Electronic device including thermal diffusion member

Abstract

An electronic device according to one embodiment of the present disclosure comprises: a housing; the display is arranged on the shell; a printed circuit board disposed in an interior of the housing; a battery including a first region and a second region having a thickness smaller than that of the first region; and a thermal diffusion member disposed between the printed circuit board and the display and between the battery and the display, in which the thermal diffusion member may include a first diffusion region and a second diffusion region extending to overlap at least a portion of the first diffusion region.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a heat diffusion member. Background Art

[0002] An electronic device (eg, a portable electronic device) may include a structure for heat diffusion therein. For example, the electronic device may use a heat diffusion member to diffuse heat generated by a printed circuit board to an area where a battery is located.

[0003] The heat diffusion member may be disposed between internal components of the electronic device. For example, the heat diffusion member may be disposed to extend between the printed circuit board and the display and between the battery and the display with a predetermined thickness. Summary of the invention

[0004] Technical issues

[0005] Due to the miniaturization of electronic devices, the electronic devices may include only a heat diffusion member having a predetermined thickness. However, the heat diffusion member having the predetermined thickness may not be sufficient to improve the heat diffusion performance of the electronic device.

[0006] Therefore, a heat spreading structure that can improve the heat spreading performance of an electronic device may be needed.

[0007] Solution to the problem

[0008] An electronic device according to an embodiment of the present disclosure may include: a housing; a display arranged on one surface of the housing; a printed circuit board arranged in an interior of the housing; a battery, which is arranged in one direction of the printed circuit board in the interior of the housing and includes a first area and a second area having a second thickness smaller than that of the first area and formed at an end facing the printed circuit board; and a heat diffusion member arranged between the printed circuit board and the display and between the battery and the display, wherein the heat diffusion member may include: a first diffusion region, at least a portion of which is arranged to overlap with the printed circuit board and at least a portion of which extends to be arranged in the first area of ​​the battery; and a second diffusion region, which is arranged between the second area of ​​the battery and the first diffusion region and extends to overlap with at least a portion of the second area.

[0009] An electronic device according to an embodiment of the present disclosure may include: a housing; a display arranged on one surface of the housing; a printed circuit board arranged in an interior of the housing; a battery, which is arranged in the interior of the housing in one direction of the printed circuit board and includes a first area and a second area having a thickness smaller than that of the first area and formed at an end facing the printed circuit board; and a heat diffusion member, which is arranged between the printed circuit board and the display and between the battery and the display, wherein the heat diffusion member may include: a first diffusion region, at least a portion of which is arranged to overlap with the printed circuit board and at least a portion of which extends to be arranged in the first area of ​​the battery; and a second diffusion region, which extends between the second area of ​​the battery and the first diffusion region in a direction perpendicular to the direction in which the first diffusion region extends and overlaps with at least a portion of the second area.

[0010] Advantageous Effects of the Invention

[0011] The electronic device according to an embodiment of the present disclosure may enhance the heat diffusion performance of the electronic device by including an additional heat diffusion member disposed in a protection circuit module (PCM) region of a battery.

[0012] The electronic device according to the embodiment of the present disclosure may enhance the heat diffusion performance of the electronic device by including an additional heat diffusion member at least a portion of which extends in a height direction of the electronic device.

[0013] The electronic device according to the embodiment of the present disclosure may enhance the rigidity of the electronic device by including a support area in which at least a portion of the heat diffusion member is disposed.

[0014] The electronic device according to an embodiment of the present disclosure may extend the battery in a direction where a camera and a printed circuit board are located by utilizing a protection circuit module (PCM) area of ​​the battery as a space in which a flexible printed circuit board is disposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a block diagram of an electronic device in a networking environment according to an embodiment.

[0016] Figure 2a and Figure 2b is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0017] Figure 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0018] Figure 4a , Figure 4b , Figure 4c and Figure 4d is a diagram illustrating a case, a battery, a heat diffusion member, and a flexible printed circuit board according to an embodiment of the present disclosure.

[0019] Figure 5 is a diagram illustrating a battery and a heat diffusion member provided in a case according to an embodiment of the present disclosure.

[0020] Figure 6a and Figure 6b is from Figure 5 FIG. 1 is a diagram of an electronic device observed along the AA′ cross section shown in FIG.

[0021] Figure 7 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0022] Figure 8 is a diagram illustrating a heat diffusion member according to an embodiment of the present disclosure.

[0023] Fig. 9 is a diagram illustrating a housing according to an embodiment of the present disclosure.

[0024] Fig.10 is a diagram illustrating a support area of ​​a housing according to an embodiment of the present disclosure.

[0025] Fig.11 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0026] Fig.12 is a diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0027] Fig.13 is a cross-sectional perspective view of an electronic device according to an embodiment of the present disclosure.

[0028] Fig.14a and Fig.14b 2 are front and rear views of an unfolded electronic device according to an embodiment of the present disclosure.

[0029] Fig.15a and Fig.15b 2 are front and rear views of a foldable electronic device according to an embodiment of the present disclosure.

[0030] Fig.16 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0031] Fig.17a , Fig.17b and Fig.17c 2 is a view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.

[0032] Fig.18a is a perspective view illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0033] Fig.18bis a perspective view illustrating an intermediate state of an electronic device according to an embodiment of the present disclosure.

[0034] Fig.19 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0036] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0037] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0038] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0039] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0040] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0041] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0042] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0043] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0044] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0045] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0046] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0048] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0049] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0052] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0053] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0054] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0055] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0056] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0057] Figure 2a is a perspective view of a front surface of an electronic device 200 according to an embodiment of the present disclosure. Figure 2b According to the embodiment of the present disclosure Figure 2a 2 is a perspective view of a rear surface of the electronic device 200.

[0058] Figure 2a and Figure 2b The electronic device 200 may be at least partially similar to Figure 1 The electronic device 101 may include other embodiments of the electronic device.

[0059] refer to Figure 2a and Figure 2b According to an embodiment, the electronic device 200 may include a housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In an embodiment, the housing 210 may refer to a housing formed Figure 2a The structure of a portion of the first surface 210A, the second surface 210B and the side surface 210C. According to an embodiment, the first surface 210A can be formed by a front plate 202 that is at least partially transparent (e.g., a glass plate or a polymer plate including various coatings). The second surface 210B can be formed by a substantially opaque rear plate 211. The rear plate 211 can be formed by, for example, coated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the above materials. The side surface 210C can be coupled to the front plate 202 and the rear plate 211 and can be formed by a side frame structure 218 (or "side member") including a metal and / or a polymer. In some embodiments, the rear plate 211 and the side frame structure 218 can be formed as one piece and can include the same material (e.g., a metal material such as aluminum).

[0060] In the illustrated embodiment, the front plate 202 may include a first region 210D extending seamlessly, the first region 210D being bent from the first surface 210a to the rear plate 211 to include both ends of the long edge of the front plate 202. Figure 2b ), the back plate 211 may include a second area 210E that is bent from the second surface 210B to the front plate 202 and extends seamlessly. In some embodiments, the front plate 202 or the back plate 211 may include only one of the first area 210D or the second area 210E. In some embodiments, the front plate 202 may not include the first area and the second area, but may only include a plane parallel to the second surface 210B. In an embodiment, when viewed from the side of the electronic device, the side frame structure 218 may have a first thickness (or width) on a side surface that does not include the above-mentioned first area 210D or the second area 210E, and may have a second thickness that is thinner than the first thickness on a side surface that includes the first area 210D or the second area 210E.

[0061] According to an embodiment, the electronic device 200 may include at least one of a display 201, an input device 203, sound output devices 207 and 214, sensor modules 204 and 219, camera modules 205 and 212, a key input device 217, an indicator, and a connector 208. In some embodiments, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the indicator), or may additionally include other components.

[0062] According to an embodiment, the display 201 may be exposed, for example, through a large portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be exposed through the first surface 210A and the front plate 202 forming the first region 210D of the side surface 210C. The display 201 may be provided in combination or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (e.g., pressure), and / or a digitizer that detects a magnetic field type stylus. In some embodiments, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be provided in the first region 210D and / or the second region 210E.

[0063] The input device 203 may include a microphone 203. In some embodiments, the input device 203 may include a plurality of microphones 203 configured to sense the direction of sound. The sound output devices 207 and 214 may include speakers 207 and 214. The speakers 207 and 214 may include an external speaker 207 and a call receiver 214. In some embodiments, the microphone 203, the speakers 207 and 214, and the connector 208 may be disposed in a space above the electronic device 200 and may be exposed to the external environment through at least one hole formed in the housing 210. In some embodiments, the hole formed in the housing 210 may be used in common for the microphone 203 and the speakers 207 and 214. In some embodiments, the sound output devices 207 and 214 may include a speaker (e.g., a piezoelectric speaker) that operates when the hole formed in the housing 210 is not included.

[0064] The sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204 and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210 and / or a third sensor module 219 (e.g., an HRM sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A (e.g., a home key button), a partial area of ​​the second surface 210B of the housing 210 and / or below the display 201. The electronic device 200 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0065] The camera modules 205 and 212 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, a second camera device 212 disposed on a second surface 210B, and / or a flash 213. The camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 200.

[0066] The key input device 217 may be provided on the side surface 210C of the housing 210. In an embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in another form (such as a soft key) on the display 201. In an embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0067] An indicator (not shown) may be provided, for example, on the first surface 210A of the housing 210. The indicator may provide, for example, in an optical form (e.g., a light emitting element) status information of the electronic device 200. In an embodiment, the light emitting element may provide a light source that interacts with, for example, the operation of the camera module 205. The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0068] The connector holes 208 may include a first connector hole that accommodates a connector (e.g., a universal serial bus (USB) connector) for transmitting power and / or data to and receiving power and / or data from an external electronic device, and / or a second connector hole (or headphone jack) (not shown) that accommodates a connector that transmits audio signals to and receives audio signals from an external electronic device.

[0069] Some of the camera modules 205 and 212, some of the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged so that it can contact the external environment through an opening of the transmission area of ​​the front plate 202 or the display perforated in the internal space of the electronic device 200. According to an embodiment, the area facing the display 201 and the camera module 205 may be formed as a transmission area with a certain transmittance as part of the area where the content is displayed. According to an embodiment, the transmission area may be formed to have a transmittance in the range of about 5% to 20%. The transmission area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module 205, through which light passes to generate an image using an image sensor. For example, the transmission area of ​​the display 201 may include an area having a lower pixel density than the surrounding area. For example, the transmission area may replace the opening. For example, the camera module 205 may include an under-display camera (UDC). In an embodiment, some sensor modules 204 may be arranged to perform their functions in the internal space of the electronic device 200 without being visually exposed through the front plate 202. For example, in this case, the area of ​​the display 201 facing the sensor modules 204 may not require a perforated opening.

[0070] Figure 3 is an exploded perspective view of an electronic device 300 according to an embodiment of the present disclosure.

[0071] Figure 3 The electronic device 300 shown in FIG. Figure 1 The electronic device 101 may include Figure 1 at least a portion of the electronic device 101.

[0072] Figure 3 The electronic device 300 shown in FIG. 2 may refer to the electronic device 200 of FIG. 2 , or may include at least a portion of the electronic device 200 of FIG. 2 .

[0073] When describing the electronic device 300 according to an embodiment of the present disclosure, the width direction of the electronic device 300 may represent the x-axis direction, the length direction of the electronic device 300 may represent the y-axis direction, and the height direction of the electronic device 300 may represent the z-axis direction.

[0074] The electronic device 300 according to an embodiment of the present disclosure may include a housing 310 , a display 320 , a battery 330 , a heat diffusion member 340 , a rear surface cover 350 , and / or a printed circuit board 380 .

[0075] In an embodiment, the housing 310 may form the exterior of the electronic device 300. Figure 3, the housing 310 may include a space within which different configurations of the electronic device 300 may be disposed.

[0076] In an embodiment, components of the electronic device 300 may be disposed in the housing 310. For example, the display 320, the battery 330, the heat diffusion member 340, the rear surface cover 350, and the printed circuit board 380 may be disposed in the housing 310.

[0077] In an embodiment, the battery 330 may provide power to at least one component of the electronic device 300 .

[0078] In an embodiment, the display 320 may be provided on one surface of the housing 310. The rear surface cover 350 according to an embodiment may be provided on another surface which is an opposite surface of the one surface of the housing 310.

[0079] In an embodiment, the rear surface cover 350 may include a decoration 351. The decoration 351 may be configured to cover at least a portion of the camera module 180 (see Figure 1 ).

