Automatic feeding and discharging device and method for blue film primary and secondary rings

Abstract

The invention relates to the technical field of semiconductor transportation tools, in particular to an automatic feeding and discharging device and method for blue film primary and secondary rings, and the automatic feeding and discharging device comprises a lifting mechanism, a rotating mechanism, a rotating plate, a pair of upper clamping devices and a pair of lower clamping devices; the slewing mechanism is mounted on the lifting mechanism; the rotating plate is connected with the slewing mechanism, and the slewing mechanism can drive the rotating plate to rotate in the horizontal plane; a through hole is formed in the free end of the rotating plate; the pair of upper clamping devices and the pair of lower clamping devices are arranged on the rotating plate around the through hole; an L-shaped upper clamping block which stretches out and draws back along the central axis of the through hole is arranged on the upper clamping device; an L-shaped lower clamping block which stretches out and draws back along the central axis of the through hole is arranged on the lower clamping device; in the projection in the horizontal plane, the L-shaped upper clamping block and the L-shaped lower clamping block can extend into or retreat from the through hole; the vertical height of the L-shaped upper clamping block is larger than that of the L-shaped lower clamping block. Automatic feeding and discharging of the blue film child and mother rings can be achieved through one robot.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor transport tooling, and in particular to an automatic loading and unloading device for blue film mother-and-child rings and a loading and unloading method thereof. Background Art

[0002] The blue film mother-and-child ring is a tool for expanding chips, usually used with a die bonder. The blue film mother-and-child ring is usually stored in a wafer tray, which is equivalent to a material tray. A material tray contains multiple blue film mother-and-child rings.

[0003] The automatic loading and unloading device of the blue film mother-and-child ring can automatically load and unload the wafer tray, and the post-process equipment takes the material from the wafer tray for assembly. The existing automatic loading and unloading device is generally equipped with two robots, one for loading the wafer tray and the other for unloading the empty wafer tray. However, the setting of two robots increases the space occupied by the equipment, making the automatic loading and unloading device less adaptable to small installation sites and difficult to integrate into a small die bonder. The setting of two robots also increases the equipment cost. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an automatic loading and unloading device and a loading and unloading method for blue film mother and child rings, which solves the technical problem that the existing automatic loading and unloading device with two robots has poor adaptability to small installation sites.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose, the automatic loading and unloading device of the blue film mother-and-child ring of the present invention comprises a lifting mechanism, a rotating mechanism, a rotating plate, a pair of upper clamps and a pair of lower clamps;

[0008] The rotary mechanism is installed on the lifting mechanism, and the lifting mechanism can drive the rotary mechanism to rise and fall vertically;

[0009] The rotating plate is connected to the rotating mechanism, and the rotating mechanism can drive the rotating plate to rotate in a horizontal plane;

[0010] A through hole is formed at the free end of the rotating plate; a pair of upper clamps and a pair of lower clamps are both arranged on the rotating plate around the through hole;

[0011] The upper clamp is provided with an L-shaped upper clamping block extending and retracting along the central axis of the through hole; the lower clamp is provided with an L-shaped lower clamping block extending and retracting along the central axis of the through hole; in the projection on the horizontal plane, the L-shaped upper clamping block and the L-shaped lower clamping block can both extend into or exit from the through hole;

[0012] The vertical height of the L-shaped upper clamping block is higher than the vertical height of the L-shaped lower clamping block.

[0013] Optionally, the L-shaped upper clamping block and the L-shaped lower clamping block each include a vertical plate and a horizontal plate;

[0014] The vertical plate is connected to the telescopic rod of the upper clamp;

[0015] The horizontal plate is vertically connected to the bottom end of the vertical plate;

[0016] The end surface of the vertical plate is the first clamping surface; the top surface of the horizontal plate is the top supporting surface; the end surface of the horizontal plate is the second clamping surface;

[0017] The distance between the bottom surface of the horizontal plate of the L-shaped upper clamping block and the top surface of the horizontal plate of the L-shaped lower clamping block is less than the thickness of a wafer tray.

