Plate processing method and device, processing equipment and readable storage medium

Abstract

The invention relates to a plate processing method and device, processing equipment and a readable storage medium. The method comprises the following steps: acquiring a segmentation period constraint value of a plate and layout information of parts in the plate; according to the segmentation period constraint value and the layout information of the parts in the plate, determining a target period segmentation line of the plate; and according to the target period parting line, the periodic processing path of the plate is determined. According to the method, different target period parting lines and periodic processing paths can be adapted according to different breadth sizes of the plates and different layout information of parts in the plates, so that the problem that the strip plates cannot be completely located in a processing breadth area due to the fact that the processing breadth area of a machine tool is a fixed value is effectively solved; and the machining precision of plates with different sizes is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of plate processing, and in particular to a plate processing method, device, processing equipment and readable storage medium. Background Art

[0002] With the continuous development of plate processing technology and the continuous enrichment of plate processing needs, the requirements for plate processing accuracy are getting higher and higher. In the flat steel machine processing process, since the machine tool processing area is a fixed area, the processing width area is a fixed value, and there is a problem that the long strip of plate cannot be completely within the processing width area, and it is difficult to ensure the processing effect of the long strip of plate. Summary of the invention

[0003] Based on this, it is necessary to provide a plate processing method, device, processing equipment and readable storage medium to address the above technical problems.

[0004] A plate processing method, comprising:

[0005] Obtain the segmentation period constraint value of the plate and the layout information of the parts in the plate;

[0006] Determining a target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of parts in the plate;

[0007] According to the target periodic dividing line, a periodic processing path of the plate is determined.

[0008] In one embodiment, the obtaining of the segmentation period constraint value of the plate and the arrangement information of the parts in the plate specifically includes: obtaining the minimum segmentation period of the plate, the maximum segmentation period, the graphic distribution shape and the graphic distribution position of the parts in the plate;

[0009] The step of determining the target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of the parts in the plate comprises:

[0010] Determine a data structure set corresponding to the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate;

[0011] The target period segmentation line is determined according to the segmentation period minimum value, the segmentation period maximum value and the data structure set.

[0012] In one embodiment, determining the data structure set corresponding to the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate includes:

[0013] Determining a data box plot of the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate;

[0014] Determining a graphic structure of the parts in the plate according to a data box plot of the parts in the plate;

[0015] Determine a data structure set corresponding to the parts in the plate according to the graphic structure of the parts in the plate;

[0016] The step of determining the target period segmentation line according to the segmentation period minimum value, the segmentation period maximum value and the data structure set includes:

[0017] Get the characteristic coordinate value of the plate;

[0018] Determining the connected straight line information of the parts in the plate according to the data structure set;

[0019] The target period segmentation line is determined according to the segmentation period minimum value, the segmentation period maximum value, the connected straight line information and the plate feature coordinate value.

[0020] In one embodiment, determining the graphic structure of the parts in the plate according to the data box plot of the parts in the plate includes:

[0021] Obtain characteristic coordinate values ​​of a data box plot of parts in the plate;

[0022] The graphic structure of the parts in the plate is determined according to the characteristic coordinate values ​​of the data box plot.

[0023] In one embodiment, determining the periodic processing path of the plate according to the target periodic segmentation line includes:

[0024] Obtain the linear position relationship between the current target cycle segmentation line and the part graphics in the plate;

[0025] When the linear position relationship is a linear intersection relationship, the periodic processing path of the plate is determined according to the current target periodic dividing line and the adjacent target periodic dividing line;

[0026] When the linear position relationship is an inclusion relationship, the periodic processing path of the plate is determined according to the current target periodic segmentation line.

[0027] In one embodiment, it also includes:

[0028] Obtain the profile feature information of the plate, processing parameters, and data box line diagram of the parts in the plate;

[0029] Determine a set of unprocessed edge contours of the plate according to the contour feature information, the processing parameters and the data box plot;

[0030] A periodic processing path of the plate is determined according to the set of unprocessed edge contours.

[0031] In one embodiment, the obtaining of the processing parameters of the plate is specifically: obtaining the starting length and overcut length of the plate;

[0032] Determining the unprocessed edge contour set of the plate according to the contour feature information, the processing parameters and the data box line diagram includes:

[0033] Determining the overlapping contour information of the plate according to the contour feature information and the data box line diagram of the parts in the plate;

[0034] The unprocessed edge contour set of the plate is determined according to the overlapping contour information of the plate, the starting length of the plate and the overcut length.

