the W-band high-frequency signal output, which can be applied to the millimeter-wave radar field to fill the gap in this demand.

[0052] In this embodiment, Figure 2 As shown, the microstrip transfer structure includes a connected microstrip line 120 and a microstrip patch 130 (radiation patch). The RF signal is led out from the main RF chip in the control module 200 and fed into the microstrip line 120, and then coupled to the 3D waveguide cavity 510 through the microstrip patch 130. The microstrip transfer structure is surrounded by a copper sheet 140 and is provided with a grounding through hole 150 to ensure signal transmission. The RF signal is led out from the main RF chip in the control module 200 and fed into the microstrip line 120, and coupled to the upper waveguide cavity through the microstrip radiation patch; the signal enters the waveguide cavity for transmission after only a short distance on the microstrip line on the PCB board, which effectively reduces the transmission loss. Figure 3 The S parameter simulation result of the transfer structure shows that it has good transmission performance within the working frequency band, and the maximum bandwidth is close to 4 GHz, which meets the transmission of W-band low-frequency signals between the LoP package frequency conversion chip 400 and the main RF chip.

[0053] Figure 4This is a schematic diagram of the principle of the LoP packaged frequency conversion chip 400. The receiving chip is the same as the transmitting chip, and the transmit / receive mode selection is realized by controlling the T / R Switch (transceiver switch). In this embodiment, the LoP packaged frequency conversion chip 400 includes four signal transceiver channels RF1-RF4, and each signal transceiver channel includes a first transceiver switch (T / R Switch), a low noise power amplifier LNA, a power amplifier PA, a second transceiver switch (T / R Switch) and a mixer (Mixer). The fixed end of the first transceiver switch is used for signal transmission with the 3D waveguide antenna 500, the first free end of the first transceiver switch is connected to the low noise power amplifier LNA, the second free end of the first transceiver switch is connected to the power amplifier PA, the low noise power amplifier LNA is connected to the first free end of the second transceiver switch, the power amplifier PA is connected to the second free end of the second transceiver switch, and the fixed end of the second transceiver switch is connected to the mixer.

[0054] The specific working process is as follows: In the transmitting mode, the local oscillator signal LO generated by the local oscillator chip 300 is amplified by the first-stage power amplifier DA1 and then formed into four local oscillator signals through a one-to-four power divider, and then amplified again by the second-stage power amplifier DA2 and mixed with the RF signal generated by the control module 200 through a mixer. The mixed signal is output as a W-band signal after passing through the PA power amplifier and fed into the 3D waveguide antenna 500, and its output power is ≥13dBm (input power ≥7dBm); in the receiving mode, the external W-band signal received by the 3D waveguide antenna 500 is first low-noise amplified by the low-noise power amplifier LNA, and then mixed with the local oscillator signal through the mixer and returned to the control module 200. The LoP package frequency conversion chip 400 of this embodiment has a 14dB frequency conversion gain and a 9dB receiving noise coefficient. In addition, all power amplifiers have independent power switches, which can also be controlled by the external control module 200. Combined with the transceiver switch, three states of transmission, reception or shutdown can be realized. If the RF channel is not working, it can be turned off to reduce power consumption.

[0055] Compared with the prior art, the low-loss W-band RF module based on LoP packaging proposed in the embodiment of the present invention has the following advantages:

[0056] 1. Currently, there are relatively mature W-band millimeter wave RF chips or modules that are mass-produced on the market, but most of them work in the low frequency band of the W-band. The chip of the present invention can be combined with existing mature products to achieve signal output in the high frequency band of the W-band, and can be applied to the field of millimeter wave radar to fill the gap in this demand.

[0057] 2. Compared with the combination of the traditional FCCSP packaged millimeter wave chip and the microstrip antenna, the combination of the LoP packaged frequency conversion chip 400 and the 3D waveguide antenna 500 of the present invention can effectively improve the SNR of the overall system, especially the millimeter wave radar using LoP technology can achieve a longer maximum detection distance.

[0058] 3. Since the transmitting ports of the LoP packaged frequency conversion chip 400 are integrated at the bottom of the package, the heat sink can be placed more flexibly on the top of the package to achieve thermal management efficiency and ensure the reliability of the module for long-term operation.

[0059] 4. Compared with the millimeter wave chip packaged in FCCSP, the solder ball size of the LoP packaged frequency conversion chip 400 of the present invention can be larger, which improves the process stability; in addition, since the LoP packaged frequency conversion chip 400 and the 3D waveguide antenna 500 are respectively placed on both sides of the PCB, as well as the grounded shielding solder balls around the port, the isolation can be improved and the electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems can be reduced.

[0060] 5. Due to the use of cheaper PCB materials and the absence of microvias, PCB processing costs can be further saved. In addition, the potential number of PCB ground layers can be reduced, thereby reducing the total number of PCB layers and reducing design difficulty.

[0061] 6. The transmission link of the RF module using the traditional packaged chip must go through at least 4 conversion structures (bare chip-package-BGA-PCB-microstrip antenna). The LoP packaged frequency conversion chip 400 proposed in the present invention only needs to go through 2 conversion structures (bare chip-package-3D waveguide antenna 500), which effectively reduces the conversion loss.

