Semiconductor spherical ice making equipment

Abstract

The invention relates to the field of ice making equipment, in particular to semiconductor spherical ice making equipment which comprises a cold conduction block and an upper cover, the cold conduction block is fixedly installed in an inner cavity of an inner container, the cold conduction block is attached to the cold face of a semiconductor chilling plate, and a radiator is attached to the hot face of the semiconductor chilling plate. A cooling fan is fixedly installed on a fin at one end of the radiator, a stirring motor is fixedly installed at the bottom end of the upper cover, a D-shaped shaft of the stirring motor is fixedly sleeved with a D-shaped hole sleeve of a stirring fan blade, a movable ice detecting blade is arranged on the stirring fan blade, a magnet is installed on the blade, and an ice full switch is installed on the upper cover. A lower mold core is attached to the top end of the cold conduction block, an upper mold core is fixedly installed at the bottom of the upper cover, and the lower mold core is matched with the upper mold core; when the ice maker is in use, due to the fact that refrigerating fluid is not needed for semiconductor refrigeration, environmental pollution possibly caused by a traditional refrigeration mode is avoided, and pollution-free ice making is achieved.

Description

Technical Field

[0001] The invention relates to the field of ice making equipment, in particular to a semiconductor spherical ice making equipment. Background Art

[0002] As the quality of life continues to improve, people's demand for ice cubes in drinking is increasing. Since ice machines can quickly produce a large number of ice cubes, they are faster and more efficient than traditional freezing methods, and are suitable for occasions that require a large number of ice cubes. In addition, ice machines can produce ice cubes of consistent size and shape. Ice machines can automatically complete the ice-making process, saving labor costs and time, resulting in a variety of ice machines on the market, including: bullet ice, chewable granular ice, cube ice, etc. After market research, people's requirements for ice cubes are getting higher and higher, requiring slow melting speed, no effect on the taste of the beverage, fast cooling speed, beautiful appearance, etc., and ice cubes in the shape of cubes have a smaller contact area with the beverage than spherical ice cubes of the same volume, and the cooling speed is slow and the maintenance time is short. Therefore, more ice cubes need to be added to the beverage, which greatly affects the taste of the beverage. Therefore, spherical ice cubes are becoming more and more popular in the market; the existing spherical ice production equipment The refrigeration system usually cools water through an evaporator to generate ice cubes, but these refrigeration components are large in size and heavy in weight, making them inconvenient to integrate into various miniaturized and portable devices; the existing ice-making technology also uses refrigerants to make ice, but when using refrigerants to make ice, it will cause greenhouse gas emissions (some refrigerants, such as Freon (CFCs) and hydrofluorocarbons (HFCs), are potent greenhouse gases that have a significant impact on climate change. They can stay in the atmosphere for a long time, leading to global warming.), damage to the ozone layer (some refrigerants such as Freon will decompose and release chlorine atoms after being released into the atmosphere. The presence of chlorine atoms will lead to the depletion of the ozone layer, thereby increasing ultraviolet radiation and posing a threat to the ecological environment and human health.), potential leakage (during the installation, maintenance or scrapping of the refrigeration system, the refrigerant may leak into the environment and cause pollution.) and other environmental problems. For this reason, we propose a semiconductor spherical ice making device. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor spherical ice making device, comprising a cooling block and an upper cover, wherein the cooling block is fixedly installed in the inner cavity of an inner tank, the cooling block fits the cold surface of a semiconductor refrigeration plate, the hot surface of the semiconductor refrigeration plate fits a radiator, a cooling fan is fixedly installed on the fins at one end of the radiator, a stirring motor is fixedly installed on the bottom end of the upper cover, a D-shaped hole sleeve of a stirring blade is fixedly sleeved on the D-shaped shaft of the stirring motor, a movable ice detection blade is provided on the stirring blade and a magnet is installed on the blade, an ice full switch is installed on the upper cover, the top end of the cooling block fits the lower mold core, the bottom of the upper cover is fixedly installed with an upper mold core, and the lower mold core matches the upper mold core.

