Resistor array environment control system based on distributed sensor network
Through the resistor array environment control system based on distributed sensor network, the problem of equipment not interconnected and low degree of automation in the prior art is solved, real-time control and monitoring of the environment and status of the resistor array component is realized, and operational safety is improved and accuracy.
Patent Information
- Application Number
- CN202411353490.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2024-12-31
AI Technical Summary
The existing resistance array infrared imaging target simulation system has problems in environmental control that the equipment is not interconnected, the degree of automation is low, and the system status cannot be monitored in real time, resulting in low accuracy of environmental control and monitoring, affecting the safe and stable operation of resistance array components. .
A resistance array environmental control system based on distributed sensor network was designed, including remote control computers, environmental control computers, ambient temperature and humidity testers, temperature control instruments, temperature control power supplies, water chillers, vacuum gauges, vacuum pumps, vacuum environment boxes Temperature measurement module, drive controller, oscilloscope, semiconductor refrigerator, heat expansion plate temperature measurement module, solenoid vacuum valve, chip substrate temperature measurement probe, housing temperature measurement probe, DVDD power supply, AVDD power supply, TVDD power supply and environmental control software , through a distributed sensor network, the environmental indicators and equipment operation indicators of the resistor array components are monitored and controlled in real time, real-time control and visualization of the working environment and status of the resistor array.
It significantly reduces the operation difficulty and complexity of the infrared imaging target simulation system, realizes safe and stable operation of the resistor array components, reduces human operation errors, and improves the accuracy and automation of environmental control.
Smart Images

Figure CN119225452A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of distributed sensors, and in particular to a resistor array environmental control system based on a distributed sensor network. Background Art
[0002] The resistor array is a precision device. Whether it is in a suitable working environment will directly affect the safety of the device during operation and the quality of its projected image, and thus affect the effect of semi-physical simulation of the infrared imaging guidance system.
[0003] At present, the resistor array infrared imaging target simulation system has some defects in environmental control, such as the lack of interconnection between devices, low degree of automation, and difficulty in grasping the real-time status of the system. These defects lead to low accuracy of environmental control and monitoring, affecting the safe and stable operation of resistor array components. Summary of the invention
[0004] Based on this, it is necessary to provide a resistor array environmental control system based on a distributed sensor network that can perform real-time control and monitoring of the working environment and working status of the resistor array in order to address the above technical problems.
[0005] A resistor array environmental control system based on a distributed sensor network, the control system comprising a remote control computer, an environmental control computer, an environmental temperature and humidity tester, a temperature controller, a temperature control power supply, a chiller, a vacuum gauge, a vacuum pump, a vacuum environment box temperature measurement module, a drive controller, an oscilloscope, a semiconductor refrigerator, a heat expansion plate temperature measurement module, an electromagnetic vacuum valve, a chip substrate temperature measurement probe, a shell temperature measurement probe, a DVDD power supply, an AVDD power supply, a TVDD power supply and environmental control software;
[0006] The remote control computer is used to map the environmental control software running on the environmental control computer to the local computer through the local area network in the form of remote login, so that the operator can directly control the control system at the front-end console and observe the operating status of the laboratory environment in real time;
[0007] The environmental control computer is used to control and visualize the important operating parameters and working status of the resistor array assembly in real time through the environmental control software therein, and promptly prompt the operator to take emergency measures manually or automatically when an early warning or failure occurs, so as to ensure the safe and stable operation of the resistor array assembly;
[0008] The temperature control subsystem is composed of an environmental control computer, a temperature controller, a semiconductor refrigerator, a heat expansion plate temperature measurement module and a temperature control power supply, which is used to control the temperature of the resistor array chip substrate; wherein the temperature control power supply is powered by a TVDD power supply;
[0009] The vacuum subsystem is composed of an environmental control computer, a vacuum pump, an electromagnetic vacuum valve and a DVDD power supply as a power supply for the electromagnetic vacuum valve, and is used to control the vacuum degree in the vacuum chamber of the resistor array assembly;
[0010] The environmental control computer and the chiller form a heat dissipation subsystem, which is used to dissipate heat from the semiconductor refrigerator;
[0011] The temperature and humidity sensor, vacuum gauge, vacuum environment chamber temperature measurement module, shell temperature measurement probe and chip substrate temperature measurement probe in the environmental temperature and humidity tester form an environmental sensing subsystem, which is used to monitor the operating environment of the resistor array component in real time;
[0012] The environmental control computer, drive controller and oscilloscope constitute the resistor array working state monitoring subsystem, which is used to monitor the working state of the resistor array components in real time;
[0013] The DVDD power supply, AVDD power supply and TVDD power supply form a resistor array power supply and monitoring subsystem, which is used to supply power to the power load and monitor the power consumption in real time;
[0014] The environmental control software runs in the environmental control computer and is used to obtain the real-time monitoring data of various equipment in the control system for summary judgment, and based on the judgment results, it sends control instructions to various subsystems for remote control;
[0015] Among them, a distributed sensor network structure is also deployed in the control system. The environmental perception subsystem is realized based on the distributed sensor network. The distributed sensor network structure is used to collect environmental indicators and equipment operation indicators of the resistor array components; among them, the collection of environmental indicators is realized by various sensor devices deployed in various types of equipment, and the collection of equipment operation indicators is realized by the sensor units of various types of equipment.
[0016] Furthermore, the temperature control subsystem also includes an A / D data acquisition card;
[0017] The principle of the temperature control subsystem to control the temperature of the resistor array chip substrate is:
[0018] The substrate of the resistor array chip is taken as the controlled object, the temperature of the substrate of the resistor array chip is monitored and obtained by using the temperature measurement module of the heat spreading plate, and the temperature signal output by the temperature measurement module of the heat spreading plate is taken as the controlled parameter;
[0019] The temperature controller takes the temperature signal output by the heat expansion plate temperature measurement module as input, and outputs an error signal by comparing it with the target temperature pre-set by the environmental control computer. It calculates the error signal in combination with the PID control algorithm and outputs a DC control voltage signal.
[0020] The A / D data acquisition card collects and transmits the DC control voltage signal output by the temperature controller to the environmental control computer at a certain frequency;
[0021] The environmental control computer uses the DC control voltage signal transmitted by the A / D data acquisition card to adjust the voltage output by the temperature control power supply to the semiconductor refrigerator, and drives and controls the cooling power of the semiconductor refrigerator in a program-controlled manner, so that the substrate of the resistor array chip is kept within a reasonable temperature range, thereby realizing closed-loop control of the temperature of the substrate of the resistor array chip.