[0080] In an embodiment, the heat diffusion member 340 may be disposed between the battery 330, the printed circuit board 380, and the display 320. For example, the heat diffusion member 340 may be disposed in a direction away from the display 320 toward the inside of the electronic device 300 (eg, a negative z-axis direction).

[0081] In an embodiment, the heat diffusion member 340 may be used to diffuse the heat generated by the heat source to other areas. For example, the heat diffusion member 340 may diffuse the heat generated by the printed circuit board 380 to other areas of the electronic device 300. The heat diffusion member 340 according to an embodiment may have one end in contact with the printed circuit board 380 and the other end in contact with the battery 330.

[0082] In order to improve the heat diffusion performance of the heat diffusion member 340, the heat diffusion member 340 may be extended to have a non-curved plane. For example, the heat diffusion member 340 may be extended so that at least a portion of the heat diffusion member 340 has a plane substantially perpendicular to the height direction of the electronic device 300. Since the display 320 has a plane substantially perpendicular to the height direction of the electronic device 300, the heat diffusion member 340 may be disposed on one surface of the display 320 (e.g., a surface facing the negative z-axis direction from the display 320).

[0083] In an embodiment, the heat diffusion member 340 may include a planar shape and may be disposed on one surface of the display 320 extending into a plane. The heat diffusion member 340 according to an embodiment may include a planar shape, which may make manufacturing of the heat diffusion member 340 easier.

[0084] Figure 4a , Figure 4b , Figure 4c and Figure 4d is a diagram illustrating a case 310 , a battery 330 , a heat diffusion member 340 , and a flexible printed circuit board 360 according to an embodiment of the present disclosure.

[0085] Figure 4a is a diagram showing a housing 310 according to an embodiment. Figure 4b is a diagram illustrating a heat diffusion member 340 according to an embodiment. Figure 4c is a diagram showing a battery 330 according to an embodiment. Figure 4d is a diagram illustrating a flexible printed circuit board 360 according to an embodiment.

[0086] refer to Figure 4a , the housing 310 according to the embodiment may include a first space 311, a second space 312 and / or a placement space 317. Different configurations of the electronic device 300 may be disposed in the first space 311 and the second space 312 of the housing 310.

[0087] In an embodiment, the placement space 317 of the housing 310 may be a space where at least a portion of the heat diffusion member 340 is located. The placement space 317 may be formed in a shape corresponding to at least a portion of the heat diffusion member 340.

[0088] refer to Figure 4b , the heat diffusion member 340 according to the embodiment may include a first diffusion region 341 and / or a second diffusion region 342 .

[0089] In an embodiment, the first diffusion region 341 may be bent and extended in at least a portion. For example, the first diffusion region 341 may extend in the length direction of the electronic device 300 and then bend and extend in at least a portion in the width direction (e.g., x-axis direction) of the electronic device 300. In an embodiment, the first diffusion region 341 may include a vapor chamber, a heat pipe, and / or a heat sink.

[0090] In an embodiment, the second diffusion region 342 may extend in a direction substantially perpendicular to the first diffusion region 341. For example, the second diffusion region 342 may extend along a width direction (eg, an x-axis direction) of the electronic device 300. In an embodiment, the second diffusion region 342 may include a vapor chamber, a heat pipe, and / or a heat sink.

[0091] refer to Figure 4c , the battery 330 according to the embodiment may include a first region 331 , a second region 332 and / or a connection region 333 .

[0092] In an embodiment, the first region 331 may be a region where cells of the battery 330 are located. The second region 332 may be a region where a protection circuit module (PCM) of the battery 330 is located. For example, the second region 332 may be a region where a protection element (e.g., a protection IC and / or MOSFET) is disposed to protect the battery 330 by cutting off or reducing overcharge, overdischarge, and / or overcurrent in the battery 330.

[0093] In an embodiment, the second region 332 may be disposed at an end of the first region 331. The end of the first region 331 may refer to an end located in the positive y-axis direction of the first region 331. The second region 332 may extend from the end of the first region 331 in the width direction (e.g., x-axis direction) of the electronic device 300.

[0094] In an embodiment, the second diffusion region 342 of the heat diffusion member 340 may extend along a direction in which the second region 332 of the battery 330 extends. The second diffusion region 342 of the heat diffusion member 340 may be disposed to overlap with at least a portion of the second region 332 of the battery 330. For example, the second diffusion region 342 of the heat diffusion member 340 may be disposed to overlap with at least a portion of a protection element (e.g., a protection IC and / or a MOSFET) for protecting the battery 330.

[0095] In an embodiment, the battery 330 may be electrically connected to the printed circuit board 380 at the connection region 333. The connection region 333 may be a region extending at least partially in a length direction (eg, y-axis direction) with respect to the battery 330.

[0096] Figure 4d is a diagram illustrating a flexible printed circuit board 360 according to an embodiment of the present disclosure.

[0097] The electronic device 300 according to the embodiment may include at least one flexible printed circuit board 360. The flexible printed circuit board 360 may include a first flexible printed circuit board 361 and / or a second flexible printed circuit board 362.

[0098] In an embodiment, the flexible printed circuit board 360 may be used to electrically connect the printed circuit board 380 and other components of the electronic device 300. For example, the first flexible printed circuit board 361 may be electrically connected to an antenna (eg, Figure 1 The second flexible printed circuit board 362 can be electrically connected to the display module (eg, Figure 1 The display module 160) and the printed circuit board 380.

[0099] In an embodiment, the flexible printed circuit board 360 may be bent and extended in at least a portion. For example, the flexible printed circuit board 360 may extend in the length direction (e.g., y-axis direction) of the electronic device 300, and then bend at at least a portion and extend in the width direction (e.g., x-axis direction) of the electronic device 300.

[0100] Figure 5 is a diagram illustrating a battery 330 and a heat diffusion member 340 provided in a housing 310 according to an embodiment of the present disclosure.

[0101] Figure 5 It may be a diagram showing the housing 310 , the battery 330 , and the heat diffusion member 340 in the electronic device 300 according to the embodiment, with other configurations omitted.

[0102] refer to Figure 5 The flexible printed circuit board 360 may extend along a length direction (eg, y-axis direction) of the electronic device 300 , and then be bent at at least a portion and extend along a width direction (eg, x-axis direction) of the electronic device 300 .

[0103] Figure 5 is a diagram illustrating a battery 330 and a heat diffusion member 340 provided in a housing 310 according to an embodiment of the present disclosure, in which other configurations are omitted.

[0104] refer to Figure 5 , the battery 330 and the heat diffusion member 340 according to the embodiment may be disposed in the housing 310 .

[0105] In an embodiment, the heat diffusion member 340 may be disposed such that at least a portion of the heat diffusion member 340 overlaps the battery 330. For example, the heat diffusion member 340 may overlap at least a portion of the second region 332 and the first region 331 of the battery 330.

[0106] Figure 6a and Figure 6b It is shown from Figure 5 FIG. 4 is a diagram of the electronic device 300 viewed along the AA′ cross section shown in FIG.

[0107] Figure 6a is a diagram illustrating a battery 330 and a heat diffusion member 340 according to an embodiment. Figure 6b is a diagram illustrating a battery 330 , a heat diffusion member 340 , and a flexible printed circuit board 360 according to an embodiment.

[0108] In an embodiment, the first diffusion region 341 of the heat diffusion member 340 may extend in a length direction (eg, y-axis direction) of the electronic device 300. The second diffusion region 342 and the battery 330 may be disposed in one direction (eg, negative z-axis direction) of the first diffusion region 341.

[0109] In an embodiment, the first diffusion region 341 may extend so that at least a portion is overlapped with the printed circuit board 380 and at least a portion is disposed in the first region 331 of the battery 330. For example, one end of the first diffusion region 341 may be overlapped with the printed circuit board 380, and the second end may be disposed in the first region 331 of the battery 330. One end of the first diffusion region 341 may refer to an end of the first diffusion region 341 located in the positive y-axis direction, and the other end of the first diffusion region 341 may refer to an end of the first diffusion region 341 located in the negative y-axis direction.

[0110] In an embodiment, the second diffusion region 342 of the heat diffusion member 340 may be disposed at a position overlapping with the second region 332 of the battery 330. Figure 6a and Figure 6b , the second region 332 of the battery 330 may be disposed in a height direction (eg, a negative z-axis direction) relative to the second diffusion region 342 .

[0111] In an embodiment, at least a portion of the battery 330 may have a different thickness from the remaining portion. The thickness of the battery 330 may refer to the length of the battery 330 extending in the height direction (e.g., z-axis direction) of the electronic device 300. The thickness of the second region 332 of the battery 330 may be formed to be thinner than the thickness of the first region 331 of the battery 330.

[0112] In an embodiment, the second diffusion region 342 may be positioned between the first diffusion region 341 and the second region 332 of the battery 330. The battery 330 may be formed such that the thickness of the second region 332 is thinner than that of the first region 331, thereby providing space for the second diffusion region 342 of the heat diffusion member 340 to be disposed.

[0113] In an embodiment, the printed circuit board 380 can be positioned in one direction of the battery 330. For example, referring to Figure 6a and Figure 6b , the printed circuit board 380 can be positioned relative to the battery 330 in the positive y-axis direction.

[0114] In an embodiment, the housing 310 (see Figure 4a) may include a support region 315. The support region 315 may be a structure formed by extending the housing 310 to surround at least a portion of the second diffusion region 342. The second diffusion region 342 according to an embodiment may be disposed in the support region 315.

[0115] In an embodiment, the support region 315 may include a first support region 3151, a second support region 3152, and / or a third support region 3153. The first support region 3151 may extend in a direction substantially perpendicular to the second support region 3152 and the third support region 3153.

[0116] In an embodiment, two second support regions 3152 may be formed. For example, the second support region 3152 may include a second-1 support region 3152-1 and / or a second-2 support region 3152-2. The second-1 support region 3152-1 may extend on one side of the first support region 3151 in a direction substantially perpendicular to the first support region 3151. The second support region 3152-2 may extend on the other side of the first support region 3151 in a direction substantially perpendicular to the first support region 3151.

[0117] In an embodiment, the second-1 supporting region 3152-1 may be positioned in one direction (e.g., the positive y-axis direction) of the second diffusion region 342 and may support the second diffusion region 342. The second-2 supporting region 3152-2 may be positioned in another direction (e.g., the negative y-axis direction) of the second diffusion region 342 and may support the second diffusion region 342.

[0118] refer to Figure 6a and Figure 6b According to an embodiment, the first support region 3151 may be disposed between the second diffusion region 342 and the second region 332 of the battery 330. The second support region 3152 may be disposed on one side and the other side of the second diffusion region 342.

[0119] In an embodiment, the second diffusion region 342 of the heat diffusion member 340 may be supported by the first support region 3151 and the second support region 3152 to be maintained at a predetermined position within the electronic device 300 .

[0120] In an embodiment, the third support region 3153 may be positioned in one direction of the battery 330. For example, the third support region 3153 may be an extension in the opposite direction of the second support region 3152, and may be positioned in the positive y-axis direction relative to the second region 332 of the battery 330. The third support region 3153 may be disposed to face the second region 332 of the battery 330.

[0121] In an embodiment, the battery 330 may be supported by the first supporting region 3151 , the second supporting region 3152 , and the third supporting region 3153 to be maintained at a predetermined position within the electronic device 300 .

[0122] The electronic device 300 according to the embodiment may include at least one flexible printed circuit board 360. The flexible printed circuit board 360 may be used to electrically connect internal components of the electronic device 300. For example, the flexible printed circuit board 360 may electrically connect the battery 330 and the printed circuit board 380.

[0123] refer to Figure 6b , at least a portion of the flexible printed circuit board 360 according to the embodiment may be disposed in the second region 332 of the battery 330. The battery 330 may be formed such that the second region 332 is thinner than the first region 331, so that there is a space for disposing the flexible printed circuit board 360. The flexible printed circuit board 360 may be disposed in a direction opposite to the direction in which the second diffusion region 342 is positioned relative to the second region 332 of the battery 330.

[0124] In an embodiment, the electronic device 300 may utilize the second region 332 of the battery 330 as a space for disposing the flexible printed circuit board 360. The electronic device 300 according to the embodiment may not require a separate space on the printed circuit board 380 to place the flexible printed circuit board 360, because the second region 332 of the battery 330 provides a space for disposing the flexible printed circuit board 360. Therefore, the electronic device 300 according to the embodiment may be formed by cutting a portion of the printed circuit board 380 (e.g., a space for disposing the flexible printed circuit board 360) and extending the battery 330 in a direction facing the printed circuit board 380.

[0125] Figure 7 is an exploded perspective view of an electronic device 400 according to an embodiment of the present disclosure.