[0018] Optionally, an anti-slip member is provided on the first clamping surface and / or the second clamping surface.

[0019] Optionally, the slewing mechanism includes a slewing driver, an adapter plate, a first limit block and a second limit block;

[0020] The adapter plate is connected to the rotating shaft of the rotary drive;

[0021] The first limiting block and the second limiting block are both arranged on the adapter plate so as to limit the rotation angle of the rotating plate in the horizontal plane.

[0022] Optionally, the adapter plate is also provided with an origin photoelectric device for monitoring the resetting of the transfer plate.

[0023] Optionally, the lifting mechanism includes a lifting drive, a linear guide rail and a slider;

[0024] The lifting drive is connected to the linear guide rail;

[0025] The slider is mounted on the linear guide rail in a vertical sliding manner; the lifting driver can drive the slider to lift and lower in the vertical direction;

[0026] The adapter plate is connected to the slider.

[0027] Optionally, a plurality of guide posts are provided on the rotating plate;

[0028] A plurality of guide posts are arranged around the through hole.

[0029] Optionally, weight-reducing holes are provided on the rotating plate.

[0030] Optionally, a photoelectric sensor for monitoring the material in the through hole is provided on the rotating plate.

[0031] Furthermore, the present invention also provides a loading and unloading method of an automatic loading and unloading device for a blue film mother-and-child ring, the loading and unloading method of the automatic loading and unloading device for a blue film mother-and-child ring is implemented based on the automatic loading and unloading device for a blue film mother-and-child ring as described above, and the loading and unloading method comprises:

[0032] S1, the rotating plate is in the original position: the rotating plate is reset to the wafer tray loading station; the L-shaped upper clamping block retracts, and the L-shaped lower clamping block extends;

[0033] S2, loading the blue film mother-and-child rings: placing a plurality of stacked wafer trays into the through hole, wherein the wafer tray at the bottom is the first wafer tray, the wafer tray stacked above the first wafer tray is the second wafer tray, and the wafer tray stacked above the second wafer tray is the third wafer tray;

[0034] The bottom surface of the first wafer plate abuts against the top supporting surface of the L-shaped lower clamping block; the side surface of the first wafer plate abuts against the first clamping surface of the L-shaped lower clamping block;

[0035] S3, unloading of blue film mother-and-child rings: the rotary mechanism drives the rotating plate to rotate above the wafer tray unloading station; the L-shaped lower clamping block retreats, and all the wafer trays fall onto the wafer tray unloading station; the L-shaped upper clamping block extends, and the side surface of the second wafer tray abuts against the second clamping surface of the L-shaped upper clamping block; the second wafer tray and the plurality of wafer trays above it are reset to the wafer tray loading station along with the rotating plate; the first wafer tray is unloaded onto the wafer tray unloading station;

[0036] The L-shaped lower clamping block extends, the L-shaped upper clamping block retracts, and the second wafer tray and the plurality of wafer trays above the second wafer tray fall onto the top support surface of the L-shaped lower clamping block;

[0037] S4, unloading the wafer tray: the rotary mechanism drives the rotating plate to rotate above the wafer tray unloading station; the L-shaped upper clamping block extends, the L-shaped lower clamping block retracts, and the side surface of the second wafer tray abuts against the second clamping surface of the L-shaped upper clamping block;

[0038] The lifting mechanism drives the rotating plate to descend to a preset position; the L-shaped lower clamping block extends out to clamp an empty wafer tray, and the side surface of the empty wafer tray abuts against the second clamping surface of the L-shaped lower clamping block;

[0039] S5, unloading of the empty wafer tray: the lifting mechanism is reset; the rotary mechanism drives the rotating plate to rotate above the unloading station of the empty wafer tray; the L-shaped lower clamping block retreats, and the empty wafer tray falls onto the unloading station of the empty wafer tray;

[0040] S6, repeat S3 to S5 until all the wafer trays are loaded and unloaded.

