Inverter, driving assembly and vehicle

Abstract

The invention provides an inverter, a driving assembly and a vehicle. The inverter comprises a high-voltage direct-current assembly, a high-voltage alternating-current assembly and an MOS assembly, the high-voltage alternating-current assembly and the MOS assembly are electrically connected with the high-voltage direct-current assembly, the high-voltage alternating-current assembly is provided with a first group of three-phase output ends, and the MOS assembly is provided with a second group of three-phase output ends. According to the inverter, the driving assembly and the vehicle provided by the embodiment of the invention, the inverter can be applied to a control system and an air conditioning system at the same time, repeated design of parts is reduced, the cost of the parts is reduced, and the space required to be occupied during installation is reduced.

Description

Technical Field

[0001] The present application relates to the field of vehicle technology, and in particular to an inverter, a drive assembly and a vehicle. Background Art

[0002] The control system and air conditioning system are both important components of the vehicle. The control system mainly includes the inverter and control motor, and the air conditioning system mainly includes the inverter and air compressor.

[0003] Since the inverter of the control system and the inverter of the air conditioning system have some common components, there is a problem of repeated design of multiple components in the process of setting up the two inverters separately, resulting in a waste of component costs and occupying a large space. Summary of the invention

[0004] The embodiments of the present application provide an inverter, a drive assembly and a vehicle, which can be applied to a control system and an air-conditioning system at the same time, thereby reducing repeated component design, lowering component costs, and reducing the space required for installation.

[0005] An embodiment of the present application provides an inverter, wherein the inverter includes a high-voltage DC component, a high-voltage AC component and a MOS component, the high-voltage AC component and the MOS component are electrically connected to the high-voltage DC component, respectively, the high-voltage AC component is provided with a first group of three-phase output terminals, and the MOS component is provided with a second group of three-phase output terminals.

[0006] In the inverter as described above, the high-voltage AC component is electrically connected to the high-voltage DC component via a first busbar and a second busbar, and the first busbar is insulated from the second busbar.

[0007] In the inverter as described above, the first busbar and the second busbar are spaced apart from each other, and a surface of the first busbar facing the second busbar and / or a surface of the second busbar facing the first busbar are covered with an insulating layer.

[0008] In the inverter as described above, a plurality of insulating support members are arranged between the first busbar and the second busbar.

[0009] The inverter as described above, wherein the high voltage AC component comprises a first power module, a second power module and a third power module;

[0010] The first bus bar includes a plurality of first connection ends, and the first bus bar is connected to the first power module, the second power module, and the third power module respectively through at least one of the first connection ends;

[0011] The second bus bar includes a plurality of second connection ends, and the second bus bar is connected to the first power module, the second power module, and the third power module respectively through at least one of the second connection ends.

[0012] The inverter as described above, wherein the high-voltage AC component further comprises a mounting seat, the first power module, the second power module and the third power module are all mounted on the mounting seat, and the first power module, the second power module and the third power module are arranged at intervals;

[0013] A cooling cavity is provided inside the mounting seat, and an inlet and an outlet communicating with the cooling cavity are provided on the mounting seat;

[0014] The projections of the first power module, the second power module and the third power module on the mounting seat at least partially overlap with the projection of the cooling cavity;

[0015] A plurality of heat-conducting protrusions are disposed inside the cooling cavity, and the heat-conducting protrusions are formed on the inner surface of the wall portion of the mounting seat where the first power module, the second power module, and the third power module are disposed.

[0016] The inverter as described above, wherein the inverter includes a first three-phase output row, the first three-phase output row includes three first connecting rows insulated from each other, the first power module, the second power module and the third power module are respectively connected to one of the first connecting rows, and the three first connecting rows form the first group of three-phase output terminals.

[0017] In the inverter as described above, the MOS component includes a mounting substrate and three pairs of MOS tubes, each of the MOS tubes is connected to the mounting substrate via a fixing member, and the MOS tubes are insulated from the mounting substrate and from the fixing member.

[0018] In the inverter as described above, the MOS tube is provided with a first hole, the mounting substrate is provided with a second hole, the fixing member passes through the first hole and is fixed to the second hole, an insulating sleeve is provided on the fixing member, and the insulating sleeve is provided between the fixing member and the hole wall of the first hole.

[0019] The inverter as described above, wherein, along the direction from the MOS tube to the mounting substrate, the second hole includes a conical hole section and a straight hole section connected to each other, the aperture of the conical hole section gradually decreases along the direction from the MOS tube to the mounting substrate, and the fixing piece passes through the conical hole section and connects with the straight hole section.

[0020] In the inverter as described above, an insulating thermal pad is provided between each MOS tube and the mounting substrate, a third hole is opened on the insulating thermal pad, the fixing member passes through the third hole, and the insulating sleeve is provided between the fixing member and the hole wall of the third hole.

[0021] In the inverter as described above, a heat-conducting adhesive layer is provided on a side of the mounting substrate facing away from each of the MOS tubes.

[0022] The inverter as described above, wherein the inverter includes a second three-phase output row, the second three-phase output row includes three second connecting rows insulated from each other, the three pairs of MOS tubes are respectively connected to the three second connecting rows, and the three second connecting rows form the second group of three-phase output ends.

[0023] The inverter as described above, wherein the inverter further comprises a circuit board, the MOS component and the high-voltage AC component are both connected to the circuit board, and the high-voltage DC component is connected to the circuit board via a transfer bar, and the transfer bar is electrically connected to the MOS component via a route arranged in the circuit board;

[0024] The inverter further comprises a high voltage connector and a low voltage connector, wherein the high voltage connector is electrically connected to the high voltage DC component, and the low voltage connector is connected to the circuit board.

