Carrying platform

Abstract

According to the carrier provided by the invention, the parts are simple in structure, a universal mechanical manufacturing process is adopted, and the cost of the carrier can be greatly reduced; the carrying platform is light in weight, so that the driving load and energy consumption can be effectively reduced; a traditional clamping jaw fixing mode is replaced, the application range of the carrying table to the cleaning liquid is expanded, and the maintenance frequency of a client side is reduced; the method can be suitable for wafer products with large warping degree, and the phenomena of vacuum leakage and fragments are effectively avoided.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor manufacturing equipment and relates to a carrier. Background Art

[0002] Semiconductor chip packaging is a process that uses film technology and precision processing technology to layout, fix, connect, and lead out terminals on a frame or substrate, and then fill and fix them with a plastic insulating medium to form an overall three-dimensional structure.

[0003] The front-end process of packaging mainly includes steps such as wafer back grinding, wafer pasting, wafer cutting, optical inspection, die pasting, baking and wire bonding. Among them, the tape frame is a common wafer carrier used between the wafer pasting and die pasting processes, and has been widely used in the dicing, thinning, cleaning and other processes in advanced packaging technologies such as 2.5D and 3D.

[0004] At present, in the process of wafer products with film frames, the most common carriers are mostly structures that use both ceramic microporous suction cups and metal claws. Among them, the ceramic microporous suction cup is a vacuum suction cup made of ceramic materials through sintering and other processing processes. It has the advantages of corrosion resistance, high temperature resistance, and high rigidity. The metal claws on the carrier can fix the border of the film frame to ensure that the film frame rotates at the same speed as the carrier. However, this type of traditional structural form of the carrier has the following disadvantages:

[0005] 1) The material cost and process cost of the ceramic microporous suction cup are relatively high, which compresses the profit margin of the machine;

[0006] 2) The carrier is made of a combination of ceramic and metal materials, which is relatively heavy. It not only increases the load on the motor, but also easily reduces the overall dynamic balance performance of the carrier. The carrier cannot meet the process requirements of high speed;

[0007] 3) In some cleaning chambers with special process requirements, the residual cleaning liquid has high viscosity after air drying, and the mucus remains on the metal claws, causing the metal claws to move slowly and require regular maintenance or replacement;

[0008] 4) Some wafers that have undergone the thinning process have a large warping problem, which makes it difficult to use traditional forms of carriers, which can easily cause vacuum leakage and the risk of wafer products with film frames being broken into pieces during rotation.

[0009] Therefore, it is necessary to provide a carrier. Summary of the invention

[0010] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a carrier for solving the above-mentioned series of application problems faced by the carrier in the prior art.

[0011] In order to achieve the above-mentioned object and other related objects, the present invention provides a carrier for carrying a wafer product with a film frame, the carrier comprising:

[0012] A bearing structure, wherein a bearing structure air passage is provided in the bearing structure, and the wafer located above the bearing structure is adsorbed through the bearing structure air passage;

[0013] A suction cup is fixed on the bearing structure and is located outside the air channel of the bearing structure. A suction cup air channel is provided in the suction cup, and the frame located above the suction cup is adsorbed through the suction cup air channel.

[0014] Optionally, the suction nozzle of the suction cup is a tapered trumpet-shaped flexible suction nozzle.

[0015] Optionally, the connection mode between the suction cup and the bearing structure includes a concave-convex connection or a threaded connection.

[0016] Optionally, a first sealing ring is provided on the supporting structure, the first sealing ring surrounds the outer side of the air channel of the supporting structure, and the first sealing ring includes a deformation end higher than the surface of the supporting structure, and the deformation end is used to contact the adhesive film located between the wafer and the frame.

[0017] Optionally, the suction cup air passage is connected to the bearing structure air passage.

[0018] Optionally, the air channel of the bearing structure includes a pinhole-shaped air channel located in the central area of ​​the bearing structure and a groove-shaped air channel located outside the pinhole-shaped air channel.

[0019] Optionally, the material of the supporting structure includes organic polymer material.