[0126] Figure 7 The electronic device 400 shown in FIG. Figure 1 The electronic device 101 may include Figure 1 at least a portion of the electronic device 101.

[0127] Figure 7 The electronic device 400 shown in FIG. 2 may include Figure 3 at least a portion of the electronic devices 200 and 300.

[0128] In the description Figure 7 When the electronic device 400 is shown in FIG. 1 , the width direction of the electronic device 400 may represent the x-axis direction, the length direction of the electronic device 400 may represent the y-axis direction, and the height direction of the electronic device 400 may represent the z-axis direction.

[0129] The electronic device 400 according to an embodiment of the present disclosure may include a housing 410 , a heat diffusion member 440 , and / or a heat diffusion sheet 490 .

[0130] In an embodiment, the heat diffusion member 440 and the heat diffusion sheet 490 may be disposed in the housing 410 .

[0131] In an embodiment, the housing 410 may include a placement space 417, and the heat diffusion member 440 may be disposed in the placement space 417. The placement space 417 may be formed with an opening having a shape corresponding to that of the heat diffusion member 440.

[0132] In an embodiment, the heat diffusion sheet 490 may be provided to cover one surface of the housing 410 and at least a portion of the heat diffusion member 440. The heat diffusion sheet 490 according to an embodiment may include a graphite sheet having heat diffusion capability.

[0133] In an embodiment, the heat diffusion sheet 490 may extend in a width direction (eg, an x-axis direction) and a length direction (eg, a y-axis direction) of the electronic device 400 .

[0134] Figure 8 is a diagram illustrating a heat diffusion member 440 according to an embodiment of the present disclosure.

[0135] In an embodiment, the heat diffusion member 440 may include a first diffusion region 441 and / or a second diffusion region 442 .

[0136] In an embodiment, the first diffusion region 441 may extend in a direction substantially perpendicular to the second diffusion region 442. For example, the first diffusion region 441 may extend along a length direction of the electronic device 400, and the second diffusion region 442 may extend along a width direction of the electronic device 400.

[0137] In an embodiment, at least a portion of the second diffusion region 442 may be disposed on a surface of the first diffusion region 441. For example, at least a portion of the second diffusion region 442 may be disposed in a direction away from the first diffusion region 441 along the negative direction of the z-axis. The direction in which the second diffusion region 442 is disposed relative to the first diffusion region 441 may be aligned with the heat diffusion sheet 490 (see Figure 7 ) is set in the opposite direction.

[0138] In an embodiment, the heat diffusion member 440 may be used to diffuse heat generated by a heat source in the electronic device 400 to other areas of the electronic device 400 .

[0139] In an embodiment, the first diffusion region 441 and the second diffusion region 442 may be integrally formed. For example, the first diffusion region 441 and the second diffusion region 442 may be integrally processed to form the heat diffusion member 440 instead of forming the second diffusion region 442 separately from the first diffusion region 441 and being disposed in the first diffusion region 441.

[0140] In an embodiment, the first diffusion region 441 may be formed in a rectangular plate shape. In an embodiment, the second diffusion region 442 may be formed in a cubic bar shape. If the heat diffusion member 440 is formed in a plate shape or a rod shape, the heat diffusion member 440 may be easier to manufacture. If the heat diffusion member 440 is formed in a plate shape or a rod shape, the first diffusion region 441 and the second diffusion region 442 may be easily formed integrally.

[0141] Fig. 9 is a diagram illustrating a housing 410 according to an embodiment of the present disclosure.

[0142] The housing 410 according to an embodiment of the present disclosure may include a first space 411 , a second space 412 , a support area 415 , and / or a placement space 417 .

[0143] In an embodiment, the first space 411 may be where the battery 330 is disposed (see Figure 3 The second space 412 may be a space in which the printed circuit board 380 is disposed (see Figure 3 ) space.

[0144] In an embodiment, the support area 415 may be formed between the first space 411 and the second space 412. For example, the first space 411 and the second space 412 may be separated by the support area 415. The support area 415 may extend along a width direction (eg, x-axis direction) of the electronic device 400.

[0145] In an embodiment, the housing 410 may increase rigidity by including a support area 415. The support area 415 may be configured to support at least a portion of the housing 410 within the housing 410 to increase the rigidity of the housing 410. For example, the housing 410 including the support area 415 may increase resistance to bending.

[0146] In an embodiment, the placement space 417 may be at least partially formed in the first space 411. The placement space 417 may be an opening formed in a shape corresponding to at least a portion of the heat diffusion member 440. For example, the placement space 417 may be formed in a shape corresponding to the heat diffusion member 440 (see Figure 8 ) of the first diffusion region 441 (see Figure 8 ) corresponds to a rectangular opening shape.

[0147] Fig.10 is a diagram illustrating a support area 415 of a housing 410 according to an embodiment of the present disclosure.

[0148] Fig.10 It can be shown from Fig. 9 FIG. 4 is a diagram of the support area 415 of the housing 410 as viewed in the BB′ cross section shown in FIG.

[0149] In an embodiment, the support region 415 may include a first support region 4151 , a second support region 4152 , and / or a third support region 4153 .

[0150] In an embodiment, the first support region 4151 may extend in a direction substantially perpendicular to the second support region 4152 and the third support region 4153 .

[0151] In an embodiment, there may be two second support regions 4152. For example, the second support region 4152 may include a second-1 support region 4152-1 and / or a second-2 support region 4152-2. The second-1 support region 4152-1 may extend on one side of the first support region 4151 in a direction substantially perpendicular to the first support region 4151. The second-2 support region 4152-2 may extend on the other side of the first support region 4151 in a direction substantially perpendicular to the first support region 4151.

[0152] In an embodiment, the heat diffusion member 440 (see Figure 8 ) of the second diffusion region 442 (see Figure 8 ) can be arranged between the space surrounded by the first supporting area 4151 and the second supporting area 4152.

[0153] In an embodiment, the heat diffusion member 440 (see Figure 8 ) of the second diffusion region 442 (see Figure 8 ) can maintain a predetermined position within the electronic device 400 by being supported by the first supporting area 4151 and the second supporting area 4152.

[0154] In an embodiment, the first support region 4151 may be disposed in the second diffusion region 442 (see Figure 8 ) and battery 330 (see Figure 6a ) of the second region 332 (see Figure 6a )between.

[0155] In an embodiment, the third support area 4153 may be on the battery 330 (see Figure 6a ) is positioned in one direction. For example, the third support area 4153 may be an extension in the opposite direction of the second support area 4152, and may be relative to the battery 330 (see Figure 6a) of the second region 332 (see Figure 6a ) is positioned in the positive y-axis direction. The third support area 4153 can be arranged to face the battery 330 (see Figure 6a ) of the second region 332 (see Figure 6a ).

[0156] In an embodiment, the battery 330 (see Figure 6a ) can maintain a predetermined position within the electronic device 400 by being supported by the first supporting area 4151, the second supporting area 4152 and the third supporting area 4153.

[0157] Fig.11 is an exploded perspective view of an electronic device 500 according to an embodiment of the present disclosure.

[0158] Fig.11 The electronic device 500 shown in FIG. Figure 1 The electronic device 101 may include Figure 1 at least a portion of the electronic device 101.

[0159] Fig.11 The electronic device 500 shown in FIG. 2 may include Figure 3 at least a portion of the electronic devices 200 and 300.

[0160] In the description Fig.11 When the electronic device 500 is shown in FIG. 5 , the width direction of the electronic device 500 may represent the x-axis direction, the length direction of the electronic device 500 may represent the y-axis direction, and the height direction of the electronic device 500 may represent the z-axis direction.

[0161] The electronic device 500 according to an embodiment of the present disclosure may include a housing 510 , a first heat diffusion member 540 , a second heat diffusion member 570 , a printed circuit board 580 , and / or a camera module 590 .

[0162] In an embodiment, the housing 510 may form the exterior of the electronic device 500. Figure 3 The housing 510 may include a first space 511 and / or a second space 512, in which different configurations of the electronic device 500 may be arranged. The first space 511 may be a space for arranging the battery 330 (see Figure 3 The second space 512 may be a space where a printed circuit board 580 and a camera module 590 are disposed.

[0163] In an embodiment, the camera module 590 may include at least one camera 591 and a camera decoration 592. The camera decoration 592 may be provided to cover or surround at least a portion of the camera 591.

[0164] according to Fig.11The heat diffusion member 540 of the embodiment shown in FIG. Figure 3 The heat diffusion member 340 shown in FIG. 1 is substantially the same. Fig.11 The heat diffusion member 540 may have Figure 3 The heat diffusion member 340 has substantially the same shape and function.

[0165] In an embodiment, the heat diffusion member 540 may include a first diffusion region 541 and / or a second diffusion region 542 .

[0166] In an embodiment, the second heat diffusion member 570 may at least partially extend in the height direction of the electronic device 500. The second heat diffusion member 570 may be used to diffuse heat within the electronic device 500 in the height direction of the electronic device 500.

[0167] The electronic device 500 according to the embodiment may include a second heat diffusion member 570 which may diffuse heat inside the electronic device 500 in a height direction of the electronic device 500 , thereby improving heat diffusion performance of the electronic device 500 .

[0168] Fig.12 is a diagram illustrating an electronic device 500 according to an embodiment of the present disclosure.

[0169] refer to Fig.12 , the electronic device 500 according to the embodiment may include a housing 510 , a first heat diffusion member 540 , a second heat diffusion member 570 , a printed circuit board 580 , and / or a camera module 590 .

[0170] In an embodiment, a printed circuit board 580 and a camera module 590 may be disposed in the second space 512 of the housing 510. The camera module 590 may be disposed on one side of the printed circuit board 580.

[0171] In an embodiment, the housing 510 may include a support area 515. The support area 515 may extend in the housing 510 along the width direction (eg, x-axis direction) of the electronic device 500. The first space 511 and the second space 512 of the housing 510 may be separated by the support area 515.

[0172] In an embodiment, the first heat diffusion member 540 may be at least partially disposed in the support region 515. For example, the second diffusion region 542 of the first heat diffusion member 540 may be disposed in the support region 515.

[0173] In an embodiment, at least a portion of the second heat diffusion member 570 may be disposed in a direction opposite to the first heat diffusion member 540 with respect to the printed circuit board 580. For example, a portion of the first heat diffusion member 540 may be disposed in one direction (e.g., the positive z-axis direction) of the printed circuit board 580, and a portion of the second heat diffusion member 570 may be disposed in another direction (e.g., the negative z-axis direction) of the printed circuit board 580.

[0174] In an embodiment, the second heat diffusion member 570 may contact the first heat diffusion member 540 at one end and contact the camera module 590 at the other end opposite to the one end.

[0175] In an embodiment, the second heat diffusion member 570 may at least partially extend in the height direction of the electronic device 500 , and may diffuse heat transferred from the first heat diffusion member 540 in the height direction of the electronic device 500 .

[0176] In an embodiment, at least a portion of the support region 515 may be formed in an open configuration. The second diffusion region 542 of the first heat diffusion member 540 may contact the second heat diffusion member 570 in the open portion of the support region 515 .

[0177] Fig.13 is a cross-sectional perspective view of an electronic device 500 according to an embodiment of the present disclosure.

[0178] Fig.13 It can be from Fig.12 A cross-sectional perspective view of the electronic device 500 observed along the CC' cross section.

[0179] In an embodiment, the support region 515 of the housing 510 may include a diffusion opening 5151 through which a portion of the support region 515 is opened. At the diffusion opening 5151, the second diffusion region 542 of the first heat diffusion member 540 may be exposed.

[0180] In an embodiment, the second heat diffusion member 570 may include an extension region 571 , a first contact region 572 , and / or a second contact region 573 .

[0181] In an embodiment, the first contact region 572 of the second heat diffusion member 570 may contact the first heat diffusion member 540. For example, the first contact region 572 may contact the second diffusion region 542 of the first heat diffusion member 540 located at the diffusion opening 5151.

[0182] In an embodiment, the extension region 571 may extend in a height direction (eg, z-axis direction) of the electronic device 500. The extension region 571 may be connected to the first contact region 572 at one end and to the second contact region 573 at the other end.

[0183] In an embodiment, the second contact region 573 of the second heat diffusion member 570 may be in contact with the camera module 590. The second heat diffusion member 570 may diffuse heat transferred from the first heat diffusion member 540 in a direction in which the camera module 590 is located.

[0184] refer to Fig.13 The second contact region 573 of the second heat diffusion member 570 according to the embodiment is shown to be disposed on the camera module 590, but this is exemplary, and the position where the second contact region 573 is disposed may not be limited thereto. The second contact region 573 may also be disposed to contact other configurations of the electronic device 500 other than the camera module 590.

