High-redundancy liquid-cooling cold plate system

Abstract

A high-redundancy liquid-cooling cold plate system comprises a vapor chamber, cold plate sets, a gas pipeline, a double-acting valve, a gas return main collecting pipe, a condenser, a pump, a liquid pipeline, a liquid separation main collecting pipe and heat exchange fluid, and further comprises at least one cold plate set, and each cold plate set is composed of at least two cold plates which are independently arranged in a crossed mode. And online maintenance of the high-heat-flow computing power chip cold plate system can be realized. In combination with the requirements of operation safety and energy conservation of the computing power chip, the device is high in safety and has the advantages of being high in heat dissipation capacity, compact in structure, high in temperature control precision, high in applicability, wide in application range and the like.

Description

Technical Field

[0001] The present invention belongs to the field of data center heat dissipation, and more specifically relates to a high-redundancy liquid-cooled cold plate system. Background Art

[0002] At present, computing power is a new type of productivity, and the improvement of computing power is positively correlated with the degree of economic development. With the development of computing power, the number of computing chips and computing servers has gradually increased, and the corresponding single cabinet power has also increased rapidly. With the gradual evolution of high-power chips, high-density servers, and high-power single cabinets, for the air cooling technology of traditional data centers, local hot spots are prone to occur, affecting the heat exchange performance, and it is necessary to continuously reduce the air supply temperature and increase the air supply volume, affecting the cooling energy consumption. Therefore, the traditional air cooling mode is gradually limited in terms of heat exchange performance and energy consumption optimization.

[0003] Liquid cooling uses liquid cooling fluid to remove heat from heating components, replacing the air heat exchange mode used in air cooling. Liquid cooling technology can better support the cooling of high-power chips, keep the chips running at low temperatures, and extend their lifespan; make full use of outdoor natural cold sources for cooling, reduce the PUE of data centers; improve the heat exchange efficiency of key components, reduce server heat dissipation hotspots, and support higher cabinet density; reduce data center noise, and improve the environmental adaptability of data centers. It is an important technical direction for the construction of future computing power data centers.

[0004] At present, the single-phase cold plate liquid cooling technology using water as the working fluid is relatively mature, occupies less space, and has a certain single-point heat dissipation capacity. However, in the heat dissipation system using water as the working fluid, although there are a series of water treatment equipment in the system, there are still a large number of cold plate blockage and failure accidents; in addition, in order to avoid ice blockage of system pipes in winter, the cooling fluid is usually selected as deionized water or ethylene glycol / propylene glycol aqueous solution. If the cooling fluid and the cold plate material are not properly selected or maintained in the later stage, corrosion may occur after long-term operation, resulting in leakage of the cooling fluid, and the risk of burning the board or downtime. Therefore, with the further development of computing power chips and the safety guarantee of the high economic value of computing power chips, higher technical requirements are put forward for the heat dissipation technology and redundant safety design of liquid-cooled cold plate systems. Summary of the invention

[0005] The purpose of the present invention is to overcome the problems existing in the above-mentioned prior art and provide a high-redundancy liquid-cooled cold plate system suitable for the field of data center heat dissipation, so that it can effectively ensure the safe operation of computing facilities and data while serving the safe and efficient operation of high heat flux density electronic devices. The system not only has a high safety margin, but also has the advantages of strong heat dissipation capacity, compact structure, high temperature control accuracy, strong applicability, and a wide range of applications.

[0006] The technical solution of the present invention is as follows:

[0007] A high-redundancy liquid-cooled cold plate system, characterized in that: the system includes a heat plate, a cold plate group, a gas pipeline, a double-acting valve, a return gas main manifold, a condenser, a pump, a liquid pipeline, a liquid separation main manifold and a heat exchange fluid; includes at least one group of return gas main manifolds and liquid separation main manifolds; includes at least one cold plate group; the cold plate group is composed of at least two cold plates that are independently arranged crosswise, and the cold plates can be installed and maintained separately; the cold plate is an integrated structure consisting of a liquid inlet, a heat exchange branch, a return gas branch and a return gas manifold; the heat exchange The fluid enters from the liquid inlet of the cold plate, flows evenly into each heat exchange branch for heat absorption phase change, and after being transformed into a gaseous fluid, enters the return gas header through each return gas branch, and enters the return gas main header through the gas pipeline, double-acting valve one, gas soft connection pipeline, double-acting valve two, and then enters the condenser through the gas pipeline to condense into liquid heat exchange fluid, and enters the liquid distribution main header through the liquid pipeline under the push of the pump. After the heat exchange fluid is evenly distributed, it is transported to the cold plate through double-acting valve four, liquid soft connection pipeline, double-acting valve three, and liquid pipeline.

