A spring pin micro-metal composite structure high-frequency test socket

Abstract

The present application discloses a spring pin micro-metal combination structure high-frequency test seat, which belongs to the field of chip testing technology. It mainly includes a base; at least two groups of test interfaces, the test interface includes a silicone tube arranged in the base, and the interior of the silicone tube is hollow; metal particles, the metal particles are filled in the silicone tube; a first spring, the first spring is arranged in the silicone tube, and the two ends of the first spring are respectively connected to the top and bottom of the silicone tube. A spring pin micro-metal combination structure high-frequency test seat of the present application is provided with a first spring pin, a second spring pin and a first spring, which and the metal micro-particles are arranged in the silicone tube. During the chip testing process, after the silicone tube is squeezed, the first spring will be squeezed and compressed, and the first spring pin and the second spring pin will contact each other to achieve conductivity. The first spring compensates for the elastic force of the silicone tube, delaying the elastic fatigue of the silicone tube in the test interface of the chip test seat.

Description

Technical Field

[0001] The present application relates to the technical field of chip testing, and in particular to a high-frequency test socket with a spring pin micro-metal combination structure. Background Art

[0002] The spring pin and micro-metal combination structure is a new type of connection structure, which is mainly used in the field of chip testing. During the chip testing process, the spring pin and micro-metal combination structure is used to connect with the chip and the test circuit board to realize electrical signal transmission. Its function is similar to that of a probe card. The spring pin and micro-metal combination structure high-frequency test seat applies the spring pin and micro-metal combination structure to the chip test seat, which is particularly suitable for testing chips of limited size. Through the ultra-flat design of the spring pin, the chip is connected to the test circuit board in a limited space to realize the sensing and transmission of micro-current.

[0003] Existing high-frequency test sockets for chip testing usually consist of a test base and a test part arranged on the test base. A flexible test probe is installed in the test part, and metal microparticles are arranged in the test probe. During the test, the metal microparticles are squeezed through the flexible test probe, and the particles contact each other to achieve conductivity, so as to test the chip.

[0004] The above-mentioned device squeezes the metal microparticles through a flexible test probe to achieve conductivity of the test part, but since the metal microparticles are arranged in the flexible test probe, their mutual contact often only relies on the flexible test probe, and since the chip test is repeated many times, and each time the chip is tested, the test probe will be squeezed and then relaxed until it returns to its initial state, and then after the test probe has been tested for many times, the flexible body made of silicone will have a certain elastic fatigue, and the fatigued test probe may no longer have an extrusion effect on the metal particles inside it after being squeezed, so that the chip test may have poor contact, so it is necessary to provide a spring pin micro-metal combination structure high-frequency test socket to solve the above problems.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a high-frequency test socket with a spring pin micro-metal combination structure, which solves the problem that the chip test interface suffers from elastic fatigue after multiple measurements, thereby causing poor contact.

[0007] The technical solution adopted by the present application to solve its technical problems is: a spring pin micro-metal composite structure high-frequency test socket, including a base; at least two groups of test interfaces, the test interface includes a silicone tube arranged in the base, the interior of the silicone tube is hollow; metal particles, the metal particles are filled in the silicone tube, the silicone tube is also filled with a second silicone, the second silicone and the metal particles are mixed; a first spring, the first spring is arranged in the silicone tube, the two ends of the first spring are respectively connected to the top and the bottom of the silicone tube; a first spring pin, the first spring pin is arranged at the upper end of the silicone tube, one end of the first spring pin protrudes from the silicone tube and extends to the outside of the base; a second spring pin, the second spring pin is arranged below the first spring pin; a connecting tube, the connecting tube is fixedly connected to the bottom of the second spring pin, the connecting tube is located on the outside of the silicone tube, the interior of the connecting tube is hollow and has an opening; a test head, the test head is installed in the connecting tube, and one end of the test head protrudes from the connecting tube.

[0008] Furthermore, a contact step is provided on one side of the connecting cylinder close to the second spring needle, and limit chambers are provided on both sides of the bottom of the connecting cylinder. A limit pin is slidably installed in the limit chamber, a first inclined surface is provided at the bottom end of the limit pin, and a limit surface is provided at the upper end of the limit pin; a second spring is fixedly installed on the side away from the limit pin, and the other end of the second spring is fixedly connected to the inner wall of the limit chamber.

[0009] Furthermore, the test head includes a cone arranged at the bottom of the connecting tube, the cone includes a cylinder close to the connecting tube and a pointed cone fixedly installed at the bottom of the cylinder, an upper connector is integrally arranged above the cylinder, the outer diameter of the upper connector is smaller than the outer diameter of the cylinder and forms a placement step, a first ring is fixedly installed on the top of the upper connector, the outer diameter of the first ring is adapted to the inner diameter of the connecting tube, a second ring is slidably installed on the surface of the upper connector, and the second ring is located on the placement step.

[0010] Furthermore, the outer diameter of the second ring is the same as the outer diameter of the first ring, the first ring is provided with a second inclined surface, the bottom of the first ring is provided with a first contact surface, and the top of the second ring is provided with a second contact surface.

[0011] Furthermore, at least two groups of spring holes are formed at the bottom of the first ring, a fourth spring is fixedly installed in the spring holes, and the other end of the fourth spring is fixedly connected to the top of the second ring.

[0012] Furthermore, a storage assembly is provided on one side of the test interface, and the storage assembly includes a movable pin arranged in the base, a movable groove is provided in the base, the movable pin is located in the movable groove, an upper connecting pin is fixedly connected to the top of the movable pin, the outer diameter of the upper connecting pin is smaller than the outer diameter of the movable pin, a first cavity is provided on the base, the upper connecting pin is located in the first cavity, a pressing end is provided on the top of the upper connecting pin, a third spring is fixedly installed on the bottom of the pressing end, the other end of the third spring is fixedly connected to the bottom of the first cavity, and the elastic force of the third spring is greater than the elastic force of the fourth spring; a lower connecting pin is fixedly installed on the bottom of the movable pin, the lower connecting pin is located in the storage cavity, a storage plate is fixedly installed on the bottom of the lower connecting pin, a storage hole is provided on the side of the storage plate away from the lower connecting pin, and a storage ring is also provided on the storage plate, the storage ring is located at the position of the storage hole, and the outer diameter of the storage ring is smaller than the outer diameter of the second ring.

