Intelligent regulation and control heat pipe array liquid cooling server
By setting up exhaust tanks and heat-concentrating plates in the thermal conduction plate, combining liquid-cooled components and phase change materials, the problem that liquid-cooled components can only cool the top of the aluminum alloy plate is solved, and efficient cooling of the CPU is achieved to ensure the use of the CPU Smooth.
Patent Information
- Application Number
- CN202411215463.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-01-03
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing liquid-cooled components can only cool the top of the aluminum alloy plate and copper plate, resulting in the bottom of the copper plate still in a high temperature state, and the cooling effect is poor, which in turn increases the CPU temperature and causes the CPU to stutter.
An intelligent control heat pipe array liquid cooling server was designed, using the exhaust tank and heat-concentrating plate to open in the thermal conduction plate, and the thermal principle is used to collect the hot gas on the top of the thermal conduction plate, combining the liquid cooling components and phase change materials, and circulate through the liquid and Condensing fins improve heat transfer efficiency and reduce the temperature of the thermal conduction plate and CPU.
It effectively reduces the temperature of the thermal plate and CPU, improves heat transfer efficiency, ensures smooth use of the CPU in high temperature state, and extends the working life of the equipment.
Smart Images
Figure CN119248084A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of servers, in particular to an intelligently controlled heat pipe array liquid cooling server. Background Art
[0002] As the digital transformation of society continues to deepen, artificial intelligence technologies represented by large model training are also driving AI to develop in a more general direction. Therefore, servers, as electronic devices that provide computing power, are also developing in the direction of high density and flexibility.
[0003] Intelligently controlled heat pipe array liquid-cooled servers are an advanced data center cooling technology that uses high-efficiency heat pipe technology and intelligent control systems to effectively reduce the heat generated when the server is running, thereby improving energy efficiency and reducing operating costs.
[0004] At present, liquid cooling technology is gradually being adopted in some CPU servers or 8-card GPU servers. That is, coolant is used as a heat transfer medium to bring heat out of the server through components such as cold plates in contact with the server's heat-generating components, thereby providing a better operating temperature for high-power heat-generating components such as CPUs and GPUs. This can effectively improve the computing efficiency and stability of the server, meet the requirements of energy saving and noise reduction, and help increase the server density of a single cabinet, thereby improving the computing efficiency of the data center.
[0005] Upon investigation, the Chinese invention patent with publication number CN117724594B discloses a liquid-cooled server. The coolant in the liquid cooling link of the liquid cooling system flows through the liquid cooling plate at the central processing unit, the liquid cooling component at the memory bar, and the graphics processing unit, so as to remove the heat generated by the central processing unit through the liquid cooling plate, and remove the heat generated by the memory bar through the liquid cooling component, and remove the heat generated by the graphics processing unit through the coolant flowing through the graphics processing unit, so as to ensure that the temperatures of the central processing unit, the memory bar, and the graphics processing unit are all within the normal working range, thereby ensuring the working reliability of the central processing unit, the memory bar, and the graphics processing unit;
[0006] A search revealed that in the prior art there is also a method of installing a copper plate above the CPU, an aluminum alloy plate above the copper plate, and a liquid cooling assembly above the aluminum alloy plate, wherein the heat generated by the CPU is transferred to the aluminum alloy plate through the copper plate, and then the aluminum alloy plate is cooled by the liquid cooling assembly to achieve the purpose of liquid cooling; however, when the CPU is in a high temperature state, the copper plate will cause its own temperature to rise due to the long-term heat transfer by the copper plate, and only the top of the aluminum alloy plate and the copper plate can be cooled by the liquid cooling assembly, resulting in the bottom of the copper plate still being in a high temperature state, which will cause the temperature of the CPU to increase, causing the CPU to freeze during use.
[0007] Therefore, the present invention provides an intelligently controlled heat pipe array liquid cooling server to solve the above problems. Summary of the invention
[0008] 1. Technical issues to be resolved
[0009] The present invention provides an intelligently controlled heat pipe array liquid cooling server, aiming to solve the problem that the existing liquid cooling components mentioned in the background technology can only cool the tops of aluminum alloy plates and copper plates, causing the bottom of the copper plate to still be in a high temperature state, resulting in poor liquid cooling effect, and the like.
