Power divider, transmitting device, receiving device and communication system

Abstract

The embodiment of the invention discloses a power divider, which is used for reducing the structural complexity of the power divider, reducing the processing difficulty and effectively improving the amplitude balance of each port of the power divider. The power divider comprises a first port, a transition module and N second ports, the transition module comprises a transition sub-module and N output sub-modules, the transition sub-module is connected with the first port, each output sub-module is connected with one second port, and each output sub-module is connected with the transition sub-module; the transition sub-module and the output sub-module are each of a fan-shaped horn structure. And if the power divider is located in the transmitting device, the power divider is used as a power divider of the terahertz wave band, and the N second ports are connected with the transmitting antenna array. And if the power divider is located in the receiving device, the power divider is used as a combiner of the terahertz wave band, and the N second ports are connected with the receiving antenna array.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of communications, and in particular to a power distributor, a transmitting device, a receiving device, and a communication system. Background Art

[0002] Terahertz (THz) waves usually refer to electromagnetic waves with a frequency range of 0.1 to 10 THz. With the development of THz wave research and technological advancement, THz waves have shown great potential in many fields such as homeland security, biology, medicine, radio astronomy, scientific research, etc., and have unique advantages in applications such as ultra-high-speed communications, biological imaging, rapid non-destructive testing, and wall-penetrating radar.

[0003] Power divider is a key device widely used in terahertz wave wireless communication. Figure 1 The structure of the existing power divider is shown in FIG. The existing power divider 100 cascades multiple waveguide modules. For example Figure 1 The power divider shown is a cascade connection of three waveguide modules, wherein the input port of waveguide module 102 is connected to an output port of waveguide module 101. The input port of waveguide module 103 is connected to another output port of waveguide module 101. Each waveguide module is made of a metal waveguide or a low-loss transmission waveguide. The low-loss transmission waveguide can be a multilayer dielectric rectangular waveguide or an electromagnetic bandgap structure.

[0004] Since the power divider cascades multiple waveguide modules, the structure of the power divider is complex and difficult to process, and the amplitudes of the output ports of the power divider are unbalanced. Summary of the invention

[0005] The embodiment of the present application provides a power divider, which is used to reduce the structural complexity of the power divider, reduce the difficulty of processing, and effectively improve the amplitude balance of each port of the power divider.

[0006] In the first aspect, the present application provides a power divider, comprising a first port, a transition module and N second ports, wherein N is an integer not less than 2, the transition module comprising a transition submodule and N output submodules, the transition submodule being connected to the first port, each of the N output submodules being connected to one of the N second ports, and each output submodule being connected to the transition submodule; wherein the transition submodule and the output submodule are respectively in a fan-shaped horn structure. If the power divider is located in a transmitting device, the power divider acts as a power divider in the terahertz band, and the N second ports are connected to a transmitting antenna array. If the power divider is located in a receiving device, the power divider acts as a combiner in the terahertz band, and the N second ports are connected to a receiving antenna array.

[0007] According to the present invention, the power divider does not need to be cascaded, which reduces the complexity of the power divider structure, reduces the difficulty of manufacturing the power divider, and is less sensitive to processing errors. The power divider can also improve the amplitude balance of each second port.

[0008] Based on the first aspect, in an optional implementation, the number N is adjusted by adjusting the size ratio between the transition submodule and the output submodule.

[0009] As shown in this implementation, the power divider can realize N-way power division or combination in the terahertz band, and realizes flexible adjustment of the number of N second ports.

[0010] Based on the first aspect, in an optional implementation, the transition module is made of an overmode waveguide.

[0011] As shown in this implementation, the over-mode waveguide has better transmission performance and greater transmission power, which effectively improves the transmission performance and transmission power of the transition module made of the over-mode waveguide.

[0012] Based on the first aspect, in an optional implementation, the transition submodule and the output submodule are respectively in the form of an E-surface fan-shaped horn structure.

[0013] As shown in this implementation, the transition submodule and each output submodule are in an E-surface fan-shaped horn structure, which effectively suppresses the high-order mode of the transition module, reduces the attenuation of the main mode energy of the transition module, and improves the performance of the transition module. Because the transition module does not need to add a parasitic unit to suppress the high-order mode, the surface roughness of the transition module is effectively reduced, thereby reducing the loss of the transition module.

[0014] Based on the first aspect, in an optional implementation, the transition submodule and the output submodule are respectively H-surface fan-shaped horn structures.

