A single-chip wafer degumming and cleaning device

Abstract

The present invention provides a single-chip wafer degumming and cleaning device, comprising: a liquid storage tank and at least one group of soaking tanks, wherein at least one supporting seat for supporting a single wafer is installed in the soaking tank, and the degumming liquid that covers the upper surface of the wafer supported by the supporting seat is contained in the soaking tank; a spray assembly is arranged in the soaking tank just above the supporting seat, and the spray assembly has a spray pipe and a spray body, and the liquid storage tank is connected to one end of the spray pipe passing through the soaking tank so that the spray body sprays the degumming liquid onto the upper surface of the wafer supported by the supporting seat. The present invention is used to solve the problem that the adhesive may not be completely softened and is difficult to be found in the batch soaking wafer method in the prior art, which affects the subsequent wafer process, and effectively improves the stripping efficiency of the adhesive on the wafer surface by combining the single-chip soaking method with the spray degumming method.

Description

Technical Field

[0001] The invention relates to the field of wafer cleaning equipment, and in particular to a single-chip wafer degumming and cleaning equipment. Background Art

[0002] Wafer photolithography is an important step in semiconductor technology. Its process includes wafer production, photoresist coating, exposure, development and cleaning. After the photoresist coated on the wafer surface undergoes subsequent exposure and development processes, the residual photoresist and other impurities on the surface need to be removed by cleaning. Existing wafer debonding equipment usually uses the immersion debonding method to remove the photoresist attached to the wafer surface.

[0003] The purpose of immersion degumming is to soften the photoresist remaining on the surface of the wafer. After the photoresist remaining on the surface of the wafer is softened by immersion, it can fall off from the surface of the wafer after the subsequent cleaning steps, thereby achieving the purpose of degumming and stripping. In the existing wafer degumming and stripping equipment, a batch immersion method is usually adopted, that is, a certain number of wafers are arranged in a wafer basket, and then the wafer basket and several wafers inside are immersed in the degumming liquid as a whole to achieve the effect of degumming and stripping. When there are a large number of adhesives on the surface of the wafer, these adhesives cover a large area of ​​the surface of the wafer, so it takes a long time to immerse them to achieve a good removal effect. In addition, the method of immersing the wafers in batches takes a long immersion time and still cannot guarantee whether the immersion degumming effect of each wafer meets the requirements, and then the basket containing several wafers is transferred as a whole to the cleaning equipment for cleaning as a whole.

[0004] Since the softening effect of the adhesive attached to the surface of each wafer cannot be guaranteed during the overall immersion process, when some of the adhesives on the wafers in the basket are not softened properly, the adhesives are still not removed after batch cleaning and the subsequent wafer processing cannot be carried out normally. In view of this, it is necessary to improve the wafer debonding and stripping equipment in the prior art to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to disclose a single-chip wafer debonding and cleaning equipment to solve the problem that the adhesive may not be completely softened and is difficult to be detected in the batch immersion method of wafers in the prior art, which affects the subsequent wafer process. The efficiency of stripping the adhesive on the wafer surface is effectively improved by combining the single-chip immersion method with the spray debonding method.

[0006] To achieve the above-mentioned object, the present invention provides a single-piece wafer degumming and cleaning device, comprising: a liquid storage tank and at least one set of immersion tanks, wherein at least one support seat for supporting a single wafer is installed in the immersion tank, and the degumming liquid that covers the upper surface of the wafer supported by the support seat is contained in the immersion tank;

[0007] A spray assembly is arranged in the immersion tank just above the support seat, and the spray assembly has a spray pipe and a spray body. The liquid storage tank is connected to one end of the spray pipe passing through the immersion tank so that the spray body sprays the degumming solution onto the upper surface of the wafer supported by the support seat.

[0008] As a further improvement of the present invention, the immersion tanks are provided in multiple groups, and the multiple groups of immersion tanks are arranged from top to bottom with their axes overlapping each other, and the upper and lower groups of adjacent immersion tanks are isolated and fixed by a mounting plate, and the side walls of the immersion tanks in the length direction are provided with a clearance groove for wafer placement;

[0009] A liquid supply component is provided in the soaking tank, which is distributed along the length direction of the soaking tank, and the two ends are U-shaped and pass through the side wall of the soaking tank. Two or more groups of supporting seats are arranged in the soaking tank along the length direction, and each group of supporting seats is correspondingly provided with a group of spraying components.