[0035] A plate processing device, comprising:

[0036] An acquisition module is used to obtain the segmentation period constraint value of the plate and the layout information of the parts in the plate;

[0037] A period segmentation determination module, connected to the acquisition module, for determining a target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of parts in the plate;

[0038] The processing path determination module is connected to the period division determination module and is used to determine the periodic processing path of the plate according to the target period division line.

[0039] A processing device includes a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the above method.

[0040] A computer-readable storage medium stores a computer program, which implements the above method when executed by a processor.

[0041] A computer program product, when the computer program product is run on a terminal device, enables the terminal device to execute any of the methods described above.

[0042] The beneficial effects of the embodiments provided in this application include:

[0043] The plate processing method obtains a target period segmentation line that is suitable for plates of different sizes and takes into account the segmentation processing efficiency of parts in the plate according to the segmentation period constraint value of the plate (such as the segmentation period minimum value and the segmentation period maximum value) and the layout information of parts in the plate (such as the graphic distribution shape and graphic distribution position of the parts in the plate), and then plans a periodic processing path for the plate that is suitable for plates of different sizes and guides the plate processing process according to the obtained target period segmentation line. Different target period segmentation lines and periodic processing paths can be adapted according to the different plate sizes and different layout information of parts in the plate, effectively improving the problem that the long strip plate cannot be completely within the processing format area due to the fixed value of the machine tool processing format area, and effectively improving the processing accuracy of plates of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1 is a schematic flow chart of a plate processing method in one embodiment;

[0046] Figure 2 is a specific flow chart of step 104 in one embodiment;

[0047] Figure 3 is a specific flow chart of step 104 in one embodiment;

[0048] Figure 4 This is a specific flow chart of step 106 in one embodiment;

[0049] Figure 5 is a schematic flow chart of a plate processing method in one embodiment;

[0050] Figure 6 is a schematic structural block diagram of a plate processing device in one embodiment;

[0051] Figure 7 is a schematic block diagram of a specific structure of a cycle segmentation determination module 40 in one embodiment;

[0052] Figure 8 is a schematic block diagram of a specific structure of a cycle segmentation determination module 40 in one embodiment;

[0053] Fig. 9 is a schematic block diagram of the specific structure of a processing path determination module 60 in one embodiment;

[0054] Fig.10 is a schematic structural block diagram of a plate processing device in one embodiment;

[0055] Fig.11 Schematic diagram of the structure of a processing device in one embodiment. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] Figure 1 , is a schematic flow chart of a plate processing method in one embodiment.

[0059] In this embodiment, if Figure 1 As shown, the plate processing method includes steps 102 to 106.

[0060] Step 102, obtaining the segmentation period constraint value of the plate and the layout information of the parts in the plate.

[0061] The segmentation cycle constraint value may be the processing cycle division permitted in the sheet processing process. The layout information of parts in the sheet may be the graphic information of the parts arranged in the sheet. Optionally, the segmentation cycle constraint value may be the segmentation cycle minimum value and the segmentation cycle maximum value. The layout information of parts in the sheet may be the graphic distribution shape and graphic distribution position of the parts in the sheet.

[0062] The segmentation cycle minimum value may be the processing cycle division minimum value allowed in the plate processing process, and is applied to the scenario where the processing cycle division minimum value is constrained. The segmentation cycle maximum value may be the processing cycle division maximum value allowed in the plate processing process, and is applied to the scenario where the processing cycle division maximum value is constrained. The graphic distribution shape may be the graphic contour shape of the parts in the plate. The graphic distribution position may be the arrangement position of the graphic contour of the parts in the plate relative to the plate coordinate system. Optionally, the graphic distribution shape includes line segment graphics and non-line segment graphics.

[0063] The situations of obtaining the segmentation period constraint value of the plate and the arrangement information of the parts in the plate include: analyzing the plate through the plate analysis module to obtain the segmentation period constraint value of the plate, and analyzing the parts in the plate through the plate analysis module to obtain the arrangement information of the parts in the plate.

[0064] Step 104, determining the target period segmentation line of the plate according to the segmentation period constraint value and the part arrangement information in the plate.

[0065] The target cycle segmentation line can be generated based on the segmentation cycle constraint value and the layout information of the parts in the plate. It can be applicable to plates of different sizes and different layout situations of parts in the plate and can be a processing cycle segmentation line that takes into account the segmentation processing efficiency of the parts in the plate.