[0020] Optionally, the supporting structure includes a supporting tray and a carrying plate, the supporting structure air channel includes a carrying plate air channel arranged in the carrying plate, the wafer is adsorbed through the carrying plate air channel, and the carrying plate is fixed on the supporting tray, the suction cup is fixed on the supporting tray, and the suction cup is located outside the carrying plate.

[0021] Optionally, matching alignment members are provided on the carrier plate and the support tray, and the alignment method of the alignment members includes concave-convex alignment.

[0022] Optionally, a support tray air channel is provided in the support tray, the support tray air channel is communicated with the carrying plate air channel, and the support tray air channel is communicated with the suction cup air channel.

[0023] Optionally, an airway cavity is provided between the carrying plate and the supporting tray, and the carrying plate airway and the supporting tray airway are both connected to the airway cavity.

[0024] Optionally, a second sealing ring is provided between the carrying plate and the supporting tray.

[0025] Optionally, a fixed connection point between the carrying plate and the supporting tray is located outside the air passage of the carrying plate.

[0026] As described above, the carrier of the present invention can effectively absorb and fix the frame by adsorbing the frame above it through the suction cup, thereby reducing the probability of contamination and reducing maintenance or replacement costs; the bearing structure includes the bearing plate and the support tray, and both are made of lightweight materials, which can meet the flatness requirements while reducing the weight, and is easy to process, manufacture, maintain and flexibly apply; through the setting of sealing rings, airway cavities and airways, the airtightness requirements are met while providing adsorption force; through the setting of the airways on the bearing plate and the connection points of each component, the stress concentration problem of the wafer can be effectively solved.

[0027] The carrier parts of the present invention have a simple structure and adopt a universal mechanical manufacturing process, which can greatly reduce the cost of the carrier; the carrier is lightweight, effectively reducing the load and energy consumption of the drive; it replaces the traditional fixing form of the claws, expands the application range of the carrier for the cleaning liquid, and reduces the frequency of client maintenance; it can be applied to wafer products with small thickness and large warping, and effectively avoids vacuum leakage and debris. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Shown is a schematic diagram of the structure of the carrier in an embodiment of the present invention.

[0029] Figure 2 Shown is a schematic structural diagram of a wafer with a film frame in an embodiment of the present invention.

[0030] Figure 3 Shown is a schematic diagram of the top view of the supporting plate in an embodiment of the present invention.

[0031] Figure 4 It is a state diagram of the first groove and the first sealing ring in an embodiment of the present invention.

[0032] Figure 5a Display as Figure 4 The state diagram when the first sealing ring is in contact with the film.

[0033] Figure 5b Display as Figure 4 A diagram showing the state of the first sealing ring and the rubber film when they are in contact after the vacuum system is turned on.

[0034] Component number description

[0035] 100 Drive parts

[0036] 110 Drive air passage

[0037] 200 Support tray

[0038] 211, 212 support tray airway

[0039] 300 Carrier Plate

[0040] 310 Carrier plate airway

[0041] 311 Pinhole Airway

[0042] 312 Grooved airway

[0043] 313 Airway cavity

[0044] 321 First Groove

[0045] 322 Second groove

[0046] 400 Suction Cup

[0047] 411 Suction Cup Airway

[0048] 500 Wafer products with film frame

[0049] 501 Wafer

[0050] 502 Film

[0051] 503 Border

[0052] 610 First sealing ring

[0053] 611 Deformation end

[0054] 620 Second sealing ring

[0055] 710, 720 screws

[0056] 800 Alignment parts DETAILED DESCRIPTION

[0057] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0058] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic view is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0059] For ease of description, spatial relational terms such as “under”, “below”, “below”, “below”, “over”, etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatial relational terms are intended to include other orientations of the device in use or operation in addition to the orientation depicted in the drawings, and may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, so that the first and second features may not be in direct contact. In addition, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or one or more intervening layers may also be present.

[0060] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0061] This embodiment provides a carrier, such as Figure 1 and Figure 2 The carrier is used to carry a wafer product 500 with a film frame. The carrier includes: a carrying structure and a suction cup 400, wherein a carrying structure air channel is provided in the carrying structure, and a wafer 501 located above the carrying structure is adsorbed through the carrying structure air channel. The suction cup 400 is fixed on the carrying structure, and the suction cup 400 is located outside the carrying structure air channel. A suction cup air channel 411 is provided in the suction cup 400, and a frame 503 located above the suction cup 400 is adsorbed through the suction cup air channel 411.

