Circuit board with embedded component and manufacturing method thereof

Abstract

The invention relates to a circuit board with embedded components, which is thinned and favorable for heat dissipation, and comprises a circuit substrate and electronic components. The circuit substrate comprises a first circuit layer, a dielectric layer and a blind hole, wherein the first circuit layer and the dielectric layer are stacked in the thickness direction, and the blind hole penetrates through the first circuit layer and part of the dielectric layer. A first metal part and a second metal part which are spaced are arranged in the blind hole, the first metal part extends from the first circuit layer to the bottom wall of the blind hole along the side wall of the blind hole, the second metal part extends from the first circuit layer to the bottom wall along the side wall, and at least one of the first metal part and the second metal part covers part of the bottom wall. The electronic component is arranged in the blind hole, a first electric connection end and a second electric connection end are arranged on the side wall of the electronic component in a spaced mode, the first electric connection end is welded to the first metal part, and the second electric connection end is welded to the second metal part. The invention further provides a manufacturing method of the circuit board with the embedded element.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to a circuit board with embedded components and a manufacturing method thereof. Background Art

[0002] With the continuous development and progress of circuit board technology, circuit boards tend to be light, thin, short, small and high-density. In the prior art, the thinning of circuit boards is usually achieved by embedding electronic components. However, the embedded design often easily leads to heat accumulation. Summary of the invention

[0003] In view of this, it is necessary to provide a circuit board with embedded components that is thinner and conducive to heat dissipation.

[0004] It is also necessary to provide a method for manufacturing the circuit board with embedded components.

[0005] In a first aspect, the present application provides a circuit board with embedded components, comprising a circuit substrate and electronic components. The circuit substrate comprises a first circuit layer and a dielectric layer stacked in a thickness direction, and the circuit substrate further comprises a blind hole penetrating the first circuit layer and a portion of the dielectric layer. A first metal portion and a second metal portion are provided in the blind hole at intervals, the first metal portion extends from the first circuit layer along the side wall of the blind hole to the bottom wall of the blind hole, the second metal portion extends from the first circuit layer along the side wall to the bottom wall, and at least one of the first metal portion and the second metal portion covers a portion of the bottom wall. The electronic component is provided in the blind hole, and a first electrical connection end and a second electrical connection end are provided at intervals on the side wall of the electronic component, the first electrical connection end is welded to the first metal portion, and the second electrical connection end is welded to the second metal portion.

[0006] In the above-mentioned circuit board of the present application, the electronic components are embedded in the blind holes, which is conducive to reducing the thickness of the circuit board in the thickness direction, and further conducive to the thinning of the circuit board. The first electrical connection end is welded to the first metal part, and the second electrical connection end is welded to the second metal part, which not only realizes the electrical connection between the electronic components and the circuit substrate, but also can quickly conduct the heat of the electronic components to other areas, which is conducive to heat dissipation. Furthermore, at least one of the first metal part and the second metal part covering part of the bottom wall is also conducive to increasing the surface area of ​​the metal part arranged in the blind hole, which is conducive to accelerating the heat dissipation of the electronic components.

[0007] Based on the first aspect, in a possible implementation, the first metal part and the second metal part respectively cover part of the bottom wall, the area covered by the first metal part on the bottom wall is a first extension area, and the area covered by the second metal part on the bottom wall is a second extension area.

[0008] Based on the first aspect, in a possible implementation manner, the electronic component is embedded between the first extension area and the second extension area, and the first extension area is directly in contact with the first electrical connection end, and the second extension area is directly in contact with the second electrical connection end.

[0009] In the above possible manner, the first extension area and the second extension area are in direct contact with the electronic component, which is beneficial for quickly conducting and diffusing the heat of the electronic component directly through the first metal part and the second metal part, thereby facilitating heat dissipation.

[0010] Based on the first aspect, in a possible implementation manner, the first extension area is sandwiched between the first electrical connection end and the bottom wall, and the second extension area is sandwiched between the second electrical connection end and the bottom wall.

[0011] In the above possible manner, it is beneficial to increase the contact area between the first metal part and the electronic component and between the second metal part and the electronic component, thereby facilitating the rapid conduction and diffusion of heat of the electronic component.