[0010] As a further improvement of the present invention, the spray body is configured as a spray plate parallel to the plane where the wafer is located, the top of the spray plate is fixedly connected to the lower surface of the mounting plate, a plurality of liquid outlet holes are provided on the lower surface of the spray plate, and the spray pipeline includes a connecting pipe and a liquid pipe, and the connecting pipe is configured as two, one ends of the two connecting pipes are respectively connected to the side walls of the spray plate and the other ends are collected to the liquid pipe through a three-way joint, and the liquid pipe passes through the side wall of the immersion tank and is connected to the liquid storage tank.

[0011] As a further improvement of the present invention, the liquid supply assembly includes a first liquid supply pipeline and a second liquid supply pipeline, the first liquid supply pipeline is composed of a first liquid outlet pipe and two first liquid inlet pipes, the second liquid supply pipeline is composed of a second liquid outlet pipe and two second liquid inlet pipes, the first liquid outlet pipe and the second liquid outlet pipe are both arranged along the length direction of the immersion tank, the first liquid outlet pipe is arranged above the second liquid outlet pipe and the diameter of the first liquid outlet pipe is larger than the diameter of the second liquid outlet pipe;

[0012] The two ends of the two first liquid inlet pipes are respectively connected to the two ends of the first liquid outlet pipe and then pass through the side wall of the immersion tank. The two ends of the two second liquid inlet pipes are respectively connected to the two ends of the second liquid outlet pipe and then pass through the side wall of the immersion tank.

[0013] As a further improvement of the present invention, a recovery hole is opened in the wall of the immersion tank, a filter is arranged around the recovery hole in the immersion tank, the recovery hole is connected to a liquid storage tank through a recovery pipe, the liquid storage tank is connected to a filtering device, the degumming liquid returning to the liquid storage tank from the recovery hole is filtered by the filtering device and then returned to the liquid storage tank again, and then sprayed onto the wafer surface by the spray plate after passing through the liquid pipe and the connecting pipe.

[0014] As a further improvement of the present invention, the immersion tank arranged first from top to bottom covers a support plate, and an inspection station is arranged on the upper surface of the support plate, and the inspection station supports the single wafer through the support seat.

[0015] As a further improvement of the present invention, the support seat includes a base and at least three support rods mounted on the top of the base, one end of the plurality of support rods converges at one point and is fixed to each other, and the other end is uniformly divergent along a radial direction parallel to the wafer;

[0016] The plurality of support rods are each provided with a first positioning column for positioning a wafer of a first size and a second positioning column for positioning a wafer of a second size, and the diameter of the wafer of the first size is greater than the diameter of the wafer of the second size.

[0017] As a further improvement of the present invention, the last immersion tank arranged from bottom to top is assembled on a connecting plate, and the connecting plate is provided with a plurality of connectors, and the liquid passing pipe and the recovery pipe are connected to the liquid storage tank through the connectors.

[0018] As a further improvement of the present invention, the liquid storage tank has a visible side wall configured as a transparent plate, the visible side wall is provided with a scale along the height direction, and the liquid storage tank is connected to the filtering device through a pump body.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: first, at least one group of supporting seats are arranged in the soaking tank, and the supporting seats are used to hold wafers in a single-piece manner. First, a degumming liquid is introduced into the soaking tank, and the wafer located at the supporting seat is immersed in the degumming liquid to achieve the purpose of soaking and softening the adhesive on its surface. Then, liquid is supplied to the spray assembly through the liquid storage tank, and the degumming liquid is introduced into the spray body through the spray pipe. While the wafer is degummed by single-piece soaking, the spray body sprays the degumming liquid on its surface to achieve the purpose of washing away the adhesive softened by soaking on the surface of the wafer. Compared with the batch soaking method of the prior art, the single-piece soaking method of the wafer is firstly used to observe the softening degree of the adhesive on the surface of the wafer in time, and further cooperates with the spray flushing to accelerate the separation of the adhesive softened by soaking on the surface of the wafer from its surface, thereby achieving the effect of effectively removing the adhesive on the surface of the wafer and improving the efficiency of adhesive removal, avoiding the problem of incomplete adhesive removal affecting the subsequent wafer process.

