Composite welding flux for welding tin brass and tungsten-titanium alloy and application of composite welding flux

By designing composite solder and combining zinc-tin solder pool treatment and ultrasonic technology, the problem of large color difference between the weld and the substrate after brass and tungsten titanium alloy is solved, and the color difference and good performance of the welded joints are achieved.

CN119216866APending Publication Date: 2024-12-31ZHEJIANG JINGSHENG FILM TECH CO LTD
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Patent Information

Application Number
CN202411470614.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-21
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

During the semiconductor chip production process, the color difference between the weld and the substrate after welding of C46400 brass and tungsten titanium alloy is large, making it difficult to judge the welding quality.

Method used

Using composite solder, including center solder and external solder, the solder composition and form are designed through zinc-tin solder pool treatment and ultrasonic assistance, so that the solder welds and substrate materials have no color difference, and combined with low-power laser welding.

Benefits of technology

It achieves almost no chromatic difference between the welded joints and ensures good welding performance.

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Abstract

The invention relates to a composite solder for welding tin brass and a tungsten-titanium alloy and application of the composite solder to solve the problem that in the prior art, the color difference between a welding seam and a base material is large after welding. The composite solder comprises a central solder and an external solder arranged around the central solder; and the central welding flux is used for performing zinc-tin welding flux pool treatment on a welding material. The application comprises the step that the tin brass and the tungsten-titanium alloy are subjected to laser welding through the composite welding flux. According to the composite solder provided by the invention, the composite content is specifically designed, so that when the composite solder is used as the welding solder of the C46400 copper alloy and the tungsten-titanium alloy, the color difference between a welding seam obtained by welding and a base material C46400 copper alloy does not exist, and meanwhile, a welding joint has good performance.
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Description

Technical Field

[0001] The invention relates to the field of laser welding, and in particular to a composite solder for welding tin brass and tungsten-titanium alloy and application thereof. Background Art

[0002] Currently, in the production process of semiconductor chips, C46400 brass is a commonly used substrate material and is usually used after being welded with other metal workpieces.

[0003] For example, CN112442704A discloses a general method for preparing oxide semiconductor nanowire photoanodes using metals or alloys as substrates. Using metal iron (Fe), titanium (Ti), tungsten (W) sheets and the like as substrates, metal oxide (Fe2O3, TiO2 and WO3) nanowires can be directly grown from the metal substrate by thermal oxidation under ultra-low pressure. For some low-melting-point metals, such as zinc (Zn) and tin (Sn), their alloys brass (Cu-Zn) and bronze (Cu-Sn) are selected as substrates, and metal oxide (ZnO and SnO) nanowires can be directly grown from the alloy substrate by thermal oxidation under ultra-low pressure. The above-mentioned n-type semiconductor oxide nanowires can all be used as anode materials for solar photoelectric catalytic water decomposition. The metal oxide nanowires and the conductive substrate underneath them are directly used as integrated photoanodes, which effectively avoids the separation of the light absorbing material from the electrode during the test. This general preparation strategy provides new ideas and methods for the preparation of photoanode materials.

[0004] However, due to process problems, when welding C46400 brass and tungsten-titanium alloy, there is a welding gap of about 0.1mm after welding, which may cause foreign matter such as oil and dust to enter. Laser welding is needed to fill the weld seam later. However, the color of the laser weld seam is inconsistent with the raw material, which makes it impossible to effectively judge whether the weld is completely closed (filling the weld seam and confirming that there is no leakage and no discoloration near the weld seam is an important basis for determining the quality of the weld). Summary of the invention

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a composite solder for welding tin brass and tungsten-titanium alloy and its use, so as to solve the problem of large color difference between the weld and the base material after welding in the prior art.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a composite solder for welding tin brass and tungsten titanium alloy, the composite solder comprising a central solder and an external solder arranged around the central solder;

[0008] The central solder is made by subjecting the solder material to a zinc-tin solder pool treatment.

[0009] The composite solder provided by the present invention has a specific design of the composite content so that when it is used as a welding solder for C46400 copper alloy and tungsten-titanium alloy, the color of the weld obtained by welding has no color difference with the base material C46400 copper alloy, and the welded joint has good performance.

[0010] In the present invention, the central solder and the external solder can be obtained by processing with corresponding welding rods, or by cold pressing with correspondingly designed powdered solder.

