Device and method for surface treatment based on jet plasma

Abstract

The invention belongs to the field of electrical engineering, and particularly relates to a device and a method for surface treatment based on jet plasma, the device mainly comprises a power supply 1, a high-voltage electrode 2, a quartz tube 3, an upper ground electrode 4, a lower ground electrode 5, a gas flow controller 6, a gas delivery pipe 7 and a gas source 8; a double-ground-electrode structure is adopted, the effect of stabilizing discharge plume is achieved, a high-voltage electrode 2 is arranged in a quartz tube 3 and connected with a power source 1, an upper ground electrode 4 and a lower ground electrode 5 are in a circular ring shape and tightly attached to the outer surface of the quartz tube 3, in the working state, the power source 1 applies high voltage to the high-voltage electrode 2, and a plasma discharge area is formed between the ground electrodes 4 and 5. The gas flow rate of the gas source is adjusted through the gas flow controller 6, the gas is injected into a plasma discharge area through the gas conveying pipe 7, and generated plasma acts on the waste lead-acid battery in a jet flow mode. According to the invention, the uniformity of the plasma jet is obviously improved, the whole jet process is more stable, and the occurrence of local abnormal discharge is reduced.

Description

Technical Field

[0001] The present invention belongs to but is not limited to the field of electrical engineering, and in particular relates to a device and method for surface treatment based on jet plasma. Background Art

[0002] With the rapid development of advanced manufacturing technology, plasma technology has been widely used in the field of material surface treatment. Plasma technology has become an important tool in many high-tech industries (such as environmental protection, material processing, semiconductor manufacturing, microelectronic device processing, etc.) due to its advantages in achieving efficient material modification, surface cleaning, etching and coating deposition at low temperatures. The main advantage of plasma treatment is that it can provide highly active particles (such as ions, free radicals and electrons) to change the surface physical and chemical properties of materials. However, the existing plasma surface treatment technology still has many problems and limitations, and it is in urgent need of further improvement and optimization.

[0003] At present, plasma jet equipment mostly adopts a monopolar electrode structure. This design structure is relatively simple, but it faces many bottlenecks in practical applications. First, the single ground electrode structure leads to uneven electric field distribution, especially on the surface of complex materials or samples with different shapes and structures. The plasma jet is prone to uneven local intensity, resulting in uneven treatment and affecting the effect of surface modification or etching. This is difficult to meet the process requirements for some processes that have strict requirements on surface treatment uniformity. Secondly, the monopolar electrode design is prone to local high temperature during the plasma jet process. Due to the non-uniformity of discharge, the gas temperature near the electrode increases significantly, which will cause irreversible damage to the thermosensitive material, resulting in ablation and structural deformation on the surface of the material, further limiting the application of plasma jet technology. In addition, the stability of the monopolar electrode configuration is poor and is easily affected by changes in environmental conditions. The problem of arc discharge during the jet process is particularly prominent, especially under high-power operating conditions, where the arc can cause premature damage to the electrode and have adverse effects on the sample surface. This instability not only increases the cost of equipment maintenance and operation, but also limits the long-term continuous operation capability of the plasma jet technology and reduces the controllability and stability of the process.

[0004] In response to the above problems, research and technological improvements in recent years have mainly focused on the following directions: (1) optimizing electrode design to improve electric field distribution and stability; (2) reducing the formation of high-temperature areas by improving the composition and flow pattern of the jet gas; (3) using multi-electrode or composite electrode structures to try to improve the uniformity of the jet and process effect. Although some progress has been made in these areas, the limitations of traditional single-ground electrodes are still obvious and cannot fully meet the requirements of complex material surface treatment. Summary of the invention

[0005] In view of the problems existing in the prior art, the present invention provides a device and method for surface treatment based on jet plasma.

[0006] The present invention is implemented as follows: a device for surface treatment based on jet plasma, characterized in that the device mainly includes a power supply 1, a high voltage electrode 2, a quartz tube 3, an upper ground electrode 4, a lower ground electrode 5, a gas flow controller 6, a gas delivery pipe 7, and a gas source 8;

[0007] The device adopts a double ground electrode structure to stabilize the discharge plume. The high-voltage electrode 2 is placed in a quartz tube 3, and the high-voltage electrode is connected to a power source 1. The upper ground electrode 4 and the lower ground electrode 5 are annular and closely attached to the outer surface of the quartz tube 3. In the working state, the power source 1 applies high voltage to the high-voltage electrode 2, and a plasma discharge region is formed between the ground electrodes 4 and 5. The gas source adjusts the gas flow rate through a gas flow controller 6 and is injected into the plasma discharge region through a gas pipe 7. The generated plasma acts on the waste lead-acid battery in the form of a jet.