[0013] Furthermore, a limiting groove is provided on the surface of the movable pin, and a supporting member is fixedly installed in the base, the limiting groove includes a first channel provided on the movable pin, one end of the supporting member is supported in the first channel to form a supporting portion, and the supporting portion is made of rubber; a second channel is provided at the end of the first channel, a vertical angle is formed between the second channel and the first channel, a groove bottom height of the second channel is lower than a groove bottom height of the first channel and a first step is formed, and a first stationary point is provided at the same position as the first channel and the second channel.

[0014] Furthermore, a third channel is provided at the end of the second channel, the highest position of the third channel is higher than the horizontal height position of the first stagnation point, and the groove bottom position of the second channel is higher than the groove bottom position of the third channel to form a second step.

[0015] Furthermore, a first node and a second node are respectively provided at the lower end of the third channel.

[0016] Furthermore, a fourth channel is arranged on the top of the third channel, a second stagnation point is arranged at the position where the fourth channel communicates with the third channel, the length of the fourth channel is greater than the length of the second channel, a fifth channel is arranged at the end of the fourth channel, the end of the fifth channel is communicated with the first channel, a transition slope is arranged at the end position of the fifth channel, the highest position of the transition slope is higher than the bottom position of the groove of the first channel and forms a transition step.

[0017] The beneficial effect of the present application is as follows: the present application provides a spring pin micro-metal combination structure high-frequency test socket, which is provided with a first spring pin, a second spring pin and a first spring, and the first spring and the metal micro-particles are arranged in a silicone tube. During the chip testing process, after the silicone tube is squeezed, the first spring will also be squeezed and compressed, and the first spring pin and the second spring pin will contact each other to achieve conductivity. The elastic force of the silicone tube is compensated by the first spring, thereby delaying the elastic fatigue of the silicone tube in the test interface of the chip test socket, thereby extending the service life of the spring pin micro-metal combination structure high-frequency test socket.

[0018] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 This is an overall schematic diagram of a spring pin micro-metal composite structure high-frequency test socket in this application;

[0021] Figure 2 for Figure 1 Bottom view of the overall structure;

[0022] Figure 3 for Figure 1 The overall structure in the middle is used in conjunction with other test structures during chip testing;

[0023] Figure 4 for Figure 1 Schematic diagram of the overall structure after the partial structure section;

[0024] Figure 5 for Figure 4 Schematic diagram of the overall structure of the middle silicone tube after sectioning;

[0025] Figure 6 for Figure 5 A magnified view of the structure of the middle A area;

[0026] Figure 7 for Figure 5 The overall structure diagram after the test head is installed;

[0027] Figure 8 for Figure 7 A magnified view of the structure of the middle B region;

[0028] Fig. 9 for Figure 5 The overall structure is cut away from the rear side view;

[0029] Fig.10 for Fig. 9 A magnified view of the structure of the middle C region;

[0030] Figure 11-13 for Fig. 9 Schematic diagram of the movement process of the test head structure and the storage component structure.

[0031] Among them, the reference numerals in the figure are:

[0032] 1. Base; 2. Test interface; 21. Silicone tube; 22. First spring; 23. First spring pin; 24. Second spring pin; 25. Connecting tube; 26. Limit pin; 261. First inclined surface; 27. Second spring; 28. Limit chamber; 29. ​​Contact step;

[0033] 3. Storage assembly; 31. Movable pin; 32. Upper connecting pin; 33. Third spring; 34. Lower connecting pin; 35. Storage plate; 351. Storage ring; 4. Plug-in seat; 41. Plug-in chamber; 5. Packaging plate;

[0034] 6. Test head; 61. Cone; 62. First ring; 621. Second inclined surface; 63. Second ring; 64. Upper connector; 65. Fourth spring;

[0035] 7. Limiting groove; 71. First channel; 72. Second channel; 73. Third channel; 731. First node; 732. Second node; 74. Fourth channel; 75. Fifth channel; 76. First stationary point; 77. Second stationary point; 78. Third stationary point; 8. Abutting member; 81. Abutting portion. DETAILED DESCRIPTION

[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0038] Embodiment 1: This embodiment mainly introduces the basic structure and working principle of the spring pin micro-metal combination structure high frequency test socket, specifically:

[0039] like Figure 1-Figure 2As shown, the present application provides a spring pin micro-metal combination structure high-frequency test socket, including a base 1, the base 1 is the chip test socket body, and a plurality of test interfaces 2 are arranged on the base 1, the test interface 2 is mainly used to connect with the chip and the circuit board to facilitate the chip test;

[0040] like Figure 1 , Figure 4 As shown, the test interface 2 includes a silicone tube 21 disposed in the base 1. The interior of the silicone tube 21 is hollow, and the silicone tube 21 is mainly made of silicone and has a certain elasticity. In the initial state, the silicone tube 21 is in an insulating state. When the silicone tube 21 is squeezed by an external force, it will be compressed. When the external force is released, the silicone tube 21 will reset under the action of its own elastic force.