[0062] 7. Currently, most W-band chip products are active phased array AiP or AoP packaging solutions, and their antenna form has been solidified and cannot meet the antenna array requirements of millimeter wave radar. The LoP packaged chip of the present invention is small in size and easy to integrate into the radar RF circuit. It can share a single PCB design and only needs to replace the 3D waveguide antenna 500 with different array designs for different scenarios, making the array design of the radar antenna more flexible.

[0063] The above specific examples are used to illustrate the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, some simple deductions, modifications or substitutions can be made.

Claims

1. A low-loss W-band RF module based on LoP packaging, characterized in that: The module includes a PCB substrate and a control module, a local oscillator chip and a transmitting / receiving module arranged on the PCB substrate; The transmitting / receiving module includes a LoP packaged frequency conversion chip and a 3D waveguide antenna; The LoP packaged frequency conversion chip and the 3D waveguide antenna are respectively arranged on both sides of the PCB substrate, and a PCB through hole is opened on the PCB substrate between the LoP packaged frequency conversion chip and the 3D waveguide antenna; the LoP packaged frequency conversion chip is a transceiver integrated chip, which controls the channel state to receive or transmit by adjusting the internal switch state; the 3D waveguide antenna is used for transmitting and receiving signals; In the transmission mode, the main RF chip in the control module generates a RF signal, and is coupled to the 3D waveguide cavity through the microstrip switching structure on the PCB substrate for transmission, and then transmitted to the LoP package frequency conversion chip through the PCB through-hole connected to the 3D waveguide cavity. The LoP package frequency conversion chip mixes the RF signal with the local oscillator signal generated by the local oscillator chip to generate a W-band signal, and feeds it into the 3D waveguide antenna through the PCB through-hole and the 3D waveguide cavity to complete the transmission; In the receiving mode, the 3D waveguide antenna receives the W-band signal from the external space and transmits it to the LoP packaged frequency conversion chip through the 3D waveguide cavity and the PCB through-hole. The LoP packaged frequency conversion chip then mixes the received signal with the local oscillator signal and transmits it back to the control module through the PCB through-hole, the 3D waveguide cavity and the microstrip transfer structure on the PCB substrate.

2. A low-loss W-band RF module based on LoP packaging as claimed in claim 1, characterized in that: The LoP packaged frequency conversion chip includes a silicon wafer, a plastic packaging mold and a packaging substrate. The plastic packaging mold and the packaging substrate are used for packaging the silicon wafer. A radiation patch connected to the silicon wafer is arranged on the surface of the packaging substrate. A grounding solder ball is arranged around the radiation patch. The radiation patch is used for receiving and transmitting signals.

3. A low-loss W-band RF module based on LoP packaging as claimed in claim 1, characterized in that: The control module and the local oscillator chip are respectively arranged on both sides of the PCB substrate, and the control module and the 3D waveguide antenna are arranged on the same side of the PCB substrate, and the local oscillator chip and the LoP package frequency conversion chip are arranged on the same side of the PCB substrate.

4. A low-loss W-band RF module based on LoP packaging as claimed in claim 3, characterized in that: The local oscillator signal generated by the local oscillator chip is transmitted to the LoP packaged frequency conversion chip through the surface local oscillator signal line on the PCB substrate.

5. A low-loss W-band RF module based on LoP packaging as claimed in claim 3, characterized in that: The microstrip switching structure includes a connected microstrip line and a microstrip patch. The radio frequency signal is led out from the main radio frequency chip in the control module and fed into the microstrip line, and then coupled into the 3D waveguide cavity through the microstrip patch.

6. A low-loss W-band RF module based on LoP packaging as claimed in claim 5, characterized in that: The microstrip transition structure is covered with copper foil and provided with grounding through holes to ensure signal transmission.

7. A low-loss W-band RF module based on LoP packaging as claimed in claim 1, characterized in that: The LoP packaged frequency conversion chip includes multiple signal transceiver channels, each of which includes a first transceiver switch, a low noise power amplifier LNA, a power amplifier PA, a second transceiver switch and a mixer; The fixed end of the first transceiver switch is used for signal transmission with the 3D waveguide antenna, the first free end of the first transceiver switch is connected to a low noise power amplifier LNA, the second free end of the first transceiver switch is connected to a power amplifier PA, the low noise power amplifier LNA is connected to the first free end of the second transceiver switch, the power amplifier PA is connected to the second free end of the second transceiver switch, and the fixed end of the second transceiver switch is connected to a mixer.

8. A low-loss W-band RF module based on LoP packaging as claimed in claim 7, characterized in that: In the transmitting mode, the local oscillator signal LO generated by the local oscillator chip is amplified by the first-stage power amplifier DA1 and then formed into multiple local oscillator signals through a power divider. After being amplified again by the second-stage power amplifier DA2, it is mixed with the RF signal generated by the control module through a mixer. The mixed signal passes through the PA power amplifier and outputs a W-band signal and is fed into the 3D waveguide antenna. In the receiving mode, the external W-band signal received by the 3D waveguide antenna is first amplified by the low-noise power amplifier LNA, then mixed with the local oscillator signal by the mixer and returned to the control module.

9. A low-loss W-band RF module based on LoP packaging as claimed in claim 7, characterized in that: The LoP packaged frequency conversion chip adopts four signal receiving and transmitting channels.

10. A low-loss W-band RF module based on LoP packaging as claimed in claim 1, characterized in that: The control module also includes a main control chip, which is used to control the signal reception and transmission of the entire module.

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