[0025] In the inverter as described above, the circuit board includes a first area and a second area, the MOS component, the high-voltage AC component and the adapter bar are all connected to the first area, the low-voltage connector is connected to the second area, shielding covers are detachably provided on both sides of the second area, and a setting space is formed between the two shielding covers and the circuit board.

[0026] The inverter as described above, wherein the inverter further comprises a housing, wherein a first accommodating space and a second accommodating space which are independent of each other are formed inside the housing, and the first accommodating space and the second accommodating space both have openings and face the same direction;

[0027] The high-voltage DC component, the high-voltage AC component and the MOS component are all installed in the first accommodation space, a portion of the high-voltage connector is located in the first accommodation space, and another portion of the high-voltage connector is located outside the housing, a portion of the low-voltage connector is located in the second accommodation space, and another portion of the low-voltage connector is outside the housing;

[0028] The circuit board is detachably connected to the housing, and the circuit board covers an opening of the first accommodating space and an opening of the second accommodating space.

[0029] The inverter as described above, wherein a first step and a second step are formed at the bottom of the first accommodating space, the first step and the second step are arranged at an interval, and the high-voltage DC component is installed between the first step and the second step;

[0030] Along the direction from the bottom of the shell to the opening of the shell, the high-voltage AC component and the high-voltage DC component are stacked, and the high-voltage AC component is detachably connected to the first step and the second step respectively;

[0031] The first step has a first step surface facing the opening of the housing, and the MOS component is mounted on the first step surface.

[0032] The inverter as described above, wherein a cooling channel is formed inside the first step, one end of the cooling channel is communicated with the outside of the housing, and the other end of the cooling channel passes through the first step surface to form a first communication port;

[0033] The second step has a second step surface facing the opening of the housing, a communication channel is formed inside the second step, one end of the communication channel is communicated with the outside of the housing, and the other end of the communication channel passes through the second step surface to form a second communication port;

[0034] The high voltage AC component is provided with a cooling chamber having an inlet and an outlet, wherein the inlet of the cooling chamber is communicated with one of the first communication port and the second communication port, and the outlet of the cooling chamber is communicated with the other of the first communication port and the second communication port.

[0035] In the inverter as described above, an insulating adhesive structure is provided in the first accommodating space, and the high-voltage DC component is buried in the insulating adhesive structure.

[0036] An embodiment of the present application also provides a drive assembly, wherein the drive assembly includes the inverter as described above.

[0037] An embodiment of the present application also provides a vehicle, wherein the vehicle includes the inverter or drive assembly as described above.

[0038] The inverter, drive assembly and vehicle provided in the embodiments of the present application integrate the inverter used in the control system with the inverter used in the air-conditioning system by making the high-voltage AC components and the MOS components share the high-voltage DC components, so that they can be used in the control system and the air-conditioning system at the same time. Compared with the technical solution in the prior art that the control system and the air-conditioning system are each provided with an inverter, the present application reduces the repeated design of components, reduces the component cost, and reduces the space required for installing the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 An exploded diagram of an inverter provided in an embodiment of the present application;

[0040] Figure 2 A three-dimensional diagram of a partial structure of an inverter provided in an embodiment of the present application;

[0041] Figure 3 A partial structural plan view of an inverter provided in an embodiment of the present application;

[0042] Figure 4 A partial structural plan view of an inverter provided in an embodiment of the present application;

[0043] Figure 5 A partial structural plan view of an inverter provided in an embodiment of the present application;

[0044] Figure 6 A partial structural plan view of an inverter provided in an embodiment of the present application;

[0045] Figure 7 An axonometric cross-sectional view of an inverter provided in an embodiment of the present application;

[0046] Figure 8 A planar cross-sectional view of an inverter provided in an embodiment of the present application;

[0047] Fig. 9 for Figure 7 A magnified view of the local structure;

[0048] Fig.10 An axonometric diagram of a high voltage AC component of an inverter provided in an embodiment of the present application;

[0049] Fig.11 An exploded diagram of a high-voltage AC component of an inverter provided in an embodiment of the present application;

[0050] Fig.12 An axonometric cross-sectional view of a high-voltage AC component of an inverter provided in an embodiment of the present application;

[0051] Fig.13 Another angled isometric view of the high voltage AC component of the inverter provided in the embodiment of the present application;

[0052] Fig.14 An axonometric view of a first seat body of a mounting seat of a high-voltage AC component of an inverter provided in an embodiment of the present application;

[0053] Fig.15 An axonometric diagram of a MOS component of an inverter provided in an embodiment of the present application;

[0054] Fig.16 An exploded diagram of a MOS component of an inverter provided in an embodiment of the present application;

[0055] Fig.17 A partial structural plan view of a MOS component of an inverter provided in an embodiment of the present application;

[0056] Fig.18 A partial structural plan view of a MOS component of an inverter provided in an embodiment of the present application;

[0057] Fig.19 An axonometric view of a housing of an inverter provided in an embodiment of the present application;

[0058] Fig. 20 A plan view of a housing of an inverter provided in an embodiment of the present application;

[0059] Fig.21 An axonometric diagram showing that a high-voltage AC component of an inverter provided in an embodiment of the present application is in communication with a cooling channel of a housing;

[0060] Fig. 22 An axonometric diagram showing that a high-voltage AC component of an inverter provided in an embodiment of the present application is connected to a communication channel of a housing;

[0061] Fig.23 A schematic diagram of the assembly of the MOS components of the inverter provided in an embodiment of the present application.