[0010] (II) Technical solution
[0011] To achieve the above object, the present invention provides the following technical solutions: an intelligently controlled heat pipe array liquid cooling server, comprising a chassis, a heat conducting component disposed in the chassis and connected to a CPU processor on a circuit board, and a liquid cooling component connected to the heat conducting component;
[0012] The chassis is provided with a cooling component for cooling the inside of the heat-conducting component, and the chassis is also provided with a liquid collecting component for collecting liquid generated in the heat-conducting component;
[0013] The difference from the existing liquid cooling equipment is that: the heat conduction assembly includes a heat conduction plate and a heat collecting plate fixed on the top of the heat conduction plate, the heat conduction plate is provided with an exhaust groove penetrating the top, and the top of the exhaust groove is fixedly connected with an air conduction plate; the exhaust groove can form a cavity inside the heat conduction plate, so that the heat conduction plate can concentrate the heat generated by the CPU on the circuit board, and the heat conduction effect of the heat conduction plate is improved by using the principle of thermodynamics that hot air rises in a closed volume;
[0014] Wherein, in order to improve the efficiency of hot air gathering inside the exhaust groove, the air guide plate is composed of a plurality of horizontal plates and vertical plates cross-connected and connected, the horizontal plates and vertical plates are arranged in an inclined shape, that is, their top ends are inward and their bottom ends are outward, so as to gather the hot air on the inner side of the exhaust groove to the middle thereof, and the two sides of the bottom wall of the exhaust groove are arranged in an inclined shape, that is, their outer sides are higher than their inner sides; because the temperature in the middle of the CPU on the circuit board is higher than the temperature on its sides when the CPU on the circuit board is in a high temperature state, the exhaust groove bottom wall is arranged by adopting the method of high sides and low middle, and the two sides of the exhaust groove bottom wall form a V shape, and according to the principle of thermodynamics, the hot air in the middle of the exhaust groove bottom wall moves straight upward, and the hot air on both sides of the bottom wall moves obliquely upward and then gathers in the middle of the top of the exhaust groove, and the inclined cross-connected arrangement of the horizontal plates and vertical plates can guide the hot air inside the exhaust groove, and can also make the hot air inside the exhaust groove gather in the middle of its top, thereby improving the heat conduction effect;
[0015] Among them, in order to improve the heat absorption efficiency of the heat collecting plate, a through air collecting hole for collecting the hot air in the exhaust groove is opened at the top of the heat collecting plate, and the air collecting hole is in a cone shape, and the diameter of the bottom port of the air collecting hole is larger than the diameter of the top port; because the temperature of the middle of the CPU on the circuit board is higher than the temperature of the side when it is in a high temperature state, the air collecting hole near the middle of the heat collecting plate is larger than the air collecting hole on the side, and the hot air can be stably gathered inside it through the air collecting hole, thereby improving the heat absorption effect of the heat collecting plate, and facilitating the liquid cooling component to cool down the heat collecting plate;
[0016] The liquid cooling assembly includes a liquid cooling box, a cooling box fixedly connected to the top of the heat collecting plate is connected to the bottom of the liquid cooling box, and the cooling box is filled with a phase change material; the phase change material can absorb and concentrate the heat on the heat collecting plate, and the heat in the cooling box can be circulated and absorbed and cooled by the liquid circulation between the liquid cooling box and the cooling box, so as to achieve the purpose of liquid cooling of the CPU;
[0017] The cooling component includes an air collecting box which is sleeved on the liquid cooling box and connected to the exhaust groove in the heat conducting plate; the air collecting box can be used to recycle the cold air dispersed from the liquid cooling box, thereby improving the energy saving effect; the design is based on the principle of thermodynamics that hot air rises and cold air falls, and can cool the bottom of the exhaust groove in the heat conducting plate, reduce the temperature of the heat conducting plate itself, improve the heat transfer efficiency of the heat conducting plate, and indirectly reduce the temperature of the CPU to ensure smooth use of the CPU; at the same time, since the two sides of the bottom wall of the exhaust groove are inclined, the cold air will gather toward the middle of the bottom wall of the exhaust groove along the two sides, and can also push the hot air to rise, thereby improving the heat transfer effect of the heat conducting plate; at the same time, the water vapor generated by the reaction of the cold air and the hot air condenses and drips to the middle of the bottom wall of the exhaust groove, and the middle of the heat conducting plate is further cooled by the condensed liquid, thereby indirectly cooling the middle of the CPU;
[0018] The liquid collecting component includes a collecting box which is arranged at the bottom of the circuit board and is connected to the exhaust groove in the heat conducting plate. The collecting box can collect the liquid generated in the exhaust groove, and at the same time facilitate the liquid inside the exhaust groove to take away part of the heat inside, further cool the inside of the exhaust groove, reduce the temperature of the heat conducting plate itself, improve the heat transfer efficiency of the heat conducting plate, indirectly reduce the temperature of the CPU, and ensure smooth use of the CPU.