[0020] Secondly, the soaking tank is provided with multiple groups of supporting seats from top to bottom and the axes overlap each other, and each soaking tank is provided with no less than two supporting seats, which can soak and spray degumming four or more wafers at the same time. In addition, the liquid supply component in each soaking tank is composed of a first liquid supply pipe and a second liquid supply pipe, and two kinds of liquids are introduced into the soaking tank through the first liquid supply pipe and the second liquid supply pipe, and the diameter of the first liquid outlet pipe of the first liquid supply pipe is controlled to be larger than the diameter of the second liquid outlet pipe of the second liquid supply pipe, so as to control the flow of the degumming liquid in the first liquid outlet pipe and the second liquid outlet pipe, and then control the ratio of the two degumming liquids entering the soaking tank, and after the two degumming liquids with controlled ratios are mixed, a good degumming effect on the wafers inside the soaking tank is achieved.

[0021] Finally, by forming a recovery hole in the soaking tank and arranging a filter element around the recovery hole, the degumming liquid mixed with the adhesives detached from the wafer surface in the soaking tank is filtered once by the filter element and collected into the liquid storage tank by the recovery pipe, while the larger pieces of adhesives remain in the soaking tank. The degumming liquid recovered to the liquid storage tank through the recovery pipe is then filtered twice by the filter device to remove the smaller pieces of adhesives mixed in the degumming liquid to obtain a degumming liquid with fewer impurities. The degumming liquid after the secondary filtration returns to the liquid storage tank and is passed into the spray plate through the liquid passing pipe and the connecting pipe to perform spray degumming on the wafer surface in coordination with the degumming by soaking. By designing that the degumming liquid for spray degumming on the wafer surface is recovered from the soaking tank, when there is a sufficient amount of degumming liquid in the liquid storage tank, no additional replenishment is required, thereby achieving the purpose of recycling the degumming liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the specific structure of the single-chip wafer degumming and cleaning equipment used in the present invention;

[0023] Figure 2 It is a schematic diagram of the mechanism for reflecting the top immersion tank and the detection station in the present invention;

[0024] Figure 3 It is a structural schematic diagram for reflecting the arrangement of various components inside the soaking tank in the present invention;

[0025] Figure 4 It is a schematic diagram of the structure of the supporting seat, the spraying assembly and the liquid supply assembly in the present invention;

[0026] Figure 5 for Figure 3 Enlarged view of part A in the middle;

[0027] Figure 6 It is an exploded view used to reflect the matching relationship between the spray assembly and the supporting seat in the present invention;

[0028] Figure 7 for Figure 6 Enlarged view of middle part B;

[0029] Figure 8 It is a structural schematic diagram for reflecting the liquid path connection relationship between the liquid storage tank and the filtering device in the present invention. DETAILED DESCRIPTION

[0030] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0031] Ginseng Figures 1 to 8 As shown, a single-chip wafer degumming and cleaning device disclosed by the present invention has an immersion tank 1 and a liquid storage tank 3. The immersion tank 1 is provided with at least one set of supporting seats 2. The supporting seats 2 are used to hold single-chip wafers 5. First, degumming liquid is introduced into the immersion tank 1, and the wafer 5 located at the supporting seat 2 is immersed in the degumming liquid to achieve the purpose of soaking and softening the adhesive on its surface. Then, liquid is supplied to the spray component 4 through the liquid storage tank 3, and the degumming liquid is introduced into the spray body 42 through the spray pipe 41. While the wafer 5 is degummed by single-chip immersion, the degumming liquid is sprayed on its surface by the spray body 42 to achieve the purpose of washing away the adhesive softened by soaking on the surface of the wafer 5. Compared with the batch immersion method of wafers in the prior art, the single-wafer immersion method is first used to timely observe the softening degree of the adhesive on the surface of the wafer 5, and further cooperate with the spray component 4 to rinse it to accelerate the detachment of the adhesive softened by immersion on the surface of the wafer 5, thereby achieving the effect of effectively removing the adhesive on the surface of the wafer 5 while improving the efficiency of adhesive removal, thereby avoiding the problem of the wafer being affected by incomplete adhesive removal in subsequent processes.