[0008] In the above technical solution, the heat spreader can be one or more of the highly thermally conductive materials selected from carbon fiber, graphene, silver, copper, and aluminum, or can be a heat pipe.

[0009] Preferably, the condenser may be an air-cooled condenser, a water-cooled condenser, or a combination thereof.

[0010] Preferably, the heat exchange fluid is a low boiling point fluid working medium, or a mixture of multiple low boiling point fluid working mediums, or a mixture of a low boiling point fluid working medium and nanoparticles.

[0011] Preferably, the pump is a high pressure resistant and leak-free mechanical pump or a piezoelectric pump.

[0012] Preferably, the double-acting valve is resistant to high pressure and has a quick connection function with a bidirectional closable function, and there is no leakage after connection.

[0013] Compared with the prior art, the present invention has the following advantages and outstanding technical effects: the present invention is closely combined with the safe operation and cooling needs of high-power computing chips in data centers, and through the ingenious design of the liquid-cooled cold plate structure, the redundant design of the chip-level cold plate is realized, and a new idea of ​​liquid cooling of computing chips is constructed, which solves the redundancy problem of the system during cabinet failure or operation and maintenance, and realizes the online maintenance of high heat flow computing systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a principle and structural schematic diagram of an embodiment of a high-redundancy liquid-cooled cold plate system provided by the present invention.

[0015] Figure 2 The diagram is a schematic diagram of the principle and structure of a cold plate embodiment of a high-redundancy liquid-cooled cold plate system provided by the present invention.

[0016] Figure 3 is Figure 1 Schematic diagram of the principle and structure of a system embodiment in which a cold plate is in direct contact with the chip.

[0017] In the figure: 1—chip; 2—heat sink; 3—cold plate group; 4—liquid distribution main header; 5—return air main header; 6—gas pipeline; 7—liquid pipeline; 8—condenser; 9—pump; 10—heat exchange fluid; 11—double-acting valve four; 12—double-acting valve three; 13—double-acting valve one; 14—double-acting valve two; 15—gas flexible connection pipeline; 16—liquid flexible connection pipeline; 310—cold plate one; 311—liquid inlet one; 312—heat exchange flow channel one; 313—return air branch one; 314—return air header one; 320—cold plate two; 321—liquid inlet two; 322—heat exchange flow channel two; 323—return air branch two; 324—return air header two. DETAILED DESCRIPTION

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0019] Figure 1 The schematic diagram of the principle and structure of a high-redundancy liquid-cooled cold plate system is shown in the figure. The system includes a heat plate, a cold plate group, a gas pipeline, a double-acting valve, a return gas main header, a condenser, a pump, a liquid pipeline, a liquid separation main header and a heat exchange fluid; includes at least one group of return gas main headers and liquid separation main headers; includes at least one cold plate group; the cold plate group is composed of at least two cold plates that are independently arranged crosswise, and the cold plates can be installed and maintained separately; the cold plate is an integrated structure consisting of a liquid inlet, a heat exchange branch, a return gas branch and a return gas header; the The heat exchange fluid enters from the liquid inlet of the cold plate, flows evenly into each heat exchange branch for heat absorption phase change, and after being converted into a gaseous fluid, enters the return gas header through each return gas branch, and enters the return gas main header through the gas pipeline, double-acting valve one, gas soft connection pipeline, double-acting valve two, and then enters the condenser through the gas pipeline to condense into liquid heat exchange fluid, and enters the liquid distribution main header through the liquid pipeline under the push of the pump. After the heat exchange fluid is evenly distributed, it is transported to the cold plate through double-acting valve four, liquid soft connection pipeline, double-acting valve three, and liquid pipeline.