[0015] As shown in this implementation, the transition submodule and each output submodule are H-surface fan-shaped horn structures, which effectively suppress the high-order modes of the transition module, reduce the attenuation of the main mode energy of the transition module, and improve the performance of the transition module. Because the transition module does not need to add parasitic units to achieve high-order mode suppression, the surface roughness of the transition module is effectively reduced, thereby reducing the loss of the transition module.

[0016] Based on the first aspect, in an optional implementation manner, the first port and each of the second ports are standard waveguides.

[0017] According to the implementation, the first port and each of the second ports of the power divider are standard waveguides, which are less sensitive to processing errors, thereby reducing the manufacturing difficulty of the power divider and improving the amplitude balance of each second port.

[0018] Based on the first aspect, in an optional implementation, the transition submodule has a first connection end and a second connection end, the second connection end is formed by opening the first connection end, the first connection end is connected to the first port, and the second connection end is connected to the N output submodules.

[0019] As shown in this implementation, the transition submodule has a fan-shaped horn structure, which effectively suppresses the high-order mode of the transition module, reduces the attenuation of the main mode energy of the transition module, and improves the performance of the transition module. Because the transition module does not need to add a parasitic unit to suppress the high-order mode, the surface roughness of the transition module is effectively reduced, thereby reducing the loss of the transition module.

[0020] Based on the first aspect, in an optional implementation, the output submodule has a third connection end and a fourth connection end, the third connection end is formed by opening the fourth connection end, the third connection end is connected to the transition submodule, and the fourth connection end is connected to the second port.

[0021] As shown in this implementation, each output submodule has a fan-shaped horn structure, which effectively suppresses the high-order mode of the transition module, reduces the attenuation of the main mode energy of the transition module, and improves the performance of the transition module. Because the transition module does not need to add a parasitic unit to achieve high-order mode suppression, the surface roughness of the transition module is effectively reduced, thereby reducing the loss of the transition module.

[0022] Based on the first aspect, in an optional implementation manner, the first port, the transition module and the second port are metal waveguides.

[0023] By using the first port, transition module and second port made of metal waveguide as shown in this implementation, the loss of the power divider is reduced and the balance of the amplitudes of the N second ports is improved.

[0024] Based on the first aspect, in an optional implementation, the power divider includes a dielectric substrate, and the first port, the transition module, and the second port are microstrip transmission lines located on a surface of the dielectric substrate.

[0025] The power divider composed of microstrip transmission lines shown in this implementation can effectively reduce the volume and weight of the power divider, thereby reducing the cost of the power divider, and can improve the conductivity and stability of the power divider.

[0026] Based on the first aspect, in an optional implementation, the power divider is a terahertz waveguide power divider.

[0027] By adopting this implementation method, the power divider can realize power division and combination in the terahertz band.

[0028] In a second aspect, an embodiment of the present application provides a transmitting device, comprising a controller, a transmitting antenna array, and a power divider as described in any one of the first aspects above, wherein the power divider is respectively connected to the controller and the transmitting antenna array; the controller is used to send a transmitting signal to the power divider, and the transmitting signal is a terahertz frequency band signal; the power divider is used to divide the power of the transmitting signal into N-path transmitting signals, and send the N-path transmitting signals to the transmitting antenna array; the transmitting antenna array is used to transmit the N-path transmitting signals.

[0029] For the description of the beneficial effects of this aspect, please refer to the first aspect and the details will not be repeated here.

[0030] In a third aspect, an embodiment of the present application provides a receiving device, comprising a controller, a receiving antenna array, and a power divider as described in any one of the first aspects above, wherein the power divider is respectively connected to the controller and the receiving antenna array; the receiving antenna array is used to receive N sub-transmit signals, each of the sub-transmit signals being a terahertz frequency band signal; the power divider is used to combine the N sub-transmit signals into one receiving signal; and the power divider is used to send the receiving signal to the controller.

[0031] In a fourth aspect, an embodiment of the present application provides a communication system, comprising a sending device as described in any one of the second aspect above and a receiving device as described in any one of the third aspect above. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a structural example diagram of an existing power distributor;

[0033] Figure 2 A diagram showing an exemplary structure of an embodiment of a communication system;

[0034] Figure 3 An example diagram of the overall three-dimensional structure of the first embodiment of the power divider provided in this application;

[0035] Figure 4 for Figure 3 A three-dimensional perspective view of the power divider shown;

[0036] Figure 5 for Figure 3 A perspective front view of the three-dimensional structure of the power divider shown;

[0037] Figure 6 for Figure 3 A perspective cross-sectional view of the three-dimensional structure of the power divider shown;