[0032] Ginseng Figures 1 to 8 As shown, in this embodiment, the single-chip wafer degumming and cleaning equipment (hereinafter referred to as the degumming and cleaning equipment) includes a liquid storage tank 3 and at least one group of immersion tanks 1, and the immersion tank 1 is equipped with at least one supporting seat 2 for supporting a single wafer 5, and the immersion tank 1 is filled with degumming liquid that covers the upper surface of the wafer 5 supported by the supporting seat 2; a spray component 4 is arranged in the immersion tank 1 directly above the supporting seat 2, and the spray component 4 has a spray pipe 41 and a spray body 42, and the liquid storage tank 2 is connected to one end of the spray pipe 41 passing through the immersion tank 1 so that the spray body 42 sprays the degumming liquid onto the upper surface of the wafer 5 supported by the supporting seat 2.

[0033] In the present embodiment, at least one set of supporting seats 2 located in the immersion tank 1 is first used to support the wafer 5 in a single piece, and then a degumming solution that can cover the single-piece support on the supporting seat 2 is introduced into the immersion tank 1 through the liquid supply component 13. Compared with the method of placing wafers in batches in a wafer basket for uniform immersion degumming in the prior art, the wafers 5 in a single piece immersed in the degumming solution in the present embodiment first have the effect of facilitating timely checking the degree of softening of the adhesive on their surface, and effectively avoiding the problem of incomplete softening of the adhesive on the wafers stored in the middle of the wafer basket in the prior art but difficult to be detected. Furthermore, since the wafer 5 is placed in a single piece on the support seat 2 in this embodiment, when a wafer robot (not shown) is used to place it on the support seat 2, it can be ensured that the wafer 5 is placed on the support seat 2 with the side attached to the adhesive facing upward. Firstly, it is ensured that the surface of the wafer 5 to which the adhesive is attached can contact with the debonding solution filled in the immersion tank 1 in a non-interference state, thereby ensuring a good immersion debonding effect. Secondly, in this embodiment, the spray assembly 4 arranged directly above the support seat 2 is used to simultaneously spray and rinse the surface of the wafer 5 to which the adhesive is attached, thereby achieving the effect of washing away the softened adhesive on the surface of the wafer 5 after immersion in the debonding solution, so that the wafer 5 can proceed to the next cleaning step in a state where there is no adhesive on the surface. Compared with the prior art, the debonding and cleaning efficiency of the wafer 5 is effectively improved, and the problem of adhesive residue still remaining on the wafer 5 after the debonding and cleaning step is effectively avoided.

[0034] Ginseng Figures 1 to 4 As shown, the immersion tank 1 is provided with multiple groups, and the multiple groups of immersion tanks 1 are arranged from top to bottom with their axes overlapping each other. The upper and lower groups of adjacent immersion tanks 1 are separated and fixed by a mounting plate 11. The side wall of the immersion tank 1 in the length direction is provided with a makeshift groove 12 for the wafer 5 to be placed. A liquid supply component 13 is provided in the immersion tank 1. The liquid supply component 13 is distributed along the length direction of the immersion tank 1, and both ends are U-shaped and pass through the side wall of the immersion tank 1. Specifically, the liquid supply component 13 includes a first liquid supply pipeline 131 and a second liquid supply pipeline 132. The first liquid supply pipeline 131 is composed of a first liquid outlet pipe 1311 and two first liquid inlet pipes 1312. The second liquid supply pipeline 132 is composed of a second liquid outlet pipe 1321 and two second liquid inlet pipes 1322. Two or more groups of supporting seats 2 are arranged in the immersion tank 1 along the length direction. Specifically, refer to FIG. Figure 3 and Figure 4 As shown, in this embodiment, three supporting seats 2 are arranged in each soaking tank 1 along the length direction.