[0012] Based on the first aspect, in a possible implementation, the first electrical connection end and the first metal part provided on the side wall are welded by a first solder, and the second electrical connection end and the second metal part provided on the side wall are welded by a second solder, and the first electrical connection end and the second electrical connection end are spaced apart and opposite to each other in a first direction perpendicular to the thickness direction, and in a second direction perpendicular to the thickness direction and the first direction, the width of the first solder is greater than the width of the first electrical connection end, and the width of the second solder is greater than the width of the second electrical connection end.

[0013] In the above possible manner, the width of the first solder is greater than the width of the first electrical connection end, and the width of the second solder is greater than the width of the second electrical connection end, which is beneficial to increase the stability of the welding between the electronic component and the circuit substrate, and is also beneficial to quickly conduct and diffuse the heat of the electronic component to facilitate heat dissipation.

[0014] Based on the first aspect, in a possible implementation, a side of the first solder facing away from the bottom wall is flush with a side of the first electrical connection end facing away from the bottom wall, and a side of the second solder facing away from the bottom wall is flush with a side of the second electrical connection end facing away from the bottom wall.

[0015] In the above possible manner, the first solder is flush with the first electrical connection, and the second solder is flush with the second electrical connection end, which is beneficial to increase the contact area between the electronic component and the first metal part and the second metal part through the first solder and the second solder, thereby facilitating the rapid conduction and diffusion of heat from the electronic component to facilitate heat dissipation.

[0016] Based on the first aspect, in a possible implementation, the first circuit layer includes a first circuit portion and a second circuit portion, the first metal portion extends from the first circuit portion, and the second metal portion extends from the second circuit portion.

[0017] The second aspect of the present application provides a method for manufacturing a circuit board with embedded components, which comprises the following steps: providing a circuit substrate, comprising a first circuit layer and a dielectric layer stacked in a thickness direction, the circuit substrate further comprising a blind hole covered by a metal layer, the blind hole penetrating the first circuit layer and a portion of the dielectric layer, the metal layer extending from the first circuit layer along the side wall of the blind hole to the bottom wall of the blind hole to cover the side wall and the bottom wall; processing the metal layer so that the metal layer is separated into a first metal portion and a second metal portion that are independently and spaced apart, the first metal portion extending from the first circuit layer along the side wall to the bottom wall, the second metal portion extending from the first circuit layer along the side wall to the bottom wall, and at least one of the first metal portion and the second metal portion covering a portion of the bottom wall; and placing an electronic component with a first electrical connection end and a second electrical connection end in the blind hole, and welding the first electrical connection end and the first metal portion, and welding the second electrical connection end and the second metal portion.

[0018] The manufacturing method of the circuit board with embedded components of the present application is beneficial to the thinning of the circuit board and the heat dissipation of the embedded electronic components.

[0019] Based on the second aspect, in a possible implementation method, the first metal part and the second metal part respectively cover part of the bottom wall, the area covered by the first metal part on the bottom wall is the first extension area, and the area covered by the second metal part on the bottom wall is the second extension area; in the step of placing the electronic components in the blind hole, the electronic components are embedded between the first extension area and the second extension area, and the first extension area is directly in contact with the first electrical connection end, and the second extension area is directly in contact with the second electrical connection end.

[0020] In the above possible manner, the first extension area and the second extension area are in direct contact with the electronic component, which is beneficial for quickly conducting and diffusing the heat of the electronic component directly through the first metal part and the second metal part, thereby facilitating heat dissipation.

[0021] Based on the second aspect, in a possible implementation method, the first metal part and the second metal part respectively cover part of the bottom wall, the area covered by the first metal part on the bottom wall is the first extension area, and the area covered by the second metal part on the bottom wall is the second extension area; in the step of placing the electronic component in the blind hole, the first extension area is clamped between the first electrical connection end and the bottom wall, and the second extension area is clamped between the second electrical connection end and the bottom wall.

[0022] In the above possible manner, it is beneficial to increase the contact area between the first metal part and the electronic component and between the second metal part and the electronic component, thereby facilitating the rapid conduction and diffusion of heat of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic cross-sectional view of a circuit board with embedded components according to an embodiment of the present application.

[0024] Figure 2 For Figure 1 A partial top view of a circuit board with embedded components is shown.

[0025] Figure 3 A schematic cross-sectional view of a circuit board with embedded components according to an embodiment of the present application.

[0026] Figure 4 A schematic cross-sectional view of a circuit substrate according to an embodiment of the present application.