[0062] Description of Figure Numbers:

[0063] 1. High-voltage DC component; 11. Filter; 12. Bus capacitor; 13. Connecting terminal; 2. High-voltage AC component; 21. First power module; 22. Second power module; 23. Third power module; A. Port; B. Port; 24. Mounting seat; 241. Cooling cavity; 2411. Heat-conducting convex portion; 242. Inlet; 243. Outlet; 244. First seat body; 2441. Mounting plane; 245. Second seat body; 25. First three-phase output row; 251. First connecting row; 252. First insulating seat; 3. MOS component; 31. Mounting substrate; 311. Second hole; 3111. Conical hole section; 3112. Straight hole section; 32. MOS tube; 321. First hole; 33. Solid Fixed piece; 34, insulating sleeve; 35, insulating thermal pad; 351, third hole; 36, thermal conductive adhesive layer; 37, second three-phase output row; 371, second connecting row; 372, second insulating seat; 38, adapter row; 4, first bus; 41, first connecting end; 5, second bus; 51, second connecting end; 6, insulating layer; 7, insulating support; 8, circuit board; 81, shielding cover; 9, shell; 91, first accommodating space; 911, first step; 9111, cooling channel; 9112, first connecting port; 912, second step; 9121, connecting channel; 9122, second connecting port; 92, second accommodating space; 93, partition; H, high-voltage connector; L, low-voltage connector. DETAILED DESCRIPTION

[0064] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0065] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present application, rather than all of the embodiments.

[0066] In order to solve a series of problems in the industry, such as repeated parts design, waste of cost resources, low integration, low power density, poor NVH performance (Noise, Vibration, Harshness), low assembly efficiency and poor EMC performance, caused by the independent arrangement of the inverter used in the control system and the inverter used in the air-conditioning system, the present application proposes a design scheme for integrating the inverter of the control system with the inverter of the air-conditioning system. By making the inverter of the control system and the inverter of the air-conditioning system share some parts, the design is optimized, the cost is reduced, and the integration and power density are improved. At the same time, the partial cover plate structure of the existing inverter is simplified to improve the NVH performance of the inverter. In addition, it has the advantages of reducing the connection inductance between the components and optimizing the electromagnetic compatibility of the inverter.

[0067] The present application will be described in detail below with reference to the accompanying drawings.

[0068] It should be noted that the definition standards of "high voltage" and "low voltage" recorded in this application are consistent with the definition standards of high voltage control circuits and low voltage control circuits in vehicle drive assemblies.

[0069] like Figure 1 As shown, an embodiment of the present application provides an inverter, wherein the inverter includes a high-voltage DC component 1, a high-voltage AC component 2 and a MOS component 3. The high-voltage DC component 1 includes a filter 11 and a bus capacitor 12 connected to each other, which are used to provide high-voltage DC power to the high-voltage AC component 2 and the MOS component 3. The high-voltage AC component 2 is used to convert the high-voltage DC power provided by the high-voltage DC component 1 into high-voltage AC power. MOS is the abbreviation of MOSFET, the full name of which is Metal-Oxide-SemiconductorField-Effect Transistor, which is a metal oxide semiconductor field effect transistor, abbreviated as gold oxide semiconductor field effect transistor. The MOS component 3 is a component composed of metal oxide semiconductor field effect transistors as main components.

[0070] The high-voltage AC component 2 and the MOS component 3 are electrically connected to the high-voltage DC component 1, respectively. Specifically, the high-voltage AC component 2 and the high-voltage DC component 1 are combined to form an inverter for the control system, and the high-voltage AC component 2 is provided with a first group of three-phase output terminals for connecting with the drive motor to cooperate to realize the driving function; the MOS component 3 and the high-voltage DC component 1 are combined to form an inverter for the air-conditioning system, and the MOS component 3 is provided with a second group of three-phase output terminals for connecting with the air compressor to cooperate to realize temperature regulation.

[0071] The inverter provided in the embodiment of the present application integrates the inverter used in the control system with the inverter used in the air-conditioning system by allowing the high-voltage AC component 2 and the MOS component 3 to share a group of high-voltage DC components 1, so that the inverter can be used in the control system and the air-conditioning system at the same time. Compared with the technical solution in the prior art that the control system and the air-conditioning system are each provided with an inverter, the present application reduces a group of high-voltage DC components 1, effectively reduces the component cost, and reduces the space required for the installation of the inverter.

[0072] like Figures 1 to 8 As shown, an inverter provided by an embodiment of the present application, wherein the high-voltage AC component 2 is electrically connected to the high-voltage DC component 1 through a first bus 4 and a second bus 5, and the first bus 4 and the second bus 5 are insulated to prevent the first bus 4 and the second bus 5 from contacting and short-circuiting, thereby ensuring electrical safety.

[0073] The high-voltage DC component 1 has two connection terminals 13, and the two connection terminals 13 are insulated to prevent the two connection terminals 13 from contacting and short-circuiting, thereby ensuring electrical safety. One of the connection terminals 13 is connected to the high-voltage AC component 2 through the first bus 4, and the other connection terminal 13 is connected to the high-voltage AC component 2 through the second bus 5.

[0074] like Fig. 9 As shown, an inverter provided by an embodiment of the present application, wherein the first bus 4 and the second bus 5 are spaced apart, and an insulating layer 6 is provided on a side surface of the first bus 4 facing the second bus 5 and / or a side surface of the second bus 5 facing the first bus 4.

[0075] The two connection terminals 13 of the high voltage DC component 1 are respectively a positive connection terminal and a negative connection terminal, and an insulating layer 6 is also provided between the two connection terminals 13 .

[0076] Optionally, the insulating layer 6 is insulating paper or insulating rubber pad, and only one insulating layer 6 or multiple insulating layers 6 may be provided between the first busbar 4 and the second busbar 5. The insulating layer 6 has a small thickness, and while achieving insulation, a small installation space is required.

