Coil component, method for manufacturing coil component, and electronic and electrical apparatus

Abstract

Disclosed are a coil component, a method for manufacturing the coil component, and an electronic and electrical apparatus, wherein a new function is imparted to a main body part to improve various characteristics. The coil component includes: a coil portion including a ring-shaped conductor portion having a central axis in a first direction and having two electrical end portions; a main body portion covering the annular conductor portion with a first surface and a second surface arranged in a first direction, the main body portion including a magnetic powder and a binder, the main body portion including: a first region comprising a first surface and a central region of which an outer peripheral edge is entirely in contact with an inner peripheral surface of the annular conductor portion, the first region being made of a first material; and a second region including at least a part of the second surface and comprising a second material, the first material and the second material being different with respect to one or more selected from the group consisting of the following. The magnetic powder includes a magnetic powder, a shape distribution, which is a distribution related to the shape of the magnetic powder, and a binder, which includes a third component other than the magnetic powder and the binder, and the binder includes a third component other than the magnetic powder and the binder.

Description

Technical Field

[0001] The present invention relates to a coil component and a method for manufacturing the same, and an electronic and electrical device equipped with the coil component. Background Art

[0002] Patent document 1 discloses a power inductor comprising: a body including magnetic powder and a polymer; at least one substrate arranged inside the body and having at least one coil pattern formed on at least one surface; and an insulating layer formed between the coil pattern and the body, wherein the body includes at least one region in which the size of the magnetic powder particles is distributed in a manner different from that of the remaining portion.

[0003] [Prior technical literature]

[0004] [Patent Literature]

[0005] Patent Document 1: Japanese Patent Application No. 2019-532519 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In a coil component having a structure in which the coil is buried in the main body, a magnetic circuit is formed in the main body by energizing the coil, and runs on the inner and outer sides of the coil in the direction along the central axis of the coil, and on the two bottom sides of the coil in the direction that crosses the central axis of the coil. Sometimes it is preferred that the magnetic properties at the inner side and bottom side of the coil in the main body are different. In addition, when the coil component is mounted on a substrate, the portion of the main body located on the bottom side of the coil becomes a portion opposite to the substrate, or a portion protruding from the substrate. Therefore, sometimes it is preferred that the above-mentioned portion is different from the portion of the main body located on the inner side of the coil in terms of electrical properties, mechanical properties, etc.

[0008] An object of the present invention is to provide a coil component having an improved function of a main body portion. Another object of the present invention is to provide a method for manufacturing the coil component and an electronic and electrical device equipped with the coil component.

[0009] Solutions to Solve Problems

[0010] A coil component according to one embodiment of the present invention provided to solve the above-mentioned problems comprises: a coil portion having an annular conductor portion having a central axis along a first direction and having two electrical ends; and a main body portion, which covers the annular conductor portion with a first face and a second face arranged in the first direction, and contains magnetic powder and a binder. The coil portion is exposed from the surface of the main body portion at a first end face connected to one of the two electrical ends of the annular conductor portion and a second end face connected to the other of the two electrical ends of the annular conductor portion. The main body portion includes: a first region, which includes the entire central region of the outer periphery that is connected to the inner periphery of the annular conductor portion and the first face, and is composed of a first material; and a second region, which includes at least a portion of the second face, and is composed of a second material. The first material and the second material differ in one or more elements selected from a group consisting of the following elements, namely, the composition of the magnetic powder, the distribution related to the shape of the magnetic powder, i.e., the shape distribution, the content of the magnetic powder, the composition of the binder, the content of the binder, and the composition of the third component and the content of the third component in the case of containing a component other than the magnetic powder and the binder, i.e., a third component. The above-mentioned coil component can make the material of the first area including the central area different from the material of the second area including at least a part of the second surface. Thereby, a new function can be given to the main body, making the main body highly functional.

[0011] In the above coil component, the material of the first region including the central region can be different from the material located near the second surface, and thus the main body can have various characteristics.

[0012] In the coil component described above, the second material may have higher insulation properties than the first material. In this case, a short circuit or insulation breakdown is less likely to occur on the second surface side where the second region is located.

[0013] The coil component may also include a first external electrode and a second external electrode which are separated from each other and disposed on the main body, wherein the first external electrode is electrically connected to the first end surface, and the second external electrode is electrically connected to the second end surface. In this case, the first external electrode may include a first covering portion covering a portion of the second surface, the second external electrode may include a second covering portion covering a portion of the second surface, and the second region may include a first opposing portion opposite to the first covering portion and a second opposing portion opposite to the second covering portion. Even when at least a portion of the external electrode is located on the second surface, short circuit and insulation breakdown are unlikely to occur.

[0014] In the above-mentioned coil component, the first end surface may have a first exposed surface exposed from the main body at the second surface and connected to the first external electrode, and the second end surface may have a second exposed surface exposed from the main body at the second surface and connected to the second external electrode. Even when the end of the coil portion is located on the mounting surface side, a short circuit between the external electrodes is unlikely to occur.

[0015] In the above coil component, the second region may include a continuous portion that is continuous with both the first opposing portion and the second opposing portion and includes a part of the second surface.

[0016] In the coil component, the second region may have a greater specific resistance than the first region. The second region has a relatively high specific resistance, so the possibility of insulation breakdown occurring between the conductor having the first exposed surface and the conductor having the second exposed surface is reduced.

[0017] In the above-mentioned coil component, the magnetic powder may include metal magnetic powder, and the relative magnetic permeability μ2 of the second region may be smaller than the relative magnetic permeability μ1 of the first region. As a scheme for making the insulation of the second region relatively high, the content of the material that increases the insulation in the second material may be cited. In this case, the content of the metal magnetic powder is relatively reduced. Therefore, the relative magnetic permeability μ2 of the second region is likely to be smaller than the relative magnetic permeability μ1 of the first region. In this case, the separation distance d2 between the end of the coil portion on the proximal side of the second surface in the first direction and the second surface may be greater than the separation distance d1 between the end of the coil portion on the proximal side of the first surface in the first direction and the first surface. Even in the case where the relative magnetic permeability μ2 of the second region is smaller than the relative magnetic permeability μ1 of the first region, as long as d2>d1, the magnetic resistance of the second region can be avoided from being too high.

[0018] In the coil component, the annular conductor portion may be connected to the first region at the end of the second surface side in the first direction. By not having the first material between the annular conductor portion and the first region, the benefits of providing the second region (such as suppression of insulation breakdown) can sometimes be more stably enjoyed.

[0019] The present invention provides a method for manufacturing a coil component as another embodiment, the coil component comprising: a coil portion having a ring-shaped conductor portion having a central axis in a first direction and two electrical ends; and a main body portion, which covers the ring-shaped conductor portion with a first surface and a second surface arranged in the first direction and contains magnetic powder. In the manufacturing method, a stacked structure consisting of the coil component, a first member and a second member is arranged in a mold cavity, at least a portion of the first member is located on one side of the first direction of the coil component, and the first member contains a first magnetic powder and a first curable material, and the second member is located on the other side of the first direction of the coil component and contains a second magnetic powder and a second curable material, and the manufacturing method of the coil component includes a step of increasing the pressure in the mold cavity, and a molded body consisting of the coil component and the main body portion is obtained from the stacked structure. In the molded body, the entire central area of ​​the outer periphery that is in contact with the inner peripheral surface of the ring-shaped conductor portion is composed of a material obtained based on the first member.

[0020] In the above-mentioned manufacturing method, the first component and the second component may be different with respect to one or more elements selected from the group consisting of the following elements, which elements refer to the composition of the first magnetic powder and the composition of the second magnetic powder, the particle size distribution of the first magnetic powder and the particle size distribution of the second magnetic powder, the content of the first magnetic powder in the first component and the content of the second magnetic powder in the second component, the composition of the first curable material and the composition of the second curable material, the content of the first curable material in the first component and the content of the second curable material in the second component, and when the first component contains a first additional component other than the first curable material and the first magnetic powder and the second component contains a second additional component other than the second curable material and the second magnetic powder, the composition of the first additional component and the composition of the second additional component.

[0021] In this specification, "hardening material" includes hardening material and material that hardens it (polymerization initiator, etc.). In addition, "additive component" is not a ferromagnetic body and is a material that does not react with the hardening material. Specific examples include non-polymerizing materials for softening components and inorganic particles for improving insulation.

[0022] The manufacturing method may include the step of curing the first curable material and the second curable material. In this case, the second material body generated by the step of curing the second curable material in the second member may have higher insulation than the first material body generated by the step of curing the first curable material in the first member.

[0023] Furthermore, the coil portion may also have a first connecting conductor portion connected to one of the two electrical end portions of the ring-shaped conductor portion, and a second connecting conductor portion connected to the other of the two electrical end portions of the ring-shaped conductor portion. In this case, the first connecting conductor portion may be exposed from the second surface at the first end surface, and the second connecting conductor portion may be exposed from the second surface at the second end surface. In the formed body, the first connecting conductor portion and the second connecting conductor portion have portions buried in the second material body.

[0024] The present invention provides an electronic and electrical device as another embodiment, the electronic and electrical device is equipped with the above-mentioned coil component, wherein the coil component is connected to a substrate via a terminal portion provided on an exposed conductor portion, and the exposed conductor portion is located at each of the two ends of the coil portion and is exposed to the outside. As the electronic and electrical device involved, a power supply device having a power switch circuit, a voltage step-up and step-down circuit, a smoothing circuit, etc., a small portable communication device, etc. can be exemplified. The electronic and electrical device involved in the present invention has the above-mentioned coil component, and therefore has excellent comprehensive characteristics as an inductor element.

[0025] Effects of the Invention

[0026] According to the present invention, the main body of the coil component can be endowed with new functions such as the function of ensuring insulation relative to the external electrode, the function of suppressing short circuits within the coil part, the function of positioning the coil part within the main body, and the function of suppressing defects during impact. The main body is highly functionalized by being endowed with such functions, and a coil component having excellent electrical properties and other characteristics is provided. When the coil component is installed in an electronic and electrical device, the performance of the electronic and electrical device can be improved and the size of the electronic and electrical device can be reduced. In addition, according to the present invention, an electronic and electrical device equipped with a coil component is provided. Furthermore, a method for manufacturing the above-mentioned coil component is also provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a perspective view conceptually showing the shape of a coil component according to one embodiment of the present invention.

[0028] Figure 2 yes Figure 1 XZ cross-sectional view at line A-A'.

[0029] Figure 3 yes Figure 2 XY cross-sectional view at line BB'.

[0030] Figure 4 This is a diagram for explaining the difference in shape distribution of magnetic powder.

[0031] Figure 5A It is an explanatory diagram of an example of the function of the main body portion of the coil component according to one embodiment of the present invention (comparative example).

[0032] Figure 5B This is an explanatory diagram of an example of the function of the main body portion of the coil component according to one embodiment of the present invention (present invention example).

[0033] Figure 5C This is a diagram for explaining the difference in shape distribution of magnetic powder.

