Manufacturing method of multilayer microwave circuit board with blind groove side wall local metal edge covering

Abstract

The invention discloses a manufacturing method of a multi-layer microwave circuit board with blind groove side wall local metal edge covering, and belongs to the technical field of multi-layer microwave circuit boards. Comprising the following steps: manufacturing an upper daughter board for forming a blind groove; a blind groove and a blind hole are pre-formed in the upper daughter board; local metal edge covering manufacturing is carried out on the side wall of the blind groove of the upper daughter board; carrying out pre-gold-plating treatment on the metal covered edge of the side wall of the blind groove of the upper sub-board; and pressing the main board, and forming through holes according to requirements after the main board is pressed. According to the method, the problem that a special structure of the multilayer microwave plate cannot be realized is solved, the multilayer microwave plate manufactured by the manufacturing method can realize shielding of microwave signals and has a good grounding effect, the process realizability is good, and reliable process implementation of a brand new circuit board with a special structure is realized.

Description

Technical Field

[0001] The invention relates to the technical field of multilayer microwave circuit boards, and in particular to a method for manufacturing a multilayer microwave circuit board with a blind slot side wall partially metal-wrapped. Background Art

[0002] Multilayer microwave circuit board is a complex electronic circuit board, which usually contains multiple circuit layers, and each layer of circuits is separated from each other by insulating materials. This circuit board design is mainly used to process high-frequency signals, such as microwave signals, with high signal transmission quality and stability.

[0003] When the bottom of the blind slot of the traditional multi-layer microwave board is all copper instead of a line design, the bottom of the blind slot does not contain a line, and the overall metal edging design of the blind slot side wall can be realized. The multi-layer microwave board with this structure has poor shielding of microwave signals and poor grounding effect. Summary of the invention

[0004] In order to solve the problems existing in the prior art, the purpose of the present invention is to provide a method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side walls of a blind slot, which can produce a multi-layer microwave circuit board containing a blind slot structure, a circuit design on the bottom of the blind slot, and partial metal edging on the side walls of the blind slot, so as to achieve shielding of microwave signals and good grounding effect.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A method for manufacturing a multilayer microwave circuit board with partial metal edging on the side wall of a blind slot, comprising the following steps:

[0007] Step A, making an upper sub-plate for opening a blind groove;

[0008] Step B, pre-opening blind grooves and blind holes on the upper sub-board;

[0009] Step C, performing partial metal edging on the side wall of the blind groove of the upper sub-board;

[0010] Step D, pre-gilding the metal edging of the blind slot sidewalls of the upper sub-board;

[0011] Step E, pressing the main plate, and after the main plate is pressed, opening through holes as required.

[0012] As a further solution of the present invention: in step A, a pressing process is adopted to realize the production of the upper sub-board.

[0013] As a further solution of the present invention: in step B, after pre-opening blind grooves and blind holes on the upper sub-board, the blind holes are metallized, and the overall metal edging of the upper sub-board side wall is achieved.

[0014] As a further solution of the present invention: in the production of the overall metal edging of the upper sub-board side wall, the edging copper thickness is ≥20μm.

[0015] As a further solution of the present invention: in step C, an alkaline etching process is used to perform partial metal edging on the side wall of the blind groove of the upper sub-board.

[0016] As a further solution of the present invention: in the process of performing partial metal edging on the side wall of the blind groove of the upper sub-plate, the vertical height of the non-metal edging is 50-80 μm.

[0017] As a further solution of the present invention: in step D, the metal edging of the blind slot sidewall of the upper sub-board is pre-gold plated with a gold plating thickness of 2-3 μm.

[0018] As a further solution of the present invention: in step E, when the main plate is pressed, a gasket is placed in the blind groove, and then the upper sub-plate and the lower sub-plate are pressed together, and after the main plate is pressed together, the gasket in the blind groove is removed.

[0019] As a further solution of the present invention: the size of the gasket placed in the blind groove is reduced by 0.05-0.15 mm relative to the overall size of the blind groove.

[0020] The present invention has the following beneficial effects:

[0021] For the multi-layer microwave board with circuits at the bottom of the blind slot, the side wall of the blind slot has a requirement for partial metal edging. The present invention proposes a new manufacturing method. The method solves the problem that the special structure of the multi-layer microwave board cannot be realized. The multi-layer microwave board manufactured by the manufacturing method of the present invention can achieve microwave signal shielding and good grounding effect, and the process feasibility is good, so as to achieve the reliable process realization of the new special structure circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a process flow chart of a method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to the present invention;

[0024] Figure 2 This is a schematic diagram of the laminated structure and partial metal edging of the blind slot side wall of a certain eight-layer microwave product;

[0025] Figure 3 yes Figure 2 Cross-sectional view of the partial metal edging of the blind slot side wall of the upper middle sub-plate. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] When the bottom of the blind slot of the traditional multi-layer microwave board is made of all copper instead of a circuit design, the bottom of the blind slot does not contain a circuit, and the overall metal edging design of the blind slot side wall can be realized. The multi-layer microwave board with this structure has poor shielding for microwave signals and poor grounding effect. For this reason, the present invention designs a multi-layer microwave board with a special structure, such as Figure 2 Take the stacking diagram of an eight-layer microwave board as an example. This multi-layer microwave board with a special structural design has a circuit design at the bottom of the blind slot, such as Figure 3 As shown, the local metal edging design of the blind groove side wall makes it impossible to manufacture the structural product using traditional technology.