[0027] Figure 5 for Figure 4 A partial top view of the circuit substrate shown.

[0028] Figure 6 For Figure 4 The schematic cross-sectional view of the circuit substrate is shown in FIG. 1 and FIG. 2 is a schematic cross-sectional view of a first metal portion and a second metal portion formed after a metal layer in the circuit substrate is processed.

[0029] Figure 7 For Figure 6 A top view of the processed circuit substrate is shown.

[0030] Figure 8 For Figure 6 The schematic cross-sectional view of the circuit substrate after electronic components are arranged in the blind holes shown.

[0031] Fig. 9 A schematic cross-sectional view of an insulating substrate with an opening according to an embodiment of the present application.

[0032] Fig.10 A schematic cross-sectional view of a single-sided board with a blind hole according to an embodiment of the present application.

[0033] Fig.11 For Fig.10 A schematic cross-sectional view of a blind hole after a metal layer is formed is shown.

[0034] Fig.12 A schematic cross-sectional view of a circuit substrate according to an embodiment of the present application.

[0035] Fig.13 For the general Fig.11 The single-sided board shown Fig. 9 The insulating substrate and Fig.12 The schematic cross-sectional view of the circuit substrates after being stacked in sequence is shown.

[0036] Fig.14 A schematic cross-sectional view of an intermediate structure of an embodiment provided in the present application.

[0037] Main component symbols

[0038]

[0039]

[0040] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0043] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] See also Figure 1The circuit board 100 with embedded components provided in one embodiment of the present application includes a circuit substrate 100a and an electronic component 50. The electronic component 50 is embedded in the circuit substrate 100a and electrically connected to the circuit substrate 100a.

[0045] The circuit substrate 100a may be a rigid circuit substrate, a rigid-flexible board, or a flexible circuit substrate. In this embodiment, the circuit substrate 100a is a rigid-flexible board. Preferably, the electronic component 50 may be embedded in the rigid board area of ​​the circuit substrate 100a.

[0046] The circuit substrate 100a includes a first circuit layer 11 and a dielectric layer 12 stacked along a thickness direction X, wherein the first circuit layer 11 is disposed on one side of the dielectric layer 12. The circuit substrate 100a further includes a blind hole 13 penetrating the first circuit layer 11 and a portion of the dielectric layer 12, wherein a first metal portion 141 and a second metal portion 143 are spaced apart in the blind hole 13. The first metal portion 141 extends from the first circuit layer 11 along the side wall 131 of the blind hole 13 to the bottom wall 133 of the blind hole 13, and the second metal portion 143 extends from the first circuit layer 11 along the side wall 131 of the blind hole 13 to the bottom wall 133 of the blind hole 13, and at least one of the first metal portion 141 and the second metal portion 143 covers a portion of the bottom wall 133. The electronic component 50 is disposed in the blind hole 13 , and a first electrical connection end 51 and a second electrical connection end 53 are spaced apart on the side wall of the electronic component 50 . The first electrical connection end 51 is welded to the first metal part 141 , and the second electrical connection end 53 is welded to the second metal part 143 .

[0047] Preferably, the first electrical connection end 51 and the second electrical connection end 53 are arranged opposite to each other, so as to help reduce the risk of short circuit between the first electrical connection end 51 and the second electrical connection end 53.

[0048] For details, please refer to Figure 2 The first circuit layer 11 includes a first circuit portion 111 and a second circuit portion 113. The first metal portion 141 extends from the first circuit portion 111, that is, the first metal portion 141 is electrically connected to the first circuit portion 111. The second metal portion 143 extends from the second circuit portion 113, that is, the second metal portion 143 is electrically connected to the second circuit portion 113.

[0049] The circuit substrate 100a may include a single-layer circuit layer, or may include two or more circuit layers. In this embodiment, the circuit substrate 100a includes three circuit layers stacked and spaced in sequence along the thickness direction X, namely the first circuit layer 11, the second circuit layer 15, and the third circuit layer 16. Among them, the first circuit layer 11 is only provided in the hard board area of ​​the circuit substrate 100a, and the second circuit layer 15 and the third circuit layer 16 are provided corresponding to the hard board area and the soft board area of ​​the circuit substrate 100a.