[0035] Specific combination Figure 1 and Figure 3As shown, in this embodiment, multiple groups of soaking tanks 1 are arranged from top to bottom with the axes overlapping each other. Specifically, in this embodiment, two soaking tanks 1 are coaxially arranged, and three supporting seats 3 are arranged in each soaking tank 1, so that six wafers 5 can be soaked and sprayed for degumming at the same time. When it is necessary to perform degumming process on wafer 6, a wafer manipulator (not shown) is used to place wafer 5 into soaking tank 1 from the yielding groove 12 and place it on any supporting seat 2 inside it. A total of six wafers 5 can be degummed in the upper and lower soaking tanks 1, and because the two soaking tanks 1 are isolated and supported by the mounting plate 11, the working states of the two soaking tanks 1 are independent of each other and will not affect each other. According to the actual wafer production needs, it can be selected to use two soaking tanks 1 at the same time or to use a soaking tank 1 alone.

[0036] Ginseng Figure 3 and Figure 4 As shown, the first liquid outlet pipe 1311 and the second liquid outlet pipe 1321 are both arranged along the length direction of the immersion tank 1, the first liquid outlet pipe 1311 is arranged above the second liquid outlet pipe 1321 and the diameter of the first liquid outlet pipe 1311 is larger than the diameter of the second liquid outlet pipe 1321; the two first liquid inlet pipes 1312 are respectively connected to the two ends of the first liquid outlet pipe 1311 and then pass through the side wall of the immersion tank 1, and the two second liquid inlet pipes 1322 are respectively connected to the two ends of the second liquid outlet pipe 1321 and then pass through the side wall of the immersion tank 1. It should be noted that a partition 18 is fixed perpendicular to the bottom surface in the immersion tank 1 between two adjacent supporting seats 2, and the first liquid outlet pipe 1311 is fixed in the immersion tank 1 through the partition 18. The partition 18 has a liquid outlet 181 for the degumming liquid to flow in the immersion tank 1. The second liquid outlet pipe 1321 is arranged below the first liquid outlet pipe 1311 and passes through the liquid outlet 181. The bottom surface of the immersion tank 1 is installed with a positioning clamp 19 for fixing the second liquid outlet pipe 1321.

[0037] In this embodiment, the diameter of the first liquid outlet pipe 1311 of the first liquid supply pipe 131 is controlled to be larger than the diameter of the second liquid outlet pipe 1321 of the second liquid supply pipe 132, thereby controlling the flow of the degumming liquid in the first liquid outlet pipe 1311 and the second liquid outlet pipe 1321, and further controlling the ratio of the two degumming liquids entering the immersion tank 1. After mixing, the two degumming liquids with the controlled ratio have a good degumming effect on the wafer 5 inside the immersion tank 1. It should be noted that the first liquid outlet pipe 1311 and the two first liquid inlet pipes 1312 are connected end to end to form a U-shape, and the second liquid outlet pipe 1321 and the two second liquid inlet pipes 1322 are connected end to end to form a U-shape, and the first liquid outlet pipe 1311 is arranged directly above the second liquid outlet pipe 1321. For specific installation postures, please refer to Figure 3 and Figure 4As shown, through this design, while achieving the purpose of introducing two kinds of degumming liquids into the soaking tank 1, the installation space occupied by the first liquid supply pipe 131 and the second liquid supply pipe 132 in the soaking tank 1 can be effectively reduced, so that there is enough space in the soaking tank 1 for installing three sets of supporting seats 2. Further, through the U-shaped design of the first liquid supply pipe 131 and the second liquid supply pipe 132, the internal space of the soaking tank 1 can be reduced, and the installation is more stable, and the injection efficiency of the degumming liquid in the soaking tank 1 can be significantly improved by introducing liquid into the two first liquid inlet pipes 1312 and the two second liquid inlet pipes 1322 at the same time, and the first liquid outlet pipe 1311 and the second liquid outlet pipe 1321 both have through holes (not shown) for the degumming liquid to flow out.

[0038] Ginseng Figures 3 to 6 As shown, each group of supporting seats 2 is correspondingly provided with a group of spraying components 4. The spraying body 42 of the spraying component 4 is set as a spraying plate 421 parallel to the plane where the wafer 5 is located, the top of the spraying plate 421 is fixedly connected to the lower surface of the mounting plate 11, and a plurality of liquid outlet holes 422 are provided on the lower surface of the spraying plate 421. The spraying pipeline 41 includes a connecting pipe 411 and a liquid pipe 412. The connecting pipe 411 is provided with two channels, one end of the two connecting pipes 411 is respectively connected to the side wall of the spraying plate 421, and the other end is collected to the liquid pipe 412 through a three-way joint 413. The liquid pipe 412 passes through the side wall of the immersion tank 1 and is connected to the liquid storage tank 3.

