Building block type welding conduction packaging structure and packaging method
Through building block welding conduction packaging structure and packaging method, the packaging chip is directly welded, which solves the problems of long time and high cost of existing plastic sealing processes, and achieves process simplification and production efficiency improvement.
Patent Information
- Application Number
- CN202411347882.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-01-03
AI Technical Summary
The existing chip packaging structure adopts a plastic sealing process, with long process time and limited production capacity due to the number of molds, and high mold opening costs, resulting in high production efficiency and cost.
Using building block welding conduction packaging structure and packaging method, by designing the electrical connection between the pads between the lower packaging substrate and the upper packaging substrate, combined with the use of filler, the packaging is directly welded, which eliminates the wire-pulling and plastic sealing process and forms a simplified process flow.
It greatly simplifies the chip packaging process, improves production efficiency, reduces batch production costs, and avoids the limitations of plastic sealing molds.
Smart Images
Figure CN119252800A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor packaging, in particular to a building block type welding conduction packaging structure and a packaging method. Background Art
[0002] The existing chip packaging structure is mostly formed by plastic encapsulation. The bracket after wire bonding is placed in the plastic encapsulation mold, the chip, metal lead and bracket are wrapped with plastic encapsulation material, and then baked and cured in the plastic encapsulation film. The process time is long, and the production capacity is limited by the number of plastic encapsulation molds, and the cost of opening the plastic encapsulation mold is high. Summary of the invention
[0003] In order to overcome the deficiencies of the prior art, the present invention provides a building block type welding conduction packaging structure and a packaging method.
[0004] To achieve the above-mentioned purpose, a building block welding conduction packaging structure is designed, including a lower packaging substrate and an upper packaging substrate, at least one of the upper part of the lower packaging substrate and the lower part of the upper packaging substrate is provided with a groove, the chip is arranged in the groove, the inner and outer sides of the lower part of the upper packaging substrate are provided with solder pads, the inner and outer solder pads of the lower part of the upper packaging substrate are electrically connected inside the upper packaging substrate, the upper and lower sides of the lower packaging substrate are provided with solder pads, the solder pads on the upper and lower sides of the lower packaging substrate are electrically connected inside the lower packaging substrate, the top of the chip is connected to the solder pad on the inner side of the lower part of the upper packaging substrate through a solder ball, the solder pad on the outer side of the lower part of the upper packaging substrate is electrically connected to the solder pad on the upper side of the lower packaging substrate through a solder ball, and a filling glue is provided between the upper packaging substrate and the lower packaging substrate.
[0005] The groove is arranged below the upper packaging substrate, the pad on the inner side below the upper packaging substrate is arranged in the groove, and the pad on the outer side below the upper packaging substrate is arranged outside the groove.
[0006] The groove is arranged below the upper packaging substrate, the lower packaging substrate is provided with one or more steps, multiple chips are stacked along the steps, the pads on one side above the chip are staggered and exposed, the side of the groove is stepped to match the chip, and the inner pad below the upper packaging substrate is arranged at the stepped part of the side of the groove.
[0007] The solder pads on the lower side of the lower package substrate are connected with solder balls.
[0008] The present invention also provides a packaging method for a building block type welding conduction packaging structure, comprising: S1: manufacturing a lower package substrate, forming pads on the upper and lower sides of the lower package substrate, and the pads are electrically connected through a conductor in the lower package substrate; S2: manufacturing an upper package substrate, forming a groove below the upper package substrate, forming pads inside and outside the groove below the upper package substrate, and the pads are electrically connected through a conductor in the upper package substrate; S3; mounting the chip on the lower package substrate; S4: soldering balls on the pads of the lower package substrate and the pads of the chip; S5: Apply filling glue on the lower package substrate and the chip; S6: welding the solder pads of the upper package substrate to the solder balls; S7: Planting solder balls on the pads below the lower package substrate; S8: Bake and solidify the molding.
[0009] In step S1, a step is formed on the lower package substrate, in step S2, the side of the groove of the upper package substrate is stepped, and the pad in the groove is arranged at the step, and in step S3, multiple chips are stacked and mounted upward along the step.
[0010] Compared with the prior art, the present invention directly welds the upper packaging substrate and the lower packaging substrate without the need for wire bonding and plastic sealing processes, thereby greatly simplifying the process flow. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the packaging structure of the first embodiment of the present invention.
[0012] Figure 2 It is a schematic diagram of step S1 of the first embodiment of the present invention.
[0013] Figure 3 It is a schematic diagram of step S2 of the first embodiment of the present invention.
[0014] Figure 4 It is a schematic diagram of steps S3 and S4 of the first embodiment of the present invention.