[0038] Figure 7 This is a structural example diagram of the power distributor body provided in this application;

[0039] Figure 8 A three-dimensional structural example diagram of an embodiment of the power divider provided in this application;

[0040] Fig. 9 for Figure 8 A front view of the power divider shown;

[0041] Fig.10 An example diagram of the structure of an embodiment of the transition submodule provided in the present application;

[0042] Fig.11 An example diagram of the three-dimensional structure of the power distributor body provided in this application;

[0043] Fig.12 for Fig.11 A front view of the three-dimensional structure of the power distributor body shown;

[0044] Fig.13 for Fig.11 An exemplary structural diagram of an embodiment of a transition submodule of a power distributor is shown;

[0045] Fig.14 An example diagram of the overall three-dimensional structure of another embodiment of the power divider provided in the present application;

[0046] Fig.15 for Fig.14 A front view of the three-dimensional structure of the power divider shown;

[0047] Fig.16 A first example diagram of a simulation of the standing wave ratio of the power divider provided in this application;

[0048] Fig.17 A second example diagram of the simulation of the standing wave ratio of the power divider provided in this application;

[0049] Fig.18 A third example diagram of the simulation of the standing wave ratio of the power divider provided in this application;

[0050] Fig.19 This is an example diagram of the first scattering parameter simulation of the power divider provided in this application;

[0051] Fig. 20 This is an example diagram of the simulation of the second scattering parameter of the power divider provided in this application;

[0052] Fig.21 for Figure 1 An example diagram of scattering parameter simulation of a power divider is shown;

[0053] Fig. 22 This is an example diagram of the structure of an embodiment of the communication device provided in this application. DETAILED DESCRIPTION

[0054] The embodiment of the present application provides a power divider, which is used to reduce the structural complexity of the power divider, reduce the difficulty of processing, and effectively improve the amplitude balance of each output port of the power divider.

[0055] The power distributor shown in this embodiment is applied to a communication system. Figure 2 As shown, Figure 2 2 is a diagram showing an example structure of an embodiment of a communication system. The communication system 200 includes a sending device 210 and a receiving device 220. The sending device 210 and the receiving device 220 shown in this embodiment may be communication devices such as a base station, an intelligent terminal, a vehicle-mounted device, or a radar, and this embodiment does not limit the device types of the sending device 210 and the receiving device 220.

[0056] The transmitting device 210 specifically includes a controller 212, a power divider 211 and a transmitting antenna array 213. The controller 212, the power divider 211 and the transmitting antenna array 213 are connected in sequence. The controller 212 is used to send a transmission signal to the power divider 211, and the transmission signal is a terahertz frequency band signal. The power divider 211 is used to divide the power of the transmission signal into N-path transmission signals, and transmit the N-path transmission signals to the transmitting antenna array 213. The transmitting antenna array 213 is used to transmit the N-path transmission signals. The N-path transmission signals emitted by the transmitting antenna array 213 are transmitted to the receiving device 220 in the form of beams 230.

[0057] The receiving device 220 includes a receiving antenna array 221, a power divider 222 and a controller 223. The receiving antenna array 221, the power divider 222 and the controller 223 are connected in sequence. The receiving antenna array 221 is used to receive N-channel transmission signals from the transmitting device 210. Each transmission signal is a terahertz frequency band signal. The power divider 222 is used to combine the N-channel transmission signals into one receiving signal, and send the receiving signal to the controller 223, and the controller 223 is used to process the receiving signal.

[0058] Embodiment 1

[0059] The embodiment of the present application provides a power divider, which is specifically a terahertz waveguide power divider. For example, the power divider can divide the power of electromagnetic waves in the terahertz band input into N outputs. For another example, the power divider combines the power of electromagnetic waves in the terahertz band input from multiple channels into one output. Figure 3 This is an example diagram of the overall three-dimensional structure of the first embodiment of the power divider provided in this application. Figure 4 for Figure 3 The three-dimensional structural perspective view of the power divider is shown. Figure 5 for Figure 3 A perspective front view of the three-dimensional structure of the power divider is shown. Figure 6 for Figure 3 The three-dimensional structure perspective cross-sectional view of the power divider is shown.

[0060] The power divider shown in this embodiment includes an outer shell 300 and a power divider body 301 located in the outer shell 300. For example, the power divider body 301 shown in this embodiment is milled out on the outer shell 300 by a mechanical processing process. This embodiment does not limit the mechanical processing process. The structure of the power divider body 301 can be seen in Figures 7 to 9 As shown, Figure 7 This is an example diagram of the structure of the power distributor body provided in this application. Figure 8 This is a three-dimensional structural example diagram of an embodiment of the power divider provided in this application. Fig. 9 for Figure 8 A front view of the power divider is shown.

