Solder supply device, solder supply method, and printing device

Abstract

The present invention relates to a solder supply device comprising: a storage tank which has a storage space for storing solder and a discharge port which communicates with the storage space and is provided at the bottom thereof, and which is capable of discharging solder downward from the discharge port; a moving body which covers the solder accommodated in the accommodating space from above, and which can move freely in the up-down direction in the accommodating space; a moving body drive mechanism that has a first opening / closing part that switches between pressure feed and pressure feed stop of air to a non-accommodating region above the moving body in the accommodating space, and that presses down the moving body by pressure-feeding air to the non-accommodating region via the first opening / closing part; and a control unit that controls the moving body driving mechanism so that the solder is ejected from the ejection port by the depression of the moving body.

Description

Technical Field

[0001] The present invention relates to a solder supplying technology for supplying solder stored in a storage tank by ejecting it from an ejection port provided at the bottom of the storage tank, and a printing device for printing the solder supplied by the solder supplying technology. Background Art

[0002] A printing device is known for printing solder on a substrate overlapping with the lower surface of a mask plate by moving the solder on the upper surface of a mask plate. The printing device is equipped with a solder supply device for supplying paste solder (sometimes also referred to as "solder paste") to the mask plate. For example, in Patent Document 1, a middle cover is movably arranged in a container constituting a storage tank. And, by pressing down the middle cover by a pushing member having a diameter smaller than the inner diameter of the container, the solder is ejected downward from the front end of a through hole provided at the bottom of the container, i.e., the ejection port.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-174119 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the device described in Patent Document 1, a pressing cylinder is fixedly arranged above the storage tank in order to enable the pusher member to move forward and backward relative to the container. Therefore, in order to arrange the pressing cylinder, a relatively large space needs to be ensured above the storage tank, which is one of the main reasons for the increase in the size of the device in the vertical direction, and further becomes one of the obstacles to the miniaturization of the printing device.

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a solder supplying technology that can realize miniaturization of the device and a printing device equipped with the solder supplying technology.

[0009] Technical solutions to solve problems

[0010] A first aspect of the present invention is a solder supply device, characterized in that it comprises: a storage tank having a storage space for storing solder and a nozzle connected to the storage space and arranged at the bottom, capable of spraying the solder downward from the nozzle; a movable body covering the solder stored in the storage space from above and being able to move freely in the up and down directions within the storage space; a movable body driving mechanism having a first opening and closing portion for switching between pressurizing and stopping air to a non-containment area above the movable body in the storage space, and pressing the movable body down by pressurizing air to the non-containment area via the first opening and closing portion; and a control portion for controlling the movable body driving mechanism to spray the solder from the nozzle by pressing the movable body down.

[0011] The second aspect of the present invention is a solder supply method, characterized in that it includes: a process of setting a movable body relative to a storage tank that stores solder in a storage space in a manner that covers the solder from above and can move freely in the up and down directions within the storage space; and a process of increasing the pressure in a non-containment area in the storage space by pressurizing air to a non-containment area above the movable body, and spraying the solder from a nozzle connected to the bottom of the storage space by pressing down the movable body accompanied by the increase in pressure.

[0012] The third embodiment of the present invention is a printing device, characterized in that it comprises: the above-mentioned solder supply device, which supplies solder to the surface of the mask overlapping with the substrate; and a printing mechanism, which prints the solder on the substrate in a pattern corresponding to the mask by moving the solder supplied from the solder supply device on the surface of the mask.

[0013] In the invention thus constituted, the movable body is pressed down by the air pumped to the non-accommodating area via the first opening and closing portion, thereby ejecting solder from the ejection port. Therefore, compared with the conventional device in which a pressing cylinder is used to press down the movable body, the solder supply device can be miniaturized in the vertical direction.

[0014] Here, as the storage tank, a storage tank having a concave container can also be used, the concave container is open to the top and the interior functions as a storage space, and a discharge port is provided at the bottom. The moving body can also have: a middle cover, which can move freely in the up and down directions while making the side surface slide in contact with the inner wall of the container and making the lower surface abut against the liquid surface of the solder; and a moving member, which can move freely in the up and down directions integrally with the middle cover in a state of being placed on the upper surface of the middle cover. The moving body driving mechanism can also have an outer cover, which is installed on the container in a manner that blocks the opening of the container when the middle cover and the moving member are inserted into the storage space. The first opening and closing part can also be connected to the outer cover in a manner that is connected to the non-storage area sandwiched by the outer cover and the moving member. That is, in the case of providing a storage tank in a state where the middle cover is inserted into the storage space, the middle cover can also be used as a component of the moving body. By using the middle cover as the moving body, the solder can be ejected while suppressing the solder from remaining on the inner wall of the container. In addition, by installing the outer cover on the container to block the opening of the container, the moving body can efficiently press down the solder.

[0015] In addition, the outer cover can be freely attached and detached from the container. In this case, when the solder is exhausted, the movable member can be taken out from the storage space by removing the outer cover. Moreover, the movable member can also be configured to have a lower surface that abuts against the upper surface of the middle cover, an upper surface facing the non-storage area, and a protruding member protruding from the center of the upper surface toward the opening of the container. Due to the presence of the protruding member, the loading and removal operations of the movable member relative to the middle cover become easy.

[0016] In addition, the storage tank may also have a concave container, which opens upward and functions as a storage space inside, and is provided with a spray port at the bottom. The movable body may also have a movable member, which is movable in the up and down directions while making the side surface in sliding contact with the inner wall of the container and making the lower surface abut against the liquid surface of the solder. Alternatively, the movable body driving mechanism may also have an outer cover mounted on the container in a manner that blocks the opening of the container when the movable member is inserted into the storage space, and the first opening and closing portion is connected to the outer cover in a manner that is connected to a non-containment area sandwiched by the outer cover and the movable member. In this case, by mounting the outer cover on the container to block the opening of the container, the airtightness of the non-containment area is improved, and the solder can be pressed down by the movable body efficiently.

[0017] In addition, the moving member may also be configured to include: a flat member having a lower surface; a cylindrical member erected from the peripheral edge of the flat member and having a cylindrical shape on the inner side of the inner wall of the container; and a first protrusion protruding outward from the lower end of the side surface of the cylindrical member and slidingly contacting the inner wall of the container to function as a side portion. In this case, the first protrusion slides in contact with the inner wall of the container to efficiently supply solder.

[0018] In addition, a second protrusion that protrudes from the upper end of the side of the cylindrical member toward the outside and contacts with the inner wall of the container in a sliding manner and functions as a lateral position can also be provided. By arranging two sliding contact positions in the vertical direction like this, the supply efficiency of the solder is further improved. However, due to the existence of the two protrusions separated from each other, the mobile member is not easy to move in the vertical direction. Therefore, considering this point, it is preferred to arrange a notch position in the first protrusion and the second protrusion. That is, the notch position becomes an escape channel for air and can stably move the mobile member in the vertical direction.

[0019] In addition, the storage tank may also have a concave container, which opens upward and functions as a storage space inside, and is provided with a spray port at the bottom. The moving body may also have a moving member, which is free to move in the up and down directions while making the side face opposite to the inner wall of the container in a state of being separated from the inner wall of the container by a small distance, and making the lower surface abut against the liquid surface of the solder. Alternatively, the moving body driving mechanism may also have an outer cover mounted on the container in a manner of blocking the opening of the container when the moving member is inserted into the storage space, and the first opening and closing part is connected to the outer cover in a manner of communicating with a non-containment area sandwiched by the outer cover and the moving member. In this case, a portion of the air that is pressed to the non-containment area is pressed to between the inner wall of the container and the solder via a small gap formed between the inner wall of the container and the moving body. As a result, the amount of solder remaining on the inner wall of the container can be reduced.

[0020] In addition, the outer cover can be freely attached and detached from the container. In this case, when the solder is exhausted, the movable member can be taken out from the storage space by removing the outer cover. In addition, the movable member can also have: an upper surface facing the non-storage area; and a protruding member protruding from the center of the upper surface toward the opening of the container. By providing the protruding member in this way, the loading and removal operations of the movable member relative to the middle cover become easy.