[0034] Figure 6 It is an XZ cross-sectional view explaining a modified example (the first) of the coil component according to the embodiment of the present invention.

[0035] Figure 7 It is an XZ cross-sectional view explaining a modified example (the second) of the coil component according to the embodiment of the present invention.

[0036] Figure 8 It is an XZ cross-sectional view explaining a modified example (the third) of the coil component according to the embodiment of the present invention.

[0037] Fig. 9 It is an XZ cross-sectional view explaining a modified example (the 4 ) of the coil component according to the embodiment of the present invention.

[0038] Fig. 10A It is an explanatory diagram (part 1) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XY plan view of a coil array sheet.

[0039] Fig. 10B yes Fig. 10A XZ cross-sectional view at line C-C'.

[0040] Fig.11 It is an explanatory diagram (part 2) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a coil array sheet and the like are arranged in a cavity of a mold.

[0041] Fig.12 It is an explanatory diagram (part 3) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a molded body is formed by molding using a mold.

[0042] Fig.13 It is an explanatory diagram (No. 4) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is a diagram showing a state before a molded body is cut.

[0043] Fig.14 It is an explanatory diagram (part 5) showing an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is a diagram showing a state in which a molded body is cut to obtain coil chips.

[0044] Fig.15 It is an explanatory diagram (part 1) of another example of the method for manufacturing a coil component according to one embodiment of the present invention.

[0045] Fig.16 It is an explanatory diagram (part 2) of another example of the method for manufacturing the coil component according to the embodiment of the present invention.

[0046] Description of reference numerals:

[0047] 100, 100A, 100B, 100C, 100D: Coil components

[0048] 10: Coil

[0049] 11: First spiral conductor part

[0050] 12, 22: Inner circumferential side end

[0051] 13, 23: Outer peripheral side end

[0052] 14: First lead-out section

[0053] 14E: First lead end

[0054] 15: First connecting conductor part

[0055] 15E: First connection end

[0056] 16: First connecting conductor part

[0057] 20: Coil conductor part

[0058] 21: Second spiral conductor part

[0059] 24: Second lead-out section

[0060] 24E: Second lead end

[0061] 25: Second connecting conductor portion

[0062] 25E: Second connection end

[0063] 26: Second connecting conductor part

[0064] 30: Main body

[0065] 31: First Area

[0066] 31C: Main part

[0067] 31E: Extended configuration section

[0068] 32: Second Area

[0069] 32C: Continuous

[0070] 32F: Second opposing portion

[0071] 32F1: First opposing part

[0072] 32F2: Second opposing part

[0073] 33: Middle layer

[0074] 41: First external electrode

[0075] 41a: First lateral external electrode

[0076] 41b: First cross-plane external electrode

[0077] 42: Second external electrode

[0078] 42a: Second lateral external electrode

[0079] 42b: Second cross-plane external electrode

[0080] 50, 60, 61, 62: Exterior coating

[0081] 70: Mould

[0082] 70C: Cavity

[0083] 71: Lower die

[0084] 72: Upper mold

[0085] 80: Coil insulation

[0086] 90: Interposer

[0087] 100Z: Coil Chip

[0088] 101: First end

[0089] 102: Second end

[0090] 300: Main structural components

[0091] 301: Side 1

[0092] 302: Side 2

[0093] 310: First material body

[0094] 311: First Component

[0095] 311A: Part of the first component

[0096] 311B: Another part of the first component

[0097] 320: Second material body

[0098] 321: Second component

[0099] 500: Coil array sheet

[0100] 500A, 501A: Molded body

[0101] CR: Central Region

[0102] DL1, DL2: cutting line

[0103] E1: First substrate electrode

[0104] E2: Second substrate electrode

[0105] EP: Short Circuit Path

[0106] MP1, MP2: Magnetic powder

[0107] O: Center axis

[0108] RS: Stripping components

[0109] S1, S2: Solder

[0110] SB: Substrate

[0111] VP: Via

[0112] d1, d2: separation distance. DETAILED DESCRIPTION

[0113] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0114] Figure 1 It is a perspective view conceptually showing the shape of a coil component according to one embodiment of the present invention. Figure 2 yes Figure 1 XZ cross-sectional view at line A-A'. Figure 2 For the sake of convenience, the joining state of the coil component to the substrate is also shown. Figure 3 yes Figure 2 XY cross-sectional view at line BB'. Figure 4 This is a diagram for explaining the difference in shape distribution of magnetic powder.

[0115] (Overall structure)

[0116] The coil component 100 according to the embodiment of the present invention includes a coil portion 10 having a coil conductor portion 20 , a main body portion 30 , a first external electrode 41 , a second external electrode 42 , and external coatings 50 , 60 .

[0117] (Coil)

[0118] like Figure 2 and Figure 3 As shown, the coil portion 10 has a coil conductor portion 20 wound around a central axis O along a first direction (Z1-Z2 direction), and the coil conductor portion 20 has a first spiral conductor portion 11 with a spiral shape. The first spiral conductor portion 11 is an example of a portion of an annular conductor portion. The spiral shape of the first spiral conductor portion 11 is a shape that moves away from the central axis O from an inner peripheral end portion 12 toward an outer peripheral end portion 13, and the inner peripheral end portion 12 is an end portion on the inner peripheral side of a pair of end portions of the first spiral conductor portion 11, and the outer peripheral end portion 13 is an end portion on the outer peripheral side of a pair of end portions of the first spiral conductor portion 11. Figure 3 In the first spiral conductor portion 11, when viewed from the Z1 side in the Z1-Z2 direction, the conductor is arranged in a spiral shape from the inner peripheral end 12 toward the outer peripheral end 13 and away from the central axis O in a clockwise direction. In this specification, the "spiral direction" in the spiral portion refers to the direction from the inner peripheral end toward the outer peripheral end.

[0119] The coil conductor portion 20 has a second spiral conductor portion 21 arranged in a row with the first spiral conductor portion 11 in the first direction. The second spiral conductor portion 21 is another example of a portion of the annular conductor portion. The second spiral conductor portion 21 has a spiral shape around the central axis O along the first direction (Z1-Z2 direction), and the spiral shape moves away from the central axis O from the end portion on the inner circumference side of the second spiral conductor portion 21, that is, the end portion on one side (the inner circumference side end portion 22) toward the end portion on the outer circumference side of the second spiral conductor portion 21, that is, the end portion on the other side (the outer circumference side end portion 23). In the second spiral conductor portion 21, when viewed from the Z1 side in the Z1-Z2 direction, the conductor is arranged to be wound around the direction opposite to the first spiral conductor portion 11 (in the Z1-Z2 direction). Figure 3 The spiral shape is counterclockwise (in the center) away from the central axis O.

[0120] The average value of the separation distance between the first spiral conductor portion 11 and the second spiral conductor portion 21 in the first direction (Z1-Z2 direction) is not particularly limited. The smaller the separation distance, the easier it is to reduce the height of the coil component 100 (the dimension in the Z1-Z2 direction), but when the separation distance is too small, the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21 is easily reduced. From the perspective of taking into account the low height (low height) of the coil component 100 and the high insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21, it is sometimes preferred that the separation distance is greater than 0.4μm and less than 20μm. In order to reduce the deviation of the separation distance in manufacturing and more reliably support the coil in the same plane, the separation distance is more preferably greater than 1.0μm, and further preferably greater than 5.0μm.

[0121] The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has appropriate conductivity. Specific examples of the conductor constituting the coil conductor portion 20 include metals such as copper, copper alloys, aluminum, and aluminum alloys, and the coil conductor portion 20 can be manufactured using film-making techniques such as plating. The coil portion 10 has an insulating coil insulation portion 80 on the surface of the coil conductor portion 20. The coil insulation portion 80 ensures insulation between adjacent conductors (between surfaces of conductors facing each other) in the coil conductor portion 20. The coil insulation portion 80 is not provided at the ends of the two ends (the first lead end portion 14E and the second lead end portion 24E) of the coil conductor portion 20, and the coil portion 10 can be electrically connected to other components at these ends.

[0122] The inner circumferential end 12 of the first spiral conductor portion 11 and the inner circumferential end 22 of the second spiral conductor portion 21 are electrically connected through the via portion VP. When the connection portion connected to the via portion VP is taken as the starting point, the first spiral conductor portion 11 and the second spiral conductor portion 21 are spiraled in opposite directions. The via portion VP can also be composed of the same conductor as the coil conductor portion 20. In a specific example, the via portion VP is manufactured together in the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the via portion VP is integrated with the inner circumferential end 12 of the first spiral conductor portion 11 and the inner circumferential end 22 of the second spiral conductor portion 21. Therefore, in this embodiment, the annular conductor portion has the first spiral conductor portion 11 and the second spiral conductor portion 21, and the via portion VP, and the outer circumferential end portions 13 and 23 are two electrical ends in the annular conductor portion.

[0123] The first lead-out portion 14 is connected to the outer peripheral end portion 13 of the first spiral conductor portion 11, and the second lead-out portion 24 is connected to the outer peripheral end portion 23 of the second spiral conductor portion 21. Therefore, the outer peripheral end portion 13 of the first spiral conductor portion 11 is substantially the interface with the first lead-out portion 14, and the outer peripheral end portion 23 of the second spiral conductor portion 21 is substantially the interface with the second lead-out portion 24. In a specific example, the first lead-out portion 14 and the second lead-out portion 24 are manufactured together in the process of manufacturing the first spiral conductor portion 11 and the second spiral conductor portion 21. In this case, the first lead-out portion 14 has a portion that is integrated with the outer peripheral end portion 13 of the first spiral conductor portion 11 without a boundary, and the second lead-out portion 24 has a portion that is integrated with the outer peripheral end portion 23 of the second spiral conductor portion 21 without a boundary.

[0124] The coil component 100 according to the present embodiment includes a first connection conductor portion 15 extending from the first lead portion 14 toward the second surface 302 side (Z2 side in the Z1-Z2 direction), and includes a second connection conductor portion 25 extending from the second lead portion 24 toward the second surface 302 side (Z2 side in the Z1-Z2 direction). The first connection conductor portion 15 is exposed from the second surface 302 of the main body portion 30 at the first connection end portion 15E, and the second connection conductor portion 25 is exposed from the second surface 302 of the main body portion 30 at the second connection end portion 25E. That is, the first connection end portion 15E is a first exposed surface exposed from the main body portion 30 at the second surface 302 and connected to the first external electrode 41, and the second connection end portion 25E is a second exposed surface exposed from the main body portion 30 at the second surface 302 and connected to the second external electrode 42.

[0125] In this embodiment, the coil conductor portion 20 has a first spiral conductor portion 11, a first lead portion 14, a second spiral conductor portion 21, a second lead portion 24, a first connecting conductor portion 15, a second connecting conductor portion 25 and a via portion VP, which are manufactured in a manner having an integrated portion through a common manufacturing process.