[0061] The power divider body 301 shown in this embodiment specifically includes a first port 701, a transition module 702 and N second ports 703. N shown in this embodiment is an arbitrary integer not less than 2. Among them, the number of first ports 701 can be one. If the power divider is located in a transmitting device, the first port 701 is used as an input port for receiving a transmission signal, and the N second ports 703 are used to send N sub-transmission signals to the transmitting antenna array. If the power divider is located in a receiving device, the N second ports are used as receiving ports for receiving N sub-transmission signals from the transmitting device. The first port 701 is used as an output port to output a combined receiving signal. The first port 701 and each second port 703 shown in this embodiment are standard waveguides, and the model of the standard waveguide is a rectangular waveguide such as WR-6, WR2.2, or WR6.5. In this embodiment, the model of the standard waveguide is WR-6 as an example. The large-size long side a of the WR-6 rectangular waveguide is 1.651 millimeters (mm), and the small-size wide side b is 0.8255 mm. The description of the waveguide model of the first port 701 and each second port 703 in this embodiment is an optional example and is not limited.

[0062] The transition module 702 is connected between the first port 701 and the N second ports 703. Specifically, the transition module 702 is made of an over-mode waveguide, and the cross-sectional dimension of the over-mode waveguide is larger than the cross-sectional dimension of the standard waveguide. The over-mode waveguide can also be called an over-size waveguide or a large-size waveguide. The over-mode waveguide has better transmission performance and greater transmission power. Figure 7 As shown, the transition module 702 specifically includes a transition submodule 801 and N output submodules 802. The first connection end of the transition submodule 801 is connected to the first port 701, and the second connection end of the transition submodule 802 is connected to the N output submodules 802. Moreover, each of the N output submodules 802 is connected to one of the N second ports 703. It can be understood that the number of output submodules 802 included in the transition module 702 is the same as the number of the second ports 703, and the N output submodules 802 are connected to the N second ports 703 in a one-to-one correspondence.

[0063] In this embodiment, the transition submodule 801 is a fan-shaped speaker structure. Specifically, the transition submodule 801 is an E-surface fan-shaped speaker structure. Fig.10 As shown, Fig.10 This is an example diagram of the structure of an embodiment of the transition submodule provided in the present application. The transition submodule 801 has a first connection end 1001 and a second connection end 1002. The second connection end 1002 is formed by the first connection end 1001 being opened at a certain angle in the electric field direction 1003. The first connection end 1001 is connected to the first port 701, and the second connection end 1002 is connected to N output submodules 802.

[0064] Each output submodule 802 shown in this embodiment also has an E-surface fan-shaped horn structure, and the output submodule 802 has a third connection end and a fourth connection end, the third connection end is formed by the fourth connection end opening at a certain angle in the electric field direction, the third connection end is connected to the transition submodule 801, and the fourth connection end is connected to the second port. For a description of each output submodule 802 having an E-surface fan-shaped horn structure, see Fig.10 The transition submodule 801 shown in the figure is an E-surface fan-shaped horn structure, and the details are not repeated here.

[0065] The power divider shown in this embodiment can realize N-way power division in the terahertz band. The power divider can also realize N-way combination in the terahertz band. By adjusting the size ratio between the transition submodule 801 and the output submodule 802, the number of N can be adjusted, and the flexible adjustment of the number of N second ports is realized. The N second ports of the power divider are all connected to the transition module 702, so that the N-way power division of the power divider does not need to be cascaded, which reduces the complexity of the power divider structure, reduces the difficulty of manufacturing the power divider, and is less sensitive to processing errors. The transition submodule 801 of the transition module 702 and each output submodule 802 are both E-face fan-shaped horn structures, which effectively suppress the high-order modes of the transition module 702, reduce the attenuation of the main mode energy of the transition module 702, and improve the performance of the transition module 702. Since the transition submodule 801 and each output submodule 802 of the transition module 702 shown in this embodiment are both E-surface fan-shaped horn structures, there is no need to add a parasitic unit to the transition module 702 to achieve high-order mode suppression. Therefore, the surface roughness of the transition module 702 shown in this embodiment is effectively reduced, thereby reducing the loss of the transition module 702.

