Ceramic chip removing device

Abstract

Provided is a ceramic chip removal device capable of easily removing ceramic chips, which are residues of a ceramic green sheet, from the surface of a support film. The ceramic chip removing device (100) is characterized by comprising a conveying mechanism (20), a cooling mechanism (30) and a stripping mechanism (40), wherein the conveying mechanism (20) is used for conveying a film (1) which comprises a supporting film (3) and ceramic chips (7) which are residues of ceramic green sheets and attached to the surface (3a) of the supporting film (3); the cooling mechanism (30) is used for cooling the ceramic chips (7); and the stripping mechanism (40) is used for stripping the cooled ceramic chips (7) from the supporting film (3).

Description

Technical Field

[0001] The invention relates to a ceramic chip removing device. Background Art

[0002] As a method for manufacturing electronic components such as laminated ceramic capacitors, there is known a method of laminating ceramic green sheets obtained by forming ceramic materials into sheets before firing, press-forming them, and then firing and singulating them, thereby mass-producing small electronic components at one time.

[0003] Generally, in order to improve handling properties, a ceramic green sheet is formed on the surface of a resin film (also referred to as a supporting film) serving as a support, and is peeled off from the surface of the supporting film when used.

[0004] When the ceramic green sheet is peeled off from the support film, a part of the ceramic green sheet may remain on the surface of the support film. In order to reuse such a support film, a step of cleaning (removing) ceramic scraps which are residues of the ceramic green sheet is required.

[0005] For example, Patent Document 1 discloses a method for recycling a release film including a film cleaning step of bringing a first bonding roller into contact with a resin film to cause adherent matter adhered to the resin film to adhere to the first bonding roller.

[0006] Prior Art Literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2010-005597 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] However, in recent years, as electronic components have become smaller, the ceramic green sheet has been made thinner. When the ceramic green sheet is made thinner, the handling property is reduced. Therefore, in order to suppress this, the holding force between the ceramic green sheet and the support film may be increased.

[0011] Therefore, in the method described in Patent Document 1, the holding force between the ceramic green sheet and the support film is strong, and the ceramic scraps that are the residue of the ceramic green sheet may not be completely removed.

[0012] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a ceramic chip removing device capable of easily removing ceramic chips, which are residues of a ceramic green sheet, from the surface of a supporting film.

[0013] Means used to solve problems

[0014] The ceramic chips removal device of the present invention is characterized in that it comprises: a conveying mechanism for conveying a film including a supporting film and ceramic chips as residues of ceramic raw sheets attached to the surface of the supporting film; a cooling mechanism for cooling the ceramic chips; and a peeling mechanism for peeling the cooled ceramic chips from the supporting film.

[0015] Effects of the Invention

[0016] According to the present invention, ceramic scraps, which are residues of the ceramic green sheet, can be easily removed from the surface of the supporting film. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention.

[0018] Figure 2 This is a cross-sectional view schematically showing an example of the ceramic chip removing device of the present invention.

[0019] Figure 3 yes Figure 2 A partial enlarged view of the peeling mechanism and its surroundings.

[0020] Figure 4 is a cross-sectional view schematically showing another example of the peeling mechanism.

[0021] Description of Reference Numerals

[0022] 1: membrane;

[0023] 3: Support membrane;

[0024] 3a: surface of the supporting film (upper surface);

[0025] 3b: surface of the supporting film (lower surface);

[0026] 5: Unpeeled ceramic green sheet;

[0027] 6: Peeling residue of ceramic green sheet;

[0028] 7: Ceramic chips;

[0029] 10: Shell;

[0030] 20: conveying mechanism;

[0031] 21: conveying roller;

[0032] 23: tension adjustment roller;

[0033] 25: suction roller;

[0034] 30: cooling mechanism;

[0035] 40: stripping mechanism;

[0036] 41: Components with sharp angles;

[0037] 41a: acute angle part;

[0038] 43: Blow out the mouth;

[0039] 50: Roll-out mechanism;

[0040] 60: coiling mechanism;

[0041] 70: dust collecting mechanism;

[0042] 71: suction mouth;

[0043] 73: Suction hose;

[0044] 75: chip storage part;

[0045] 100: Ceramic chip removal device;

[0046] θ1: The angle formed by the acute angle part;

[0047] θ2: deformation angle. DETAILED DESCRIPTION

[0048] The ceramic chip removal device of the present invention is described below. However, the present invention is not limited to the following structure, and can be appropriately changed and applied within the scope of not changing the main purpose of the present invention. In addition, the structure obtained by combining two or more of the preferred structures of the present invention described below is also the present invention.

