Semiconductor processing equipment and transmission cavity with focusing ring thickness detection device thereof

Abstract

According to the semiconductor processing equipment and the transmission cavity with the focusing ring thickness detection device, the focusing ring thickness detection device is arranged in the transmission cavity to monitor the thicknesses of focusing rings in a plurality of processing cavities at the same time, and the device cost is greatly reduced. The focusing ring thickness detection device comprises an alignment control assembly and a camera shooting assembly, and the alignment control assembly realizes lifting, rotation and pitching or translation of the camera shooting assembly, so that the camera shooting assembly is more accurately aligned with focusing rings in different processing cavities, the shooting dead angle is greatly reduced, the shooting angle range is expanded, and the detection precision is improved. The camera shooting assembly shoots near-end images and far-end images of the focusing ring from different shooting heights and different shooting angles, the multiple images shot at different heights and different angles are subjected to superposition processing, the surface loss condition of the focusing ring is comprehensively judged, the accuracy is improved, the thickness of different parts of the same focusing ring is compared, and the surface loss condition of the focusing ring is judged. The loss degree of the focusing ring can be judged more comprehensively and accurately, and the monitoring precision is further improved.

Description

Technical Field

[0001] The invention relates to a semiconductor processing device and a transmission cavity thereof with a focusing ring thickness detection device. Background Art

[0002] A set of semiconductor processing equipment is usually equipped with multiple processing chambers, and semiconductor processing processes are carried out simultaneously in multiple processing chambers to improve efficiency and output. When the etching process is carried out, the substrate to be etched is placed on the electrostatic chuck on the base in the processing chamber, and plasma is generated in the processing chamber to etch the substrate. A focusing ring is arranged around the electrostatic chuck to adjust the electric field and temperature distribution around the substrate. The focusing ring is exposed to the plasma environment for a long time, and the upper surface is easily corroded and consumed. When the consumption reaches a certain level, the thickness of the focusing ring will decrease and needs to be replaced in time. Usually, at least one set of detection devices is arranged in each processing chamber to monitor the thickness change of the focusing ring in real time. However, due to the space limitation inside the processing chamber, the detection range of the detection device is limited, and it can often only monitor the local focusing ring, and the monitoring accuracy is reduced. In addition, at least six sets of detection devices need to be arranged in a set of semiconductor processing equipment, which is costly. In addition, the detection device needs to be exposed to the plasma and various reaction byproducts in the plasma processing chamber, and an additional protective layer needs to be arranged on the exposed surface. All these lead to the cost of the focusing ring thickness detection device cannot be minimized.

[0003] The statements herein merely provide background art related to the present invention and do not necessarily constitute prior art. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor processing device and a transmission cavity thereof with a focusing ring thickness detection device, which reduces device cost, reduces monitoring blind spots, and improves monitoring accuracy.

[0005] In order to achieve the above object, the present invention provides a transmission chamber used in a semiconductor processing device, wherein the transmission chamber is connected to a front-end module through a vacuum lock, the transmission chamber is connected to a plurality of processing chambers, a focusing ring is provided in the processing chamber, and the transmission chamber comprises:

[0006] Cavity;

[0007] a robot arm disposed in the chamber and used for transferring substrates between the processing chamber and the vacuum lock;

[0008] A focusing ring thickness detection device is arranged at the top of the cavity; the focusing ring thickness detection device comprises: an alignment control component connected to the top of the cavity and a camera component connected to the alignment control component, the alignment control component realizes the adjustment of the position and orientation of the camera component, so that the camera component is aligned to the focusing rings in the multiple processing chambers in turn.

[0009] The alignment control assembly comprises: a support rod and a joint; one end of the support rod is fixedly connected to the top of the cavity, and the other end of the support rod is connected to the joint, and the joint is respectively connected to the support rod and the camera assembly.