[0066] The situations in which the target period segmentation line of the plate is determined according to the segmentation period constraint value and the arrangement information of the parts in the plate include: determining the data structure set corresponding to the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate, and then determining the target period segmentation line of the plate according to the obtained data structure set.

[0067] Step 106, determining the periodic processing path of the plate according to the target periodic segmentation line.

[0068] The periodic processing path can be generated based on the target periodic segmentation line, and can be applied to plates of different sizes and provide periodic or segmented guidance for the plate processing process.

[0069] The case of determining the periodic processing path of the plate according to the target periodic dividing line includes: obtaining the linear position relationship between the target periodic dividing line and the part graphics in the plate, and determining the periodic processing path of the plate according to the linear position relationship.

[0070] When planning the processing of the plate, the plate is analyzed through the plate analysis module to obtain the segmentation period constraint value of the plate, and the parts in the plate are analyzed through the plate analysis module to obtain the layout information of the parts in the plate; according to the graphic distribution shape and graphic distribution position of the parts in the plate, the data structure set corresponding to the parts in the plate is determined, and then the target period segmentation line of the plate is determined based on the obtained data structure set; the linear position relationship between the target period segmentation line and the graphics of the parts in the plate is obtained, and the periodic processing path of the plate is determined based on the linear position relationship.

[0071] The plate processing method provided in this embodiment obtains a target cycle dividing line that is suitable for plates of different formats and takes into account the efficiency of segmentation processing of parts in the plate according to the segmentation cycle constraint value of the plate (such as the minimum segmentation cycle value and the maximum segmentation cycle value) and the layout information of parts in the plate (such as the graphic distribution shape and graphic distribution position of parts in the plate). Then, based on the obtained target cycle dividing line, a periodic processing path for the plate that is suitable for plates of different formats and guides the plate processing process is planned. Different target cycle dividing lines and periodic processing paths can be adapted to different plate formats and different layout information of parts in the plate, effectively improving the problem that the long strip plate cannot be completely within the processing format area due to the fixed value of the machine tool processing format area, and effectively improving the processing accuracy of plates of different sizes.

[0072] Figure 2 , which is a specific flow chart of step 104 in an embodiment.

[0073] In this embodiment, if Figure 2 As shown, step 104 includes sub-steps 202 to 206 .

[0074] In sub-step 202, a data box plot of the parts in the plate is determined according to the graphic distribution shape and graphic distribution position of the parts in the plate.

[0075] The data box plot can be generated based on the graphic distribution shape and graphic distribution position of the plate parts, and can reflect the data graphics of the graphic shape, graphic position and planned process type of the parts in the plate.

[0076] The case of determining the data box-line diagram of the parts in the plate according to the graphic distribution shape and the graphic distribution position of the parts in the plate includes: determining the graphic contour data of the parts in the plate according to the graphic distribution shape and the graphic distribution position of the parts in the plate, dividing them, and obtaining the data box-line diagram of the parts in the plate.

[0077] In sub-step 204, a graphic structure of the parts in the plate is determined based on the data box-line diagram of the parts in the plate.

[0078] The graphic structure may be generated based on a data box line diagram of the parts in the plate, and may be a data structure unit that reflects the graphic shape, graphic position, and planned process type of the parts in the plate.

[0079] The case of determining the graphic structure of the parts in the plate according to the data box plot of the parts in the plate includes: obtaining characteristic coordinate values ​​of the data box plot of the parts in the plate; and determining the graphic structure of the parts in the plate according to the characteristic coordinate values ​​of the data box plot.

[0080] In sub-step 206, a data structure set corresponding to the parts in the plate is determined according to the graphic structure of the parts in the plate.

[0081] According to the graphic structure of the parts in the plate, the case of determining the data structure set corresponding to the parts in the plate includes: sorting the graphic structure of the parts in the plate, and combining the sorted graphic structures to obtain a data structure set that can reflect the graphic shapes, graphic positions and planned process types of all parts in the plate.

[0082] When planning the processing of the plate, the graphic contour data of the parts in the plate are determined and divided according to the graphic distribution shape and graphic distribution position of the parts in the plate, and a data box-line diagram of the parts in the plate is obtained; the characteristic coordinate values ​​of the data box-line diagram of the parts in the plate are obtained; the graphic structure of the parts in the plate is determined according to the characteristic coordinate values ​​of the data box-line diagram; the graphic structure of the parts in the plate is sorted, and the sorted graphic structures are combined to obtain a data structure set that can reflect the graphic shape, graphic position and planned process type of all parts in the plate.