[0041] (III) Beneficial effects

[0042] The beneficial effects of the present invention are:

[0043] The L-shaped upper clamp and the L-shaped lower clamp are both L-shaped, and the L-shaped clamp is formed with a flange, which can support the wafer tray to achieve support for the bottom surface of the wafer tray. The two end surfaces of the L-shaped clamp facing the wafer tray can abut against the side of the wafer tray to achieve clamping of the side of the wafer tray. The clamping method of the upper clamp and the lower clamp is flexible and ingenious.

[0044] The vertical height of the L-shaped upper clamping block is higher than that of the L-shaped lower clamping block, so that there is a height difference between the upper clamping device and the lower clamping device. Combined with the ingenious clamping structure of the L-shaped clamping block, it is possible to take and place empty wafer trays while clamping multiple wafer trays, thereby optimizing the equipment structure.

[0045] Through the effective cooperation of a pair of upper clamps and a pair of lower clamps, the unloading of wafer trays and the unloading of empty wafer trays are realized. Only one robot can realize the automatic loading and unloading of blue film mother and child rings, which simplifies the equipment structure, reduces equipment costs, and reduces the space occupied by equipment. At the same time, it improves the adaptability of automatic loading and unloading devices to small installation sites. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a schematic structural diagram of the automatic loading and unloading device of the blue film mother-and-child ring of the present invention in the original position;

[0047] Figure 2 It is a structural schematic diagram of the automatic loading and unloading device of the blue film mother-and-child ring of the present invention;

[0048] Figure 3 is a cross-sectional schematic diagram of an upper clamp of the present invention;

[0049] Figure 4 It is a structural schematic diagram of an L-shaped upper clamping block of the present invention;

[0050] Figure 5 It is a structural schematic diagram of the L-shaped lower clamping block of the present invention;

[0051] Figure 6 It is a structural schematic diagram of the lifting mechanism of the present invention.

[0052] [Description of Reference Numerals]

[0053] 1: lifting mechanism; 11: lifting drive; 12: linear guide; 13: slider;

[0054] 2: Rotation mechanism; 21: Rotation driver; 22: Adapter plate; 23: First limit block; 24: Second limit block; 25: Origin photoelectric;

[0055] 3: rotating plate; 31: guide column; 32: weight reduction hole; 33: photoelectric sensor;

[0056] 4: upper clamp; 41: L-shaped upper clamping block; 411: first clamping surface; 412: top support surface; 413: second clamping surface;

[0057] 5: lower clamp; 51: L-shaped lower clamping block;

[0058] 6: Wafer disk;

[0059] 7: Wafer tray loading station;

[0060] 8: Wafer tray unloading station;

[0061] 9: Vacant wafer tray unloading station. DETAILED DESCRIPTION

[0062] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation modes in conjunction with the accompanying drawings.

[0063] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0064] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; "connection" can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] See also Figures 1 to 3The present invention provides an automatic loading and unloading device for blue film mother-and-child rings, which comprises a lifting mechanism 1, a rotating mechanism 2, a rotating plate 3, a pair of upper clamps 4 and a pair of lower clamps 5; the rotating mechanism 2 is installed on the lifting mechanism 1, and the lifting mechanism 1 can drive the rotating mechanism 2 to lift vertically; the rotating plate 3 is connected to the rotating mechanism 2, and the rotating mechanism 2 can drive the rotating plate 3 to rotate in a horizontal plane; a through hole is opened at the free end of the rotating plate 3; a pair of upper clamps 4 and a pair of lower clamps 5 are both arranged on the rotating plate 3 around the through hole; an L-shaped upper clamping block 41 which can be extended and retracted along the central axis of the through hole is arranged on the upper clamping block 4; an L-shaped lower clamping block 51 which can be extended and retracted along the central axis of the through hole is arranged on the lower clamping block 5; in the projection in the horizontal plane, the L-shaped upper clamping block 41 and the L-shaped lower clamping block 51 can both extend into or out of the through hole; the vertical height of the L-shaped upper clamping block 41 is higher than the vertical height of the L-shaped lower clamping block 51.