[0010] Optionally, the alignment control assembly includes a first drive motor, which drives the support rod to rise and fall and rotate to achieve the rise and fall and rotation of the camera assembly; the joint achieves the pitch of the camera assembly.

[0011] Optionally, the alignment control assembly includes a second drive motor, and the second drive motor drives the support rod to rise and fall to achieve the rise and fall of the camera assembly; the joint adopts a universal joint to achieve the rotation and pitch of the camera assembly.

[0012] The alignment control component includes a sealing protection component, which includes: an elastic covering layer and a sealing component, wherein the elastic covering layer covers the support rod and the joint, and the sealing component is respectively connected to the elastic covering layer and the top of the cavity.

[0013] The elastic covering layer is made of polymer material.

[0014] The sealing assembly comprises: a sealing ring, a magnetic fluid sealing device and a bellows, wherein the sealing ring is sleeved on the support rod, the magnetic fluid sealing device is sleeved on the sealing ring, and the bellows is respectively connected to the magnetic fluid sealing device and the top of the cavity.

[0015] The alignment control component comprises: a magnetic suspension track, which is arranged on the top of the cavity. The camera component can move along the magnetic suspension track and photograph a plurality of focusing rings in the processing cavity.

[0016] The camera assembly is a monocular camera or a binocular camera.

[0017] The side wall of the cavity is provided with a plurality of first substrate transfer ports, the transfer cavity is connected to the processing cavity via the first substrate transfer ports, and at least one reference positioning mark is arranged around the first substrate transfer ports.

[0018] The focusing ring thickness detection device includes: a controller, wherein the controller circuit is connected to the alignment control component and the camera component, and the controller controls the alignment control component to realize the lifting, rotation and pitching of the camera component, and controls the camera component to capture the image of the focusing ring in the processing chamber to calculate the thickness of the focusing ring.

[0019] The present invention also provides a semiconductor processing device, comprising:

[0020] Front-end module;

[0021] The transmission cavity;

[0022] at least one vacuum lock, one end of which is connected to the front-end module and the other end of which is connected to the transmission chamber;

[0023] A plurality of processing chambers are respectively connected to the transmission chambers.

[0024] The processing chamber comprises:

[0025] A vacuum reaction chamber, wherein a second substrate transfer port is provided on a side wall of the vacuum reaction chamber, and the second substrate transfer port is connected to the first substrate transfer port on the transfer chamber;

[0026] A base, which is arranged inside the vacuum reaction chamber;

[0027] An electrostatic chuck, which is arranged on the base and is used to place the substrate;

[0028] a focusing ring surrounding the electrostatic chuck for adjusting the electric field and temperature distribution around the substrate;

[0029] a cover ring surrounding the focus ring and used to support the focus ring;

[0030] A lifting device is arranged below the focusing ring and is used for lifting the focusing ring.

[0031] The present invention sets a focusing ring thickness detection device in the transmission cavity, and the camera assembly in the focusing ring thickness detection device can be raised, lowered, rotated, pitched, or translated. Therefore, only one set of focusing ring thickness detection devices is set in the transmission cavity to simultaneously monitor the thickness of the focusing rings in multiple processing cavities connected to the transmission cavity, which greatly reduces the device cost. By rotating or translating the camera assembly, the camera assembly can be more accurately aligned with the focusing rings in different processing cavities, greatly reducing the shooting blind spot and expanding the shooting angle range. By raising and lowering and pitching the camera assembly, the focus ring can be photographed from different shooting heights and different shooting angles. By superimposing and comprehensively judging the surface loss of the focus ring through multiple pictures taken at different heights and angles, the accuracy is improved. By pitching the camera assembly, the near-end image and the far-end image of the focus ring can be selectively photographed. By comparing the thickness of different parts of the same focus ring, the loss degree of the focus ring can be more comprehensively and accurately judged, further improving the monitoring accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The figure is a top view of the structure of a semiconductor processing device provided by the present invention.

[0033] Figure 2 yes Figure 1 Side cross-sectional view of .

