Laser drilling equipment for ceramic substrate production and working method thereof

Abstract

The invention belongs to the technical field of laser processing, and particularly relates to laser drilling equipment for ceramic substrate production and a working method thereof, and the laser drilling equipment comprises a feeding conveying belt, a discharging conveying belt, a laser processing platform, a feeding assembly and a discharging assembly. The tail end of the feeding assembly and the tail end of the discharging assembly are each provided with a magnetic suction head. The magnetic suction head comprises a connecting column, a buffer piece and an electromagnet. The buffer piece is arranged on the bottom surface of the connecting column; and the electromagnet is fixedly arranged on the bottom surface of the buffer piece. According to the ceramic substrate transfer device, the ceramic substrate is adsorbed in the mode that the magnetic suction head makes direct contact with the ceramic substrate, buffering is conducted through the buffering piece, the ceramic substrate is prevented from being pressed by the magnetic suction head when the magnetic suction head descends, and therefore the damage rate of the ceramic substrate in the transfer process is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and specifically relates to laser drilling, and in particular to a laser drilling device for producing a ceramic substrate and a working method thereof. Background Art

[0002] When drilling holes in a ceramic substrate, the ceramic substrate needs to be transferred between a conveyor belt and a laser processing platform.

[0003] In the related art, magnetic suction is used to grab the ceramic substrate. In order to prevent the magnetic suction head from crushing the ceramic substrate, the magnetic suction force of the electromagnet is increased and a certain distance is placed between the magnetic suction head and the ceramic substrate. As a result, when the electromagnet is energized, the ceramic substrate directly collides with the magnetic suction head, which can easily damage the ceramic substrate.

[0004] Therefore, how to reduce the damage to the ceramic substrate caused by the collision of the magnetic suction head during grasping is currently an urgent problem to be solved.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a laser drilling device for producing ceramic substrates and a working method thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a laser drilling device for producing a ceramic substrate, comprising: Loading conveyor belt, unloading conveyor belt, laser processing platform, loading assembly and unloading assembly; The loading conveyor belt and the unloading conveyor belt are both arranged on the side of the laser processing platform; The loading assembly and the unloading assembly are both arranged on the laser processing platform; The feeding assembly is suitable for conveying the ceramic substrate on the feeding conveyor belt to the laser processing platform for laser drilling; The unloading assembly is suitable for conveying the punched ceramic substrate to the unloading conveyor belt to complete unloading; Wherein, the ends of the loading assembly and the unloading assembly are both provided with magnetic suction heads; The magnetic suction head comprises: Connecting posts, buffers and electromagnets; The buffer member is arranged on the bottom surface of the connecting column; The electromagnet is fixedly arranged on the bottom surface of the buffer.

[0008] In an optional embodiment, the buffer member includes a connecting plate and a plurality of elastic parts; The bottom of the elastic part is fixedly connected to the connecting plate, and the top of the elastic part is fixedly connected to the connecting column via the anti-stuck part.

[0009] In an optional embodiment, the elastic part includes: a guide rod and a buffer spring; The buffer spring is sleeved on the guide rod; The bottom of the guide rod is fixedly connected to the connecting plate; The top of the guide rod passes through the anti-stuck portion.

[0010] In an optional implementation, the anti-stuck portion includes: a connecting frame, a first clamping block, and a second clamping block; The first card block and the second card block are arranged opposite to each other and are both slidably arranged in the frame body of the connecting frame; The first clamping block and the second clamping block are elastically connected to the connection frame via corresponding return springs; The first clamping block and the second clamping block are respectively arranged on both sides of the guide rod and are suitable for clamping the guide rod.

[0011] In an optional embodiment, the shapes of the fitting surfaces of the first clamping block and the second clamping block with the guide rod are adapted to the side wall of the guide rod.

[0012] In an optional embodiment, the side wall of the guide rod is provided with two plug-in inclined blocks; Insertion grooves are provided at the places where the first card block and the second card block are adapted to the corresponding inserting inclined blocks.

[0013] In an optional embodiment, a supporting plate is provided on the top surface of the first clamping block; A proximity switch is provided on the top surface of the second card block; The laser drilling equipment for producing ceramic substrates also includes a control module; The control module is suitable for receiving proximity information from the proximity switch and judging whether the guide rod is stuck according to the proximity information.