[0062] For details, see Figure 2The figure shows a structural schematic diagram of a wafer product 500 with a film frame, wherein the wafer product 500 with a film frame includes a wafer 501, a film 502 and a frame 503, the film 502 is bonded to the frame 503, the wafer 501 is adhered to the film 502 on the inner side of the frame 503, and the film 502 is supported by the frame 503, so that after the wafer 501 is bonded to the film 502, it is convenient for the wafer 501 to be transferred, processed and other operations in the process, such as wafer cleaning process, wafer cutting process, wafer bonding process and the like. The type, thickness and size of the wafer 501 can be selected according to needs. For example, the size of the wafer 501 can range from 4 inches to 12 inches, such as 4 inches, 6 inches, 8 inches, 12 inches, etc. The film 502 can include a blue film or a white film commonly used in semiconductor processes, and the frame 503 can be a metal frame, etc. Therefore, there is no excessive restriction on the specific material and structure of the wafer product 500 with a film frame.

[0063] The carrier in this embodiment can be used in a wafer cleaning machine, but is not limited thereto. The carrier is particularly suitable for wafer products 500 with a thin film frame and a warpage, which can meet the customer's requirements for high-speed, crack-free and other difficult technologies. Since the suction nozzle 400 is located below the frame 503 and absorbs the frame 503 through the suction cup airway 411, the traditional clamping form is replaced, and the application range of the carrier for cleaning liquid is expanded, such as reducing the contact with acidic, alkaline, viscous and other cleaning liquids, thereby reducing the frequency of client maintenance.

[0064] In this embodiment, Figure 1 As shown, the platform is preferably an axisymmetric structure to improve the stability of the platform, but it is not limited to this and can be set according to specific needs.

[0065] As an example, the stage may be a rotating stage, such as Figure 1 The carrier provided in this embodiment is preferably a rotating carrier, that is, the carrier also includes a driving member 100, so as to drive the supporting structure and the suction cup 400 connected thereto through the driving member 100 to expand the scope of application. Of course, in another embodiment, the driving member 100 may not be provided, and no excessive restriction is made here.

[0066] Furthermore, a driving member airway 110 is also provided in the driving member 100 in this embodiment to facilitate the communication of subsequent airways, but the present invention is not limited thereto.

[0067] As an example, the bearing structure may be an independent structure, such as an integrally formed structure. Of course, the bearing structure may also be a discrete structure as required to facilitate processing, manufacturing, maintenance and flexible application.

[0068] Specifically, Figure 1In this embodiment, the bearing structure includes a separate supporting tray 200 and a carrying plate 300, wherein the supporting tray 200 is fixed on the driving member 100, and the carrying plate 300 is fixed on the supporting tray 200. The bearing structure airway includes a carrying plate airway 310 arranged in the carrying plate 300, and the wafer 501 is adsorbed through the carrying plate airway 310. The suction cup 400 is fixed on the supporting tray 200, and the suction cup 400 is located outside the carrying plate 300. The support tray 200 is provided with support tray air channels 211, 212, and the support tray air channels 211, 212 are interconnected with the drive member air channel 110; the carrier plate air channel 310 runs through the carrier plate 300, and the carrier plate air channel 310 is interconnected with the support tray air channels 211, 212, and the carrier plate air channel 310 is located below the wafer 501 in the film frame 500 for adsorbing the wafer 501; the suction cup 400 is provided with a suction cup air channel 411 running through the suction cup 400, and the suction cup air channel 411 is interconnected with the support tray air channels 211, 212, and the suction cup 400 is located below the frame 503 in the film frame 500 for adsorbing the frame 503.