[0185] Fig.14a and Fig.14b They are respectively a front view and a rear view showing an unfolded state of the electronic device according to the embodiment. Fig.15a and Fig.15b They are diagrams showing a front view and a rear view, respectively, of a folded state of the electronic device according to the embodiment.

[0186] refer to Fig.14a , Fig.14b , Fig.15a and Fig.15b (which can be called Figures 14a to 15b ), the electronic device 600 may include: a pair of housings 610 and 620 (eg, a foldable housing structure), which are connected by a hinge device (eg, Fig.16 The hinge devices 685 and 687 (e.g., hinge modules) are rotatably coupled to each other relative to the folding axis F1 so as to be folded relative to each other; a first display 630 (e.g., a flexible display, a foldable display, or a main display) provided through the pair of housings 610 and 620; and / or a second display 655 (e.g., a sub-display) provided through the second housing 620. According to an embodiment, the hinge device (e.g., Fig.16At least a portion of the hinge device 685 and 687 of the electronic device 600 may be set so as not to be visible from the outside through the first housing 610 and the second housing 620, and may be set so as not to be visible from the outside through the hinge housing 680 covering the foldable portion. According to an embodiment, the hinge device may include a hinge module and a hinge plate for connecting the hinge module to the first housing 610 and the second housing 620, the hinge module including a gear assembly, the gear assembly including a plurality of gears and a plurality of hinge cams, the plurality of hinge cams being coupled to a hinge shaft rotated by the gear assembly and performing a cam interlocking operation. In the present disclosure, the surface on which the first display 630 is set may be defined as the front surface of the electronic device 600, and the surface opposite to the front surface may be defined as the rear surface of the electronic device 600. In addition, the surface surrounding the space between the front surface and the rear surface may be defined as the side surface of the electronic device 600.

[0187] According to an embodiment, a pair of housings 610 and 620 may include a hinge device (eg, Fig.16 The first housing 610 and the second housing 620 are foldably arranged relative to each other using hinge devices 685 and 687. According to an embodiment, the shape and connection of the pair of housings 610 and 620 are not limited to Figures 14a to 15b , and a pair of shells 610 and 620 may be implemented by a combination and / or connection of other shapes or components. According to an embodiment, the first shell 610 and the second shell 620 may be arranged on opposite sides relative to the folding axis F1, and may have shapes that are completely symmetrical to each other relative to the folding axis F1. According to an embodiment, the first shell 610 and the second shell 620 may be folded asymmetrically relative to the folding axis F1. According to an embodiment, the angle or distance between the first shell 610 and the second shell 620 may vary depending on whether the electronic device 600 is in an unfolded state, a folded state, or an intermediate state.

[0188] According to an embodiment, in the unfolded state of the electronic device 600, the first housing 610 may include: a first surface 611 connected to a hinge device (eg, Fig.16 The second housing 620 may include a third surface 621 connected to the hinge device (e.g., hinge devices 685 and 687) and disposed toward the front surface of the electronic device 600; a second surface 612 facing in a direction opposite to the first surface 611; and / or a first side member 613 surrounding at least a portion of the first space between the first surface 611 and the second surface 612. According to an embodiment, in the unfolded state of the electronic device 600, the second housing 620 may include: a third surface 621 connected to the hinge device (e.g., Fig.16The first and second side members 623 may be provided with hinge devices 685 and 687 of the electronic device 600 and arranged to face the front surface of the electronic device 600; the fourth surface 622 faces a direction opposite to the third surface 621; and / or the second side member 623 surrounds at least a portion of the second space between the third surface 621 and the fourth surface 622. According to an embodiment, the first surface 611 and the third surface 621 may face substantially the same direction in the unfolded state, and the first surface 611 and the third surface 621 may at least partially face each other in the folded state. According to an embodiment, the electronic device 600 may include a recess 601 formed by the structural coupling of the first shell 610 and the second shell 620 to receive the first display 630. According to an embodiment, the recess 601 may have substantially the same shape as the first display 630. According to an embodiment, the first housing 610 may include a first protective frame 613a (e.g., a first decorative member) coupled to the first side member 613 when viewed from above the first display 630, arranged to overlap with the edge of the first display 630, thereby covering the edge of the first display 630 to allow it not to be seen from the outside. According to an embodiment, the first protective frame 613a may be formed integrally with the first side member 613. According to an embodiment, the second housing 620 may include a second protective frame 623a (e.g., a second decorative member) coupled to the second side member 623 when viewed from above the first display 630, arranged to overlap with the edge of the first display 630, thereby covering the edge of the first display 630 to allow it not to be seen from the outside. According to an embodiment, the second protective frame 623a may be formed integrally with the first side member 623. In an embodiment, the first protective frame 613a and the second protective frame 623a may be omitted.

[0189] According to an embodiment, the hinge housing 680 (eg, hinge cover) may be disposed between the first housing 610 and the second housing 620, and may be disposed to cover a hinge device (eg, hinge cover) disposed on the hinge housing 680. Fig.16According to an embodiment, the hinge housing 680 may be hidden from the outside or exposed to the outside by a part of the first housing 610 and the second housing 620 according to the unfolded state, the folded state or the intermediate state of the electronic device 600. For example, when the electronic device 600 is in the unfolded state, at least a part of the hinge housing 680 may be covered by the first housing 610 and the second housing 620 and is not substantially exposed. According to an embodiment, when the electronic device 600 is in the folded state, at least a part of the hinge housing 680 may be exposed to the outside between the first housing 610 and the second housing 620. According to an embodiment, in the intermediate state where the first housing 610 and the second housing 620 are folded with each other at a predetermined angle (folded at a certain angle), the hinge housing 680 may be at least partially exposed to the outside of the electronic device 600 between the first housing 610 and the second housing 620. For example, the area where the hinge housing 680 is exposed to the outside may be smaller than the area when the electronic device 600 is fully folded. According to an embodiment, the hinge housing 680 may include a curved surface.

[0190] According to an embodiment, when the electronic device 600 is in the unfolded state (eg, Fig.14a and Fig.14b ), the first shell 610 and the second shell 620 may intersect at an angle of about 180 degrees, and the first area 630a, the second area 630b and the folding area 630c of the first display 630 may form the same plane and be arranged to face substantially the same direction (e.g., z-axis direction). In an embodiment, when the electronic device 600 is in the unfolded state, the first shell 610 may be rotated at an angle of about 360 degrees relative to the second shell 620, and may be folded outward (outward folding solution) so that the second surface 612 and the fourth surface 622 face each other.

[0191] According to an embodiment, when the electronic device 600 is in a folded state (eg, Fig.15a and Fig.15b), the first surface 611 of the first shell 610 and the third surface 621 of the second shell 620 may be arranged to face each other. In this case, the first area 630a and the second area 630b of the first display 630 may form a narrow angle (e.g., a range between 0 degrees and about 10 degrees) through the folding area 630c, and may be arranged to face each other. According to an embodiment, at least a portion of the folding area 630c may be deformed into a curved shape having a predetermined curvature. According to an embodiment, when the electronic device 600 is in an intermediate state, the first shell 610 and the second shell 620 may be arranged at a predetermined angle (a certain angle). In this case, the first area 630a and the second area 630b of the first display 630 may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state, and the curvature of the folding area 630c may be smaller than the curvature in the folded state and may be larger than the curvature in the unfolded state. In an embodiment, the first shell 610 and the second shell 620 may be connected by a hinge device (e.g., Fig.16 The hinge devices 685 and 687 of the embodiment form an angle that allows the first housing 610 and the second housing 620 to stop at a specified folding angle between the folded state and the unfolded state (free stop function). Fig.16 The hinge devices 685 and 687) continue to operate while being compressed in the unfolding direction or the folding direction based on a specified bending angle.

[0192] According to an embodiment, the electronic device 600 may include at least one of at least one display 630 and 655, an input device 615, sound output devices 627 and 628, sensor modules 617a, 617b, and 626, camera modules 616a, 616b, and 625, a key input device 619, an indicator (not shown), or a connector port 629 provided on the first housing 610 and / or the second housing 620. In an embodiment, the electronic device 600 may omit at least one of the elements, or may additionally include at least one other element.

[0193] According to an embodiment, at least one display 630 and 655 may include: a first display 630 (eg, a flexible display) configured to be connected to a display device 630 through a hinge device (eg, Fig.16The electronic device 600 includes a hinge device 685 and 687) supported by a third surface 621 of the second housing 620 from a first surface 611 of the first housing 610; and a second display 655, which is arranged to be seen from the outside through the fourth surface 622 at least partially in the space in the second housing 620. In an embodiment, the second display 655 may be arranged to be seen from the outside through the second surface 612 in the space in the first housing 610. According to an embodiment, the first display 630 may be mainly used for the unfolded state of the electronic device 600, and the second display 655 may be mainly used for the folded state of the electronic device 600. According to an embodiment, the electronic device 600 may control the use of the first display 630 and / or the second display 655 based on the folding angle between the first housing 610 and the second housing 620 in the intermediate state.

[0194] According to an embodiment, the first display 630 may be disposed in a receiving space formed by a pair of shells 610 and 620. For example, the first display 630 may be disposed in a recess 601 formed by a pair of shells 610 and 620, and may be disposed to occupy substantially most of the front surface of the electronic device 600 in an unfolded state. According to an embodiment, the first display 630 may include a flexible display having at least one area that is deformable into a plane or a curved surface. According to an embodiment, the first display 630 may include a first area 630a facing the first shell 610 and a second area 630b facing the second shell 620. According to an embodiment, the first display 630 may include a folding area 630c including a portion of the first area 630a and a portion of the second area 630b relative to the folding axis F1. According to an embodiment, at least a portion of the folding area 630c may include a hinge device (e.g., Fig.16 According to an embodiment, the area division of the first display 630 corresponds only to the area formed by a pair of housings 610 and 620 and a hinge device (eg, Fig.16 , and the first display 630 can be physically divided by a pair of housings 610 and 620 and a hinge device (e.g., Fig.16 The hinge devices 685 and 687 of the folding area 630c are basically displayed as a seamless full screen. According to an embodiment, the first area 630a and the second area 630b may have shapes that are completely symmetrical or partially asymmetrical with respect to each other with respect to the folding area 630c.

[0195] According to an embodiment, the electronic device 600 may include a first back cover 640 disposed on the second surface 612 of the first housing 610 and a second back cover 650 disposed on the fourth surface 622 of the second housing 620. In an embodiment, at least a portion of the first back cover 640 may be formed integrally with the first side member 613. In an embodiment, at least a portion of the second back cover 650 may be formed integrally with the second side member 623. According to an embodiment, at least one of the first back cover 640 and the second back cover 650 may be substantially formed of a transparent plate (e.g., a polymer plate or a glass plate including various coatings) or an opaque plate. According to an embodiment, the first back cover 640 may be formed of, for example, an opaque plate (such as coated or colored glass), ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the above materials. According to an embodiment, the second back cover 650 may be substantially formed of, for example, a transparent plate (such as glass or polymer). Therefore, the second display 655 may be arranged to be seen from the outside through the second back cover 650 in the space in the second housing 620.

[0196] According to an embodiment, the input device 615 may include a microphone. In an embodiment, the input device 615 may include a plurality of microphones arranged to detect the direction of the sound. According to an embodiment, the sound output devices 627 and 628 may include a speaker. According to an embodiment, the sound output devices 627 and 628 may include a call receiver 627 provided through the fourth surface 622 of the second housing 620 and an external speaker 628 provided through at least a portion of the second side member 623 of the second housing 620. In an embodiment, the input device 615, the sound output devices 627 and 628, and the connector 629 may be provided in a space of the first housing 610 and / or the second housing 620, and may be exposed to the external environment through at least one hole formed through the first housing 610 and / or the second housing 620. In an embodiment, the hole formed through the first housing 610 and / or the second housing 620 may be used in common for the input device 615 and the sound output devices 627 and 628. In an embodiment, the sound output devices 627 and 628 may include speakers (eg, piezoelectric speakers) that operate without including a hole formed through the first housing 610 and / or the second housing 620 .

[0197] According to an embodiment, the camera modules 616a, 616b, and 625 may include a first camera module 616a disposed on a first surface 611 of the first housing 610, a second camera module 616b disposed on a second surface 612 of the first housing 610, and / or a third camera module 625 disposed on a fourth surface 622 of the second housing 620. According to an embodiment, the electronic device 600 may include a flash 618 disposed around the second camera module 616b. According to an embodiment, the flash 618 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, the camera modules 616a, 616b, and 625 may include one or more lenses, an image sensor, and / or an image signal processor. In an embodiment, at least one of the camera modules 616a, 616b, and 625 may include two or more lenses (e.g., a wide-angle lens and a telephoto lens) and an image sensor, and may be arranged together on one surface of the first housing 610 and / or the second housing 620.