[0077] like Fig. 9As shown, in the inverter provided by the embodiment of the present application, a plurality of insulating support members 7 are arranged between the first busbar 4 and the second busbar 5 .

[0078] The distance between the first bus 4 and the second bus 5 is maintained by the insulating support 7, which effectively ensures that the first bus 4 and the second bus 5 are arranged at a distance. By arranging the insulating support 7, the insulation setting of the first bus 4 and the second bus 5 can still be guaranteed when the insulating layer 6 is damaged during vibration use.

[0079] Optionally, the insulating support 7 is an insulating rubber block formed by solidifying a liquid structural adhesive. When the first bus 4 and the second bus 5 are subjected to external force, the insulating rubber block can provide a buffer and maintain the relative position of the first bus 4 and the second bus 5.

[0080] like Figures 10 to 12 As shown, the inverter provided by the embodiment of the present application, wherein the high-voltage AC component 2 includes a first power module 21, a second power module 22 and a third power module 23, and the first power module 21, the second power module 22 and the third power module 23 are all semiconductor switching devices, which are used to convert high-voltage direct current into three-phase alternating current. The first power module 21, the second power module 22 and the third power module 23 can be a half-bridge module, also called a half-bridge power module, a power semiconductor device packaging module including a half-bridge circuit, and has positive and negative input interfaces, a single-phase AC output interface and several independent parts of signal interfaces.

[0081] The first busbar 4 includes a plurality of first connection ends 41, and the first busbar 4 and the first power module 21, the first busbar 4 and the second power module 22, and the first busbar 4 and the third power module 23 are connected respectively via at least one first connection end 41;

[0082] The second busbar 5 includes a plurality of second connection ends 51 . The second busbar 5 and the first power module 21 , the second busbar 5 and the second power module 22 , and the second busbar 5 and the third power module 23 are connected via at least one second connection end 51 .

[0083] The high-voltage AC component 2 is roughly plate-shaped, and the first power module 21, the second power module 22 and the third power module 23 are respectively provided with a port A connected to the first connection end 41 and a port B connected to the second connection end 51. Port A and port B are both pit-shaped and have a flat bottom, and port A for connecting to the first connection end 41 and port B for connecting to the second connection end 51 are spaced apart.

[0084] A portion of the first busbar 4 and a portion of the second busbar 5 are both substantially parallel to the plate-like structure formed by the high-voltage AC component 2 and are stacked and spaced apart.

[0085] Each first connection end 41 is bent from the portion of the first bus 4 parallel to the high-voltage AC component 2 toward the direction close to the high-voltage AC component 2 and extends into the port A of the power module and is bent again to form a connection portion parallel to the bottom of the pit-shaped port A to connect with the bottom of port A, thereby ensuring the connection area between the first connection end 41 and port A and ensuring the connection reliability between the two.

[0086] Each second connection end 51 is bent from the part of the second bus 5 parallel to the high-voltage AC component 2 in the direction close to the high-voltage AC component 2 and extends into the port B of the power module and is bent again to form a connection portion parallel to the bottom of the pit-shaped port B, so as to be connected to the bottom of the port B, thereby ensuring the connection area between the second connection end 51 and the port B and ensuring the connection reliability between the two.

[0087] Since the port A for connecting to the first connection end 41 and the port B for connecting to the second connection end 51 are arranged at intervals, the first connection end 41 and the second connection end 51 can be effectively arranged at intervals to ensure insulation between the two.

[0088] Specifically, the two connecting terminals of the high-voltage DC component 1 are laser welded to the first bus 4 and the second bus 5 respectively, and a portion of the first bus 4 and a portion of the second bus 5 are stacked, which can minimize the distance between the two to the greatest extent, thereby reducing the equivalent series inductance (ESL) between the high-voltage AC component 2 and each power module, and reducing the loss of each power module.

[0089] like Figures 10 to 12 As shown, the inverter provided by the embodiment of the present application, wherein the high-voltage AC component 2 also includes a mounting base 24, the first power module 21, the second power module 22 and the third power module 23 are all installed on the mounting base 24, and the first power module 21, the second power module 22 and the third power module 23 are arranged at intervals.

[0090] The mounting base 24 includes a first base body 244 and a second base body 245 connected to each other. A surface of the first base body 244 facing away from the second base body 245 is provided with three spaced mounting planes 2441 for mounting the first power module 21 , the second power module 22 and the third power module 23 .

[0091] like Fig.13As shown, in the inverter provided by the embodiment of the present application, a cooling cavity 241 is provided inside the mounting base 24 , and the mounting base 24 is provided with an inlet 242 and an outlet 243 , and both the inlet 242 and the outlet 243 are connected to the cooling cavity 241 .

[0092] A concave portion is provided on one side of the first base body 244 facing the second base body 245 and / or on one side of the second base body 245 facing the first base body 244 . After the first base body 244 and the second base body 245 are connected, the concave portion is closed to form a cooling cavity 241 .

[0093] Optionally, the first seat body 244 and the second seat body 245 are fixed by welding to ensure the sealing effect of the cooling cavity 241 .

[0094] The inlet 242 and the outlet 243 are both opened on the second seat body 245, and the inlet 242 and the outlet 243 are arranged at intervals to ensure that after the cooling medium enters the cooling cavity 241 from the inlet 242, it flows inside the cooling cavity 241 for a distance and then flows out at the outlet 243. During the flow of the cooling medium in the cooling cavity 241, the first power module 21, the second power module 22 and the third power module 23 installed on the first seat body 244 can be cooled.