[0049] In this specification, terms that indicate the relationship between elements (for example, "opposite", "orthogonal", etc.) and terms that indicate the shape of an element (for example, "rectangular", etc.) do not have strict meanings but rather indicate a range of substantial equivalence, for example, also including a difference of a few percent.

[0050] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, and scales may differ from those of actual products.

[0051] [Ceramic chips removal device]

[0052] The ceramic chips removal device of the present invention is characterized in that it comprises: a conveying mechanism for conveying a film including a supporting film and ceramic chips as residues of ceramic raw sheets attached to the surface of the supporting film; a cooling mechanism for cooling the ceramic chips; and a peeling mechanism for peeling the cooled ceramic chips from the supporting film.

[0053] Figure 1 This is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention.

[0054] Figure 1 The film 1 shown includes a support film 3 and ceramic chips 7 as residues of a ceramic green sheet adhering to the surface of the support film 3 .

[0055] The supporting film 3 has a sheet shape in which a surface 3 a serving as an upper surface and a surface 3 b serving as a lower surface face each other, and the ceramic chips 7 are attached to the surface 3 a serving as the upper surface of the supporting film 3 .

[0056] The film 1 is in a state where ceramic green sheets of a predetermined shape are cut out from a laminated sheet in which a support film 3 and ceramic green sheets are laminated and then peeled off.

[0057] Since a part of the ceramic green sheet stacked on the surface of the supporting film 3 is cut out for use, a part that is not cut out remains on the surface of the supporting film.

[0058] It is Figure 1 The ceramic green sheet 5 is shown as not being peeled off.

[0059] Even when the ceramic green sheet stacked on the surface of the support film 3 is peeled off, the ceramic green sheet may not be completely peeled off. In such a case, fine fragments of the ceramic green sheet (unpeeled fragments) remain on the surface of the support film after the ceramic green sheet is peeled off.

[0060] It is Figure 1 The peeling residue 6 of the ceramic green sheet is shown.

[0061] As described above, the ceramic green sheets 5 that have not been peeled off and the peeling residues 6 of the ceramic green sheets adhere to the surface 3 a of the film 1 as ceramic chips 7 .

[0062] The ceramic chip removing device of the present invention is a device for removing ceramic chips from the above-mentioned film.

[0063] Figure 2 This is a cross-sectional view schematically showing an example of the ceramic chip removing device of the present invention.

[0064] Figure 2 The ceramic chip removing device 100 shown includes a housing 10 , and a conveying mechanism 20 , a cooling mechanism 30 , and a peeling mechanism 40 which are arranged in the housing 10 .

[0065] The transport mechanism 20 is a mechanism for transporting the film 1 .

[0066] The transport mechanism 20 includes a transport roller 21 for transporting the film 1 , a dancer roller 23 for adjusting the tension of the transported film 1 , and a suction roller 25 for preventing the propagation of the tension.

[0067] Figure 2The thin one-way arrow in shows the direction in which the film 1 is conveyed. In addition, the thin two-way arrow indicates that the dancer roller 23 can move in the up-and-down direction.

[0068] The film 1 is unwound from the unwinding mechanism 50 to the conveying mechanism 20 .

[0069] The cooling mechanism 30 is a mechanism for cooling the ceramic chips constituting the film 1 .

[0070] Figure 2 The cooling mechanism 30 shown in the figure introduces cooled gas into the housing 10 (at Figure 2 In the figure, the thick one-way arrow shows the mechanism.

[0071] The inside of the housing 10 is cooled by the cooled gas, thereby cooling the film 1 conveyed in the housing 10. As a result, the ceramic chips constituting the film 1 are also cooled.

[0072] The peeling mechanism 40 is a mechanism for peeling the cooled ceramic chips from the support film.

[0073] Figure 2 The peeling mechanism 40 shown includes an acute angled member 41 .

[0074] The peeled ceramic chips are collected by the dust collecting mechanism 70 .

[0075] The dust collecting mechanism 70 includes a suction nozzle 71 for sucking the peeled ceramic chips, a chip storage portion 75 for storing the ceramic chips, and a suction hose 73 connecting the suction nozzle 71 and the chip storage portion 75 .