[0028] In order to solve the above problems, the present invention proposes a new manufacturing method, which solves the problem that the special structure of multi-layer microwaves cannot be achieved, thereby producing a multi-layer microwave board with microwave signal shielding and good grounding effect.

[0029] See also Figure 1 The present invention provides a method for manufacturing a multi-layer microwave circuit board with a partial metal edging on the side wall of a blind slot, comprising the following steps:

[0030] Step A, making an upper sub-plate for opening a blind groove;

[0031] Step B, pre-opening blind grooves and blind holes on the upper sub-board;

[0032] Step C, performing partial metal edging on the side wall of the blind groove of the upper sub-board;

[0033] Step D, pre-gilding the metal edging of the blind slot sidewalls of the upper sub-board;

[0034] Step E, pressing the main plate, and after the main plate is pressed, opening through holes as required.

[0035] Specific process flow such as Figure 1 As shown, in step A, a pressing process is used to realize the production of the upper sub-board on the blind groove; then step B is performed to pre-open the blind groove and blind hole on the upper sub-board. After the blind groove and blind hole are pre-opened on the upper sub-board, the blind hole is metallized, and the overall metal edging of the side wall of the upper sub-board is realized, and the copper thickness of the edging is ≥20μm; then step C is performed to realize the production of partial metal edging of the side wall of the blind groove of the upper sub-board by alkaline etching, and the vertical height of the non-metal edging is 50-80μm, forming as shown in FIG. Figure 3 The blind groove side wall of the upper sub-board shown in the figure is partially metal-bound; then step D is performed to pre-gold-plate the blind groove side wall of the sub-board, and the gold plating thickness is 2-3μm; then step E is performed to press the main board, and after the main board is pressed, through holes are opened as required to form a Figure 1 The multi-layer microwave circuit board with special structure is shown.

[0036] It is worth noting that in step E, when the main board is pressed, a gasket needs to be placed in the blind groove, and then the upper sub-board and the lower sub-board are pressed together. A gasket is placed in the blind groove to achieve the blind groove glue resistance requirement, and the gasket size is reduced by 0.05-0.15mm relative to the overall groove size; the gasket is removed after the main board is pressed.

[0037] This method solves the problem that the special structure of the multi-layer microwave board cannot be achieved, realizes the shielding of microwave signals and a good grounding effect, and has good process feasibility, achieving reliable process implementation of a new special structure circuit board.

[0038] In the description of the present invention, it should be understood that terms such as "up", "down", "left", "right", "front" and "back" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation. Therefore, they should not be understood as limitations on the present invention.

[0039] The above is a detailed description of the preferred embodiments of the present invention, which cannot be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the present invention.

Claims

1. A method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot, characterized in that: The following steps are involved: Step A, making an upper sub-plate for opening a blind groove; Step B, pre-opening blind grooves and blind holes on the upper sub-board; Step C, performing partial metal edging on the side wall of the blind groove of the upper sub-board; Step D, pre-gilding the metal edging of the blind slot sidewalls of the upper sub-board; Step E, pressing the main plate, and after the main plate is pressed, opening through holes as required.

2. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 1, characterized in that: In step A, a pressing process is used to manufacture the upper sub-board.

3. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 1, characterized in that: In step B, after pre-opening blind grooves and blind holes on the upper sub-board, the blind holes are metallized, and the overall metal edging of the side wall of the upper sub-board is achieved.

4. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 3, characterized in that: In the production of the overall metal edging of the upper sub-board side wall, the edging copper thickness is ≥20μm.

5. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 1, characterized in that: In step C, an alkaline etching process is used to perform partial metal edging on the sidewalls of the blind groove of the upper sub-board.

6. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 5, characterized in that: In the process of making partial metal edging on the side wall of the blind groove of the upper sub-board, the vertical height of the non-metal edging is 50-80 μm.

7. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 1, characterized in that: In step D, the metal edging of the blind slot sidewall of the upper sub-board is pre-gilded, and the gold plating thickness is 2-3 μm.

8. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 1, characterized in that: In step E, when the main board is pressed, a gasket is placed in the blind groove, and then the upper sub-board and the lower sub-board are pressed together. After the main board is pressed together, the gasket in the blind groove is removed.

9. The method for manufacturing a multi-layer microwave circuit board with partial metal edging on the side wall of a blind slot according to claim 8, characterized in that: The size of the gasket placed in the blind groove is reduced by 0.05-0.15mm relative to the size of the blind groove.

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