[0014] In an optional implementation, the step of receiving proximity information from the proximity switch and judging whether the guide rod is stuck according to the proximity information includes: Get the buffer time T; When the control module continues to receive approach information, it indicates that the guide column is not stuck at this time; When the time t when the control module does not receive the approach information is greater than the buffer time T, it indicates that the guide column is stuck and a stuck reminder is issued.

[0015] In an optional embodiment, when the laser drilling device for producing ceramic substrates is not working, the first clamping block and the second clamping block are spread apart, so that the buffer spring extends from the top of the first clamping block and the second clamping block to restore the initial state.

[0016] In a second aspect, this embodiment further provides a working method of the laser drilling device for producing a ceramic substrate as described above, comprising: Transport the ceramic substrate to the loading conveyor belt; The loading component transports the magnetic suction head to the top of the ceramic substrate, and pushes the magnetic suction head downward until the magnetic suction head contacts the ceramic substrate, and energizes the electromagnet to adsorb the ceramic substrate; Control the loading assembly to transport the ceramic substrate to the laser processing platform; The ceramic substrate is punched with a laser processing platform; After the drilling is completed, the unloading assembly is controlled to transport the magnetic suction head to the top of the ceramic substrate, and push the magnetic suction head downward until the magnetic suction head contacts the ceramic substrate, and the electromagnet is energized to adsorb the ceramic substrate; The unloading component is controlled to transport the ceramic substrate to the unloading conveyor belt.

[0017] The beneficial effect of the present invention is that the laser drilling equipment for ceramic substrate production and its working method absorb the ceramic substrate by directly contacting the magnetic suction head with the ceramic substrate, and buffer it through the buffer part to prevent the magnetic suction head from pressing the ceramic substrate ring when descending, thereby reducing the damage rate of the ceramic substrate during transportation.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1A schematic diagram of the structure of a laser drilling device for producing a ceramic substrate provided in an embodiment of the present disclosure; Figure 2 A schematic diagram of the structure of a magnetic suction head provided in an embodiment of the present disclosure; Figure 3 A top view of a magnetic suction head provided in an embodiment of the present disclosure; Figure 4 A top view of an anti-stuck portion provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the first part of the structure of the anti-stuck portion provided in an embodiment of the present disclosure; Figure 6 A schematic diagram of the second part of the anti-stuck portion provided in an embodiment of the present disclosure.

[0022] In the figure: 100, feeding conveyor belt; 200, unloading conveyor belt; 300, laser processing platform; 400, feeding assembly; 500, unloading assembly; 600, magnetic suction head; 610, connecting column; 620, buffer member; 621, connecting plate; 622, elastic part; 6221, guide rod; 6221a, plug-in inclined block; 6222, buffer spring; 6223, anti-stuck part; 6223a, connecting frame; 6223b, first clamping block; 6223b1, supporting plate; 6223b2, plug-in slot; 6223c, second clamping block; 6223c1, proximity switch. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0027] See also Figure 1 , Figure 1 The present invention shows a schematic structural diagram of a laser drilling device for producing ceramic substrates, comprising: a loading conveyor belt 100, a unloading conveyor belt 200, a laser processing platform 300, a loading assembly 400 and a unloading assembly 500; the loading conveyor belt 100 and the unloading conveyor belt 200 are both arranged on the side of the laser processing platform 300; the loading assembly 400 and the unloading assembly 500 are both arranged on the laser processing platform 300; the loading assembly 400 is suitable for conveying the ceramic substrate on the loading conveyor belt 100 to the laser processing platform 300 for laser drilling; the unloading assembly 500 is suitable for conveying the drilled ceramic substrate to the unloading conveyor belt 200 to complete unloading.

[0028] See also Figure 2 , the ends of the loading assembly 400 and the unloading assembly 500 are both provided with a magnetic suction head 600; the magnetic suction head 600 comprises: a connecting column 610, a buffer 620 and an electromagnet; the buffer 620 is arranged on the bottom surface of the connecting column 610; the electromagnet is fixedly arranged on the bottom surface of the buffer 620. By adopting the method that the magnetic suction head 600 directly contacts the ceramic substrate, the ceramic substrate is adsorbed, and the buffer 620 is used for buffering, so as to avoid the magnetic suction head 600 pressing the ceramic substrate when descending, thereby reducing the damage rate of the ceramic substrate during transportation.