[0021] In addition, the moving body driving mechanism may also be configured to have a second opening and closing portion that switches between suction and suction stop of air from the non-containment area, and the moving body is lifted by sucking air from the non-containment area via the second opening and closing portion. The control unit may also control the moving body driving mechanism to pull the solder from the nozzle by lifting the moving body caused by the reduction of pressure in the non-containment area. For example, the pulling in of solder from the nozzle can be performed by retreating the piston rod of the pressing cylinder of the existing device, but the same problem as the solder spraying occurs. In contrast, in the case where the moving body is lifted by reducing the pressure in the non-containment area, thereby pulling the solder from the nozzle, there is no need for a pressing cylinder, and similarly to the solder spraying, this greatly contributes to the miniaturization of the solder supply device in the up and down directions.

[0022] In addition, the control unit may control the movable body driving mechanism so that when the solder is supplied, the first opening and closing unit and the second opening and closing unit are respectively switched to pressure feeding and suction stop, and on the other hand, during the period of stopping the supply of the solder, the first opening and closing unit and the second opening and closing unit are respectively switched to pressure feeding stop and suction. By controlling the first opening and closing unit and the second opening and closing unit in this way, the solder ejection and the solder pulling can be smoothly switched.

[0023] In addition, the moving body driving mechanism may also be configured to include: a pressure-feeding section that pressurizes and delivers air; a suction section that sucks air; and a flow path switching valve. The flow path switching valve in them may also be configured to include: a first port connected to the non-containment area; a second port connected to the pressure-feeding section; and a third port connected to the suction section, and the flow path switching valve functions as a first opening and closing section by connecting and disconnecting the second port relative to the first port, and functions as a second opening and closing section by connecting and disconnecting the third port relative to the first port. In this way, by using a single flow path switching valve, the structure of the moving body driving mechanism can be simplified.

[0024] Furthermore, a cutter mechanism may be further provided to cut the solder hanging down from the discharge port at a position directly below the discharge port, thereby effectively preventing excess solder from dripping at a timing other than when the solder is discharged.

[0025] The cutter mechanism may also be configured to include: a cutter part that cuts off the solder hanging from the nozzle; and a solder recovery part that receives and recovers the solder that falls due to the cutting of the cutter part, so that the solder cut by the cutter part can be reliably recovered to the solder recovery part. As a result, it is possible to reliably prevent the solder pieces cut by the cutter mechanism from scattering around the device.

[0026] In addition, it can also be configured to further include a tank holding unit that holds a plurality of storage tanks in a horizontal arrangement, and the control unit controls the moving body driving mechanism to select one of the plurality of storage tanks as a selection tank, and to eject solder from the ejection port of the selection tank by pressing the moving body in the storage space of the selection tank. In this case, even if the selection tank becomes empty, solder ejection can be continuously performed by selecting other storage tanks. As a result, solder supply can be performed for a long time.

[0027] Furthermore, a residual amount detection unit may be further provided, and the residual amount detection unit detects the residual amount of solder in each storage tank, and the control unit controls the moving body driving mechanism, so that when the residual amount detection unit detects that the solder remaining in the selection tank is lower than a preset value, the selection tank is selected again from the storage tank that has not been selected as the selection tank, and the solder is ejected from the ejection port of the selection tank by pressing the moving body in the storage space of the reselected selection tank. Thus, the solder stored in the storage tank can be consumed efficiently, thereby reducing the running cost.

[0028] Effects of the Invention

[0029] As described above, according to the present invention, it is possible to efficiently supply solder while achieving reduction in the size of the device in the up-down direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a diagram showing a printing device equipped with a first embodiment of a solder supply device according to the present invention.

[0031] Figure 2 It is a perspective view showing the structure of a solder supply mechanism corresponding to the first embodiment of the solder supply device according to the present invention.

[0032] Figure 3 Is installed in Figure 2 A diagram showing a storage tank of a solder supply mechanism, and accessories and an outer cover mounted on the storage tank.

[0033] Figure 4 It is a diagram showing a solder supply mechanism and an electrical structure connected to the solder supply mechanism.

[0034] Figure 5 This is a diagram schematically showing the structure and operation of a cutter mechanism for cutting solder.

[0035] Fig. 6A An air circuit diagram is shown when positive pressure is applied to the first supply tank and solder is ejected from the first supply tank.

[0036] Figure 6BAn air circuit diagram is shown when negative pressure is applied to the first supply tank to draw solder from the first supply tank.

[0037] Figure 6C An air circuit diagram is shown when positive pressure is applied to the second supply tank and solder is ejected from the second supply tank.

[0038] Fig.6D This is an air circuit diagram showing a case where negative pressure is applied to the second supply tank to draw solder from the second supply tank.

[0039] Figure 7 This is a flowchart showing the operation of a solder supply mechanism that supplies solder using two supply tanks.

[0040] Figure 8 This is a flowchart showing the installation procedure of the operator installing the supply tank to the solder supply mechanism.

[0041] Fig. 9 The figure schematically shows the ejection action, the pulling action, and the cutting action of the solder.

[0042] Fig.10 is a flowchart showing the exhaustion process.

[0043] Fig.11 It is a diagram showing a storage tank, and accessories and an outer cover attached to the storage tank in a second embodiment of the solder supply device according to the present invention.

[0044] Fig.12 It is a diagram schematically showing the discharge operation, the pulling operation, and the cutting operation of the solder in the second embodiment.

[0045] Fig.13 It is a diagram schematically showing the discharge operation of solder in the third embodiment of the solder supply device according to the present invention. DETAILED DESCRIPTION

[0046] Figure 1 FIG. 2 is a diagram showing a printing device equipped with a first embodiment of a solder supply device according to the present invention. Figure 1 In the following drawings, XYZ rectangular coordinate axes are appropriately shown to indicate the positional relationship of each device component. In addition, as necessary, the arrow direction of each coordinate axis is treated as the positive side, and the reverse direction of the arrow of each coordinate axis is treated as the negative side.

[0047] The printing device 100 includes a base 1 having a substantially rectangular parallelepiped shape and a supporting mechanism composed of two supporting frames 2, 2 mounted on the upper surface of the base 1. These supporting frames 2, 2 are respectively gate-shaped frames in which beam members 2b extending in the Y-axis direction are erected on column members 2a, 2a provided at both ends of the base 1 in the Y-axis direction. One of the two supporting frames 2, 2 is arranged at the center of the base 1 in the X-axis direction, and the other supporting frame 2 is arranged at the end of the base 1 in the positive direction of the X-axis. Furthermore, the printing unit 200 is supported on the upper surface of the base 1 between the two supporting frames 2, 2 arranged in the Y-axis direction. On the other hand, the substrate conveying unit 300 is extended in the X-axis direction in a manner passing through the gate-shaped supporting frames 2, 2, and is supported on the upper surface of the base 1.

[0048] The substrate conveying unit 300 is arranged between the loading conveyor and the unloading conveyor which are separated from each other in the X-axis direction, receives the substrate S loaded from the loading conveyor, and conveys it toward the unloading conveyor. In addition, the substrate conveying unit 300 has a function of appropriately stopping the substrate S at the standby position and the printing position Pp which are arranged between the loading conveyor and the unloading conveyor. Specifically, the substrate conveying unit 300 has a structure in which the upper part of two sliding mechanisms 301, 301 extending in the X-axis direction supports the substrate worktable 302. In addition, the substrate worktable 302 moves in the X-axis direction while holding the substrate S on its upper surface, thereby making the substrate S received from the loading conveyor standby at the standby position near the printing unit 200, or conveying it to the printing position Pp in the printing unit 200, or unloading the substrate S which has been printed at the printing position Pp to the unloading conveyor. Then, the printing unit 200 prints the substrate S conveyed to the printing position Pp.