[0039] Ginseng Figures 1 to 6 as well as Figure 8 As shown, a recovery hole 14 is provided in the wall of the soaking tank 1, and a filter 141 is arranged around the recovery hole 14 in the soaking tank 1. The recovery hole 14 is connected to the liquid storage tank 3 through a recovery pipe 142. The liquid storage tank 3 is connected to a filter device 31. The degumming liquid that flows back from the recovery hole 14 to the liquid storage tank 3 is filtered by the filter device 31 and then flows back to the liquid storage tank 3 again. After passing through the liquid pipe 412 and the connecting pipe 411, it is evenly sprayed onto the surface of the wafer 5 through the liquid outlet 422 of the spray plate 421. The liquid storage tank 3 has a visible side wall 32 that is set as a transparent plate (for example, glass, transparent plastic, etc.), and a scale 33 is provided on the visible side wall 32 along the height direction. The liquid storage tank 3 is connected to the filter device 31 through a pump body 35. It should be noted that the liquid storage tank 3 and the filter device 31 are connected via a circulating liquid circuit 34. Specifically, the circulating liquid circuit 34 includes a first tube body 341 and a second tube body 342, wherein one end of the second tube body 342 is connected to the bottom wall of the liquid storage tank 3, and the other end is connected to the liquid inlet end 312 of the filter device 31 after passing through the pump body 35; one end of the first tube body 341 is connected to the liquid outlet end 311 of the filter device 31, and the other end is connected to the visible side wall 32 near the top wall. The specific liquid flow direction in the circulating liquid circuit 34 is reference numeral 341. Figure 8 Indicated by the arrow.

[0040] By forming a recovery hole 14 in the soaking tank 1 and setting a filter 141 around the recovery hole 14, the debonding liquid mixed with the adhesives removed from the surface of the wafer 5 in the soaking tank 1 is filtered once by the filter 141 and then collected by the recovery pipe 142 into the liquid storage tank 3. Specifically, the filter 141 is set as follows: Figure 4 and Figure 5 In the filter screen installed in the state shown, the relatively large pieces of adhesives in the degumming liquid are filtered out by the filter element 141 so that they remain in the immersion tank 1. The degumming liquid recovered to the liquid storage tank 3 through the recovery pipe 142 is then filtered twice by the filter device 31 to remove the relatively small pieces of adhesives mixed in the degumming liquid to obtain a degumming liquid with less impurities. The degumming liquid after the secondary filtration returns to the liquid storage tank 3 and is then passed into the spray plate 421 through the liquid passing pipe 412 and the connecting pipe 411 to perform spray degumming on the surface of the wafer 3 in coordination with the degumming by immersion. By designing that the degumming liquid sprayed on the surface of the wafer 5 is recovered from the soaking tank 1, when there is a sufficient amount of degumming liquid in the liquid storage tank 3, no additional replenishment is required, so as to achieve the effect of recycling the degumming liquid in the soaking tank 1, that is, the first liquid outlet pipe 1311 and the second liquid outlet pipe 1321 are respectively introduced into the two degumming liquids in the soaking tank 1 to mix and soak the wafer 5 for degumming, and then the two degumming liquids are filtered and sprayed on the surface of the wafer 5 through the spray assembly 4, so as to effectively improve the utilization rate of the degumming liquid to achieve a certain effect of reducing the wafer production cost. It should be noted that the filter device 31 is a filter with a filter element (not shown) inside.