[0041] The silicone tube 21 is filled with metal particles (not shown in the figure), and the silicone tube 21 is also filled with a second silicone with higher strength (not shown in the figure). The second silicone is mixed with the metal particles. In the initial state, there is a certain gap between the metal particles. At this time, the silicone tube 21 is in an insulating state. When the silicone tube 21 is squeezed, the second silicone is squeezed synchronously, so that the metal particles mixed with the second silicone will contact each other under the action of pressure to achieve a conductive effect. In this way, it is only necessary to set a protruding end at each end of the silicone tube 21, and the protruding end extends to the outside of the base 1. When testing, it is only necessary to squeeze the protruding end to achieve the effect of squeezing the silicone tube 21, thereby realizing the conductivity of the test interface 2;

[0042] Combination Figure 3 As shown, a socket 4 and a packaging board 5 are provided on one side of the base 1. In this embodiment, the socket 4 is a chip testing device, and the packaging board 5 is a circuit board. A plug-in chamber 41 is provided on the socket 4. The base 1 can be fixed in the plug-in chamber 41 by fasteners and other locking parts. It should be noted that in order to facilitate the test of the chip, the base 1 can be moved up and down by a certain distance after being fixed by fasteners, so as to contact with the chip;

[0043] At the beginning of the experiment, the staff can fix the chip in the plug-in chamber 41 with the contact surface of the chip facing upwards, and then fix the base 1 in the installation chamber through fasteners. After the fixing is completed, the staff covers the packaging plate 5 on the base 1. When the chip needs to be tested, the staff only needs to press down the packaging plate 5. The pressed packaging plate 5 contacts the base 1 and exerts an extrusion effect on the protruding end of the silicone tube 21. The silicone tube 21 will be compressed after being squeezed, and the second silicone inside it will be compressed synchronously. The metal particles change from the initial separation state to the state of contacting each other. At this time, the base 1 and the packaging plate 5 are in a conductive state. At the same time, the downward movement of the packaging plate 5 generates a certain pressure on the base 1. The base 1 moves downward synchronously, and the other end of the silicone tube 21 contacts the chip. At this time, the two ends of the test interface 2 are in contact with the chip and the packaging plate 5 respectively, and the metal particles inside it are in contact with each other, achieving a conductive effect, so as to test the chip;

[0044] However, after multiple measurements, the silicone tube 21 and the second silicone will produce elastic fatigue after multiple extrusions. In order to solve this problem, Figure 1 , Figure 4-Figure 5 As shown, firstly, in order to avoid the protruding end of the silicone tube 21 from having poor contact with the outside, in this embodiment, the silicone tube 21 is set as a cylindrical body, which is completely in the base 1, and how the silicone tube 21 is connected to the external chip and circuit board is described below;

[0045] A first spring 22 is arranged inside the silicone tube 21, and the two ends of the first spring 22 are respectively connected to the top and the bottom of the silicone tube 21. When the silicone tube 21 is squeezed, the first spring 22 is squeezed synchronously. A first spring needle 23 is arranged at the upper end of the silicone tube 21. The first spring needle 23 is divided into a first needle body arranged inside the silicone tube 21 and a first needle head arranged outside the silicone tube 21. The first needle head extends outside the base 1, which replaces the protruding end of the silicone tube 21 mentioned above. At the same time, the first needle body is connected to the first spring 22. When the first spring 22 is squeezed, it drives the first needle body to move;

[0046] A second spring needle 24 is arranged below the first spring needle 23. In this embodiment, the first spring needle 23 and the second spring needle 24 are made of metal material, which has a certain conductivity. The second spring needle 24 is mainly composed of a second needle body arranged in the silicone tube 21. The second needle body and the first needle body are staggered. In the initial state, the first needle body and the second needle body are not in contact with each other. When the first spring 22 is squeezed, the first needle body and the second needle body contact each other under the action of the first spring 22 to conduct electricity.

[0047] It should be noted that, while the first spring 22, the first spring needle 23 and the second spring needle 24 are arranged in the silicone tube 21, the remaining space inside the silicone tube 21 is filled with mixed second silicone and metal particles, so that when the silicone tube 21 is squeezed, not only the first spring 22 will be squeezed, but also the second silicone and the metal particles will be squeezed, further reducing the risk of disconnection of the test interface 2;

[0048] In this embodiment, by arranging the first spring 22, the first spring needle 23 and the second spring needle 24 in the silicone tube 21, when the silicone tube 21 is squeezed, the first spring 22 is squeezed synchronously, and the metal particles mixed in the silicone tube 21 are supplemented with elastic force for a second time, so that the contact of the metal particles is closer, and the risk of disconnection of the test interface 2 is reduced. Secondly, when the silicone tube 21 is subjected to a strong pressure, the first spring 22 can absorb the pressure, so as to avoid the silicone tube 21 being subjected to excessive pressure and requiring a longer time to recover, and to a certain extent prolong the service life of the silicone tube 21, so that the high-frequency test socket with a spring needle micro-metal composite structure is more durable;

[0049] In order to facilitate the connection between the second spring pin 24 and the chip, as shown in FIG. Figure 5-Figure 7 As shown, one end of the second needle body extends to the outside of the silicone tube 21 and is fixedly installed with a connecting tube 25, and a test head 6 is fixedly connected in the connecting tube 25. In this embodiment, the test head 6 has the same effect as the first needle head. The test head 6 is made of metal material and has a certain conductivity. One end of the test head protrudes from the silicone tube 21 and is mainly used to contact the chip to achieve a conductive effect.

[0050] When performing chip testing (this process can be combined with the chip testing process mentioned above for reference), after the staff presses down the packaging plate 5, the packaging plate 5 contacts the first needle head and generates pressure on it. After the first needle head is pressed, it squeezes the silicone tube 21. The silicone tube 21 is pressed so that the first spring 22 is pressed. At the same time, the second silicone mixed inside is pressed, and the metal particles change from a separated state to a state of contact with each other. At the same time, the first spring 22 is pressed and drives the first needle body to move downward. The first needle body and the second needle body contact each other, so that the first spring needle 23 and the second spring needle 24 contact each other. At this time, the test interface 2 is in a conductive state;

[0051] After being pressed down, the packaging board 5 generates pressure on the base 1, and the base 1 moves downward, and at the same time, the test head 6 moves downward, and the test head 6 contacts the chip in the plug-in chamber 41. At this time, the two ends of the test interface 2 contact the chip and the circuit board respectively, and the metal particles are in contact with each other. At the same time, the first spring needle 23 and the second spring needle 24 contact each other, achieving a conductive effect, thereby realizing the test of the chip.