[0066] The first port 701, transition module 702 and second port 703 shown in this embodiment are all made of metal waveguides or low-loss transmission waveguides. The metal waveguide shown in this embodiment can be implemented by metal materials such as copper and aluminum, and is not specifically limited. The first port 701, transition module 702 and second port 703 made of metal waveguides, and the power divider does not need to adopt a cascade structure, can effectively realize power division and combining in the terahertz band, reduce the loss of the power divider and improve the balance of the amplitudes of the N second ports. It can be understood that the use of the power divider shown in this embodiment can effectively improve the balance of losses between the electromagnetic wave transmission paths in the terahertz band between the first port and different second ports, thereby improving the balance of the amplitudes of different second ports.

[0067] Embodiment 2

[0068] The structure of the transition module 702 shown in this embodiment can also be seen Figures 11 to 13 As shown, Fig.11 This is an example diagram of the three-dimensional structure of the power divider body provided in this application. Fig.12 for Fig.11 The three-dimensional structure front view of the power divider body shown, Fig.13 for Fig.11 An exemplary structural diagram of an embodiment of a transition submodule of a power distributor is shown.

[0069] The power distributor body 301 shown in this embodiment specifically includes a first port 1101, a transition module 1102 and N second ports 1103. For the description of the first port 1101 and the N second ports 1103, please refer to the above embodiment, and no further details are given. The transition module 1102 is made of an overmode waveguide. For the description of the overmode waveguide, the connection between the transition module 1102 and the first port 1101, and the connection between the transition module 1102 and the second port 1103, please refer to the above embodiment, and no further details are given. For the description of the transition submodule and the N output submodules included in the transition module 1102, please refer to the above embodiment, and no further details are given.

[0070] In this embodiment, the transition submodule of the transition module 1102 is an H-surface fan-shaped horn structure. The transition submodule has a first connection end 1301 and a second connection end 1302, and the second connection end 1302 is formed by the first connection end 1301 being opened at a certain angle in the magnetic field direction 1303. The first connection end 1301 is connected to the first port 1101, and the second connection end 1302 is connected to N output submodules. Fig.10 The transition submodule shown is an E-surface fan-shaped horn structure, and Fig.13 As shown in the transition submodule with H-surface fan-shaped horn structure, it can be seen that the second connection end length 1304 of the transition submodule with H-surface fan-shaped horn structure is greater than the second connection end length 1004 of the transition submodule with E-surface fan-shaped horn structure.

[0071] Each output submodule shown in this embodiment also has an H-surface fan-shaped speaker structure. The output submodule has a third connection end and a fourth connection end. The third connection end is formed by the fourth connection end opening at a certain angle along the magnetic field direction. The third connection end is connected to the transition submodule, and the fourth connection end is connected to the second port. For a description of the H-surface fan-shaped speaker structure of the output submodule, please refer to Fig.13 The transition submodule shown is an H-surface fan-shaped horn structure, and the details are not repeated here.

[0072] Optionally, in other examples, one of the transition submodule and the output submodule may be an E-surface fan-shaped speaker structure, while the other may be an H-surface fan-shaped speaker structure. For another example, among the N output submodules, a portion of the output submodules may be an E-surface fan-shaped speaker structure, while another portion of the output submodules may be an H-surface fan-shaped speaker structure, which is not specifically limited in this embodiment.

[0073] Embodiment 3

[0074] Fig.14 This is an example diagram of the overall three-dimensional structure of another embodiment of the power divider provided in this application. Fig.15 for Fig.14The three-dimensional structure front view of the power divider shown. The power divider shown in this embodiment includes a dielectric substrate 1401, and the surface of the dielectric substrate 1401 includes a microstrip transmission line, and the microstrip transmission line specifically includes a first port 1402, a transition module 1403 and a second port 1404. It can be understood that the first port 1402, the transition module 1403 and the second port 1404 are arranged on the surface of the dielectric substrate 1401 in the form of patches. Among them, the first port 1402 and the second port 1404 are rectangular patches. For the description of the specific structure, please refer to the description of the structure of the first port and the second port shown in the above embodiment, and the details will not be repeated. The transition module 1403 shown in this embodiment can be composed of an impedance gradient patch similar to an over-mode waveguide structure. For the description of the specific structure of the transition module 1403 shown in this embodiment, please refer to the description of the transition module structure shown in the above embodiment, and the details will not be repeated.

[0075] Compared with the power divider made of metal waveguide in the above embodiment, the power divider composed of microwave transmission lines can effectively reduce the volume and weight of the power divider, thereby reducing the cost of the power divider, and can improve the efficiency of the power divider.