[0069] The driving member 100 is used to provide a driving force to drive the support tray 200 fixedly connected thereto, thereby driving the carrier plate 300 fixedly connected thereto to rotate through the support tray 200. The driving member airway 110 provided in the driving member 100 is interconnected with the support tray airways 211 and 212, and the support tray airways 211 and 212 are interconnected with the carrier plate airway 310, and the support tray airways 211 and 212 are interconnected with the suction cup airway 411 in the suction cup 400, so that after an exhaust device such as a vacuum pump is connected to the driving member airway 110, a connected negative pressure channel can be provided to adsorb and fix the wafer 501 to the carrier plate below it. The frame 503 is fixed on the plate 300, and the frame 503 is simultaneously adsorbed and fixed by the suction cup 400 located below it, so that while stably adsorbing the wafer product 500 with the film frame, the suction cup 400 located below the frame 503 can also reduce the probability of contamination of the suction cup 400, reduce maintenance or replacement costs, and enable the wafer 501 and the frame 503 in the wafer product 500 with the film frame to rotate at the same speed as the carrier, so as to prevent the frame 503 and the wafer 501 from having a rotation speed difference, which causes fragments.

[0070] In this embodiment, the air passages in the various components are preferably interconnected so that the wafer 501 and the frame 503 can be adsorbed simultaneously by setting up a vacuum device. Of course, as needed, the air passages may not be interconnected, and multiple vacuum devices may be set up to achieve separate vacuum operations to meet the needs. No excessive restrictions are made here.

[0071] As an example, the suction nozzle of the suction cup 400 is preferably a tapered trumpet-shaped flexible suction nozzle.

[0072] Specifically, in order to improve the adsorption capacity of the suction cup 400, the suction nozzle of the suction cup 400 is preferably made of a flexible material and is trumpet-shaped, but the shape and material of the suction nozzle are not limited thereto. Figure 3 In this embodiment, four suction cups 400 are arranged on the carrier at equal intervals and in a ring shape, but the number and distribution of the suction cups 400 are not limited thereto.

[0073] As an example, the connection method between the suction cup 400 and the support tray 200 may include a concave-convex connection or a threaded connection.

[0074] Specifically, in order to improve air tightness and installation convenience, the suction cup 400 is preferably an integrated suction cup made of a flexible material and has a special-shaped structure, that is, a special morphological structure with protrusions or depressions, so that no additional fasteners and seals are required during installation. The suction cup 400 only needs to be directly clamped on the mounting piece of the support tray 200 with a corresponding special-shaped structure, such as Figure 1 The small boss located at the edge of the support tray 200 is matched with the corresponding recessed groove located inside the suction cup 400 to achieve convenient installation and removal, and the vacuum airtightness can also be fully guaranteed. However, the material and structure of the suction cup 400 are not limited to this. For example, the suction cup 400 can also be a split suction cup with a flexible suction nozzle on the upper part and a threaded, rigid material on the lower part, so as to achieve an airtight fixed connection with the support tray 200 by means of a threaded connection. No excessive restrictions are made here. When the bearing structure is an independent structure, the suction cup 400 can be directly installed on the bearing structure, and the connection method with the bearing structure can include a concave-convex connection or a threaded connection, which will not be elaborated here.

[0075] As an example, Figure 1 and Figure 3 In this embodiment, the carrier plate air channel 310 includes a pinhole-shaped air channel 311 located in the central area of ​​the carrier plate 300 and a groove-shaped air channel 312 located outside the hole-shaped air channel 311 .

[0076] Specifically, in this embodiment, the aperture width of the pinhole-shaped air channel 311 is preferably smaller than the groove width of the groove-shaped air channel 312, and the distribution density of the pinhole-shaped air channel 311 is greater than the distribution density of the groove-shaped air channel 312, and the pinhole-shaped air channel 311 is directly opposite to the driving member air channel 110, so that the support plate air channel 310 with this structure can effectively solve the stress concentration problem of the wafer 501 and reduce the risk of fragmentation. Figure 3In this embodiment, the groove-shaped air channel 312 adopts an annular groove, and each annular groove constitutes concentric rings with equal spacing, and the pinhole-shaped air channel 311 is located at the center of the concentric rings, but the morphology of the pinhole-shaped air channel 311 and the groove-shaped air channel 312 is not limited to this. The specific size, distribution density, etc. of the pinhole-shaped air channel 311 and the groove-shaped air channel 312 are not overly limited here. They can be evenly arranged at equal spacing, but can also be randomly arranged as needed, and are not overly limited here. When the bearing structure is an independent structure, the pinhole-shaped air channel 311 and the groove-shaped air channel 312 located at the periphery of the hole-shaped air channel 311 can be directly set on the bearing structure, which will not be elaborated here. As an example, the material of the bearing plate 300 may include an organic polymer material; the material of the supporting tray 200 may include an organic polymer material.