[0083] The plate processing method provided in this embodiment obtains a data structure set that can reflect the graphic shape, graphic position and planned process type of all parts in the plate based on the graphic distribution shape and graphic distribution position of the parts in the plate, thereby realizing the conversion of the graphic contour of the parts in the plate to the data structure set, and facilitating the implementation of subsequent processing processes.

[0084] Figure 3 , which is a specific flow chart of step 104 in an embodiment.

[0085] In this embodiment, if Figure 3 As shown, step 104 includes sub-steps 302 to 306 .

[0086] In sub-step 302, the characteristic coordinate values ​​of the plate are obtained.

[0087] In sub-step 304, the connected straight line information of the parts in the plate is determined according to the data structure set.

[0088] In sub-step 306, a target period segmentation line is determined according to the segmentation period minimum value, the segmentation period maximum value, the connected straight line information and the plate feature coordinate value.

[0089] The plate feature coordinate value may be a coordinate value of a plate feature position. The connected straight line information may be generated based on a data structure set and may be a connected straight line that can reflect the distribution of parts in the plate.

[0090] The situations in which the target period dividing line is determined based on the segmentation period minimum, segmentation period maximum, connected straight line information and plate characteristic coordinate values ​​include: determining the distance information between different positions in the plate and the connected straight lines based on the segmentation period maximum and the plate characteristic coordinate values, and then determining the target period dividing line based on the obtained distance information and the segmentation period minimum.

[0091] The plate processing method provided in this embodiment determines the connected straight line information of the parts in the plate according to the obtained data structure set, and combines the plate characteristic coordinate value, the segmentation period minimum value and the segmentation period maximum value to obtain the target period segmentation line that can be applied to plates of different formats and different layout situations of parts in the plate and takes into account the segmentation processing efficiency of the parts in the plate, thereby effectively improving the scope of application and compatibility of the plate processing method while ensuring the timeliness of the plate processing method.

[0092] For example, the graphic contour data of all parts in the plate are separated, the data box plot box of the plate parts is calculated, and two graphic structures XBox are created for each data box plot box (one is the X coordinate of the lower left corner of the data box plot box, head is true; the other is the X coordinate of the upper right corner of the data box plot box, head is false), and the data structure set XBoxs of all graphics is obtained, and each graphic structure XBox is sorted; the data structure set XBoxs is looped, the heads in the graphic structure XBox are counted and paired, and connected straight lines are obtained (that is, there are parts between x1-x2); based on the X coordinate of the lower left corner of the plate (that is, the characteristic coordinate value of the plate), the segmentation period maximum is looped and superimposed to determine the distance between different positions in the plate and the head and tail of the connected straight line at this time, and then the target period segmentation line XList of the plate is obtained according to the segmentation period minimum.

[0093] Figure 4 , which is a specific flow chart of step 106 in one embodiment.

[0094] In this embodiment, if Figure 4 As shown, step 106 includes sub-steps 402 to 406 .

[0095] In sub-step 402, the linear position relationship between the current target period segmentation line and the part graphics in the plate is obtained.

[0096] The linear position relationship may be the relative position relationship between the current target period segmentation line and the part graphics in the sheet. Optionally, the linear position relationship includes a linear intersection relationship and a linear inclusion relationship. The linear intersection relationship may be the cross-overlap relationship between the current target period segmentation line and the part graphics in the sheet. The linear inclusion relationship may be the non-cross-overlap relationship between the current target period segmentation line and the part graphics in the sheet.

[0097] In sub-step 404, when the linear position relationship is a linear intersection relationship, a periodic processing path of the plate is determined according to the current target periodic dividing line and the adjacent target periodic dividing line.

[0098] The situations of determining the periodic processing path of the plate according to the current target periodic dividing line and the adjacent target periodic dividing line include: determining the current periodic processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the current periodic dividing line; determining the adjacent periodic processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the adjacent target periodic dividing line.

[0099] In sub-step 406, when the linear position relationship is an inclusion relationship, the periodic processing path of the plate is determined according to the current target periodic segmentation line.

[0100] The situation of determining the periodic processing path of the plate according to the current target periodic dividing line includes: determining the current periodic processing path according to the part graphics in the plate corresponding to the current periodic dividing line.