[0076] The following describes the beneficial effects of the power divider provided by the above-mentioned embodiments 1 to 3 of the present application in combination with specific scenarios:

[0077] Fig.16 This is a first example diagram of standing wave ratio simulation of the power divider provided in this application. Fig.16 The figure shows the working frequency of the power divider in the range of 150 to 170 GHz. The full name of the standing wave ratio is voltage standing wave ratio (VSWR or SWR). It can be understood that Fig.16 The corresponding relationship between different operating frequencies of the power divider and VSWR is shown. When the operating frequency of the power divider shown in this embodiment is within 150 to 170 GHZ, the VSWR is less than 1.3 and close to 1. If the VSWR is equal to 1, it means that the power divider and the antenna array (such as Figure 2 The impedances of the transmitting antenna array or receiving antenna array shown in the figure are completely matched. Taking the power divider connected to the transmitting antenna array as an example, when the VSWR of the power divider is close to 1, the echo reflection of the power divider is reduced, thereby increasing the power output of the power divider, and the power radiated by the transmitting antenna array, reducing the loss of the power divider.

[0078] Fig.17 This is an example diagram of the second standing wave ratio simulation of the power divider provided in this application. Fig.17The power divider is shown as an example where the frequency is in the range of 150 to 170 GHZ. Fig.17 It shows the corresponding relationship between different Frequency and VSWR under different a of the first port of the power divider. For the description of a of the first port of the power divider, please refer to the above embodiment, and the details will not be repeated. For example, Fig.17 The a value of the first port of the power divider shown has three possible values: 1.601mm, 1.651mm and 1.701mm. Fig.17 As shown, as the value of a of the first port of the power divider changes, the VSWR changes very little. That is, under the same Frequency, the VSWRs corresponding to different a are relatively close, and are all close to 1. This shows that the power divider shown in this embodiment has a high tolerance for processing errors of the first port a. It can be understood that the value of a of the first port has little effect on the VSWR of the first port, which reduces the processing difficulty of the first port of the power divider in the terahertz band. For the description of the corresponding relationship between a, Frequency and VSWR of the second port of the power divider, please refer to the description of the corresponding relationship between a, Frequency and VSWR of the first port, and no further details will be given.

[0079] Fig.18 This is a third example diagram of the standing wave ratio simulation of the power divider provided in this application. Fig.18 The power divider is shown as an example where the frequency is in the range of 150 to 170 GHZ. Fig.18 It shows the corresponding relationship between different Frequency and VSWR under different b of the first port of the power divider. For the description of b of the first port of the power divider, please refer to the above embodiment, and the details will not be repeated. For example, Fig.18 The b value of the first port of the power divider shown in the figure has three possible values: 0.7755mm, 0.8255mm and 0.8755mm. Fig.18 As shown, as the value of b of the first port of the power divider changes, the VSWR changes very little, that is, under the same Frequency, the VSWRs corresponding to different b are relatively close, and are less than 1.3 and are close to 1. This shows that the power divider shown in this embodiment has a high tolerance for the processing error of b of the first port, that is, the value of b of the first port has a small effect on the VSWR of the first port, which reduces the processing difficulty of the first port of the power divider in the terahertz band. For the description of the corresponding relationship between b, Frequency and VSWR of the second port of the power divider, please refer to the description of the corresponding relationship between b, Frequency and VSWR of the first port, and no further details will be given.

[0080] Fig.19This is an example diagram of the first scattering parameter simulation of the power divider provided in this application. Fig. 20 This is an example diagram of the second scattering parameter simulation of the power divider provided in this application. Fig.19 as well as Fig. 20 The power distributor shown in the figure takes 16 second ports as an example. Specifically, Fig.19 The figure shows the corresponding relationship between the first eight second ports of the power divider, namely the second port 1, the second port 2 to the second port 8, and the scattering parameter (S parameter) when the frequency is in the range of 150 to 170 GHZ. Fig. 20 The figure shows the corresponding relationship between the last eight second ports of the power divider, namely, the second port 9, the second port 10 to the second port 16, and the S parameter when the frequency is in the range of 150 to 170 GHZ. Fig.19 as well as Fig. 20 As shown, the loss of the power divider is below 0.3 dB, resulting in different second port amplitude imbalances also being within 0.3 dB.