[0011] In the present invention, the central solder is set to have a diameter of 0.1-0.3 mm, and the diameter of the external solder may be 0.1-0.3 mm, wherein the diameter of the central solder and the diameter of the external solder may be the same or different.

[0012] As a preferred technical solution of the present invention, the welding material includes, by mass percentage, 59-62% copper, 0.5-1% tin, ≤0.2% lead, ≤0.1% iron, and the balance is zinc.

[0013] In the present invention, the copper content in the welding material is 59-62% by mass, for example, it can be 59%, 59.1%, 59.2%, 59.3%, 59.4%, 59.5%, 59.6%, 59.7%, 59.8%, 59.9%, 60%, 60.1%, 60.2%, 60.3%, 60.4%, 60.5%, 60.6%, 60.7%, 60.8%, 60.9%, 61%, 61.1%, 61.2%, 61.3%, 61.4%, 61.5%, 61.6%, 61.7%, 61.8%, 61.9% or 62%, etc., but is not limited to the listed values, and other values ​​not listed in this range are also applicable.

[0014] In the present invention, the mass percentage of tin in the solder is 0.5-1%, for example, it can be 0.5%, 0.52%, 0.54%, 0.56%, 0.58%, 0.6%, 0.62%, 0.64%, 0.66%, 0.68%, 0.7%, 0.72%, 0.74%, 0.76%, 0.78%, 0.8%, 0.82%, 0.84%, 0.86%, 0.88%, 0.9%, 0.92%, 0.94%, 0.96%, 0.98% or 1%, etc., but is not limited to the listed values, and other values ​​not listed in this range are also applicable.

[0015] In the present invention, the lead content in the welding material is ≤0.2% by mass, for example, it can be 0.2%, 0.19%, 0.18%, 0.17%, 0.16%, 0.15%, 0.14%, 0.13%, 0.12%, 0.11%, 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02% or 0.01%, etc., but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0016] In the present invention, the iron content in the welding material is ≤0.1% by mass percentage, for example, it can be 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02% or 0.01%, etc., but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0017] As a preferred technical solution of the present invention, the external solder includes, by mass percentage, 59-62% copper, 0.5-1% tin, ≤0.2% lead, ≤0.1% iron, and the balance is zinc.

[0018] In the present invention, the copper content in the external solder is 59-62% by mass, for example, it can be 59%, 59.1%, 59.2%, 59.3%, 59.4%, 59.5%, 59.6%, 59.7%, 59.8%, 59.9%, 60%, 60.1%, 60.2%, 60.3%, 60.4%, 60.5%, 60.6%, 60.7%, 60.8%, 60.9%, 61%, 61.1%, 61.2%, 61.3%, 61.4%, 61.5%, 61.6%, 61.7%, 61.8%, 61.9% or 62%, etc., but is not limited to the listed values, and other values ​​not listed within the range are also applicable.

[0019] In the present invention, the mass percentage of tin in the external solder is 0.5-1%, for example, it can be 0.5%, 0.52%, 0.54%, 0.56%, 0.58%, 0.6%, 0.62%, 0.64%, 0.66%, 0.68%, 0.7%, 0.72%, 0.74%, 0.76%, 0.78%, 0.8%, 0.82%, 0.84%, 0.86%, 0.88%, 0.9%, 0.92%, 0.94%, 0.96%, 0.98% or 1%, etc., but is not limited to the listed values, and other values ​​not listed within the range are also applicable.

[0020] In the present invention, the lead content in the external solder is ≤0.2% by mass, for example, it can be 0.2%, 0.19%, 0.18%, 0.17%, 0.16%, 0.15%, 0.14%, 0.13%, 0.12%, 0.11%, 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02% or 0.01%, etc., but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0021] In the present invention, the iron content in the external solder is ≤0.1% by mass percentage, for example, it can be 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02% or 0.01%, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also applicable.