[0004] Preferably: a cooling block sealing seat is provided between the cooling block and the inner tank, and the shape of the cooling block sealing seat matches the shape of the cooling block.

[0005] Preferably, thermally conductive silicone grease is applied on the cold surface of the semiconductor refrigeration sheet, and the thermally conductive silicone grease contacts the cooling block.

[0006] Preferably, thermal conductive silicone grease is applied on the hot surface of the semiconductor refrigeration plate, and the thermal conductive silicone grease contacts the heat sink.

[0007] Preferably, a front heat-insulating block of the inner liner is fixedly sleeved on the front end position of the outer side of the inner liner, and a rear heat-insulating block of the inner liner is fixedly sleeved on the rear end position of the outer side of the inner liner.

[0008] Preferably, a front air duct foam is fixedly sleeved on one side of the radiator, and a rear air duct foam is fixedly sleeved on the other side of the radiator.

[0009] Preferably: the upper cover is detachably mounted on the housing, an upper cover switch is mounted on the upper cover, a display panel is fixedly mounted on the top of the upper cover, and a display PCB board is mounted on the display panel.

[0010] Preferably, the semiconductor refrigeration plate is covered with refrigeration plate heat insulation cotton on the outside, and the top of the refrigeration plate heat insulation cotton fits the bottom of the inner tank.

[0011] Preferably, the shell is fixedly mounted on the top of the base, four groups of brackets are arranged inside the shell, and the four groups of brackets are all fixedly mounted on the base.

[0012] Preferably, an ambient temperature probe is installed on the inner wall of the shell, two groups of ventilation holes are opened on the shell, and a group of dustproof nets are fixedly installed at the two groups of ventilation holes.

[0013] Compared with the prior art, the present invention has the following beneficial effects: When the present invention is used, since semiconductor refrigeration does not require refrigerant, environmental pollution that may be caused by traditional refrigeration methods is avoided, and pollution-free ice making is achieved.

[0014] When the present invention is used, the semiconductor refrigeration element is small in size and light in weight, so it is easy to be integrated into various miniaturized and portable devices, thereby realizing the miniaturization of the device.

[0015] When the present invention is in use, the stirring motor drives the stirring blades to rotate, and the rotation of the stirring blades can stir the water in the mold, thereby turning on the stirring function; the stirring function is adopted, non-full-area contact and software control, and the water in the mold is stirred during the ice-making process, combined with directional refrigeration from bottom to top, combined with different protrusion shapes (ring-shaped, lattice) at the bottom of the lower mold core made of silicone material, so that the cold amount is not fully extracted, and at the same time combined with the control board to control the semiconductor refrigeration plate to exert corresponding power under different ambient temperatures, thereby expelling the air in the water, making transparent ice, and thereby improving the quality of the ice balls.

[0016] When the present invention is in use, the movable blades on the stirring fan blades are used to detect the ice ball during the rotation process. When the ice ball protrudes, the blades are blocked and approach the ice full switch, so that the ice is full. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an exploded view of the structure of the present invention; Figure 2 It is the structural appearance diagram of the present invention; Figure 3 It is a cross-sectional view of the structure of the present invention.