[0034] Figure 3 Schematic diagram of the structure of the focusing ring thickness detection device in an embodiment of the present invention.

[0035] Figure 4 It is a working schematic diagram of the focusing ring thickness detection device.

[0036] Figure 5 yes Figure 1 The view at X in the middle shows the structure of the reference positioning mark.

[0037] Figure 6 This is a bottom view of the interior of the transmission cavity.

[0038] Figure 7 It is a schematic structural diagram of a focusing ring thickness detection device in another embodiment of the present invention.

[0039] Figure 8 It is a schematic diagram of a camera assembly in another embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following is based on Figures 1 to 8 , specifically describe the preferred embodiments of the present invention.

[0041] like Figure 1 As shown, the present invention provides a semiconductor processing device, comprising a transmission chamber 1 and a plurality of processing chambers 2 connected to the transmission chamber 1, wherein the transmission chamber 1 is connected to a front-end module 4 through at least one vacuum lock 3. The front-end module 4 is an atmospheric environment, and is used to store substrates to be processed and processed substrates. The vacuum lock 3 is used to isolate the atmospheric environment of the front-end module 4 from the vacuum environment in the transmission chamber 1, and realize the transmission of substrates between the front-end module 4 and the transmission chamber 1. The substrate to be processed from the front-end module 4 enters the transmission chamber 1 through the vacuum lock 3, and is transmitted to each processing chamber 2 through the transmission chamber 1 for etching process. The substrate after etching is then transmitted to the transmission chamber 1, and is transmitted to the front-end module 4 through the vacuum lock 3.

[0042] like Figure 1 and Figure 2As shown, the processing chamber 2 includes a vacuum reaction chamber 201, and the vacuum reaction chamber 201 has a base 202 inside. An electrostatic chuck 203 is arranged on the base 202, and a substrate is placed on the electrostatic chuck 203. A focusing ring 204 is arranged around the electrostatic chuck 203 to adjust the electric field and temperature distribution around the substrate. A covering ring 205 is arranged around the focusing ring 204 to support the focusing ring 204. A lifting device 206 is provided under the focusing ring 204 to replace the focusing ring 204. When the focusing ring 204 needs to be replaced, the lifting device 206 rises to lift the focusing ring 204 vertically upward from the initial position to the required height, and the old focusing ring 204 is taken away. After the new focusing ring 204 is placed on the lifting device 206, the lifting device 206 descends to place the new focusing ring 204 at the initial position to continue the etching process of the substrate.

[0043] A robotic arm 102 is arranged in the cavity body 101 of the transfer cavity 1 for carrying substrates. A plurality of first substrate transfer ports 103 are arranged on the side wall of the cavity body 101. Correspondingly, a second substrate transfer port 207 is arranged on the side wall of the vacuum reaction cavity 201 of the processing cavity 2. The second substrate transfer port 207 on each processing cavity 2 corresponds to a first substrate transfer port 103 on the transfer cavity 1. The first substrate transfer port 103 and the second substrate transfer port 207 that match each other together constitute a transfer port 5. The robotic arm 102 transfers substrates between the processing cavity 2 and the transfer cavity through the transfer port 5.

[0044] The transmission chamber 1 is provided with a focus ring thickness detection device 104, which is arranged at the top of the chamber body 101 of the transmission chamber 1. The focus ring thickness detection device 104 comprises an alignment control component 105 connected to the top of the chamber body 101 and a camera component 106 connected to the alignment control component 105. The alignment control component 105 realizes the lifting, rotation and pitching of the camera component 106. The focus ring thickness detection device 104 also comprises a controller (not shown in the figure). The controller circuit is connected to the alignment control component 105 and the camera component 106. The controller controls the alignment control component 105 to realize the lifting, rotation and pitching of the camera component, and controls the camera component 106 to capture the image of the focus ring 204 in the processing chamber 2 to calculate the thickness of the focus ring 204.

