Heat dissipation module and electronic device

Abstract

The invention provides a heat dissipation module and an electronic device. The radiating module comprises a radiator and a fan. The radiator is provided with an air inlet, an air outlet and an air duct, the air duct is communicated with the air inlet and the air outlet, and the air duct is bent. The air outlet is smaller than the air inlet, and the fan is arranged at the air inlet.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module and an electronic device, and in particular to a heat dissipation module capable of effectively improving heat dissipation performance and an electronic device equipped with the heat dissipation module. Background Art

[0002] As the transmission speed of solid-state drives has increased significantly, solid-state drives often use a combination of radiators and fans for forced convection cooling. The most common way to place fans is to place them vertically or axially with the radiator. This assembly method will cause the wind blown by the fan to only be forced to dissipate heat in a fixed direction. The vertically placed fan blows downward onto the fins of the radiator and cannot generate a fixed and effective airflow; the axially placed fan has less direct airflow contact with the fins of the radiator and cannot improve the cooling efficiency, and the overall fin height will be the highest. Summary of the invention

[0003] The object of the present invention is to provide a heat dissipation module which can effectively improve the heat dissipation performance and an electronic device equipped with the heat dissipation module to solve the above-mentioned problems.

[0004] According to one embodiment, the heat dissipation module of the present invention comprises a radiator and a fan. The radiator has an air inlet, an air outlet and an air duct. The air duct connects the air inlet and the air outlet. The air duct is curved. The air outlet is smaller than the air inlet. The fan is arranged at the air inlet.

[0005] According to another embodiment, the electronic device of the present invention includes an electronic component and a heat dissipation module. The heat dissipation module includes a radiator and a fan. The radiator is disposed on the electronic component. The radiator has an air inlet, an air outlet, and an air duct. The air duct connects the air inlet and the air outlet. The air duct is curved. The air outlet is smaller than the air inlet. The fan is disposed at the air inlet.

[0006] In summary, the present invention forms a curved air duct in the radiator, and makes the air outlet smaller than the air inlet. The area through which the air duct passes will accelerate the transfer of heat. By designing the structure that the air outlet is smaller than the air inlet, the air pressure blown out by the fan can be maintained consistent or increased, thereby reducing the pressure drop problem of the forced convection fan, thereby effectively improving the heat dissipation performance.

[0007] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a three-dimensional diagram of an electronic device according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 An exploded view of the electronic device in the image.

[0010] Figure 3 for Figure 1 A three-dimensional diagram of the radiator in FIG.

[0011] Figure 4 for Figure 1 An internal side view of an electronic device in FIG.

[0012] The reference numerals are as follows:

[0013] 1: Electronic devices

[0014] 10: Electronic components

[0015] 12: Heat dissipation module

[0016] 100: Heat source

[0017] 120: Radiator

[0018] 122: Fan

[0019] 1200: Air inlet

[0020] 1202: Air outlet

[0021] 1204: Air duct

[0022] 1206: Horizontal surface

[0023] 1220: Square fan frame

[0024] H: Overall height

[0025] L: side length

[0026] W: Width

[0027] θ: angle DETAILED DESCRIPTION

[0028] See also Figures 1 to 4 , Figure 1 is a three-dimensional diagram of an electronic device 1 according to an embodiment of the present invention, Figure 2 for Figure 1 An exploded view of the electronic device 1 in FIG. Figure 3 for Figure 1 A perspective view of the heat sink 120 in FIG. Figure 4 for Figure 1 An internal side view of the electronic device 1 in FIG.

[0029] like Figures 1 to 4 As shown, the electronic device 1 includes an electronic component 10 and a heat dissipation module 12. The heat dissipation module 12 is disposed on the electronic component 10 to dissipate heat from the electronic component 10. In this embodiment, the electronic component 10 may be a solid state drive, but is not limited thereto.

[0030] The heat dissipation module 12 includes a heat sink 120 and a fan 122. The heat sink 120 is disposed on the electronic component 10. The heat sink 120 has an air inlet 1200, an air outlet 1202 and an air duct 1204, wherein the air duct 1204 connects the air inlet 1200 and the air outlet 1202. The fan 122 is disposed at the air inlet 1200. In the present embodiment, the fan 122 may be embedded in the air inlet 1200, but is not limited thereto. In another embodiment, the fan 122 may also be detachably disposed at the air inlet 1200 by a snap-fit ​​structure or other fixing structure. Thus, the fan 122 may be replaced with fans of different sizes according to the required wind speed.

[0031] In this embodiment, the air duct 1204 is curved, and the width W of the air duct 1204 gradually decreases from the air inlet 1200 toward the air outlet 1202. As a result, the area through which the air duct 1204 passes will accelerate the transfer of heat. In addition, the air outlet 1202 is smaller than the air inlet 1200. By designing the structure that the air outlet 1202 is smaller than the air inlet 1200, the air pressure blown out by the fan 122 can be maintained consistent or increased, so as to reduce the pressure drop problem of the forced convection fan, thereby effectively improving the heat dissipation performance.