[0022] Furthermore, the principle of the vacuum pumping subsystem controlling the vacuum degree in the vacuum chamber of the resistor array assembly is as follows:
[0023] The environmental control computer controls the start and stop of the vacuum pump by connecting with the vacuum pump interface according to the real-time air pressure value in the vacuum chamber of the resistor array assembly obtained by the vacuum gauge, and controls the start and stop of the electromagnetic vacuum valve by connecting with the electromagnetic vacuum valve power supply; when the vacuum pump and the electromagnetic vacuum valve are started, the air inlet of the vacuum pump is connected with the electromagnetic vacuum valve installed on the resistor array assembly through the vacuum bellows to maintain the vacuum degree in the vacuum chamber of the resistor array assembly below the set threshold.
[0024] Furthermore, the principle of heat dissipation of the semiconductor refrigerator by the heat dissipation subsystem is:
[0025] The environmental control computer controls the start and shut down of the chiller by connecting to the chiller interface, and adjusts the cooling water temperature in the chiller according to the real-time ambient dew point temperature. It also monitors, displays, and reports various parameters of the chiller and the working status of the unit in real time during operation.
[0026] When the chiller is started, the water inlet and outlet of the chiller are connected to the water inlet and outlet of the water cooling box in the resistor array assembly through the cooling water pipe, and the heat dissipation end of the semiconductor refrigerator is dissipated by the transmitted cooling water.
[0027] Furthermore, the temperature control subsystem, the vacuum pumping subsystem and the heat dissipation subsystem constitute an environmental support subsystem for providing a suitable cooling, vacuum and heat dissipation environment for the resistor array chip and the packaging components.
[0028] Furthermore, the principle of the environmental sensing subsystem to monitor the operating environment of the resistor array component in real time is:
[0029] One end of the vacuum gauge is connected to the vacuum measurement interface of the resistor array assembly through a regulation cable to monitor the vacuum degree in the vacuum chamber of the resistor array assembly in real time; the other end of the vacuum gauge is connected to the environment control computer to upload the real-time vacuum degree to the environment control computer. When the real-time vacuum degree does not meet the safety range, the environment control computer immediately controls each device to power off in sequence to stop the operation of the resistor array assembly;
[0030] The temperature and humidity sensor in the environmental temperature and humidity tester monitors the temperature and humidity values of the laboratory environment in real time, and uploads the real-time temperature and humidity data to the environmental control computer. After receiving the real-time temperature and humidity data, the environmental control computer obtains the environmental dew point temperature by looking up the table, and adjusts the cooling water temperature of the chiller in real time based on the environmental dew point temperature;
[0031] One end of the vacuum environment box temperature measurement module is connected to a shell temperature measurement probe installed on the surface of the resistor array assembly shell, so as to measure the resistance value of the resistor array assembly in real time, and convert the resistance value into a temperature value according to the temperature response characteristics of the shell temperature measurement probe, so as to realize the temperature measurement of the shell of the resistor array assembly; the other end of the vacuum environment box temperature measurement module is connected to an SD1011 module to power it and realize communication with the environment control computer, so as to upload the shell temperature of the resistor array assembly obtained by monitoring to the environment control computer for display;
[0032] The chip substrate temperature measuring probe is installed on the surface of the resistor array component shell, and is connected to the drive controller to transmit the voltage signal representing the temperature of the resistor array chip substrate obtained by real-time measurement to the drive controller, and the voltage signal is converted into a digital quantity through the A / D acquisition channel in the drive controller. The drive controller is connected to the environmental control computer, and the environmental control software in the environmental control computer is used to convert the voltage signal converted into a digital quantity into a temperature value according to the voltage-temperature response curve, thereby realizing real-time temperature measurement of the resistor array chip substrate.
[0033] Furthermore, the principle of the resistor array working state monitoring subsystem to monitor the working state of the resistor array assembly in real time is:
[0034] One end of the drive controller is connected to the resistor array component to obtain the periodic detection signals EOS_X and EOS_Y output by the resistor array peripheral site selection circuit when the resistor array component is running. The signal detection module in the drive controller is used to verify whether EOS_X and EOS_Y are in a normal state, and the verification result is transmitted to the environmental control computer connected to the other end of the drive controller. At the same time, EOS_X and EOS_Y are differentially processed through the signal detection module, and the obtained differential signal is transmitted to the oscilloscope connected to the other end of the drive controller, and the waveform of the differential signal is displayed using the oscilloscope.
[0035] Furthermore, the principle of the resistor array power supply and monitoring subsystem for real-time monitoring of power supply and power consumption of the power load is:
[0036] The DVDD power supply is a three-output channel switching regulated power supply, which is used to power the resistor array peripheral site selection circuit, the chip substrate temperature probe and the electromagnetic vacuum valve. It is connected to the environmental control computer, and the environmental control computer is used for power program control and real-time monitoring.
[0037] AVDD power supply and TVDD power supply are two precision power supplies with remote sensing, which are used to power the resistor array heating resistor and semiconductor cooler respectively. They are connected to the environmental control computer respectively, and the environmental control computer is used to perform power consumption program control and real-time monitoring.
[0038] Furthermore, the environmental control software has two control modes: automatic and manual. In automatic mode, the environmental control software realizes one-click automatic operation of the control system, and powers on and off various types of equipment in the control system according to a preset sequence. In manual mode, the environmental control software interlocks the logic according to the equipment start and stop sequence manually set by the operator, and operates the control system.
[0039] Furthermore, environmental indicators include laboratory ambient temperature and humidity, vacuum degree of the resistor array component vacuum chamber, shell temperature, resistor array chip substrate temperature and semiconductor refrigerator temperature; equipment operation indicators include chiller cooling water temperature and flow, vacuum pump speed, resistor array component working status and real-time voltage and current of DVDD power supply, AVDD power supply and TVDD power supply output.