[0067] In this embodiment, the shape and size of the through hole are compatible with the shape and size of the wafer tray 6, and the wafer tray 6 can be circular or polygonal, so that multiple wafer trays 6 can be stacked vertically and placed at the through hole. The turntable 3 can rotate between the wafer tray loading station 7, the wafer tray unloading station 8, and the vacant wafer tray unloading station 9 to realize the unloading of the wafer tray 6 and the unloading of the vacant wafer tray. Optionally, the wafer tray loading station 7 is arranged directly above the vacant wafer tray unloading station 9 to simplify the equipment operation procedure, and it is also convenient for the origin photoelectric 25 to monitor the reset origin of the turntable 3, improve the high precision of the equipment, and realize high-precision loading and unloading. The upper clamp 4 and the lower clamp 5 can be driven by a cylinder, a hydraulic cylinder or an electric push rod.

[0068] A through hole is provided at the free end of the rotating plate 3, and a pair of upper clamps 4 and a pair of lower clamps 5 are both arranged on the rotating plate 3 around the through hole. The pair of upper clamps 4 clamp or release the wafer disk 6 through a pair of L-shaped upper clamps 41, and the pair of lower clamps 5 clamp or release the wafer disk 6 through a pair of L-shaped lower clamps 51. The L-shaped upper clamp 41 and the L-shaped lower clamp 51 are both L-shaped, and the L-shaped clamp is formed with a flange (i.e., a top support surface 412), which can support the wafer disk 6 and realize support for the bottom surface of the wafer disk 6. The two end faces of the L-shaped clamp facing the wafer disk 6 can abut against the side of the wafer disk 6 to realize clamping of the side of the wafer disk 6. The clamping method of the upper clamp 4 and the lower clamp 5 is flexible and ingenious.

[0069] The vertical height of the L-shaped upper clamp 41 is higher than the vertical height of the L-shaped lower clamp 51, so that there is a height difference between the upper clamp 4 and the lower clamp 5. Combined with the ingenious clamping structure of the L-shaped block, empty wafer trays can be taken and placed while clamping multiple wafer trays 6, thereby optimizing the equipment structure.

[0070] Through the effective cooperation of a pair of upper clamps 4 and a pair of lower clamps 5, the unloading of the wafer tray 6 and the unloading of the empty wafer tray are realized. The automatic loading and unloading of the blue film mother and child rings can be realized by only one robot, which simplifies the equipment structure, reduces the equipment cost, and at the same time reduces the space occupied by the equipment, thereby improving the adaptability of the automatic loading and unloading device to small installation sites.

[0071] like Figure 4 and Figure 5 As shown, the L-shaped upper clamping block 41 and the L-shaped lower clamping block 51 both include a vertical plate and a horizontal plate; the vertical plate is connected to the telescopic rod of the upper clamp 4; the horizontal plate is vertically connected to the bottom end of the vertical plate; the end surface of the vertical plate is the first clamping surface 411; the top surface of the horizontal plate is the top support surface 412; the end surface of the horizontal plate is the second clamping surface 413; the distance between the bottom end of the second clamping surface 413 of the L-shaped upper clamping block 41 and the top support surface 412 of the L-shaped lower clamping block 51 is less than the thickness of a wafer disk 6. Specifically, the L-shaped clamping block includes two clamping methods, one is to support the bottom end of the wafer disk 6 by the top support surface 412, and the first clamping surface 411 abuts against the side of the wafer disk 6; the other is to abut against the side of the wafer disk 6 by the second clamping surface 413. Since the distance between the bottom surface of the horizontal plate of the L-shaped upper clamping block 41 and the top surface of the horizontal plate of the L-shaped lower clamping block 51 is less than the thickness of a wafer tray 6, on the one hand, when multiple wafer trays 6 are supported by the top supporting surface 412 of the L-shaped lower clamping block 51, the second clamping surface 413 of the L-shaped upper clamping block 41 can clamp the side of the wafer tray 6 at the bottom, and at this time, the L-shaped lower clamping block 51 can be flexibly extended and retracted to realize the loading and unloading of the empty wafer tray; on the other hand, when the side of the wafer tray 6 at the bottom is clamped by the second clamping surface 413 of the L-shaped upper clamping block 41, the L-shaped lower clamping block 51 can extend, and after the L-shaped upper clamping block 41 retracts, the stacked multiple wafer trays 6 can naturally fall onto the top supporting surface 412 of the L-shaped lower clamping block 51 to realize the unloading of the wafer tray 6 at the bottom. The clamping method of the upper clamper 4 and the lower clamper 5 are ingenious, and the coordination method is ingenious, and ultimately a robot can be used to load and unload multiple stacked wafer trays 6 and unload empty wafer trays.