[0052] Embodiment 2: In the above embodiment, by arranging the first spring 22, the first spring needle 23 and the second spring needle 24 in the silicone tube 21, the elastic force of the silicone tube 21 can be compensated during chip testing, thereby reducing the risk of disconnection of the test interface 2 and extending its service life. However, in order to facilitate the contact between the test interface 2 and the chip, the test head 6 always extends to the outside of the base 1. In this way, before the test starts, if the base 1 is squeezed or collided, the test head 6 is likely to be damaged. When the test head 6 is damaged, it will be more cumbersome to replace the test head 6 due to the fixed connection setting.

[0053] In order to solve this problem, the test head 6 is changed to a quick-release type in this embodiment without affecting the normal chip test. Specifically: Figure 4-Figure 6 As shown, the interior of the connecting tube 25 is hollow, and an opening is provided at one end away from the silicone tube 21, and the opening is convenient for installing the test head 6. A contact step 29 is provided on one side of the connecting tube 25 close to the second spring pin 24. The contact step 29 is made of metal material and has conductivity. When the test head 6 contacts the contact step 29, it means that the test head 6 contacts the second spring pin 24.

[0054] A limit chamber 28 is provided on both sides of the bottom of the connecting tube 25, and a limit pin 26 is slidably installed in the limit chamber 28. It should be noted that a first inclined surface 261 is provided at the bottom end of the limit pin 26, and a horizontal limit surface is provided at the upper end of the limit pin 26. When the test head 6 moves from bottom to top, the top of the test head 6 will preferentially contact the first inclined surface 261. A second spring 27 is fixedly installed on one side of the limit pin 26 that is away from each other, and the other side of the second spring 27 is in contact with the limit The inner wall of the limiting chamber 28 is fixedly connected, so that when the limiting pin 26 is squeezed, it will slide into the limiting chamber 28, and the second spring 27 will be compressed. When the external force is released, the limiting pin 26 will be reset under the action of the second spring 27. It should be noted that in the initial state, one end of the limiting pin 26 is already outside the limiting chamber 28, and a small part of the limiting pin 26 is still inside the limiting chamber 28, so that when the limiting pin 26 moves, it will not fall out of the limiting chamber 28;

[0055] like Figure 7-Figure 8As shown, the test head 6 includes a cone 61 arranged at the bottom of the connecting tube 25, and the cone 61 is mainly composed of a cylinder close to one side of the connecting tube 25 and a pointed cone fixedly installed at the bottom of the cylinder. When the chip is tested, the pointed cone is mainly in contact with the chip. An upper connector 64 is fixedly arranged above the cylinder. The outer diameter of the upper connector 64 is smaller than the outer diameter of the cylinder and forms a placement step (not shown in the figure). At the same time, a first ring 62 is fixedly installed on the top of the upper connector 64. The outer diameter of the first ring 62 is adapted to the inner diameter of the connecting tube 25, and a second inclined surface 621 used in conjunction with the first inclined surface 261 is arranged on the first ring 62. A horizontal first contact surface is arranged at the bottom of the first ring 62, and the first contact surface is mainly used in conjunction with the limit surface.

[0056] Continue to refer Figure 8 A second ring 63 is slidably mounted on the surface of the upper connector 64. The outer diameter of the second ring 63 is the same as that of the first ring 62, and a second contact surface is arranged on the top of the second ring 63. The second contact surface is also arranged horizontally and is mainly used in conjunction with the first contact surface. In the initial state, due to the action of gravity, the second ring 63 falls freely onto the placement step. At this time, there is a certain distance between the second ring 63 and the first ring 62. When subjected to external force, the second ring 63 is suitable for moving upward. When the first contact surface and the second contact surface are in contact with each other, the first ring 62 and the second ring 63 are closest to each other.

[0057] Before the test starts, the test head 6 has not been installed in the connecting tube 25. At this time, personnel are required to install the test head 6. During the installation, the staff only needs to hold the pointed cone of the test head 6, align the upper connecting body 64 with the connecting tube 25 and push it in. During the upward movement of the test head 6, the second inclined surface 621 contacts the first inclined surface 261 first and produces an extrusion effect on it. The limiting pin 26 is retracted into the limiting chamber 28 under the extrusion of the first ring 62. When the first ring 62 completely enters the connecting tube 25, the first ring 62 is pressed into the limiting chamber 28. The ring 62 is separated from the limit pin 26. At this time, under the action of the second spring 27, the limit pin 26 is reset. After the staff pushes the first ring 62 into the connecting tube 25, the test head 6 can be released. Under the action of gravity, the test head 6 will move downward, and finally the first contact surface will contact the limit surface. The first ring 62 overlaps the limit pin 26. At this time, even if the test head 6 is subjected to a downward force, the first ring 62 will not fall out of the connecting tube 25 due to the restriction of the limit surface to the first contact surface. The installed test head 6 is Figure 8 As shown in , at this time, the lower half of the test head 6 protrudes from the connecting tube 25, the first contact surface contacts the limit surface, and the top of the test head 6 has not yet contacted the contact step 29, and the test head 6 is in a power-off state;

[0058] When the chip is tested, the base 1 moves downward under the action of the packaging plate 5. Since the bottom of the test head 6 has no support, the test head 6 will move downward synchronously with the base 1 during the downward movement of the base 1 until the pointed cone contacts the chip. When the pointed cone contacts the chip, the base 1 moves downward again, and the test head 6 moves upward relatively. The first contact surface and the limit surface are separated from each other until the top of the upper connector 64 contacts the bottom of the contact step 29. At this time, the test head 6 is in a conductive state. When the top of the upper connector 64 contacts the bottom of the contact step 29, the second ring 63 does not move to the position of the limit pin 26 and does not affect the use of the test head 6. The chip test can be realized. When the first ring 62 is in the connecting tube 25, it will not fall from the connecting tube 25 and can also ensure the normal progress of the chip test. After the chip test operation is completed and the test head 6 is separated from the chip, the test head 6 returns to the state when the installation is completed due to the action of gravity, which will not affect the next chip test.