[0008] Further, the design parameters of each component of the device are as follows:

[0009] (1) Plasma gas source: Plasma working gas, which can be a variety of single gases or mixed gases, such as argon, nitrogen, oxygen, helium, hydrogen, etc., is controlled by a gas source 8 through a gas flow controller 6 and enters the quartz tube 3 through a gas pipe 7. The gas flow rate can be adjusted according to the discharge effect;

[0010] (2) Power supply parameters: The power supply of the present invention can be a radio frequency or pulse power supply, the voltage can be 1-5 kV, and the power is 100-150 W. In this embodiment, the applied voltage is 3 kV. The voltage is applied to the high-voltage electrode 2 through a high-voltage cable. At this time, the working gas is ionized to generate a plasma jet discharge;

[0011] (3) Component structure: the high-voltage electrode 2 is in the shape of a long rod, the quartz tube 3 is a hollow cylindrical tube, and the upper ground electrode 4 and the lower ground electrode 5 are in the shape of a ring and fit the outer surface of the quartz tube 3;

[0012] (4) Selection of materials: The material of the high voltage electrode 2 is tungsten, the material of the quartz tube 3 is quartz, and the materials of the upper ground electrode 4 and the lower ground electrode 5 are copper;

[0013] (5) Dimension parameters: The length of the high-voltage electrode 2 is about 150 mm and the diameter is about 3 mm. The length of the quartz tube 3 is 150 mm, the outer diameter is 10 mm, and the inner diameter is 8.5 mm. The connection between the gas pipe and the quartz tube is 80 mm long. The outer diameter and inner diameter of the gas pipe connection are determined according to the size of the gas pipe 7. The width of the upper ground electrode 4 and the lower ground electrode 5 is 7 mm and the thickness is 0.3 mm. The center distance between the upper ground electrode 4 and the lower ground electrode 5 is 11 mm. The center distance between the lower electrode 5 and the lower end of the quartz tube 3 is 7.5 mm. The center distance between the high-voltage electrode 2 and the lower ground electrode 5 is 5.5 mm. It is worth noting that the end dimensional parameters of the high-voltage electrode 2, such as the end curvature or other shapes, can be adjusted according to the specific discharge effect to produce a stable and uniform plasma jet.

[0014] Another object of the present invention is to provide a method for surface treatment based on jet plasma based on the device for surface treatment based on jet plasma, the method specifically comprising:

[0015] In order to enhance the processing uniformity and stability during the processing, a flat ground electrode 10 is placed at the plasma jet plume 9, and the object to be processed is placed directly under the plume, so that the plasma jet processing device is in working state, and the gas flow rate, power supply voltage, and plasma processing time can be adjusted according to different processed objects.

[0016] In combination with the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solutions to be protected by the present invention are as follows:

[0017] First, (1) The dual ground electrode structure adopted by the present invention is compared with the traditional single ground electrode. The traditional single ground electrode structure often faces the problem of uneven electric field distribution, which easily leads to local instability of the plasma jet and affects the uniformity and stability of the jet. The dual ground electrode significantly improves the uniformity of the plasma jet by optimizing the electric field distribution, making the entire jet process more stable and reducing the occurrence of local abnormal discharge.

[0018] In addition, in the traditional single ground electrode system, local overheating is prone to occur around the electrode, especially under high power operation, and the increase in gas temperature is not conducive to the processing of heat-sensitive materials. In contrast, the double ground electrode can disperse the heat and significantly reduce the gas temperature in the jet area, making it suitable for a wider range of material processing.

[0019] In terms of discharge stability, the dual ground electrode can more effectively control the discharge process and reduce the occurrence of arc or unstable discharge compared to the single ground electrode, which is crucial to improving the repeatability and process quality of the plasma process. In terms of reaction efficiency, the dual ground electrode structure expands the plasma reaction area, making ionization and chemical reactions more complete. Compared with the traditional single ground electrode, it can achieve higher processing efficiency and deeper material modification effects under the same conditions.

[0020] At the same time, the dual ground electrode design reduces the problem of electrode erosion. The traditional single ground electrode is prone to rapid wear of the electrode material due to the local electric field concentration, while the dual ground electrode reduces the electrode loss rate and extends the service life by balancing the electric field distribution.