[0101] Obtain the linear position relationship between the current target cycle dividing line and the part graphics in the plate; determine the current cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the current cycle dividing line; when the linear position relationship is a linear intersection relationship, determine the adjacent cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the adjacent target cycle dividing lines; when the linear position relationship is an inclusion relationship, determine the current cycle processing path according to the part graphics in the plate corresponding to the current cycle dividing line.

[0102] When planning the processing of the plate, obtain the linear position relationship between the current target cycle dividing line and the part graphics in the plate; determine the current cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the current cycle dividing line; determine the adjacent cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the adjacent target cycle dividing line; determine the current cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the current cycle dividing line; when the linear position relationship is a linear intersection relationship, determine the adjacent cycle processing path according to the cross-overlapping graphics of the part graphics in the plate corresponding to the adjacent target cycle dividing line; when the linear position relationship is an inclusion relationship, determine the current cycle processing path according to the part graphics in the plate corresponding to the current cycle dividing line.

[0103] The sheet metal processing method provided in this embodiment determines a periodic processing path suitable for different relative position relationships based on the different relative position relationships between the current target period dividing line and the part graphics in the sheet metal, thereby effectively improving the feasibility and scope of application of sheet metal processing while ensuring the processing efficiency of the parts in the sheet metal.

[0104] Figure 5 , is a schematic flow chart of a plate processing method in one embodiment.

[0105] In this embodiment, if Figure 5 As shown, the plate processing method also includes steps 103 to 107.

[0106] Step 103, obtaining the profile feature information of the plate, processing parameters, and data box line diagram of the parts in the plate.

[0107] The processing parameters may be the processing parameters planned for the parts in the sheet. Optionally, the processing parameters include a starting length and an overcut length. The starting length may be the distance between the starting point of the tool and the starting point of the contour to be processed of the part in the sheet during sheet processing. The overcut length may be the distance between the ending point of the tool and the ending point of the contour to be processed of the part in the sheet during sheet processing.

[0108] Step 105 , determining a set of unprocessed edge contours of the plate according to the contour feature information, the processing parameters and the data box plot.

[0109] The situations where the set of unprocessed contours of the edge of the plate is determined based on the contour feature information, processing parameters and data box plot include: determining the overlapping contour information of the plate based on the contour feature information and the data box plot of the parts in the plate; determining the set of unprocessed contours of the edge of the plate based on the overlapping contour information of the plate, the starting length of the plate and the overcut length.

[0110] The plate overlapping contour information may be the contour information of the graphic contour of the part in the plate overlapping with the plate edge during plate processing. The edge non-processing contour set may be the contour set of the graphic contour of the part in the plate overlapping with the plate edge during plate processing and not requiring processing.

[0111] Step 107, determining a periodic processing path of the plate according to the set of edge non-processing contours.

[0112] The case of determining the periodic processing path of the plate according to the set of edge non-processing contours includes: taking the edge non-processing contours as constraints and determining the periodic processing path of the plate according to the direction of the target periodic segmentation line.

[0113] When planning the processing of the plate, obtain the contour feature information, processing parameters, and data box-line diagram of the parts in the plate; determine the overlapping contour information of the plate based on the contour feature information and the data box-line diagram of the parts in the plate; determine the edge unprocessed contour set of the plate based on the overlapping contour information of the plate, the starting length of the plate, and the overcut length; use the edge unprocessed contour as a constraint condition and determine the periodic processing path of the plate based on the direction of the target period dividing line.

[0114] The plate processing method provided in this embodiment analyzes the graphic contours of parts in the plate and the contour information of the overlap of the plate edge during plate processing, and obtains a periodic processing path that takes into account the non-processing of the plate edge, thereby improving the problem of the graphic contours of parts in the plate falling off prematurely due to overlapping with the plate edge, and further improving the feasibility of the plate processing method.

[0115] For example, all parts in the plate are separated to obtain the data box graph Boxs of the parts in the plate and the graphic contours contours of the parts in the plate; the data structure set XBoxs is looped, the data box graph box is slightly expanded, and the boxes that do not intersect with the contour feature sheetPoly of the plate and the graphic contours contour of the parts in the plate are filtered out; the graphic contours contours of the parts in the plate are looped to calculate the overlapping part of the graphic contour contour of the parts in the plate and the contour feature sheetPoly of the plate, and the graphic contour contour of the parts in the plate is cropped or deleted, and the overlapping graphic contours contour of the parts in the plate and the graphic contours contour of the parts in the adjacent plates are segmented and extended according to the starting length and the excess length to obtain the edge unprocessed contour set of the plate.