[0049] The printing unit 200 includes: a solder supply mechanism 10; a mask lifting mechanism 20 that lifts and lowers the mask M above the substrate conveying unit 300; and a printing mechanism 30 that prints the solder supplied to the mask M on the substrate S. The solder supply mechanism 10 has a function of supplying solder to the mask M, and corresponds to the first embodiment of the solder supply device involved in the present invention. In addition, the structure and operation of the solder supply mechanism 10 will be described in detail later.

[0050] The mask lifting mechanism 20 is arranged between the above-mentioned support frames 2, 2 arranged along the Y-axis direction on the upper surface of the base 1, and has a general structure of lifting and lowering the mask M by lifting and lowering the mask holding frame 21 holding the mask M using a frame driving unit 22. The frame driving unit 22 rotates pulleys 24 respectively screwed with four ball screw shafts 23 extending downward (in the negative direction of the Z axis) from the mask holding frame 21 by using a servo motor 26 via a belt 25, thereby lifting and lowering the mask holding frame 21.

[0051] When printing on the substrate S, the mask lifting mechanism 20 lowers the mask M. As a result, the lower surface of the mask M overlaps with the upper surface of the substrate S, and the substrate S is transported and fixed to the printing position Pp below the mask M held by the mask holding frame 21. On the other hand, after printing on the substrate S, the mask lifting mechanism 20 raises the mask M, thereby separating the lower surface of the mask M from the upper surface of the substrate S ( Figure 1 status).

[0052] The printing mechanism 30 is supported by the beam members 2b, 2b of the support frames 2, 2 above the mask lifting mechanism 20. The printing mechanism 30 slides the scraper 40 along the Y-axis direction on the upper surface of the mask M supplied with solder, while the mask M and the substrate S are overlapped, thereby printing solder on the substrate S through the pattern holes formed in the mask M. In this embodiment, the printing mechanism 30 has a scraper 40 ( Figure 1 The scraper on the left side) and the scraper 40 ( Figure 1 scraper on the right).

[0053] The printing mechanism 30 has a pressure applying portion 31 that holds the scrapers 40 respectively via a rod 41 that can be extended and retracted in the up and down directions. During printing, the pressure applying portion 31 is pressed against the upper surface of the mask M with a specified pressure by lowering the scraper 40 corresponding to the sliding direction of the two scrapers 40, 40. In addition, a solder supply mechanism 10 is installed on the pressure applying portion 31. In addition, the pressure applying portion 31 and the solder supply mechanism 10 can be moved in the Y-axis direction as a whole through a ball screw mechanism. Specifically, a nut member 34 that is screwed with a ball screw shaft 33 extending in the Y-axis direction is installed on the solder supply mechanism 10, and when the ball screw shaft 33 is rotated by a servo motor 35, the pressure applying portion 31 and the solder supply mechanism 10 move in the Y-axis direction. Therefore, a specified amount of solder SP is supplied to the upper surface of the mask M by the operation of the solder supply mechanism 10. The solder supply mechanism 10 corresponds to the first embodiment of the solder supply device of the present invention, and its structure and operation will be described in detail later.

[0054] In a state where solder paste SP (solder paste) exists on the upper surface of the mask M, the scraper 40 is pressed against the upper surface of the mask M while the servo motor 35 is operated, so that the scraper 40 slides on the upper surface of the mask M in the Y-axis direction, and the solder is printed on the substrate S. In addition, both ends of the axial direction of the ball screw shaft 33 are rotatably supported by fixing members 36 and 37 mounted on the upper surface of the beam member 2b at both ends in the Y-axis direction, and the servo motor 35 is fixed to the fixing member 36.

[0055] Each unit of the printing device 100 configured as above is controlled by a control unit ( Figure 4 The control unit includes, for example, a CPU that performs various calculations, a ROM that is a dedicated readout memory storing basic programs, a RAM that is a freely readable and writable memory storing various information, and a magnetic disk that stores control software and data in advance. In the control unit, the CPU as the main control unit performs calculations in the order described in the program, thereby controlling each part of the printing device 100. Of course, the solder supply mechanism 10 configured as follows is also controlled by the control unit.

[0056] Figure 2 It is a perspective view showing the structure of a solder supply mechanism corresponding to the first embodiment of the solder supply device according to the present invention. Figure 3 Is installed in Figure 2 A diagram showing a storage tank of a solder supply mechanism, and an adapter and an outer cover mounted on the storage tank. Figure 4 The solder supply mechanism 10 supplies the solder SP to the upper surface of the mask M by pushing out the solder SP in the storage tank 11 by air pressure while holding the storage tank 11 containing the solder SP by the tank holding portion 12 .

[0057] like Figure 3 As shown, the storage tank 11 has a container with a concave shape (a cylindrical cup shape in this embodiment) opened upward, and the internal space of the container functions as a storage space 111 for storing solder SP. In addition, at the bottom of the storage tank 11, a nozzle 112 is provided in communication with the storage space 111, and the solder SP can be ejected downward from the nozzle 112. At the time of providing the printing device 100, the middle cover 131 is inserted in a manner of covering the solder SP stored in the storage space 111 from above, and on the other hand, the plug member 14 is installed in the nozzle 112. In the first embodiment, the middle cover 131 is used as a part of the "moving body" of the present invention when the solder is supplied, and on the other hand, the plug member 14 is removed from the storage tank 11 after the storage tank 11 is installed in the tank holding portion 12.

[0058] The middle cover 131 is movable in the vertical direction Z while its side surface is in sliding contact with the inner wall of the storage tank 11 and its lower surface is in contact with the liquid surface of the solder SP. In addition, a fitting 132 is inserted into the storage space 111 of the storage tank 11 with clearance. Figure 3As shown, the accessory 132 has: a lower surface 132a that contacts the upper surface of the middle cover 131; an upper surface 132b that faces upward; and a protruding member 132c that protrudes from the center of the upper surface 132b toward the opening of the container (hereinafter referred to as the "container opening"). By providing the protruding member 132c, the operator can easily place the accessory 132 on the upper surface of the middle cover 131 and remove the accessory 132.

[0059] The fitting 132 is placed on the upper surface of the middle cover 131 and is movable in the vertical direction together with the middle cover 131. That is, the fitting 132 is an example of the "moving member" of the present invention, and cooperates with the middle cover 131 to function as the "moving body" of the present invention.

[0060] The moving body 13 composed of the inner cover 131 and the fitting 132 also functions to divide the storage space 111 into two areas. That is, the storage space 111 is divided into a storage area R1 storing the solder SP below the moving body 13 and a non-storage area R2 above the moving body 13 .

[0061] With respect to the storage tank 11 having the attachment 132 added to the storage space 111, before the storage tank 11 is mounted to the tank holding portion 12, the outer cover 15 is mounted so as to close the opening of the storage tank 11 (see Figure 3 ). In the outer cover 15, an internal thread is formed on the inner side relative to the cover body 151 (refer to the enlarged view in FIG15 ), and the outer cover 15 is installed by rotating the outer cover 15 in a predetermined direction so as to be screwed with the external thread (refer to the enlarged view in FIG15 ) provided at the upper end of the storage tank 11, so that the storage space 111 can be sealed. That is, the installation of the outer cover 15 improves the airtightness of the non-containment area R2. Conversely, by rotating the outer cover 15 to the opposite side, it can be removed from the storage tank 11.

[0062] A port 152 is installed on the top surface of the cover body 151. The port 152 is connected to the non-containment area R2 of the containment space 111. Figure 4 As shown, by installing a one-touch coupling 160 relative to the port 152, the non-containment area R2 is connected to the moving body driving mechanism 16 via the one-touch coupling 160. Therefore, by controlling the internal pressure of the non-containment area R2 by the moving body driving mechanism 16, the moving body 13 moves in the up-down direction Z. Through this movement, the solder SP is ejected and pulled in. In addition, the structure of the moving body driving mechanism 16, the ejection action of the solder SP, and the pulling action of the solder SP will be described in detail later.

[0063] like Figure 3As shown, the plug member 14 is removed at an appropriate timing after the additional insertion of the fitting 132 into the storage space 111 and the installation of the outer cover 15. In order to distinguish the storage tank 11 capable of ejecting solder SP from the purchased storage tank, it is appropriately referred to as "supply tank 10A" in this specification.