[0015] Figure 5 It is a schematic diagram of step S5 of the first embodiment of the present invention.
[0016] Figure 6 It is a schematic diagram of steps S6 and S7 of the first embodiment of the present invention.
[0017] Figure 7 It is a schematic diagram of the packaging structure of the second embodiment of the present invention.
[0018] Figure 8 It is a schematic diagram of step S1 of the second embodiment of the present invention.
[0019] Fig. 9 It is a schematic diagram of step S2 of the second embodiment of the present invention.
[0020] Fig.10 It is a schematic diagram of steps S3 and S4 of the second embodiment of the present invention.
[0021] Fig.11It is a schematic diagram of step S5 of the second embodiment of the present invention.
[0022] Fig.12 It is a schematic diagram of steps S6 and S7 of the second embodiment of the present invention.
[0023] See also Figure 1-Figure 12 , where 1 is the lower package substrate, 2 is the upper package substrate, 3 is the groove, 4 is the step, 5 is the chip, 6 is the pad, 7 is the solder ball, and 8 is the filling glue. DETAILED DESCRIPTION
[0024] The present invention will be further described below with reference to the accompanying drawings. Example
[0025] like Figure 1-Figure 6 As shown, the present embodiment provides a building block welding conduction packaging structure of a single chip, at least one of the upper part of the lower packaging substrate 1 and the lower part of the upper packaging substrate 2 is provided with a groove 3, the chip 5 is arranged in the groove 3, the inner and outer sides of the lower part of the upper packaging substrate 2 are provided with solder pads 6, the inner and outer solder pads 6 below the upper packaging substrate 6 are electrically connected inside the upper packaging substrate 1, solder pads 6 are provided on the upper and lower sides of the lower packaging substrate 1, the solder pads 6 on the upper and lower sides of the lower packaging substrate 1 are electrically connected inside the lower packaging substrate 1, the chip 5 is connected to the solder pad 6 on the inner side of the lower part of the upper packaging substrate 2 through a solder ball 7, the solder pad 6 on the outer side of the lower part of the upper packaging substrate 2 is electrically connected to the solder pad 6 on the upper side of the lower packaging substrate 2 through the solder ball 7, and a filling glue 8 is provided between the upper packaging substrate 2 and the lower packaging substrate 1.
[0026] The groove 3 is arranged below the upper package substrate 2 , the pad 7 on the inner side below the upper package substrate 2 is arranged inside the groove 3 , and the pad 7 on the outer side below the upper package substrate 2 is arranged outside the groove 3 .
[0027] The packaging methods include: S1: manufacturing a lower package substrate 1, forming pads 6 on the upper and lower sides of the lower package substrate 1, and the pads 6 are electrically connected through a conductor in the lower package substrate 1; S2: manufacturing an upper package substrate 2, forming a groove 3 below the upper package substrate 2, forming pads 6 inside and outside the groove 3 below the upper package substrate 2, and the pads 6 are electrically connected through the conductor in the upper package substrate 2; S3; mounting the chip 5 on the lower package substrate 2; S4: soldering balls 7 are implanted on the soldering pads 6 of the lower package substrate 2 and the soldering pads 6 of the chip 5; S5: Applying a filling glue 8 on the lower package substrate 2 and the chip 5; S6: welding the pad 6 of the upper package substrate 2 to the solder ball 7; S7: Planting solder balls 7 on the pads 6 below the lower package substrate 2; S8: Bake and solidify the molding.
[0028] In this embodiment, the lower package substrate 1 and the upper package substrate 2 can be prefabricated in advance. The pads 6 and internal conductors are provided on the substrates according to the prior art. The chip 5 is mounted on the lower package substrate 2, and then the solder balls 7 are implanted. The filling glue 8 can be a resin-based non-conductive glue, such as the bottom filler of the chip flip-chip. When applying the glue, the top of the solder ball 7 is exposed, and then the pads 6 of the upper package substrate 2 are welded to the solder balls 7. The filling glue 8 makes the upper package substrate 2 fit the lower package substrate 1. The solder balls 7 are implanted on the pads 6 below the lower package substrate 2 for electrical connection to the outside. Finally, the filling glue 8 is baked to solidify and form. Example
[0029] like Figure 7-Figure 12 As shown, this embodiment provides a building block type welding conductive packaging structure of multiple chip stacks, which is different from the first embodiment in that: the lower packaging substrate 1 is provided with one or more steps 4, and multiple chips 5 are stacked along the steps 4, and the pads 6 on one side above the chip 5 are staggered and exposed, and the side of the groove 3 is stepped to cooperate with the chip 5, and the inner pad 6 at the bottom of the upper packaging substrate 2 is arranged at the stepped part of the side of the groove 3.