[0045] like Figure 3As shown, in one embodiment of the present invention, the alignment control assembly includes a support rod 107 and a joint 108, one end of the support rod 107 is connected to a drive motor 109, the other end of the support rod 107 is connected to the joint 108, and the joint 108 is connected to the camera assembly 106. In this embodiment, the camera assembly 106 adopts a monocular camera, and the drive motor 109 adopts a first drive motor, which can output an axial drive force and a rotational drive force to the support rod 107, drive the support rod 107 to rise and fall and rotate, thereby driving the joint 108 and the monocular camera 106 to rise and fall and rotate, and accordingly, the joint 108 only needs to provide a drive force to achieve the pitch of the monocular camera 106, and the power line and control line of the joint 108 can be arranged inside the support rod 107, and led out to the outside of the transmission chamber 1 through the support rod 107 to ensure the sealing of the cavity 101 of the transmission chamber 1.

[0046] A through hole 110 is provided at the top of the cavity 101 of the transmission cavity 1. Since the driving motor 109 needs an external power supply and will generate electromagnetic interference, the driving motor 109 is generally arranged outside the transmission cavity 1, that is, arranged above the cavity 101 of the transmission cavity 1. The support rod 107 passes through the through hole 110, so that the joint 108 and the camera assembly 106 are located inside the cavity 101, so that the camera assembly 106 can monitor the thickness of the focus ring 204 in each of the processing chambers 2 connected to the processing chamber 1. The through hole 110 is preferably arranged at the center of the top of the cavity 101, so that the distance between the support rod 107 and each of the processing chambers 2 is equal, that is, the distance between the camera assembly 106 and each of the processing chambers 2 is equal, avoiding inaccurate observation due to unequal distances.

[0047] The support rod 107 is sealed and connected to the top of the cavity 101 through a sealing assembly 111. The sealing assembly 111 includes a sealing ring 112, a magnetic fluid sealing device 113 and a bellows 114. The sealing ring 112 is sleeved on the support rod 107. The magnetic fluid sealing device 113 is sleeved on the sealing ring 112 and fits tightly with the contact surface of the sealing ring 112. The bellows 114 is sleeved on the outer side of the support rod 107. One end of the bellows 114 is fixedly connected to the magnetic fluid sealing device 113, and the other end is fixedly connected to the top of the cavity 101. The sealing ring 112, the magnetic fluid sealing device 113 and the bellows 114 realize the sealing of the through hole 110, ensuring that the entire cavity 101 is in a complete sealed environment. During the lifting and rotation of the support rod 107, the sealing ring 112 always moves with the support rod 107, and fits tightly with the contact surface of the support rod 107 without displacement, ensuring the sealing reliability. The bellows 114 deforms as the support rod 107 is lifted and lowered to accommodate the lifting stroke of the support rod 107. The magnetic fluid sealing device 113 ensures that the support rod 107 is still well sealed when it rotates.

[0048] An elastic coating layer 115 is arranged outside the support rod 107 and the joint 108, one end of the elastic coating layer 115 is fixedly connected to the sealing ring 112, and the other end of the elastic coating layer 115 extends to and wraps the joint 108. The elastic coating layer 115 is made of polymer material, which will not generate particles and impurities during movement and friction. By using the elastic coating layer 115 to cover the support rod 107 and the joint 108, the particles generated by the support rod 107 and the joint 108 during the movement will be collected by the elastic coating layer 115 and will not fall into the cavity 101 of the transmission cavity 1, thereby ensuring the cleanliness of the transmission cavity 1.