[0040] The above-mentioned resistor array environmental control system based on a distributed sensor network takes into account that the working environment of the resistor array chip and the packaging component should simultaneously meet the requirements of vacuum, refrigeration, heat dissipation and power supply. Through the remote control computer, environmental control computer, environmental control software, a subsystem composed of various equipment and a deployed distributed sensor network structure, it is possible to realize program control and remote control of all equipment in the resistor array environmental control system, and complete real-time control and visualization of the working environment and working status of the resistor array. The control system can significantly reduce the operating difficulty and complexity of the infrared imaging target simulation system, and realize automation, reduce the psychological burden of the operator, thereby reducing human operating errors, and play a very important role in the protection, normal and safe operation of the resistor array chip and packaging components. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] Figure 1 A schematic diagram of a resistor array environment control system based on a distributed sensor network constructed for operation of a 512×512 resistor array chip and a package assembly in one embodiment;
[0042] Figure 2 A schematic diagram of a distributed sensor network topology structure in one embodiment;
[0043] Figure 3 FIG. 1 is a schematic diagram of the principle of temperature control of a resistor array chip substrate in an embodiment; wherein: Figure 3 (a) is a schematic diagram of the temperature controller controlling the temperature control power output; Figure 3(b) is a schematic diagram of the temperature control subsystem structure;
[0044] Figure 4 A schematic diagram of the structure of a vacuum subsystem in one embodiment;
[0045] Figure 5 A schematic diagram of the structure of a heat dissipation subsystem in one embodiment;
[0046] Figure 6 A schematic diagram of the structure of an environment perception subsystem in one embodiment;
[0047] Figure 7 Schematic diagram of outputs of EOS_X and EOS_Y in one embodiment;
[0048] Figure 8 A schematic diagram of the AVDD power supply principle in one embodiment;
[0049] Fig. 9 A schematic diagram of a temperature control process of a resistor array chip substrate in an embodiment;
[0050] Fig.10 The figure is a control flow diagram of the environmental control software in automatic mode in one embodiment. DETAILED DESCRIPTION
[0051] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0052] In one embodiment, Figure 1 As shown, a resistor array environmental control system based on a distributed sensor network is constructed for the operation of a 512×512 resistor array chip and a package component. The control system includes a remote control computer, an environmental control computer, an environmental temperature and humidity tester, a temperature controller, a temperature control power supply, a chiller, a vacuum gauge, a vacuum pump, a vacuum environment box temperature measurement module, a drive controller, an oscilloscope, a semiconductor refrigerator (TEC), a heat expansion plate temperature measurement module, an electromagnetic vacuum valve, a chip substrate temperature measurement probe, a shell temperature measurement probe, a DVDD power supply (digital power supply), an AVDD power supply (analog power supply), a TVDD power supply (transmitting circuit power supply) and an environmental control software;
[0053] The remote control computer is used to map the environmental control software running on the environmental control computer to the local computer through the local area network in the form of remote login, so that the operator can directly control the control system at the front-end console and observe the operating status of the laboratory environment in real time;
[0054] The environmental control computer is used to control and visualize the important operating parameters and working status of the resistor array assembly in real time through the environmental control software therein, and promptly prompt the operator to take emergency measures manually or automatically when an early warning or failure occurs, so as to ensure the safe and stable operation of the resistor array assembly;
[0055] The temperature control subsystem is composed of an environmental control computer, a temperature controller, a semiconductor refrigerator, a heat expansion plate temperature measurement module and a temperature control power supply, which is used to control the temperature of the resistor array chip substrate; wherein the temperature control power supply is powered by a TVDD power supply;
[0056] The vacuum subsystem is composed of an environmental control computer, a vacuum pump, an electromagnetic vacuum valve and a DVDD power supply as a power supply for the electromagnetic vacuum valve, and is used to control the vacuum degree in the vacuum chamber of the resistor array assembly;
[0057] The environmental control computer and the chiller form a heat dissipation subsystem, which is used to dissipate heat from the semiconductor refrigerator;
[0058] The temperature and humidity sensor, vacuum gauge, vacuum environment chamber temperature measurement module, shell temperature measurement probe and chip substrate temperature measurement probe in the environmental temperature and humidity tester form an environmental sensing subsystem, which is used to monitor the operating environment of the resistor array component in real time;
[0059] The environmental control computer, drive controller and oscilloscope constitute the resistor array working state monitoring subsystem, which is used to monitor the working state of the resistor array components in real time;
[0060] The DVDD power supply, AVDD power supply and TVDD power supply form a resistor array power supply and monitoring subsystem, which is used to supply power to the power load and monitor the power consumption in real time; and the AVDD power supply has feedback.
[0061] Environmental control software (also called environmental control software) runs in the environmental control computer and is used to obtain real-time monitoring data of various devices in the control system for summary judgment, and based on the judgment results, it sends control instructions to various subsystems for remote control;
[0062] Among them, a distributed sensor network structure is also deployed in the control system. The environmental perception subsystem is implemented based on the distributed sensor network. The distributed sensor network structure is used to collect environmental indicators and equipment operation indicators of the resistor array component; among them, the collection of environmental indicators is realized by various sensor devices deployed in various types of equipment, and the collection of equipment operation indicators is realized by the sensor units that come with various types of equipment. Environmental indicators include laboratory environment temperature and humidity, vacuum degree of the resistor array component vacuum cavity, shell temperature, resistor array chip substrate temperature, and semiconductor refrigerator temperature; equipment operation indicators include chiller cooling water temperature and flow, vacuum pump speed, resistor array component working status, and DVDD power supply, AVDD power supply, and TVDD power supply output real-time voltage and current.
[0063] The topology of a distributed sensor network is as follows: Figure 2 As shown, the topology of the distributed sensor network also includes an RTD (thermal resistor) data acquisition module and an RTD probe, which are connected by a 10m long measurement wire. The RTD probe is inserted into the housing slot of the resistor array component to measure and obtain the housing temperature. Figure 2 The N3630 power supply corresponds to the TVDD power supply, the N7950 power supply corresponds to the AVDD power supply, and the IT6322A power supply corresponds to the DVDD power supply.
[0064] Figure 2 Each node shown transmits information to the environmental control computer through wired communication, and then the environmental control software makes a unified decision. Specifically, the communication cable between the environmental control computer and the environmental temperature and humidity tester, vacuum gauge, RTD data acquisition module, temperature controller and three power supplies is 1m long, the communication cable with the chiller and vacuum pump is 5m long, and the communication cable with the drive controller is 10m long; the measurement cable between the resistor array component and the vacuum gauge, RTD data acquisition module, temperature controller is 10m long, and the signal cable between the resistor array component and the drive controller is 1m long. Among them, the environmental temperature and humidity tester, vacuum gauge, temperature controller, chiller and vacuum pump communicate with the multi-serial port card or USB of the environmental control computer through RS485, the RTD data acquisition module communicates with the multi-serial port card or USB of the environmental control computer through USB, the drive controller communicates with the multi-serial port card or USB of the environmental control computer through RS422, the N3630 power supply and IT6322A power supply communicate with the multi-serial port card or USB of the environmental control computer through RS232, and the N7950 power supply communicates with the multi-serial port card or USB of the environmental control computer through GPIB to USB.