[0050] The dielectric layer 12 may include but is not limited to polypropylene, polyimide, Teflon, polythiamine, polymethyl methacrylate, polycarbonate, polyethylene terephthalate or polyimide-polyethylene-terephthalate copolymer or a combination thereof.

[0051] The electronic component 50 is embedded in the blind hole 13, which is conducive to reducing the thickness of the circuit board in the thickness direction X, and further conducive to the thinning of the circuit board. The first electrical connection end 51 is welded to the first metal part 141, and the second electrical connection end 53 is welded to the second metal part 143, which not only realizes the electrical connection between the electronic component 50 and the circuit substrate 100a, but also can quickly conduct the heat of the electronic component 50 to other areas (for example, but not limited to the large area of ​​copper foil area of ​​the circuit board), which is conducive to heat dissipation. Furthermore, at least one of the first metal part 141 and the second metal part 143 covering a part of the bottom wall 133 is also conducive to increasing the surface area of ​​the metal part arranged in the blind hole 13, which is conducive to accelerating the heat dissipation of the electronic component 50.

[0052] In this embodiment, the first metal part 141 and the second metal part 143 can respectively cover part of the bottom wall 133, the area covered by the first metal part 141 on the bottom wall 133 is the first extension area 141a, and the area covered by the second metal part 143 on the bottom wall 133 is the second extension area 143a.

[0053] Furthermore, the electronic component 50 can be embedded between the first extension area 141a and the second extension area 143a, and the first extension area 141a can directly contact the first electrical connection end 51, and the second extension area 143a can directly contact the second electrical connection end 53, thereby facilitating the rapid conduction and diffusion of the heat of the electronic component 50 directly through the first metal part 141 and the second metal part 143 to facilitate heat dissipation.

[0054] In some embodiments, see Figure 3The first extension area 141a can be clamped between the first electrical connection end 51 and the bottom wall 133, and the second extension area 143a can be clamped between the second electrical connection end 53 and the bottom wall 133, which is beneficial to increase the contact area between the first metal part 141 and the electronic component 50 and between the second metal part 143 and the electronic component 50, and further beneficial to the rapid conduction and diffusion of heat of the electronic component 50.

[0055] See also Figure 1 , Figure 2 and Figure 3 A first solder 61 is filled between the area where the first electrical connection end 51 and the first metal part 141 are disposed on the side wall 131, and the first solder 61 welds the first electrical connection end 51 and the first metal part 141. A second solder 63 is filled between the area where the second electrical connection end 53 and the second metal part 143 are disposed on the side wall 131, and the second solder 63 welds the second electrical connection end 53 and the second metal part 143.

[0056] The first solder 61 may be, but is not limited to, solder paste, and the second solder 63 may be, but is not limited to, solder paste.

[0057] In some embodiments, Figure 2 The first electrical connection end 51 and the second electrical connection end 53 are spaced apart and opposite to each other in the first direction Y, and the first direction Y is perpendicular to the thickness direction X. Further, in the second direction Z perpendicular to the thickness direction X and the first direction Y, the width of the first solder 61 may be greater than the width of the first electrical connection end 51, and the width of the second solder 63 may be greater than the width of the second electrical connection end 53, thereby facilitating the stability of the welding between the electronic component 50 and the circuit substrate 100a, and also facilitating the rapid conduction and diffusion of the heat of the electronic component 50 for heat dissipation.

[0058] In some embodiments, the side of the first solder 61 facing away from the bottom wall 133 can be flush with the side of the first electrical connection end 51 facing away from the bottom wall 133, and the side of the second solder 63 facing away from the bottom wall 133 can be flush with the side of the second electrical connection end 53 facing away from the bottom wall 133, thereby facilitating increasing the contact area between the electronic component 50 and the first metal part 141 and the second metal part 143 through the first solder 61 and the second solder 63, thereby facilitating rapid conduction and diffusion of heat from the electronic component 50 to facilitate heat dissipation.

[0059] In some embodiments, a plurality of the electronic components 50 may be disposed in the same blind hole 13, and the first electrical connection end 51 and the second electrical connection end 53 welded to any one of the electronic components 50 are independently arranged between the first electrical connection end 51 and the second electrical connection end 53 welded to any other one of the electronic components 50.