[0077] Specifically, in order to reduce the weight of the carrier and reduce the driving load, it is preferred that the carrier plate 300 is made of organic polymer material and the support tray 200 is also made of organic polymer material, wherein the organic polymer material may include resin, polymer engineering plastic, etc. In particular, when the carrier plate 300 is made of hard polymer engineering plastic, the overall flatness of the surface of the carrier plate 300 can also be ensured, so that the wafer 501 and the carrier plate 300 are fully fitted, but the choice of the material of the carrier plate 300 and the support tray 200 is not limited to this. When the bearing structure is an independent structure, the bearing structure may include organic polymer material, which will not be described in detail here.

[0078] As an example, the carrier plate 300 is provided with a first sealing ring 610, which surrounds the outer side of the carrier plate air channel 310, and the first sealing ring 610 includes a deformation end 611 higher than the surface of the carrier plate 300, and the deformation end 611 is used to contact the adhesive film 502 located between the wafer 501 and the frame 503.

[0079] As an example, a second sealing ring 620 is disposed between the carrier plate 300 and the supporting tray 200 .

[0080] Specifically, Figure 1 In order to improve air tightness, the present embodiment provides a groove on the carrier plate 300 located at the periphery of the carrier plate air passage 310, and a sealing ring is provided in the groove, wherein the groove includes a first groove 321 which is in contact with the adhesive film 502 in the wafer product 500 with an adhesive film frame and a second groove 322 which is in contact with the support tray 200, which is away from the support tray 200. The first sealing ring 610 provided in the first groove 321 is preferably a lip-shaped sealing ring, and the second sealing ring 620 provided in the second groove 322 is an O-shaped sealing ring. The lip-shaped sealing ring can effectively hold the adhesive film 502 to prevent vacuum leakage, and can be effectively applied even when adsorbing a wafer 501 with a large warpage, such as Figure 4The diagram shows the state after the lip seal ring is installed in the first groove 321, wherein the lip edge of the lip seal ring, i.e. the deformed end 611, exceeds the upper surface of the carrier plate 300 by a height Y so as to effectively support the film 502. The value of Y is not overly limited here. Figure 5a and Figure 5b The diagram shows two states when the lip seal ring contacts the film 502, wherein: Figure 5a The schematic diagram shows a state where a wafer product 500 with a film frame is placed on a carrier plate 300, wherein the film 502 is in contact with the lip seal ring. Figure 5b The schematic diagram is a state diagram of the wafer product 500 with the film frame when the vacuum system is turned on and negative pressure adsorption is performed. Figure 5a and Figure 5b It can be seen that the deformed end 611 of the first sealing ring 610 that is higher than the surface of the carrier plate 300 can form a good seal between the wafer product 500 with the film frame and the carrier plate 300. The setting of the first sealing ring 610 is particularly suitable for wafer products with a large warpage. The type of the sealing ring located in the first groove 321 is not limited to this, and can also be an O-ring, etc., which is not limited here.

[0081] In this embodiment, the second groove 322 is arranged in the carrier plate 300, but is not limited to this. The second groove 322 can also be arranged in the support tray 200, and the type of the sealing ring located in the second groove 322 is not limited to the O-ring. It can be selected and set according to needs to ensure the sealing between the carrier plate 300 and the support tray 200 by setting the second groove 322 and the second sealing ring 620. It can be understood that when the bearing structure is an independent structure, it is only necessary to set the first groove 321 and the first sealing ring 610 on the surface of the bearing structure, which will not be elaborated here.

[0082] As an example, an airway cavity 313 is disposed between the carrier plate 300 and the support tray 200 , and the support tray airways 211 , 212 and the carrier plate airway 310 are all connected to the airway cavity 313 .