[0022] As a preferred technical solution of the present invention, the mass of the external solder is 5.8-6.3 times the mass of the central solder, for example, it can be 5.8 times, 5.82 times, 5.84 times, 5.86 times, 5.88 times, 5.9 times, 5.92 times, 5.94 times, 5.96 times, 5.98 times, 6 times, 6.02 times, 6.04 times, 6.06 times, 6.08 times, 6.1 times, 6.12 times, 6.14 times, 6.16 times, 6.18 times, 6.2 times, 6.22 times, 6.24 times, 6.26 times, 6.28 times or 6.3 times, etc., but is not limited to the listed values, and other unlisted values ​​within the range are equally applicable.

[0023] As a preferred technical solution of the present invention, the external solder is spirally arranged around the central solder. At this time, the solder selected is a welding rod of corresponding specifications.

[0024] As a preferred technical solution of the present invention, the pitch of the solder is 5-6mm, for example, it can be 5mm, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm or 6mm, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0025] In the present invention, the pitch of the solder is the position of the straight line (parallel to the center solder) where the external solder returns to the starting position in the external solder spiral in the spiral setting after winding, that is, the distance between the peaks of a single thread.

[0026] As a preferred technical solution of the present invention, the zinc-tin solder pool treatment is to place the solder in a zinc-tin solder pool for treatment.

[0027] As a preferred technical solution of the present invention, the zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 10-15 cm / s, for example, 10 cm / s, 10.2 cm / s, 10.4 cm / s, 10.6 cm / s, 10.8 cm / s, 11 cm / s, 11.2 cm / s, 11.4 cm / s, 11.6 cm / s, 11.8 cm / s, 12 cm / s, 12.2 cm / s, 12.4cm / s, 12.6cm / s, 12.8cm / s, 13cm / s, 13.2cm / s, 13.4cm / s, 13.6cm / s, 13.8cm / s, 14cm / s, 14.2cm / s, 14.4cm / s, 14.6cm / s, 14.8cm / s or 15cm / s, etc., but not limited to the listed values, other values ​​not listed in the range are also applicable.

[0028] Preferably, the zinc-tin solder pool treatment is assisted by ultrasound.

[0029] In the present invention, the power of the ultrasound is 400-500W, for example, it can be 400W, 410W, 420W, 430W, 440W, 450W, 460W, 470W, 480W, 490W or 500W, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0030] Preferably, the treatment temperature of the zinc-tin solder pool treatment is 230-250°C, for example, it can be 230°C, 232°C, 234°C, 236°C, 238°C, 240°C, 242°C, 244°C, 246°C, 248°C or 250°C, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0031] Preferably, the zinc-tin solder pool treatment time is 10-20s, for example, it can be 10s, 11s, 12s, 13s, 14s, 15s, 16s, 17s, 18s, 19s or 20s, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0032] In a second aspect, the present invention provides a use of the composite solder as described in the first aspect, wherein the use comprises laser welding tin brass and tungsten-titanium alloy using the composite solder as described in the first aspect.

[0033] As a preferred technical solution of the present invention, the laser power of the laser welding is 6-8W, for example, it can be 6W, 6.1W, 6.2W, 6.3W, 6.4W, 6.5W, 6.6W, 6.7W, 6.8W, 6.9W, 7W, 7.1W, 7.2W, 7.3W, 7.4W, 7.5W, 7.6W, 7.7W, 7.8W, 7.9W or 8W, but is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0034] Compared with the prior art solutions, the present invention has the following beneficial effects:

[0035] The composite solder provided by the present invention realizes a welding joint design with almost no color difference and ensures the performance of the welding joint by performing specific treatment on the solder, adopting a specific solder form, and combining low-power laser welding. DETAILED DESCRIPTION

[0036] To better illustrate the present invention and facilitate understanding of the technical solution of the present invention, typical but non-limiting embodiments of the present invention are as follows:

[0037] Example 1

[0038] This embodiment provides a composite solder for welding tin brass and tungsten titanium alloy, the composite solder comprising a central solder and an external solder arranged around the central solder;

[0039] The central solder is to treat the solder material with a zinc-tin solder pool; the zinc-tin solder pool treatment is to place the solder material in a zinc-tin solder pool for treatment; the zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 12 cm / s; the zinc-tin solder pool treatment is assisted by ultrasound (power of 450 W); the treatment temperature of the zinc-tin solder pool treatment is 240° C.; the treatment time of the zinc-tin solder pool treatment is 14 seconds;

[0040] The welding material comprises, by mass percentage, 60% copper, 0.75% tin, 0.2% lead, 0.1% iron, and the balance zinc;

[0041] The external solder comprises, by mass percentage, 60% copper, 0.75% tin, 0.2% lead, 0.1% iron, and the balance zinc;

[0042] The mass of the external solder is 6 times the mass of the central solder;

[0043] The external solder is arranged spirally around the central solder;

[0044] The pitch of the solder is 5 mm.