[0029] In some embodiments, the buffer member 620 includes a connecting plate 621 and a plurality of elastic parts 622 ; the bottom of the elastic part 622 is fixedly connected to the connecting plate 621 , and the top of the elastic part 622 is fixedly connected to the connecting column via an anti-stuck part 6223 .

[0030] The plurality of elastic parts 622 are evenly distributed along the circumference of the connecting plate 621 , so as to evenly absorb the impact force generated when the magnetic suction head 600 contacts the ceramic substrate, thereby reducing the displacement of the elastic part 622 and the probability of the elastic part 622 being stuck.

[0031] Specifically, the elastic part 622 includes: a guide rod 6221 and a buffer spring 6222; the buffer spring 6222 is sleeved on the guide rod 6221; the bottom of the guide rod 6221 is fixedly connected to the connecting plate 621; the top of the guide rod 6221 passes through the anti-stuck part 6223.

[0032] By providing the anti-stuck portion 6223 , the offset of the guide rod 6221 is adjusted, thereby reducing the probability of the guide rod 6221 being stuck.

[0033] See also Figure 3 and Figure 4 In some embodiments, the anti-stuck portion 6223 includes: a connecting frame 6223a, a first clamping block 6223b and a second clamping block 6223c; the first clamping block 6223b and the second clamping block 6223c are arranged opposite to each other and are both slidably arranged in the frame body of the connecting frame 6223a; the first clamping block 6223b and the second clamping block 6223c are elastically connected to the connecting frame 6223a through corresponding return springs; the first clamping block 6223b and the second clamping block 6223c are respectively arranged on both sides of the guide rod 6221, and are suitable for clamping the guide rod 6221.

[0034] The guide rod 6221 is limited by the first clamping block 6223b and the second clamping block 6223c. When the guide rod 6221 is offset, the offset of the guide rod 6221 is buffered by the return spring, thereby preventing the guide rod 6221 from being directly stuck. After the magnetic suction head 600 is separated from the ceramic substrate, the first clamping block 6223b and the second clamping block 6223c correct the guide rod 6221 under the action of the return spring, thereby reducing the probability of the guide rod 6221 being stuck.

[0035] In a preferred embodiment, the shapes of the fitting surfaces of the first clamping block 6223 b and the second clamping block 6223 c and the guide rod 6221 are adapted to the side walls of the guide rod 6221 .

[0036] In some embodiments, the side wall of the guide rod 6221 is provided with two plug-in oblique blocks 6221a; the first clamping block 6223b and the second clamping block 6223c are provided with a plug-in slot 6223b2 at the adaption position with the corresponding plug-in oblique block 6221a. Through the cooperation between the plug-in oblique block 6221a and the plug-in slot 6223b2, when the buffer spring 6222 is squeezed, the two plug-in oblique blocks 6221a on the guide rod 6221 will open the first clamping block 6223b and the second clamping block 6223c, increase the clamping force on the guide rod 6221, thereby further reducing the deviation of the guide rod 6221 and reducing the probability of the guide rod 6221 being stuck.

[0037] See also Figure 5-Figure 6 In some embodiments, a supporting plate 6223b1 is disposed on the top surface of the first clamping block 6223b; a proximity switch 6223c1 is disposed on the top surface of the second clamping block 6223c; the laser drilling equipment for producing ceramic substrates also includes a control module; the control module is suitable for receiving proximity information of the proximity switch 6223c1, and judging whether the guide rod is stuck based on the proximity information.

[0038] Specifically, the steps of receiving the proximity information of the proximity switch 6223c1 and judging whether the guide rod is stuck based on the proximity information include: obtaining the buffer time T; when the control module continues to receive the proximity information, it indicates that the guide column is not stuck at this time; when the time t when the control module does not receive the proximity information is greater than the buffer time T, it indicates that the guide column is stuck at this time, and a jam reminder is issued.