[0019] Preferably, the cooling box is fixedly connected to the inside with a pulsating heat pipe running through both ends thereof, the chassis is fixedly connected to a liquid inlet connection end connected to the inlet end of the pulsating heat pipe through a condenser and a liquid outlet connection end connected to the outlet end of the pulsating heat pipe through a drain pipe, the inlet end of the liquid inlet connection end and the outlet end of the liquid outlet connection end both run through the outer wall of the chassis, the liquid cooling box is fixedly connected to a liquid cooling outlet pipe and a liquid cooling inlet pipe which are connected to the interior of the box and run through the outer wall of the chassis, the liquid inlet connection end and the liquid cooling outlet pipe as well as the liquid outlet connection end and the liquid cooling inlet pipe are all connected through pipes, and a liquid pump is installed on the liquid cooling outlet pipe.
[0020] Preferably, the top of the liquid cooling box is fixedly connected to a connecting column fixedly connected to the inner top wall of the air collecting box, the bottom of the air collecting box is fixedly plugged with an air guide pipe, the top of the heat conducting plate is fixedly connected to an air intake pipe connected to the exhaust groove, and the top of the air intake pipe is fixedly sleeved with a connecting cap fixedly connected to the bottom of the air guide pipe;
[0021] The outer wall of the liquid cooling box is fixedly connected with a plurality of condensing fins at equal intervals, and there is a gap between the condensing fins and the inner wall of the air collecting box; the condensing fins can increase the cold air diffused from the outer wall of the liquid cooling box when the liquid cooling box is in working state.
[0022] Preferably, the air duct is in a conical shape, and the diameter of the top end of the air duct is larger than the diameter of the bottom end thereof; the conical air duct can be set up to increase the speed at which cold air enters the exhaust slot, accelerate the reaction between cold air and hot air, reduce the temperature inside the exhaust slot, indirectly reduce the temperature of the heat conduction plate, and improve the heat transfer efficiency of the heat conduction plate.
[0023] Preferably, an arc plate is fixedly connected inside the exhaust groove and outside the air inlet pipe, and the arc surface of the arc plate is arranged upward; the arc plate can make the cold air entering the exhaust groove move along the inner wall of the exhaust groove, further reducing the temperature of the heat conduction plate.
[0024] Preferably, a liquid inlet pipe is fixedly connected to the top of the collecting box, a liquid outlet pipe is fixedly connected to one end of the collecting box and passes through the outer wall of the chassis, and a liquid guide pipe is fixedly connected to the bottom of the middle part of the outer wall of the heat conduction plate and is fixedly connected to the liquid inlet pipe through a water guide pipe.
[0025] Preferably, a circulation pipe is provided on the external fixed sleeve at one end of the liquid outlet pipe, a circulation inlet pipe fixedly connected to the liquid cooling box and the end of the circulation pipe is fixedly plugged on the chassis, and a circulation pump is fixedly installed on the circulation inlet pipe; the circulation pump is electrically connected to the circuit board, and the liquid in the collection box can be transported to the liquid cooling box through the circulation pump, so as to achieve the purpose of liquid circulation and improve energy saving effect.
[0026] Preferably, the heat conducting plate is made of copper, and the heat collecting plate, liquid cooling box and collecting box are all made of aluminum alloy; since the thermal conductivity of copper is higher than that of aluminum alloy, about twice that of aluminum alloy, this means that the copper plate can conduct the heat generated by the electronic device more quickly and effectively, thereby helping to maintain the electronic components within a safe operating temperature range and preventing performance degradation or damage caused by overheating.
[0027] Preferably, the phase change material is a hydrated inorganic salt, a saturated fatty acid or a liquid metal; utilizing the heat storage characteristics of the phase change material, when the electronic device reaches a high temperature, the material changes from solid to liquid, absorbs a large amount of latent heat, and then dissipates the stored heat through a heat exchange system. When the temperature drops, the PCM re-solidifies and prepares for the next round of heat absorption process.
[0028] Preferably, the inclination angle of the transverse plate and the longitudinal plate is 10° to 20°, which is the best state.
[0029] (III) Beneficial effects
[0030] The liquid cooling server improves the heat conduction component by opening an exhaust groove in the heat conduction plate. The exhaust groove can form a cavity inside the heat conduction plate, which is convenient for the heat conduction plate to concentrate the heat generated by the CPU on the circuit board. The principle of thermodynamics is used to set the heat rise in a closed volume, so as to improve the heat conduction effect of the heat conduction plate and reduce the temperature of the heat conduction plate. When the CPU on the circuit board is in a high temperature state, the temperature in the middle is higher than the temperature on the sides. The exhaust groove bottom wall is set by a method of high sides and low middle. The two sides of the exhaust groove bottom wall form a V shape. The hot air in the middle of the exhaust groove bottom wall moves straight upward according to the thermodynamic principle, and the hot air on both sides of the bottom wall moves obliquely upward and then gathers in the middle of the top of the exhaust groove. The inclined cross-staggered connection of the horizontal plate and the vertical plate can guide the hot air inside the exhaust groove and gather the hot air inside the exhaust groove in the middle of the top, thereby improving the heat conduction effect.