[0081] Fig.21 for Figure 1 The scattering parameter simulation example of the power divider shown in the figure. Figure 1 In the case of the cascade type shown, taking the power divider including 16 output ports as an example, Fig.21 The figure shows the corresponding relationship between the 16 output ports of the existing power divider and the S parameter when the frequency is in the range of 150 to 170 GHZ. Fig.21 As shown in the figure, the loss of the existing power divider is within 2dB, and the port amplitude imbalance is within 1.5dB. Fig.19 , Fig. 20 as well as Fig.21 It can be seen from the figure that the power divider shown in this embodiment can effectively reduce the loss of the power divider, thereby reducing the amplitude imbalance of different second ports.

[0082] Fig. 22An example structure diagram of an embodiment of a communication device provided in the present application. The circuit in the communication device mainly includes a controller 2201, a memory 2202, a controller area network (CAN) transceiver 2203, an audio module 2204, a video module 2205, a power module 2206, an antenna array 2207, an amplification module 2229, a power distributor 2230, an input / output (I / O) interface 2208, a video interface 2209, a touch unit 2210, and a display circuit 2228. Among them, the controller 2201 and its peripheral components, such as a memory 2202, a CAN transceiver 2203, an audio module 2204, a video module 2205, a power module 2206, an amplification module 2229, an I / O interface 2208, a video interface 2209, a touch unit 2210, and a display circuit 2228 can be connected via a bus. In addition, the circuit diagram illustrated in the embodiment of the present application does not constitute a specific limitation on the communication device. In other embodiments of the present application, the communication device may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware. The communication device shown in this embodiment may be Figure 2 The sending device or receiving device shown.

[0083] A memory may also be provided in the controller 2201 for storing instructions and data. In some embodiments, the memory in the controller 2201 is a cache memory. The memory may store instructions or data that the controller 2201 has just used or circulated. If the controller 2201 needs to use the instruction or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the controller 2201, and thus improves the efficiency of the system.

[0084] In some embodiments, the communication device may further include a plurality of I / O interfaces 2208 connected to the controller 2201. The interface 2208 may include, but is not limited to, an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc. The above-mentioned I / O interface 2208 may be connected to devices such as a mouse, a touchpad, a keyboard, a camera, a speaker / speaker, a microphone, etc., and may also be connected to physical buttons (such as a volume button, a brightness adjustment button, a power button, etc.) on the communication device.

[0085] The memory 2202 may include an internal memory and may also include an external memory. The memory 2202 may be used to store computer executable program codes, and the executable program codes include instructions. The memory 2202 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system, an application required for at least one function, etc. The data storage area may store data created during the use of the communication device, etc. In addition, the memory 2202 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc. The controller 2201 executes various functional applications and data processing of the communication device by running instructions stored in the memory 2202 and / or instructions stored in a memory provided in the controller 2201.

[0086] The CAN transceiver 2203 can be connected to the CAN bus (CAN BUS) of the communication device. The CAN transceiver 2203 converts and adjusts the signals between the controller 2201 and the CAN bus through the CAN bus to convert the digital signal output by the controller 2201 into the physical signal required by the CAN bus, and converts the physical signal received on the CAN bus into a digital signal and transmits it to the controller 2201 for processing.

[0087] The communication device can implement audio functions through the audio module 2204 and the application controller, etc. For example, music playing, calling, etc. The audio module 2204 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. The audio module 2204 can also be used to encode and decode audio signals, such as playing or recording. In some embodiments, the audio module 2204 can be arranged in the controller 2201, or some functional modules of the audio module 2204 can be arranged in the controller 2201.

[0088] The video interface 2209 can receive input audio and video, which can be a high definition multimedia interface (HDMI), a digital visual interface (DVI), a video graphics array (VGA), a display port (DP), a low voltage differential signaling (LVDS) interface, etc. The video interface 2209 can also output video. For example, the communication device receives video data sent by the navigation system through the video interface.

[0089] The video module 2205 can decode the video input by the video interface 2209, for example, perform H.264 decoding. The video module can also encode the video collected by the communication device, for example, perform H.264 encoding on the video collected by the external camera. In addition, the controller 2201 can also decode the video input by the video interface 2209.

[0090] The display circuit 2228 is used to display the corresponding image. In this embodiment, the video interface 2209 receives the input video data (or video source), and the video module 2205 decodes and / or digitizes the image data and outputs the image signal to the display circuit 2228. The display circuit 2228 performs corresponding display according to the input image signal, thereby generating a visible image.

[0091] The power module 2206 is used to provide power to the controller 2201 according to input power (such as direct current). The power module 2206 may include a rechargeable battery, and the rechargeable battery can provide power to the controller 2201.