[0198] According to an embodiment, the sensor modules 617a, 617b, and 626 may generate a data value or an electrical signal corresponding to an internal operating state or an external environmental state of the electronic device 600. According to an embodiment, the sensor modules 617a, 617b, and 626 may include a first sensor module 617a disposed on a first surface 611 of the first housing 610, a second sensor module 617b disposed on a second surface 612 of the first housing 610, and / or a third sensor module 626 disposed on a fourth surface 622 of the second housing 620. In an embodiment, the sensor modules 617a, 617b, and 626 may include at least one of a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illumination sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time of flight (TOF) sensor or a light detection and ranging (LiDAR)).

[0199] According to an embodiment, the electronic device 600 may further include a sensor module not shown, such as at least one of an atmospheric sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In an embodiment, the fingerprint recognition sensor may be provided by at least one of the first side member 613 of the first housing 610 and / or the second side member 623 of the second housing 620.

[0200] According to an embodiment, the key input device 619 may be provided to be exposed to the outside through the first side member 613 of the first housing 610. In an embodiment, the key input device 619 may be provided to be exposed to the outside through the second side member 623 of the second housing 620. In an embodiment, the electronic device 600 may not include some or all of the key input device 619, and the key input device 619 not included may be implemented in another shape (such as a soft key) on at least one display 630 and 655. In an embodiment, the key input device 619 may be implemented using a pressure sensor included in at least one display 630 and 655.

[0201] According to an embodiment, the connector port 629 may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for sending data and / or power to an external electronic device or receiving data and / or power from an external electronic device. In an embodiment, the connector port 629 may perform the function of sending an audio signal to an external electronic device or receiving an audio signal from an external electronic device together, or may also include a separate connector port (e.g., a headphone jack) for performing the function of sending an audio signal to an external electronic device or receiving an audio signal from an external electronic device.

[0202] According to an embodiment, at least one of the camera modules 616a, 616b, and 625, at least one of the sensor modules 617a, 617b, and 626, and / or an indicator may be arranged to be exposed through at least one display 630 and 655. For example, at least one camera module 616a and 625, at least one sensor module 617a and 626, and / or an indicator may be arranged below an active area (display area) of at least one display 630 and 655 in a space in at least one housing 610 and 620, and may be arranged to contact the external environment through a transparent area or an opening perforated in a cover member (e.g., a window layer (not shown) of the first display 630 and / or the second back cover 650). According to an embodiment, an area where at least one display 630 and 655 and at least one camera module 616a and 625 face each other may be formed as a transmissive area having a predetermined transmittance as a portion of an area where content is displayed. According to an embodiment, the transmissive region may be formed to have a transmittance in the range of about 5% to about 20%. The transmissive region may include an area overlapping with an effective area (e.g., a viewing angle area) of at least one camera module 616a and 625, wherein an image is formed on an image sensor in the effective area, and the light used to generate the image passes through the effective area. For example, the transmissive region of the display 630 and 655 may include an area having a pixel density lower than that in the surrounding area. For example, the transmissive region may be replaced by an opening. For example, at least one camera module 616a and 625 may include a camera under the display (UDC) or a camera under the panel (UPC). In an embodiment, some camera modules or sensor modules 617a and 626 may be arranged to perform their functions without being visually exposed through the display. For example, the area facing the camera modules 616a and 625 and / or sensor modules 617a and 626 arranged below the display 630 and 655 (e.g., a display panel) corresponds to a camera under the display (UDC) structure, and a perforated opening is not necessarily required.

[0203] Fig.16 is an exploded perspective view of an electronic device 600 according to an embodiment of the present disclosure.

[0204] See also Fig.16 The electronic device 600 may include a first display 630 (e.g., a flexible display), a second display 655, at least one hinge device 685 and 687, a pair of support members 661 and 662, at least one substrate 670 (e.g., a printed circuit board (PCB)), a first shell 610, a second shell 620, a first back cover 640 and / or a second back cover 650.

[0205] According to an embodiment, the first display 630 may include a display panel 635 (e.g., a flexible display panel) and a support plate 636 disposed below the display panel 635. According to an embodiment, the first display 630 may include a pair of reinforcing plates 637 and 638 disposed below the support plate 636. In some embodiments, the pair of reinforcing plates 637 and 638 may be omitted. According to an embodiment, the display panel 635 may include: a first panel area 635a corresponding to a first area of ​​the first display 630 (e.g., Fig.14a a first area 630a in the first display 630); a second panel area 635b extending from the first panel area 635a and corresponding to a second area of ​​the first display 630 (eg, Fig.14a and a third panel area 635c, connecting the first panel area 635a and the second panel area 635b and corresponding to the folding area of ​​the first display 630 (eg, Fig.14a In the folding area 630c). According to an embodiment, the support plate 636 may be disposed between the display panel 635 and the pair of support members 661 and 662, and may be formed to have a material and shape that provides a planar support structure for the first panel area 635a and the second panel area 635b, and provide a bendable structure to advantageously provide flexibility for the third panel area 635c. According to an embodiment, the support plate 636 may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or fiber reinforced plastic (FRP)). According to an embodiment, a pair of reinforcing plates 637 and 638 may be disposed between the support plate 636 and the pair of support members 661 and 662, and may include a first reinforcing plate 637 and a second reinforcing plate 638, the first reinforcing plate 637 being disposed to correspond to at least a portion of the third area 635c and the first panel area 635a, and the second reinforcing plate 638 being disposed to correspond to at least a portion of the third panel area 635c and the second panel area 635b. According to an embodiment, the pair of reinforcement plates 637 and 638 may be formed of a metal material (eg, SUS) to advantageously reinforce the ground connection structure and rigidity of the first display 630 .

[0206] According to an embodiment, the second display 655 may be disposed in the space between the second case 620 and the second back cover 650. According to an embodiment, the second display 655 may be visible from the outside through substantially the entire area of ​​the second back cover 650 when located in the space between the second case 620 and the second back cover 650.

[0207] According to an embodiment, at least a portion of the first support member 661 may be foldably coupled to the second support member 662 by at least one hinge device 685 and 687. According to one embodiment, the electronic device 600 may include at least one wiring member 663 (e.g., a flexible printed circuit board (FPCB)) provided from at least a portion of the first support member 661 to a portion of the second support member 662 across at least one hinge device 685 and 687. According to an embodiment, the first support member 661 may extend from the first side member 613, or may be structurally combined with the first side member 613. According to an embodiment, the electronic device 600 may include a first space (e.g., Fig.14a 6101), which is provided by the first support member 661 and the first back cover 640. According to an embodiment, the first housing 610 (e.g., the first housing structure) may be configured by a combination of the first side member 613, the first support member 661, and the first back cover 640. According to an embodiment, the second support member 662 may extend from the second side member 623 or may be structurally combined with the second side member 623. According to an embodiment, the electronic device 600 may include a second space (e.g., Fig.14a According to an embodiment, the second shell 620 (e.g., the second shell structure) may be configured by a combination of a second side member 623, a second support member 662, and a second back cover 650. According to an embodiment, at least a portion of at least one hinge device 685 and 687 and / or at least one wiring member 663 may be provided to be supported by at least a portion of a pair of support members 661 and 662. According to an embodiment, at least one wiring member 663 may be provided in a direction intersecting the first support member 661 and the second support member 662 (e.g., the x-axis direction). According to an embodiment, at least one wiring member 663 may be arranged in a direction intersecting the folding axis (e.g., Fig.14a It has a length in a direction substantially perpendicular to the y-axis or folding axis F1 (eg, the x-axis direction).

[0208] According to an embodiment, at least one substrate 670 may include a first substrate 671 disposed in the first space 6101 and a second substrate 672 disposed in the second space 6201. According to an embodiment, the first substrate 671 and the second substrate 672 may include a plurality of electronic components arranged to implement various functions of the electronic device 600. According to an embodiment, the first substrate 671 and the second substrate 672 may be electrically connected by at least one wiring member 663.

[0209] According to an embodiment, the electronic device 600 may include at least one battery 691 and 692. According to an embodiment, the at least one battery 691 and 692 may include a first battery 691 disposed in a first space 6101 of the first housing 610 and electrically connected to the first substrate 671, and a second battery 620 disposed in a second space 6201 of the second housing 620 and electrically connected to the second substrate 672. According to an embodiment, the first support member 661 and the second support member 662 may further include at least one expansion hole for the first battery 691 and the second battery 692.

[0210] According to an embodiment, the first housing 610 may include a first rotation support surface 614, and the second housing 620 may include a second rotation support surface 624 corresponding to the first rotation support surface 614. According to an embodiment, the first rotation support surface 614 and the second rotation support surface 624 may include a curved surface corresponding to (naturally connected to) the curved outer surface of the hinge housing 680. According to an embodiment, when the electronic device 600 is in an unfolded state, the first rotation support surface 614 and the second rotation support surface 624 may cover the hinge housing 680 to prevent the hinge housing 680 from being exposed from the rear surface of the electronic device 600 or to expose only a portion of the hinge housing 680. According to an embodiment, when the electronic device 600 is in a folded state, the first rotation support surface 614 and the second rotation support surface 624 may rotate along the curved outer surface of the hinge housing 680 and at least partially expose the hinge housing 680 from the rear surface of the electronic device 600.

[0211] According to an embodiment, the electronic device 600 may include at least one antenna 676 disposed in the first space 6201. According to an embodiment, at least one antenna 676 may be disposed on the first battery 691 and the first back cover 640 in the first space 6201. According to an embodiment, at least one antenna 676 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. According to an embodiment, at least one antenna 676 may, for example, communicate with an external device over a short distance or wirelessly send / receive power required for charging. In some embodiments, the antenna structure may be formed by at least a portion of the first side member 613 or the second side member 623 and / or a portion of the first support member 661 and the second support member 662, or a combination thereof.

[0212] According to an embodiment, the electronic device 600 may further include at least one electronic component assembly 674 and 675 and / or additional support members 663 and 673 disposed in the first space 6101 and / or the second space 6201. For example, the at least one electronic component assembly may include an interface connector port assembly 674 or a speaker assembly 675.

[0213] According to an embodiment, the electronic device 600 may include a first waterproof member (WP1) disposed between the first reinforcing plate 637 and the first supporting member 661 and a second waterproof member (WP2) disposed between the second reinforcing plate 638 and the second supporting member 662. According to an embodiment, the first waterproof member (WP1) may provide at least one first waterproof space when disposed between the first reinforcing plate 637 and the first supporting member 661. According to an embodiment, the at least one first waterproof space may accommodate an area corresponding to at least one electronic component (e.g., a camera module or a sensor module) disposed to be supported by the first supporting member 661. According to an embodiment, the second waterproof member (WP2) may provide a second waterproof space when disposed between the second reinforcing plate 638 and the second supporting member 662. According to an embodiment, the second waterproof space may accommodate at least a portion of the curved portion folded toward the rear surface of the first display 630. For example, the second waterproof space may extend from the display panel of the first display 630 and may be disposed as at least a portion of the curved portion folded toward the rear surface thereof. Therefore, a control circuit (eg, a display driver IC (DDI)) and a plurality of electrical elements arranged in the bent portion may be disposed in the second waterproof space to be protected from external moisture and / or foreign substances.

[0214] According to an embodiment, the electronic device 600 may include a waterproof tape 641 disposed between the first rear cover 640 and the first housing 610. According to an embodiment, the electronic device 600 may include a joint member 651 disposed between the second rear cover 650 and the second housing 620. In some embodiments, the joint member 651 may be disposed between the second display 655 and the second housing 620. In some embodiments, the waterproof tape 641 may be replaced with the joint member 651, and the joint member 651 may be replaced with the waterproof tape 641.