[0060] See also Figures 4 to 8 The present application also provides a method for manufacturing a circuit board with embedded components according to an embodiment of the present invention, which comprises the following steps:

[0061] Step S1, see Figure 4 and Figure 5 A circuit substrate 100b is provided. The circuit substrate 100b includes a first circuit layer 11 and a dielectric layer 12 stacked along a thickness direction X. The first circuit layer 11 is disposed on one side of the dielectric layer 12. The circuit substrate 100b also includes a blind hole 13 covered by a metal layer 14. The blind hole 13 penetrates the first circuit layer 11 and a portion of the dielectric layer 12. The metal layer 14 extends from the first circuit layer 11 along a side wall 131 of the blind hole 13 to a bottom wall 133 of the blind hole 13 to cover the side wall 131 and the bottom wall 133.

[0062] Specifically, the first circuit layer 11 includes a first circuit portion 111 and a second circuit portion 113. Preferably, the first circuit portion 111 and the second circuit portion 113 are relatively distributed on two sides of the blind hole 13 and are connected to the metal layer 14 respectively.

[0063] In this embodiment, the circuit substrate 100b may be a rigid-flexible board, and may include the first circuit layer 11, the second circuit layer 15, and the third circuit layer 16 stacked and spaced in sequence along the thickness direction X. The first circuit layer 11 is only provided in the rigid board area of ​​the circuit substrate 100b, and the second circuit layer 15 and the third circuit layer 16 are provided corresponding to the rigid board area and the flexible board area of ​​the circuit substrate 100b.

[0064] Step S2, see Figure 6 and Figure 7 , the metal layer 14 is processed so that the metal layer 14 is separated into a first metal portion 141 and a second metal portion 143 that are independently and spaced apart. The first metal portion 141 extends from the first circuit layer 11 along the side wall 131 of the blind hole 13 to the bottom wall 133 of the blind hole 13, and the second metal portion 143 extends from the first circuit layer 11 along the side wall 131 of the blind hole 13 to the bottom wall 133 of the blind hole 13, and at least one of the first metal portion 141 and the second metal portion 143 covers a portion of the bottom wall 133.

[0065] Specifically, the first metal portion 141 extends from the first circuit portion 111 , and the second metal portion 143 extends from the second circuit portion 113 .

[0066] In this embodiment, the first metal part 141 and the second metal part 143 can respectively cover part of the bottom wall 133, the area covered by the first metal part 141 on the bottom wall 133 is the first extension area 141a, and the area covered by the second metal part 143 on the bottom wall 133 is the second extension area 143a.

[0067] The metal layer 14 can be formed into the first metal part 141 and the second metal part 143 by methods such as, but not limited to, exposure and development, mechanical drilling, punching, and fixed depth molding.

[0068] Step S3, see Figure 8 and Figure 2 , an electronic component 50 with a first electrical connection terminal 51 and a second electrical connection terminal 53 is placed in the blind hole 13, and the first electrical connection terminal 51 and the first metal part 141 are welded by a first solder 61, and the second electrical connection terminal 53 and the second metal part 143 are welded by a second solder 63.

[0069] The first solder 61 may be, but is not limited to, solder paste, and the second solder 63 may be, but is not limited to, solder paste.

[0070] The first electrical connection end 51 and the second electrical connection end 53 are spaced apart and opposite to each other in the first direction Y, and the first direction Y is perpendicular to the thickness direction X. Further, in the second direction Z perpendicular to the thickness direction X and the first direction Y, the width of the first solder 61 may be greater than the width of the first electrical connection end 51, and the width of the second solder 63 may be greater than the width of the second electrical connection end 53, thereby facilitating the stability of the welding between the electronic component 50 and the circuit substrate 100a, and also facilitating the rapid conduction and diffusion of the heat of the electronic component 50 for heat dissipation.

[0071] The side of the first solder 61 facing away from the bottom wall 133 can be flush with the side of the first electrical connection end 51 facing away from the bottom wall 133, and the side of the second solder 63 facing away from the bottom wall 133 can be flush with the side of the second electrical connection end 53 facing away from the bottom wall 133, thereby facilitating increasing the contact area between the electronic component 50 and the first metal part 141 and the second metal part 143 through the first solder 61 and the second solder 63, thereby facilitating the rapid conduction and diffusion of the heat of the electronic component 50 to facilitate heat dissipation.