[0095] like Fig.14 As shown, an inverter provided by an embodiment of the present application, wherein the projections of the first power module 21, the second power module 22 and the third power module 23 on the mounting seat 24 at least partially overlap with the projection of the cooling cavity 241; so as to shorten the path for the heat generated by the first power module 21, the second power module 22 and the third power module 23 to be transferred to the cooling cavity 241, ensure that the heat generated by the first power module 21, the second power module 22 and the third power module 23 can be smoothly transferred to the cooling cavity 241 through the first seat body 244, and ensure the cooling effect of the cooling medium in the cooling cavity 241 on the first power module 21, the second power module 22 and the third power module 23.

[0096] A plurality of heat-conducting protrusions 2411 are provided inside the cooling cavity 241, and the heat-conducting protrusions 2411 are formed on the inner surface of the wall of the mounting seat 24 on which the first power module 21, the second power module 22 and the third power module 23 are provided. By providing the heat-conducting protrusions 2411, the heat generated by the first power module 21, the second power module 22 and the third power module 23 can be transferred to each heat-conducting protrusion 2411 through the first seat body. At this time, the surface of the first seat body 244 used to enclose and form the cooling cavity 241 and the outer surface of each heat-conducting protrusion 2411 can transfer heat to the inside of the cooling cavity 241, realize heat exchange with the cooling medium, and thus effectively improve the cooling efficiency of the cooling medium on the first power module 21, the second power module 22 and the third power module 23.

[0097] Optionally, the heat-conducting protrusion 2411 is a columnar structure, and its cross section can be circular, elliptical or polygonal. A plurality of heat-conducting protrusions 2411 are arranged in intervals, and the cooling medium can flow between every two adjacent heat-conducting protrusions 2411.

[0098] The inverter provided in the embodiment of the present application includes a first three-phase output row 25, the first three-phase output row 25 includes three first connecting rows 251 insulated from each other, the first power module 21, the second power module 22 and the third power module 23 are respectively connected to a first connecting row 251, and the three first connecting rows 251 form a first group of three-phase output terminals.

[0099] The first three-phase output row 25 includes a first insulating seat 252 , and three first connecting rows 251 are connected to the first insulating seat 252 at intervals.

[0100] like Figure 15 to Figure 16 As shown, the inverter provided by the embodiment of the present application, wherein the MOS component 3 includes a mounting substrate 31 and three pairs of MOS tubes 32, each MOS tube 32 is connected to the mounting substrate 31 through a fixing member 33, and the MOS tube 32 and the mounting substrate 31 are insulated from each other, and the MOS tube 32 and the fixing member 33 are insulated from each other. The three pairs of MOS tubes 32 cooperate to convert high-voltage direct current into three-phase alternating current.

[0101] like Figure 16 to Figure 17 As shown, an inverter provided by an embodiment of the present application, wherein a first hole 321 is provided on the MOS tube 32, a second hole 311 is provided on the mounting substrate 31, a fixing member 33 passes through the first hole 321 and is fixed to the second hole 311, an insulating sleeve 34 is sleeved on the fixing member 33, and an insulating sleeve 34 is provided between the fixing member 33 and the hole wall of the first hole 321.

[0102] The fixing member 33 is a bolt, the first hole 321 is a smooth hole, and at least a portion of the inner wall of the second hole 311 is provided with threads. The screw of the fixing member 33 passes through the first hole 321 and is screwed to the threads of the second hole 311, and the bolt head of the fixing member 33 abuts against the side of the MOS tube 32 away from the mounting substrate 31.

[0103] Since a charged metal sheet is provided on one side of the MOS tube 32 connected to the mounting substrate 31, it is necessary to provide insulation between the fixing member 33 and the charged metal sheet. By providing an insulating sleeve 34 sleeved on the screw of the fixing member 33 and providing the insulating sleeve 34 between the fixing member 33 and the hole wall of the first hole 321, the fixing member 33 can be effectively isolated from the charged metal sheet of the MOS tube 32 to achieve an insulation effect, thereby ensuring the electrical function of the MOS tube 32.

[0104] The insulating sleeve 34 can be connected to the fixing member 33 or directly fixed in the first hole 321 of the rod.

[0105] like Fig.17 As shown, an inverter provided by an embodiment of the present application, wherein, along the direction from the MOS tube 32 to the mounting substrate 31, the second hole 311 includes a connected conical hole section 3111 and a straight hole section 3112, the aperture of the conical hole section 3111 gradually decreases along the direction from the MOS tube 32 to the mounting substrate 31, and the fixing member 33 passes through the conical hole section 3111 and is connected to the straight hole section 3112.

[0106] Since the electric energy carried by the charged metal sheet of the MOS tube 32 may creep toward the mounting substrate 31, by providing the tapered hole section 3111, the distance between the charged metal sheet and the fixing member 33 can be increased, thereby reducing the insulation failure between the charged metal sheet and the fixing member 33 caused by the creepage phenomenon.

[0107] like Figure 16 to Figure 17 As shown, the inverter provided by the embodiment of the present application, wherein an insulating thermal pad 35 is provided between each MOS tube 32 and the mounting substrate 31, a third hole 351 is provided on the insulating thermal pad, a fixing member 33 passes through the third hole 351, and an insulating sleeve 34 is provided between the fixing member 33 and the hole wall of the third hole 351. The insulating thermal pad 35 can further insulate the charged metal sheet, thereby ensuring the reliability of the insulation setting between the charged metal sheet and the fixing member 33; at the same time, the insulating thermal pad 35 has good thermal conductivity, which can ensure that the heat generated by each MOS tube 32 can be dissipated through the mounting substrate 31 and the insulating thermal pad 35.

[0108] like Fig.18 As shown, in the inverter provided by the embodiment of the present application, a thermally conductive adhesive layer 36 is provided on the side of the mounting substrate 31 facing away from each MOS tube 32, which is used for fixing the MOS component 3 to the mounting component. At the same time, the thermally conductive adhesive layer 36 has good thermal conductivity and will not hinder the conduction of heat.