[0059] When the chip test is not being performed, in order to avoid accidental damage to the test head 6, the test head 6 needs to be removed from the connecting tube 25. At this time, the staff only needs to push the second ring 63 upwards by using a tool such as a ejector pin. Due to the setting of the first inclined surface 261, the second ring 63 will also produce an extrusion effect on the limit pin 26 during the upward movement. The staff continuously pushes the second ring 63 upwards, and the second contact surface fits with the first contact surface. At this time, the limit pin 26 is completely retracted into the limit chamber 28. When the second ring 63 contacts the first ring 62, the staff can release the force on the second ring 63. Under the action of gravity, the test head 6 moves downward. Since the limit pin 26 is squeezed and compressed into the limit chamber 28, it can no longer restrict the first ring 62. Then the test head 6 is removed from the connecting tube 25, thereby realizing the disassembly of the test head 6.

[0060] When testing the chip, if the test head 6 is damaged, the test head 6 can also be disassembled by this method. The setting of the first ring 62 and the second ring 63 facilitates the installation and disassembly of the test head 6, facilitates the disassembly and assembly of the test interface 2, and prolongs the service life of the test head 6.

[0061] Embodiment 3: The above embodiment facilitates the installation and removal of the test head 6 by means of the split-type test head 6. However, when the test head 6 is not installed on the base 1, it is usually stored in a position outside the base 1. When the chip test is required, it needs to be taken out from other positions and then installed. Therefore, the installation of the test head 6 is relatively cumbersome, and during the entire installation and removal process, the staff needs to push the test head 6 or the second ring 63 to achieve it, and also needs to use tools. Due to the large number of test interfaces 2, the installation and removal of the test head 6 will undoubtedly greatly increase the workload of the staff.

[0062] In order to solve this problem, the present embodiment is equipped with a storage mechanism for storing the test head 6 on the base 1, specifically: Figure 4 , Figure 7-Figure 10 As shown, in the present embodiment, a storage assembly 3 is provided on one side of each group of test interfaces 2, and the storage assembly 3 includes a movable pin 31 arranged in the base 1, and a movable groove is provided in the base 1 for use with the movable pin 31, and the movable pin 31 is slidably installed in the movable groove, and an upper connecting pin 32 is fixedly installed on the top of the movable pin 31, and the outer diameter of the upper connecting pin 32 is smaller than the outer diameter of the movable pin 31, and a first cavity is provided on the base 1, and the first cavity is not connected with the movable groove, and the upper connecting pin 32 is arranged in the first cavity, and a pressing end is provided on the top of the upper connecting pin 32, and the outer diameter of the pressing end is larger than the outer diameter of the upper connecting pin 32, and the outer diameter of the pressing end is smaller than the inner diameter of the first cavity, and the staff is suitable for pressing the upper connecting pin 32 through the pressing end and pressing the pressing end into the first cavity;

[0063] A third spring 33 is fixedly installed at the bottom of the pressing end, and the other end of the third spring 33 is fixedly connected to the bottom of the first chamber. In the initial state, due to the elastic force of the third spring 33, the movable pin 31 is located at the top of the movable groove, and the pressing end also protrudes from the base 1, so that the staff can press it.

[0064] A storage cavity is also provided at the bottom of the base 1. It should be noted that the height of the storage cavity is greater than the height of the test head 6. When the test head 6 is placed vertically in the storage cavity, the bottom of the test head 6 is also located in the storage cavity, so that the test head 6 is stored in the base 1 to protect the test head 6. The storage cavity is communicated with the movable groove. At the same time, a lower connecting pin 34 is fixedly installed at the bottom of the movable pin 31. The lower connecting pin 34 is located in the storage cavity, and a storage plate 35 is fixedly installed at the bottom of the lower connecting pin 34. The storage plate 35 is vertically arranged at the bottom of the lower connecting pin 34, and an angle of 190 degrees is formed therebetween. A storage hole is provided on the side of the storage plate 35 away from the lower connecting pin 34. The inner diameter of the storage hole is slightly smaller than the diameter of the cylinder on the test head 6. The test head 6 is suitable for being placed in the storage hole position but will not fall out of the storage hole. When the test head 6 needs to be taken out of the storage hole, the test head 6 can be taken out directly from the top.

[0065] A receiving ring 351 is provided at the receiving hole. The receiving ring 351 and the receiving plate 35 are of an integrated design. The inner diameter of the receiving ring 351 is the same as the inner diameter of the receiving hole. The outer diameter of the receiving ring 351 is smaller than the outer diameter of the second ring 63. When the test head 6 is placed in the receiving hole, the pointed cone passes through the receiving hole due to gravity. However, due to the restriction of the receiving ring 351, the bottom of the second ring 63 contacts the top of the receiving ring 351, and the second ring 63 rests on the receiving ring 351.