[0031] The liquid cooling server can guide the hot air inside the exhaust groove by setting the air guide plate and using the inclined cross-staggered connection of the horizontal plate and the vertical plate, and can also make the hot air inside the exhaust groove gather in the middle of the top thereof, thereby improving the heat conduction effect; because the temperature of the middle of the CPU on the circuit board is higher than the temperature of the side thereof when the CPU is in a high temperature state, the bottom wall of the exhaust groove is set by a method of high sides and low middle, and the two sides of the bottom wall of the exhaust groove form a V shape. According to the principle of thermodynamics, the hot air in the middle of the bottom wall of the exhaust groove moves straight upward, and the hot air on both sides of the bottom wall moves obliquely upward and then gathers in the middle of the top of the exhaust groove;
[0032] The liquid cooling server has air gathering holes on the heat gathering plate. When the CPU on the circuit board is in a high temperature state, the temperature in the middle is higher than the temperature on the side. The air gathering holes near the middle of the heat gathering plate are larger than the air gathering holes on the side. The air gathering holes can stably gather hot air inside the heat gathering plate, thereby improving the heat absorption effect of the heat gathering plate and facilitating the liquid cooling component to cool the heat gathering plate.
[0033] The liquid cooling server is provided with a liquid cooling component. The liquid cooling component is provided above the heat conducting component by using the thermodynamic principle. The heat in the cooling box can be circulated and absorbed and cooled by the liquid circulation between the liquid cooling box and the cooling box, thereby achieving the purpose of liquid cooling of the CPU.
[0034] The liquid cooling server can recycle the cold air dispersed from the liquid cooling box by setting a cooling component and utilizing an air collecting box, thereby improving the energy saving effect. The design is based on the principle of thermodynamics that hot air rises and cold air falls, and can cool the bottom of the exhaust groove in the heat conducting plate, reduce the temperature of the heat conducting plate itself, improve the heat transfer efficiency of the heat conducting plate, and indirectly reduce the temperature of the CPU to ensure smooth use of the CPU. At the same time, since the two sides of the bottom wall of the exhaust groove are inclined, the cold air will gather toward the middle of the bottom wall of the exhaust groove along the two sides, and can also push the hot air to rise, thereby improving the heat transfer effect of the heat conducting plate.
[0035] The liquid cooling server uses the cooperation of the cooling component and the heat conducting component. The water vapor generated by the reaction between the cold air and the hot air condenses and drips to the middle of the bottom wall of the exhaust groove. The condensed liquid further cools the middle of the heat conducting plate, and indirectly cools the middle of the CPU.
[0036] The liquid-cooled server is equipped with a liquid collecting component, and a collection box is used to collect the liquid generated in the exhaust groove. At the same time, the liquid inside the exhaust groove can take away part of the hot air inside, further cooling the inside of the exhaust groove, reducing the temperature of the heat conducting plate itself, improving the heat transfer efficiency of the heat conducting plate, and indirectly reducing the temperature of the CPU to ensure smooth use of the CPU. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] Figure 1 A schematic diagram of the overall structure of an intelligently controlled heat pipe array liquid cooling server;
[0038] Figure 2 This is a schematic diagram of the internal structure of the chassis;
[0039] Figure 3 It is a schematic diagram of the connection structure between the heat conduction component, the liquid cooling component and the circuit board;
[0040] Figure 4 It is a schematic diagram of the connection structure between the pipe fitting and the cooling box;
[0041] Figure 5 This is a cross-sectional exploded view of some structures of the heat conducting component;
[0042] Figure 6 Schematic diagram of the internal structure of the heat conducting plate;
[0043] Figure 7 It is a schematic diagram of the structure of the air guide plate;
[0044] Figure 8 It is a schematic diagram of the connection structure between the cooling component and the heat conducting plate;
[0045] Fig. 9 It is a schematic diagram of the internal structure of the gas collecting box;
[0046] Fig.10 It is a schematic diagram of the connection structure between the liquid collecting component and the circuit board, the heat conducting plate and the liquid cooling box.