[0030] During the packaging process, a step 4 is formed on the lower packaging substrate 1 in step S1, the side of the groove 3 of the upper packaging substrate 2 is stepped in step S2, and the pad 6 in the groove 3 is set at the step. In step S3, multiple chips 5 are stacked and mounted upward along the step 4.
[0031] In this embodiment, a multi-step step 4 is provided on the lower package substrate 1 to support one side of the chip 5 when the chip 5 is stacked and mounted, and to fill the suspended portion of the stacked chip 5. The groove 3 of the upper package substrate 1 is provided according to the shape of the chip 5 after stacking, and the pad 6 under the groove 3 is electrically connected to the chip 5 through the solder ball 7, so as to realize the building block welding conduction packaging of the stacked chip. The other steps are the same as those in the first embodiment.
[0032] The present invention can use prefabricated lower packaging substrate 1 and upper packaging substrate 2, eliminating wire bonding and plastic sealing processes, greatly simplifying the chip packaging process, improving production efficiency and reducing mass production costs.
Claims
1. A building block type welding conduction packaging structure, characterized in that: The invention comprises a lower packaging substrate (1) and an upper packaging substrate (2), wherein at least one of the upper portion of the lower packaging substrate (1) and the lower portion of the upper packaging substrate (2) is provided with a groove (3), a chip (5) is arranged in the groove (3), solder pads (6) are provided on the inner side and the outer side of the lower portion of the upper packaging substrate (2), the solder pads (6) on the inner side and the outer side of the lower portion of the upper packaging substrate (6) are electrically connected inside the upper packaging substrate (1), solder pads (6) are provided on the upper and lower sides of the lower packaging substrate (1), the solder pads (6) on the upper and lower sides of the lower packaging substrate (1) are electrically connected inside the lower packaging substrate (1), the upper portion of the chip (5) is connected to the solder pads (6) on the inner side of the lower portion of the upper packaging substrate (2) through a solder ball (7), the solder pads (6) on the outer side of the lower portion of the upper packaging substrate (2) are electrically connected to the solder pads (6) on the upper side of the lower packaging substrate (2) through a solder ball (7), and a filling glue (8) is provided between the upper packaging substrate (2) and the lower packaging substrate (1).
2. The modular welding conductive packaging structure according to claim 1, characterized in that: The groove (3) is arranged below the upper packaging substrate (2), the solder pad (6) on the inner side below the upper packaging substrate (2) is arranged inside the groove (3), and the solder pad (6) on the outer side below the upper packaging substrate (2) is arranged outside the groove (3).
3. The modular welding conductive packaging structure according to claim 1, characterized in that: The groove (3) is arranged below the upper packaging substrate (2); the lower packaging substrate (1) is provided with one or more steps (4); a plurality of chips (5) are stacked along the steps (4); the pads (6) on one side above the chips (5) are staggered and exposed; the side surface of the groove (3) is in a step shape to match the chip (5); and the inner pad (6) below the upper packaging substrate (2) is arranged at the step-shaped portion of the side surface of the groove (3).
4. The modular welding conductive packaging structure according to claim 1, characterized in that: The solder pad (6) on the lower side of the lower packaging substrate (1) is connected to a solder ball (7).
5. A packaging method for the modular welding conductive packaging structure according to claim 1, characterized in that: include: S1: manufacturing a lower packaging substrate (1), forming solder pads (6) on the upper and lower sides of the lower packaging substrate (1), and electrically connecting the solder pads (6) via a conductor in the lower packaging substrate (1); S2: manufacturing an upper packaging substrate (2), forming a groove (3) below the upper packaging substrate (2), forming solder pads (6) inside and outside the groove (3) below the upper packaging substrate (2), and electrically connecting the solder pads (6) via a conductor inside the upper packaging substrate (2); S3: mounting a chip (5) on the lower packaging substrate (2); S4: Planting solder balls (7) on the solder pads (6) of the lower packaging substrate (2) and the solder pads (6) of the chip (5); S5: applying a filling glue (8) on the lower packaging substrate (2) and the chip (5); S6: welding the solder pad (6) of the upper packaging substrate (2) to the solder ball (7); S7: Planting a solder ball (7) on the solder pad (6) below the lower package substrate (2); S8: Bake and solidify the molding.
6. The packaging method of the modular welding conductive packaging structure according to any one of claim 5, characterized in that: In step S1, a step (4) is formed on the lower packaging substrate (1); in step S2, the side surface of the groove (3) of the upper packaging substrate (2) is in the shape of a step, and the pad (6) in the groove (3) is arranged at the step; and in step S3, a plurality of chips (5) are stacked and mounted upward along the step (4).