[0126] (External Electrode)

[0127] The coil component 100 according to this embodiment is as follows: Figure 1 As shown in the figure, the coil component 100 has an external electrode provided outside the main body 30 as a terminal portion. In other words, the external electrode is provided on the exposed conductor portion, which is the portion of the coil portion 10 exposed to the outside. Specifically, the external electrode has a first external electrode 41 and a second external electrode 42.

[0128] More specifically, regarding the first external electrode 41, the first lateral external electrode 41a located on the outer side surface of the main body 30 is continuous with the first intersecting surface external electrode 41b located on the second surface 302 of the main body 30. The first intersecting surface external electrode 41b is a first covering portion of the first external electrode 41 that covers a portion of the second surface 302. The first lateral external electrode 41a is electrically connected to the first lead-out end 14E, and the first intersecting surface external electrode 41b is electrically connected to the first connecting end 15E. Regarding the second external electrode 42, the second lateral external electrode 42a located on the outer side surface of the main body 30 is continuous with the second intersecting surface external electrode 42b located on the second surface 302 of the main body 30. The second intersecting surface external electrode 42b is a second covering portion of the second external electrode 42 that covers a portion of the second surface 302. The second lateral external electrode 42a is electrically connected to the second lead-out end 24E, and the second intersecting surface external electrode 42b is electrically connected to the second connecting end 25E.

[0129] In the case where the first lateral external electrode 41a and the second lateral external electrode 42a are provided, Figure 2 As shown, the solder S1 is located between the first substrate electrode E1 and the first lateral external electrode 41a, and between the first substrate electrode E1 and the first cross-surface external electrode 41b, which extend in the X1-X2 direction from a position sufficiently far from the first lateral external electrode 41a (on the X2 side in the X1-X2 direction) to a position opposite to the second surface 302 on the substrate SB. Similarly, the solder S2 is located between the second substrate electrode E2 and the second lateral external electrode 42a, and between the second substrate electrode E2 and the second cross-surface external electrode 42b, which extend in the X1-X2 direction from a position sufficiently far from the second lateral external electrode 42a (on the X1 side in the X1-X2 direction) to a position opposite to the second surface 302 on the substrate SB. In this way, the first substrate electrode E1 and the second substrate electrode E2 extend, so that stable electrical connection is obtained between the first substrate electrode E1 and the first external electrode 41 via the solder S1, and between the second substrate electrode E2 and the second external electrode 42 via the solder S2.

[0130] The material and structure of the first external electrode 41 and the second external electrode 42 are not limited as long as they have appropriate conductivity. As an example of the first external electrode 41 and the second external electrode 42, which is not limited, a layer having a structure of Cu plating / Ni plating / Sn plating from the surface proximal to the main body 30 can be cited. The first external electrode 41 and the second external electrode 42 can also be composed of a coating type electrode in which a conductive material such as silver is dispersed in a resin or the like. In addition, the first external electrode 41 and the second external electrode 42 can also be a combination of a plated type and a coated type electrode.

[0131] (Exterior coating)

[0132] On the upper surface of the main body 30 (the surface on the Z1 side in the Z1-Z2 direction) and the side surfaces arranged along the Y1-Y2 direction, insulating outer coatings 50 and 60 are provided as surface insulating portions, respectively. An insulating outer coating may also be provided on the portion of the bottom surface of the main body 30 (the surface on the Z2 side in the Z1-Z2 direction) where the first cross-plane external electrode 41b and the second cross-plane external electrode 42b are not provided. In addition, the coil component 100 may not have the outer coatings 50 and 60. The outer coatings 50 and 60 can be formed at any position on the surface of the main body 30 according to the purpose. The outer coatings 50 and 60 may also include the metal magnetic powder contained in the main body 30. In this case, it is sometimes preferred that the area of ​​the metal magnetic powder occupied in the cross section of the outer coatings 50 and 60 is less than 50% of the area of ​​the metal magnetic powder occupied in the cross section of the main body 30.

[0133] (Coil insulation)

[0134] As the constituent material of the coil insulating portion 80, for example, a resin material can be cited, which is not limited to a specific material, and can be an inorganic material or a mixture of an organic material and an inorganic material. The coil insulating portion 80 can also be thermoplastic, and as a specific example, a thermoplastic resin containing a paraxylene polymer can be cited. As other examples of thermoplastic resins, polyethylene, polypropylene, polyamide, polyester, polyamide-imide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, polytetrafluoroethylene, etc. can be cited. The coil insulating portion 80 as a whole has thermoplasticity, and can also contain, for example, inorganic insulating particles in addition to the above-mentioned thermoplastic resin. In addition, as the constituent material of the coil insulating portion 80, in addition to the above-mentioned thermoplastic resin, organic materials such as thermosetting resins and inorganic materials such as oxides can also be exemplified.

[0135] The coil insulating portion 80 preferably has excellent insulation properties. Specifically, it is sometimes preferable that the volume resistivity obtained by ASTM D257 is 1.0×10 14 Ωcm or more. The volume resistivity is more preferably 1.0×10 15 Ωcm or more, more preferably 1.0×10 16 The upper limit of the volume resistivity is not particularly limited. The volume resistivity may also be 1.0×10 20Ωcm or less. In addition, the coil insulation portion 80 preferably has excellent dielectric properties. Specifically, it is sometimes preferred that the relative dielectric constant at 60Hz obtained by ASTM D150 is 4.0 or less. The relative dielectric constant is more preferably less than 3.5, and further preferably less than 3.0. The lower limit of the relative dielectric constant is not particularly limited. The relative dielectric constant may also be greater than 1.0. The method for measuring the volume resistivity and relative dielectric constant of the coil insulation portion 80 is not limited as long as the result equivalent to the result obtained by the above-mentioned ASTM D257 and D150 is expected. For example, the following method can be cited: prepare a measurement sample separately, the measurement sample is formed by modulating a material equivalent to the coil insulation portion 80 into a size required for the measurement, and use the measurement sample to determine the constituent materials by component analysis, FT-IR and other analysis methods, and evaluate the volume resistivity and other properties of the material.

[0136] (Main body)

[0137] The main body 30 covers the first spiral conductor part 11 and the second spiral conductor part 21 with at least a pair of intersection surfaces (first surface 301, second surface 302) arranged in the first direction (Z1-Z2 direction), and includes magnetic powder and a binder. In the present embodiment, the main body 30 has four outer side surfaces extending and arranged along the first direction (Z1-Z2 direction) between the above-mentioned pair of intersection surfaces, and has a substantially rectangular shape. The main body 30 includes the end surface of the outermost side (X2 side of the X1-X2 direction and both sides of the Z1-Z2 direction) of the first lead-out part 14 and the outermost side (X1 side of the X1-X2 direction and both sides of the Z1-Z2 direction) of the second lead-out part 24 at the end of the coil part 10.

[0138] The coil portion 10 is exposed from the surface of the main body 30 at a first end face (first lead end 14E, first connection end 15E) connected to one of the two electrical ends of the annular conductor portion (the outer peripheral end 13) and a second end face (second lead end 24E, second connection end 25E) connected to the other of the two electrical ends of the annular conductor portion (the outer peripheral end 23).

[0139] The main body 30 includes a first region 31 and a second region 32, wherein the first region 31 is made of a first material and includes a first surface 301, and the second region 32 is made of a second material and includes at least a portion of a second surface 302. The first region 31 includes the entire outer periphery and the central region CR facing the inner circumference of the annular conductor portion (the first spiral conductor portion 11 and the second spiral conductor portion 21, and the via portion VP). The length (thickness) of the central region CR in the first direction is appropriately set according to the characteristics required for the central region CR, the shape of the inner circumference of the annular conductor portion, etc. The thickness of the central region CR can be the same as the length of the annular conductor portion in the first direction (the thickness of the annular conductor portion), or it can be half of the thickness of the annular conductor portion, or it can be, for example, 1 / 4 of the thickness of the annular conductor portion. When the thickness of the central region CR is thinner than the thickness of the annular conductor portion, the central region CR can be arranged on the side of the first surface 301, or on the side of the second surface 302, or it can be arranged in a manner that is approximately equally separated from the first surface 301 and the second surface 302.

[0140] In this embodiment, the first material and the second material are different in one or more selected from the group consisting of the following [1] to [6].

[0141] [1] Composition of magnetic powder

[0142] [2] Shape distribution is the distribution related to the shape of magnetic powder.

[0143] [3]Content of magnetic powder

[0144] [4] Composition of binder

[0145] [5] Binder content

[0146] [6] When a third component other than magnetic powder and binder is contained, the composition of the third component and the content of the third component

[0147] By making the first material and the second material different in at least one of these, the first region 31 and the second region 32 in the main body 30 can have different characteristics. As a result, further functions can be imparted to the main body 30 in some cases.

[0148] The positional relationship between the end of the first direction of the portion of the coil portion 10 where the annular conductor portion is arranged and the boundary between the first region 31 and the second region 32 arranged along the first direction in the main body portion 30 is not particularly limited. For example, the portion of the coil portion 10 formed by the annular conductor portion may be in contact with the second region 32 at the end in the first direction. Figure 2In the embodiment, the end portion (second end portion 102) of the portion of the coil portion 10 in which the second spiral conductor portion 21 is arranged on the Z2 side in the Z1-Z2 direction is in contact with the second region 32. In this way, no other material (for example, the first material) exists between the portion of the coil portion 10 formed by the annular conductor portion and the second region 32, and thus the benefits (such as improved insulation) of the second region 32 can sometimes be more stably enjoyed.

[0149] (Magnetic powder)

[0150] Here, the magnetic powder is described. Regarding the composition of the magnetic powder, there are two examples of the case where the magnetic body of the magnetic powder is composed of a conductive material and the case where the magnetic body of the magnetic powder is composed of an insulating material.

[0151] A specific example of a conductive material is a metal material. When the magnetic powder is a metal magnetic powder, its crystallographic organization is not limited. The organization may include a crystalline phase or an amorphous phase. Here, a crystalline material is defined as a material composed of a crystalline phase, an amorphous material is defined as a material composed of an amorphous phase, and a composite material is defined as a material composed of a crystalline phase and an amorphous material. In the case where the diffraction pattern obtained by a general X-ray diffraction method includes a sharp diffraction peak that can determine the type of the crystalline phase, the material includes a crystalline phase. In addition, in the case where the diffraction pattern obtained by a general X-ray diffraction method includes a wide peak representing an amorphous phase, the material includes an amorphous phase. In the case where the DSC curve obtained by differential thermal analysis includes a peak representing crystallization, that is, heat generated by a phase change from an amorphous phase to a crystalline phase, the material also includes an amorphous phase.

[0152] The material system of the magnetic body is not limited. As a specific example of crystalline material, Fe-Si-Cr alloy, Fe-Ni alloy, Fe-Co alloy, Fe-V alloy, Fe-Al alloy, Fe-Si alloy, Fe-Si-Al alloy, pure iron, Mn-Zn ferrite can be cited. As a powder of pure iron, carbonyl iron powder is preferred. In addition, as a specific example of amorphous material, Fe-Si-B alloy, Fe-PC alloy and Co-Fe-Si-B alloy can be cited. As a specific example of composite material, Fe-Zr alloy, Fe-Zr-B alloy, Fe-Nb-B alloy, Fe-Si-B-Nb-Cu alloy, Fe-Si-BP-Cu alloy can be cited. When the magnetic body contains Fe, the synergistic effect of improving magnetic properties is particularly large.