[0064] In order to hold the above-mentioned supply tank 10A, a tank holding portion 12 is provided. The tank holding portion 12 comprises: a holding member main body 121 capable of placing two supply tanks 10A in a manner of being arranged in a horizontal direction; and a door main body 122, which is axially supported relative to the holding member main body 121 in a manner of being freely rotatable around a rotation axis AX extending in the up-down direction Z. The holding member main body 121 has a supporting member 123 for supporting the outer cover 15 of the supply tank 10A from the back side. The supporting member 123 has two arc-shaped cutout portions that can engage with the outer side of the outer cover 15 when viewed from above. In addition, the same cutout portions are also provided on the door main body 122. Therefore, if Figure 2 As shown, when the door body 122 is separated from the supporting member 123, the supply tank 10A can be installed on the retaining member body 121 and the tank in which the solder SP in the supply tank 10A becomes empty (hereinafter appropriately referred to as an "empty tank") can be removed from the retaining member body 121.

[0065] On the other hand, in a state where both the two supply tanks 10A are placed on the holder body 121, when the door body 122 and the support member 123 are integrated, as shown in FIG. Figure 4 As shown in FIG. 1 , the supply tank 10A is sandwiched by the door body 122 and the support member 123. Thus, the two supply tanks 10A are firmly held in the solder supply mechanism 10. In addition, for the convenience of the following description, Figure 2 As shown in the figure, the supply tank 10A or the empty tank on the right side when viewed from the door body 122 side, that is, in the (+Y) direction, is referred to as the "first supply tank 10A1" and the "first empty tank", respectively. On the other hand, the supply tank 10A or the empty tank on the left side when viewed from the door body 122 side is referred to as the "second supply tank 10A2" and the "second empty tank", respectively.

[0066] As the solder is ejected, the remaining amount of solder SP in the supply tanks 10A1 and 10A2 decreases. Therefore, solder remaining amount sensors 171 and 172 are respectively provided near the lower ends of the supply tanks 10A1 and 10A2 to detect the amount of solder remaining in the storage space 111. Thus, the solder remaining amount sensors 171 and 172 are equivalent to an example of the "remaining amount detection unit" of the present invention. Figure 2 In the figure, only the solder remaining amount sensor 172 is shown. In this embodiment, the solder remaining amount sensors 171 and 172 are electrostatic capacitance type. In addition, in order to detect the width of the solder SP ejected from each supply tank 10A1 and 10A2, as shown in FIG. Figure 2 As shown, the solder width sensor 173 is fixedly arranged on the holder body 121 via a sensor mounting member 174 .

[0067] Figure 5 Schematically shows the structure and operation of the cutter mechanism for cutting solder. Figure 2 , Figure 4 and Figure 5 The structure and operation of the cutter mechanism 18 will be described. The cutter mechanism 18 has a function of removing and recovering the front end of the solder SP that has not been completely drawn into the ejection port 112 in the drawing operation described later. Figure 2 , Figure 4 and Figure 5 As shown in FIG. 1 , the cutter mechanism 18 has a cutter support portion 181 fixed to the lower surface of the holder body 121. The cutter support portion 181 is provided with two through holes 182, 182 corresponding to the two ejection ports 112. Figure 4 and Figure 5 In FIG. 1 , only the through hole 182 provided corresponding to the discharge port 112 of the first supplyable tank 10A1 is shown.

[0068] At a position directly below the cutter support portion 181, the cutter portion 183 is arranged to be able to move freely relative to the space directly below the through hole 182 (hereinafter referred to as the "cutting space"). In addition, a box-shaped solder recovery portion 184 is installed obliquely below the cutter portion 183, and can move horizontally together with the cutter portion 183. In addition, the piston of the cylinder 185 is connected to the rear end of the cutter portion 183. Figure 4 As shown in FIG. 1 , the air cylinder 185 is connected to a cutter driving unit 186. The cutter driving unit 186 sends compressed air into the air cylinder 185 according to a driving instruction from the control unit 500 of the printing device 100 to drive the piston of the air cylinder 185. For example, the piston of the air cylinder 185 is contracted by the cutter driving unit 186, so that Figure 5 Column (a) and Figure 4 As shown in FIG. 1 , the cutter section 183 and the solder recovery section 184 are retracted from the cutting space to the cylinder 185 side. In this state, the solder SP is ejected from the ejection port 112 and supplied to the upper surface of the mask M. On the other hand, the piston of the cylinder 185 is extended by the cutter driving section 186, so that Figure 5As shown in the column (b), the front end of the cutter part 183, i.e., the blade part, cuts off the solder SP existing in the cutting space, and recovers it from the blade part to the solder recovery part 184 that moves to the cutting space with a slight delay. In addition, in the present embodiment, the control part 500 repeatedly performs a small amount of forward and backward movement at the timing when the blade part moves to the cutting space to cut off the solder SP hanging down to the cutting space. Therefore, the solder SP can be reliably cut off. In addition, when the cutting operation is completed, the cutter part 183 stops in a state of blocking the through hole 182. Thus, even if it accidentally hangs down from the nozzle 112, it can be effectively prevented from falling onto the mask M.

[0069] Next, refer to FIG. 6A to FIG. 6D The structure and operation of the moving body driving mechanism 16 will be described. FIG. 6A to FIG. 6D It is a diagram showing the structure and operation of the moving body driving mechanism. Fig. 6A An air circuit diagram is shown when positive pressure is applied to the first supply tank 10A1 and the solder SP is ejected from the first supply tank 10A1. Figure 6B An air circuit diagram is shown when negative pressure is applied to the first supply tank 10A1 to draw the solder SP from the first supply tank 10A1. Figure 6C An air circuit diagram is shown when a positive pressure is applied to the second supply tank 10A2 and the solder SP is ejected from the second supply tank 10A2. Fig.6D FIG. 1 is an air circuit diagram when negative pressure is applied to the second supply tank 10A2 and the solder SP is drawn from the second supply tank 10A2. In addition, the black arrows and the white arrows in these drawings represent positive pressure and negative pressure, respectively. Figure 6A to Figure 6D Among the symbols indicating valves, a symbol with a black triangular portion indicates that the valve is open, and a symbol with a white triangular portion indicates that the valve is closed.

[0070] and, Figure 6A to Figure 6D Reference numerals 191 and 192 in the figure are indicator lamps attached to the tank holding portion 12. The indicator lamp 191 is lit during use of the first supply tank 10A1, while the indicator lamp 192 is lit during use of the second supply tank 10A2.

[0071] The moving body driving mechanism 16 has: a regulator 161, which functions as a pressure-feeding unit that pressurizes air while appropriately changing the pressure of compressed air when it is pressed and fed to each supply tank 10A1, 10A2, that is, the size of the positive pressure; a vacuum ejector 162, which functions as a suction unit for generating negative pressure, and the negative pressure is used to suck air from each supply tank 10A1, 10A2; a pneumatic valve 163, which switches between positive pressure and negative pressure; and a pneumatic valve 164, which switches the supply destination of positive pressure and negative pressure. In addition, in order to selectively switch the following four working states, namely:

[0072] (a) The discharging action of the solder SP in the first supply tank 10A1;

[0073] (b) the pulling action of the solder SP in the first supply tank 10A1;

[0074] (c) the ejection action of the solder SP in the second supply tank 10A2; and

[0075] (d) the pulling-in action of the solder SP in the second supply tank 10A2,

[0076] Three control valves 165-167 are provided.

[0077] The regulator 161 is connected to a compressed air supply source 168 via a control valve 165. As the compressed air supply source 168, for example, an energy device of a factory in which the printing device 100 is installed can be used. When the control valve 165 is opened according to an opening instruction from the control unit 500, compressed air is supplied to the regulator 161 and adjusted to a positive pressure suitable for solder ejection. Therefore, in this embodiment, the control valve 165 functions as a valve for solder ejection. In addition, in order to monitor the pressure at this time, a positive pressure sensor 169 is connected to the regulator 161.