[0041] Ginseng Figure 6 and Figure 7 As shown, the support seat 2 includes a base 22 and no less than three support rods 21 mounted on the top of the base 22. One end of the multiple support rods 21 converges at one point and is fixed to each other, and the other end is uniformly divergent along a radial direction parallel to the wafer 5; the multiple support rods 21 are each provided with a first positioning column 211 for positioning a first-size wafer 51 and a second positioning column 212 for positioning a second-size wafer 52. The diameter of the first-size wafer 51 is greater than the diameter of the second-size wafer 52, and the height of the first positioning column 211 is greater than the height of the second positioning column 212. It should be noted that, Figure 7As shown, each supporting rod 21 has three first positioning posts 211 and three second positioning posts 212, and the three first positioning posts 211 include one first positioning post 211 with a smaller height for supporting the lower surface of the first-size wafer 51 and two first positioning posts 211 with a higher height for positioning the edge of the first-size wafer 51. The three second positioning posts 212 include one second positioning post 212 with a smaller height for supporting the lower surface of the second-size wafer 52 and two second positioning posts 212 with a higher height for positioning the edge of the second-size wafer 52. When the wafer 5 needs to be debonded and cleaned, the wafer 5 is placed into the soaking tank 1 through the clearance groove 12 by a wafer robot (not shown), and the wafer robot places the wafer 5 directly above the supporting seat 2 according to the set program and drives the wafer 5 to descend. If the wafer 5 is a first-size wafer 51, it is positioned in the supporting seat 2 by the first positioning post 211, and if the wafer 5 is a second-size wafer 52, it is positioned in the supporting seat 2 by the second positioning post 212. Through this design, the same support seat 2 can be used for immersion degumming of wafers 5 of two sizes, so as to improve the application range of the degumming and cleaning equipment. Specifically, in this embodiment, the support seat 2 has four support rods 21.

[0042] Ginseng Figures 1 to 5 As shown, the soaking tank 1 arranged in the first position from top to bottom covers the support plate 16, and the upper surface of the support plate 16 is provided with a detection station 17, and the detection station 17 supports the single wafer 5 through the support seat 2. It should be noted that in this embodiment, the detection station 17 uses an infrared sensor (not shown) or any other device that can identify the area of ​​the adhesive covering the surface of the wafer 5. Before placing the wafer 5 into the soaking tank 1, the wafer 5 is first placed on the support seat 2 of the detection station 17 to determine the area of ​​the adhesive covering the surface of the wafer 5. If the area of ​​the adhesive covering the surface of the wafer 5 is small, it does not need to be placed in the soaking tank 1, and can be directly transferred to the next cleaning station to clean the wafer 5. The soaking tank 1 arranged in the last position from bottom to top is assembled at the connecting plate 15, and the connecting plate 15 is provided with a plurality of connectors 151, and the liquid pipe 412 and the recovery pipe 142 are connected to the liquid storage tank 3 through the connector 151.

[0043] Specific reference Figure 1 As shown, the connecting plate 15 supports the two immersion tanks 1 and the aforementioned inspection station 17. The several connectors 151 arranged on the connecting plate 15 are used to connect the aforementioned liquid pipe 412 and the recovery pipe 142. Then the connector 151 is connected to the connecting nozzle (not marked) of the liquid storage tank 3 through a hose or other pipe body (not shown). It should be noted that in this embodiment, the two immersion tanks 1 have three supporting seats 2 respectively, so the two immersion tanks 1 have a total of six groups of spray assemblies 4, and thus a total of six liquid pipes 412. And reference Figure 4As shown, two immersion tanks 1 are symmetrically provided with two recovery holes 14, so there are four recovery pipes 142 in total. In this embodiment, in order to take into account the connection between the immersion tank 1 and a total of 10 pipes, a connector 151 for connecting the liquid storage tank 3 and the four recovery pipes 142 and the six liquid pipes 412 is provided on the connecting plate 15. Specifically, since the spray body 42 in this embodiment is set to a spray plate 421 parallel to the plane where the wafer 5 is located and the spray plate 421 is evenly distributed with a number of liquid outlet holes 422, when the degumming liquid enters the spray plate 421 through the liquid pipe 412 and the connecting pipe 411, the degumming liquid can be evenly sprayed on all parts of the surface of the wafer 5. It should be noted that in this embodiment, after the infrared sensor (not shown) or any other device recognizes that the wafer 5 is placed in the support seat 2 from the clearance groove 12, the degumming liquid is passed to the spray plate 421 directly above the wafer 5 through the liquid pipe 412 to rinse it.