[0020] The heat spreader may be one or more of the highly thermally conductive materials selected from the group consisting of carbon fiber, graphene, silver, copper, and aluminum, or may be a heat pipe.

[0021] The condenser can be an air-cooled condenser, a water-cooled condenser, or a combination thereof.

[0022] The heat exchange fluid is a low boiling point fluid working medium, or a mixture of multiple low boiling point fluid working mediums, or a mixture of a low boiling point fluid working medium and nanoparticles.

[0023] The pump is a high pressure resistant and leak-free mechanical pump or a piezoelectric pump.

[0024] The double-acting valve is high-pressure-resistant and has a quick-connection function with a bidirectional closable function, and has no leakage after connection.

[0025] Figure 2 This is a schematic diagram of the principle and structure of a cold plate embodiment of a high-redundancy liquid-cooled cold plate system provided by the present invention. The cold plate group is composed of at least two cold plates that are independently arranged crosswise. The liquid heat exchange fluid enters each heat exchange channel in the cold plate from the liquid inlet 1 of the cold plate, absorbs the heat of the chip in the heat exchange channel, and changes phase to become a gaseous heat exchange fluid. It passes through the return air branch connected to the end of the heat exchange channel and converges into the return air manifold. This embodiment is a cold plate group composed of two cold plates. Cold plate 1 and cold plate 2 are independent of each other and can be closely intertwined to form a complete cold plate. There is no cross-interference phenomenon in the pipeline in space. When cold plate 1 fails, only cold plate 1 needs to be disassembled for maintenance. Cold plate 2 provides heat dissipation for the entire chip through the uniform heat transfer effect of the heat spreader; when cold plate 2 fails, only cold plate 2 needs to be maintained. Cold plate 1 still provides heat dissipation for the entire chip through the uniform heat transfer effect of the heat spreader.

[0026] Figure 3 is Figure 1 The principle and structural diagram of the system embodiment in which the cold plate is directly in contact with the chip is shown in the figure. The cold plate group is directly installed in close contact with the chip. The cold plate group directly absorbs the heat of the chip to provide a suitable temperature environment for the stable operation of the chip. The operation principle and structure of the heat exchange fluid are similar to Figure 1 same.

Claims

1. A high-redundancy liquid-cooled cold plate system, characterized in that: The system includes a soaking plate, a cold plate group, a gas pipeline, a double-acting valve, a return gas main header, a condenser, a pump, a liquid pipeline, a liquid separation main header and a heat exchange fluid; includes at least one group of return gas main headers and liquid separation main headers; includes at least one cold plate group; the cold plate group is composed of at least two cold plates arranged independently and crosswise, and the cold plates can be installed and maintained separately; the cold plate is an integrated structure composed of a liquid inlet, a heat exchange branch, a return gas branch and a return gas header; the heat exchange fluid is transferred from the liquid inlet of the cold plate to the return gas branch; It enters from the inlet and flows evenly into each heat exchange branch for heat absorption phase change. After being transformed into a gaseous fluid, it enters the return gas header through each return gas branch, and enters the return gas main header through the gas pipeline, double-acting valve one, gas soft connecting pipeline, double-acting valve two, and then enters the condenser through the gas pipeline to be condensed into a liquid heat exchange fluid. It enters the liquid distribution main header through the liquid pipeline under the push of the pump. After the heat exchange fluid is evenly distributed, it is transported to the cold plate through double-acting valve four, liquid soft connecting pipeline, double-acting valve three, and liquid pipeline.

2. In a high-redundancy liquid-cooled cold plate system according to claim 1, it is characterized in that: The heat spreader may be one or more of the highly thermally conductive materials selected from the group consisting of carbon fiber, graphene, silver, copper, and aluminum, or may be a heat pipe.

3. A high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The condenser can be an air-cooled condenser, a water-cooled condenser, or a combination thereof.

4. The high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The heat exchange fluid is a low boiling point fluid working medium, or a mixture of multiple low boiling point fluid working mediums, or a mixture of a low boiling point fluid working medium and nanoparticles.

5. The high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The pump is a high pressure resistant and leak-free mechanical pump or a piezoelectric pump.

6. A high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The double-acting valve is high-pressure-resistant and has a quick-connection function with a bidirectional closable function, and has no leakage after connection.

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