[0215] According to an embodiment, at least one hinge device 685 and 687 may include a first hinge device 685 and a second hinge device 687 respectively disposed at one end and the other end in a direction parallel to the folding axis (F). According to an embodiment, the first hinge device 685 and the second hinge device 687 may have substantially the same configuration. According to an embodiment, the electronic device 600 may include a connection module 686 disposed between the first hinge device 685 and the second hinge device 687. According to an embodiment, the connection module 686 may be arranged by a combination of one or more gears and / or a combination of one or more connecting rods. In some embodiments, the connection module 686 may be replaced by the first hinge device 685. In some embodiments, at least one hinge device 685 and 687 may be disposed at one place or three or more places at a specified interval along a direction parallel to the folding axis (F). According to an embodiment, the electronic device 600 may include a first hinge plate 611 and a second hinge plate 612 connected by at least one hinge device 685 and 687. According to an embodiment, the first hinge plate 611 may form the same plane with the first housing 610 in the unfolded state, and the second hinge plate 612 may form the same plane with the second housing 620 in the unfolded state. According to an embodiment, in the folded state, the flexible display 630 may be deformed into a water drop shape by at least one hinge device 685 and 687 and accommodated in the internal space of the electronic device 600. According to an embodiment, in the folded state, the first hinge plate 611 and the second hinge plate 612 may be movable to support the folded area (e.g., Fig.14a In the folded state, the first shell 610 and the second shell 620 can move to support at least a portion of the folding area 630c in the flexible display 630 (the folding area is deformed into a water drop shape), and in the folded state, the first shell 610 and the second shell 620 can move to support a substantially undeformed flat portion of the flexible display 630 (for example, Fig.14a Therefore, the first hinge plate 611 may not form the same plane with the first housing 610 in the folded state, and the second hinge plate 612 may not form the same plane with the second housing 620.

[0216] At least one hinge device 685 and 687 according to an exemplary embodiment of the present disclosure may be configured to induce the folding region 630 c to be deformed into a designated shape (eg, a water drop shape) in a folded state of the flexible display 630 .

[0217] Fig.14a , Fig.14b , Fig.15a , Fig.15b , Fig.16 The electronic device 600 shown in FIG. 1 may include Figure 1 At least some components of the electronic device 101 shown in .

[0218] Fig.14a , Fig.14b , Fig.15a , Fig.15b , Fig.16 The electronic device 600 shown in FIG. 1 may include Figure 3 , Figure 4a , Figure 4b , Figure 4c , Figure 4d , Figure 5 , Figure 6a and Figure 6b At least some components of the electronic device 300 shown in .

[0219] Fig.14a , Fig.14b , Fig.15a , Fig.15b , Fig.16 The electronic device 600 shown in FIG. 1 may include Figure 7 , Figure 8 , Fig. 9 and Fig.10 At least some components of the electronic device 400 shown in .

[0220] Fig.14a , Fig.14b , Fig.15a , Fig.15b , Fig.16 The electronic device 600 shown in FIG. 1 may include Fig.11 , Fig.12 and Fig.13 At least some components of the electronic device 500 shown in FIG.

[0221] The heat diffusion member 340 , 440 , or 540 according to an embodiment of the present disclosure may be applied to a foldable electronic device 600 . Fig.14a , Fig.14b , Fig.15a , Fig.15b , Fig.16 The electronic device 600 shown in FIG. 6 may include the heat diffusion member 340 , 440 , or 540 .

[0222] According to one or more embodiments, the heat diffusion member 340 , 440 , or 540 may be disposed between the board 670 and the display 630 , and between the batteries 691 , 692 and the display 630 .

[0223] According to one or more embodiments, the heat diffusion member 340, 440, or 540 may be disposed in at least one of the first housing 610 and the second housing 620. For example, the heat diffusion member 340, 440, or 540 may be disposed in the first housing 610. Alternatively, the heat diffusion member 340, 440, or 540 may be disposed in the second housing 620. Alternatively, the heat diffusion member 340, 440, or 540 may be disposed in the first housing 610 and the second housing 620, respectively.

[0224] According to one or more embodiments, at least one of the first housing 610 or the second housing 620 may include a structure that supports (or surrounds) at least a portion of the heat diffusion member 340, 440, or 540. For example, when the heat diffusion member 340, 440, or 540 is disposed in the first housing 610, the first housing 610 may at least partially include the support region 315, 415, or 515. When the heat diffusion member 340, 440, or 540 is disposed in the second housing 620, the second housing 620 may at least partially include the support region 315, 415, or 515. When the heat diffusion member 340, 440, or 540 is disposed in the first housing 610 and the second housing 620, respectively, the first housing 610 and the second housing 620 may each at least partially include the support region 315, 415, or 515.

[0225] According to one or more embodiments, the heat diffusion member 340, 440 or 540 may be used to diffuse heat generated from a heat source of the electronic device 600 to other regions of the electronic device 600. For example, the heat diffusion member 340, 440 or 540 may diffuse heat generated from the board 670 to other regions of the electronic device 600.

[0226] Fig.17a is a perspective view of an electronic device according to an embodiment of the present disclosure, illustrating an unfolded state (or flat state) of the electronic device. Fig.17b is a plan view showing a front surface of an electronic device when the electronic device according to an embodiment of the present disclosure is in an unfolded state. Fig.17c is a plan view showing a rear surface of an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0227] Fig.18a is a perspective view of an electronic device illustrating a folded state of the electronic device according to an embodiment of the present disclosure. Fig.18b is a perspective view of an electronic device illustrating an intermediate state of the electronic device according to an embodiment of the present disclosure.

[0228] refer to Figures 17a to 18b , the electronic device 700 may include a hinge-based device (eg, Fig.17bIn an embodiment, the hinge device (eg, a hinge device 740) is used to foldably combine the first shell 710 and the second shell 720 with each other (eg, a foldable shell structure). Fig.17b The hinge device 740 of the electronic device 700 may be arranged in the X-axis direction or in the Y-axis direction. According to an embodiment, the electronic device 700 may include a first display 731 (e.g., a flexible display, a foldable display, or a main display), which is arranged in an area (e.g., a recess) formed by the first shell 710 and the second shell 720. According to an embodiment, the first shell 710 and the second shell 720 may be arranged on both sides around the folding axis F2, and may have a shape that is substantially symmetrical about the folding axis F2. According to an embodiment, the angle or distance between the first shell 710 and the second shell 720 may be different depending on the state of the electronic device 700. For example, depending on whether the electronic device is in an unfolded state (or a flat state), a folded state, or an intermediate state, the angle or distance between the first shell 710 and the second shell 720 may be different.

[0229] According to an embodiment, in the unfolded state of the electronic device 700, the first housing 710 may include a first surface 711 pointing to a first direction (e.g., a front direction) (z-axis direction) and a second surface 712 pointing to a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface 711. According to an embodiment, in the unfolded state of the electronic device 700, the second housing 720 may include a third surface 721 pointing to the first direction (z-axis direction) and a fourth surface 722 pointing to the second direction (-z-axis direction). According to an embodiment, in the unfolded state of the electronic device 700, the first surface 711 of the first housing 710 and the third surface 721 of the second housing 720 may point to substantially the same first direction (z-axis direction). In an embodiment, in the folded state of the electronic device 700, the first surface 711 of the first housing 710 and the third surface 721 of the second housing 720 may face each other. According to an embodiment, in the unfolded state of the electronic device 700, the second surface 712 of the first housing 710 and the fourth surface 722 of the second housing 720 may point to substantially the same second direction (-z-axis direction). In an embodiment, in the folded state of the electronic device 700, the second surface 712 of the first shell and the fourth surface 722 of the second shell 720 may point to opposite directions. For example, in the folded state of the electronic device 700, the second surface 712 may point to the first direction (z-axis direction), and the fourth surface 722 may point to the second direction (-z-axis direction). In this case, the first display 731 may not be observed from the outside (inner folding mode). In an embodiment, the electronic device 700 may be folded so that the second surface 712 of the first shell 710 and the fourth surface 722 of the second shell 720 face each other. In this case, the first display 731 may be arranged to be observed from the outside (outer folding mode).

[0230] According to an embodiment, the first housing 710 (e.g., a first housing structure) may include a first side member 713 that forms an appearance of the electronic device 700 and a first back cover 714 that is combined with the first side member 713 and forms at least a portion of a second surface 712 of the electronic device 700. According to an embodiment, the first side member 713 may include a first side surface 713a, a second side surface 713b extending from one end of the first side surface 713a, and a third side surface 713c extending from the other end of the first side surface 713a. According to an embodiment, the first side member 713 may be formed in a quadrilateral (e.g., square or rectangular) shape by the first side surface 713a, the second side surface 713b, and the third side surface 713c.

[0231] According to an embodiment, the second housing 720 (e.g., a second housing structure) may include a second side member 723 that at least partially forms the appearance of the electronic device 700 and a second side cover 724 that is combined with the second side member 723 and forms at least a portion of the fourth surface 722 of the electronic device 700. According to an embodiment, the second side member 723 may include a fourth side surface 723a, a fifth side surface 723b extending from one end of the fourth side surface 723a, and a sixth side surface 723c extending from the other end of the fourth side surface 723a. According to an embodiment, the second side member 723 may be formed into a quadrilateral by the fourth side surface 723a, the fifth side surface 723b, and the sixth side surface 723c.

[0232] According to an embodiment, the first housing 710 and the second housing 720 are not limited to the shapes and combinations shown, but can be implemented by combinations and / or compositions of other shapes or components. In an embodiment, the first side member 713 can be formed integrally with the first rear cover 714, and the second side member 723 can be formed integrally with the second rear cover 724.

[0233] According to an embodiment, in the unfolded state of the electronic device 700, the second side surface 713b of the first side member 713 and the fifth side surface 723b of the second side member 723 may be connected to each other without a gap. According to an embodiment, in the unfolded state of the electronic device 700, the third side surface 713c of the first side member 713 and the sixth side surface 723c of the second side member 723 may be connected to each other without a gap. According to an embodiment, in the unfolded state of the electronic device 700, the sum of the lengths of the second side surface 713b and the fifth side surface 723b may be configured to be longer than the length of the first side surface 713a and / or the fourth side surface 723a. According to an embodiment, in the unfolded state of the electronic device 700, the sum of the lengths of the third side surface 713c and the sixth side surface 723c may be configured to be longer than the length of the first side surface 713a and / or the fourth side surface 723a.

[0234] refer to Fig.18a and Fig.18b , the first side member 713 and / or the second side member 723 may be formed of metal, or may also include a polymer injected into the metal. According to an embodiment, the first side member 713 and / or the second side member 723 may include at least one conductive portion 716 and / or 726 electrically segmented by at least one segmented portion 7161, 7162 and / or 7261, 7262 formed of a polymer. In this case, at least one conductive portion 716 and / or 726 may be electrically connected to a wireless communication circuit included in the electronic device 700, and thus may be used as at least a portion of an antenna operating in at least one designated frequency band (e.g., a conventional frequency band).

[0235] According to an embodiment, the first back cover 714 and / or the second back cover 724 may be formed of at least one of, for example, coated or colored glass, ceramic, polymer, or metal (eg, aluminum, stainless steel (STS) or magnesium) or a combination of at least two thereof.

[0236] According to an embodiment, the first display 731 may be disposed to extend from the first surface 711 of the first housing 710 across a hinge device (eg, Fig.17b The hinge device 740 of the first housing 720) extends to at least a portion of the third surface 721 of the second housing 720. In an embodiment, the first display 731 may include a first area 730a substantially corresponding to the first surface 711, a second area 730b corresponding to the second surface 721, and a third area 730c (e.g., a flexible area or a folding area) connecting the first area 730a and the second area 730b to each other. According to an embodiment, the third area 730c may be a part of the first area 720a and / or the second area 730b, and may be provided at a position corresponding to the hinge device (e.g., Fig.17b According to an embodiment, the electronic device 700 may include a support hinge device (eg, Fig.17b In an embodiment, the hinge housing 741 may be configured to be exposed to the outside when the electronic device 700 is in a folded state, and when the electronic device 700 is in an unfolded state, the hinge housing 741 is pulled into the internal space of the first housing 710 and the internal space of the second housing 720 so as not to be observed from the outside.

[0237] According to an embodiment, the electronic device 700 may include a second display 731 (e.g., a sub-display) that is separately provided from the first display 731. According to an embodiment, the second display 731 may be provided to be at least partially exposed on the second surface 712 of the first housing 710. In an embodiment, when the electronic device 700 is in a folded state, the second display 732 may display at least a portion of the state information of the electronic device 700 to replace at least a portion of the display function of the first display 731. According to an embodiment, the second display 732 may be provided to be observed from the outside through at least a portion of the first back cover 714. In an embodiment, the second display 732 may be provided on the fourth surface 722 of the second housing 720. In this case, the second display 732 may be provided to be observed from the outside through at least a portion of the second back cover 724.