[0076] The film (support film) from which the ceramic chips have been peeled off by the peeling mechanism 40 is wound up by the winding mechanism 60 .

[0077] Hereinafter, each mechanism constituting the ceramic chip removing device of the present invention will be described.

[0078] (Conveying mechanism)

[0079] The transport mechanism is a mechanism for transporting the film.

[0080] As a conveyance mechanism, a conveyance roller which conveys a film by rotation is mentioned, for example.

[0081] The transport mechanism may include, in addition to the transport rollers described above, a dancer roller for adjusting the tension of the film during transport, a suction roller for preventing the tension from being transmitted to the upstream side, and the like.

[0082] The speed (conveying speed) at which the film is conveyed by the conveying mechanism is not particularly limited, but is preferably 100 m / min or more. In addition, the conveying speed is preferably 200 m / min or less.

[0083] The ceramic chip removing device of the present invention may include a winding-out mechanism and a winding-up mechanism.

[0084] The unwinding mechanism is a mechanism for unwinding the film with respect to the conveying mechanism.

[0085] The winding mechanism is a mechanism for winding up the film (support film) from which the ceramic chips have been removed.

[0086] The unwinding mechanism may also be configured to be rotatable. In this case, the film is conveyed by the conveying mechanism, and thus the unwinding mechanism is rotatable to unwind the film.

[0087] (Cooling mechanism)

[0088] The cooling mechanism is a mechanism for cooling the ceramic chips.

[0089] The object to be cooled by the cooling mechanism is not limited to ceramic chips.

[0090] That is, the cooling mechanism may cool the ceramic chips together with the film, may cool the ceramic chips together with the winding mechanism around which the film is wound, or may cool the ceramic chips together with the casing.

[0091] The cooling mechanism is preferably a mechanism for cooling the ceramic chips to 20° C. or lower, and more preferably a mechanism for cooling the ceramic chips to 18° C. or lower.

[0092] The position and timing for cooling the ceramic chips may be any position as long as it is before the peeling by the peeling mechanism.

[0093] Therefore, the ceramic chips can be cooled while being wound up by the winding mechanism, can be cooled while being transported from the unwinding mechanism to the transport mechanism, can be cooled while being transported by the transport mechanism, and can be cooled around the peeling mechanism described later.

[0094] For example, a mechanism for cooling ceramic chips by introducing cooled gas into the housing can be said to be a mechanism for cooling the ceramic chips together with the housing, and corresponds to a cooling mechanism.

[0095] As a cooling mechanism, for example, there is a mechanism for introducing a gas having a temperature of 0° C. or higher and 20° C. or lower into the periphery of the peeling mechanism.

[0096] The gas introduced by the cooling mechanism is preferably air.

[0097] Furthermore, the humidity of the gas introduced at this time is preferably low. For example, the humidity is preferably 10% or less at 20°C.

[0098] When the humidity is higher than the above humidity, there is a possibility that condensation may occur on the surface of the supporting film.

[0099] In the ceramic chip removing device of the present invention, a coolant cooled to a temperature of 0° C. or higher and 20° C. or lower may be used as the cooling means.

[0100] For example, such a cooling mechanism may be arranged at the center of the unwinding mechanism.

[0101] That is, in the ceramic chip removing device of the present invention, a coolant cooled to 0° C. or higher and 20° C. or lower may be disposed at the center of the unwinding mechanism as the cooling mechanism.

[0102] In this case, the unwinding mechanism preferably includes a mechanism for fixing or holding the cooling mechanism disposed at the center.

[0103] As a coolant, a metal rod cooled to 0° C. or higher and 20° C. or lower can be mentioned, for example.

[0104] The metal constituting the metal rod is not particularly limited, but is preferably a metal containing aluminum, iron with high thermal conductivity, copper, or the like.

[0105] The refrigerant may be cooled by storing it in a refrigerator or the like before use.

[0106] Furthermore, the refrigerant may be in gaseous or liquid form.

[0107] Examples of the liquid coolant include water and nitrogen.

[0108] When a coolant is used, for example, a mechanism in which the coolant circulates in a flow path including the center of the unwinding mechanism to cool the ceramic chips by the unwinding mechanism can be mentioned.

[0109] The cooling mechanism may include two or more of the above-mentioned mechanisms.

[0110] (Peeling mechanism)

[0111] The peeling mechanism is a mechanism for peeling ceramic chips constituting the film from the supporting film.