[0066] In this embodiment, in order to prevent the test head 6 from being placed on the receiving ring 351, due to the effect of gravity, the second ring 63 moves toward the first ring 62. Figure 8 As shown, at least two groups of spring holes (not shown in the figure) are opened at the bottom of the first ring 62, and a fourth spring 65 is fixedly installed in the spring hole. The other end of the fourth spring 65 is fixedly connected to the top of the second ring 63, and the elastic force of the fourth spring 65 is larger but smaller than the elastic force of the third spring 33. Therefore, when the test head 6 is placed on the receiving ring 351, due to the elastic force of the fourth spring 65, the second ring 63 will not move toward the position of the first ring 62, and when the second ring 63 is pushed upward, the fourth spring 65 will be compressed, and the maximum limit is that the fourth spring 65 is completely retracted into the spring hole, and the second ring 63 fits with the first ring 62, which will not affect the normal use of the test head 6;

[0067] In the initial state, if Figure 5 As shown, at this time, the movable pin 31 is located at the upper end of the movable groove, the receiving plate 35 is located in the receiving cavity, and the test head 6 is placed on the receiving ring 351. At this time, the chip test has not yet started. Figure 2 As shown, the test head 6 placed on the receiving ring 351 is received in the base 1, and is received and protected by the base 1 at the same time;

[0068] In order to facilitate the disassembly and assembly of the test head 6 in the storage cavity, Figure 9-10 As shown, a limiting groove 7 is provided on the surface of the movable pin 31, and a supporting member 8 used in conjunction with the limiting groove 7 is fixedly installed in the base 1. The limiting groove 7 includes a first channel 71 provided on the surface of the movable pin 31. The first channel 71 is a vertical channel. At the same time, one end of the supporting member 8 is supported in the first channel 71 to form a supporting portion 81. In this embodiment, the supporting portion 81 is made of a flexible material such as rubber. When the supporting portion 81 is supported in the first channel 71, it is already in a squeezed state. For the convenience of description, the supporting position of the supporting portion 81 is defined as the initial position.

[0069] A second channel 72 is provided at the end of the first channel 71. The second channel 72 is a downward arc-shaped channel. The bottom height of the second channel 72 is lower than the bottom height of the first channel 71 and forms a first step. After the abutting portion 81 slides from the first channel 71 into the second channel 72, it cannot return from the second channel 72 to the first channel 71. For the convenience of description, the position where the first channel 71 and the second channel 72 communicate is defined as a first stationary point 76. The first stationary point 76 is located in the second channel 72.

[0070] A third channel 73 is also provided at the end of the second channel 72. The third channel 73 is a vertical channel. The highest position of the third channel 73 is higher than the horizontal height position of the first stationary point 76. When the abutting member 8 slides in the third channel 73, it will move to a higher horizontal position. Fig.10 As shown, the position where the second channel 72 communicates with the third channel 73 is located in the middle section of the third channel 73. A first node 731 and a second node 732 are respectively provided at the lower end of the third channel 73. The second node 732 is the bottom position of the third channel 73. It should be noted that the groove bottom position of the second channel 72 is higher than the groove bottom position of the third channel 73 and forms a second step, so that when the abutting member 8 slides from the second channel 72 into the third channel 73, it cannot return from the third channel 73 to the second channel 72;

[0071] In combination with the above, when the test head 6 needs to be installed, the staff only needs to press the pressing end of the upper connecting pin 32, and the upper connecting pin 32 moves downward to drive the movable pin 31 to slide downward, the third spring 33 is compressed, and the movable pin 31 slides downward to drive the limiting groove 7 to move downward, so that the abutting member 8 moves upward relatively in the first channel 71 until it moves to the first stationary point 76. At this time, the staff cannot continue to press the movable pin 31. While the abutting member 8 moves relatively, the storage plate 35 moves downward under the drive of the movable pin 31, driving the test head 6 to move downward synchronously and separate from the storage chamber. When the abutting portion 81 is located at the first stationary point 76, the test head 6 is located at a lower position at the lower end of the connecting tube 25, so as to facilitate the installation of the test head 6.

[0072] After the movable pin 31 can no longer be installed, the staff releases the movable pin 31. Due to the elastic force of the third spring 33, the movable pin 31 moves upward, so that the limiting slot 7 moves upward. When the limiting slot 7 moves upward, the abutment 8 slides in the second channel 72. Since the second channel 72 is arranged in an arc shape, when the abutment 8 slides, the movable pin 31 rotates, so that the storage plate 35 rotates and drives the test head 6 to rotate synchronously, and the third spring 33 located above will produce a certain angle of distortion when being squeezed, and in the initial state, due to Figure 5It is known that the test head 6 and the connecting tube 25 are not in the same vertical plane, and with the rotation of the movable pin 31, the test head 6 will gradually rotate to the lower position of the connecting tube 25. When the abutment 8 slides to the end of the second channel 72, the test head 6 is located directly below the connecting tube 25. With the continuous action of the third spring 33, the abutment 8 will slide through the second channel 72 and enter the third channel 73. Since the third channel 73 is vertically arranged, when the abutment 8 slides in the third channel 73, the movable pin 31 will move in the vertical direction. At this time, due to the rebound force of the third spring 33, the abutment 8 slides relatively downward in the third channel 73, and the movable pin 31 moves upward. When the movable pin 31 moves upward, it drives the lower connecting pin 34 and the storage plate 35 to move upward, thereby driving the test head 6 to move upward.

[0073] Combination Fig.11 As shown in the installation process of the test head 6 in the second embodiment, when the top of the upper connector 64 passes through the limit pin 26 to reach the bottom position of the contact step 29, the abutting member 8 is at the first node 731. Due to the limitation of the contact step 29, the test head 6 cannot move up, so the storage plate 35 cannot move up, and the movable pin 31 cannot continue to move up. The third spring 33 is still in an extruded state, and the abutting portion 81 stops at the first node 731. After the upper connector 64 abuts against the contact step 29, the test head 6 is in a conductive state. The installation of the test head 6 is completed, and under the action of the third spring 33, the test head 6 is fixed. Instead of the second embodiment, the test head 6 is in a suspended state after the installation is completed, and there is still a certain space in the connecting tube 25 so that the test head 6 can move up. In this embodiment, the test head 6 is in a conductive state after the installation is completed. At this time, it is only necessary to contact the chip with the bottom of the test head 6 to test the chip.