[0116] It should be understood that, although the various steps in the above flowchart are displayed in sequence according to the prompts of the arrows, these steps are not necessarily executed in sequence in the order of the arrow prompts. Unless clearly stated in this article, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the above sub-steps may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps. It should be noted that the above different embodiments can be combined with each other.

[0117] Figure 6 , is a schematic block diagram of the structure of a plate processing device in one embodiment.

[0118] In this embodiment, if Figure 6 As shown, the plate processing device includes an acquisition module 20 , a cycle division determination module 40 and a processing path determination module 60 .

[0119] The acquisition module 20 is used to acquire the segmentation period constraint value of the plate and the layout information of the parts in the plate.

[0120] The period segmentation determination module 40 is connected to the acquisition module 20 and is used to determine the target period segmentation line of the plate according to the segmentation period constraint value and the part arrangement information in the plate.

[0121] The processing path determination module 60 is connected to the period division determination module 40 and is used to determine the periodic processing path of the plate according to the target period division line.

[0122] In this embodiment, each module is used to execute Figure 1 For details of the steps in the corresponding embodiments, please refer to Figure 1 as well as Figure 1 The relevant descriptions in the corresponding embodiments are not repeated here.

[0123] Specifically, the plate is analyzed through the plate analysis module to obtain the segmentation period constraint value of the plate, and the parts in the plate are analyzed through the plate analysis module to obtain the layout information of the parts in the plate; according to the graphic distribution shape and graphic distribution position of the parts in the plate, the data structure set corresponding to the parts in the plate is determined, and then the target period segmentation line of the plate is determined based on the obtained data structure set; the linear position relationship between the target period segmentation line and the graphics of the parts in the plate is obtained, and according to the linear position relationship, the periodic processing path of the plate is determined.

[0124] The plate processing device provided in this embodiment obtains a target period dividing line that is suitable for plates of different sizes and takes into account the efficiency of segmentation processing of parts in the plate according to the segmentation period constraint value of the plate (such as the minimum and maximum segmentation period values) and the layout information of parts in the plate (such as the graphic distribution shape and graphic distribution position of parts in the plate), and then plans a periodic processing path for the plate that is suitable for plates of different sizes and guides the plate processing process according to the obtained target period dividing line. Different target period dividing lines and periodic processing paths can be adapted according to different plate sizes and different layout information of parts in the plate, effectively improving the problem that the long strip of plate cannot be completely within the processing format area due to the fixed value of the machine tool processing format area, and effectively improving the processing accuracy of plates of different sizes.

[0125] Figure 7 , is a schematic block diagram of the specific structure of the period division determination module 40 in an embodiment.

[0126] In this embodiment, if Figure 7 As shown, the period segmentation determination module 40 includes a box plot determination unit 420 , a graph structure determination unit 440 and a data set determination unit 460 .

[0127] The box plot determination unit 420 is used to determine the data box plot of the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate.

[0128] The graphic structure determination unit 440 is connected to the box plot determination unit 420 and is used to determine the graphic structure of the parts in the plate according to the data box plot of the parts in the plate.

[0129] The data set determination unit 460 is connected to the graphic structure determination unit 440 and is used to determine the data structure set corresponding to the parts in the plate according to the graphic structure of the parts in the plate.

[0130] In this embodiment, each unit is used to execute Figure 2 For details of the steps in the corresponding embodiments, please refer to Figure 2 as well as Figure 2 The relevant descriptions in the corresponding embodiments are not repeated here.

[0131] Figure 8 , is a schematic block diagram of the specific structure of the period division determination module 40 in an embodiment.

[0132] In this embodiment, if Figure 8 As shown, the period segmentation determination module 40 includes a plate feature acquisition unit 430 , a connected straight line determination unit 450 and a period segmentation determination unit 470 .

[0133] The plate feature acquisition unit 430 is used to acquire plate feature coordinate values.

[0134] The connected straight line determination unit 450 is connected to the plate feature acquisition unit 430 and is used to determine the connected straight line information of the parts in the plate according to the data structure set.

[0135] The period segmentation determination unit 470 is connected to the connected line determination unit 450 and is used to determine the target period segmentation line according to the segmentation period minimum value, the segmentation period maximum value, the connected line information and the plate feature coordinate value.

