Water-cooling shell radiator of electronic equipment

Abstract

The invention is applicable to the technical field of radiators, and provides a water-cooling shell radiator of electronic equipment, the water-cooling shell radiator comprises a water-cooling plate, a radiating upper cover, a connecting device and a water pump, and the top of the radiating upper cover is provided with a water injection hole, a water inlet hole and a water outlet hole which are communicated with a cavity formed in the radiating upper cover. According to the water-cooling shell radiator, the water-cooling plate, the heat dissipation upper cover, the connecting device and the water pump of the electronic equipment, internal circulation of water can be achieved through mutual cooperation, meanwhile, an independent fluid channel of a heat dissipation cavity is formed, no water-cooling connector exists in the equipment, the doubt of short circuit of the electronic equipment caused by liquid leakage is greatly reduced, and the service life of the electronic equipment is prolonged. And the water in the cavity can quickly diffuse heat to the radiating fins distributed on the cavity in an internal circulation manner, so that a quick radiating function is realized, the heat diffusion capability of the radiator is improved, the temperature of the chip is reduced, the chip can stably and continuously work, and the service life of the chip is prolonged.

Description

Technical Field

[0001] The invention belongs to the technical field of radiators, and in particular relates to a water-cooling housing radiator for electronic equipment. Background Art

[0002] In the next generation of network communication products or data center computing equipment, the heat generated by key chips is getting higher and higher. In order to improve the reliability of the equipment, the heat dissipation technology of high-end chips currently includes immersion cooling and water cooling. The compatibility of the working fluid used in immersion cooling with the various electronic components and transmission cables on the motherboard still needs a long time to verify. The concern that the liquid inside the water cooling kit will leak out and damage the electronic components has also been criticized.

[0003] At the same time, the heat dissipation technology of existing radiator products is to use the upper cover of the shell for natural convection heat dissipation. This heat dissipation method has a low cost, but the heat dissipation capacity is limited. The heat generated by the chip of the current network switch is getting higher and higher, which no longer meets the current high heat density heat dissipation requirements.

[0004] Therefore, in view of the above situation, it is urgent to develop a water-cooled housing radiator for electronic equipment to overcome the shortcomings in current practical applications. Summary of the invention

[0005] In view of the shortcomings of the prior art, an object of the embodiments of the present invention is to provide a water-cooling housing radiator for an electronic device to solve the problems in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A water-cooled housing radiator for an electronic device, comprising a water-cooling plate and a heat dissipation upper cover, wherein a cavity for storing water is provided inside the heat dissipation upper cover, the water-cooling plate is fixed to the bottom of the heat dissipation upper cover by brazing and the internal cavity is sealed, and a water injection hole, a water inlet hole and a water outlet hole are respectively provided on the top of the heat dissipation upper cover, wherein the water injection hole, the water inlet hole and the water outlet hole are all connected to the cavity inside the heat dissipation upper cover, and further comprising: A connecting device, the connecting device is fixed on the heat dissipation upper cover and is located above the water outlet, the connecting device is respectively provided with an installation groove and a connecting groove, the installation groove is connected with the connecting groove, the connecting groove is connected with the water outlet, screw holes are distributed on the installation groove, the screw holes and the installation groove are both used for installing a water pump, a connecting hole connected with the water inlet hole is provided on one side of the connecting groove, the input end of the water pump matches with the water outlet, and the output end of the water pump matches with the connecting hole; The heat generated by the chip when it is running is transferred to the water cooling plate, and the water cooling plate quickly transfers the heat to the cavity of the heat dissipation cover. The water pump draws the water inside the cavity into the connecting hole through the water outlet hole. The connecting hole transports the water to the water inlet hole and allows it to flow back into the cavity. The water in the cavity quickly diffuses the heat to the heat dissipation cover through internal circulation and realizes rapid heat dissipation of the radiator.

[0007] As a further technical solution of the present invention, the connecting device adopts a square block structure, the connecting device is connected to the heat dissipation cover as a whole by brazing, and the water pump is embedded in a mounting groove on the connecting device.

[0008] As a further technical solution of the present invention, a spoiler is arranged inside the heat dissipation upper cover, and the spoiler is used to disturb the water in the cavity.

[0009] As a further technical solution of the present invention, an adapter is installed on the water injection hole, the adapter is fixedly connected to the water injection hole by brazing, and a locking cover is screwed on the adapter, and the locking cover is used to lock the adapter.

[0010] As a further technical solution of the present invention, a water-blocking kit is installed at the connection between the adapter and the locking cover and at the connection between the connecting groove and the water pump. The water-blocking kit adopts an annular structure.

[0011] As a further technical solution of the present invention, heat dissipation fins are distributed on the heat dissipation upper cover, and the heat dissipation fins are used to quickly transfer heat from the heat dissipation upper cover to the air.