[0153] The chemical composition of the magnetic body is not limited. For example, the Fe-Si-Cr alloy may also be composed of 1.0 to 10.0 mass % Si, 1.0 to 10.0 mass % Cr, and the remainder, which is composed of Fe and impurities. In addition, for example, the Fe-Ni alloy may also be composed of 1.0 to 99.0 mass % Ni, and the remainder, which is composed of Fe and impurities. Further, for example, the Fe-PC alloy may also be composed of 1.0 to 13.0 atomic % P, 1.0 to 13.0 atomic % C, and Fe and impurities. The Fe-PC alloy may also contain one or more selected from the group consisting of Ni, Sn, Cr, B, and Si as any element. In this case, for example, the amount of Ni may be 0 to 10.0 atomic %, the amount of Sn may be 0 to 3.0 atomic %, the amount of Cr may be 0 to 6.0 atomic %, the amount of B may be 0 to 9.0 atomic %, and the amount of Si may be 0 to 7.0 atomic %. The amount of Fe is preferably 65 atomic % or more. In addition, for example, a Fe-Si-B-Nb-Cu alloy may also be composed of 1.0 to 16.0 atomic % Si, 1.0 to 15.0 atomic % B, 0.50 to 5.0 atomic % Nb, 0.50 to 5.0 atomic % Cu, and the remainder, which is composed of Fe and impurities. In this case, the amount of Fe is preferably 65 atomic % or more.

[0154] A specific example of the magnetic body as the magnetic powder when it is composed of an insulating material is Ni—Zn-based ferrite.

[0155] The magnetic powder may also be subjected to surface insulation treatment. When the magnetic powder is subjected to surface insulation treatment, the insulation resistance of the main body 30 is improved. The type of surface insulation treatment applied to the magnetic powder is not limited. Examples include phosphoric acid treatment, phosphate treatment, oxidation treatment, etc. The magnetic powder may also have an insulating coating on the surface of the magnetic particles. The insulating coating may also contain at least one selected from the group consisting of Si, P, and B, and O (oxygen).

[0156] The magnetic powder may be a mixed material obtained by mixing a plurality of powder materials. The magnetic powder is preferably a ferromagnetic material, and more preferably a soft magnetic material.

[0157] As the distribution related to the shape of the magnetic powder, i.e., the shape distribution, there can be cited the shape of the magnetic powder itself (spherical, needle-shaped, amorphous, etc.), the distribution related to the particle size, etc. If the range of the particle size of the magnetic powder is given as an example, for example, 0.10 to 50.0 μm can be cited. As a specific example of the distribution related to the particle size, for example, the volume particle size distribution obtained by measuring the particle size of the magnetic powder by laser diffraction / scattering, and the distribution of the average equivalent circle diameter of the magnetic powder obtained by analyzing the image (secondary electron image) obtained by photographing the cross section of the main body 30 with a scanning electron microscope can be cited.

[0158] (Binder)

[0159] In the main body 30, the binder contained in the second region 32 may contain a second polymer, and the binder contained in the first region 31 may contain a first polymer. The physical properties of the polymer can be easily adjusted by adjusting the composition of the monomers and the degree of polymerization, so the properties of the binder can be easily adjusted by the binder containing a polymer. Examples of polymers include acrylic resins, silicone resins, epoxy resins, phenolic resins, urea resins, melamine resins, and polyester resins. The binder may also contain an inorganic material, with a glass-based material such as water glass as a specific example.

[0160] The weight average molecular weight of the second polymer may be greater than that of the first polymer. The second region 32 including a polymer having a relatively large molecular weight is likely to be higher than the first region 31 as a whole from the perspective of insulation and mechanical properties. In this case, the difference between the weight average molecular weight of the second polymer and the weight average molecular weight of the first polymer may be 1% or more and 5% or less based on the weight average molecular weight of the second polymer. The second region 32 can stably enjoy the benefits of improved insulation and mechanical properties.

[0161] The existence density of the unreacted groups of the second polymer can also be lower than the existence density of the unreacted groups of the first polymer. As unreacted groups, functional groups with high reactivity between other functional groups such as glycidyl, isocyanate, carboxyl, functional groups (hydroxyl, amino etc.) with active hydrogen reacted with such active functional groups can be enumerated. In the case where polymer is obtained by polymerization of a free radical polymerization catalyst, olefinic unsaturated bonds may also become unreacted groups.

[0162] The second region 32 including a polymer having a relatively low density of unreacted groups is likely to be higher in terms of insulation and mechanical properties as a whole than the first region 31. In this case, the difference between the density of unreacted groups in the second polymer and the density of unreacted groups in the first polymer may be 1% or more and 5% or less based on the density of unreacted groups in the second polymer. The second region 32 can stably enjoy the benefits of high insulation and mechanical properties.

[0163] In the case where the second material contains a polymerization catalyst for forming a binder and the first material contains a polymerization catalyst for forming a binder, the content of the polymerization catalyst in the second material may be more than the content of the polymerization catalyst in the first material. The polymerization catalyst is appropriately set according to the monomer used to form the polymer. As the polymerization catalyst, urethane polymerization catalysts such as 2-(dimethylamino)ethanol, epoxy polymerization catalysts such as tetrabutylphosphonium bromide, olefin polymerization catalysts such as metallocene compounds, etc. can be exemplified. The second region 32 containing a relatively large amount of polymer containing a polymerization catalyst is prone to high strength and high viscosity as a whole. In this case, the difference between the content of the polymerization catalyst in the second material and the content of the polymerization catalyst in the first material can also be more than 1% and less than 5% based on the content of the polymerization catalyst in the second material. The second region 32 can stably enjoy the benefits of high insulation and mechanical properties.

[0164] The hardness of the binder included in the second region 32 obtained by the nanoindenter may be smaller than the hardness of the binder included in the first region 31. The second region 32 including a relatively hard binder is likely to be higher than the first region 31 in terms of insulation and mechanical properties as a whole. In this case, the difference between the hardness of the second binder obtained by the nanoindenter and the hardness of the first binder obtained by the nanoindenter may be 1% or more and 5% or less based on the hardness of the second binder obtained by the nanoindenter. The second region 32 can stably enjoy the benefits of high insulation and mechanical properties.

[0165] (Insulation)

[0166] In the main body 30, the second material may have higher insulation than the first material. In this case, the main body 30 is provided with a new function of ensuring insulation from the external electrode. Figure 2 In the case where the second surface 302 is the mounting surface side (the side opposite to the substrate SB) as shown in the figure, a short circuit is not likely to occur on the mounting surface side. In particular, in the case where the lower surface electrodes such as the first cross-surface external electrode 41b and the second cross-surface external electrode 42b are provided as in the present embodiment, the insulation between the lower surface electrodes and the main body 30 is ensured, so a short circuit is not likely to occur between the lower surface electrodes.

[0167] As one method for making the insulation property of the second material higher than the insulation property of the first material, the specific resistance of the second region 32 may be made larger than the specific resistance of the first region 31 .

[0168] In the case where the magnetic powder includes metal magnetic powder, from the viewpoint of stably achieving higher insulation of the second material than the first material, it is sometimes preferred that the relative magnetic permeability μ2 of the second region 32 is smaller than the relative magnetic permeability μ1 of the first region 31. In the case where the magnetic powder includes metal magnetic powder, there is a high possibility that the magnetic powder contacts inside the main body 30, thereby forming a conductive path that reduces insulation. Therefore, as a scheme for relatively improving the insulation of the second region 32, the content of the material that increases the insulation in the second material can be cited. In this case, the content of the metal magnetic powder is reduced, so the relative magnetic permeability μ2 of the second region 32 is likely to be smaller than the relative magnetic permeability μ1 of the first region 31.

[0169] In this case, the separation distance d2 between the second end 102, which is the end of the coil portion 10 closer to the second surface 302 in the first direction, and the second surface 302 may be greater than the separation distance d1 between the first end 101 and the first surface 301. Even if the relative magnetic permeability μ2 of the second region 32 is smaller than the relative magnetic permeability μ1 of the first region 31, as long as d2>d1, the magnetic resistance of the second region 32 can be prevented from being too high.

[0170] When μ2<μ1 as described above, the following formula (1) can also be satisfied. When the following formula (1) is satisfied, the magnetic resistance of the second region 32 is less likely to be excessively high. Therefore, the magnetic characteristics of the coil component 100 can be more stably avoided from being degraded.

[0171] | μ1×d1-μ2×d2| / (μ1×d1)≤0.1 (1)

[0172] Alternatively, from the viewpoint of more stably achieving a higher insulation property of the second material than that of the first material when the magnetic powder contains metal magnetic powder, when the second region 32 is cut using a plane (XY plane) orthogonal to the first direction to obtain a second cut surface, and when the first region 31 is cut using a plane orthogonal to the first direction to obtain a first cut surface, at least one of the following (A) and (B) is satisfied.

[0173] (A) The area ratio of the magnetic powder at the second cut surface, i.e., the second area ratio, is lower than the area ratio of the magnetic powder at the first cut surface, i.e., the first area ratio

[0174] (B) The average equivalent circle diameter of the magnetic powder at the second cut surface, i.e., the second average equivalent circle diameter, is larger than the average equivalent circle diameter of the magnetic powder at the first cut surface, i.e., the first average equivalent circle diameter.

[0175] Regarding (A), μ2<μ1 is easily achieved by making the second area ratio < the first area ratio. In this case, the area ratio of the binder in the second region 32 is high, so the insulation of the second region 32 is easily improved. Figure 4 Let's take this as an example to illustrate. Figure 4 The following are diagrams to illustrate the different shape distributions of magnetic powders. The left diagram corresponds to the observation image at the first cut surface, and the right diagram corresponds to the observation image at the second cut surface. In the area of ​​the dotted circle, the cross section of the magnetic powder is shaded, and the cross section of materials other than the magnetic powder (matrix) such as the binder is shown as colorless. A specific example of the binder is a polymer as described later. In this case, the magnetic powder, which is a metal magnetic powder, has lower insulation properties than the matrix. Therefore, in Figure 4 When the cross section shown in the left figure, in which the area ratio of the magnetic powder is relatively low in the two figures, is the second cross section, and the cross section in the right figure is the first cross section, (A) is satisfied.

[0176] Regarding (B), when the average equivalent circle diameter of the magnetic powder is relatively large, the filling rate is likely to decrease. Therefore, by making the second average equivalent circle diameter > the first average equivalent circle diameter, μ2 < μ1 is easily achieved. At this time, the area ratio of the binder in the second region 32 is likely to be high, so the resistivity of the second region 32 is likely to be high.