[0072] In some embodiments, Figure 8 As shown, the electronic component 50 can be embedded between the first extension area 141a and the second extension area 143a, and the first extension area 141a can directly contact the first electrical connection end 51, and the second extension area 143a can directly contact the second electrical connection end 53, thereby facilitating the rapid conduction and diffusion of the heat of the electronic component 50 directly through the first metal part 141 and the second metal part 143 to facilitate heat dissipation.

[0073] In other embodiments, Figure 3 As shown, the first extension area 141a can be clamped between the first electrical connection end 51 and the bottom wall 133, and the second extension area 143a can be clamped between the second electrical connection end 53 and the bottom wall 133, which is beneficial to increase the contact area between the first metal part 141 and the electronic component 50 and between the second metal part 143 and the electronic component 50, thereby facilitating the rapid conduction and diffusion of heat from the electronic component 50.

[0074] Taking a three-layer circuit layer rigid-flex board as the circuit substrate 100b as an example, the circuit substrate 100b can be manufactured by but not limited to the following methods, which may specifically include the following steps:

[0075] Step S11, see Fig. 9 , provide an insulating substrate A, and open an opening A1 passing through the insulating substrate A.

[0076] The insulating substrate A may be, but is not limited to, a polypropylene plate. The opening A1 may be formed by, but is not limited to, etching, punching, mechanical cutting, laser cutting, and the like.

[0077] Step S12, see Fig.10 A single-sided board B is provided, and a blind hole 13 is formed on the single-sided board B. The single-sided board B includes a stacked first metal foil 11a and a first dielectric layer 12a, and the blind hole penetrates the first metal foil 11a and a portion of the first dielectric layer 12a.

[0078] The blind hole 13 can be formed by, but not limited to, etching, punching, mechanical cutting, laser cutting, and the like.

[0079] Step S13, see Fig.11 , the single-sided board B with the blind hole 13 is electroplated to form a metal layer 14 covering the side wall 131 and the bottom wall 133 of the blind hole 13 .

[0080] Step S14, see Fig.12, a circuit substrate C is provided, wherein the circuit substrate C includes a hard board area C1 and a soft board area C2, and a covering film 81 is provided on one side of the soft board area C2.

[0081] Step S15, see Fig.13 and Fig.14 , the single-sided board B with the metal layer 14, the insulating substrate A with the opening A1, and the circuit substrate C are sequentially stacked and pressed together to form an intermediate structure D. The insulating substrate A is respectively combined with the side of the circuit substrate C provided with the cover film 81 and the side of the single-sided board B away from the first metal foil 11a, the opening A1 corresponds to the cover film 81, and the blind hole 13 corresponds to the hard board area C1.

[0082] Step S16, see Figure 4 , the intermediate structure D is wired so that the first metal foil forms a first wiring layer 11, and then the portion of the single-sided board B corresponding to the opening A1 is removed to expose the cover film 81. The first dielectric layer 12a, the insulating substrate A and the second dielectric layer 12b in the wiring substrate C are combined to form the dielectric layer 12.

[0083] Furthermore, the step S16 may also include performing solder masking to form a protective layer 83 after the circuit is manufactured.

[0084] The circuit board 100 with embedded components and the manufacturing method thereof of the present application, wherein the electronic component 50 is embedded in the blind hole 13, is conducive to reducing the thickness of the circuit board in the thickness direction X, and is further conducive to the thinning of the circuit board. The first electrical connection end 51 is welded to the first metal part 141, and the second electrical connection end 53 is welded to the second metal part 143, which not only realizes the electrical connection between the electronic component 50 and the circuit substrate 100a, but also can quickly conduct the heat of the electronic component 50 to other areas (for example, but not limited to the large area of ​​copper foil area of ​​the circuit board), which is conducive to heat dissipation. Furthermore, at least one of the first metal part 141 and the second metal part 143 covers a part of the bottom wall 133, which is also conducive to increasing the surface area of ​​the metal part arranged in the blind hole 13, so as to accelerate the heat dissipation of the electronic component 50.