[0072] Furthermore, an anti-slip member is provided on the first clamping surface 411 and / or the second clamping surface 413. The anti-slip member may be a rubber gasket or an anti-slip groove provided on the clamping surface to enhance the stability of clamping the wafer plate 6.

[0073] See again Figure 2The rotary mechanism 2 includes a rotary driver 21, an adapter plate 22, a first limit block 23 and a second limit block 24; the adapter plate 22 is connected to the rotating shaft of the rotary driver 21; the first limit block 23 and the second limit block 24 are both arranged on the adapter plate 22 to limit the rotation angle of the rotating plate 3 in the horizontal plane. The rotary driver 21 is an electric motor. The first limit block 23 and the second limit block 24 limit the limit position of the horizontal rotation of the rotating plate 3, that is, limit the wafer tray unloading station 8 and the vacant wafer tray unloading station 9, so as to improve the turnover accuracy of the rotating plate 3 between the stations and realize high-precision loading and unloading.

[0074] Secondly, the transfer plate 22 is also provided with an origin photoelectric 25 for monitoring the resetting of the rotating plate 3. The origin photoelectric 25 is used to set the resetting origin of the rotating plate 3, improve the accuracy and stability of the horizontal rotation of the rotating plate 3, and further realize high-precision loading and unloading.

[0075] like Figure 6 As shown, the lifting mechanism 1 includes a lifting drive 11, a linear guide 12 and a slider 13; the lifting drive 11 is connected to the linear guide 12; the slider 13 is installed on the linear guide 12 along a vertical sliding direction; the lifting drive 11 can drive the slider 13 to lift vertically; the adapter plate 22 is connected to the slider 13. Specifically, the lifting drive 11 and the linear guide 12 can be a linear motor module or a motor screw slider module. This embodiment is a motor screw slider module, and the adapter plate 22 is an L-shaped adapter plate. By installing the adapter plate 22 on the slider 13, the lifting drive 11 can drive the rotating plate 3 to lift vertically, thereby realizing the unloading of the wafer tray 6 and the unloading of the empty wafer tray. The structure is simple and practical.

[0076] Furthermore, a plurality of guide posts 31 are provided on the rotating plate 3; and the plurality of guide posts 31 are arranged around the through hole. The guide posts 31 are used for guiding during the loading process of the stacked plurality of wafer trays 6, so that the center lines of the plurality of wafer trays 6 are close to the center line of the through hole after being placed, and then the center lines of the plurality of wafer trays 6 are further pushed to move by the clamping of the upper clamp 4 or the lower clamp 5, so that the center lines of the plurality of wafer trays 6 are basically coincident with the center lines of the through hole, thereby realizing high-precision loading of the plurality of wafer trays 6. Optionally, a plurality of guide posts 31 can also be provided at the vacant wafer tray unloading station 9, so as to facilitate the storage of a plurality of vacant wafer trays. The specific number of the upper clamp 4 or the lower clamp 5 can be set according to the demand, and the array is preferably arranged in the circumference of the through hole.