[0047] In the figure:
[0048] 1. Chassis; 2. Circuit board; 3. Heat conduction component; 31. Heat conduction plate; 311. Air inlet pipe; 312. Liquid guide pipe; 32. Heat collecting plate; 321. Air collecting hole; 33. Air guide plate; 34. Arc plate; 4. Liquid cooling component; 41. Liquid cooling box; 411. Liquid cooling outlet pipe; 412. Liquid cooling inlet pipe; 413. Circulation inlet pipe; 42. Cooling box; 421. Pulsating heat pipe; 43. Liquid inlet connection end; 431. Condenser pipe; 44. Liquid outlet connection end; 441. Drain pipe; 45. Condenser fin; 5. Cooling component; 51. Air collecting box; 52. Air guide pipe; 521. Connecting cap; 6. Liquid collecting component; 61. Collecting box; 611. Liquid inlet pipe; 612. Liquid outlet pipe; 62. Water guide pipe; 63. Circulation pipe; 64. Circulation pump. DETAILED DESCRIPTION
[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0050] The present invention provides an intelligently controlled heat pipe array liquid cooling server. Figure 1-10 As shown, the liquid cooling server includes a chassis 1, a heat conducting component 3 disposed in the chassis 1 and connected to a CPU processor on a circuit board 2, and a liquid cooling component 4 connected to the heat conducting component 3 and used to cool the heat conducting component 3;
[0051] The heat conducting assembly 3 includes a heat conducting plate 31 and a heat collecting plate 32 fixed on the top of the heat conducting plate 31. An exhaust groove penetrating the top of the heat conducting plate 31 is provided inside the heat conducting plate 31, and an air conducting plate 33 is fixedly connected to the top of the exhaust groove. The exhaust groove can form a cavity inside the heat conducting plate 31, so that the heat conducting plate 31 can concentrate the heat generated by the CPU on the circuit board 2. The heat conducting plate 31 is provided by using the principle of thermodynamics that hot air rises in a closed volume, thereby improving the heat conducting effect of the heat conducting plate 31.
[0052] Among them, in order to improve the efficiency of hot air gathering inside the exhaust groove, the air guide plate 33 is composed of a plurality of horizontal plates and vertical plates cross-connected and connected, and the horizontal plates and vertical plates are arranged in an inclined shape, that is, their top ends are inward and their bottom ends are outward, so as to gather the hot air on the inner side of the exhaust groove to the middle thereof, and the two sides of the bottom wall of the exhaust groove are arranged in an inclined shape, that is, their outer sides are higher than their inner sides; because the temperature of the middle of the CPU on the circuit board 2 is higher than the temperature of its sides when the CPU is in a high temperature state, the bottom wall of the exhaust groove is arranged by adopting the method of high sides and low middle, and the two sides of the bottom wall of the exhaust groove form a V shape, and according to the principle of thermodynamics, the hot air in the middle of the bottom wall of the exhaust groove moves straight upward, and the hot air on both sides of the bottom wall moves obliquely upward and then gathers in the middle of the top of the exhaust groove, and the inclined cross-connected arrangement of the horizontal plates and vertical plates can guide the hot air inside the exhaust groove, and can also make the hot air inside the exhaust groove gather in the middle of its top, thereby improving the heat conduction effect;
[0053] Furthermore, the inclination angle of the transverse and longitudinal boards is 10° to 20°, which is the best state;
[0054] Furthermore, the heat conducting plate 31 is made of copper material, and the heat collecting plate 32 is made of aluminum alloy material; since the thermal conductivity of copper is higher than that of aluminum alloy, about twice that of aluminum alloy, this means that the copper plate can conduct the heat generated by the electronic device more quickly and effectively, thereby helping to maintain the electronic components within a safe operating temperature range and preventing performance degradation or damage caused by overheating.
[0055] In order to improve the heat absorption efficiency of the heat collecting plate 32, a through air collecting hole 321 for collecting the hot air in the exhaust groove is opened at the top of the heat collecting plate 32. The air collecting hole 321 is in a cone shape, and the bottom diameter of the air collecting hole 321 is larger than the top diameter. When the CPU on the circuit board 2 is in a high temperature state, the temperature in the middle is higher than the temperature on the side. The air collecting hole 321 near the middle of the heat collecting plate 32 is larger than the air collecting hole 321 on the side. The air collecting hole 321 can stably collect the hot air inside, thereby improving the heat absorption effect of the heat collecting plate 32, and facilitating the liquid cooling component 4 to cool down the heat collecting plate 32.
[0056] When in use, the heat generated by the CPU on the circuit board 2 is transferred to the exhaust groove through the heat conducting plate 31, and the heat is gathered in the air collecting holes 321 according to the principle of thermodynamics, so that the heat collecting plate 32 can absorb the heat.