[0112] The peeling mechanism may include, for example, a member that presses the acute angle of the film from the supporting film side.

[0113] The acute-angle member is a member having a "portion (acute-angle portion) whose cross-sectional shape forms an acute angle".

[0114] By pressing the acute angle portion from the support film side of the film, the running direction of the film can be changed, and ceramic chips that cannot follow the change can be peeled off.

[0115] The angle of the acute angle portion may be an acute angle (less than 90°), but is preferably 30° to 70°, and more preferably 30° to 60°.

[0116] Preferably, R is provided at the acute angle portion.

[0117] By providing R at the acute angle portion, stress applied to the supporting film can be suppressed, thereby suppressing breakage of the supporting film.

[0118] Sometimes, a notch is formed in the support film during the process of pressing the ceramic green sheet, and the support film may be damaged starting from the notch. If R is provided at the acute angle portion, it is possible to prevent the support film from being damaged starting from the notch.

[0119] The strength of the member pressing the acute angle is not particularly limited, but is preferably such a strength that the increase in tension applied to the supporting film by pressing the acute angle member from the supporting film side is about 10 N to 20 N.

[0120] The deformation angle of the film caused by pressing the acute-angled member is preferably 20° or more and less than 90°.

[0121] Figure 3 yes Figure 2 A partial enlarged view of the peeling mechanism and its surroundings.

[0122] like Figure 3 As shown, the peeling mechanism 40 is composed of a sharp-angled member 41 .

[0123] The acute-angled member 41 has an angle formed at its front end (at Figure 3 , the angle (denoted by θ1) is an acute angle portion 41a.

[0124] The acute-angled member 41 presses the film 1 so that the acute-angled portion 41 a comes into contact with the film 1 .

[0125] It can be said that the pressing of the acute-angled member 41 changes the traveling direction of the supporting film 3 constituting the film 1. Figure 3 In the figure, the angle shown in θ2 is also called the deformation angle.

[0126] Here, the supporting film 3 constituting the membrane 1 has sufficient flexibility and can therefore follow the deformation caused by the acute-angled member 41 .

[0127] On the other hand, the ceramic chips 7 constituting the film are cooled by the cooling mechanism, so that the resin component constituting the ceramic chips 7 solidifies and becomes hard as a whole. Therefore, the ceramic chips 7 cannot follow the deformation like the supporting film 3 and cannot be peeled off from the surface of the supporting film 3 .

[0128] The peeled ceramic chips 7 are sucked by the suction nozzle 71 and recovered in the chip storage portion 75 via the suction hose 73 .

[0129] like Figure 3As shown, it is preferred that the acute-angled member 41 presses the film 1 downward in the vertical direction (downward in the paper, in the direction in which the suction nozzle 71 is arranged). If the film 1 is pressed in this direction, the peeled ceramic chips 7 fall due to gravity, thereby preventing re-attachment to the supporting film 3.

[0130] The suction nozzle 71 is disposed at a position opposite to the acute-angle member 41 across the film 1. The ceramic chips 7 peeled off by pressing the acute-angle member 41 are peeled off toward the side opposite to the acute-angle member 41, so if the suction nozzle 71 is disposed at a position opposite to the acute-angle member 41 across the film 1, it is easy to recover the peeled ceramic chips 7.

[0131] In addition, the length of the acute-angle member in the width direction is preferably greater than the width of the film.

[0132] The width direction referred to herein is a direction perpendicular to the direction in which the film is conveyed.

[0133] If the length of the acute-angle member in the width direction is equal to or greater than the width of the film, all ceramic chips on the surface of the support film can be peeled off by using one acute-angle member for the entire portion in the width direction of the film.

[0134] The peeling mechanism may include a blowing nozzle for blowing compressed gas toward the ceramic chips in addition to the above-mentioned acute-angle member.

[0135] Specifically, the peeling mechanism includes a member that presses the acute angle of the film from the supporting film side and a blowing nozzle that blows compressed gas toward the ceramic chips to blow the ceramic chips off from the surface of the supporting film.

[0136] Reference Figure 4 An example of a peeling mechanism including a blowing nozzle will be described.

[0137] Figure 4 is a cross-sectional view schematically showing another example of the peeling mechanism.

[0138] Figure 4 The stripping mechanism 40 shown in FIG. Figure 3 In addition to the acute-angled member 41 shown, a blow-out nozzle 43 is also provided.