[0077] Secondly, a weight-reducing hole 32 is provided on the rotating plate 3. The weight-reducing hole 32 reduces the weight of the rotating plate 3, reduces the wear between components, and prolongs the service life of the equipment.

[0078] In addition, a photoelectric sensor 33 for monitoring the material in the through hole is provided on the rotating plate 3. In the present embodiment, the photoelectric sensor 33 is provided on the guide column 31. The photoelectric sensor 33 is used to detect whether there are blue film mother-and-child rings in the wafer tray 6, so as to send a signal to the control center. When the wafer tray 6 on the wafer tray unloading station 8 is emptied, the photoelectric sensor 33 sends a signal to the control center, and the control center then sends a discharge signal of the empty wafer tray to the rotating mechanism 2 and the lifting mechanism 1 and other equipment, and finally completes the emptying of all blue film mother-and-child rings. Optionally, the control center is electrically connected to a buzzer, and when all blue film mother-and-child rings are emptied, the equipment alarms to remind the operator to load the material.

[0079] In addition, the present invention also provides a loading and unloading method of an automatic loading and unloading device for a blue film mother-and-child ring. The loading and unloading method of the automatic loading and unloading device for a blue film mother-and-child ring is implemented based on the above automatic loading and unloading device for a blue film mother-and-child ring, and the loading and unloading method includes:

[0080] S1, the rotating plate original position state: the rotating plate 3 is reset to the wafer tray loading station 7, and the reset origin is monitored by the origin photoelectric 25; the L-shaped upper clamping block 41 retracts, and the L-shaped lower clamping block 51 extends;

[0081] S2, loading the blue film mother-and-child rings: put multiple stacked wafer trays 6 into the through hole, the wafer tray 6 at the bottom is the first wafer tray, the wafer tray stacked above the first wafer tray is the second wafer tray, the wafer tray stacked above the second wafer tray is the third wafer tray, and so on;

[0082] The bottom surface of the first wafer plate abuts against the top support surface 412 of the L-shaped lower clamping block 51; the side surface of the first wafer plate abuts against the first clamping surface 411 of the L-shaped lower clamping block 51;

[0083] S3, unloading of blue film mother-and-child rings: the rotary mechanism 2 drives the rotating plate 3 to rotate to the top of the wafer tray unloading station 8; the L-shaped lower clamping block 51 retreats, and all wafer trays 6 fall onto the wafer tray unloading station 8; the L-shaped upper clamping block 41 extends, and the side surface of the second wafer tray abuts against the second clamping surface 413 of the L-shaped upper clamping block 41; the second wafer tray and the multiple wafer trays 6 above it are reset to the wafer tray loading station 7 with the rotating plate 3, and can also be reset to the preset position, as long as the rotating plate 3 is moved out of the operating range of the wafer tray unloading station 8; the first wafer tray is unloaded onto the wafer tray unloading station 8;

[0084] The L-shaped lower clamping block 51 extends, the L-shaped upper clamping block 41 retracts, and the second wafer tray and the plurality of wafer trays 6 above it fall onto the top support surface 412 of the L-shaped lower clamping block 51;

[0085] S4, unloading the wafer tray: the rotary mechanism 2 drives the rotating plate 3 to rotate above the unloading station of the wafer tray 6; the L-shaped upper clamping block 41 extends, the L-shaped lower clamping block 51 retracts, and the side surface of the second wafer tray abuts against the second clamping surface 413 of the L-shaped upper clamping block 41;

[0086] The lifting mechanism 1 drives the rotating plate 3 to descend to a preset position. In this embodiment, the bottom surface of the horizontal plate of the L-shaped lower clamping block 51 is lowered to a position substantially flush with the bottom surface of the empty wafer tray; the L-shaped lower clamping block 51 extends out to clamp the empty wafer tray, and the side surface of the empty wafer tray abuts against the second clamping surface 413 of the L-shaped lower clamping block 51;

[0087] S5, unloading of the empty wafer tray: the lifting mechanism 1 is reset; the rotary mechanism 2 drives the rotating plate 3 to rotate to the top of the unloading station 9 of the empty wafer tray; the L-shaped lower clamping block 51 retreats, and the empty wafer tray falls onto the unloading station 9 of the empty wafer tray;

[0088] S6, repeat S3 to S5 until all wafer trays 6 are loaded and unloaded.