[0057] The liquid cooling assembly 4 includes a liquid cooling box 41, and a cooling box 42 fixedly connected to the top of the heat collecting plate 32 is connected to the bottom of the liquid cooling box 41, and the cooling box 42 is filled with a phase change material; the phase change material can absorb and concentrate the heat on the heat collecting plate 32, and the heat in the cooling box 42 can be circulated and absorbed and cooled through the liquid circulation of the liquid cooling box 41 and the cooling box 42, so as to achieve the purpose of liquid cooling of the CPU;
[0058] Specifically, the cooling box 42 is fixedly connected with a pulsating heat pipe 421 running through both ends thereof, the chassis 1 is fixedly connected with a liquid inlet connection end 43 connected to the inlet end of the pulsating heat pipe 421 through a condensing pipe 431 and a liquid outlet connection end 44 connected to the outlet end of the pulsating heat pipe 421 through a drain pipe 441, the inlet end of the liquid inlet connection end 43 and the outlet end of the liquid outlet connection end 44 both run through the outer wall of the chassis 1, and the liquid cooling box 41 is fixedly connected with a liquid outlet 44 connected to the interior thereof. The liquid cooling outlet pipe 411 and the liquid cooling inlet pipe 412 that penetrate the outer wall of the chassis 1, the liquid inlet connection end 43 and the liquid cooling outlet pipe 411, and the liquid outlet connection end 44 and the liquid cooling inlet pipe 412 are all connected through pipes, and a liquid pump is installed on the liquid cooling outlet pipe 411; the liquid pump is electrically connected to the circuit board 2, and a one-way valve is connected to the outlet end of the pulsating heat pipe 421 on the discharge pipe 441 to prevent liquid reflux, and the installation method of the one-way valve is the prior art and will not be repeated here;
[0059] Furthermore, the phase change material is a hydrated inorganic salt, a saturated fatty acid or a liquid metal; utilizing the heat storage characteristics of the phase change material, when the electronic device reaches a high temperature, the material changes from solid to liquid, absorbs a large amount of latent heat, and then dissipates the stored heat through the heat exchange system. When the temperature drops, the PCM re-solidifies and prepares for the next round of heat absorption process;
[0060] Furthermore, the liquid cooling box 41 is made of aluminum alloy material, so that part of the cold air inside the liquid cooling box 41 can be released and collected by the air collecting box 51;
[0061] When in use, the heat transferred by the heat-conducting component 3 is absorbed by the box-change material in the cooling box 42, and the liquid in the liquid cooling box 41 is extracted by the liquid pump. Then the liquid enters the pulsating heat pipe 421 along the liquid cooling outlet pipe 411, the pipeline, the liquid inlet connection end 43, and the condenser pipe 431 to absorb the liquid and gas inside the phase change material. Then the liquid enters the liquid cooling box 41 through the outlet end of the pulsating heat pipe 421, the drain pipe 441, the liquid outlet connection end 44, the pipeline, and the liquid cooling inlet pipe 412 to perform liquid cooling and cooling treatment to achieve the purpose of liquid cooling.
[0062] See attached Figure 2 , Attachment Figure 8 and attached Fig. 9As shown, the liquid cooling server also includes a cooling component 5 arranged in the chassis 1 for cooling the inside of the heat conducting component 3. The cooling component 5 includes an air collecting box 51 which is sleeved on the liquid cooling box 41 and connected to the exhaust groove in the heat conducting plate 31. The air collecting box 51 can be used to recycle the cold air dispersed from the liquid cooling box 41 to improve the energy saving effect. The design is based on the principle that hot air rises and cold air falls according to the thermodynamic principle, and can cool the bottom of the exhaust groove in the heat conducting plate 31, reduce the temperature of the heat conducting plate 31 itself, and improve the heat conducting plate. The heat transfer efficiency of the heat conducting plate 31 is improved, which indirectly reduces the temperature of the CPU and ensures smooth use of the CPU. At the same time, since the two sides of the bottom wall of the exhaust groove are inclined, the cold air will gather along the two sides of the bottom wall of the exhaust groove to the middle part, and can also push the hot air to rise, thereby improving the heat transfer effect of the heat conducting plate 31. At the same time, the water vapor generated by the reaction of the cold air and the hot air condenses and drips to the middle part of the bottom wall of the exhaust groove, and the condensed liquid further cools the middle part of the heat conducting plate 31, and indirectly cools the middle part of the CPU.
[0063] Specifically, the top of the liquid cooling box 41 is fixedly connected with a connecting column fixedly connected to the inner top wall of the air collecting box 51, the bottom of the air collecting box 51 is fixedly plugged with an air guide pipe 52, the top of the heat conducting plate 31 is fixedly connected with an air intake pipe 311 connected to the exhaust groove, and the top of the air intake pipe 311 is fixedly sleeved with a connecting cap 521 fixedly connected to the bottom of the air guide pipe 52;
[0064] Furthermore, a plurality of condensing fins 45 are fixedly connected to the outer wall of the liquid cooling box 41 at equal intervals, and there is a gap between the condensing fins 45 and the inner wall of the air collecting box 51; the condensing fins 45 can improve the cold air diffused from the outer wall of the liquid cooling box 41 when the liquid cooling box 41 is in working state;
[0065] Furthermore, the air guide pipe 52 is in a cone shape, and the diameter of the top end of the air guide pipe 52 is larger than the diameter of the bottom end thereof. The cone-shaped air guide pipe 52 can increase the speed at which cold air enters the exhaust slot, accelerate the reaction between cold air and hot air, reduce the temperature inside the exhaust slot, indirectly reduce the temperature of the heat conducting plate 31, and improve the heat transfer efficiency of the heat conducting plate 31.