[0078] The vacuum ejector 162 has a supply port 162a, an exhaust port 162b, and a vacuum port 162c, and functions as an example of the "suction unit" of the present invention. The supply port 162a is connected to the compressed air supply source 168 via the control valve 166. Therefore, when the control valve 166 becomes an open state according to the opening instruction from the control unit 500, compressed air is supplied to the supply port 162a, flows inside the ejector, and flows out from the exhaust port 162b. At this time, a suction force is generated in the vacuum port 162c. The suction force is used to apply negative pressure to each supply tank 10A1, 10A2. On the other hand, when the control valve 166 becomes a closed state according to the closing instruction from the control unit 500, the suction performed by the vacuum ejector 162 stops. Therefore, the control valve 166 functions as a valve for pulling in solder, and can switch between suction and suction stop based on the pneumatic valve 163. However, in the present embodiment, the control valve 166 also cooperates with the air operated valve 163 to function as a switching valve between positive pressure and negative pressure.

[0079] The pneumatic valve 163 has four ports 163a to 163d. Port 163a is connected to the control valve 166. Port 163b is connected to the non-containment area R2 of the supply tanks 10A1 and 10A2 via another pneumatic valve 164 and the outer cover 15. The remaining two ports 163c and 163d are connected to the output of the regulator 161 and the vacuum port 162c of the vacuum ejector 162, respectively. Among them, ports 163b to 163d are respectively equivalent to the "first port", "second port" and "third port" of the present invention.

[0080] The pneumatic valve 163 has a positive pressure supply flow path connecting the port 163b and the port 163c, and a negative pressure supply flow path connecting the port 163b and the port 163d. When the pressure received by the port 163a exceeds the threshold value, the pneumatic valve 163 connects the negative pressure supply flow path and cuts off the positive pressure supply flow path, and when the pressure received by the port 163a becomes less than the above threshold value, the pneumatic valve 163 connects the positive pressure supply flow path and cuts off the negative pressure supply flow path. That is, the pneumatic valve 163 functions as a first opening and closing part that controls the connection and disconnection of the port 163b and the port 163c, and functions as a second opening and closing part that controls the connection and disconnection of the port 163b and the port 163d. Therefore, when the control valve 166 is in the open state, as described above, the vacuum ejector 162 operates to generate negative pressure, and the negative pressure can be applied to the supplyable tanks 10A1 and 10A2 along the negative pressure supply flow path. On the contrary, when the control valve 166 is closed, positive pressure can be applied to the supplyable tanks 10A1 and 10A2 along the positive pressure supply flow path. Thus, in the present embodiment, the air operated valve 163 functions as an example of the "flow path switching valve" of the present invention.

[0081] The port 163b of the pneumatic valve 163 is connected to the port 164b of the pneumatic valve 164. The pneumatic valve 164 has, in addition to the port 164b, a port 164a connected to the control valve 167, a port 164c connected to the first supplyable tank 10A1, and a port 164d connected to the second supplyable tank 10A2. The pneumatic valve 164 has a first tank flow path connecting the port 164b and the port 164c, and a second tank flow path connecting the port 164b and the port 164d. The pneumatic valve 164 is configured so that when the pressure applied to the port 164a exceeds a threshold value, the first tank flow path is connected, and when the pressure is below the threshold value, the second tank flow path is connected. Therefore, when the control valve 167 is in an open state, positive pressure or negative pressure is applied to the first supplyable tank 10A1 via the first tank flow path. On the contrary, when the control valve 167 is in the closed state, positive pressure or negative pressure is applied to the second supplyable tank 10A2 via the second tank flow path. In this way, the control valve 167 functions as a tank switching valve.

[0082] In the moving body drive mechanism 16 configured in this way, the operating state is switched as shown in Table 1 by the combination of the open / closed states of the control valves 165 to 167 shown below.

[0083] [Table 1]

[0084]

[0085] In the present embodiment, the open / closed states of the control valves 165 to 167 are switched according to a program of the control unit 500 of the printing device 100 . However, a control unit that performs the switching may be provided in the solder supply mechanism 10 corresponding to the solder supply device of the present invention.

[0086] Next, refer to Figures 7 to 10 The supply operation of the solder SP by the solder supply mechanism 10 will be described. Figure 7 This is a flowchart showing the operation of the solder supply mechanism that supplies solder using two supply tanks. At appropriate timing, such as when the printing device 100 is powered on or when maintenance is completed, the control unit 500 determines whether both the first supply tank 10A1 and the second supply tank 10A2 are held in the tank holding unit 12 (step S1). This determination can be performed using, for example, the solder remaining amount sensors 171 and 172.

[0087] When the control unit 500 determines "yes" in step S1, it skips step S2 and proceeds to step S3. On the other hand, when at least one of the first supply tank 10A1 and the second supply tank 10A2 is not installed relative to the tank holding portion 12, the control unit 500 determines "no" in step S1, and displays a message urging the operator to install the first supply tank 10A1 and / or the second supply tank 10A2 on the display unit of the printing device 100 (not shown) for notification. Then, the operator performs the tank installation process (step S2). When the tank installation process is performed and it is confirmed that both the first supply tank 10A1 and the second supply tank 10A2 are held in the tank holding portion 12, the control unit 500 proceeds to the next step S3.

[0088] Figure 8 Flowchart showing the installation sequence of the supply tank to the solder supply mechanism by the operator. The storage tank 11 is provided in a state where the solder SP stored in the storage space 111 is covered with the middle cover 131 and the plug member 14 is inserted into the ejection port 112. In the present embodiment, the solder supply is performed using the middle cover 131. Therefore, the operator sets the accessory 132 on the middle cover 131 while retaining the middle cover 131 (step S21). Next, the operator installs the outer cover 15 in a manner that blocks the opening of the storage tank 11 (step S22). Thus, the preparation of the supply tank 10A is completed.

[0089] Next, the operator rotates the door body 122 about the rotation axis AX, as shown in FIG. Figure 2 As shown (step S23). As a result, the tank loading space is opened, and the operator sets the two supply tanks 10A in the released loading space in a manner of arranging them in the horizontal direction (step S24). Then, the operator installs the one-touch coupling 160 on the port 152 of each supply tank 10A (step S25). As a result, the first supply tank 10A1 and the second supply tank 10A2 are connected to the movable body driving mechanism 16. Thereafter, the operator removes the plug member 14 from the ejection outlets 112 of the first supply tank 10A1 and the second supply tank 10A2, and rotates the door body 122 in the opposite direction around the rotation axis AX, as shown. Figure 4 The door body 122 is closed as shown (step S26). In this way, the installation of the two supply tanks 10A1 and 10A2 is completed.

[0090] return Figure 7 , and refer to Fig. 9 Continue with the description. Fig. 9 Schematically showing the solder ejection action, pulling action and cutting action. After the preparation of the two supply tanks 10A1 and 10A2 filled with solder SP is completed as described above, when the solder ejection instruction is provided from the control unit 500 to the movable body driving mechanism 16, the first supply tank 10A1 is first selected as the "selected tank" of the present invention. Then, the solder SP of the amount corresponding to the solder ejection instruction is ejected from the first supply tank 10A1 (solder ejection process: step S3). That is, as Fig. 6A As shown in FIG. 1 , the moving body driving mechanism 16 sets the valves 165 to 167 to “open”, “close”, and “close” respectively. Fig. 9 As shown in the column (a) of FIG. 1 , compressed air is supplied to the first supply tank 10A1, and the non-containment area R2 is pressurized to a value exceeding the atmospheric pressure. As a result, the moving body 13 (= accessory 132 + middle cover 131) moves downward, and the solder SP corresponding to the pressure adjusted by the regulator 161 is pushed downward from the ejection port 112. Through this solder ejection process, the solder SP is supplied to the upper surface of the mask M.