[0018] In the figure: 1. cooling block; 2. inner tank; 3. sealing seat of cooling block; 4. semiconductor cooling sheet; 5. radiator; 6. cooling fan; 7. insulation block in front of inner tank; 8. insulation block in rear of inner tank; 9. foam in front air duct; 10. foam in rear air duct; 11. upper cover; 12. stirring motor; 13. stirring fan blades; 14. full ice switch; 15. lower mold core; 16. upper mold core; 17. outer shell; 18. upper cover switch; 19. display panel; 20. cooling sheet insulation cotton; 21. base; 22. bracket; 23. ambient temperature probe; 24. vent; 25. dust net. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1 - Figure 3, the figure shows a semiconductor spherical ice making device of the present invention, comprising a cooling block 1 and an upper cover 11, wherein the cooling block 1 is fixedly installed in the inner cavity of the inner tank 2, the cooling block 1 is attached to the cold surface of the semiconductor refrigeration sheet 4, the hot surface of the semiconductor refrigeration sheet 4 is attached to the radiator 5, a cooling fan 6 is fixedly installed on the fins at one end of the radiator 5, a stirring motor 12 is fixedly installed on the bottom end of the upper cover 11, a D-shaped hole sleeve of a stirring blade 13 is fixedly sleeved on the D-shaped shaft of the stirring motor 12, a movable ice detection blade is arranged on the stirring blade 13 and a magnet is installed on the blade, an ice full switch 14 is installed on the upper cover 11, the top of the cooling block 1 is attached to the lower mold core 15, the bottom of the upper cover 11 is fixedly installed with an upper mold core 16, and the lower mold core 15 matches the upper mold core 16; A cooling block sealing seat 3 is provided between the cooling block 1 and the inner tank 2, and the shape of the cooling block sealing seat 3 matches the shape of the cooling block 1. During the ice making process, the cooling block sealing seat 3 is used to seal the cooling block 1 and the inner tank 2 to prevent condensation water generated during ice making from leaking into the inner tank 2. The cooling block 1 is made of aluminum alloy and has good thermal conductivity, and can effectively conduct heat. Therefore, it is used in cooling systems or radiators in some applications.

[0021] Thermal grease is applied on the cold surface of the semiconductor refrigeration sheet 4, and the thermal grease contacts the cooling block 1; by applying thermal grease on the cold surface of the semiconductor refrigeration sheet 4, the conduction efficiency between the semiconductor refrigeration sheet 4 and the cooling block 1 can be increased.

[0022] Thermal grease is applied on the hot surface of the semiconductor refrigeration sheet 4 , and the thermal grease contacts the heat sink 5 . By applying thermal grease on the hot surface of the semiconductor refrigeration sheet 4 , the conduction efficiency between the semiconductor refrigeration sheet 4 and the heat sink 5 can be increased.

[0023] A front liner insulation block 7 is fixedly sleeved on the front end position of the outer side of the inner liner 2, and a rear liner insulation block 8 is fixedly sleeved on the rear end position of the outer side of the inner liner 2; the front liner insulation block 7 and the rear liner insulation block 8 are both made of EPS foam material. EPS foam is a thermoplastic material, containing 3 million to 6 million independent closed bubbles per cubic meter, and the volume of air contained is more than 98%. Since the thermal conductivity of air is very small and it is enclosed in the foam plastic and cannot convect, EPS is a material with very good thermal insulation properties. The outer side of the inner liner 2 is wrapped by the front liner insulation block 7 and the rear liner insulation block 8 made of EPS foam material, which can achieve a good insulation effect.

[0024] A front air duct foam 9 is fixedly sleeved on one side of the radiator 5, and a rear air duct foam 10 is fixedly sleeved on the other side of the radiator 5; the front air duct foam 9 and the rear air duct foam 10 are both made of EPS foam. EPS foam is a thermoplastic material, containing 3 million to 6 million independent closed bubbles per cubic meter, and the volume of the air contained is more than 98%. Since the thermal conductivity of air is very small and it is enclosed in the foam plastic and cannot convect, EPS is a material with very good thermal insulation properties. By respectively sleeved the front air duct foam 9 and the rear air duct foam 10 on both sides of the radiator 5, an air duct is formed.

[0025] The upper cover 11 is detachably mounted on the outer shell 17, an upper cover switch 18 is mounted on the upper cover 11, a display panel 19 is fixedly mounted on the top of the upper cover 11, and a display PCB board is mounted on the display panel 19; by installing the display panel 19 and installing the display PCB board on the display panel 19, it is convenient for operators to understand the working status of the device; the upper cover switch 18 is mounted on the upper cover 11, and the upper cover switch 18 is a magnetic switch, and the upper cover 11 can be opened or closed by controlling the upper cover switch 18.