[0083] Specifically, Figure 1 In this embodiment, the carrier plate 300 is provided with an air passage cavity 313 on the side adjacent to the support tray 200, and the air passage cavity 313 is connected to the support tray air passages 211, 212 and the carrier plate air passage 310, so that the air passage cavity 313 is provided to facilitate the provision of the air passages in the entire carrier, improve the uniformity of gas distribution, and reduce stress damage to the wafer. The air passage cavity 313 can also be provided on the side of the support tray 200 adjacent to the carrier plate 300, and the size, shape and position of the air passage cavity 313 are not excessively restricted here.

[0084] As an example, the fixed connection point between the carrier plate 300 and the support tray 200 is located outside the carrier plate air passage 310 .

[0085] Specifically, Figure 1 In this embodiment, the support tray 200 and the driving member 100 are threadedly connected by screws 710, and the carrier plate 300 and the support tray 200 are threadedly connected by screws 720, and the screws 710 are installed on the support tray 200, and the screws 720 are installed on the edge of the carrier plate 300 to ensure that there are no other grooves in the range of the wafer 501 except the pinhole-shaped air channel 311 and the groove-shaped air channel 312, so as to avoid the excessively wide grooves from contacting the wafer 501 and causing cracking. The connection method between the support tray 200 and the driving member 100, and the carrier plate 300 and the support tray 200 is not limited to threaded connection, and the selection of fixed connection points can be set according to needs.

[0086] As an example, matching alignment members 800 are disposed on the carrier plate 300 and the support tray 200 , and the alignment method of the alignment member 800 includes concave-convex alignment.

[0087] Specifically, Figure 1 In this embodiment, a concave step is provided below the carrier plate 300, and a convex step corresponding to the concave step is provided above the support tray 200, so that the carrier plate 300 and the support tray 200 can present a good concave-convex alignment relationship when they are assembled. This structure can not only ensure that the axes of the two bodies are coaxial, prevent the eccentricity of the stage caused by manual installation errors, but also ensure the overall airtightness of the stage. Of course, the alignment method of the carrier plate 300 and the support tray 200 is not limited to this, and can be selected according to needs.

[0088] The following combination Figures 2 to 5b , further explanation is given on the installation and application of the carrier.

[0089] See also Figure 1The support tray 200 serves as the base of the entire carrier. When installing, firstly, the support tray 200 is fixed to the driving member 100 by means of screws 710, and the carrier tray 300 is placed on the support tray 200 by means of the alignment member 800 between the carrier tray 300 and the support tray 200 to achieve concave-convex alignment, and the carrier tray 300 and the support tray 200 are fixed to each other by means of screws 720. When installing the carrier tray 300, the O-ring needs to be installed in the second groove 322 in advance. When the screws 720 are tightened, the O-ring will be elastically deformed to prevent the vacuum from leaking outward from the installation surface between the carrier tray 300 and the support tray 200. Then, four suction cups 400 are installed at the edge of the support tray 200. The distances between the suction cups 400 are the same and evenly distributed in the circumferential direction. The small bosses for installing the suction cups 400 adopt a special-shaped size structure, that is, a special morphological structure with protrusions or depressions. This structure does not require additional fasteners and seals during installation. It only needs to clamp the suction cups 400 directly on the small bosses. The installation and disassembly are very convenient, and the vacuum airtightness can be fully guaranteed. Finally, the lip seal ring is installed in the first groove 321 of the outer ring of the upper surface of the carrier plate 300, and the installation of the entire carrier is completed.

[0090] When the carrier is installed, the driving member air channel 110 is connected with the supporting tray air channels 211, 212, the air channel cavity 313, the carrier plate air channel 310 and the suction cup air channel 411 to form a connecting air channel. When vacuuming, the airflow above the carrier plate 300 will be drawn out through the pinhole-shaped air channel 311 and the groove-shaped air channel 312, and the film 502 and the wafer 501 can be adsorbed on the carrier plate 300 to achieve the purpose of adsorption. The lower part of the air channel cavity 313 is directly opposite to the four supporting tray air channels 212 on the supporting tray 200, so when vacuuming, the airflow in the supporting tray air channel 212 will also be drawn away, so that the four suction cups 400 can adsorb the frame 503 of the wafer product 500 with the film frame. At this point, when the driving member 100 starts to rotate and drive the carrier, the entire wafer product 500 with the film frame will also rotate at the same speed.