[0177] From the perspective of more stably achieving a higher insulation property of the second material than that of the first material, the second material may also include insulating inorganic particles as a third component. For insulating inorganic particles, there are many materials with higher insulation withstand voltage than binders, and this tendency is significant when the binder is a polymer. By containing inorganic particles as the third component of the second material, the possibility of insulation breakdown in the second region 32 can be reduced. The type of inorganic particles is not limited. Sometimes, from the perspective of ease of acquisition, oxide inorganic particles such as silica, alumina, and zirconium oxide are also preferred.

[0178] From the viewpoint of more stably achieving a higher insulation property of the second material than that of the first material, the magnetic powder contained in the second region 32 may also include a metal magnetic powder having an insulating coating on the surface. When the magnetic powder is a metal magnetic powder, the magnetic powder forms a conductive path when the insulation is broken. Therefore, by having the metal magnetic powder have an insulating coating on its surface, the possibility of insulation breakdown in the second region 32 can sometimes be reduced.

[0179] (Preventing short circuit in coil section)

[0180] Figure 5A is an explanatory diagram of an example of the function of the main body portion of the coil component according to one embodiment of the present invention (comparative example), Figure 5B This is an explanatory diagram of an example of the function of the main body portion of the coil component according to one embodiment of the present invention (present invention example). Figure 5C This is a diagram for explaining the difference in shape distribution of magnetic powder.

[0181] like Figure 5A As shown in the figure, a coil insulating portion 80 is provided around the first spiral conductor portion 11 and the second spiral conductor portion 21 to prevent short circuits between turns of the same spiral conductor portion. In addition, an insulating interposer 90 is provided as an insulating portion between the first spiral conductor portion 11 and the second spiral conductor portion 21 to prevent short circuits between turns of the first spiral conductor portion 11 and turns of the second spiral conductor portion 21 arranged in the first direction with respect to the turns.

[0182] However, when the magnetic powder MP1 included in the first material constituting the first region 31 includes metal magnetic powder, if the particle size of the magnetic powder MP1 is larger than the thickness of the interposer 90, there is a concern that Figure 5A As shown, the magnetic powder MP1 is arranged in such a manner that a short-circuit path EP is formed between the turns of the first spiral conductor portion 11 and the turns of the second spiral conductor portion 21. The same short-circuit phenomenon may also occur between the turns of the first lead portion 14 and the second spiral conductor portion 21, and between the turns of the second lead portion 24 and the first spiral conductor portion 11. In the case where the material containing the magnetic powder MP1 is arranged around the coil portion 10 and pressurized to form the main body portion 30, sometimes the insulating portion of the coil portion 10 (the coil insulating portion 80, the interposer 90) is partially destroyed while the magnetic powder MP1 contacts the conductor of the coil portion 10. At this time, the possibility of the above-mentioned short-circuit phenomenon occurring is high.

[0183] Therefore, by making the shape distribution of the magnetic powder MP1 included in the first material different from the shape distribution of the magnetic powder MP2 included in the second material, a new function of suppressing short circuits in the coil part 10 is imparted to the main body part 30. Figure 5B In the present invention, the magnetic powder MP1 included in the first material is a metal magnetic powder having a smaller diameter than the magnetic powder MP2 included in the second material. Therefore, even if the insulating portion of the coil portion 10 (coil insulating portion 80, interposer 90) is partially damaged while the magnetic powder MP1 contacts the conductor of the coil portion 10, it is not easy to reach the level of short circuit.

[0184] It should be noted that the material constituting the interposer 90 is not limited as long as it has appropriate insulation properties. The interposer 90 may preferably have a volume resistivity of 1.0×10 14 Ωcm or more. The volume resistivity is more preferably 1.0×10 15 Ωcm or more, more preferably 1.0×10 16 The upper limit of the volume resistivity is not particularly limited. The volume resistivity may also be 1.0×10 20 Ωcm or less. In addition, the interposer 90 preferably has excellent dielectric properties. Specifically, it is sometimes preferred that the relative dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. The relative dielectric constant is more preferably less than 3.5, and further preferably less than 3.0. The lower limit of the relative dielectric constant is not particularly limited. The relative dielectric constant can also be greater than 1.0. For the measurement of the volume resistivity and relative dielectric constant of the interposer 90, a separately prepared material equivalent to the interposer 90 is modulated to the size required for the measurement and used. The material equivalent to the interposer 90 is the same as that of the coil insulation portion 80, and can be determined, for example, by analytical methods such as component analysis and FT-IR.

[0185] The material constituting the interposer 90 may be composed of an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. In the case where the interposer 90 is composed of a composite material, the inorganic material may also have a particle shape and be dispersed in a matrix composed of an organic material. As specific examples of organic materials, polyimide resins, polyethylene resins, polypropylene resins, polyamide resins, polyester resins, polyamide-imide resins, polysulfone resins, polycarbonate resins, liquid crystal polymer resins, polyvinylidene fluoride resins, polytetrafluoroethylene resins, etc. can be cited. As inorganic materials, especially as specific examples of inorganic materials in composite materials, inorganic materials such as oxides, carbides, nitrides, and inorganic salts can be exemplified. For example, as oxides, silicon dioxide, aluminum oxide, and zirconium oxide can be cited. In addition, for example, as carbides and nitrides, inorganic materials of silicon carbide and boron nitride can be cited respectively. As inorganic salts, for example, minerals such as wollastonite, kaolin, and mica can be cited. In terms of cost and insulation, oxide-based materials such as oxides, silicates, and phosphates are preferred. For example, the inorganic material preferably includes at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

[0186] From the viewpoint of more stably reducing the possibility of the above-mentioned short-circuit phenomenon, with regard to the shape distribution of the magnetic powder, it is sometimes preferred that when the second region is cut using a surface orthogonal to the first direction to obtain a second cut surface, and the first region is cut using a surface orthogonal to the first direction to obtain a first cut surface, the second cut surface is compared with the first cut surface to satisfy at least one of the following (a) to (d).

[0187] (a) The average equivalent circle diameter of the magnetic powder MP1 at the first cut surface, i.e., the first average equivalent circle diameter, is smaller than the average equivalent circle diameter of the magnetic powder MP2 at the second cut surface, i.e., the second average equivalent circle diameter.

[0188] (b) The median diameter of the magnetic powder MP1 at the first cut surface, i.e., the first median diameter, is smaller than the median diameter of the magnetic powder MP2 at the second cut surface, i.e., the second median diameter.

[0189] (c) The maximum equivalent circular diameter of the magnetic powder MP1 at the first cut surface, i.e., the first maximum equivalent circular diameter, is smaller than the maximum equivalent circular diameter of the magnetic powder MP2 at the second cut surface, i.e., the second maximum equivalent circular diameter.

[0190] (d) at least one of the distribution of the equivalent circular diameter of the magnetic powder MP2 at the second cut surface, i.e., the second diameter distribution, and the distribution of the equivalent circular diameter of the magnetic powder MP1 at the first cut surface, i.e., the first diameter distribution, has two or more peaks, and the equivalent circular diameter of the maximum frequency at the peak on the maximum diameter side of the peaks of the first diameter distribution, i.e., the first peak diameter, is smaller than the equivalent circular diameter of the maximum frequency at the peak on the maximum diameter side of the peaks of the second diameter distribution, i.e., the second peak diameter.

[0191] Regarding (a), there is a high possibility that relatively small-sized magnetic powder exists in the first region 31. Therefore, when the main body 30 is formed by a step including pressurizing the material containing the magnetic powder MP1, even if the insulating portion (coil insulating portion 80, inserter 90) provided on the surface of the annular conductor portion (first spiral conductor portion 11, second spiral conductor portion 21 and via portion VP) by pressurization is partially broken due to the magnetic powder, a short circuit is not likely to occur in the annular conductor portion.

[0192] The difference between the second average equivalent circular diameter and the first average equivalent circular diameter is sometimes preferably 1% or more and 5% or less based on the second average equivalent circular diameter. From the viewpoint of preventing short circuits in the annular conductor portion (the first spiral conductor portion 11, the second spiral conductor portion 21, and the via portion VP), the smaller the first average equivalent circular diameter, the more preferred it is, but there is a tendency for the filling rate to increase when the average equivalent circular diameter is small, so there is a concern that when the first average equivalent circular diameter is too small, the filling rate of the second region 32 becomes relatively low, and the magnetic resistance of the second region 32 increases. If it is set to the above range, it is possible to appropriately suppress the short circuit in the annular conductor portion while suppressing the magnetic resistance of the second region 32 from becoming relatively too high.

[0193] Regarding (b), the possibility of relatively small-sized magnetic powder existing in the first region 31 becomes higher. Therefore, in the case of forming the main body 30 including the step of pressurizing the material containing the magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion by pressurization is partially broken due to the magnetic powder, a short circuit is less likely to occur in the annular conductor portion.

[0194] The difference between the second median diameter and the first median diameter may be 1% or more and 5% or less based on the second median diameter. From the viewpoint of preventing short circuits in the annular conductor portion, the smaller the first median diameter, the more preferable it is, but there is a tendency for the filling rate to be higher when the median diameter is smaller, so there is a concern that when the first median diameter is too small, the filling rate of the second region 32 becomes relatively low, and the magnetic resistance of the second region 32 increases. If it is set to the above range, it is possible to appropriately suppress the short circuit in the annular conductor portion while suppressing the magnetic resistance of the second region 32 from becoming relatively too high.

[0195] Regarding (c), there is a high possibility that magnetic powder with relatively small particle size exists in the first region 31. Therefore, when the main body 30 is formed by a step including pressurizing the material containing the magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion by pressurization is partially broken by the magnetic powder MP1, a short circuit is not likely to occur in the annular conductor portion.

[0196] The difference between the second maximum equivalent circular diameter and the first maximum equivalent circular diameter is sometimes preferably 1% or more and 5% or less based on the second maximum equivalent circular diameter. From the viewpoint of preventing short circuits in the annular conductor portion, the smaller the first maximum equivalent circular diameter, the more preferred it is, but there is sometimes a tendency for the filling rate to increase when the maximum equivalent circular diameter is small, so there is sometimes a concern that when the first maximum equivalent circular diameter is too small, the filling rate of the second region 32 becomes relatively low, and the magnetic resistance of the second region 32 increases. If it is set to the above range, it is possible to appropriately suppress the short circuit in the annular conductor portion while suppressing the magnetic resistance of the second region 32 from becoming relatively too high.

[0197] In some cases, it is preferable that the second maximum equivalent circle diameter is 12.0 μm to 50.0 μm, and the first maximum equivalent circle diameter is 2.0 μm to 10.0 μm. The above ranges are likely to suppress the influence of increased magnetic resistance in the second region 32 while appropriately suppressing short circuits in the annular conductor portion.