[0044] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0045] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0046] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A single-chip wafer degumming and cleaning device, characterized in that: include: A liquid storage tank and at least one set of immersion tanks, wherein at least one support seat for supporting a single wafer is installed in the immersion tank, and the immersion tank contains a degumming liquid that covers the upper surface of the wafer supported by the support seat; A spray assembly is arranged in the soaking tank just above the supporting seat, the spray assembly comprises a spray pipe and a spray body, the liquid storage tank is connected with one end of the spray pipe passing through the soaking tank so that the spray body sprays the degumming liquid onto the upper surface of the wafer supported by the supporting seat; The immersion tanks are provided in multiple groups, and the immersion tanks are arranged from top to bottom with their axes overlapping each other. The upper and lower groups of adjacent immersion tanks are separated and fixed by mounting plates, and the side walls of the immersion tanks in the length direction are provided with clearance grooves for wafer placement; A liquid supply component is provided in the soaking tank, and the liquid supply component is distributed along the length direction of the soaking tank, and the two ends are U-shaped and pass through the side wall of the soaking tank. Two or more groups of supporting seats are arranged in the soaking tank along the length direction, and each group of the supporting seats is correspondingly provided with a group of spraying components; The liquid supply assembly includes a first liquid supply pipeline and a second liquid supply pipeline, wherein the first liquid supply pipeline is composed of a first liquid outlet pipe and two first liquid inlet pipes, and the second liquid supply pipeline is composed of a second liquid outlet pipe and two second liquid inlet pipes, wherein the first liquid outlet pipe and the second liquid outlet pipe are both arranged along the length direction of the immersion tank, the first liquid outlet pipe is arranged above the second liquid outlet pipe, and the diameter of the first liquid outlet pipe is larger than the diameter of the second liquid outlet pipe; The two ends of the two first liquid inlet pipes are respectively connected to the two ends of the first liquid outlet pipe and then pass through the side wall of the immersion tank. The two ends of the two second liquid inlet pipes are respectively connected to the two ends of the second liquid outlet pipe and then pass through the side wall of the immersion tank.

2. The single-chip wafer degumming and cleaning equipment according to claim 1, characterized in that: The spray body is configured as a spray plate parallel to the plane where the wafer is located, the top of the spray plate is fixedly connected to the lower surface of the mounting plate, a plurality of liquid outlet holes are provided on the lower surface of the spray plate, and the spray pipeline includes a connecting pipe and a liquid pipe, and the connecting pipe is configured as two, one end of the two connecting pipes are respectively connected to the side wall of the spray plate and the other end is collected to the liquid pipe through a three-way joint, and the liquid pipe passes through the side wall of the immersion tank and is connected to the liquid storage tank.

3. The single-chip wafer degumming and cleaning equipment according to claim 2, characterized in that: A recovery hole is provided on the wall of the immersion tank, a filter is arranged around the recovery hole in the immersion tank, the recovery hole is connected to a liquid storage tank through a recovery pipe, the liquid storage tank is connected to a filter device, the degumming liquid returned to the liquid storage tank from the recovery hole is filtered by the filter device and then returned to the liquid storage tank again, and then sprayed onto the wafer surface by the spray plate after passing through the liquid pipe and the connecting pipe.

4. The single-chip wafer degumming and cleaning equipment according to claim 1, characterized in that: The immersion tank arranged first from top to bottom covers a supporting plate, and an inspection station is arranged on the upper surface of the supporting plate. The inspection station supports a single wafer through the supporting seat.

5. The single-chip wafer degumming and cleaning equipment according to claim 1, characterized in that: The support seat comprises a base and at least three support rods mounted on the top of the base, one end of the plurality of support rods converges at one point and is fixed to each other, and the other end of the plurality of support rods is uniformly divergent along a radial direction parallel to the wafer; The plurality of support rods are each provided with a first positioning column for positioning a wafer of a first size and a second positioning column for positioning a wafer of a second size, and the diameter of the wafer of the first size is greater than the diameter of the wafer of the second size.

6. The single-chip wafer degumming and cleaning equipment according to claim 3, characterized in that: The last immersion tank arranged from bottom to top is assembled on a connecting plate, and the connecting plate is provided with a plurality of connectors, and the liquid-passing pipe and the recovery pipe are connected to the liquid storage tank through the connectors.

7. The single-chip wafer degumming and cleaning equipment according to claim 4, characterized in that: The liquid storage tank has a visible side wall which is set as a transparent plate body, and the visible side wall is provided with a scale along the height direction. The liquid storage tank is connected to the filtering device through a pump body.

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