[0049] like Figure 4As shown, a set of focus ring thickness detection devices 104 disposed in the cavity body 101 of the transmission cavity 1 can monitor the thickness of the focus rings 204 in the multiple processing cavities 2 connected to the transmission cavity 1, which greatly reduces the cost. When monitoring the focus ring 204, the focus ring 204 can be placed on the base 202 without moving, and the lifting device 206 can be raised to lift the focus ring 204 vertically upward, so that the side wall of the focus ring 204 will not be blocked by the outer covering ring 205, so that the focus ring 204 is completely exposed in front of the lens of the camera assembly 106, so that the camera assembly 106 can easily capture the entire thickness of the focus ring 204, so as to improve the accuracy of monitoring. The alignment control component 105 drives the camera component 106 to rotate, so that the camera component 106 can face the focus rings 204 inside different processing chambers 2 respectively. The camera component 106 shoots the focus ring 204 inside the vacuum reaction chamber 201 of the processing chamber 2 through the film transmission port 5 between the transmission chamber 1 and the processing chamber 2. The alignment control component 105 drives the camera component 106 to descend from the bottom of the chamber 101 to the lowest position that can be reached. During the descent, the camera component 106 can capture images of the focus ring 204 from different heights. The alignment control component 105 can also adjust the pitch angle of the camera component 106. The camera assembly 106 can capture images of the focus ring 204 from different pitch angles. The accuracy is improved by superimposing multiple pictures taken at different heights and angles and comprehensively judging the surface loss of the focus ring. By adjusting the pitch angle of the camera assembly 106, the near-end image and the far-end image of the focus ring 204 can be selectively captured. By comparing the thickness of different parts of the same focus ring 204, the degree of loss of the focus ring can be judged more comprehensively and accurately. After the camera assembly 106 finishes shooting, the alignment control assembly 105 drives the camera assembly 106 to rise to the highest position to avoid interfering with the operation of the robotic arm 102.

[0050] like Figure 5As shown, in the second embodiment of the present invention, at least one reference positioning mark 116 is set around the first substrate transmission port 103 on the side wall of the cavity body 101 of the transmission cavity 1, which is used to correct the shooting height and shooting angle of the camera assembly 106, to ensure that the two pictures taken before and after the loss of the focus ring have the same shooting height and shooting angle, and to prevent the misjudgment of the loss of the focus ring caused by shooting errors. The reference positioning mark 116 can be set to any graphic, for example, it can be set to a cross "+". When a new focus ring 204 is replaced in the processing chamber 2, the camera assembly 106 takes a reference picture of the focus ring 204 at the set shooting height and shooting angle. After a long period of plasma etching, the camera assembly 106 is adjusted to the same shooting height and shooting angle as the reference picture again, and the picture of the focus ring 204 is taken again. The loss of the focus ring 204 is calculated based on the two pictures taken. In order to ensure that the two shots have the same shooting height and shooting angle, firstly, the camera component 106 is used to shoot at a wide-angle end and focus on the reference positioning mark 116 on the side wall of the cavity 101, and the reference positioning mark 116 is used to correct the height and angle of the camera component 106. The reference positioning mark 116 in the two shots should be located at the same position in the picture to ensure that the camera component 106 has a stable and consistent shooting height and shooting angle during the two shots. After correcting the shooting height and shooting angle, adjust the focal length of the camera component 106, focus on the focus ring 204 in the processing chamber 2, and take a picture of the focus ring 204.

[0051] In a third embodiment of the present invention, Figure 3 As shown, the drive motor 109 uses a second drive motor, and the second drive motor only outputs an axial drive force to the support rod 107, driving the support rod 107 to rise and fall, and then driving the joint 108 and the camera assembly 106 to rise and fall. The second drive motor only provides an axial drive force, which reduces the control difficulty of the motor and reduces the cost. Correspondingly, the joint 108 needs to use a universal joint to realize the rotation and pitch of the camera assembly 106, ensuring that the alignment control assembly 105 can still realize the lifting, rotation and pitch of the camera assembly 106.