[0198] Regarding (d), there is a high possibility that magnetic powder with relatively small particle size exists in the first region 31. Therefore, when the main body 30 is formed by a step including pressurizing the material containing the magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion by pressurization is partially broken by the magnetic powder MP1, a short circuit is not likely to occur in the annular conductor portion. Figure 5C The right side distribution of the two equivalent circle diameters shown has two peaks. When comparing the peaks on the maximum diameter side of the peaks of the two distributions, the right side distribution has a larger diameter. Figure 5C The two equivalent circle diameter distributions shown are: the left side is an example of the first diameter distribution, and the right side is an example of the second diameter distribution.

[0199] The difference between the second peak diameter and the first peak diameter is preferably 1% or more and 5% or less based on the second peak diameter. From the viewpoint of preventing short circuits in the annular conductor portion, the smaller the first peak diameter, the more preferred it is, but there is a tendency for the filling rate to increase when the peak diameter is small, so there is a concern that when the first peak diameter is too small, the filling rate of the second region 32 becomes relatively low, and the magnetic resistance of the second region 32 increases. If it is set to the above range, it is possible to appropriately suppress the short circuit in the annular conductor portion while suppressing the magnetic resistance of the second region 32 from becoming relatively too high.

[0200] In some cases, it is preferable that the second diameter distribution has more peaks than the first diameter distribution. In the second region 32 containing relatively large diameter magnetic powder, small diameter magnetic powder is contained to a degree having a peak, thereby easily increasing the filling rate of the magnetic powder MP2 and easily improving the magnetic properties of the second region 32. Figure 5C Of the two distributions of equivalent circle diameters shown, the distribution on the right side as an example of the second diameter distribution has two peaks.

[0201] In the case where the magnetic powder MP1 contains metal magnetic powder and the above-mentioned short circuit is concerned, from the viewpoint of more stably reducing the possibility of short circuit, it is sometimes preferred that at least one of the volume particle size distribution of the magnetic powder contained in the second region 32, i.e., the second particle size distribution, and the volume particle size distribution of the magnetic powder contained in the first region 31, i.e., the first particle size distribution, have two or more peaks, and the particle size with the maximum frequency at the peak on the maximum diameter side of the peak of the first particle size distribution, i.e., the first particle size, is smaller than the particle size with the maximum frequency at the peak on the maximum diameter side of the peak of the second particle size distribution, i.e., the second particle size.

[0202] There is a high possibility that relatively small-sized magnetic powder exists in the first region 31. Therefore, when the main body 30 is formed by a step including pressurizing a material containing the magnetic powder MP1, even if the insulating portion provided on the surface of the annular conductor portion by pressurization is partially broken due to the magnetic powder MP1, a short circuit is unlikely to occur in the annular conductor portion.

[0203] The difference between the second particle size and the first particle size is sometimes preferably 1% or more and 5% or less based on the second particle size standard. From the viewpoint of preventing short circuits in the annular conductor portion, the smaller the first particle size, the more preferred it is, but there is sometimes a tendency for the filling rate to increase when the particle size defined above is small, so there is sometimes a concern that when the first particle size is too small, the filling rate of the second region 32 becomes relatively low, and the magnetic resistance of the second region 32 increases. If it is set to the above range, it is possible to appropriately suppress the short circuit in the annular conductor portion while suppressing the magnetic resistance of the second region 32 from becoming relatively too high.

[0204] The second particle size distribution may preferably have more peaks than the first particle size distribution. In the second region 32 containing relatively large-diameter magnetic powder, small-diameter magnetic powder is contained to a degree having a peak, so that the filling rate of the magnetic powder MP2 is easily increased, and the magnetic properties of the second region 32 are easily high.

[0205] (Mechanical properties)

[0206] The second material may also be harder than the first material. The second region 32 is basically a region where the coil portion 10 does not exist, so by making the second region 32 hard, it is not easy to cause defects based on the main body 30. In addition, as described later, in the case of forming the main body 30 including the step of pressurizing the material containing the magnetic powder and the curable material along the first direction, the position control of the coil portion 10 in the main body 30 becomes easy.

[0207] From the viewpoint of stably achieving a second material that is harder than the first material, it is sometimes preferred that the area ratio of the magnetic powder at the second cut surface obtained by cutting the second region 32 with a surface orthogonal to the first direction, i.e., the second area ratio, is higher than the area ratio of the magnetic powder at the first cut surface obtained by cutting the first region 31 with a surface orthogonal to the first direction, i.e., the first area ratio.

[0208] From the perspective of ensuring both the hardness of the second region 32 and the proper magnetic and electrical properties of the coil component 100 by suppressing the effect of increased magnetic resistance in the first region 31, the difference between the second area ratio and the first area ratio is sometimes preferably greater than 1% and less than 5% based on the second area ratio standard.

[0209] (Variation Example)

[0210] Figure 6 It is an XZ cross-sectional view explaining a modified example (the first) of the coil component according to the embodiment of the present invention. Figure 6 The basic structure of the coil component 100A involved in one of the modified examples of the present embodiment shown is shared with the coil component 100. Since only the different points in structure are described, the description of the shared structure is omitted. In the coil component 100A involved in this example, there is an intermediate layer 33 composed of a mixed material of the first material and the second material between the first region 31 and the second region 32. Such an intermediate layer 33 is inevitably formed according to the manufacturing method. The intermediate layer 33 may also include an inclined region in which the composition changes in the direction including the first direction. By having such an intermediate layer 33, it is sometimes possible to avoid the influence of changes in characteristics between regions, such as an increase in local magnetic resistance, a decrease in local mechanical properties, etc.

[0211] Figure 7 It is an XZ cross-sectional view explaining a modified example (the second) of the coil component according to the embodiment of the present invention. Figure 7 The basic structure of the coil component 100B according to one of the modifications of the present embodiment shown is common to the coil component 100, and therefore only the differences in structure will be described, and description of the common structure will be omitted. Figure 2 In the coil component 100 shown in FIG. 1 , the second region 32 includes the entire second surface 302 of the main body 30, but in the coil component 100B involved in this example, the second region 32 has a first opposing portion 32F1 opposed to the first cross-surface external electrode 41b corresponding to the first covering portion of the first external electrode 41, and a second opposing portion 32F2 opposed to the second cross-surface external electrode 42b corresponding to the second covering portion of the second external electrode 42. Therefore, the second region 32 includes a portion of the second surface 302, and the first region 31 includes a portion of the second surface 302 that is not included in the second region 32. By having such a configuration relationship between the first region 31 and the second region 32, even if the second region 32 has a paradoxical function (high insulation but low magnetic permeability), the effect of the second region 32 can be suppressed to a minimum while obtaining the benefits of providing the second region 32.

[0212] It should be noted that Figure 2 The entire coil component 100 including the second surface 302 of the main body 30 as shown in the figure can also be said to include the first opposing portion 32F1 and the second opposing portion 32F2 in relationship with the coil component 100B, and has a continuous portion 32C, which is continuous with both the first opposing portion 32F1 and the second opposing portion 32F2 and includes a portion of the second surface 302.

[0213] Figure 8 It is an XZ cross-sectional view explaining a modified example (the third) of the coil component according to the embodiment of the present invention. Figure 8 The basic structure of the coil component 100C involved in one of the modified examples of the present embodiment shown is shared with the coil component 100, so only the points of structural difference are described, and the description of the shared structure is omitted. The annular conductor portion of the coil component 100 is connected to the second region 32 at the end portion, i.e., the second end portion 102, which is the end portion on the second surface 302 side in the first direction, but in the coil component 100C involved in this example, the second end portion 102 of the annular conductor portion is connected to the first region 31.

[0214] That is, in the coil component 100C involved in this example, the first region 31 is extended and arranged along the first direction in a manner that it is connected to both ends (the first end 101 and the second end 102) of the first direction in the portion of the coil portion 10 where the annular conductor portion is arranged. Specifically, the first region 31 is composed of a main portion 31C and an extended arrangement portion 31E, wherein the main portion 31C includes a first surface 301, is connected to the first end 101, and includes a central region CR, and the extended arrangement portion 31E is connected to the second end 102 and is extended and arranged along the XY direction. In this way, the material that is in contact with the annular conductor portion is all the first material, thereby sometimes being able to more stably enjoy the benefits of the first region 31 composed of the first material (suppressing short circuits in the coil portion 10 caused by local rupture of the insulating portion, etc.).

[0215] Fig. 9 It is an XZ cross-sectional view explaining a modified example (the 4 ) of the coil component according to the embodiment of the present invention. Fig. 9 The basic structure of the coil component 100D involved in one of the modified examples of the present embodiment shown is shared with the coil component 100, so only the points of difference in structure are described, and the description of the shared structure is omitted. In the coil component 100D involved in this example, the first external electrode 41 does not have the first lateral external electrode 41a but is composed of the first cross-plane external electrode 41b, and the second external electrode 42 does not have the second lateral external electrode 42a but is composed of the second cross-plane external electrode 42b. In the coil component 100D, the outer coating 61 is located in the portion where the first lateral external electrode 41a was once arranged, and the outer coating 62 is located in the portion where the second lateral external electrode 42a was once arranged.

[0216] Therefore, in the coil component 100D, the first end face of the coil portion 10 is constituted by the first connection end portion 15E, the second end face of the coil portion 10 is constituted by the second connection end portion 25E, and the portion electrically contacting the first substrate electrode E1 and the second substrate electrode E2 is only located on the mounting surface side (Z2 side in the Z1-Z2 direction). Therefore, in the substrate SB on which the coil component 100D is mounted, the area of ​​the first substrate electrode E1 and the second substrate electrode E2 can be reduced, specifically, the portion extending to the X2 side in the X1-X2 direction can be shortened with respect to the first substrate electrode E1, and the portion extending to the X1 side in the X1-X2 direction can be shortened with respect to the second substrate electrode E2. That is, by using the coil component 100D, the mounting density of the components mounted on the substrate SB can be increased.

[0217] (Method for manufacturing coil component)

[0218] The method for manufacturing the coil component according to the present embodiment is not particularly limited. However, a non-limiting example of the manufacturing method is as follows.

[0219] Fig. 10A It is an explanatory diagram (part 1) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XY plan view of a coil array sheet. Fig. 10B yes Fig. 10A XZ cross-sectional view at line C-C'. Fig.11 It is an explanatory diagram (part 2) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a coil array sheet and the like are arranged in a cavity of a mold. Fig.12 It is an explanatory diagram (part 3) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is an XZ cross-sectional view showing a state in which a molded body is formed by molding using a mold. Fig.13 It is an explanatory diagram (No. 4) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is a diagram showing a state before a molded body is cut. Fig.14 It is an explanatory diagram (part 5) of an example of a method for manufacturing a coil component according to an embodiment of the present invention, and is a diagram showing a state in which a molded body is cut to obtain coil chips.