[0109] The inverter provided in the embodiment of the present application includes a second three-phase output row 37, the second three-phase output row 37 includes three second connecting rows 371 insulated from each other, three pairs of MOS tubes 32 are respectively connected to the three second connecting rows 371, that is, each pair of MOS tubes 32 is respectively connected to one second connecting row 371, and the three second connecting rows 371 form a second group of three-phase output terminals.

[0110] The second three-phase output row 37 includes a second insulating seat 372 , and three second connecting rows 371 are connected to the second insulating seat 372 at intervals.

[0111] The inverter provided in the embodiment of the present application further includes a circuit board 8, the MOS component 3 and the high-voltage AC component 2 are both connected to the circuit board 8, and the high-voltage DC component 1 is connected to the circuit board 8 through a transfer bar 38, and the transfer bar 38 is electrically connected to the MOS component 3 through a route laid out in the circuit board 8.

[0112] The circuit board 8 may be a PCB, Printed Circuit Board, or other types of circuit boards.

[0113] The high voltage AC component 2 , the MOS component 3 and the adapter bar 38 are all fixed to the circuit board 8 by welding through pins.

[0114] The inverter provided in the embodiment of the present application further includes a high-voltage connector H and a low-voltage connector L, wherein the high-voltage connector H is electrically connected to the high-voltage DC component 1, and the low-voltage connector L is connected to the circuit board 8. The high-voltage connector H is used to connect to the power supply to realize the inverter power supply; the low-voltage connector L is used to connect to the external control device to realize the control signal transmission.

[0115] Optionally, the circuit board 8 includes a first area and a second area, the MOS component 3, the high-voltage AC component 2 and the adapter bar 38 are all connected to the first area, and the low-voltage connector L is connected to the second area. The first area is mainly used for the installation and wiring of high-voltage electronic components, and the second area is mainly used for the installation and wiring of low-voltage electronic components. By installing high-voltage electronic components and low-voltage electronic components in different areas, the electromagnetic interference between the two can be effectively reduced, thereby improving the overall electromagnetic compatibility of the inverter.

[0116] Optionally, shielding covers 81 are detachably provided on both sides of the second region, and a setting space is formed between the two shielding covers 81 and the circuit board 8. The low-voltage electronic components are installed in the setting space, and the electromagnetic interference between the high-voltage electronic components and the low-voltage electronic components can be further reduced by providing the shielding covers 81.

[0117] like Fig.19 and Fig. 20 As shown, an inverter provided in an embodiment of the present application, wherein the inverter further includes a shell 9, the interior of the shell 9 is formed with a first accommodating space 91 and a second accommodating space 92 which are independent of each other, the shell 9, the first accommodating space 91 and the second accommodating space 92 all have openings, and the opening of the shell 9, the opening of the first accommodating space 91 and the opening of the second accommodating space 92 are oriented in the same direction; so as to facilitate the installation of components in the first accommodating space 91 and the second accommodating space 92, thereby improving the overall electromagnetic compatibility of the inverter.

[0118] The high-voltage DC component 1, the high-voltage AC component 2 and the MOS component 3 are all installed in the first accommodating space 91, a part of the high-voltage connector H is located in the first accommodating space 91, and another part of the high-voltage connector H is located outside the shell 9, a part of the low-voltage connector L is located in the second accommodating space 92, and another part of the low-voltage connector L is outside the shell 9; the first accommodating space 91 and the second accommodating space 92 are separated by a partition 93. The partition 93 is provided to form the first accommodating space 91 and the second accommodating space 92 that are independent of each other, and the low-voltage connector L is installed in the second accommodating space 92, which can effectively protect the low-voltage connector L, reduce the electromagnetic interference generated by other components to the low-voltage connector L, and improve the overall electromagnetic compatibility of the inverter.

[0119] The circuit board 8 is detachably connected to the housing 9 , and the circuit board 8 is detachably connected to the partition 93 , and the partition 93 can provide support for the circuit board 8 .

[0120] The circuit board 8 covers the opening of the first accommodating space 91 and the opening of the second accommodating space 92. The circuit board 8 can close the opening of the first accommodating space 91 and the opening of the second accommodating space 92 to form two independent accommodating spaces.

[0121] Optionally, other components with a partitioning function may also be provided in the first accommodating space 91 to divide the first accommodating space 91 into a plurality of accommodating chambers, and the plurality of accommodating chambers may be used to respectively install the high-voltage connector H, the filter 11 of the high-voltage DC component 1, and the bus capacitor 12 of the high-voltage DC component 1 to protect each component respectively.

[0122] In the inverter provided in the embodiment of the present application, the opening of the shell 9 can be directly connected and sealed with the outer surface of the case of other structural components, such as the reducer case, without providing a cover plate or other sealing structure at the opening, thereby effectively improving the NVH performance of the inverter.

[0123] like Fig.19 and Fig. 20 As shown, an inverter provided by an embodiment of the present application, wherein a first step 911 and a second step 912 are formed at the bottom of the first accommodating space 91, the first step 911 and the second step 912 are arranged at intervals, and at least a portion of the high-voltage DC component 1 is installed between the first step 911 and the second step 912.

[0124] Along the direction from the bottom of the shell 9 to the opening of the shell 9, the high-voltage AC component 2 and the high-voltage DC component 1 are stacked, the high-voltage AC component 2 is located on the side of the high-voltage DC component 1 close to the opening of the shell 9, and the high-voltage AC component 2 is detachably connected to the first step 911 and the second step 912 respectively; that is, the high-voltage AC component 2 is arranged across the high-voltage DC component 1, and the two ends of the high-voltage AC component 2 are spanned and detachably connected to the first step 911 and the second step 912, and the high-voltage AC component 2 and the first step 911 as well as the high-voltage AC component 2 and the second step 912 are connected by bolts or other connecting parts.