[0065] It can be understood that a distributed sensor network is an effective way to obtain data. It is composed of many sensor nodes with perception and communication functions. These nodes are dispersed in designated locations and are responsible for monitoring the corresponding areas or indicators. The collected data information is transmitted and aggregated to the environmental control computer for calculation and processing, thereby realizing comprehensive and multi-perspective information collection of the monitored objects and providing a basis for the control of the environmental control system.
[0066] Furthermore, the temperature control subsystem also includes an A / D (analog-to-digital converter) data acquisition card;
[0067] The principle of temperature control subsystem to control the temperature of resistor array chip substrate is as follows Figure 3 As shown, Figure 3 (a) is a schematic diagram of the temperature controller controlling the temperature control power output; Figure 3 (b) is a schematic diagram of the temperature control subsystem structure. The technical principles of the temperature control subsystem include:
[0068] The substrate of the resistor array chip is taken as the controlled object, and the temperature of the substrate of the resistor array chip is monitored and obtained by using the heat expansion plate temperature measurement module, and the temperature signal output by the heat expansion plate temperature measurement module is taken as the controlled parameter; the temperature controller takes the temperature signal output by the heat expansion plate temperature measurement module as input, and outputs an error signal by comparing it with the target temperature pre-set by the environmental control computer, calculates the error signal in combination with the PID control algorithm, and outputs a DC control voltage signal; the voltage value of the DC control voltage signal is 0-10V, and the DC control voltage signal of 0-10V corresponds to the output voltage of the temperature control power supply of 0-95V;
[0069] The A / D data acquisition card collects and transmits the DC control voltage signal output by the temperature controller to the environmental control computer at a certain frequency;
[0070] The environmental control computer uses the DC control voltage signal transmitted by the A / D data acquisition card to adjust the voltage output by the temperature control power supply to the semiconductor refrigerator, and drives and controls the cooling power of the semiconductor refrigerator in a program-controlled manner, so that the substrate of the resistor array chip is kept within a reasonable temperature range, thereby realizing closed-loop control of the substrate temperature of the resistor array chip. Figure 1 As shown, an ammeter may be provided between the temperature-controlled power supply and the semiconductor refrigerator to monitor the current output from the temperature-controlled power supply to the semiconductor refrigerator.
[0071] Specifically, in this embodiment, the SR93 series intelligent temperature controller and the DAQ-USB3214 A / D data acquisition card of Zishu Technology are selected, and the N3630 programmable DC power supply with remote sensing terminals is selected to power the temperature control power supply. The three are connected and communicated with the environmental control computer through RS485, USB and RS232 respectively. The environmental control computer realizes the power on and off, fault monitoring of the temperature control subsystem, and the setting of the target temperature of the temperature controller and the output voltage of the temperature control power supply, so as to realize real-time and precise control of the substrate temperature of the resistor array chip.
[0072] Furthermore, the structure of the vacuum subsystem is as follows: Figure 4 As shown, the principle of the vacuum pumping subsystem controlling the vacuum degree in the vacuum chamber of the resistor array assembly is:
[0073] The environmental control computer controls the start and stop of the vacuum pump by connecting to the vacuum pump interface according to the real-time air pressure value in the vacuum chamber of the resistor array component obtained by the vacuum gauge, and controls the start and stop of the electromagnetic vacuum valve by connecting to the electromagnetic vacuum valve power supply; when the vacuum pump and the electromagnetic vacuum valve are started, the air inlet of the vacuum pump is connected to the electromagnetic vacuum valve installed on the resistor array component through the vacuum bellows to maintain the vacuum degree in the vacuum chamber of the resistor array component below the set threshold. The vacuum pumping subsystem can maintain the air pressure value in the vacuum chamber of the resistor array component within a reasonable range, preventing the oxidation of the radiation pixels at high temperatures and the heat loss caused by convection. The resistor array only works when the vacuum degree is lower than the set threshold.
[0074] Specifically, the environmental control computer is connected to the vacuum pump DB15 interface through RS485 to realize the start and stop control and fault monitoring of the vacuum pump, and is connected to the electromagnetic vacuum valve power supply through RS232 to control the start and close of the electromagnetic vacuum valve. In addition, since the vacuum pump and the chiller produce a lot of noise during operation, they are placed in a corner far away from the resistor array. The vacuum pump is connected to the electromagnetic vacuum valve installed on the resistor array assembly through a vacuum bellows with a total length of about 10m. The opening and closing of the electromagnetic vacuum valve is realized by a 24V DC power supply controlled by the environmental control computer.
[0075] Furthermore, the structure of the heat dissipation subsystem is as follows Figure 5 As shown in the figure, the semiconductor refrigerator uses the Peltier effect to achieve cooling. When DC current flows through the semiconductor refrigerator, one end absorbs heat and the other end releases heat. Therefore, a precision cooling water circulation machine is required to take away the heat generated by the heat release end of the semiconductor refrigerator through a relatively low temperature refrigerant, so as to keep the temperature inside the resistor array component at a low level. The principle of heat dissipation of the semiconductor refrigerator by the heat dissipation subsystem is:
[0076] The environmental control computer controls the start and stop of the chiller by connecting to the chiller interface, and adjusts the cooling water temperature in the chiller according to the real-time ambient dew point temperature, and monitors, displays, and reports the various parameters of the chiller and the working status of the unit in real time during operation; when the chiller is started, the inlet and outlet of the chiller are connected to the outlet and inlet of the water cooling box in the resistor array assembly through the cooling water pipe, and the heat dissipation end of the semiconductor refrigerator is dissipated by the transmitted cooling water. Among them, the cooling water pipe is about 10m long, and the environmental control computer is connected to the D89 interface of the chiller through the RS485 interface to remotely control the start and stop of the chiller.
[0077] Furthermore, the temperature control subsystem, the vacuum pumping subsystem and the heat dissipation subsystem constitute an environmental support subsystem for providing a suitable cooling, vacuum and heat dissipation environment for the resistor array chip and the packaging components.