[0136] In this embodiment, each unit is used to execute Figure 3 For details of the steps in the corresponding embodiments, please refer to Figure 3 as well as Figure 3 The relevant descriptions in the corresponding embodiments are not repeated here.

[0137] Fig. 9 , is a schematic block diagram of the specific structure of a processing path determination module 60 in an embodiment.

[0138] In this embodiment, if Fig. 9 As shown, the processing path determination module 60 includes an angle difference determination unit 620 , a first graphic determination unit 640 and a second graphic determination unit 660 .

[0139] The linear position acquisition unit 620 is used to acquire the linear position relationship between the current target periodic segmentation line and the part graphics in the plate.

[0140] The first processing path determination unit 640 is connected to the linear position acquisition unit 620, and is used to determine the periodic processing path of the plate according to the current target periodic dividing line and the adjacent target periodic dividing line when the linear position relationship is a linear intersection relationship.

[0141] The second processing path determining unit 660 is connected to the linear position acquiring unit 620, and is used to determine the periodic processing path of the plate according to the current target periodic dividing line when the linear position relationship is an inclusive relationship.

[0142] In this embodiment, each unit is used to execute Figure 4 For details of the steps in the corresponding embodiments, please refer to Figure 4 as well as Figure 4 The relevant descriptions in the corresponding embodiments are not repeated here.

[0143] Fig.10 , is a schematic block diagram of the structure of a plate processing device in one embodiment.

[0144] In this embodiment, if Fig.10 As shown, the plate processing device includes an acquisition module 20 , a processing path determination module 60 , and an edge set determination module 30 .

[0145] The acquisition module 20 is used to obtain the profile feature information of the plate, the processing parameters, and the data box line diagram of the parts in the plate.

[0146] The edge set determination module 30 is connected to the acquisition module 20 and is used to determine the edge unprocessed contour set of the plate according to the contour feature information, the processing parameters and the data box line diagram.

[0147] The processing path determination module 60 is connected to the edge set determination module 30 and is used to determine the periodic processing path of the plate according to the edge non-processing contour set.

[0148] In this embodiment, each module is used to execute Figure 5 For details of the steps in the corresponding embodiments, please refer to Figure 5 as well as Figure 5 The relevant descriptions in the corresponding embodiments are not repeated here.

[0149] The division of the various modules in the above-mentioned plate processing device is only for illustration. In other embodiments, the plate processing device can be divided into different modules as needed to complete all or part of the functions of the above-mentioned plate processing device.

[0150] The specific definition of the plate processing device can be found in the definition of the plate processing method above, which will not be repeated here. Each module in the above-mentioned plate processing device can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the processing equipment in the form of hardware, or can be stored in the memory of the processing equipment in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0151] Fig.11 , is a schematic diagram of the structure of a processing device in an embodiment.

[0152] In this embodiment, if Fig.11 As shown, the processing equipment includes a memory A1 and a processor A2; it may also include a display screen A3, a communications interface (Communications Interface) and a bus. Optionally, the processing equipment may be a plate processing equipment.

[0153] Among them, the memory A1, the processor A2, the display screen A3 and the communication interface can communicate with each other through a bus; the display screen A3 is set to display the user operation interface preset in the initial setting mode, and the display screen A3 can also display the process control window; the communication interface can transmit information; the memory A1 stores a computer program, and the processor A2 can call the logical instructions in the memory A1 to execute the method in the above embodiment.

[0154] In addition, the logic instructions in the above-mentioned memory A1 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent part.

[0155] The memory A1 is a computer-readable storage medium that can be configured to store software programs, computer executable programs, such as program instructions or modules corresponding to the methods in the embodiments of the present application. The processor A2 executes functional applications and data processing by running the software programs, instructions or modules stored in the memory A1, that is, implementing the methods in the above embodiments.

[0156] The memory A1 includes a program storage area and a data storage area, wherein the program storage area can store an operating system and an application required for at least one function; the data storage area can store data created according to the use of the terminal device, etc. In addition, the memory A1 can include a high-speed random access memory and a non-volatile memory.

[0157] Processor A2 can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0158] The present application also provides a computer-readable storage medium, one or more non-volatile computer-readable storage media containing computer-executable instructions, which, when executed by one or more processors, enable the processors to execute the method in the above embodiment.

[0159] The embodiment of the present application also provides a computer program product. When the computer program product is run on a terminal device, the terminal device executes the method in the above embodiment.