[0026] The semiconductor refrigeration sheet 4 is sheathed with refrigeration sheet insulation cotton 20 on the outside, and the top of the refrigeration sheet insulation cotton 20 fits the bottom of the inner liner 2; the semiconductor refrigeration sheet 4 is sheathed with refrigeration sheet insulation cotton 20, and the top of the refrigeration sheet insulation cotton 20 fits the bottom of the inner liner 2, so that the heat generated by the hot surface of the semiconductor refrigeration sheet 4 can be separated from the inner liner 2 by the refrigeration sheet insulation cotton 20, preventing the heat generated by the hot surface of the semiconductor refrigeration sheet 4 from being transferred to the inner liner 2, and the refrigeration sheet insulation cotton 20 is made of EPDN material. EPDN (ethylene-propylene-diene copolymer, Ethylene Propylene Diene Monomer) does have a certain thermal insulation function. Due to its good elasticity, heat resistance and weather resistance, EPDN is often used in applications that require thermal insulation protection, such as building materials, automotive interior insulation, etc. In addition, the structure of EPDN enables it to slow down heat conduction to a certain extent, thereby providing a certain thermal insulation effect.

[0027] The shell 17 is fixedly mounted on the top of the base 21, and four groups of brackets 22 are arranged in the shell 17, and the four groups of brackets 22 are all fixedly mounted on the base 21; the four groups of brackets are all made of T=1.0 galvanized sheet material, and the shell 17 is made of T=0.5 vertical brushed stainless steel. The four groups of brackets 22 are used in coordination with the shell 17 for support, and the structures such as the front insulation block 7 of the inner tank, the rear insulation block 8 of the inner tank, the front air duct foam 9, the rear air duct foam 10, the radiator 5 in the inner cavity of the shell 17 are all connected with the four groups of brackets 22, thereby making the installation structure of each component inside the shell 17 stable.

[0028] An ambient temperature probe 23 is installed on the inner wall of the shell 17, and two groups of ventilation holes 24 are provided on the shell 17, and a group of dustproof nets 25 are fixedly installed at the two groups of ventilation holes 24; during the use of the device, the ambient temperature probe 23 allows the operator to timely understand the temperature changes inside the device; the two groups of ventilation holes 24 provided on the shell 17 are used in conjunction with the air duct (the front air duct foam 9 and the rear air duct foam 10 are combined to form an air duct) to form a heat dissipation channel for the heat generated by the hot surface of the semiconductor refrigeration plate 4; a group of dustproof nets 25 are respectively installed at the two groups of ventilation holes 24, and the dustproof nets 25 can prevent external dust from entering the inner cavity of the shell 17. It should be noted that the two groups of dustproof nets 25 need to be cleaned regularly to prevent the dustproof nets 25 from being blocked by dust, thereby affecting normal heat dissipation.

[0029] Working principle of the present invention: When the device is in use, the upper cover 11 can be opened by controlling the upper cover switch 18, and then the operator can add an appropriate amount of water between the lower mold core 15 and the upper mold core 16. (It should be noted that the lower mold core 15 and the upper mold core 16 are both prior art and will not be described in detail here. By using the lower mold core 15 and the upper mold core 16 together, a number of spherical cavities will be formed between the lower mold core 15 and the upper mold core 16, as shown in the attached Figure 3 As shown.) After the water is added, the upper cover 11 is closed again, and the semiconductor refrigeration sheet 4 is started. Since the cold surface of the semiconductor refrigeration sheet 4 is in contact with the cooling block 1, and the top of the cooling block 1 is in contact with the lower mold core 15, under the action of the semiconductor refrigeration sheet 4, the water stability between the lower mold core 15 and the upper mold core 16 is continuously reduced and gradually turns into ice; in the process of making ice, the hot surface of the semiconductor refrigeration sheet 4 will generate heat. Since the hot surface of the semiconductor refrigeration sheet 4 is in contact with the radiator 5, and the fins at one end of the radiator 5 are fixedly mounted with a cooling fan 6, the cooling fan 6 can be started at this time, so as to accelerate the flow of air in the heat dissipation duct. The heat dissipation duct is formed by the cooperation of two sets of vents 24 opened on the outer shell 17 and the air duct (the front air duct foam 9 and the rear air duct foam 10 are combined to form the air duct). The accelerated flow of air in the heat dissipation duct The stirring motor 12 is started to drive the stirring blade 13 to rotate, and the stirring blade 13 can stir the water in the mold, and the directional refrigeration from bottom to top is combined with the different protrusion shapes (ring, lattice) at the bottom of the lower mold core 16 of silicone material, so that the cold amount is not fully extracted, and the control board is combined with different ambient temperatures to control the semiconductor refrigeration plate 4 to exert the corresponding power, so as to discharge the air in the water and make transparent ice; and there is an active ice-detecting blade on the stirring blade 13. When the blade touches the ice ball protrusion, the blade rotates, and the magnet on the blade approaches the ice full switch, the switch closes and provides a signal, thereby judging that the ice is full.