[0125] The first step 911 has a first step surface facing the opening of the housing 9 , the MOS component 3 is mounted on the first step surface, and the thermal conductive adhesive layer 36 of the MOS component 3 is bonded and fixed to the first step surface.

[0126] like Fig.21 and Fig. 22 As shown, in the inverter provided by the embodiment of the present application, a cooling channel 9111 is formed inside the first step 911, one end of the cooling channel 9111 is connected to the outside of the housing 9, and the other end of the cooling channel 9111 passes through the first step surface to form a first communication port 9112;

[0127] The second step 912 has a second step surface opening toward the shell 9, and a connecting channel 9121 is formed inside the second step 912. One end of the connecting channel 9121 is connected to the outside of the shell 9, and the other end of the connecting channel 9121 passes through the second step surface to form a second connecting port 9122; the inlet 242 and the outlet 243 of the cooling cavity 241 of the mounting seat 24 of the high-voltage AC component 2 are respectively connected to the first connecting port 9112 and the second connecting port 9122.

[0128] Specifically, the inlet 242 of the cooling cavity 241 is connected to one of the first communication port 9112 and the second communication port 9122, and the outlet 243 of the cooling cavity 241 is connected to the other of the first communication port 9112 and the second communication port 9122. The cooling medium can enter the cooling cavity 241 through the cooling channel 9111 and be discharged through the communication channel 9121, so as to first cool down the MOS component 3 and then cool down the high-voltage AC component 2; or the cooling medium can enter the cooling cavity 241 through the communication channel 9121 and be discharged through the cooling channel 9111, so as to first cool down the high-voltage AC component 2 and then cool down the MOS component 3.

[0129] Optionally, sealing components may be provided between the inlet 242 and the first communication port 9112 , between the inlet 242 and the second communication port 9122 , between the outlet 243 and the first communication port 9112 , and between the outlet 243 and the second communication port 9122 to ensure sealing of the connection.

[0130] Optionally, connecting pipes or connecting joints may be provided between the inlet 242 and the first connecting port 9112, between the inlet 242 and the second connecting port 9122, between the outlet 243 and the first connecting port 9112, between the outlet 243 and the second connecting port 9122, one end of the cooling channel 9111 passing through the outer surface of the shell 9, and one end of the connecting channel 9121 passing through the outer surface of the shell 9 to achieve conduction.

[0131] like Fig.23 As shown, in the inverter provided by the embodiment of the present application, the projection of at least part of the MOS tube 32 on the mounting substrate 31 coincides with the projection of the cooling channel 9111, so as to shorten the path for the heat generated by the MOS tube 32 to be transferred to the cooling channel 9111, ensure that the heat generated by the MOS tube 32 is smoothly transferred to the cooling channel 9111, and ensure the cooling effect of the cooling medium in the cooling channel 9111 on the MOS tube 32.

[0132] Optionally, in the inverter provided by the embodiment of the present application, an insulating adhesive structure is provided in the first accommodating space 91, and the high-voltage DC component 1 is buried in the insulating adhesive structure, so that the high-voltage DC component 1 is fixed and protected by the insulating adhesive structure.

[0133] The insulating bonding structure is formed by filling and curing a liquid structural adhesive, and the liquid structural adhesive may be an epoxy resin.

[0134] An embodiment of the present application also provides a drive assembly, wherein the drive assembly includes the inverter as described above.

[0135] The drive assembly provided in the embodiment of the present application has an inverter that integrates the inverter used in the control system with the inverter used in the air-conditioning system by allowing the high-voltage AC component and the MOS component to share the high-voltage DC component, so that the inverter can be used in the control system and the air-conditioning system at the same time. Compared with the technical solution in the prior art that the control system and the air-conditioning system are each provided with an inverter, the present application reduces the repeated design of components, reduces the component cost, and reduces the space required for installing the inverter.

[0136] An embodiment of the present application also provides a vehicle, wherein the vehicle includes the inverter or drive assembly as described above.

[0137] The vehicle provided in the embodiment of the present application has an inverter of a drive assembly, in which the inverter used for the control system is integrated with the inverter used for the air-conditioning system by making the high-voltage AC component and the MOS component share the high-voltage DC component, so that the inverter can be used for the control system and the air-conditioning system at the same time. Compared with the technical solution in the prior art in which the control system and the air-conditioning system are each provided with an inverter, the present application reduces the repeated design of components, reduces the component cost, and reduces the space required for installing the inverter.

[0138] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. An inverter, characterized in that: The inverter includes a high-voltage DC component, a high-voltage AC component and a MOS component. The high-voltage AC component and the MOS component are electrically connected to the high-voltage DC component respectively. The high-voltage AC component is provided with a first group of three-phase output terminals, and the MOS component is provided with a second group of three-phase output terminals.

2. The inverter according to claim 1, characterized in that: The high-voltage AC component is electrically connected to the high-voltage DC component via a first busbar and a second busbar, and the first busbar is insulated from the second busbar.

3. The inverter according to claim 2, characterized in that: The first busbar is spaced apart from the second busbar, and a surface of the first busbar facing the second busbar and / or a surface of the second busbar facing the first busbar are covered with an insulating layer.

4. The inverter according to claim 2 or 3, characterized in that: A plurality of insulating support members are arranged between the first busbar and the second busbar.

5. The inverter according to claim 2, characterized in that: The high voltage AC component includes a first power module, a second power module and a third power module; The first bus bar includes a plurality of first connection ends, and the first bus bar is connected to the first power module, the second power module, and the third power module respectively through at least one of the first connection ends; The second bus bar includes a plurality of second connection ends, and the second bus bar is connected to the first power module, the second power module, and the third power module respectively through at least one of the second connection ends.