[0091] After the solder supply is completed, Figure 6B As shown in FIG. 1 , the moving body driving mechanism 16 sets the valves 165 to 167 to “close”, “open”, and “close” respectively. Fig. 9As shown in the column (b) of FIG. 1 , negative pressure is applied to the first supply tank 10A1, that is, the air in the non-containment area R2 is sucked. As a result, the non-containment area R2 is depressurized to a value lower than the atmospheric pressure, and the moving body 13 (= accessory 132 + middle cover 131) moves upward. With this movement, the solder SP hanging from the ejection port 112 is pulled into the side of the containment space 111 (solder pulling process: step S4).

[0092] Next, while the non-containment area R2 of the first supply tank 10A1 is kept depressurized, the cutter driving unit 186 receives the cutting command from the control unit 500 and extends the piston of the cylinder 185, whereby the front end (blade portion) of the cutter unit 183 cuts off the solder SP hanging from the discharge port 112, and the solder recovery unit 184 operates to recover the cut pieces of the solder SP (solder cutting process: step S5). Thus, it is possible to effectively prevent the solder SP from dripping from the discharge port 112 from the completion of the supply of the solder SP to the next solder discharge process (step S6). In addition, the cut solder pieces are recovered in the solder recovery unit 184, so that it is possible to reliably prevent the solder pieces from scattering around the device.

[0093] Then, when a solder ejection instruction is provided from the control unit 500 to the movable body driving mechanism 16, the solder SP of the amount corresponding to the solder ejection instruction is ejected from the first supply tank 10A1 in the same manner as step S3 (solder ejection process: step S6). By repeating the solder ejection process in this way, the amount of solder SP contained in the first supply tank 10A1 decreases. Therefore, in the present embodiment, each time solder ejection is repeated from the first supply tank 10A1, based on the detection signal from the solder remaining amount sensor 171 disposed close to the first supply tank 10A1, when the amount of solder SP remaining in the first supply tank 10A1 is lower than a preset set value, the control unit 500 determines that the remaining amount is reduced (step S7). In the present embodiment, the above threshold value means the amount of solder that can be ejected several times (equivalent to the remaining amount count m described below) of solder ejection.

[0094] While the remaining amount is above the threshold value in step S7 ("No" in step S7), the process returns to step S4 and the solder supply is repeated. On the other hand, when the remaining amount is below the threshold value, that is, the solder supply based on the remaining solder SP is the remaining number of times, the control unit 500 executes Fig.10 The exhaustion process (step S8) is shown.

[0095] Fig.10is a flowchart showing the exhaustion process. The control unit 500 controls each part of the solder supply mechanism 10 according to the above-mentioned procedure, thereby efficiently using the solder SP remaining in the first supply tank 10A1 without waste. The control unit 500 calculates the executable number of times the solder ejection process using the solder SP remaining in the first supply tank 10A1 can be performed, and sets the executable number as the remaining count m (step S81). Then, similarly to the above-mentioned steps S4 to S5, the control unit 500 performs the solder pulling process (step S82) and the solder cutting process (step S83), and displays the fact that the remaining solder in the first supply tank 10A1 is reduced on the display unit (not shown) to warn the operator (step S84).

[0096] Next, the control unit 500 decrements the remaining count m by "1" (step S85), and then further determines whether the remaining count m becomes zero (step S86). Here, when the remaining count m is a value greater than zero, that is, when the solder ejection process using the solder SP remaining in the first supply tank 10A1 can still be performed, the control unit 500 returns to step S82 after performing the solder ejection process (step S87) and repeats the solder pulling process (step S82) and the solder cutting process (step S83).

[0097] On the other hand, when the remaining amount counter m becomes zero, that is, when the first supplyable tank 10A1 becomes the first empty tank, the control unit 500 displays the remaining amount as zero on the display unit to warn the operator (step S88).

[0098] Next, return Figure 7 The description will be continued. When the solder cannot be supplied from the first supply tank 10A1, the control unit 500 turns off the display light 191 and turns on the display light 192. By switching the light display, the operator is informed that the supply tank 10A used for solder supply is switched from the first supply tank 10A1 to the second supply tank 10A2. In addition, the control unit 500 starts supplying the solder SP from the second supply tank 10A2.

[0099] Supplying solder from the second supply tank 10A2 is basically the same as supplying solder from the second supply tank 10A2. That is, at this stage, although the first supply tank 10A1 becomes the first empty tank, the second supply tank 10A2 is sufficiently filled with solder SP. Therefore, when the control unit 500 provides a solder ejection instruction to the movable body drive mechanism 16, the solder SP in an amount corresponding to the solder ejection instruction is ejected from the second supply tank 10A2 (solder ejection process: step S9). That is, as shown in FIG. Figure 6CAs shown, the moving body driving mechanism 16 sets the valves 165 to 167 to "open", "closed", and "open", respectively. As a result, compressed air is supplied to the second supply tank 10A2, and the non-containment area R2 is pressurized to a value exceeding the atmospheric pressure. As a result, the solder SP is supplied to the upper surface of the mask M in the same manner as step S3.

[0100] After the solder supply is completed, Fig.6D As shown, the movable body driving mechanism 16 sets the valves 165 to 167 to "closed", "opened", and "opened", respectively. As a result, the non-containment area R2 is depressurized to a value lower than the atmospheric pressure, and the solder SP hanging from the nozzle 112 is pulled into the side of the containment space 111 (solder pulling process: step S10). Next, while the non-containment area R2 of the second supply tank 10A2 is kept depressurized, the cutter driving unit 186 receiving the cutting command from the control unit 500 extends the piston of the cylinder 185, whereby the front end portion (blade portion) of the cutter unit 183 cuts off the solder SP hanging from the nozzle 112, and the solder recovery unit 184 operates to recover the cut pieces of the solder SP (solder cutting process: step S11).

[0101] Furthermore, when a solder ejection instruction is provided from the control unit 500 to the movable body driving mechanism 16, the solder SP of the amount corresponding to the solder ejection instruction is ejected from the second supply tank 10A2 in the same manner as step S9 (solder ejection processing: step S12). By repeating the solder ejection processing in this way, the amount of solder SP contained in the second supply tank 10A2 decreases. Therefore, in the same manner as step S7, each time solder ejection is repeated from the second supply tank 10A2, based on the detection signal from the solder remaining amount sensor 172 disposed close to the second supply tank 10A2, when the amount of solder SP remaining in the second supply tank 10A2 is lower than a preset set value, the control unit 500 determines that the remaining amount is reduced (step S13).

[0102] Then, while the remaining amount is above the threshold value in step S13, the process returns to step S10 and the solder supply is repeated. On the other hand, when the remaining amount is below the threshold value, that is, the solder supply based on the remaining solder SP becomes the remaining number of times, the control unit 500 executes Fig.10 The exhaustion process (step S14) is shown.

[0103] If the second supplyable tank 10A2 also becomes the second empty tank as a result of the exhaustion process (step S14), solder supply cannot be continued. Therefore, the control unit 500 displays this fact on the display unit (not shown) to inform the operator. Figure 7As shown, when the operator confirms that the used cans, that is, the first empty can and the second empty can have been removed from the can holding portion 12 (step S15), the control unit 500 returns to step S2 to repeat a series of processes.

[0104] As described above, according to the first embodiment, the air valve 163 corresponding to the "first opening and closing portion" of the present invention is used to switch between the compressed air supply and the compressed air stop to each supply tank 10A1, 10A2. And the air through the air valve 163 is compressed and sent to the non-containment area R2 of the supply tank 10A1, 10A2, thereby the movable body 13 moves downward, and the solder SP is ejected downward from the ejection port 112. In this way, the solder SP is supplied from each supply tank 10A1, 10A2 by compressed air. Therefore, compared with the conventional device using the push cylinder, the solder SP can be efficiently supplied while achieving the reduction of the device size in the vertical direction Z. The same is true for the solder pull-in. The movable body 13 is lifted by the pressure reduction in the non-containment area R2, thereby eliminating the need for the press cylinder used in the conventional device to pull the solder SP from the ejection port 112, and similarly to the solder ejection, the solder SP hanging from the ejection port 112 can be efficiently pulled back while achieving the reduction of the device size in the vertical direction Z.