[0220] First, if Fig. 10A XY top view and Fig. 10BAs shown in the XZ cross-sectional view, a plurality of coil portions 10 including a first spiral conductor portion 11 and a second spiral conductor portion 21, a first lead portion 14 and a second lead portion 24, and a first connecting conductor portion 15 and a second connecting conductor portion 25 form a coil array sheet 500 that is interconnected via a first connecting conductor portion 16 and a second connecting conductor portion 26. The manufacturing method is not limited, and a plating process can be used as described below. Specifically, first, a conductor layer (seed layer: seed layer) is formed on both sides of the surface of an insulating sheet substrate (Z1 side and Z2 side in the Z1-Z2 direction). Next, an electroplating treatment is performed to form a precipitate on the conductor layer by plating. Fig. 10B As shown, the conductor includes the first spiral conductor portion 11 and the second spiral conductor portion 21 , the first lead portion 14 and the second lead portion 24 , the first connecting conductor portion 15 and the second connecting conductor portion 25 , and the first connecting conductor portion 16 and the second connecting conductor portion 26 .

[0221] The method for forming the conductor is not limited. For example, a pattern of an insulating layer that becomes a negative image of the conductor may be formed on the conductor layer on the insulating sheet substrate, and an electroplating process may be performed to energize the conductor layer, thereby causing the plated precipitate to accumulate on the conductor layer exposed around the negative image pattern, thereby forming a conductor having a desired shape. It should be noted that in this plating process, the through hole of the sheet substrate is filled with the plated precipitate, thereby forming a via portion VP.

[0222] Next, in the sheet substrate on which the conductor is formed, at least a portion of the exposed portion that is not covered by the conductor in the Z1-Z2 direction is removed. Specifically, the sheet substrate is removed in a manner that includes the area surrounded by the inner edges of the first spiral conductor portion 11 and the second spiral conductor portion 21 in the sheet substrate when viewed along the first direction (Z1-Z2 direction). As described above, in the case of using a negative image composed of an insulating layer in the conductor forming step, the insulating layer is first removed, and then the conductor layer exposed in the Z1-Z2 direction by removing the insulating layer is removed. In this way, a portion of the sheet substrate is exposed as an exposed portion in the Z1-Z2 direction, and a process of removing the exposed portion is performed.

[0223] The specific removal process of the sheet substrate is appropriately set according to the constituent material of the sheet substrate. The removal process is roughly divided into dry processes such as plasma etching and wet processes such as wet etching. It is also possible to remove a portion of the sheet substrate by the removal process, and there is a remaining portion that is not removed. For example, it is also possible that the sheet substrate is composed of a composite material of a base portion and an inorganic material dispersed in the base portion, and the base portion is composed of an organic material. In the removal process, the base portion composed of the organic material is removed, thereby removing the sheet substrate.

[0224] Next, the coil insulating portion 80 is formed in a manner that covers the exposed surface of the conductor. Thus, the coil array sheet 500 is formed. It should be noted that in the above-mentioned manufacturing method, the portion of the insulating portion of the coil array sheet 500 that is covered by the conductor on both sides of the Z1-Z2 direction is not the coil insulating portion 80 but is composed of the remaining portion of the sheet substrate. Fig. 10B The illustration is omitted and the same as the coil insulating portion 80 .

[0225] A stacked structure having a coil array sheet 500 including a plurality of coil components 100 obtained in this way, a first member 311, and a second member 321 is arranged in the cavity 70C of the mold 70, wherein at least a portion of the first member 311 is located on one side of the first direction of the coil array sheet 500 (Z1 side in the Z1-Z2 direction), and the first member 311 includes a first magnetic powder and a first curable material, and the second member 321 is located on the other side of the first direction of the coil component 100 (Z2 side in the Z1-Z2 direction), and includes a second magnetic powder and a second curable material. Specifically, as Fig.11 As shown, the second member 321, a portion 311A ​​of the first member, the coil array sheet 500, and another portion 311B of the first member are sequentially arranged from the lower mold 71 side (Z2 side in the Z1-Z2 direction) to the upper mold 72 side (Z1 side in the Z1-Z2 direction) of the mold 70. In this way, the stacked structure having the coil array sheet 500, the first member 311, and the second member 321 is arranged in the cavity 70C of the mold 70.

[0226] The first member 311 includes a first magnetic powder and a first curable material, and becomes a first material body 310 composed of the first material, which constitutes the first region 31 including the central region CR after forming. The second member 321 includes a second magnetic powder and a second curable material, and becomes a second material body 320 composed of the second material, which constitutes the second region 32 after forming.

[0227] As mentioned above, in this specification, "curable material" includes cured materials and materials (polymerization initiators, etc.) that cure. Specifically, compounds containing active functional groups with high reactivity with other functional groups such as glycidyl, isocyanate, and carboxyl, and compounds containing functional groups (hydroxyl, amino, etc.) with active hydrogen that react with such active functional groups can be cited. Cross-linked substances containing multivalent ions such as magnesium and calcium are also included in curable materials. In the case where the curable material is polymerized by a free radical polymerization catalyst, compounds with ethylenically unsaturated bonds can also become curable materials. The polymerization catalyst that starts and continues the polymerization reaction of the material that performs the above-mentioned polymerization reaction is also included in the curable material. As a polymerization catalyst, urethane polymerization catalysts such as 2-(dimethylamino)ethanol, epoxy polymerization catalysts such as tetrabutylphosphonium bromide, olefin polymerization catalysts such as metallocene compounds, etc. are exemplified.

[0228] The second member 321 is different from the first member 311 in one or more selected from the group consisting of the following (1) to (6).

[0229] (1) the composition of the second magnetic powder and the composition of the first magnetic powder,

[0230] (2) the particle size distribution of the second magnetic powder and the particle size distribution of the first magnetic powder,

[0231] (3) the content of the second magnetic powder in the second member 321 and the content of the first magnetic powder in the first member 311,

[0232] (4) the composition of the second curable material and the composition of the first curable material,

[0233] (5) the content of the second curable material in the second member 321 and the content of the first curable material in the first member 311, and

[0234] (6) Composition of the second additive component and composition of the first additive component when the second member 321 contains the second additive component other than the second curable material and the second magnetic powder and the first member 311 contains the first additive component other than the first curable material and the first magnetic powder

[0235] Thus, the second material formed from the second member 321 can be made different from the first material formed from the first member 311 , and the characteristics of the second region 32 can be made different from the characteristics of the first region 31 .

[0236] The laminated structure thus obtained is subjected to a forming process including a step of increasing the pressure in the cavity, thereby Fig.12As shown, a formed body 500A is obtained from the stacked structure, and the formed body 500A has a coil portion 10 and a main body portion 30, specifically, a coil array sheet 500 including a plurality of coil portions 10, and a main body structural member 300 provided with the main body portion 30. The forming process for obtaining the formed body 500A from the stacked structure can also be heated in addition to pressurization. As described later, in the case where the degree of curing of the first curable material in the first member 311 is low, curing can sometimes be completed by, for example, heating.

[0237] It should be noted that the second member 321 and the part 311A ​​of the first member 311 may be made of different materials but may be integrated by preliminary heat treatment, etc. In this case, it is easy to arrange the stacked structure in the cavity 70C of the mold 70 .

[0238] The above-mentioned forming process may also include a step of curing the first curable material and the second curable material. By performing such a curing process, the first member 311 and the first material body 310 have different materials, and the second member 321 and the second material body 320 have different materials. Therefore, the first member 311 and the second member 321 can be given a unique function from the perspective of the forming process.

[0239] As a specific example of such inherent function, there can be cited the function of positioning the coil array sheet 500 in the mold during the molding process of the molded body 500A. Fig.11 As shown, in the case where the first direction is along the vertical direction (Z1-Z2 direction) and the second member 321 is arranged in a manner that is located below the coil array sheet 500, the second member 321 is harder than the first member 311. Thus, when the compression force in the first direction is applied to the mold 70, the coil array sheet 500 is easily embedded in the relatively soft first member 311, especially the part 311A ​​of the first member, but it is not easy to embed the relatively hard second member 321. Thus, during the forming process, the bottom of the vertical lower side (Z2 side in the Z1-Z2 direction) of the coil array sheet 500 is stable in a state of being connected to the upper end of the second member 321. Therefore, with respect to the coil array sheet 500 in the formed body 500A, the position accuracy in the vertical direction (first direction) can be improved. Specifically, in the coil component 100, it is easy to make the distance between the end of the Z2 side of the Z1-Z2 direction of the coil portion 10 and the second surface 302 in an appropriate range.

[0240] exist Fig.11In the state before the compression force in the first direction is applied to the mold 70, the front end portions of the first connecting conductor portion 15, the second connecting conductor portion 25, and the second connecting conductor portion 26 protruding downward (Z1-Z2 direction Z2 side) in the mold cavity 70C of the mold 70 are embedded in the interior of a portion 311A ​​of the relatively soft first member and abut against the end portion of the upper side (Z1-Z2 direction Z2 side) of the relatively hard second member 321. From this state, the upper mold 72 is moved downward to close the mold, and the front end portions of the first connecting conductor portion 15, the second connecting conductor portion 25, and the second connecting conductor portion 26 are embedded in the second member 321, but the lower side of the annular conductor portion, that is, the lower side of the second spiral conductor portion 21, is maintained in a state of abutting against the end portion of the upper side (Z1-Z2 direction Z2 side) of the second member 321, and the configuration accuracy of the coil array sheet 500 in the mold cavity 70C of the mold 70 is ensured by this portion.

[0241] Afterwards, if Fig.12 As shown in the figure, the main body structural member 300 composed of the first material body 310 and the second material body 320 is formed by solidification and integration of the first member 311 and the second member 321. In addition, the lower side of the second spiral conductor portion 21 is located at the boundary between the first material body 310 and the second material body 320 in the main body structural member 300, thereby ensuring the configuration accuracy of the coil array sheet 500 in the molded body 500A.

[0242] It should be noted that the first member 311 and the second member 321 may be in the so-called B stage (semi-cured stage) and may be cured after being softened temporarily when cured by heating. In this case, the annular conductor portion is easily embedded in the first member 311 during the softening of the first member 311, and the front end of the first connecting conductor portion 15, the second connecting conductor portion 25 and the second connecting conductor portion 26 is easily embedded in the second member 321 during the softening of the second member 321. In this case, even in the softened state, as long as the second member 321 is relatively harder than the first member 311, the state in which the lower side of the second spiral conductor portion 21 abuts against the end of the upper side (Z1-Z2 direction Z2 side) of the second member 321 can be maintained. Moreover, if the curing of the first member 311 and the second member 321 is advanced in this state, the adhesion between the first material body 310 and the second material body 320 is also improved, and it is easy to properly ensure the mechanical properties and magnetic properties of the main body structural member 300.

[0243] Making the second member 321 harder than the first member 311 can also be achieved by satisfying at least one of the following (I) to (VI).

[0244] (I) With respect to the laminated structure disposed in the cavity, the viscosity of the second curable material is higher than the viscosity of the first curable material,

[0245] (II) With respect to the laminated structure disposed in the cavity, the polymerization degree of the second curable material is higher than the polymerization degree of the first curable material

[0246] (III) With respect to the laminated structure disposed in the cavity, the content of the uncured material contained in the second curable material is less than the content of the uncured material contained in the first curable material.