6. The inverter according to claim 5, characterized in that: The high-voltage AC component further includes a mounting seat, the first power module, the second power module and the third power module are all mounted on the mounting seat, and the first power module, the second power module and the third power module are arranged at intervals; A cooling cavity is provided inside the mounting seat, and an inlet and an outlet communicating with the cooling cavity are provided on the mounting seat; The projections of the first power module, the second power module and the third power module on the mounting seat at least partially overlap with the projection of the cooling cavity; A plurality of heat-conducting protrusions are disposed inside the cooling cavity, and the heat-conducting protrusions are formed on the inner surface of the wall portion of the mounting seat where the first power module, the second power module, and the third power module are disposed.

7. The inverter according to claim 5 or 6, characterized in that: The inverter includes a first three-phase output row, which includes three first connecting rows insulated from each other. The first power module, the second power module and the third power module are respectively connected to one of the first connecting rows, and the three first connecting rows form the first group of three-phase output terminals.

8. The inverter according to claim 1, characterized in that: The MOS component comprises a mounting substrate and three pairs of MOS tubes. Each of the MOS tubes is connected to the mounting substrate via a fixing member. The MOS tubes are insulated from the mounting substrate and from the fixing member.

9. The inverter according to claim 8, characterized in that: The MOS tube is provided with a first hole, the mounting substrate is provided with a second hole, the fixing member passes through the first hole and is fixed to the second hole, an insulating sleeve is sleeved on the fixing member, and the insulating sleeve is provided between the fixing member and the hole wall of the first hole.

10. The inverter according to claim 9, characterized in that: Along the direction from the MOS tube to the mounting substrate, the second hole includes a connected tapered hole section and a straight hole section, the aperture of the tapered hole section gradually decreases along the direction from the MOS tube to the mounting substrate, and the fixing piece passes through the tapered hole section and connects with the straight hole section.

11. The inverter according to claim 9 or 10, characterized in that: An insulating thermal pad is provided between each MOS tube and the mounting substrate, a third hole is opened on the insulating thermal pad, the fixing member passes through the third hole, and the insulating sleeve is provided between the fixing member and the hole wall of the third hole.

12. The inverter according to claim 8 or 9, characterized in that: A heat-conducting adhesive layer is provided on one side of the mounting substrate away from each MOS tube.

13. The inverter according to claim 8, characterized in that: The inverter includes a second three-phase output row, which includes three second connecting rows insulated from each other. The three pairs of MOS tubes are respectively connected to the three second connecting rows, and the three second connecting rows form the second group of three-phase output terminals.

14. The inverter according to claim 1, characterized in that: The inverter further includes a circuit board, the MOS component and the high-voltage AC component are both connected to the circuit board, and the high-voltage DC component is connected to the circuit board via a transfer bar, and the transfer bar is electrically connected to the MOS component via a route arranged in the circuit board; The inverter further comprises a high voltage connector and a low voltage connector, wherein the high voltage connector is electrically connected to the high voltage DC component, and the low voltage connector is connected to the circuit board.

15. The inverter according to claim 14, characterized in that: The circuit board includes a first area and a second area, the MOS component, the high-voltage AC component and the adapter bar are all connected to the first area, the low-voltage connector is connected to the second area, and shielding covers are detachably provided on both sides of the second area, and a setting space is formed between the two shielding covers and the circuit board.

16. The inverter according to claim 14, characterized in that: The inverter further includes a housing, wherein a first accommodating space and a second accommodating space which are independent of each other are formed inside the housing, and the first accommodating space and the second accommodating space both have openings and face the same direction; The high-voltage DC component, the high-voltage AC component and the MOS component are all installed in the first accommodation space, a portion of the high-voltage connector is located in the first accommodation space, and another portion of the high-voltage connector is located outside the housing, a portion of the low-voltage connector is located in the second accommodation space, and another portion of the low-voltage connector is outside the housing; The circuit board is detachably connected to the housing, and the circuit board covers an opening of the first accommodating space and an opening of the second accommodating space.

17. The inverter according to claim 16, characterized in that: A first step and a second step are formed at the bottom of the first accommodating space, the first step and the second step are arranged at an interval, and the high-voltage DC component is installed between the first step and the second step; Along the direction from the bottom of the shell to the opening of the shell, the high-voltage AC component and the high-voltage DC component are stacked, and the high-voltage AC component is detachably connected to the first step and the second step respectively; The first step has a first step surface facing the opening of the housing, and the MOS component is mounted on the first step surface.

18. The inverter according to claim 17, characterized in that: A cooling channel is formed inside the first step, one end of the cooling channel is communicated with the outside of the shell, and the other end of the cooling channel passes through the first step surface to form a first communication port; The second step has a second step surface facing the opening of the housing, a communication channel is formed inside the second step, one end of the communication channel is communicated with the outside of the housing, and the other end of the communication channel passes through the second step surface to form a second communication port; The high voltage AC component is provided with a cooling chamber having an inlet and an outlet, wherein the inlet of the cooling chamber is communicated with one of the first communication port and the second communication port, and the outlet of the cooling chamber is communicated with the other of the first communication port and the second communication port.

19. The inverter according to claim 17 or 18, characterized in that: An insulating bonding structure is provided in the first accommodating space, and the high-voltage DC component is buried in the insulating bonding structure.

20. A drive assembly, characterized in that: The drive assembly comprises the inverter according to any one of claims 1 to 19.

21. A vehicle, characterized in that: The vehicle comprises the inverter according to any one of claims 1 to 19 or the drive assembly according to claim 20.

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