[0066] Furthermore, an arc plate 34 is fixedly connected in the exhaust groove and located outside the air inlet pipe 311, and the arc surface of the arc plate 34 is arranged upward; the arc plate 34 can make the cold air entering the exhaust groove move along the inner wall of the exhaust groove, further reducing the temperature of the heat conducting plate 31;
[0067] When in use, the cold gas diffused from the liquid cooling box 41 in the working state can be collected by the air collecting box 51, and then the hot gas rises and the cold gas falls according to the principle of thermodynamics. The cold gas in the air collecting box 51 enters the exhaust groove in the heat conduction plate 31 along the air guide pipe 52. At this time, the cold air hits the inner wall of the exhaust groove along the arc plate 34, and then gathers along the inner wall of the exhaust groove to the middle of the bottom wall of the exhaust groove. In this process, it reacts with the hot air inside the exhaust groove, and then reduces the temperature inside the exhaust groove. At the same time, the reaction between the cold air and the hot air causes water vapor to condense and drip to the middle of the bottom wall of the exhaust groove. The condensed liquid further cools the middle of the heat conduction plate 31, and indirectly cools the middle of the CPU.
[0068] See attached Figure 2 and attached Fig.10 As shown, the liquid cooling server further includes a liquid collecting component 6 arranged in the chassis 1 for collecting the liquid generated in the heat conducting component 3, and the liquid collecting component 6 includes a collecting box 61 arranged at the bottom of the circuit board 2 and connected to the exhaust groove in the heat conducting plate 31; the collecting box 61 can collect the liquid generated in the exhaust groove, and at the same time facilitate the liquid in the exhaust groove to take away part of the hot air inside, further cool the inside of the exhaust groove, reduce the temperature of the heat conducting plate 31 itself, improve the heat transfer efficiency of the heat conducting plate 31, indirectly reduce the temperature of the CPU, and ensure smooth use of the CPU;
[0069] The top of the collection box 61 is fixedly connected with a liquid inlet pipe 611, one end of the collection box 61 is fixedly connected with a liquid outlet pipe 612 that runs through the outer wall of the chassis 1, and the bottom of the middle of the outer wall of the heat conducting plate 31 is fixedly connected with a liquid guide pipe 312 that is fixedly connected to the liquid inlet pipe 611 through the water guide pipe 62;
[0070] Furthermore, a circulation pipe 63 is provided on the outer fixed sleeve of one end of the liquid outlet pipe 612, and a circulation inlet pipe 413 fixedly connected to the liquid cooling box 41 and the end of the circulation pipe 63 is fixedly plugged on the chassis 1, and a circulation pump 64 is fixedly installed on the circulation inlet pipe 413; the circulation pump 64 is electrically connected to the circuit board 2, and the liquid in the collection box 61 can be transported to the liquid cooling box 41 through the circulation pump 64, so as to achieve the purpose of liquid circulation and improve the energy saving effect;
[0071] Furthermore, the collection box 61 is made of aluminum alloy material; the collection box 61 can be cooled;
[0072] When in use, the liquid generated in the exhaust groove can be introduced into the collection box 61 for centralized collection through the cooperation of the liquid guide pipe 312, the water guide pipe 62 and the liquid inlet pipe 611. The liquid in the collection box 61 can be introduced into the interior of the liquid cooling box 41 through the cooperation of the liquid outlet pipe 612, the circulation pipe 63, the circulation inlet pipe 413 and the circulation pump 64, so as to achieve the purpose of liquid circulation and improve the energy saving effect.