[0085] The above is only the preferred implementation mode of the present application, and is not any form of limitation on the present application. Although the present application has been disclosed as the preferred implementation mode as above, it is not used to limit the present application. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent implementation modes without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above implementation modes based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A circuit board with embedded components, comprising a circuit substrate and electronic components, wherein the circuit substrate comprises a first circuit layer and a dielectric layer stacked in a thickness direction, characterized in that: The circuit substrate further includes a blind hole penetrating the first circuit layer and a portion of the dielectric layer, wherein a first metal portion and a second metal portion are provided in the blind hole at intervals, wherein the first metal portion extends from the first circuit layer along the side wall of the blind hole to the bottom wall of the blind hole, and the second metal portion extends from the first circuit layer along the side wall to the bottom wall, and at least one of the first metal portion and the second metal portion covers a portion of the bottom wall, and the electronic component is provided in the blind hole, and a first electrical connection end and a second electrical connection end are provided on the side wall of the electronic component at intervals, wherein the first electrical connection end is welded to the first metal portion, and the second electrical connection end is welded to the second metal portion.

2. The circuit board with embedded components as claimed in claim 1, characterized in that: The first metal part and the second metal part respectively cover a portion of the bottom wall. The area where the first metal part covers the bottom wall is a first extension area, and the area where the second metal part covers the bottom wall is a second extension area.

3. The circuit board with embedded components as claimed in claim 2, characterized in that: The electronic component is embedded between the first extension area and the second extension area, and the first extension area is directly in contact with the first electrical connection end, and the second extension area is directly in contact with the second electrical connection end.

4. The circuit board with embedded components as claimed in claim 2, characterized in that: The first extension area is sandwiched between the first electrical connection end and the bottom wall, and the second extension area is sandwiched between the second electrical connection end and the bottom wall.

5. The circuit board with embedded components as claimed in claim 1, characterized in that: The first electrical connection end and the first metal part provided on the side wall are welded by a first solder, and the second electrical connection end and the second metal part provided on the side wall are welded by a second solder. The first electrical connection end and the second electrical connection end are spaced apart and opposite to each other in a first direction perpendicular to the thickness direction, and in a second direction perpendicular to the thickness direction and the first direction, the width of the first solder is greater than the width of the first electrical connection end, and the width of the second solder is greater than the width of the second electrical connection end.

6. The circuit board with embedded components as claimed in claim 5, characterized in that: A side of the first solder facing away from the bottom wall is flush with a side of the first electrical connection end facing away from the bottom wall, and a side of the second solder facing away from the bottom wall is flush with a side of the second electrical connection end facing away from the bottom wall.

7. The circuit board with embedded components as claimed in claim 1, characterized in that: The first circuit layer includes a first circuit portion and a second circuit portion. The first metal portion extends from the first circuit portion, and the second metal portion extends from the second circuit portion.

8. A method for manufacturing a circuit board with embedded components, comprising the following steps: A circuit substrate is provided, comprising a first circuit layer and a dielectric layer stacked in a thickness direction, the circuit substrate further comprising a blind hole covered by a metal layer, the blind hole penetrating the first circuit layer and a portion of the dielectric layer, the metal layer extending from the first circuit layer along the side wall of the blind hole to the bottom wall of the blind hole to cover the side wall and the bottom wall; Processing the metal layer so that the metal layer is separated into a first metal portion and a second metal portion that are independent and spaced apart, wherein the first metal portion extends from the first circuit layer along the side wall to the bottom wall, and the second metal portion extends from the first circuit layer along the side wall to the bottom wall, and at least one of the first metal portion and the second metal portion covers a portion of the bottom wall; as well as An electronic component with a first electrical connection end and a second electrical connection end is placed in the blind hole, and the first electrical connection end and the first metal portion are welded, and the second electrical connection end and the second metal portion are welded.

9. The method for manufacturing a circuit board with embedded components as claimed in claim 8, characterized in that: The first metal part and the second metal part respectively cover a part of the bottom wall, the area where the first metal part covers the bottom wall is a first extension area, and the area where the second metal part covers the bottom wall is a second extension area; In the step of placing the electronic component in the blind hole, the electronic component is embedded between the first extension area and the second extension area, and the first extension area is directly in contact with the first electrical connection end, and the second extension area is directly in contact with the second electrical connection end.

10. The method for manufacturing a circuit board with embedded components as claimed in claim 8, characterized in that: The first metal part and the second metal part respectively cover a part of the bottom wall, the area where the first metal part covers the bottom wall is a first extension area, and the area where the second metal part covers the bottom wall is a second extension area; In the step of placing the electronic component in the blind hole, the first extension area is sandwiched between the first electrical connection end and the bottom wall, and the second extension area is sandwiched between the second electrical connection end and the bottom wall.

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