[0078] It can be understood that according to the resistor array indicators, through theoretical estimation, when the equivalent black body radiation temperature of a single pixel is heated to 222°C, the heating power is about 1.5mW. Then for the full-screen pixels, the peak power can reach at least 1.5mW×512×512≈400W. When the resistor array runs to the effective simulation temperature, the required large drive current will lead to very high array power consumption and spatial power density. Thermal drift may occur, resulting in image artifacts, or the pixels may be damaged due to overheating. Therefore, cooling and thermal stability are critical to system safety and simulation performance. On the other hand, in order to reduce heat loss caused by convection and prevent the radiating pixels from being oxidized at high temperatures, thereby changing their radiation characteristics, the resistor array needs to operate in a vacuum environment.
[0079] Furthermore, the structure of the environment perception subsystem is as follows Figure 6 As shown, to ensure that the resistor array can be in the environment required for normal operation, in addition to providing corresponding environmental support, it is also necessary to monitor the operating environment of the resistor array in real time. Once the environment is abnormal, the user can be prompted in time or emergency protection operations can be automatically taken. The principle of the environmental perception subsystem to monitor the operating environment of the resistor array component in real time is:
[0080] One end of the vacuum gauge is connected to the vacuum measurement interface of the resistor array assembly through a regulation cable to monitor the vacuum degree in the vacuum chamber of the resistor array assembly in real time; the other end of the vacuum gauge is connected to the environmental control computer to upload the real-time vacuum degree to the environmental control computer. When the real-time vacuum degree does not meet the safety range, the environmental control computer immediately controls each device to power off in sequence and stop the operation of the resistor array assembly. Specifically, the regulation cable is about 10m long, and the vacuum gauge uploads the real-time vacuum degree to the environmental control computer via RS485.
[0081] The temperature and humidity sensor in the environmental temperature and humidity tester monitors the temperature and humidity values of the laboratory environment in real time, and uploads the real-time temperature and humidity data to the environmental control computer through RS485. After receiving the real-time temperature and humidity data, the environmental control computer obtains the environmental dew point temperature by looking up the table, and adjusts the cooling water temperature of the chiller in real time based on the environmental dew point temperature. Specifically, the basis for setting the cooling water temperature of the chiller comes from the temperature and humidity of the laboratory environment. The ambient dew point temperature value needs to be calculated based on the temperature and humidity values. The water temperature set by the chiller should be at least 2°C higher than the dew point temperature, otherwise it is easy to cause condensation on the outer shell of the resistor array component, resulting in a short circuit fault. When the dew point temperature is above 18°C, the device should be stopped in time, because the cooling water temperature has exceeded 20°C at this time, and the cooling effect is poor, which will affect the working efficiency of TEC and even cause TEC performance degradation.
[0082] One end of the vacuum environment box temperature measurement module is connected to the shell temperature probe installed on the surface of the resistor array component shell, and the resistance value of the resistor array component is measured in real time, and the resistance value is converted into a temperature value according to the temperature response characteristics of the shell temperature probe, so as to realize the temperature measurement of the shell of the resistor array component; the other end of the vacuum environment box temperature measurement module is connected to an SD1011 module to power it and realize the communication between the environmental control computer, and the shell temperature of the resistor array component obtained by monitoring is uploaded to the environmental control computer for display; specifically, the shell temperature probe is realized by using an RTD (Resistance Temperature Detector) thermal resistor, and the resistance value of the RTD will change with the change of temperature, and the resistance value has a one-to-one correspondence with the temperature. The RTD temperature probe is installed on the shell surface, and then its resistance value is measured in real time through a data acquisition module, and the resistance value is converted into a temperature value according to the temperature response characteristics of the RTD type, so as to realize the temperature measurement of the shell; this embodiment uses the M2111 module of Simai Kehua Company to collect temperature information, and then powers it through the SD1011 module and realizes the communication between the computer.
[0083] The chip substrate temperature probe is installed on the surface of the resistor array component housing, and is connected to the drive controller to transmit the voltage signal representing the temperature of the resistor array chip substrate obtained by real-time measurement to the drive controller, and the voltage signal is converted into a digital quantity through the A / D acquisition channel in the drive controller. Then, the voltage signal is connected to the environmental control computer through the drive controller, and the voltage signal converted into a digital quantity is converted into a temperature value according to the voltage-temperature response curve using the environmental control software in the environmental control computer, so as to realize the real-time temperature measurement of the resistor array chip substrate. Specifically, the chip substrate temperature probe is realized by using the on-chip temperature measurement module, and the resistor array component will output three analog voltage signals through the vacuum socket to represent the temperature measurement results of three different parts of the resistor array chip. In order to avoid the long-line transmission voltage drop of the analog signal, three A / D acquisition channels (i.e., AD1, AD2, and AD3) are designed to be arranged in the drive controller (also called the drive control card), and the voltage signal representing the temperature is converted into a digital quantity, and then transmitted to the environmental control computer through RS422. Finally, the environmental control software in the environmental control computer is used to convert the voltage value into a temperature value according to the voltage-temperature response curve of the temperature measurement module.
[0084] Furthermore, the principle of the resistor array working state monitoring subsystem to monitor the working state of the resistor array assembly in real time is:
[0085] One end of the drive controller is connected to the resistor array component to obtain the periodic detection signals EOS_X and EOS_Y output by the resistor array peripheral selection circuit when the resistor array component is running. It should be observed that Figure 7 The reference outputs of EOS_X and EOS_Y shown in the figure can prove that the chip address selection circuit works normally. Among them, the amplitude of EOS_X is equal to the DVDD power supply voltage, the pulse width is 0.56μs, and the period is 9.52μs; the amplitude of EOS_Y is equal to the DVDD power supply voltage, the pulse width is 9.52μs, and the period is 4.88376ms.
[0086] In order to avoid various interferences during long-line transmission, a signal detection module is designed in the drive controller. The signal detection module in the drive controller is used to verify whether EOS_X and EOS_Y are in a normal state, and the verification result is transmitted to the environmental control computer connected to the other end of the drive controller through RS422. At the same time, EOS_X and EOS_Y are differentially processed through the signal detection module, and the obtained differential signal is transmitted to the oscilloscope connected to the other end of the drive controller. The waveform of the differential signal is displayed using the oscilloscope.