[0139] The tip of the blowing nozzle 43 is disposed so as to face between the ceramic chips 7 and the supporting film 3 at the moment of separation from the supporting film 3 by the acute-angled member 41 , that is, at a position that becomes the starting point of separation between the supporting film 3 and the ceramic chips 7 .

[0140] By blowing the compressed gas toward the position that becomes the starting point of separation between the support film 3 and the ceramic chips 7 , the ceramic chips 7 can also be separated from the starting point of separation, so that the ceramic chips 7 can be easily separated.

[0141] That is, it is preferable that the blowing nozzle 43 is arranged on the downstream side of the acute-angle member 41 and is arranged so as to blow the compressed gas toward the upstream side.

[0142] The air volume of the compressed gas blown out through the blowing nozzle is preferably 200 L / min or more and 400 L / min or less.

[0143] The temperature of the compressed gas blown out from the blowing nozzle is preferably 0° C. or higher and 20° C. or lower.

[0144] If the temperature of the compressed gas blown from the blowing nozzle is 0° C. or higher and 20° C. or lower, the ceramic chips are not softened when peeling them off. Therefore, the ceramic chips cooled by the cooling mechanism are not prevented from peeling off.

[0145] In addition, the blowing nozzle that blows out the compressed gas at a temperature of 0° C. or higher and 20° C. or lower is at most a peeling mechanism, and does not correspond to a cooling mechanism.

[0146] The temperature of the compressed gas mentioned here means the temperature of the gas blown out from the blowing nozzle, and does not mean the temperature of the compressed gas stored in the pressure container.

[0147] The humidity of the compressed gas blown out from the blowing nozzle at 20° C. is preferably 10% or less.

[0148] Examples of the peeling mechanism other than the above include removal by a brush, scraping by a blade, and removal by vibration.

[0149] (Supporting film)

[0150] A supporting film constituting a membrane suitable for use in the ceramic chip removing device of the present invention will be described.

[0151] As the support film constituting the membrane, a conventionally known support film can be appropriately used.

[0152] The support film may be, for example, a multilayer film in which a release layer is formed on one surface of a base film serving as a base layer, and a back surface resin layer is formed on the other surface.

[0153] Examples of the resin constituting the substrate layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polysulfone, polyetheretherketone, polyethersulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, and acrylic resin.

[0154] Among them, polyester is preferred from the viewpoint of ease of processing, durability, heat resistance, cost, and the like, and polyethylene terephthalate is particularly preferred.

[0155] In addition to the above-mentioned resin, a filler may be added to the base material layer.

[0156] The substrate film constituting the substrate layer may be an unstretched film, but is preferably a uniaxially or biaxially stretched film.

[0157] The release layer can be formed, for example, by applying a release layer-forming composition on one surface of a base film, and heating and curing the composition.

[0158] The back surface resin layer can be formed, for example, by applying a back surface resin layer forming composition on the other main surface of the base film, and heating and curing the composition.

[0159] The width of the supporting film is not particularly limited, but is preferably, for example, 100 mm or more and 200 mm or less.

[0160] (Ceramic chips)

[0161] The ceramic chips constituting the film suitable for use in the ceramic chip removing device of the present invention will be described.

[0162] The ceramic chips are residues of the ceramic green sheet disposed on the surface of the support film.

[0163] The ceramic green sheet can be obtained, for example, by applying a slurry prepared by adding a plasticizer and an organic solvent to a ceramic material such as barium titanate and an organic binder, onto the surface of a supporting film, and drying the slurry.

[0164] The ceramic green sheet can be handled together with the support film, and then the ceramic green sheet having a predetermined shape is cut out and peeled off from the support film, and then used in the production of electronic components.

[0165] The ceramic green sheets that are not peeled off from the support film and the fine fragments of the ceramic green sheets that remain on the surface of the support film after peeling (peeling residues) become ceramic chips.

[0166] As described above, the ceramic chips are residues of the ceramic green sheet remaining on the support film, and therefore the composition of the ceramic chips is the same as that of the ceramic green sheet.

[0167] Examples of the ceramic material include barium titanate.

[0168] Metal paste that becomes internal electrodes may be printed on the surface of the ceramic green sheet, and therefore, the ceramic scraps may contain residues of the metal paste.

[0169] The ceramic chip removing device of the present invention is preferably applied to a film to which ceramic chips having a thickness of 3 μm or less are attached.