[0160] The plate processing method, device, processing equipment and readable storage medium provided in the above-mentioned embodiments obtain a target period dividing line that is suitable for plates of different formats and takes into account the efficiency of segmentation processing of parts in the plate according to the segmentation period constraint value of the plate (such as the minimum value and the maximum value of the segmentation period) and the layout information of parts in the plate (such as the graphic distribution shape and graphic distribution position of the parts in the plate), and then plan a periodic processing path for the plate that is suitable for plates of different formats and guides the plate processing process according to the obtained target period dividing line. Different target period dividing lines and periodic processing paths can be adapted to different plate formats and different layout information of parts in the plate, effectively improving the problem that the long strip plate cannot be completely within the processing format area due to the fixed value of the machine tool processing format area, effectively improving the processing accuracy of plates of different sizes, and having important economic value and promotion and practical value.

[0161] Any reference to memory, storage, database or other medium used in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM), which is used as an external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0162] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0163] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A plate processing method, characterized in that: include: Obtain the segmentation period constraint value of the plate and the layout information of the parts in the plate; Determining a target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of parts in the plate; According to the target periodic dividing line, a periodic processing path of the plate is determined.

2. The plate processing method according to claim 1, characterized in that: The obtaining of the segmentation period constraint value of the plate and the arrangement information of the parts in the plate specifically includes: obtaining the minimum segmentation period of the plate, the maximum segmentation period, the graphic distribution shape and the graphic distribution position of the parts in the plate; The step of determining the target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of the parts in the plate comprises: Determine a data structure set corresponding to the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate; The target period segmentation line is determined according to the segmentation period minimum value, the segmentation period maximum value and the data structure set.

3. The plate processing method according to claim 2, characterized in that: The step of determining a data structure set corresponding to the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate comprises: Determining a data box plot of the parts in the plate according to the graphic distribution shape and graphic distribution position of the parts in the plate; Determining a graphic structure of the parts in the plate according to a data box plot of the parts in the plate; Determine a data structure set corresponding to the parts in the plate according to the graphic structure of the parts in the plate; The step of determining the target period segmentation line according to the segmentation period minimum value, the segmentation period maximum value and the data structure set includes: Get the characteristic coordinate value of the plate; Determining the connected straight line information of the parts in the plate according to the data structure set; The target period segmentation line is determined according to the segmentation period minimum value, the segmentation period maximum value, the connected straight line information and the plate feature coordinate value.

4. The plate processing method according to claim 3, characterized in that: Determining the graphic structure of the parts in the plate according to the data box line diagram of the parts in the plate includes: Obtain characteristic coordinate values ​​of a data box plot of parts in the plate; The graphic structure of the parts in the plate is determined according to the characteristic coordinate values ​​of the data box plot.

5. The plate processing method according to claim 4, characterized in that: Determining the periodic processing path of the plate according to the target periodic segmentation line includes: Obtain the linear position relationship between the current target cycle segmentation line and the part graphics in the plate; When the linear position relationship is a linear intersection relationship, the periodic processing path of the plate is determined according to the current target periodic dividing line and the adjacent target periodic dividing line; When the linear position relationship is an inclusion relationship, the periodic processing path of the plate is determined according to the current target periodic segmentation line.

6. The plate processing method according to any one of claims 1 to 5, characterized in that: Also includes: Obtain the profile feature information of the plate, processing parameters, and data box line diagram of the parts in the plate; Determine a set of unprocessed edge contours of the plate according to the contour feature information, the processing parameters and the data box plot; A periodic processing path of the plate is determined according to the set of unprocessed edge contours.

7. The plate processing method according to claim 6, characterized in that: The obtaining of the processing parameters of the plate is specifically: obtaining the starting length and overcut length of the plate; Determining the unprocessed edge contour set of the plate according to the contour feature information, the processing parameters and the data box line diagram includes: Determining the overlapping contour information of the plate according to the contour feature information and the data box line diagram of the parts in the plate; The unprocessed edge contour set of the plate is determined according to the overlapping contour information of the plate, the starting length of the plate and the overcut length.

8. A plate processing device, characterized in that: include: An acquisition module is used to obtain the segmentation period constraint value of the plate and the layout information of the parts in the plate; A period segmentation determination module, connected to the acquisition module, for determining a target period segmentation line of the plate according to the segmentation period constraint value and the arrangement information of parts in the plate; The processing path determination module is connected to the period division determination module and is used to determine the periodic processing path of the plate according to the target period division line.

9. A processing equipment, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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