[0032] In this embodiment, the position of a heat source 100 of the electronic component 10 corresponds to the position of the air outlet 1202. Figure 4 As shown, the air outlet 1202 may be located above the heat source 100, so that the air duct 1204 passes over the heat source 100, and the wind speed principle is used to transfer heat energy as quickly as possible. In this embodiment, the heat source 100 may be a controller of a solid state drive, but is not limited thereto.

[0033] In this embodiment, the air inlet 1200 can be tilted at an angle θ relative to a horizontal surface 1206 of the heat sink 120, so that the fan 122 is tiltedly disposed at the air inlet 1200. Since the fan 122 is tiltedly disposed, it can support cooling areas in more than two axes and is no longer limited to a single-axis heat dissipation method, thereby improving the heat dissipation efficiency of forced convection.

[0034] In this embodiment, the fan 122 may have a square fan frame 1220, wherein a side length L of the square fan frame 1220 is greater than a total height H of the radiator 120. If the fan 122 is disposed on one side of the radiator 120 in an axial arrangement, the total height H of the radiator 120 must be increased to the side length L of the square fan frame 1220, so that the total height H of the radiator 120 is increased. Since the present invention obliquely disposes the fan 122 at the air inlet 1200, the total height H of the radiator 120 is not limited by the side length L of the fan 122, and the total height H of the radiator 120 can be reduced by adjusting the air duct 1204.

[0035] In summary, the present invention forms a curved air duct in the radiator, and makes the air outlet smaller than the air inlet. The area through which the air duct passes will accelerate the transfer of heat. By designing the air outlet smaller than the air inlet, the wind pressure blown out by the fan can be maintained consistent or increased, so as to reduce the pressure drop problem of the forced convection fan, thereby effectively improving the heat dissipation efficiency. In addition, the position of the heat source of the electronic component can correspond to the position of the air outlet, so as to utilize the wind speed principle to make the fastest transfer of heat energy. Furthermore, the fan can be set at an angle to support cooling areas in more than two axes, and is no longer limited to a single-axis heat dissipation method, thereby improving the heat dissipation efficiency of forced convection. Furthermore, since the fan can be set at an angle, the total height of the radiator is not limited by the side length of the fan, and the total height of the radiator can be reduced by adjusting the air duct.

[0036] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the claims of the present invention should fall within the scope of the present invention.

Claims

1. A heat dissipation module, comprising: A radiator having an air inlet, an air outlet, and an air duct, the air duct connecting the air inlet and the air outlet, the air duct being curved, and the air outlet being smaller than the air inlet; and A fan is disposed at the air inlet. 2 . The heat dissipation module as claimed in claim 1 , wherein the heat sink is disposed on an electronic component, and a position of a heat source of the electronic component corresponds to a position of the air outlet. 3 . The heat dissipation module as claimed in claim 2 , wherein the electronic component is a solid state drive, and the heat source is a controller of the solid state drive. 4 . The heat dissipation module as claimed in claim 1 , wherein the air inlet is inclined at an angle relative to a horizontal surface of the heat sink, so that the fan is disposed at an angle at the air inlet. 5 . The heat dissipation module as claimed in claim 1 , wherein a width of the air duct gradually decreases from the air inlet toward the air outlet. The heat dissipation module as claimed in claim 1 , wherein the fan is detachably disposed at the air inlet. 7 . The heat dissipation module as claimed in claim 1 , wherein the fan has a square fan frame, and a side of the square fan frame is longer than a total height of the heat sink.

8. An electronic device comprising: an electronic component; and A heat dissipation module, comprising: a heat sink, disposed on the electronic component, the heat sink having an air inlet, an air outlet, and an air duct, the air duct connecting the air inlet and the air outlet, the air duct being curved, and the air outlet being smaller than the air inlet; and A fan is disposed at the air inlet. 9 . The electronic device as claimed in claim 8 , wherein a position of a heat source of the electronic component corresponds to a position of the air outlet. 10 . The electronic device as claimed in claim 9 , wherein the electronic component is a solid state drive, and the heat source is a controller of the solid state drive. 11 . The electronic device as claimed in claim 8 , wherein the air inlet is inclined at an angle relative to a horizontal surface of the heat sink, so that the fan is disposed at an angle at the air inlet. 12 . The electronic device as claimed in claim 8 , wherein a width of the air duct gradually decreases from the air inlet toward the air outlet. 13 . The electronic device as claimed in claim 8 , wherein the fan is detachably disposed on the air inlet. 14 . The electronic device as claimed in claim 8 , wherein the fan has a square fan frame, and a side of the square fan frame is longer than a total height of the heat sink.

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