[0039] The buffer time T is artificially set, and needs to be greater than the time it takes for the loading component and the unloading component to take the material.

[0040] In some embodiments, when the laser drilling device for producing ceramic substrates is not working, the first clamping block 6223b and the second clamping block 6223c are spread apart, so that the buffer spring 6222 extends from the top of the first clamping block 6223b and the second clamping block 6223c to restore the initial state. In order to ensure the elasticity of the buffer spring 6222, when the laser drilling device for producing ceramic substrates is not working, the first clamping block 6223b and the second clamping block 6223c are manually spread apart, thereby releasing the limit on the buffer spring 6222, so that the buffer spring 6222 extends from the top of the first clamping block 6223b and the second clamping block 6223c to restore the initial state, thereby improving the life of the buffer spring 6222.

[0041] At least one embodiment further provides a working method of the laser drilling device for producing a ceramic substrate as described above, comprising: S110: transporting the ceramic substrate to the loading conveyor belt 100; S120: The loading assembly 400 transports the magnetic suction head 600 to the top of the ceramic substrate, and pushes the magnetic suction head 600 downward until the magnetic suction head 600 contacts the ceramic substrate, and energizes the electromagnet to adsorb the ceramic substrate; S130: Control the loading assembly 400 to transport the ceramic substrate to the laser processing platform 300; S140: drilling holes in the ceramic substrate by using the laser processing platform 300; S150: After the punching is completed, the unloading assembly is controlled to transport the magnetic suction head 600 to the top of the ceramic substrate, and the magnetic suction head 600 is pushed downward until the magnetic suction head 600 contacts the ceramic substrate, and the electromagnet is energized to adsorb the ceramic substrate; S160 : Control the unloading assembly 500 to transport the ceramic substrate to the unloading conveyor belt 200 .

[0042] In summary, the present invention provides a laser drilling device for ceramic substrate production and a working method thereof, comprising: a loading conveyor belt 100, a unloading conveyor belt 200, a laser processing platform 300, a loading assembly 400 and a unloading assembly 500; the loading conveyor belt 100 and the unloading conveyor belt 200 are both arranged on the side of the laser processing platform 300; the loading assembly 400 and the unloading assembly 500 are both arranged on the laser processing platform 300; the loading assembly 400 is suitable for conveying the ceramic substrate on the loading conveyor belt 100 to the laser processing platform 300 for laser drilling; the unloading assembly 500 is suitable for conveying the punched ceramic substrate to the unloading conveyor belt 200 to complete unloading. The ends of the loading assembly 400 and the unloading assembly 500 are both provided with a magnetic suction head 600; the magnetic suction head 600 comprises: a connecting column 610, a buffer 620 and an electromagnet; the buffer 620 is arranged on the bottom surface of the connecting column 610; the electromagnet is fixedly arranged on the bottom surface of the buffer 620. By adopting the method that the magnetic suction head 600 directly contacts the ceramic substrate, the ceramic substrate is adsorbed, and the buffer 620 is used for buffering, so as to avoid the magnetic suction head 600 pressing the ceramic substrate when descending, thereby reducing the damage rate of the ceramic substrate during transportation. Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A laser drilling device for producing ceramic substrates, characterized in that: include: A loading conveyor belt (100), a unloading conveyor belt (200), a laser processing platform (300), a loading assembly (400), and a unloading assembly (500); The loading conveyor belt (100) and the unloading conveyor belt (200) are both arranged on the side of the laser processing platform (300); The loading assembly (400) and the unloading assembly (500) are both arranged on the laser processing platform (300); The loading assembly (400) is suitable for conveying the ceramic substrate on the loading conveyor belt (100) to the laser processing platform (300) for laser drilling; The unloading component (500) is suitable for conveying the punched ceramic substrate to the unloading conveyor belt (200) to complete unloading; Wherein, the ends of the loading assembly (400) and the unloading assembly (500) are both provided with magnetic suction heads (600); The magnetic suction head (600) comprises: A connecting column (610), a buffer member (620), and an electromagnet; The buffer member (620) is arranged on the bottom surface of the connecting column (610); The electromagnet is fixedly arranged on the bottom surface of the buffer component (620).