[0012] As a further technical solution of the present invention, a flow channel is provided in the water cooling plate, and the flow channel is integrally formed with the water cooling plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The radiator is located in the device casing as a whole, and the bottom of the water-cooling plate is in contact with the chip. When the chip is running, heat is generated, and the generated heat is transferred to the water-cooling plate. The water-cooling plate can quickly transfer the heat to the cavity of the heat dissipation cover. The water pump draws the water inside the cavity into the connecting hole through the water outlet hole. The connecting hole transports the water to the water inlet hole, allowing it to flow back into the cavity, thereby realizing the internal circulation of water. At the same time, an independent fluid channel for the heat dissipation cavity is also formed, so that there is no water-cooling joint inside the device, which greatly reduces the concern about short circuit of electronic equipment caused by leakage and improves the waterproof and dustproof effect of the equipment. The water in the cavity can quickly diffuse the heat to the heat dissipation fins distributed thereon through internal circulation, thereby realizing the function of rapid heat dissipation, improving the heat diffusion capacity of the radiator, and reducing the temperature of the chip, so that it can work stably and continuously, and extending its service life.

[0014] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The present invention is a schematic diagram of the installation of a water-cooling housing radiator for an electronic device provided by an embodiment of the present invention.

[0016] Figure 2 A top view of the structure of a water-cooling housing radiator for an electronic device provided by an embodiment of the present invention.

[0017] Figure 3 A structural stereogram of a water-cooling housing radiator for an electronic device provided by an embodiment of the present invention.

[0018] Figure 4 for Figure 2 Enlarged view of the structure of the connecting device.

[0019] Figure markings: 1-chip, 2-main board, 3-device housing, 4-connecting device, 41-installation groove, 42-screw hole, 43-connecting groove, 44-connecting hole, 5-water cooling plate, 6-heat dissipation cover, 7-heat dissipation fins, 8-water injection hole, 9-adapter, 10-locking cover, 11-water blocking kit, 12-water outlet hole. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0021] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0022] like Figures 1 to 4 As shown, as an embodiment of the present invention, a water-cooled housing radiator of an electronic device includes a water-cooled plate 5 and a heat dissipation upper cover 6, wherein a cavity for storing water is provided inside the heat dissipation upper cover 6, the water-cooled plate 5 is fixed to the bottom of the heat dissipation upper cover 6 by brazing and the internal cavity is sealed, and a water injection hole 8, a water inlet hole and a water outlet hole 12 are respectively provided on the top of the heat dissipation upper cover 6, wherein the water injection hole 8, the water inlet hole and the water outlet hole 12 are all connected to the cavity inside the heat dissipation upper cover 6, and further includes: A connecting device 4, the connecting device 4 is fixed on the heat dissipation upper cover 6 and is located above the water outlet 12, and a mounting groove 41 and a connecting groove 43 are respectively provided on the connecting device 4, the mounting groove 41 is connected to the connecting groove 43, and the connecting groove 43 is connected to the water outlet 12, and screw holes 42 are distributed on the mounting groove 41, and the screw holes 42 and the mounting groove 41 are both used for installing a water supply pump, and a connecting hole 44 connected to the water inlet hole is provided on one side of the connecting groove 43, the input end of the water pump cooperates with the water outlet 12, and the output end of the water pump cooperates with the connecting hole 44; The radiator is located in the device housing 3 as a whole, and the bottom of the water-cooling plate 5 is in conflict with the chip 1. The chip 1 is provided with a mainboard 2 connected thereto. The chip 1 includes heat-generating electronic components such as a computing chip 1, a power electronic conversion module or a communication chip 1. When the chip 1 is running, heat is generated, and the generated heat is transferred to the water-cooling plate 5. The water-cooling plate 5 can quickly transfer the heat to the cavity of the heat dissipation cover 6. The water pump draws the water inside the cavity into the connecting hole 44 through the water outlet hole 12. The connecting hole 44 transports the water to the water inlet hole and allows it to flow back into the cavity, thereby realizing the internal circulation of the water. At the same time, an independent fluid channel of the heat dissipation cavity is also formed, so that there is no water-cooling joint inside the device, which greatly reduces the doubts about short circuit of the electronic equipment caused by leakage, and improves the waterproof and dustproof effect of the device. The water in the cavity can quickly diffuse the heat to the heat dissipation cover 6 through the internal circulation method, thereby realizing the function of rapid heat dissipation, improving the heat diffusion capacity of the radiator, reducing the temperature of the chip 1, so that it can work stably and continuously, and extending its service life.

[0023] like Figures 1 to 4 As shown, as a preferred embodiment of the present invention, the connecting device 4 preferably adopts a square block structure, the connecting device 4 is connected to the heat dissipation cover 6 as a whole by brazing, and the water pump is embedded in the installation groove 41 on the connecting device 4, which is easy to assemble and greatly improves the heat dissipation capacity of the radiator.