[0052] like Figure 6 and Figure 7As shown, in the fourth embodiment of the present invention, a magnetic suspension track 117 is arranged on the top of the cavity 101 of the transmission cavity 1. At this time, no through hole is arranged on the top of the cavity 101, and the entire cavity 101 is sealed. The length and shape of the magnetic suspension track 117 are adjusted according to the number and position of the processing chambers 2 connected to the transmission cavity 1. For example, if the three sides of the transmission cavity 1 are connected to the processing chambers 2, the magnetic suspension track 117 can be set to be U-shaped, so that the magnetic suspension track 117 covers the range of all processing chambers 2. The support rod 107 is suspended on the magnetic suspension track 117, and the support rod 107 can move along the magnetic suspension track 117. When monitoring the focus ring 204 in different processing chambers 2, the support rod 107 can be moved along the magnetic suspension track 117 to the film transmission port 5 where the corresponding processing chamber 2 is connected to the transmission cavity 1, so that the camera assembly 106 is closer to the film transmission port 5, which greatly reduces the shooting blind spot and expands the shooting angle range. The support rod 107 is suspended on the magnetic suspension track 117 by magnetic force. There is no substantial contact between the support rod 107 and the magnetic suspension track 117. There is also a distance between the support rod 107 and the top of the cavity 101. Therefore, during the movement of the support rod 107, no friction particles will be generated, and the internal environment of the transmission cavity 1 will not be polluted. In this embodiment, since the support rod 107 is arranged inside the cavity 101, no driving motor is provided, so the support rod 107 cannot be raised or lowered, and there is no need to provide a bellows. The joint 108 can still have a mechanism for rotating and pitching the camera assembly, and it is still necessary to provide an elastic coating layer 115 and a sealing ring 112 to ensure the cleanliness of the transmission cavity 1. When the camera assembly does not need to be filmed, it can stay at a position that does not block the operation route of the robot arm, such as a corner between different processing chamber openings. Only when filming is required, the camera assembly is moved to a position facing the processing chamber opening, so that it will not conflict with the position of the robot arm. Alternatively, a driving motor may be provided on the support rod 107 so that the camera assembly stays above the operating height of the robot arm when the processing chamber is carrying out normal processes. When the thickness of the focus ring needs to be detected, the support rod 107 is extended downward, and the camera assembly at the lower end of the support rod descends to photograph the side of the focus ring in a more horizontal position.

[0053] like Figure 8 As shown, in the fifth embodiment of the present invention, the camera assembly 106 adopts a binocular camera, and the two cameras together form a shooting unit. The two cameras can be raised, lowered, rotated and pitched together, and the graphic information formed by the shooting can have a more 3D stereoscopic effect, so that it is easier to distinguish the shape outline of the focusing ring.

[0054] The present invention sets a focusing ring thickness detection device in the transmission cavity, and the camera assembly in the focusing ring thickness detection device can be raised, lowered, rotated, pitched, or translated. Therefore, only one set of focusing ring thickness detection devices is set in the transmission cavity to simultaneously monitor the thickness of the focusing rings in multiple processing cavities connected to the transmission cavity, which greatly reduces the device cost. By rotating or translating the camera assembly, the camera assembly can be more accurately aligned with the focusing rings in different processing cavities, greatly reducing the shooting blind spot and expanding the shooting angle range. By raising and lowering and pitching the camera assembly, the focus ring can be photographed from different shooting heights and different shooting angles. By superimposing and comprehensively judging the surface loss of the focus ring through multiple pictures taken at different heights and angles, the accuracy is improved. By pitching the camera assembly, the near-end image and the far-end image of the focus ring can be selectively photographed. By comparing the thickness of different parts of the same focus ring, the loss degree of the focus ring can be more comprehensively and accurately judged, further improving the monitoring accuracy.