[0105] In addition, in the first embodiment, the middle cover 131 attached to the purchased storage tank 11 together with the solder SP can freely move in the vertical direction in the storage space 111 in a state where the side surface is in sliding contact with the inner wall of the container of the storage tank 11 (hereinafter referred to as "container inner wall") and the lower surface is in contact with the liquid surface of the solder SP, so the middle cover 131 can be effectively used as a movable body 13. In addition, compared with the embodiment in which the solder SP is pressed down only by the fitting as described below, the adhesion of the solder SP to the fitting 132 can be greatly reduced. That is, the effect suitable for the reuse of the fitting 132 can be obtained.

[0106] The air operated valve 163 has both the functions of the "first opening and closing section" and the "second opening and closing section" of the present invention, and switches between the negative pressure supply flow path and the positive pressure supply flow path. Therefore, the structure of the moving body driving mechanism 16 can be simplified.

[0107] In addition, if Figure 7 As shown, since the solder is supplied from the two supplyable tanks, the first supplyable tank 10A1 and the second supplyable tank 10A2, in sequence, the solder can be supplied for a long time.

[0108] When the solder remaining amount sensor 171 detects that the remaining amount of solder SP in the first supply tank 10A1 is reduced, the Fig.10When the solder remaining amount sensor 172 detects that the remaining amount of solder SP in the second supply tank 10A2 is reduced, the same exhaustion process (step S8) is performed. Therefore, the solder SP stored in each supply tank 10A1, 10A2 can be consumed efficiently.

[0109] Fig.11 1 is a diagram showing a storage tank, accessories and an outer cover mounted on the storage tank in a second embodiment of the solder supply device according to the present invention. Fig.12 1 is a diagram schematically showing the ejection action, the pulling action, and the cutting action of the solder in the second embodiment. The second embodiment is greatly different from the first embodiment in the structure of the moving body 13, and the other structures and actions are basically the same as the first embodiment. Therefore, the following description will focus on the differences, and the same structures and actions are marked with the same reference numerals and the description is omitted.

[0110] In a second embodiment, if Fig.11 As shown, the operator prepares the supply tanks 10A1 and 10A2 in the following order. That is, the operator removes the middle cover (see Figure 3 After that, the accessory 133 which functions as an example of the "moving member" of the present invention is inserted into the storage space 111. Next, the operator attaches the outer cover 15 to the storage tank 11. In this way, the supply tanks 10A1 and 10A2 are obtained.

[0111] The accessory 133 has: a flat plate member 133a in the shape of a circular plate, which has a lower surface that can abut against the liquid surface of the solder SP; and a cylindrical member 133b, which is erected from the peripheral edge of the flat plate member 133a and is cylindrical in shape on the inner side of the container inner wall of the storage tank 11. The accessory 133 has a cup shape that opens upward. Moreover, the first protrusion 133c and the second protrusion 133d are protruding outward from the side of the cylindrical member 133b. In more detail, the first protrusion 133c is provided in a flange shape from the lower end of the side of the cylindrical member 133b, and its side portion is provided so as to be able to slide in contact with the container inner wall of the storage tank 11. In addition, the second protrusion 133d is provided in a flange shape from the upper end of the side of the cylindrical member 133b, and its side portion is provided so as to be able to slide in contact with the container inner wall of the storage tank 11. Therefore, as Fig.12 As shown, the accessory 133 inserted into the storage space 111 is freely movable in the vertical direction while making the first protrusion 133c and the second protrusion 133d slide against the inner wall of the storage tank 11 and making the lower surface of the flat member 133a contact the liquid surface of the solder SP. Therefore, the solder ejection process and the solder pulling process are respectively performed in the same manner as in the first embodiment. That is, as Fig.12As shown in the column (a) of FIG. 1 , when compressed air is supplied to the supply tank 10A, the moving body 13 (= accessory 133) moves downward and pushes the solder SP downward from the ejection port 112. Through this solder ejection process, the solder SP is supplied to the upper surface of the mask M. In addition, when negative pressure is applied to the supply tank 10A, that is, when the air in the non-containment area R2 is sucked, the moving body 13 (= accessory 133) moves upward, and with this, the solder SP hanging from the ejection port 112 is pulled into the containment space 111 side.

[0112] In addition, a plurality of cutouts 133e are provided at equal angle intervals on the first protrusion 133c and the second protrusion 133d. Fig.11 As shown by the dotted arrow in FIG. 1 , even when the accessory 133 is inserted into the storage space 111, the gas component can flow in the vertical direction along the inner wall surface of the storage tank 11. That is, it becomes an escape channel for the air. Fig.12 As shown, the attachment 133 can stably move in the vertical direction according to the application of positive or negative pressure to the non-containment area R2 while maintaining the posture in which the side parts of the first protrusion 133c and the second protrusion 133d are in sliding contact with the container inner wall of the storage tank 11.

[0113] Also, in the accessory 133, similarly to the first embodiment, a protruding member 133f is protruded from the center of the upper surface of the flat member 133a toward the container opening. Therefore, the operator can easily place the accessory 133 on the liquid surface of the solder SP stored in the storage tank 11 and remove the accessory 133.

[0114] Fig.13 : is a diagram schematically showing the solder ejection action in the third embodiment of the solder supply device involved in the present invention. In the third embodiment, instead of the accessory 133 used in the second embodiment, an accessory 134 without the first protrusion 133c and the second protrusion 133d is used. Therefore, the outer side surface of the accessory 134 is separated from the container inner wall of the storage tank 11 by a small distance. That is, an annular small gap GP is formed between the container inner wall of the storage tank 11 and the accessory 134, and the small gap GP becomes a path for compressed air. Therefore, when compressed air is supplied to the supply tank 10A, the movable body 13 (= accessory 134) moves downward and pushes the solder SP downward from the ejection port 112. Through this solder ejection process, the solder SP is supplied to the upper surface of the mask M. In addition, in the solder ejection process, as Fig.13 As shown in the partial enlarged view of , a part of the compressed air (the dotted line in the figure) is pressed into the space between the inner wall of the container of the storage tank 11 and the solder SP through the small gap GP. Therefore, in addition to the same effects as those of the above embodiment, the following effects can be obtained.

[0115] In the device described in patent document 1, the pushing member is pressed down by the pressing cylinder while being in sliding contact with the container. Therefore, the solder easily remains on the inner wall of the container, and it is difficult to supply the solder efficiently. In contrast, in the third embodiment, air is pressed to the solder SP in contact with the inner wall of the container of the storage tank 11 through a small gap GP. As a result, the solder SP is also ejected downward through the ejection port 112. As a result, the amount of solder remaining on the inner wall of the container of the storage tank 11 can be reduced, thereby enabling the solder SP to be efficiently supplied to the mask M.

[0116] In addition, the present invention is not limited to the above-mentioned embodiment, and various changes can be made outside the above-mentioned embodiment as long as it does not deviate from the main purpose. For example, in the above-mentioned embodiment, the solder supply mechanism 10 in which two supply tanks 10A are arranged in the tank holding portion 12 is used as an example of the "solder supply device" of the present invention, and the present invention is applied to the solder supply mechanism 10, but the number of supply tanks 10A is not limited to "2". For example, three or more supply tanks 10A can be arranged in an array. In addition, the present invention can also be applied to a solder supply mechanism (solder supply device) that uses a single supply tank 10A to supply solder.

[0117] In the above-described embodiment, the air operated valves 163 and 164 are used to switch between positive pressure and negative pressure and to switch the supply destination. However, the movable body drive mechanism 16 may be configured to perform switching using other valves.

[0118] Industrial Applicability

[0119] The present invention can be applied to all solder supply technologies that supply solder stored in a storage tank by ejecting it from a ejection port provided at the bottom of the storage tank.