[0089] The above process method can realize automatic loading and unloading of a robot, including loading and unloading of multiple stacked wafer trays 6 and unloading of empty wafer trays, which reduces the occupied space of the equipment, improves the adaptability of the automatic loading and unloading device to small installation sites, and enables the automatic loading and unloading device to be integrated into a small die bonder. In addition, the automatic loading and unloading method of a robot optimizes the equipment structure and reduces the equipment cost.

[0090] It should be understood that the above description of the specific embodiments of the present invention is only for illustrating the technical route and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but the present invention is not limited to the above specific implementation methods. Any changes or modifications made within the scope of the claims of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic loading and unloading device for blue film mother and child rings, characterized in that: The automatic loading and unloading device comprises a lifting mechanism (1), a rotating mechanism (2), a rotating plate (3), a pair of upper clamps (4) and a pair of lower clamps (5); The rotary mechanism (2) is installed on the lifting mechanism (1), and the lifting mechanism (1) can drive the rotary mechanism (2) to move up and down vertically; The rotating plate (3) is connected to the rotating mechanism (2), and the rotating mechanism (2) can drive the rotating plate (3) to rotate in a horizontal plane; A through hole is formed at the free end of the rotating plate (3); a pair of upper clamps (4) and a pair of lower clamps (5) are both arranged on the rotating plate (3) around the through hole; The upper clamp (4) is provided with an L-shaped upper clamping block (41) which is telescopic along the central axis of the through hole; the lower clamp (5) is provided with an L-shaped lower clamping block (51) which is telescopic along the central axis of the through hole; in terms of projection on the horizontal plane, both the L-shaped upper clamping block (41) and the L-shaped lower clamping block (51) can extend into or out of the through hole; The vertical height of the L-shaped upper clamping block (41) is higher than the vertical height of the L-shaped lower clamping block (51).

2. The automatic loading and unloading device of the blue film mother-and-child ring according to claim 1 is characterized in that: The L-shaped upper clamping block (41) and the L-shaped lower clamping block (51) both include a vertical plate and a horizontal plate; The vertical plate is connected to the telescopic rod of the upper clamp (4); The horizontal plate is vertically connected to the bottom end of the vertical plate; The end surface of the vertical plate is a first clamping surface (411); the top surface of the horizontal plate is a top supporting surface (412); and the end surface of the horizontal plate is a second clamping surface (413); The distance between the bottom surface of the horizontal plate of the L-shaped upper clamping block (41) and the top surface of the horizontal plate of the L-shaped lower clamping block (51) is less than the thickness of a wafer plate (6).

3. The automatic loading and unloading device of the blue film mother-child ring according to claim 2 is characterized in that: An anti-slip component is provided on the first clamping surface (411) and / or the second clamping surface (413).

4. The automatic loading and unloading device of the blue film mother-child ring according to any one of claims 1 to 3, characterized in that: The slewing mechanism (2) comprises a slewing driver (21), an adapter plate (22), a first limit block (23) and a second limit block (24); The adapter plate (22) is connected to the rotating shaft of the rotary drive (21); The first limiting block (23) and the second limiting block (24) are both arranged on the adapter plate (22) so as to limit the rotation angle of the rotating plate (3) in the horizontal plane.

5. The automatic loading and unloading device for blue film mother-and-child rings according to claim 4 is characterized in that: The transfer plate (22) is also provided with an origin photoelectric device (25) for monitoring the resetting of the transfer plate (3).