[0055] It should be noted that, in the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A transmission chamber used in a semiconductor processing device, wherein the transmission chamber is connected to a front-end module via a vacuum lock, the transmission chamber is connected to a plurality of processing chambers, and a focusing ring is provided in the processing chamber, wherein: The transmission cavity comprises: Cavity; a robot arm disposed in the chamber and used for transferring substrates between the processing chamber and the vacuum lock; A focusing ring thickness detection device is arranged at the top of the cavity; the focusing ring thickness detection device comprises: an alignment control component connected to the top of the cavity and a camera component connected to the alignment control component, the alignment control component realizes the adjustment of the position and orientation of the camera component, so that the camera component is aligned to the focusing rings in the multiple processing chambers in turn.

2. The transmission cavity according to claim 1, characterized in that: The alignment control assembly comprises: a support rod and a joint; one end of the support rod is fixedly connected to the top of the cavity, and the other end of the support rod is connected to the joint, and the joint is respectively connected to the support rod and the camera assembly.

3. The transmission chamber according to claim 2, characterized in that: The alignment control assembly comprises a first driving motor, which drives the support rod to rise and fall and rotate to achieve the rise and fall and rotation of the camera assembly; the joint achieves the pitch of the camera assembly.

4. The transmission chamber according to claim 2, characterized in that: The alignment control component includes a second drive motor, and the second drive motor drives the support rod to rise and fall, so as to realize the rise and fall of the camera component; the joint adopts a universal joint, so as to realize the rotation and pitch of the camera component.

5. The transmission chamber according to claim 3 or 4, characterized in that: The alignment control component includes a sealing protection component, which includes: an elastic covering layer and a sealing component, wherein the elastic covering layer covers the support rod and the joint, and the sealing component is respectively connected to the elastic covering layer and the top of the cavity.

6. The transmission chamber according to claim 5, characterized in that: The elastic covering layer is made of polymer material.

7. The transmission chamber according to claim 5, characterized in that: The sealing assembly comprises: a sealing ring, a magnetic fluid sealing device and a bellows, wherein the sealing ring is sleeved on the support rod, the magnetic fluid sealing device is sleeved on the sealing ring, and the bellows is respectively connected to the magnetic fluid sealing device and the top of the cavity.

8. The transmission chamber according to claim 1, characterized in that: The alignment control component comprises: a magnetic suspension track, which is arranged on the top of the cavity. The camera component can move along the magnetic suspension track and photograph a plurality of focusing rings in the processing cavity.

9. The transmission chamber according to claim 1, characterized in that: The camera assembly is a monocular camera or a binocular camera.

10. The transmission chamber according to claim 1, characterized in that: The side wall of the cavity is provided with a plurality of first substrate transfer ports, the transfer cavity is connected to the processing cavity via the first substrate transfer ports, and at least one reference positioning mark is arranged around the first substrate transfer ports.

11. The transmission chamber according to any one of claims 1 to 10, characterized in that: The focusing ring thickness detection device includes: a controller, wherein the controller circuit is connected to the alignment control component and the camera component, and the controller controls the alignment control component to realize the lifting, rotation and pitching of the camera component, and controls the camera component to capture the image of the focusing ring in the processing chamber to calculate the thickness of the focusing ring.

12. A semiconductor processing device, characterized in that: Include: Front-end module; The transmission chamber according to any one of claims 1 to 11; at least one vacuum lock, one end of which is connected to the front-end module and the other end of which is connected to the transmission chamber; A plurality of processing chambers are respectively connected to the transmission chambers.

13. The semiconductor processing equipment according to claim 12, wherein: The processing chamber comprises: A vacuum reaction chamber, wherein a second substrate transfer port is provided on a side wall of the vacuum reaction chamber, and the second substrate transfer port is connected to the first substrate transfer port on the transfer chamber; A base, which is arranged inside the vacuum reaction chamber; An electrostatic chuck, which is arranged on the base and is used to place the substrate; a focusing ring surrounding the electrostatic chuck for adjusting the electric field and temperature distribution around the substrate; a cover ring surrounding the focus ring and used to support the focus ring; A lifting device is arranged below the focusing ring and is used for lifting the focusing ring.

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