[0170] Ceramic green sheets are thinned as electronic components are miniaturized, and ceramic green sheets with a thickness of 3 μm or less are sometimes used. If the thickness of the ceramic green sheet is 3 μm or less, in order to improve the operability of the ceramic green sheet, it is necessary to increase the holding force between the ceramic green sheet and the supporting film. In this case, it is sometimes difficult to peel the ceramic chips from the supporting film. If the ceramic chip removal device of the present invention is used, the peelability of the ceramic chips can be improved, and therefore it can also be appropriately applied to a film in which the ceramic chips with a thickness of 3 μm or less are strongly attached to the supporting film.

[0171] In this specification, the following matters are described.

[0172] The present disclosure (1) is a ceramic chip removal device, characterized in that it comprises:

[0173] a conveying mechanism for conveying a film including a supporting film and ceramic scraps as residues of a ceramic green sheet adhering to a surface of the supporting film;

[0174] A cooling mechanism for cooling the ceramic chips; and

[0175] The peeling mechanism peels the cooled ceramic chips from the supporting film.

[0176] The present disclosure (2) is based on the ceramic chip removing device described in the present disclosure (1), wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 20° C. or less.

[0177] The present disclosure (3) is based on the ceramic chip removing device described in the present disclosure (1), wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 18° C. or less.

[0178] The present disclosure (4) is a ceramic chip removing device based on any combination of any of the present disclosures (1) to (3), wherein the cooling mechanism has a mechanism for introducing a gas having a temperature of 0° C. or higher and 20° C. or lower into the vicinity of the peeling mechanism.

[0179] The present disclosure (5) is a ceramic chip removal device based on any combination of any items in the present disclosure (1) to (4), wherein the peeling mechanism comprises a component for pressing the acute angle of the film from the supporting film side, and a nozzle for blowing compressed gas toward the ceramic chips to blow the ceramic chips away from the surface of the supporting film.

[0180] The present disclosure (6) is a ceramic chip removing device according to the present disclosure (5), wherein the temperature of the compressed gas is 0°C or higher and 20°C or lower.

[0181] The present disclosure (7) is a ceramic chip removal device based on any combination of any of the items in the present disclosure (1) to (6), the ceramic chip removal device comprising: a roll-out mechanism that rolls the film out with respect to the conveying mechanism;

[0182] A refrigerant cooled to a temperature of 0° C. or higher and 20° C. or lower is disposed at the center of the unwinding mechanism as the cooling mechanism.

[0183] The present disclosure (8) is a ceramic chip removing device according to the present disclosure (7), wherein the coolant is a metal rod cooled to a temperature of 0°C or higher and 20°C or lower.

Claims

1. A ceramic chip removal device, characterized in that: have: a conveying mechanism for conveying a film including a supporting film and ceramic scraps as residues of a ceramic green sheet adhering to a surface of the supporting film; A cooling mechanism for cooling the ceramic chips; as well as The peeling mechanism peels the cooled ceramic chips from the supporting film.

2. The ceramic chip removing device according to claim 1, wherein: The cooling mechanism has a mechanism for cooling the ceramic chips to 20° C. or less.

3. The ceramic chip removing device according to claim 1, wherein: The cooling mechanism has a mechanism for cooling the ceramic chips to 18° C. or less.

4. The ceramic chip removing device according to any one of claims 1 to 3, wherein: The cooling mechanism includes a mechanism for introducing a gas having a temperature of 0° C. or higher and 20° C. or lower into the periphery of the peeling mechanism.

5. The ceramic chip removing device according to any one of claims 1 to 4, wherein: The peeling mechanism includes a member for pressing an acute angle of the film from the supporting film side, and a blowing nozzle for blowing compressed gas toward the ceramic chips to blow the ceramic chips away from the surface of the supporting film.

6. The ceramic chip removing device according to claim 5, wherein: The temperature of the compressed gas is 0° C. or higher and 20° C. or lower.

7. The ceramic chip removing device according to any one of claims 1 to 6, wherein: The ceramic chip removing device comprises: a winding mechanism for winding the film out of the conveying mechanism; A refrigerant cooled to a temperature of 0° C. or higher and 20° C. or lower is disposed at the center of the unwinding mechanism as the cooling mechanism.

8. The ceramic chip removing device according to claim 7, wherein: The refrigerant is a metal rod cooled to a temperature of 0° C. or higher and 20° C. or lower.

Images