6. The automatic loading and unloading device for blue film mother-and-child rings according to claim 5 is characterized in that: The lifting mechanism (1) comprises a lifting drive (11), a linear guide rail (12) and a slide block (13); The lifting drive (11) is connected to the linear guide rail (12); The slider (13) is mounted on the linear guide rail (12) in a sliding manner along the vertical direction; the lifting drive (11) is capable of driving the slider (13) to be lifted and lowered along the vertical direction; The adapter plate (22) is connected to the slider (13).

7. The automatic loading and unloading device of the blue film mother-child ring according to any one of claims 1 to 3, characterized in that: The rotating plate (3) is provided with a plurality of guide posts (31); A plurality of guide posts (31) are arranged around the through hole.

8. The automatic loading and unloading device of the blue film mother-child ring according to any one of claims 1 to 3, characterized in that: The rotating plate (3) is provided with a weight-reducing hole (32).

9. The automatic loading and unloading device of the blue film mother-child ring according to any one of claims 1 to 3, characterized in that: The rotating plate (3) is provided with a photoelectric sensor (33) for monitoring the material in the through hole.

10. A method for loading and unloading a blue film mother-and-child ring automatic loading and unloading device, characterized in that: The loading and unloading method of the automatic loading and unloading device of the blue film mother-and-child ring is implemented based on the automatic loading and unloading device of the blue film mother-and-child ring according to any one of claims 2 to 9, and the loading and unloading method includes: S1, the rotating plate is in the original position: the rotating plate (3) is reset to the wafer tray loading station (7); the L-shaped upper clamping block (41) is retracted, and the L-shaped lower clamping block (51) is extended; S2, loading the blue film mother-and-child rings: placing a plurality of stacked wafer trays (6) into the through hole, wherein the wafer tray (6) at the bottom is the first wafer tray, the wafer tray stacked above the first wafer tray is the second wafer tray, and the wafer tray stacked above the second wafer tray is the third wafer tray; The bottom surface of the first wafer plate abuts against the top support surface (412) of the L-shaped lower clamping block (51); the side surface of the first wafer plate abuts against the first clamping surface (411) of the L-shaped lower clamping block (51); S3, unloading of blue film mother-and-child rings: the rotary mechanism (2) drives the rotating plate (3) to rotate to the top of the wafer tray unloading station (8); the L-shaped lower clamping block (51) retreats, and all the wafer trays (6) fall onto the wafer tray unloading station (8); the L-shaped upper clamping block (41) extends, and the side surface of the second wafer tray abuts against the second clamping surface (413) of the L-shaped upper clamping block (41); the second wafer tray and the plurality of wafer trays (6) above it are reset to the wafer tray loading station (7) along with the rotating plate (3); the first wafer tray is unloaded onto the wafer tray unloading station (8); The L-shaped lower clamping block (51) extends out, the L-shaped upper clamping block (41) retracts, and the second wafer tray and the plurality of wafer trays (6) above it fall onto the top supporting surface (412) of the L-shaped lower clamping block (51); S4, taking out materials from an empty wafer tray: the rotary mechanism (2) drives the rotating plate (3) to rotate above the unloading station of the wafer tray (6); the L-shaped upper clamping block (41) extends, the L-shaped lower clamping block (51) retracts, and the side surface of the second wafer tray abuts against the second clamping surface (413) of the L-shaped upper clamping block (41); The lifting mechanism (1) drives the rotating plate (3) to descend to a preset working position; the L-shaped lower clamping block (51) extends out to clamp an empty wafer tray, and the side surface of the empty wafer tray abuts against the second clamping surface (413) of the L-shaped lower clamping block (51); S5, unloading of the vacant wafer tray: the lifting mechanism (1) is reset; the rotating mechanism (2) drives the rotating plate (3) to rotate to the top of the vacant wafer tray unloading station (9); the L-shaped lower clamping block (51) retreats, and the vacant wafer tray falls onto the vacant wafer tray unloading station (9); S6, repeat S3 to S5 until all the wafer trays (6) are loaded and unloaded.

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