[0087] Furthermore, the principle of the resistor array power supply and monitoring subsystem for real-time monitoring of power supply and power consumption of the power load is:
[0088] The DVDD power supply is a three-output channel switching regulated power supply, which is used to power the resistor array peripheral site selection circuit, chip substrate temperature probe and electromagnetic vacuum valve. It is connected to the environmental control computer to perform power consumption program control and real-time monitoring using the environmental control computer.
[0089] The AVDD power supply and TVDD power supply are two precision power supplies with remote sensing, which respectively power the resistor array heating resistor and the semiconductor cooler, and are respectively connected to the environmental control computer, which uses the environmental control computer for power program control and real-time monitoring. Specifically, the TVDD power supply indirectly powers the semiconductor cooler by powering the temperature control power supply.
[0090] Specifically, the DVDD power supply is called the power supply for the scan gating circuit. The scan gating circuit is a conventional digital circuit with an operating current of no more than 5mA and a voltage of 6.5V. There are no special requirements for the DVDD power supply. The AVDD power supply will power the discharge circuit of the pixel and is the source of the resistance heating power. The maximum current is about 70A. Such a large current will generate a considerable potential difference on the cable, causing the actual voltage at the chip power port on the array component to be lower than the power output end. Therefore, a programmable precision power supply Agilent N7950A with remote sensing, also known as a linear tracking power supply, is selected for AVDD. The power supply principle is as follows: Figure 8 After the current flows through the resistor RL on the line, the potential relative to the power output terminal is reduced. When the remote sensing terminals S+ and S- detect this potential difference, the voltage drop in the power compensation cable is adjusted so that when the input current changes, the actual voltage at the power input terminal of the array component can be consistent with the output terminal of the power supply and remain constant.
[0091] Furthermore, in this embodiment, both the environmental control computer and the remote control computer are Advantech industrial computers, the operating system of the industrial computer is Windows7 64-bit, and the VS2015 and Qt5.9 development platforms are used to perform UI design and function implementation on the environmental control software, so that it has a beautiful human-computer interaction interface with clear operating logic.
[0092] The environmental control software needs to realize program control of all equipment. The main technologies used include serial communication, GPIB communication, A / D acquisition, SCPI language and Modbus RTU language.
[0093] (1) A / D acquisition
[0094] In order to enable the temperature-controlled power supply to obtain the control voltage signal output by the temperature controller, an A / D data acquisition card is used to convert the control voltage signal into a digital quantity, which is then read and processed by the environmental control computer and sent to the temperature-controlled power supply. The control of the A / D data acquisition card is implemented by the function library provided by the manufacturer. The corresponding DLL dynamic link library needs to be added according to the computer operating system and the number of bits, and then the corresponding API (application programming) interface function is called to implement the specific function. The API interface function is specifically expressed as:
[0095] libdaq_init() / / initialization;
[0096] device_example(int index) / / Select device name;
[0097] adc1_config_channel(daqusb3214*daqdevice) / / channel configuration (range, sampling rate, etc.);
[0098] adc1_single_sample_example(daqusb3214*daqdevice) / / single sampling mode;
[0099] gpio_example(daqusb3214*device) / / Port read and write.
[0100] (2) SCPI (Standard Commands for Programmable Instruments) language control instruments
[0101] The DVDD power supply and AVDD power supply in the resistor array power supply and monitoring subsystem both use the SCPI instrument command language to set the voltage and current of their output channels, turn on and off the output, and read back the output voltage and current in real time. RS232 is used to send and receive commands to realize program control of the ITECH IT6322A power supply. The main commands used are:
[0102] SYST:REM\n / / Set the power supply to remote control mode;
[0103] NST:FIR / SECO / THI\n / / Select the current operation channel 1 / 2 / 3;
[0104] VOLT 6.5\n / / Set the current channel output voltage to 6.5V;
[0105] OUTP 1 / 0\n / / Turn on / off the current channel output;
[0106] MEAS? \n / / Read the actual output voltage;
[0107] MEAS:CURR? \n / / Read the actual output current.
[0108] To program the Agilent N7950A power supply, use a GPIB to USB card to communicate with the environmental control computer. Since the power supply is used to power the heating resistors of the resistor array and is a high-current power supply, in order to avoid damage to the resistor array chip due to excessive voltage or current, the power supply output protection needs to be programmed to limit its output voltage and current within a certain safe range. The corresponding instructions are as follows:
[0109] SOUR:VOLT 6.5 / / Set the output voltage to 6.5V;
[0110] OUT:STAT 1 / 0 / / Turn on / off power output;
[0111] VOLT:PROT 7 / / Set the voltage protection level to 7V;
[0112] CURR:LIM 70 / / Set the positive current limit to 70A;
[0113] CURR:PROT:STAT ON / / Turn on overcurrent protection.
[0114] (3) Modbus RTU language control instrument
[0115] Most of the other devices are programmed using Modbus RTU language, and the CRC check code is used at the end of the instruction. Taking the chiller as an example, it is necessary to realize the sequential start and stop of the controller, circulating water pump, and refrigeration, set the water temperature and flow warning values, and monitor the real-time water temperature and flow. The specific instructions are shown in Table 1.
[0116] Table 1 Chiller control instructions
[0117]
[0118] (4) Resistor array chip substrate temperature control technology
[0119] Based on the temperature control subsystem, the A / D data acquisition card and Modbus RTU instrument command language can be used to achieve precise control of the substrate temperature of the resistor array chip. The program flow is as follows: Fig. 9As shown. Since the communication mode between the environmental control computer and the temperature control power supply is a serial port, it is impossible to implement the issuance of control instructions and data reading back in parallel, so the sending function of each instruction is placed in a loop body for sequential execution. After starting the temperature control subsystem, send instructions to set the target temperature of the temperature controller to 0℃, and then power on the temperature control power supply. After that, the semiconductor refrigerator temperature is read back, the output voltage and current of the temperature control power supply are read back, and the output control voltage of the temperature controller is collected in a cycle of 50ms, and the voltage of the temperature control power supply acting on the two ends of the semiconductor refrigerator is adjusted accordingly. In this way, the continuity and sensitivity of the temperature controller to the temperature control of the substrate of the resistor array chip can be guaranteed, and the effective cooling of the substrate of the resistor array chip can be achieved.