[0074] Continue to refer Fig.10 A fourth channel 74 is provided at the top of the third channel 73. The fourth channel 74 is also an arc-shaped channel. A second stationary point 77 is provided at the position where the fourth channel 74 communicates with the third channel 73. The second stationary point 77 is the highest position of the third channel 73. It should be noted that the length of the fourth channel 74 is greater than that of the second channel 72. Therefore, when the abutting member 8 slides in the fourth channel 74, it will slide for a longer time.

[0075] A fifth channel 75 is provided at the end of the fourth channel 74. The fifth channel 75 is a downward arc-shaped channel. A third stationary point 78 is provided at the connection between the fourth channel 74 and the fifth channel 75 for the abutting portion 81 to stop. The end of the fifth channel 75 is connected to the first channel 71. A transition slope is provided at the end of the fifth channel 75. The highest position of the transition slope is higher than the bottom position of the groove of the first channel 71 and forms a transition step. Therefore, when the abutting portion 81 slides in the first channel 71, it will not directly enter the fifth channel 75.

[0076] At the same time, for convenience, a transition arc surface is also provided at the second stationary point 77, and the transition arc surface is mainly used to facilitate the abutting portion 81 to slide from the third channel 73 into the fourth channel 74;

[0077] After the chip test is completed, the test head 6 needs to be removed from the connecting tube 25. At this time, the staff needs to press the pressing end again. After the pressing end is pressed again, the movable pin 31 moves downward, the limiting groove 7 moves downward again, and the abutting member 8 will slide upward relatively in the third channel 73. Under the force of downward pressure, the abutting portion 81 moves from the first node 731 to the second stationary point 77. Since the second stationary point 77 is higher than the first stationary point 76, and the test head 6 is installed on the connecting tube 25, the storage plate 35 will move downward when pressed this time, and the test head 6 will lose the supporting force of the storage plate 35, and the first contact surface of the free fall will finally overlap the limiting surface.

[0078] When the abutting portion 81 moves to the second stationary point 77, the receiving ring 351 is separated from the second sleeve ring 63, but the test head 6 is still in the receiving ring 351. At the same time, due to the limitation of the third channel 73, the staff cannot continue to press the upper connecting pin 32 and can only release the pressure on the upper connecting pin 32. Since the height of the second stationary point 77 is higher than the height of the first stationary point 76, the third spring 33 has a stronger rebound force at this position. Under the action of the third spring 33, the movable pin 31 rebounds upward, and the abutting portion 81 is The second ring 63 slides relatively downward in the third channel 73. Due to the stronger rebound force, the receiving ring 351 pushes the second ring 63 to move upward until the second ring 63 is pushed into the connecting tube 25. The second contact surface contacts the first contact surface, the fourth spring 65 is compressed, and the limiting pin 26 is squeezed into the limiting chamber 28 due to the squeezing of the second ring 63. At this time, the top of the receiving plate 35 contacts the bottom of the connecting tube 25. At this time, the movable pin 31 cannot continue to move upward, and the abutting portion 81 is located at the second node 732. For details, refer to Fig.12 In this embodiment, in order to ensure that the abutting portion 81 can reach the position of the second node 732 under the action of the rebound force of the third spring 33, after the pressing, an artificial pulling force can be added to ensure that the abutting portion 81 reaches the position of the second node 732;

[0079] It should be noted that after the second pressing, the abutting member 8 reaches the second stationary point 77, but the test head 6 is still located in the receiving ring 351 and in the connecting tube 25. Therefore, due to the limitation of the test head 6, even if the third spring 33 has a twisting force, the receiving plate 35 cannot rotate, and the abutting member 8 cannot enter the fourth channel 74 from the second stationary point 77.

[0080] After the second pressing and rebounding, the test head 6 is in a state to be disassembled. Due to the action of the third spring 33, the storage plate 35 fixes the test head 6 at the position of the connecting tube 25. If it is to be disassembled, the staff needs to press down the upper connecting pin 32 again. After this pressing down, the abutting portion 81 moves up again from the second node 732 to the second stationary point 77. During the pressing down process, since the first ring 62 and the second ring 63 are in contact, the test head 6 will directly come out of the connecting tube 25 under the action of gravity. When the abutting portion 81 moves to the second stationary point 77, the staff can no longer press the upper connecting pin 32. At this time, the test head 6 has come out of the connecting tube 25 and is located below the connecting tube 25. Then the staff releases the pressure on the upper connecting pin 32.

[0081] Due to the elastic force of the third spring 33 and the twisted state, and due to the transition arc surface set at the second stationary point 77, the movable pin 31 rotates under the twisting force, and the abutting portion 81 passes through the transition arc surface and enters the fourth channel 74 and continues to slide in the fourth channel 74. Fig.13 For reference, when the abutting portion 81 slides in the fourth channel 74, the movable pin 31 will rotate at a larger angle. With the continuous action of the third spring 33, the abutting member 8 passes through the fourth channel 74 and enters the fifth channel 75 to rotate, and finally returns to the initial position of the first channel 71. During this process, the receiving plate 35 will rotate. When the abutting member 8 returns to the first channel 71, the receiving plate 35 has rotated to the bottom of the receiving cavity. When the abutting member 8 returns to the initial position, the receiving plate 35 also returns to the initial position, and drives the test head 6 back to the initial position.

[0082] To summarize, in this embodiment, by the coordinated use of the limit groove 7 and the supporting member 8, and the coordination of the storage component 3 and the disassembly structure of the test head 6, when the test head 6 needs to be installed, it is only necessary to press the pressing end once to achieve the installation of the test head 6, and when the test head 6 needs to be disassembled, it is only necessary to press twice to disassemble and store the test head 6, which facilitates the disassembly and assembly of the test head 6 while the test head 6 is stored in the base 1, facilitating the use of the test head 6. At the same time, it should be noted that since the test head 6 needs to be rotated during the disassembly and assembly process, the test head 6 placed on the storage ring 351 needs to pay attention to its placement angle, and it is necessary to ensure that the fourth spring 65 and the limit pin 26 are in the same vertical plane. When the test head 6 is rotated to the position of the connecting tube 25, the fourth spring 65 and the limit pin 26 are staggered, which will not affect the normal use of the limit pin 26.