[0073] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. An intelligently controlled heat pipe array liquid cooling server, comprising a chassis (1), a heat conducting component (3) arranged in the chassis (1) and connected to a CPU processor on a circuit board (2), and a liquid cooling component (4) connected to the heat conducting component (3); Features: The chassis (1) is provided with a cooling component (5) for cooling the inside of the heat-conducting component (3), and the chassis (1) is also provided with a liquid collecting component (6) for collecting liquid generated in the heat-conducting component (3); The heat conduction assembly (3) comprises a heat conduction plate (31) and a heat collecting plate (32) fixed on the top of the heat conduction plate (31); an exhaust groove penetrating the top of the heat conduction plate (31) is provided inside the heat conduction plate (31); an air guide plate (33) is fixedly connected to the top of the exhaust groove; The air guide plate (33) is composed of a plurality of transverse plates and longitudinal plates connected in a cross-staggered manner, the transverse plates and longitudinal plates are arranged in an inclined shape, that is, their top ends are facing inwards and their bottom ends are facing outwards, so as to gather the hot air on the inner side of the exhaust groove to the middle thereof, and the two sides of the bottom wall of the exhaust groove are arranged in an inclined shape, that is, the outer side is higher than the inner side; The top of the heat collecting plate (32) is provided with a through gas collecting hole (321) for collecting the hot gas in the exhaust groove, the gas collecting hole (321) is in a cone shape, and the bottom end diameter of the gas collecting hole (321) is larger than the top end diameter; The liquid cooling assembly (4) comprises a liquid cooling box (41), a cooling box (42) fixedly connected to the top of the heat collecting plate (32) is connected below the liquid cooling box (41), and the cooling box (42) is filled with a phase change material; The cooling component (5) comprises an air collecting box (51) which is sleeved on the liquid cooling box (41) and is connected to the exhaust groove in the heat conducting plate (31); The liquid collecting assembly (6) comprises a collecting box (61) arranged at the bottom end of the circuit board (2) and connected to the exhaust groove in the heat conducting plate (31).
2. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: The cooling box (42) is fixedly connected to a pulsating heat pipe (421) passing through both ends thereof; the chassis (1) is fixedly connected to a liquid inlet connection end (43) connected to the inlet end of the pulsating heat pipe (421) through a condensing pipe (431) and a liquid outlet connection end (44) connected to the outlet end of the pulsating heat pipe (421) through a liquid discharge pipe (441); the inlet end of the liquid inlet connection end (43) and the outlet end of the liquid outlet connection end (44) both pass through the outer wall of the chassis (1); the liquid cooling box (41) is fixedly connected to a liquid cooling outlet pipe (411) and a liquid cooling inlet pipe (412) which are in communication with the interior thereof and pass through the outer wall of the chassis (1); the liquid inlet connection end (43) and the liquid cooling outlet pipe (411) as well as the liquid outlet connection end (44) and the liquid cooling inlet pipe (412) are both connected through pipes; a liquid pump is installed on the liquid cooling outlet pipe (411).
3. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: The top of the liquid cooling box (41) is fixedly connected to a connecting column fixedly connected to the inner top wall of the air collecting box (51); the bottom of the air collecting box (51) is fixedly plugged with an air guide pipe (52); the top of the heat conducting plate (31) is fixedly connected to an air intake pipe (311) connected to the exhaust groove; the top of the air intake pipe (311) is fixedly sleeved with a connecting cap (521) fixedly connected to the bottom of the air guide pipe (52); The outer wall of the liquid cooling box (41) is fixedly connected with a plurality of condensing fins (45) at equal intervals, and there is a gap between the condensing fins (45) and the inner wall of the air collecting box (51).
4. The intelligent control heat pipe array liquid cooling server according to claim 3 is characterized in that: The air guide tube (52) is in a cone shape, and the diameter of the top end of the air guide tube (52) is larger than the diameter of the bottom end thereof.
5. The intelligent control heat pipe array liquid cooling server according to claim 3, characterized in that: An arc-shaped plate (34) is fixedly connected in the exhaust groove and located outside the air inlet pipe (311), and the arc surface of the arc-shaped plate (34) is arranged upward.
6. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: A liquid inlet pipe (611) is fixedly plugged into the top of the collection box (61), a liquid outlet pipe (612) is fixedly plugged into one end of the collection box (61) and penetrates the outer wall of the chassis (1), and a liquid guide pipe (312) is fixedly connected to the bottom of the middle part of the outer wall of the heat conducting plate (31) and is fixedly connected to the liquid inlet pipe (611) via a water guide pipe (62).
7. The intelligent control heat pipe array liquid cooling server according to claim 6, characterized in that: A circulation pipe (63) is fixedly sleeved on the outside of one end of the liquid outlet pipe (612), and a circulation inlet pipe (413) fixedly connected to the liquid cooling box (41) and the end of the circulation pipe (63) is fixedly plugged on the chassis (1), and a circulation pump (64) is fixedly installed on the circulation inlet pipe (413).
8. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: The heat conducting plate (31) is made of copper material, and the heat collecting plate (32), the liquid cooling box (41) and the collecting box (61) are all made of aluminum alloy material.
9. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: The phase change material is a hydrated inorganic salt, a saturated fatty acid or a liquid metal.
10. The intelligent control heat pipe array liquid cooling server according to claim 1, characterized in that: The optimum inclination angle of the transverse plate and the longitudinal plate is 10° to 20°.