[0120] Specifically, the environment control software interface is divided into various subsystems to realize the control, parameter reading and basic status display of various subsystems. There is also a threshold setting area to set the preset working conditions for vacuum degree, cooling water temperature and other startup standards; a serial port allocation area to realize the allocation and opening and closing of the communication serial ports of various equipment.
[0121] The environmental control software has two control modes: automatic and manual. In the automatic mode, the environmental control software realizes the one-button automatic operation of the control system, and performs power-on and power-off operations on various devices in the control system according to the preset sequence. In the manual mode, the environmental control software interlocks the logic according to the equipment start and stop sequence manually set by the operator, and operates the control system. The standard start and stop sequence of the control system is as follows:
[0122] (1) Start the vacuum pump and the electromagnetic vacuum valve power supply, open the electromagnetic vacuum valve, and then start the environmental sensing subsystem to collect data and monitor the vacuum degree in the vacuum cavity of the resistor array component measured by the vacuum gauge.
[0123] (2) After the vacuum degree of the cavity drops below 15Pa, start the chiller and confirm that there is no leakage at the cooling water inlet / outlet ports of the resistor array assembly.
[0124] (3) After the cooling water temperature reaches the target temperature (to avoid condensation, the set liquid temperature should be at least 2°C higher than the dew point temperature) and the liquid cooling source flow is not less than 70% of the normal flow, turn on the temperature control power supply. The voltage and current upper limits of the temperature control power supply are set to 95V and 25A respectively. The refrigeration setting temperature of the temperature controller is 0°C. The refrigeration temperature controller should start working immediately, and the measured temperature gradually decreases until it fluctuates in a small range of about ±0.5°C around the set temperature.
[0125] (4) Turn on the oscilloscope, AVDD power supply, and DVDD power supply, load the selection timing signal but not the image drive signal, and confirm that the waveforms of the EOS_X signal (pulse width is one row selection time, period is one column selection time) and the EOS_Y signal (pulse width is one column selection time, period is one frame period) on the environmental control software or oscilloscope meet the requirements.
[0126] (5) The image driving signal is loaded and the resistor array starts to project the infrared image.
[0127] (6) After the simulation stops, the image drive signal is unloaded in sequence, the selection timing signal is unloaded, the AVDD power supply and DVDD power supply are cut off, the temperature control subsystem is turned off, and the chiller is turned off, but the vacuum pump keeps working.
[0128] (7) The vacuum pump continues to work until the temperature of the resistor array chip rises above the dew point temperature, then the power supply of the electromagnetic vacuum valve is turned off, the vacuum pump is turned off, and the main power supply of the system is turned off.
[0129] The control process of the environmental control software in automatic control mode is as follows Fig.10 shown. Fig.10 The symbol “&&” means “and”, indicating whether two conditions are met at the same time.
[0130] Table 2 Fault classification and protection measures
[0131]
[0132] In addition to completing the automatic start and stop of the control system, the environmental control software must also judge the key data or information collected by the distributed sensor network during the entire process of system operation. When an abnormal situation occurs, an alarm message is given on the software interface, and relevant protective operations are performed to achieve automatic response to faults and ensure the safe and stable operation of the environmental control system. The main fault classifications and corresponding protection measures are shown in Table 2.
[0133] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0134] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.
Claims
1. A resistor array environmental control system based on a distributed sensor network, characterized in that: The control system includes a remote control computer, an environmental control computer, an environmental temperature and humidity tester, a temperature controller, a temperature control power supply, a chiller, a vacuum gauge, a vacuum pump, a vacuum environment box temperature measurement module, a drive controller, an oscilloscope, a semiconductor refrigerator, a heat expansion plate temperature measurement module, an electromagnetic vacuum valve, a chip substrate temperature measurement probe, a shell temperature measurement probe, a DVDD power supply, an AVDD power supply, a TVDD power supply and environmental control software; The remote control computer is used to map the environment control software running on the environment control computer to the local computer in the form of remote login through the local area network, so that the operator can directly control the control system at the front-end console and observe the operating status of the laboratory environment in real time; The environmental control computer is used to control and visualize the important operating parameters and working status of the resistor array assembly in real time through the environmental control software therein, and promptly prompt the operator to take emergency measures manually or automatically when an early warning or failure occurs, so as to ensure the safe and stable operation of the resistor array assembly; The environmental control computer, temperature controller, semiconductor refrigerator, heat expansion plate temperature measurement module and temperature control power supply form a temperature control subsystem for controlling the temperature of the resistor array chip substrate; wherein the temperature control power supply is powered by a TVDD power supply; The environmental control computer, vacuum pump, electromagnetic vacuum valve and DVDD power supply as the electromagnetic vacuum valve power supply constitute a vacuum pumping subsystem for controlling the vacuum degree in the vacuum chamber of the resistor array assembly; The environmental control computer and the chiller form a heat dissipation subsystem for dissipating heat from the semiconductor refrigerator; The temperature and humidity sensor, vacuum gauge, vacuum environment chamber temperature measurement module, shell temperature measurement probe and chip substrate temperature measurement probe in the environmental temperature and humidity tester constitute an environmental sensing subsystem for real-time monitoring of the operating environment of the resistor array assembly; The environmental control computer, drive controller and oscilloscope constitute a resistor array working state monitoring subsystem, which is used to monitor the working state of the resistor array assembly in real time; The DVDD power supply, AVDD power supply and TVDD power supply form a resistor array power supply and monitoring subsystem, which is used to supply power to the power load and monitor the power consumption in real time; The environmental control software runs in the environmental control computer and is used to obtain real-time monitoring data of various devices in the control system for summary judgment, and based on the judgment results, it sends control instructions to various subsystems for remote control; Among them, a distributed sensor network structure is also deployed in the control system, and the environmental perception subsystem is implemented based on the distributed sensor network. The distributed sensor network structure is used to collect environmental indicators and equipment operation indicators of the resistor array components; wherein the collection of the environmental indicators is realized by various sensor devices deployed in various types of equipment, and the collection of the equipment operation indicators is realized by the sensor units provided by various types of equipment.
2. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The temperature control subsystem also includes an A / D data acquisition card; The principle of the temperature control subsystem controlling the temperature of the resistor array chip substrate is: The substrate of the resistor array chip is taken as a controlled object, the temperature of the substrate of the resistor array chip is monitored and acquired by using a heat spreading plate temperature measuring module, and the temperature signal output by the heat spreading plate temperature measuring module is taken as a controlled parameter; The temperature controller uses the temperature signal output by the heat expansion plate temperature measurement module as input, and outputs an error signal by comparing it with the target temperature preset by the environmental control computer, calculates the error signal in combination with the PID control algorithm, and outputs a DC control voltage signal; The A / D data acquisition card collects and transmits the DC control voltage signal output by the temperature controller to the environment control computer at a certain frequency; The environmental control computer uses the DC control voltage signal transmitted by the A / D data acquisition card to adjust the voltage output by the temperature control power supply to the semiconductor refrigerator, and drives and controls the cooling power of the semiconductor refrigerator in a program-controlled manner, so that the substrate of the resistor array chip is kept within a reasonable temperature range, thereby realizing closed-loop control of the temperature of the substrate of the resistor array chip.
3. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The principle of the vacuum pumping subsystem controlling the vacuum degree in the vacuum chamber of the resistor array assembly is as follows: The environmental control computer controls the start and stop of the vacuum pump by connecting to the vacuum pump interface based on the real-time air pressure value in the vacuum chamber of the resistor array assembly obtained by real-time monitoring of the vacuum gauge, and controls the start and stop of the electromagnetic vacuum valve by connecting to the electromagnetic vacuum valve power supply; when the vacuum pump and the electromagnetic vacuum valve are started, the air inlet of the vacuum pump is connected to the electromagnetic vacuum valve installed on the resistor array assembly through the vacuum bellows to maintain the vacuum degree in the vacuum chamber of the resistor array assembly below the set threshold.
4. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The principle of heat dissipation of the semiconductor refrigerator by the heat dissipation subsystem is as follows: The environmental control computer controls the start and shut down of the chiller by connecting to the chiller interface, and adjusts the cooling water temperature in the chiller according to the real-time ambient dew point temperature, and monitors, displays and reports various parameters of the chiller and the working status of the unit in real time during operation; When the chiller is started, the water inlet and outlet of the chiller are connected to the water inlet and outlet of the water cooling box in the resistor array assembly through the cooling water pipe, and the heat dissipation end of the semiconductor refrigerator is dissipated by the transmitted cooling water.
5. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The temperature control subsystem, the vacuum pumping subsystem and the heat dissipation subsystem constitute an environmental support subsystem, which is used to provide a suitable refrigeration, vacuum and heat dissipation environment for the resistor array chip and the packaging component.
6. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The principle of the environmental sensing subsystem to monitor the operating environment of the resistor array component in real time is: One end of the vacuum gauge is connected to the vacuum measurement interface of the resistor array assembly through a regulation cable to monitor the vacuum degree in the vacuum chamber of the resistor array assembly in real time; the other end of the vacuum gauge is connected to the environment control computer to upload the real-time vacuum degree to the environment control computer. When the real-time vacuum degree does not meet the safety range, the environment control computer immediately controls each device to power off in sequence to stop the operation of the resistor array assembly; The temperature and humidity sensor in the environmental temperature and humidity tester monitors the temperature and humidity values of the laboratory environment in real time, and uploads the real-time temperature and humidity data to the environmental control computer. After receiving the real-time temperature and humidity data, the environmental control computer obtains the environmental dew point temperature by looking up the table, and adjusts the cooling water temperature of the chiller in real time based on the environmental dew point temperature; One end of the vacuum environment box temperature measurement module is connected to a shell temperature measurement probe installed on the surface of the resistor array assembly shell, so as to measure the resistance value of the resistor array assembly in real time, and convert the resistance value into a temperature value according to the temperature response characteristics of the shell temperature measurement probe, so as to achieve the temperature measurement of the shell of the resistor array assembly; the other end of the vacuum environment box temperature measurement module is connected to an SD1011 module to power it and achieve communication with the environment control computer, so as to upload the shell temperature of the resistor array assembly obtained by monitoring to the environment control computer for display; The chip substrate temperature measuring probe is installed on the surface of the resistor array component shell, and is connected to a drive controller to transmit a voltage signal representing the temperature of the resistor array chip substrate obtained by real-time measurement to the drive controller, and the voltage signal is converted into a digital quantity through an A / D acquisition channel in the drive controller. The drive controller is connected to an environmental control computer, and the environmental control software in the environmental control computer is used to convert the voltage signal converted into a digital quantity into a temperature value according to a voltage-temperature response curve, thereby realizing real-time temperature measurement of the resistor array chip substrate.
7. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The principle of the resistor array working state monitoring subsystem for real-time monitoring of the working state of the resistor array assembly is: One end of the drive controller is connected to the resistor array component to obtain periodic detection signals EOS_X and EOS_Y output by the resistor array peripheral addressing circuit when the resistor array component is running. The signal detection module in the drive controller is used to verify whether EOS_X and EOS_Y are in a normal state, and the verification result is transmitted to the environmental control computer connected to the other end of the drive controller. At the same time, EOS_X and EOS_Y are differentially processed by the signal detection module, and the obtained differential signal is transmitted to the oscilloscope connected to the other end of the drive controller, and the waveform of the differential signal is displayed using the oscilloscope.
8. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The principle of the resistor array power supply and monitoring subsystem for real-time monitoring of power supply and power consumption of power loads is as follows: The DVDD power supply is a three-output channel switching voltage-stabilized power supply, which is used to power the resistor array peripheral site selection circuit, the chip substrate temperature probe and the electromagnetic vacuum valve, and is connected to the environmental control computer to perform power program control and real-time monitoring by the environmental control computer; The AVDD power supply and TVDD power supply are two precision power supplies with remote sensing, which respectively power the resistor array heating resistor and the semiconductor refrigerator, and are respectively connected to the environmental control computer to perform power consumption program control and real-time monitoring using the environmental control computer.
9. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The environmental control software has two control modes: automatic and manual. In automatic mode, the environmental control software realizes one-click automatic operation of the control system, and powers on and off various types of equipment in the control system according to a preset sequence. In manual mode, the environmental control software interlocks the logic according to the equipment start and stop sequence manually set by the operator to operate the control system.
10. The resistor array environmental control system based on a distributed sensor network according to claim 1, characterized in that: The environmental indicators include laboratory ambient temperature and humidity, vacuum degree of the resistor array component vacuum chamber, shell temperature, resistor array chip substrate temperature and semiconductor refrigerator temperature; the equipment operation indicators include chiller cooling water temperature and flow, vacuum pump speed, resistor array component working status and real-time voltage and current output by DVDD power supply, AVDD power supply and TVDD power supply.