[0083] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A spring pin micro-metal composite structure high frequency test socket, characterized by: include: A detection seat (1); at least two groups of detection interfaces (2), the detection interface (2) comprising a silicone tube (21) arranged in the detection seat (1), the interior of the silicone tube (21) being hollow; metal particles, the metal particles being filled in the silicone tube (21), the silicone tube (21) also being filled with a second silicone, the second silicone being mixed with the metal particles; a first spring (22), the first spring (22) being arranged in the silicone tube (21), the two ends of the first spring (22) being respectively connected to the top end and the bottom end of the interior of the silicone tube (21); and a first spring needle (23), the first spring needle (23) being arranged at the upper end of the silicone tube (21), the first spring needle (23) being one end of which protrudes from the silicone tube (21) and extends to the outside of the detection seat (1); a second spring needle (24), the second spring needle (24) being arranged below the first spring needle (23); a connecting tube (25), the connecting tube (25) being fixedly connected to the bottom of the second spring needle (24), the connecting tube (25) being located outside the silicone tube (21), the interior of the connecting tube (25) being hollow and having an opening; a detection head (6), the detection head (6) being installed in the connecting tube (25), one end of the detection head (6) protruding from the connecting tube (25); a contact step (29) being arranged on one side of the connecting tube (25) close to the second spring needle (24), the connecting tube (25) being provided with a plurality of contact steps (29), the connecting tube (25) being provided with a plurality of contact steps (29) and ... Both sides of the bottom of the connecting tube (25) are provided with a limit chamber (28), a limit pin (26) is slidably installed in the limit chamber (28), the bottom end of the limit pin (26) is provided with a first inclined surface (261), and the upper end of the limit pin (26) is provided with a limit surface; a second spring (27) is fixedly installed on the side away from the limit pin (26), and the other end of the second spring (27) is fixedly connected to the inner wall of the limit chamber (28); the detection head (6) comprises a cone (61) arranged at the bottom of the connecting tube (25), the cone (61) comprises a cylinder close to the connecting tube (25) and a pointed cone fixedly installed at the bottom of the cylinder, and the upper part of the cylinder is integrally formed with a cone. An upper connecting body (64) is provided, the outer diameter of the upper connecting body (64) is smaller than the outer diameter of the cylinder and forms a placement step, a first ring (62) is fixedly mounted on the top of the upper connecting body (64), the outer diameter of the first ring (62) is adapted to the inner diameter of the connecting tube (25), a second ring (63) is slidably mounted on the surface of the upper connecting body (64), and the second ring (63) is located on the placement step; the outer diameter of the second ring (63) is the same as the outer diameter of the first ring (62), a second inclined surface (621) is provided on the first ring (62), a first contact surface is provided at the bottom of the first ring (62), and a second contact surface is provided at the top of the second ring (63);At least two groups of spring holes are provided at the bottom of the first sleeve ring (62), and a fourth spring (65) is fixedly installed in the spring hole, and the other end of the fourth spring (65) is fixedly connected to the top of the second sleeve ring (63); a storage component (3) is provided on one side of the detection interface (2), and the storage component (3) includes a movable pin (31) arranged in the detection seat (1), a movable groove is provided in the detection seat (1), and the movable pin (31) is located in the movable groove, and an upper connecting pin (32) is fixedly connected to the top of the movable pin (31), and the outer diameter of the upper connecting pin (32) is smaller than the outer diameter of the movable pin (31), and a first cavity is provided on the detection seat (1), and the upper connecting pin (32) is located in the detection seat (1). In the first chamber, a pressing end is arranged at the top of the upper connecting pin (32), a third spring (33) is fixedly installed at the bottom of the pressing end, the other end of the third spring (33) is fixedly connected to the bottom of the first chamber, and the elastic force of the third spring (33) is greater than the elastic force of the fourth spring (65); a lower connecting pin (34) is fixedly installed at the bottom of the movable pin (31), the lower connecting pin (34) is located in the receiving chamber, a receiving plate (35) is fixedly installed at the bottom of the lower connecting pin (34), a receiving hole is provided on the side of the receiving plate (35) away from the lower connecting pin (34), and a receiving ring (351) is also provided on the receiving plate (35), and the receiving ring (351) is located at the receiving hole. The outer diameter of the receiving ring (351) is smaller than the outer diameter of the second sleeve ring (63); a limiting groove (7) is provided on the surface of the movable pin (31); a supporting member (8) is fixedly installed in the detection seat (1); the limiting groove (7) comprises a first channel (71) provided on the movable pin (31); one end of the supporting member (8) is supported in the first channel (71) to form a supporting portion (81); a second channel (72) is provided at the end of the first channel (71); a third channel (73) is provided at the end of the second channel (72); a fourth channel (74) is provided at the top of the third channel (73); the length of the fourth channel (74) is greater than the length of the second channel (72); A fifth channel (75) is provided at the end of the fourth channel (74), and the end of the fifth channel (75) is communicated with the first channel (71); the abutting portion (81) is made of rubber; a vertical angle is formed between the second channel (72) and the first channel (71); the groove bottom height of the second channel (72) is lower than the groove bottom height of the first channel (71) and forms a first step; a first stationary point (76) is provided at the same position of the first channel (71) and the second channel (72); the highest position of the third channel (73) is higher than the horizontal height position of the first stationary point (76); the groove bottom position of the second channel (72) is higher than the groove bottom position of the third channel (73) and forms a second step;The lower end of the third channel (73) is respectively provided with a first node (731) and a second node (732); the position where the fourth channel (74) communicates with the third channel (73) is provided with a second stationary point (77); the end position of the fifth channel (75) is provided with a transition slope, the highest position of the transition slope is higher than the bottom position of the groove of the first channel (71) and forms a transition step. ;

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