[0045] Example 2

[0046] This embodiment provides a composite solder for welding tin brass and tungsten titanium alloy, the composite solder comprising a central solder and an external solder arranged around the central solder;

[0047] The central solder is to treat the solder material with a zinc-tin solder pool; the zinc-tin solder pool treatment is to place the solder material in a zinc-tin solder pool for treatment; the zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 10 cm / s; the zinc-tin solder pool treatment is assisted by ultrasound (power of 400 W); the treatment temperature of the zinc-tin solder pool treatment is 250° C.; the treatment time of the zinc-tin solder pool treatment is 10 s;

[0048] The welding material comprises, by mass percentage, 62% copper, 0.5% tin, 0.1% lead, 0.05% iron, and the balance is zinc;

[0049] The external solder comprises, by mass percentage, 59% copper, 1% tin, 0.15% lead, 0.01% iron, and the balance zinc;

[0050] The mass of the external solder is 5.8 times the mass of the central solder;

[0051] The external solder is arranged spirally around the central solder;

[0052] The pitch of the solder is 5 mm.

[0053] Example 3

[0054] This embodiment provides a composite solder for welding tin brass and tungsten titanium alloy, the composite solder comprising a central solder and an external solder arranged around the central solder;

[0055] The central solder is to treat the solder material with a zinc-tin solder pool; the zinc-tin solder pool treatment is to place the solder material in a zinc-tin solder pool for treatment; the zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 15 cm / s; the zinc-tin solder pool treatment is assisted by ultrasound (power of 500 W); the treatment temperature of the zinc-tin solder pool treatment is 230° C.; the treatment time of the zinc-tin solder pool treatment is 20 seconds;

[0056] The welding material comprises, by mass percentage, 59% copper, 1% tin, 0.15% lead, 0.07% iron, and the balance zinc;

[0057] The external solder is composed of 62% copper, 0.5% tin, 0.01% lead, 0.01% iron, and the balance is zinc in terms of mass percentage.

[0058] The mass of the external solder is 6.3 times the mass of the central solder;

[0059] The external solder is arranged spirally around the central solder;

[0060] The pitch of the solder is 6 mm.

[0061] Example 4

[0062] This embodiment provides a composite solder for welding tin brass and tungsten titanium alloy, the composite solder comprising a central solder and an external solder arranged around the central solder;

[0063] The central solder is to treat the solder material with a zinc-tin solder pool; the zinc-tin solder pool treatment is to place the solder material in a zinc-tin solder pool for treatment; the zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 14 cm / s; the zinc-tin solder pool treatment is assisted by ultrasound (power of 450 W); the treatment temperature of the zinc-tin solder pool treatment is 234° C.; the treatment time of the zinc-tin solder pool treatment is 17 seconds;

[0064] The welding material comprises, by mass percentage, 61% copper, 0.85% tin, 0.2% lead, 0.1% iron, and the balance zinc;

[0065] The external solder comprises, by mass percentage, 59% copper, 0.6% tin, 0.2% lead, 0.1% iron, and the balance is zinc;

[0066] The mass of the external solder is 6 times the mass of the central solder;

[0067] The external solder is arranged spirally around the central solder;

[0068] The pitch of the solder is 5 mm.

[0069] Application Example 1

[0070] This application example provides a use of the composite solder obtained in Example 1, specifically including: laser welding tin brass and tungsten-titanium alloy;

[0071] The laser power of the laser welding is 7W.

[0072] The color difference of tin brass and weld after welding is shown in Table 1.

[0073] Application Example 2

[0074] This application example provides a use of the composite solder obtained in Example 1, specifically including: laser welding tin brass and tungsten-titanium alloy;

[0075] The laser power of the laser welding is 8W.

[0076] The color difference of tin brass and weld after welding is shown in Table 1.

[0077] Application Example 3

[0078] This application example provides a use of the composite solder obtained in Example 1, specifically including: laser welding tin brass and tungsten-titanium alloy;

[0079] The laser power of the laser welding is 6W.