[0238] According to an embodiment, the electronic device 700 may include at least one of an input device 703 (e.g., a microphone), sound output devices 701 and 702, a sensor module 704, camera devices 705 and 708, a key input device 706, or a connector port 707. In the illustrated embodiment, although the input device 703 (e.g., a microphone), the sound output devices 701 and 702, the sensor module 704, the camera devices 705 and 708, the key input device 706, or the connector port 707 are shown as holes or circular elements formed on the first housing 710 or the second housing 720, they are only exemplarily shown for illustration, but are not limited thereto. According to an embodiment, the input device 703 may include at least one microphone 703 disposed on the second housing 720. In an embodiment, the input device 703 may include a plurality of microphones 703 disposed to sense a sound direction. In an embodiment, the plurality of microphones 703 may be disposed at appropriate positions on the first housing 710 and / or the second housing 720. According to an embodiment, the sound output devices 701 and 702 may include at least one speaker 701 and 702. According to an embodiment, at least one speaker 701 and 702 may include a receiver 701 for talking provided on the first housing 710 and a speaker 702 provided on the second housing 720. In an embodiment, the input device 703, the sound output devices 701 and 702, and the connector port 707 may be provided in a space provided in the first housing 710 and / or the second housing 720 of the electronic device 700, and may be exposed to the external environment through at least one hole formed on the first housing 710 and / or the second housing 720. According to an embodiment, at least one connector port 707 may be used to send power and / or data to and receive power and / or data from an external electronic device. In an embodiment, at least one connector port (e.g., a headphone jack) may accommodate a connector (e.g., a headphone jack) for sending audio signals to and receiving audio signals from an external electronic device. In an embodiment, the holes formed on the first housing 710 and / or the second housing 720 may be used together for the input device 703 and the sound output devices 701 and 702. In an embodiment, the sound output devices 701 and 702 may include speakers (eg, piezoelectric speakers) that are not exposed through holes formed in the first housing 710 and / or the second housing 720 .

[0239] According to an embodiment, the sensor module 704 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 700. According to an embodiment, the sensor module 704 may detect the external environment through the first surface 711 of the first housing 710. In an embodiment, the electronic device 700 may further include at least one sensor module, which is configured to detect the external environment through the second surface 712 of the first housing 710. According to an embodiment, the sensor module 704 (e.g., an illumination sensor) may be configured to detect the external environment through the first display 731 under the first display 731. According to an embodiment, the sensor module 704 may include at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, an illumination sensor, a proximity sensor, a biosensor, an ultrasonic sensor, or an illumination sensor 704.

[0240] According to an embodiment, the camera devices 705 and 708 may include a first camera device 705 (e.g., a front camera device) disposed on a first surface 711 of the first housing 710 and a second camera device 708 disposed on a second surface 712 of the first housing 710. In an embodiment, the electronic device 700 may further include a flash 709 disposed near the second camera device 708. According to an embodiment, the camera devices 705 and 708 may include at least one lens, an image sensor, and / or an image signal processor. According to an embodiment, the camera devices 705 and 708 may be arranged so that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and two or more image sensors are located on one surface (e.g., the first surface 711, the second surface 712, the third surface 721, or the fourth surface 722) of the electronic device 700. In an embodiment, the camera devices 705 and 708 may include a lens for an image sensor and / or a time of flight (TOF).

[0241] According to an embodiment, the key input device 706 (e.g., a key button) may be provided on a third side surface 713c of the first side member 713 of the first housing 710. In an embodiment, the key input device 706 may be provided on at least one of the other side surfaces 713a and 713b of the first housing 710 and / or the side surfaces 723a, 723b, and 723c of the second housing 720. In an embodiment, the electronic device 700 may not include some or all of the key input devices 706, and the key input device 706 not included may be implemented in another form (such as a soft key) on the first display 731. In an embodiment, the key input device 706 may be implemented by using a pressure sensor included in the first display 731.

[0242] According to an embodiment, one of the camera devices 705 and 708 (e.g., the first camera device 705) or the sensor module 704 may be provided to be exposed through the first display 731. According to an embodiment, the first camera device 705 or the sensor module 704 may be optically exposed to the outside through an opening (e.g., a through hole) at least partially formed on the first display 731 in the internal space of the electronic device 700. According to an embodiment, at least a portion of the sensor module 704 may be provided not to be visually exposed through the first display 731 in the internal space of the electronic device 700. Fig.18b , the electronic device 700 may be hinged by a hinge device (eg, Fig.17b In this case, the electronic device 700 may control the first display 731 so that different types of content are displayed on the display area corresponding to the first surface 711 and the display area corresponding to the third surface 721. According to an embodiment, the electronic device 700 may be operated by the hinge device (e.g., Fig.17b The hinge device 740 of the electronic device 700 is in a substantially unfolded state (eg, Fig.17a of the expanded state) and / or the substantially folded state (e.g. Fig.18a In an embodiment, if the electronic device 700 is operated in a folded state by a hinge device (e.g., Fig.17b When the hinge device 740 of the electronic device 700 is unfolded at a specific folding angle, a pressing force is provided in the unfolding direction (direction D1), and the electronic device 700 can be operated to be transformed into the unfolded state (for example, Fig.17a In an embodiment, if the electronic device 700 is unfolded by a hinge device (eg, Fig.17b When the hinge device 740 of the electronic device 700 is unfolded at a specific folding angle, a pressing force is provided in a folding direction (direction D2), and the electronic device 700 can be operated to be transformed into a folded state (for example, Fig.18a In an embodiment, the electronic device 700 may be folded by a hinge device (eg, Fig.17b The hinge device 740) operates to maintain the unfolded state (not shown) at various angles (free stop function).

[0243] Fig.19 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0244] refer to Fig.19, the electronic device 700 may include a first side member 713 (e.g., a first side frame), a second side member 723 (e.g., a second side frame), and a hinge device 740 (e.g., a hinge module or a hinge structure) that rotatably connects the first side member 713 and the second side member 723 to each other. According to an embodiment, the electronic device 700 may include a first support member 7131 (e.g., a first support plate) at least partially extending from the first side member 713 and a second support member 7231 (e.g., a second support plate) at least partially extending from the second side member 723. According to an embodiment, the first support member 7131 may be formed integrally with the first side member 713, or may be structurally combined with the first side member 713. In an embodiment, the second support member 7231 may be formed integrally with the second side member 723, or may be structurally combined with the second side member 723. According to an embodiment, the first display 731 may be provided to be supported by the first support member 7131 and the second support member 7231. According to an embodiment, the electronic device 700 may include a first back cover 714 and a second back cover 724, the first back cover 714 is combined with the first side member 713 and provides a first space together with the first support member 7131, and the second back cover 724 is combined with the second side member 723 and provides a second space together with the second support member 7231. In an embodiment, the first side member 713 and the first back cover 714 may be formed integrally with each other. In an embodiment, the second side member 723 and the second back cover 724 may be formed integrally. According to an embodiment, the first housing 710 may include a first side member 713, a first support member 7131, and a first back cover 714. According to an embodiment, the second housing 720 may include a second side member 723, a second support member 7231, and a second back cover 724. According to an embodiment, the electronic device 700 may include a second display 732, which is arranged to be observed from the outside through at least a partial area of ​​the first back cover 714.

[0245] According to an embodiment, the electronic device 700 may include a first board 761 (e.g., a first board assembly or a main printed circuit board), a camera assembly 763, a first battery 771, or a first bracket 751 disposed in a first space between the first side member 713 and the first rear cover 714. According to an embodiment, the camera assembly 763 may include a plurality of camera devices (e.g., Fig.17a and Fig.18aAccording to an embodiment, the first bracket 758 may provide a support structure for supporting the first board 761 and / or the camera assembly 763 and improved rigidity. According to an embodiment, the electronic device 700 may include a second board 762 (e.g., a second board assembly or a sub-printed circuit board), an antenna 790 (e.g., a coil member), a second battery 772, or a second bracket 759 disposed in a second space between the second side member 723 and the second back cover 724. According to an embodiment, the electronic device 700 may include a plurality of electronic components (e.g., a wiring member 780 (e.g., a flexible printed circuit board (FPCB)) disposed between the second side member 723 and the second back cover 724 from the first board 761 across the hinge device 740, the wiring member 780 being disposed to extend to the second board 762, the second battery 772, or the antenna 790, and providing an electrical connection). According to an embodiment, the antenna 790 may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.

[0246] According to an embodiment, the electronic device 700 may further include a first protective cover 715 (e.g., a first protective frame or a first decorative member) combined along the edge of the first shell 710 and a second protective cover 725 (e.g., a second protective frame or a second decorative member) combined along the edge of the second shell 720. According to an embodiment, the first protective cover 715 and / or the second protective cover 725 may be formed of a metal or polymer material. According to an embodiment, the first protective cover 715 and / or the second protective cover 725 may be used as a decorative member. In this case, the first display 731 may be arranged so that the edge of the first area 730a is not observed from the outside between the first shell 710 and the first protective cover 715. According to an embodiment, the first display 731 may be arranged so that the edge of the second area 730b is not observed from the outside between the second shell 720 and the second protective cover 725.

[0247] According to an embodiment, the electronic device 700 may further include a protection cap 735 configured to protect a third area (eg, Fig.17b In this case, the edge of the third area 730c can be set at the edge of the folding area (for example, Fig.17b A protective cap 735 is provided at a position corresponding to the folding area 730c) to protect the edge of the first display 731.

[0248] According to an embodiment, the first support member 7131 may include a first support surface 7131a pointing to a first direction (z-axis direction) and a second support surface 7131b pointing to a second direction (-z-axis direction) opposite to the first direction. According to an embodiment, in the unfolded state of the electronic device 700, the second support member 7231 may include a third support surface 7231a pointing to the first direction and a fourth support surface 7231b pointing to the second direction. According to an embodiment, the first display 731 may be configured to be supported by the first support surface 7131a of the first support member 7131 and the third support surface 7231a of the second support member 7231.

[0249] According to an embodiment, the electronic device 700 may include at least one waterproof member 751, 752, 753, and 754 disposed between the first display 731 and the second supporting member 7231 and between the first display 731 and the first supporting member 7131. According to an embodiment, some of the at least one waterproof member 751, 752, 753, and 754 may include a first waterproof member 751 disposed between the first display 731 and the second supporting member 7231, a second waterproof member 752 connected to the first waterproof member 751, and a third waterproof member 753 providing a first waterproof space 7513 by connecting one end 7511 of the first waterproof member 751 to one end of the second waterproof member 752 and by connecting the other end 7512 of the first waterproof member 751 to the second waterproof member 752. In an embodiment, the first waterproof member 751, the second waterproof member 752, and / or the third waterproof member 753 may be integrally formed. According to an embodiment, the waterproof member 754 of at least one of the waterproof members 751, 752, 753 and 754 may include a fourth waterproof member 754, which provides a second waterproof space 7541 provided between the first display 731 and the first supporting member 7131 in a closed ring shape. According to an embodiment, a plurality of electronic components including a control circuit (e.g., a display driver IC (DDI)) of the first display 731 are provided in a first sealed waterproof space 7513 formed by the first waterproof member 751, the second waterproof member 752 and the third waterproof member 753 between the first display 731 and the second supporting member 7231, so that they can be protected from external moisture and / or foreign matter. According to an embodiment, at least one electronic component (e.g., a sensor module (e.g., Fig.17a sensor module 704) and / or a camera device (e.g., Fig.17aThe camera device 705) is disposed in a second waterproof space 7541 formed by a closed ring-shaped fourth waterproof member 754 between the first display 731 and the first supporting member 7131, so that it can be protected from external moisture and / or foreign matter. According to an embodiment, the types of components disposed in the first waterproof space 7513 and / or the second waterproof space 7541 are not limited.

[0250] Fig.17a , Fig.17b , Fig.17c , Fig.18a , Fig.18b and Fig.19 The electronic device 700 shown in FIG. 7 may include Figure 1 At least some components of the electronic device 101 shown in .

[0251] Fig.17a , Fig.17b , Fig.17c , Fig.18a , Fig.18b and Fig.19 The electronic device 700 shown in FIG. 7 may include Figure 3 , Figure 4a , Figure 4b , Figure 4c , Figure 4d , Figure 5 , Figure 6a and Figure 6b At least some components of the electronic device 300 shown in .

[0252] Fig.17a , Fig.17b , Fig.17c , Fig.18a , Fig.18b and Fig.19 The electronic device 700 shown in FIG. 7 may include Figure 7 , Figure 8 , Fig. 9 and Fig.10 At least some components of the electronic device 400 shown in .

[0253] Fig.17a , Fig.17b , Fig.17c , Fig.18a , Fig.18b and Fig.19 The electronic device 700 shown in FIG. 7 may include Fig.11 , Fig.12 and Fig.13 At least some components of the electronic device 500 shown in FIG.