[0120] Description of symbols

[0121] 10 ... solder supply mechanism (solder supply device);

[0122] 10A, 10A1, 10A2…can supply tanks;

[0123] 10A1 ... first supply tank;

[0124] 10A2 ... second supply tank;

[0125] 11…containment tank;

[0126] 12 ... tank holding portion;

[0127] 13… mobile body;

[0128] 15…outer cover;

[0129] 16… moving body driving mechanism;

[0130] 18…cutter mechanism;

[0131] 30…Printing institutions;

[0132] 100…Printing device;

[0133] 111…Containment space;

[0134] 112…Spout;

[0135] 131…middle cover;

[0136] 132, 133, 134… Accessories (moving components);

[0137] 132a ...lower surface (of accessory);

[0138] 132b…upper surface (of accessory);

[0139] 132c, 133f ... protruding arrangement components;

[0140] 133a ... flat plate member;

[0141] 133b ... a cylindrical member;

[0142] 133c ... a first protrusion;

[0143] 133d ... a second protrusion;

[0144] 133e…Incision site;

[0145] 161… regulator (pressure delivery unit);

[0146] 162 ... vacuum ejector (suction unit);

[0147] 163 ... pneumatic valve (first opening and closing part, second opening and closing part, flow path switching valve);

[0148] 171, 172 ... solder remaining amount sensor (remaining amount detection unit);

[0149] 500…Control Department;

[0150] GP…Micro Gap;

[0151] M…Mask;

[0152] R1…Containment area;

[0153] R2…Non-containment area;

[0154] S…Substrate;

[0155] SP…Solder;

[0156] Z…up and down direction.

Claims

1. A solder supply device, characterized in that: have: A storage tank having a storage space for storing solder and a spray port connected to the storage space and arranged at the bottom, and capable of spraying the solder downward from the spray port; A movable body, covering the solder contained in the containing space from above and being movable in the containing space in an up-and-down direction; The moving body driving mechanism has a first opening and closing part for switching between pressurizing and stopping the air to a non-containment area above the moving body in the containing space, and the moving body is pressed down by pressurizing the air to the non-containment area via the first opening and closing part; and The control unit controls the movable body driving mechanism so that the solder is ejected from the ejection port by pressing down the movable body.

2. The solder supply device according to claim 1, wherein: The storage tank has a concave container that opens upward and has an interior that functions as the storage space, and the ejection port is provided at the bottom. The movable body comprises: a middle cover which is movable in the vertical direction while its side surface is in sliding contact with the inner wall of the container and its lower surface is in contact with the liquid surface of the solder; and a movable member which is movable in the vertical direction integrally with the middle cover in a state of being placed on the upper surface of the middle cover, The moving body driving mechanism further includes an outer cover which is mounted on the container in such a manner as to block the opening of the container when the middle cover and the moving member are inserted into the accommodation space. The first opening and closing portion is connected to the outer cover so as to communicate with the non-accommodation region sandwiched between the outer cover and the moving member.

3. The solder supply device according to claim 2, wherein: The outer cover is removable relative to the container. The moving member comprises: a lower surface abutting against the upper surface of the middle cover; an upper surface facing the non-accommodation area; and a protruding member protruding from the center of the upper surface toward the opening of the container.

4. The solder supply device according to claim 1, wherein: The storage tank has a concave container that opens upward and has an interior that functions as the storage space, and the ejection port is provided at the bottom. The moving body has a moving member that is movable in the vertical direction while making the side surface slide in contact with the inner wall of the container and making the lower surface abut against the liquid surface of the solder. The moving body driving mechanism further includes an outer cover which is mounted on the container so as to block the opening of the container when the moving member is inserted into the housing space. The first opening and closing portion is connected to the outer cover so as to communicate with the non-accommodation region sandwiched between the outer cover and the moving member.

5. The solder supply device according to claim 4, wherein: The mobile component also has: a plate member having the lower surface; a cylindrical member which is erected from the peripheral edge of the flat member and has a cylindrical shape on the inner side of the inner wall of the container; and The first protrusion protrudes outward from a lower end portion of the side surface of the cylindrical member and is in sliding contact with the inner wall of the container.

6. The solder supply device according to claim 5, wherein: The solder supply device further includes a second protrusion that protrudes outward from an upper end portion of the side surface of the cylindrical member and is in sliding contact with an inner wall of the container.

7. The solder supply device according to claim 6, wherein: The first protrusion and the second protrusion have cutout portions.

8. The solder supply device according to claim 1, wherein: The storage tank has a concave container that opens upward and has an interior that functions as the storage space, and the ejection port is provided at the bottom. The movable body has a movable member that is movable in the vertical direction while the side surface is opposed to the inner wall of the container with a small distance therefrom and the lower surface is in contact with the liquid surface of the solder. The moving body driving mechanism further includes an outer cover which is mounted on the container so as to block the opening of the container when the moving member is inserted into the housing space. The first opening and closing portion is connected to the outer cover so as to communicate with the non-accommodation region sandwiched between the outer cover and the moving member.

9. The solder supply device according to claim 4 or 8, wherein: The outer cover is removable relative to the container. The moving member includes: an upper surface facing the non-accommodation area; and a protruding member protruding from a central portion of the upper surface toward an opening of the container.

10. The solder supply device according to claim 1, wherein: The moving body driving mechanism includes a second opening and closing portion for switching between suction and suction stop of the air from the non-containment area, and the moving body is lifted by sucking the air from the non-containment area via the second opening and closing portion. The control unit controls the movable body driving mechanism so that the solder is pulled in from the discharge port by lifting the movable body due to a decrease in pressure in the non-accommodation region.

11. The solder supply device according to claim 10, wherein: The control unit controls the moving body driving mechanism so that When the solder is supplied, the first opening and closing section and the second opening and closing section are switched to pressure feeding and suction stop, respectively. While the supply of the solder is stopped, the first opening and closing section and the second opening and closing section are switched to pressure feed stop and suction, respectively.

12. The solder supply device according to claim 11, wherein: The moving body driving mechanism comprises: A pressure-feeding unit, for pressurizing and delivering the air; a suction unit for sucking the air; and A flow path switching valve comprises: a first port connected to the non-containment area; a second port connected to the pressure delivery part; and a third port connected to the suction part. The flow path switching valve functions as the first opening and closing part by connecting and disconnecting the second port relative to the first port, and functions as the second opening and closing part by connecting and disconnecting the third port relative to the first port.

13. The solder supply device according to claim 1, wherein: The solder supply device further includes a cutter mechanism that cuts the solder hanging down from the discharge port at a position directly below the discharge port.

14. The solder supply device according to claim 13, wherein: The cutter mechanism includes: a cutter part that cuts the solder hanging down from the discharge port; and a solder recovery part that receives and recovers the solder dropped by the cutting of the cutter part.

15. The solder supply device according to claim 1, wherein: The solder supply device further includes a tank holding portion that holds the plurality of storage tanks in a horizontally aligned manner. The control unit controls the moving body driving mechanism to select one of the plurality of storage tanks as a selection tank, and discharges the solder from a discharge port of the selection tank by pressing the moving body in the storage space of the selection tank.

16. The solder supply device according to claim 15, wherein: The solder supply device further includes a remaining amount detection unit configured to detect the remaining amount of the solder in each storage tank. The control unit controls the moving body driving mechanism so that when the remaining amount detection unit detects that the solder remaining in the selection tank is lower than a preset set value, the selection tank is selected from the storage tanks that have not been selected as the selection tank, and the solder is ejected from the ejection port of the selection tank by pressing the moving body in the storage space of the selected selection tank.

17. A solder supply method, characterized in that: include: A step of providing a movable body with respect to a storage tank containing solder in a storage space so as to cover the solder from above and be movable in a vertical direction within the storage space; and The process includes: supplying air under pressure to a non-containment region above the movable body in the containment space to increase the pressure in the non-containment region; and ejecting the solder from an ejection port connected to a bottom of the containment space due to the depression of the movable body accompanying the increase in pressure.

18. A printing device, characterized in that: have: The solder supplying device according to any one of claims 1 to 16, which supplies solder to a surface of the mask overlapping with the substrate; and The printing mechanism moves the solder supplied from the solder supply device on the surface of the mask, thereby printing the solder on the substrate in a pattern corresponding to the mask.

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