[0080] The color difference of tin brass and weld after welding is shown in Table 1.

[0081] Application Example 4

[0082] This application example provides a use of the composite solder obtained in Example 1, specifically including: laser welding tin brass and tungsten-titanium alloy;

[0083] The laser power of the laser welding is 7.5W.

[0084] The color difference of tin brass and weld after welding is shown in Table 1.

[0085] Comparative application example 1

[0086] The only difference from Application Example 1 is that the central solder of the composite solder is replaced by welding material; that is, a single-composition solder is used for welding. The color difference between the tin brass and the weld after welding is shown in Table 1.

[0087] Comparative Application Example 2

[0088] The only difference from Application Example 1 is that the external solder is replaced with an equal amount of central solder. This is equivalent to directly using the central solder for welding. The color difference between the tin brass and the weld after welding is shown in Table 1.

[0089] Comparative Application Example 3

[0090] The only difference from Application Example 1 is that the composite solder replaces the central solder with the external solder, and the external content is replaced with the central solder, that is, the positions of the internal and external solders are reversed. The color difference of the tin brass and the weld after welding is shown in Table 1.

[0091] Comparative Application Example 4

[0092] The only difference from Application Example 1 is that the laser power is 12 W. The color difference between the tin brass and the weld after welding is shown in Table 1.

[0093] Table 1

[0094] Visual color difference between tin, brass and weld Microscopic chromatic aberration of tin, brass and weld / 50X Application Example 1 No color difference Completely melted Application Example 2 No color difference Completely melted Application Example 3 No color difference Completely melted Application Example 4 No color difference Completely melted Comparative application example 1 There is color difference, the color is reddish With pores Comparative Application Example 2 There is color difference, the color is reddish Completely melted Comparative Application Example 3 There is color difference, the color is reddish With pores Comparative Application Example 4 Obvious color difference, dark red With pores

[0095] It can be seen from the above specific embodiments that the composite solder provided by the present invention, through the specific design of the composite content, makes it possible for when it is used as a welding solder for C46400 copper alloy and tungsten-titanium alloy, the color of the weld obtained by welding has no color difference with the base material C46400 copper alloy, and the welded joint has good performance.

[0096] It is stated that the present invention uses the above embodiments to illustrate the detailed structural features of the present invention, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of the components selected by the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

[0097] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0098] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0099] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A composite solder for welding tin brass and tungsten-titanium alloy, characterized in that: The composite solder includes a central solder and an external solder arranged around the central solder; The central solder is made by subjecting the solder material to a zinc-tin solder pool treatment.

2. The composite solder according to claim 1, characterized in that The welding material comprises, by mass percentage, 59-62% copper, 0.5-1% tin, ≤0.2% lead, ≤0.1% iron, and the balance is zinc.

3. The composite solder according to claim 1 or 2, characterized in that: The external solder comprises, by mass percentage, 59-62% copper, 0.5-1% tin, ≤0.2% lead, ≤0.1% iron, and the balance is zinc.

4. The composite solder according to any one of claims 1 to 3, characterized in that: The mass of the external solder is 5.8-6.3 times the mass of the central solder.

5. The composite solder according to any one of claims 1 to 4, characterized in that: The external solder is spirally disposed around the central solder.

6. The composite solder according to claim 5, characterized in that The pitch of the solder is 5-6 mm.

7. The composite solder according to any one of claims 1 to 6, characterized in that: The zinc-tin solder pool treatment is to place the solder material in a zinc-tin solder pool for treatment.

8. The composite solder according to any one of claims 1 to 7, characterized in that: The zinc-tin solder pool treatment is to move the solder material in the solder pool at a speed of 10-15 cm / s; Preferably, the zinc-tin solder pool treatment is assisted by ultrasound; Preferably, the treatment temperature of the zinc-tin solder pool treatment is 230-250°C; Preferably, the zinc-tin solder pool treatment time is 10-20s.

9. Use of the composite solder according to any one of claims 1 to 8, characterized in that: The use comprises laser welding tin brass and tungsten-titanium alloy using the composite solder as described in any one of claims 1 to 8.

10. The use according to claim 9, characterized in that The laser power of the laser welding is 6-8W.