[0091] Among them, see Figure 4 Before the wafer is placed, the lip edge of the lip seal ring installed in the first groove 321 of the outer ring of the carrier plate 300 is slightly higher than the upper surface of the carrier plate 300, as shown in Y in the figure. Figure 5a When the wafer product 500 with the film frame is placed and Figure 5b When the vacuum system is turned on, the lip edge of the lip seal ring and the adhesive film 502 are in contact and sealed state, so that even if the warpage of the wafer 501 is very large, a good vacuum degree can still be maintained between the carrier and the wafer product 500 with the adhesive film frame.

[0092] As described above, the carrier of the present invention can effectively absorb and fix the frame above it by adsorbing it through a suction cup, thereby reducing the probability of contamination and reducing maintenance or replacement costs; the bearing structure includes a bearing plate and a support tray, both of which are made of lightweight materials, which can meet the flatness requirements while reducing the weight, and are easy to process, manufacture, maintain and flexibly apply; through the setting of sealing rings, airway cavities and airways, while providing adsorption force, the airtightness requirements are met; through the setting of the airways on the bearing plate and the connection points of each component, the stress concentration problem of the wafer can be effectively solved.

[0093] The carrier parts of the present invention have a simple structure and adopt a universal mechanical manufacturing process, which can greatly reduce the cost of the carrier; the carrier is lightweight and can effectively reduce the load and energy consumption of the drive; it replaces the traditional fixing form of the claws, expands the application range of the carrier for the cleaning liquid, and reduces the frequency of client maintenance; it can be applied to wafer products with a large warping degree, and effectively avoids vacuum leakage and debris.

[0094] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A carrier used for carrying a wafer product with a film frame, characterized in that: The carrier comprises: A bearing structure, wherein a bearing structure air passage is provided in the bearing structure, and a wafer located above the bearing structure is adsorbed through the bearing structure air passage; A suction cup is fixed on the bearing structure and is located outside the air channel of the bearing structure. A suction cup air channel is provided in the suction cup, and the frame located above the suction cup is adsorbed through the suction cup air channel.

2. The stage according to claim 1, characterized in that: The suction nozzle of the suction cup is a tapered trumpet-shaped flexible suction nozzle.

3. The stage according to claim 1, characterized in that: The connection mode between the suction cup and the bearing structure includes a concave-convex connection or a threaded connection.

4. The stage according to claim 1, characterized in that: A first sealing ring is arranged on the bearing structure, the first sealing ring surrounds the outer side of the air channel of the bearing structure, and the first sealing ring includes a deformation end higher than the surface of the bearing structure, and the deformation end is used to contact the adhesive film located between the wafer and the frame.

5. The stage according to claim 1, characterized in that: The suction cup air passage is connected with the bearing structure air passage.

6. The stage according to claim 1, characterized in that: The air channel of the bearing structure includes a pinhole-shaped air channel located in the central area of ​​the bearing structure and a groove-shaped air channel located outside the pinhole-shaped air channel.

7. The stage according to claim 1, characterized in that: The material of the bearing structure includes organic polymer material.

8. The stage according to claim 1, characterized in that: The supporting structure includes a supporting tray and a supporting plate, the supporting structure air channel includes a supporting plate air channel arranged in the supporting plate, the wafer is adsorbed through the supporting plate air channel, and the supporting plate is fixed on the supporting tray, the suction cup is fixed on the supporting tray, and the suction cup is located outside the supporting tray.

9. The stage according to claim 8, characterized in that: The carrier plate and the support tray are provided with matching alignment pieces, and the alignment method of the alignment pieces includes concave-convex alignment.

10. The stage according to claim 8, characterized in that: The support tray is provided with a support tray air passage, the support tray air passage is communicated with the carrying plate air passage, and the support tray air passage is communicated with the suction cup air passage.

11. The stage according to claim 10, characterized in that: An airway cavity is provided between the carrying plate and the supporting tray, and the carrying plate airway and the supporting tray airway are both connected to the airway cavity.

12. The stage according to claim 8, characterized in that: A second sealing ring is arranged between the carrying plate and the supporting tray.

13. The stage according to claim 8, characterized in that: The fixed connection point between the carrying plate and the supporting tray is located outside the air passage of the carrying plate.

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