2. The laser drilling equipment for producing ceramic substrates according to claim 1, characterized in that: The buffer member (620) comprises a connecting plate (621) and a plurality of elastic parts (622); The bottom of the elastic part (622) is fixedly connected to the connecting plate (621), and the top of the elastic part (622) is fixedly connected to the connecting column (610) via the anti-stuck part (6223).

3. The laser drilling equipment for producing ceramic substrates according to claim 2, characterized in that: The elastic part (622) comprises: a guide rod (6221) and a buffer spring (6222); The buffer spring (6222) is sleeved on the guide rod (6221); The bottom of the guide rod (6221) is fixedly connected to the connecting plate (621); The top of the guide rod (6221) passes through the anti-stuck portion (6223).

4. The laser drilling equipment for producing ceramic substrates according to claim 3, characterized in that: The anti-stuck portion (6223) comprises: a connecting frame (6223a), a first locking block (6223b) and a second locking block (6223c); The first card block (6223b) and the second card block (6223c) are arranged relative to each other, and are both slidably arranged in the frame body of the connecting frame (6223a); The first clamping block (6223b) and the second clamping block (6223c) are elastically connected to the connecting frame (6223a) via corresponding return springs; The first clamping block (6223b) and the second clamping block (6223c) are respectively arranged on both sides of the guide rod (6221), and are suitable for clamping the guide rod (6221).

5. The laser drilling equipment for producing ceramic substrates according to claim 4, characterized in that: The shapes of the fitting surfaces of the first clamping block (6223b) and the second clamping block (6223c) and the guide rod (6221) are adapted to the side wall of the guide rod (6221).

6. The laser drilling equipment for producing ceramic substrates according to claim 4, characterized in that: The side wall of the guide rod (6221) is provided with two plug-in inclined blocks (6221a); Insertion grooves (6223b2) are provided at the places where the first clamping block (6223b) and the second clamping block (6223c) are adapted to the corresponding inserting inclined block (6221a).

7. The laser drilling equipment for producing ceramic substrates according to claim 4, characterized in that: The top surface of the first clamping block (6223b) is provided with a supporting plate (6223b1); A proximity switch (6223c1) is provided on the top surface of the second card block (6223c); The laser drilling equipment for producing ceramic substrates also includes a control module; The control module is suitable for receiving proximity information from the proximity switch (6223c1), and judging whether the guide rod (6221) is stuck based on the proximity information.

8. The laser drilling equipment for producing ceramic substrates according to claim 7, characterized in that: The step of receiving proximity information from the proximity switch (6223c1) and judging whether the guide rod (6221) is stuck according to the proximity information comprises: Get the buffer time T; When the control module continues to receive approach information, it indicates that the guide column is not stuck at this time; When the time t when the control module does not receive the approach information is greater than the buffer time T, it indicates that the guide column is stuck and a stuck reminder is issued.

9. The laser drilling equipment for producing ceramic substrates according to claim 4, characterized in that: When the laser drilling device for producing ceramic substrates is not working, the first clamping block (6223b) and the second clamping block (6223c) are spread apart, so that the buffer spring (6222) extends from the top of the first clamping block (6223b) and the second clamping block (6223c) to restore the initial state.

10. A working method of the laser drilling equipment for producing ceramic substrates according to any one of claims 1 to 9, characterized in that: include: Transporting the ceramic substrate to a loading conveyor belt (100); The loading component (400) transports the magnetic suction head (600) to the top of the ceramic substrate, and pushes the magnetic suction head (600) downward until the magnetic suction head (600) contacts the ceramic substrate, and energizes the electromagnet to adsorb the ceramic substrate; Controlling the loading assembly (400) to transport the ceramic substrate to the laser processing platform (300); Punching holes in the ceramic substrate using a laser processing platform (300); After the drilling is completed, the unloading assembly (500) is controlled to transport the magnetic suction head (600) to the top of the ceramic substrate, and the magnetic suction head (600) is pushed downward until the magnetic suction head (600) contacts the ceramic substrate, and the electromagnet is energized to adsorb the ceramic substrate; The unloading assembly (500) is controlled to convey the ceramic substrate onto the unloading conveyor belt (200).

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