[0030] The above content is a further detailed description of the present invention in combination with specific implementation methods. It cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as belonging to the scope of protection determined by the claims submitted for the present invention.

Claims

1. A semiconductor spherical ice making device, comprising a cooling block (1) and an upper cover (11), characterized in that: The cooling block (1) is fixedly installed in the inner cavity of the inner tank (2), the cooling block (1) is attached to the cold surface of the semiconductor cooling plate (4), the hot surface of the semiconductor cooling plate (4) is attached to the radiator (5), a cooling fan (6) is fixedly installed on the fins at one end of the radiator (5), a stirring motor (12) is fixedly installed on the bottom end of the upper cover (11), a D-shaped hole sleeve of the stirring blade (13) is fixedly sleeved on the D-shaped shaft of the stirring motor (12), a movable ice detection blade is provided on the stirring blade (13) and a magnet is installed on the blade, an ice full switch (14) is installed on the upper cover (11), the top end of the cooling block (1) is attached to the lower mold core (15), the bottom of the upper cover (11) is fixedly installed with an upper mold core (16), and the lower mold core (15) and the upper mold core (16) match.

2. A semiconductor spherical ice making device according to claim 1, characterized in that: A cooling block sealing seat (3) is provided between the cooling block (1) and the inner tank (2), and the shape of the cooling block sealing seat (3) matches the shape of the cooling block (1).

3. The semiconductor spherical ice making device according to claim 1, characterized in that: Thermally conductive silicone grease is applied to the cold surface of the semiconductor refrigeration sheet (4), and the thermally conductive silicone grease contacts the cooling block (1).

4. The semiconductor spherical ice making device according to claim 1, characterized in that: Thermally conductive silicone grease is applied to the hot surface of the semiconductor cooling sheet (4), and the thermally conductive silicone grease contacts the heat sink (5).

5. The semiconductor spherical ice making device according to claim 1, characterized in that: A front liner heat-insulating block (7) is fixedly sleeved on the front end of the outer side of the inner liner (2), and a rear liner heat-insulating block (8) is fixedly sleeved on the rear end of the outer side of the inner liner (2).

6. The semiconductor spherical ice making device according to claim 1, characterized in that: A front air duct foam (9) is fixedly sleeved on one side of the radiator (5), and a rear air duct foam (10) is fixedly sleeved on the other side of the radiator (5).

7. The semiconductor spherical ice making device according to claim 1, characterized in that: The upper cover (11) is detachably mounted on the outer shell (17); an upper cover switch (18) is mounted on the upper cover (11); a display panel (19) is fixedly mounted on the top of the upper cover (11); and a display PCB board is mounted on the display panel (19).

8. The semiconductor spherical ice making device according to claim 1, characterized in that: The semiconductor refrigeration sheet (4) is covered with refrigeration sheet heat insulation cotton (20) on the outside, and the top end of the refrigeration sheet heat insulation cotton (20) is in contact with the bottom of the inner liner (2).

9. The semiconductor spherical ice making device according to claim 7, characterized in that: The housing (17) is fixedly mounted on the top of the base (21); four groups of brackets (22) are arranged inside the housing (17); and the four groups of brackets (22) are all fixedly mounted on the base (21).

10. The semiconductor spherical ice making device according to claim 7, characterized in that: An ambient temperature probe (23) is installed on the inner wall of the housing (17), and two groups of ventilation holes (24) are provided on the housing (17). A group of dustproof nets (25) are fixedly installed at each of the two groups of ventilation holes (24).

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