[0092] The antenna array 2207 can enable the communication device to communicate wirelessly with the outside world, and can provide wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) and other wireless communication solutions. The antenna array 2207 can be one or more devices integrating at least one communication processing module. If the communication device is a receiving device, the antenna array 2207 receives multiple received signals and sends them to the power divider 2230, and the received signals are terahertz frequency band signals. The power divider 2230 combines the multiple received signals to transmit a combined optical signal to the amplifier module 2229. The amplifier module 2229 is used to amplify the power of the combined received signal, and optionally, frequency modulation and filtering processing can be performed, and the processed received signal is sent to the controller 2201. If the communication device is a transmitting device, the controller 2201 sends a transmission signal to the amplification module, and the transmission signal is a terahertz frequency band signal. The amplification module 2229 is used to amplify the power of the transmission signal, and optionally, frequency modulation and filtering can be performed, and the processed transmission signal is sent to the power divider 2230. The power divider 2230 divides the transmission signal into multiple transmission signals and transmits them to the antenna array 2207. The antenna array 2207 radiates the multiple reflection signals. The description of the power divider 2230 shown in this embodiment can also be found in Figure 1 The corresponding instructions are not elaborated in detail.

[0093] The present application also provides a communication system, wherein the communication device includes a transmitting device and a receiving device communicating with the transmitting device. For a description of the structures of the transmitting device and the receiving device, see Figure 2 as well as Fig. 22 The instructions shown are not repeated in detail.

[0094] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0095] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0096] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0097] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0098] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, read-only memory), random access memory (RAM, random access memory), disk or optical disk and other media that can store program code.

Claims

1. A power distributor, characterized in that: The invention comprises a first port, a transition module and N second ports, wherein N is an integer not less than 2, wherein the transition module comprises a transition submodule and N output submodules, wherein the transition submodule is connected to the first port, each of the N output submodules is connected to one of the N second ports, and each of the output submodules is connected to the transition submodule; Wherein, the transition submodule and the output submodule are respectively in a fan-shaped speaker structure.

2. The power divider according to claim 1, characterized in that: The transition module is made of an over-mode waveguide.

3. The power divider according to claim 1 or 2, characterized in that: The transition submodule and the output submodule are respectively in the form of an E-surface fan-shaped horn structure.

4. The power divider according to claim 1 or 2, characterized in that: The transition submodule and the output submodule are respectively in the form of H-surface fan-shaped horn structures.

5. The power divider according to any one of claims 1 to 4, characterized in that: The first port and each of the second ports are standard waveguides.

6. The power divider according to any one of claims 1 to 5, characterized in that: The transition submodule has a first connection end and a second connection end, the second connection end is formed by opening the first connection end, the first connection end is connected to the first port, and the second connection end is connected to the N output submodules.

7. The power divider according to any one of claims 1 to 6, characterized in that: The output submodule has a third connection end and a fourth connection end, the third connection end is formed by expanding the fourth connection end, the third connection end is connected to the transition submodule, and the fourth connection end is connected to the second port.

8. The power divider according to any one of claims 1 to 7, characterized in that: The first port, the transition module and the second port are metal waveguides.

9. The power divider according to any one of claims 1 to 7, characterized in that: The power divider comprises a dielectric substrate, and the first port, the transition module and the second port are microstrip transmission lines located on the surface of the dielectric substrate.

10. The power divider according to any one of claims 1 to 9, characterized in that: The power divider is a terahertz waveguide power divider.

11. A sending device, characterized in that: The transmitting device comprises a controller, a transmitting antenna array and a power divider according to any one of claims 1 to 10, wherein the power divider is connected to the controller and the transmitting antenna array respectively; The controller is used to send a transmission signal to the power distributor, and the transmission signal is a terahertz frequency band signal; The power divider is used to divide the power of the transmission signal into N transmission signals, and send the N transmission signals to the transmission antenna array; The transmitting antenna array is used to transmit the N-channel transmitting signals.

12. A receiving device, characterized in that: The receiving device comprises a controller, a receiving antenna array and a power distributor as claimed in any one of claims 1 to 10, wherein the power distributor is connected to the controller and the receiving antenna array respectively; The receiving antenna array is used to receive N sub-transmitting signals, each of which is a terahertz frequency band signal; The power divider is used to combine the N transmission signals into one receiving signal; The power distributor is used to send the receiving signal to the controller.

13. A communication system, characterized in that: It comprises the sending device as claimed in claim 11 and the receiving device as claimed in claim 12.

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