[0247] (IV) The second curable material and the first curable material contain a polymerization catalyst, and with respect to the stacked structure disposed in the cavity, the content of the polymerization catalyst contained in the second curable material is greater than the content of the polymerization catalyst contained in the first curable material.

[0248] (V) With respect to the stacked structure disposed in the cavity, the volume ratio of the second magnetic powder contained in the second member 321 is greater than the volume ratio of the first magnetic powder contained in the first member 311.

[0249] (VI) With respect to the second curable material and the first curable material of the stacked structure disposed in the cavity, when the gel time defined in JIS K5600-9-1:2006 is measured, the gel time of the second curable material is shorter than the gel time of the first curable material

[0250] The second member 321 may have higher insulation than the first member 311. In this case, the insulation of the second material formed from the second member 321 can be made higher than the insulation of the first material formed from the first member 311.

[0251] When the coil portion 10 has an insulating portion (coil insulating portion 80, etc.) covering the surface of the annular conductor portion as in the present embodiment, and the first magnetic powder includes metal magnetic powder, when the second member 321 is cut to obtain a second member cut surface, and the first member 311 is cut to obtain a first member cut surface, it is sometimes preferred to satisfy at least one of the following (i) to (iv).

[0252] (i) The average equivalent circle diameter of the first magnetic powder at the cut surface of the first member, i.e., the average equivalent circle diameter of the first member, is smaller than the average equivalent circle diameter of the second magnetic powder at the cut surface of the second member, i.e., the average equivalent circle diameter of the second member

[0253] (ii) The median diameter of the first magnetic powder at the cut surface of the first member, i.e., the median diameter of the first member, is smaller than the median diameter of the second magnetic powder at the cut surface of the second member, i.e., the median diameter of the second member.

[0254] (iii) the maximum equivalent circular diameter of the first magnetic powder at the cut surface of the first member, i.e., the maximum equivalent circular diameter of the first member, is smaller than the maximum equivalent circular diameter of the second magnetic powder at the cut surface of the second member, i.e., the maximum equivalent circular diameter of the second member.

[0255] (iv) at least one of the distribution of the equivalent circular diameter of the second magnetic powder at the cut surface of the second component, i.e., the second component diameter distribution, and the distribution of the equivalent circular diameter of the first magnetic powder at the cut surface of the first component, i.e., the first component diameter distribution, has two or more peaks, and the equivalent circular diameter of the maximum frequency at the peak on the maximum diameter side of the peaks in the first component diameter distribution, i.e., the first component peak diameter, is smaller than the equivalent circular diameter of the maximum frequency at the peak on the maximum diameter side of the peaks in the second component diameter distribution, i.e., the second component peak diameter.

[0256] After the molded body 500A is formed in the cavity 70C of the mold 70, it is taken out from the mold 70 and Fig.13 The cut lines DL1 and DL2 shown cut the formed body 500A. Fig.14 As shown, a coil chip 100Z including a main body 30 and a coil 10 formed of a first region 31 and a second region 32 is obtained. The coil component 100 is obtained by forming outer coatings 50 and 60 on the coil chip 100Z and further forming first external electrodes 41 and second external electrodes 42.

[0257] Fig.15 and Fig.16 It is an explanatory diagram (1 and 2) of another example of a method for manufacturing a coil component according to an embodiment of the present invention, and is a method for manufacturing a coil component 100B. The manufacturing method of this example is basically the same as the example of the manufacturing method of the coil component 100 described above, so only the points with different structures or methods are described, and the description of the common structures and methods is omitted.

[0258] In the manufacturing method of the coil component 100B involved in this example, the first region 31 in the coil component 100 includes a portion of the second surface 302 of the main body 30, so the second member 321 provided to the second region 32 is different from the case of the manufacturing method of the coil component 100 and is discretely present on the bottom surface of the cavity 70C of the mold 70. Therefore, in the manufacturing method involved in this example, Fig.15 As shown, the peeling member RS ​​in which the second members 321 are discretely arranged is arranged on the bottom surface of the cavity 70C, and the coil array sheet 500 and the first member 311 are arranged thereon.

[0259] In this state, the upper mold 72 is moved in the first direction to close the mold, and the first member 311 and the second member 321 are cured by heating or the like, thereby Fig.16As shown, a molded body 501A is obtained in which the second material bodies 320 are discretely arranged and the first material body 310 is arranged so as to be in contact with the outer periphery of the second material body 320 in the XY direction. Thereafter, the coil component 100B is obtained by performing the same manufacturing method as the molded body 500A.

[0260] (Electronic and electrical equipment)

[0261] The electronic and electrical equipment involved in one embodiment of the present invention is an electronic and electrical equipment installed with the coil components 100, 100A, 100B, 100C, 100D involved in one embodiment of the present invention, and the coil components 100, 100A, 100B, 100C, 100D are connected to the substrate SB through the terminal parts (first external electrode 41 and second external electrode 42) provided on the exposed conductor parts (for example, the first lead end part 14E and the second lead end part 24E), and the exposed conductor parts are located at each of the two ends of the coil part 10 and exposed to the outside. The electronic and electrical equipment involved in one embodiment of the present invention is installed with the coil components 100, 100A, 100B, 100C, 100D involved in one embodiment of the present invention, so the miniaturization of the equipment is also easy, especially the coil component 100D is easy to cope with high-density installation, so the miniaturization of the equipment equipped with them is particularly easy. Furthermore, even if a large current flows through the device or a high frequency is applied, the characteristics of the coil components 100 , 100A, 100B, 100C, and 100D are unlikely to be degraded or problems due to heat generation are unlikely to occur.

[0262] The embodiments and examples described above are provided to facilitate understanding of the present invention and are not provided to limit the present invention. Therefore, it is intended that each element disclosed in the above embodiments also includes all design changes and equivalents belonging to the technical scope of the present invention.

Claims

1. A coil component, characterized in that: The coil component comprises: a coil portion having an annular conductor portion having a central axis along a first direction and having two electrical ends; and a main body portion, which covers the annular conductor portion with a first surface and a second surface arranged in the first direction and contains magnetic powder and a binder, The coil portion is exposed from the surface of the main body portion at a first end surface connected to one of the two electrical ends of the annular conductor portion and a second end surface connected to the other of the two electrical ends of the annular conductor portion. The main body comprises: a first region including the entire central region of the outer periphery that is in contact with the inner peripheral surface of the annular conductor portion and the first surface, and made of a first material; and a second region, which includes at least a portion of the second surface and is made of a second material, The first material and the second material differ in one or more elements selected from the group consisting of the following elements: The composition of the magnetic powder, The distribution related to the shape of the magnetic powder is the shape distribution, The content of the magnetic powder, The composition of the binder, The content of the binder, and When a third component other than the magnetic powder and the binder is contained, the composition of the third component and the content of the third component.

2. The coil component according to claim 1, wherein The second material has higher insulating properties than the first material.

3. The coil component according to claim 2, wherein: The coil component further includes a first external electrode and a second external electrode which are separated from each other and provided on the main body, the first external electrode being electrically connected to the first end surface, and the second external electrode being electrically connected to the second end surface. The first external electrode has a first covering portion covering a portion of the second surface, and the second external electrode has a second covering portion covering a portion of the second surface, The second region has a first opposing portion opposing the first covering portion and a second opposing portion opposing the second covering portion.

4. The coil component according to claim 3, wherein: The first end surface has a first exposed surface that is exposed from the main body at the second surface and is in contact with the first external electrode. The second end surface has a second exposed surface that is exposed from the main body portion at the second surface and is in contact with the second external electrode.

5. The coil component according to claim 3, wherein The second region includes a continuous portion that is continuous with both the first opposing portion and the second opposing portion and includes a portion of the second surface.

6. The coil component according to claim 2, wherein: The second region has a higher specific resistance than the first region.

7. The coil component according to claim 2, wherein: The magnetic powder comprises metal magnetic powder, The relative magnetic permeability (μ2) of the second region is smaller than the relative magnetic permeability (μ1) of the first region.

8. The coil component according to claim 7, wherein A separation distance (d2) between an end of the coil portion proximal to the second surface in the first direction and the second surface is greater than a separation distance (d1) between an end of the coil portion proximal to the first surface in the first direction and the first surface.

9. The coil component according to claim 1, wherein The annular conductor portion is in contact with the first region at an end portion on the second surface side in the first direction.

10. A method for manufacturing a coil component, The coil component has: a coil portion having an annular conductor portion having a central axis in a first direction and having two electrical ends; and a main body portion, which covers the annular conductor portion with a first surface and a second surface arranged in the first direction and contains magnetic powder, The method for manufacturing the coil component is characterized in that: A stacked structure consisting of the coil component, the first member and the second member is arranged in a mold cavity. At least a portion of the first member is located on one side of the coil component in the first direction, and the first member includes a first magnetic powder and a first curable material. The second member is located on the other side of the coil component in the first direction and includes a second magnetic powder and a second curable material. The method for manufacturing the coil component includes the step of increasing the pressure in the cavity to obtain a molded body consisting of the coil component and the main body from the stacked structure. In the molded body, the entire central region of the outer peripheral edge that is in contact with the inner peripheral surface of the annular conductor portion is formed of a material obtained from the first member.

11. The method for manufacturing a coil component according to claim 10, wherein: The first component and the second component differ in one or more elements selected from the group consisting of the following elements: the composition of the first magnetic powder and the composition of the second magnetic powder, the particle size distribution of the first magnetic powder and the particle size distribution of the second magnetic powder, the content of the first magnetic powder in the first member and the content of the second magnetic powder in the second member, the composition of the first curable material and the composition of the second curable material, the content of the first curable material in the first member and the content of the second curable material in the second member, and When the first member contains a first additive component other than the first curable material and the first magnetic powder and the second member contains a second additive component other than the second curable material and the second magnetic powder, the composition of the first additive component and the composition of the second additive component.

12. The method for manufacturing a coil component according to claim 10, wherein: The method for manufacturing the coil component includes the step of curing the first curable material and the second curable material.

13. The method for manufacturing a coil component according to claim 11, wherein: The second material body produced by including the step of curing the second curable material in the second member has higher insulation properties than the first material body produced by including the step of curing the first curable material in the first member.

14. The method for manufacturing a coil component according to claim 13, wherein: The coil portion includes a first connection conductor portion connected to one of the two electrical ends of the annular conductor portion, and a second connection conductor portion connected to the other of the two electrical ends of the annular conductor portion. The first connecting conductor portion is exposed from the second surface at the first end surface, The second connecting conductor portion is exposed from the second surface at the second end surface, In the molded body, the first connecting conductor portion and the second connecting conductor portion have portions buried in the second material body.

15. An electronic and electrical device having the coil component according to claim 1 mounted therein, wherein: The coil component is connected to the substrate via a terminal portion provided on an exposed conductor portion that is located at each of two end portions of the coil portion and is exposed to the outside.

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