[0254] The heat diffusion member 340 , 440 , or 540 according to an embodiment of the present disclosure may be applied to a foldable electronic device 700 . Fig.17a , Fig.17b , Fig.17c , Fig.18a , Fig.18b and Fig.19 The electronic device 700 shown in FIG. 7 may include the heat diffusion member 340 , 440 , or 540 .

[0255] According to one or more embodiments, the heat diffusion member 340 , 440 , or 540 may be disposed between the boards 761 , 762 and the first display 731 and between the batteries 771 , 772 and the first display 731 .

[0256] According to one or more embodiments, the heat diffusion member 340, 440, or 540 may be disposed in at least one of the first housing 710 and the second housing 720. For example, the heat diffusion member 340, 440, or 540 may be disposed in the first housing 710. Alternatively, the heat diffusion member 340, 440, or 540 may be disposed in the second housing 720. Alternatively, the heat diffusion member 340, 440, or 540 may be disposed in the first housing 710 and the second housing 720, respectively.

[0257] According to one or more embodiments, at least one of the first housing 710 or the second housing 720 may include a structure that supports (or surrounds) at least a portion of the heat diffusion member 340, 440, or 540. For example, when the heat diffusion member 340, 440, or 540 is disposed in the first housing 710, the first housing 710 may at least partially include the support region 315, 415, or 515. When the heat diffusion member 340, 440, or 540 is disposed in the second housing 720, the second housing 720 may at least partially include the support region 315, 415, or 515. When the heat diffusion member 340, 440, or 540 is disposed in the first housing 710 and the second housing 720, respectively, the first housing 710 and the second housing 720 may each at least partially include the support region 315, 415, or 515.

[0258] According to one or more embodiments, the heat diffusion member 340, 440 or 540 may be used to diffuse heat generated from a heat source of the electronic device 700 to other regions of the electronic device 700. For example, the heat diffusion member 340, 440 or 540 may diffuse heat generated from the plates 761, 762 to other regions of the electronic device 700.

[0259] The electronic device 300 according to an embodiment of the present disclosure may include: a housing 310; a display 320 disposed on one surface of the housing 310; a printed circuit board 380 disposed in the interior of the housing 310; a battery 330 disposed in one direction of the printed circuit board 380 in the interior of the housing 310 and including a first region 331 and a second region 332 having a thickness smaller than that of the first region 331 and formed at one end facing the printed circuit board 380; and a heat diffusion member 340 disposed between the printed circuit board 380 and the display 320 and between the battery 330 and the display 320, wherein the heat diffusion member 340 may include: a first diffusion region 341, at least a portion of which is disposed to overlap with the printed circuit board 380 and at least a portion of which extends to be disposed in the first region 331 of the battery 330; and a second diffusion region 342 disposed between the second region 332 of the battery 330 and the first diffusion region 341 and extending to overlap with at least a portion of the second region 332.

[0260] In an embodiment, the first diffusion region 341 may extend along a length direction of the electronic device 300 , and the second diffusion region 342 may extend along a width direction of the electronic device.

[0261] In an embodiment, the housing 310 may include a support area 315 , the second diffusion area 342 of the heat diffusion member 340 is disposed on the support area 315 , the second area 332 of the battery 330 may be disposed on one surface of the support area 315 , and the second diffusion area 342 of the heat diffusion member 340 may be disposed on another surface of the support area 315 .

[0262] In an embodiment, the support region 315 may include a first support region 3151 disposed between the second diffusion region 342 of the heat diffusion member 340 and the second region 332 of the battery 330 , and a pair of second support regions 3152 - 1 and 3152 - 2 vertically connected to the first support region 3151 .

[0263] In one embodiment, one second support area 3152-1 of a pair of second support areas 3152-1 and 3152-2 may be disposed on one side of the first support area 3151 and the second diffusion area 342, and the remaining second support area 3152-2 of the pair of second support areas 3152-1 and 3152-2 may be disposed on the other side of the first support area 3151 and the second diffusion area 342.

[0264] In an embodiment, the support region 315 may include a third support region 3153 extending in an opposite direction of the second support region 3152 and facing the second region 332 of the battery 330 .

[0265] In an embodiment, the electronic device 300 may further include at least one flexible printed circuit board 360 electrically connecting internal components of the electronic device 300 .

[0266] In an embodiment, the electronic device 300 may include at least one flexible printed circuit board 360 at least partially disposed in the second region 332 of the battery 330 .

[0267] In an embodiment, at least one flexible printed circuit board 360 may be disposed in one direction of the second region 332 of the battery 330 , and the second diffusion region 342 of the heat diffusion member 340 may be disposed in a second direction opposite to the one direction of the second region 332 of the battery 330 .

[0268] In an embodiment, at least one flexible printed circuit board 360 may include a flexible printed circuit board 360 that electrically connects the battery 330 and the printed circuit board 380 .

[0269] In an embodiment, the heat diffusion member 440 may be integrally formed with a first diffusion region 441 and a second diffusion region 442 .

[0270] In an embodiment, the housing 310 may include a placement space 317 having a shape corresponding to at least a portion of the heat diffusion member, and the heat diffusion member 340 may be at least partially disposed in the placement space 317 .

[0271] In an embodiment, the heat diffusion member 340 may be a first heat diffusion member 540 , and the first heat diffusion member 540 may be disposed in one direction of the printed circuit board 580 .

[0272] In an embodiment, the electronic device 500 may further include a second heat diffusion member 570, one end of which contacts the first heat diffusion member 540, and the other end of the second heat diffusion member 570 (the opposite end of the one end) is arranged in another direction of the printed circuit board 580 (the opposite direction of the one direction).

[0273] In an embodiment, the housing 510 may include a support area 515 on which the second diffusion region 542 of the first heat diffusion member 540 is disposed, and the support area 515 may include a diffusion opening 5151 formed where the second heat diffusion member 570 contacts the first heat diffusion member 540 .

[0274] In an embodiment, the second heat diffusion member 570 may at least partially extend in a height direction of the electronic device 500 .

[0275] In an embodiment, the electronic device 500 may include a camera module 590 disposed on one side of the printed circuit board 580 .

[0276] In an embodiment, the second heat diffusion member 570 may contact the first heat diffusion member 540 at one end and contact the camera module 590 at the other end (the opposite end to the one end).

[0277] In an embodiment, the battery 330 may include a protection circuit module (PCM) disposed in the second region 332 of the battery 330 .

[0278] The electronic device 400 according to an embodiment of the present disclosure may include: a housing 410; a display 320 disposed on one surface of the housing 410; a printed circuit board 380 disposed in the interior of the housing 410; a battery 330 disposed in one direction of the printed circuit board 380 in the interior of the housing 410 and including a first region 331 and a second region 332 formed at one end facing the printed circuit board 380, the second region having a thickness smaller than that of the first region 331; and a heat diffusion member 440 disposed between the printed circuit board 380 and the display 320 to and between the battery 330 and the display 320, wherein the heat diffusion member 440 may include a first diffusion region 441, at least a portion of which is disposed to overlap with the printed circuit board 380, and at least a portion of the first diffusion region 441 extends to be disposed in the first region 331 of the battery 330; and a second diffusion region 442, which extends between the second region 332 of the battery 330 and the first diffusion region 441 in a direction perpendicular to the direction in which the first diffusion region 441 extends, and overlaps with at least a portion of the second region 332.

[0279] In an embodiment, the housing 410 may include a support area 415 , the second diffusion area 442 of the heat diffusion member 440 is disposed on the support area 415 , the second area 332 of the battery 330 may be disposed on one surface of the support area 415 , and the second diffusion area 442 of the heat diffusion member 440 may be disposed on another surface of the support area 415 .

[0280] In an embodiment, the support region 415 may include: a first support region 4151 disposed between the second diffusion region 442 of the heat diffusion member 440 and the second region 332 of the battery 330; and a pair of second support regions 4152-1, 4152-2 vertically connected to the first support region 4151 and disposed on one side and the other side of the second diffusion region 442.

[0281] In an embodiment, the housing 410 may include a placement space 417 having a shape corresponding to at least a portion of the heat diffusion member, and the heat diffusion member 440 may be disposed in the placement space 417 .

[0282] The electronic device 600 , 700 according to one or more embodiments may be a foldable electronic device.

[0283] According to one or more embodiments, the electronic device 600 , 700 may include a first housing 610 , 710 and a second housing 620 , 720 .

[0284] According to one or more embodiments, the first housing 610, 710 and the second housing 620, 720 may be arranged to be foldable relative to each other. The first housing 610, 710 and the second housing 620, 720 may be foldably coupled to each other about folding axes F1, F2.

[0285] According to one or more embodiments, the heat diffusion member 340 , 440 , or 540 may be provided in at least one of the first housing 610 , 710 and the second housing 620 , 720 .

[0286] According to one or more embodiments, the support area 315 , 415 , or 515 may be provided in at least one of the first housing 610 , 710 and the second housing 620 , 720 .

[0287] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0288] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0289] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0290] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0291] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0292] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be detachably arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performs one or more functions before integration.

[0293] According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (300), comprising: Housing (310); a display (320) disposed on a surface of the housing; a printed circuit board (380) disposed within the interior of the housing; a battery (330) disposed in one direction of the printed circuit board in the interior of the housing and comprising a first region (331) and a second region (332), the second region having a thickness smaller than that of the first region and formed at one end facing the printed circuit board; as well as A heat diffusion member (340) is disposed between the printed circuit board and the display and between the battery and the display, wherein The heat diffusion member comprises: a first diffusion region (341), at least a portion of which is arranged to overlap the printed circuit board and at least a portion of which extends to be arranged in the first region of the battery; as well as A second diffusion region (342) is disposed between the second region of the battery and the first diffusion region and extends to overlap at least a portion of the second region.

2. The electronic device according to claim 1, wherein The first diffusion region extends along the length direction of the electronic device; and The second diffusion region extends along a width direction of the electronic device.

3. The electronic device according to claim 1, wherein The housing comprises a support region (315), the second diffusion region of the heat diffusion member being disposed in the support region; The second area of ​​the battery is disposed on a surface of the support area; and The second diffusion region of the heat diffusion member is disposed on the other surface of the support region.

4. The electronic device according to claim 3, wherein The support area includes: a first supporting region (3151) disposed between the second diffusion region of the heat diffusion member and the second region of the battery; as well as a pair of second supporting areas (3152-1, 3152-2) vertically connected to the first supporting area, wherein one second supporting region (3152-1) of the pair of second supporting regions (3152-1, 3152-2) is disposed on one side of the first supporting region and the second diffusion region, and The remaining second supporting region (3152-2) of the pair of second supporting regions (3152-1, 3152-2) is disposed on the other side of the first supporting region and the second diffusion region.

5. The electronic device according to claim 4, wherein The support area includes a third support area (3153) extending in the opposite direction of the second support area and facing the second area of ​​the battery.

6. The electronic device according to claim 1, further comprising at least one flexible printed circuit board (360) disposed at least partially in the second area of ​​the battery.

7. The electronic device according to claim 6, wherein at least one flexible printed circuit board is disposed in one direction of the second region of the battery; and The second region of the heat diffusion member is disposed in a direction opposite to a direction of the second region of the battery.

8. The electronic device according to claim 6, wherein At least one flexible printed circuit board includes a flexible printed circuit board electrically connecting the battery and the printed circuit board.

9. The electronic device according to claim 1, wherein The heat diffusion member is integrally formed of the first diffusion region and the second diffusion region.

10. The electronic device according to claim 9, wherein The housing includes a placement space (317) having a shape corresponding to at least a portion of the heat diffusion member; and At least a portion of the heat diffusion member is disposed in the placement space (317).

11. The electronic device according to claim 1, wherein The heat diffusion member is a first heat diffusion member (540); and The first heat diffusion member is arranged in one direction of the printed circuit board, and further includes a second heat diffusion member (570), one end of which contacts the first heat diffusion member and the other end of which is arranged in a direction opposite to the one direction of the printed circuit board, the other end being the opposite end of the one end.

12. The electronic device according to claim 11, wherein The housing comprises a support area (515), the second diffusion area of ​​the first heat diffusion member being disposed on the support area; and The support area includes a diffusion opening (5151) formed at a position where the second heat diffusion member contacts the first heat diffusion member.

13. The electronic device according to claim 11, wherein At least a portion of the second heat diffusion member extends in a height direction of the electronic device.

14. The electronic device according to claim 11, further comprising a camera module (590) disposed on one side of the printed circuit board, The second heat diffusion member contacts the first heat diffusion member at one end and contacts the camera module at another end opposite to the one end.

15. The electronic device according to claim 1, wherein The battery includes a protection circuit module (PCM) disposed in the second region of the battery.

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