[0024] like Figures 1 to 3 As shown, as a preferred embodiment of the present invention, a spoiler is arranged inside the heat dissipation upper cover 6, and the spoiler is used to disturb the water in the cavity, aiming to effectively promote the water flow in the cavity to form a turbulent state, that is, to improve the heat exchange performance by increasing the mixing of the fluid, thereby improving the heat exchange efficiency of the radiator.

[0025] like Figures 1 to 3As shown, as a preferred embodiment of the present invention, an adapter 9 is installed on the water injection hole 8, and the adapter 9 is fixedly connected to the water injection hole 8 by brazing, and a locking cover 10 is screwed on the adapter 9, and the locking cover 10 is used to lock the adapter 9, thereby locking the water injection hole 8, and further blocking the water inside the cavity, so as to achieve the effect of waterproofing and dustproofing the entire equipment, and greatly reduce the concern that leakage will cause a short circuit in the electronic equipment.

[0026] like Figures 1 to 3 As shown, as a preferred embodiment of the present invention, a water-blocking kit 11 is installed at the connection between the adapter 9 and the locking cover 10 and at the connection between the connecting groove 43 and the water pump. The water-blocking kit 11 preferably adopts an annular structure, which can block the water in the cavity of the heat dissipation cover 6, improve the waterproof and dustproof effect of the overall equipment, and greatly reduce the concern that leakage will cause a short circuit in the electronic equipment.

[0027] like Figures 1 to 3 As shown, as a preferred embodiment of the present invention, the heat dissipation upper cover 6 is provided with heat dissipation fins 7, and the heat dissipation fins 7 can increase the surface area of ​​the radiator, help to more effectively transfer heat from the heat source to the air, prevent heat accumulation from damaging the equipment, and thus improve the heat dissipation efficiency.

[0028] like Figures 1 to 3 As shown, as a preferred embodiment of the present invention, a flow channel is provided in the water cooling plate 5 , and the flow channel is integrally formed with the water cooling plate 5 .

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A water-cooled housing radiator for an electronic device, comprising a water-cooling plate and a heat dissipation upper cover, wherein a cavity for storing water is provided inside the heat dissipation upper cover, wherein the water-cooling plate is fixed to the bottom of the heat dissipation upper cover by brazing and its internal cavity is sealed, wherein a water injection hole, a water inlet hole and a water outlet hole are respectively provided on the top of the heat dissipation upper cover, wherein the water injection hole, the water inlet hole and the water outlet hole are all connected to the cavity inside the heat dissipation upper cover, wherein: Also includes: A connecting device, the connecting device is fixed on the heat dissipation upper cover and is located above the water outlet, the connecting device is respectively provided with an installation groove and a connecting groove, the installation groove is connected with the connecting groove, the connecting groove is connected with the water outlet, screw holes are distributed on the installation groove, the screw holes and the installation groove are both used for installing a water pump, a connecting hole connected with the water inlet hole is provided on one side of the connecting groove, the input end of the water pump matches with the water outlet, and the output end of the water pump matches with the connecting hole; The heat generated by the chip when it is running is transferred to the water cooling plate, and the water cooling plate quickly transfers the heat to the cavity of the heat dissipation cover. The water pump draws the water inside the cavity into the connecting hole through the water outlet hole. The connecting hole transports the water to the water inlet hole and allows it to flow back into the cavity. The water in the cavity quickly diffuses the heat to the heat dissipation cover through internal circulation and realizes rapid heat dissipation of the radiator.

2. The water-cooling housing radiator of electronic equipment according to claim 1, characterized in that: The connecting device adopts a square block structure, and the connecting device is connected to the heat dissipation upper cover as a whole by brazing, and the water pump is embedded in the installation groove on the connecting device.

3. The water-cooling housing radiator of electronic equipment according to claim 1, characterized in that: A spoiler is arranged inside the heat dissipation upper cover, and the spoiler is used to disturb the water in the cavity.

4. The water-cooling housing radiator of electronic equipment according to claim 1, characterized in that: An adapter is installed on the water injection hole, and the adapter is fixedly connected to the water injection hole by brazing. A locking cover is screwed on the adapter, and the locking cover is used to lock the adapter.

5. The water-cooling housing radiator of electronic equipment according to claim 4, characterized in that: A water-blocking kit is installed at the connection between the adapter and the locking cover and at the connection between the connecting groove and the water pump. The water-blocking kit adopts an annular structure.

6. The water-cooling housing radiator of electronic equipment according to claim 1, characterized in that: The heat dissipation upper cover is provided with heat dissipation fins, and the heat dissipation fins are used to quickly transfer heat from the heat dissipation upper cover to the air.

7. The water-cooling housing radiator of electronic equipment according to claim 1, characterized in that: A flow channel is arranged in the water cooling plate, and the flow channel is integrally formed with the water cooling plate.

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