[0021] (2) The design of using grounded plate electrodes during the treatment process has the following advantages:

[0022] 1) Significantly enhance the uniformity of the electric field, ensuring a more uniform electric field distribution between the plasma jet and the sample surface, thereby promoting uniform coverage and treatment of the sample surface by the plasma jet.

[0023] 2) Placing the sample on the grounded plate electrode can effectively improve the reaction efficiency of the plasma. The grounded plate electrode provides a stable potential reference point for the plasma, thereby enhancing the charge exchange process between the plasma and the sample surface, promoting the generation of surfactants and the chemical reaction. This not only helps to improve the processing efficiency of processes such as surface modification and material etching, but also improves the uniformity and depth of the processing effect.

[0024] 3) The grounded plate electrode can also reduce unnecessary discharge and arcing during sample processing. Compared with the floating electrode configuration, the grounded plate electrode helps stabilize the discharge process and reduce arcing caused by local excessive electric fields.

[0025] 4) Enhance the physical effect of the plasma jet on the sample. Under the acceleration of the electric field near the ground electrode, the ions and active particles in the plasma have a stronger bombardment and reaction with the sample surface, which is beneficial to increase the etching rate or the depth of surface modification.

[0026] Second, the jet plasma surface treatment device of the present invention solves several key technical problems in the prior art through a series of optimized parameter designs, which are mainly reflected in the following aspects:

[0027] 1. Stable plasma jet: Traditional plasma jet devices often have uneven treatment effects due to unstable discharge. The present invention adopts a double ground electrode design, and the electrode spacing and shape are optimized. The length and end shape of the high-voltage electrode are also precisely adjusted to ensure the stability and uniformity of the plasma jet and avoid the common jet unevenness or turbulence.

[0028] 2. Flexible gas flow control: Through the precise adjustment of the gas flow controller, the working gas flow entering the jet area can be flexibly controlled, thereby adjusting the plasma generation process. This design not only enhances the flexibility of the system and adapts to the processing requirements of different surface materials, but also improves processing efficiency and reduces energy consumption.

[0029] 3. Efficient power supply parameter configuration: The power supply voltage range is 1-5kV, and the power is 100-150W. Especially at the working voltage of 3kV, the plasma can be stably generated and has enough energy to complete the surface treatment. At the same time, by selecting radio frequency or pulse power supply, the ionization efficiency is further improved, making the plasma jet generation faster and the discharge efficiency higher.

[0030] 4. Accurate selection of materials and dimensions: The high-voltage electrode is made of tungsten material, which has good corrosion resistance and conductivity and is suitable for high-energy discharge environments. The size design of the quartz tube has also been optimized to ensure the reasonable distribution of airflow and ionization space, thereby improving the stability of the jet and the discharge effect. Through the careful design of the electrode and quartz tube size, the miniaturization and high efficiency of the equipment are achieved.

[0031] Through these optimizations, the present invention significantly improves the accuracy and efficiency of plasma surface treatment, solves the problems of unstable discharge, low energy utilization, uneven treatment, etc. in the prior art, and has wide industrial application value.

[0032] Third, the expected benefits and commercial value of the technical solution of the present invention after transformation are as follows: In terms of technical performance, the structure of the present invention optimizes the stability of the plasma jet, and effectively reduces the arc and noise during the discharge process by rationally configuring the electrode position and electric field distribution, making the jet more consistent and stable. This structural design also improves energy utilization efficiency, making applications in the fields of material surface treatment, medical treatment, and environmental protection more energy-efficient and efficient. In addition, the design of the double ground electrode can reduce electrode wear and extend the service life of the equipment, thereby reducing equipment maintenance costs.

[0033] In terms of commercial value, the device of the present invention can be widely used in multiple industries. Its application in material surface treatment can effectively improve the surface quality of products, especially in the fields of semiconductor manufacturing and precision electronic manufacturing, where its stable jet characteristics will greatly improve the accuracy and efficiency of processing. At the same time, the device also has broad prospects in the medical and biological fields, such as for wound disinfection, tissue repair and other applications, by providing safe and reliable plasma jets to ensure the treatment effect. In terms of environmental protection, the device can efficiently treat pollutants in exhaust gas, air and water, and achieve the degradation of volatile organic compounds (VOCs), which meets the development needs of today's environmental protection industry.

[0034] In terms of market competitiveness, due to its low manufacturing cost and simple maintenance, it can provide cost-effective solutions in many fields. Through standardized and modular production methods, mass production and promotion of the device are also highly feasible. In addition, the intellectual property protection of this technology will bring patent income to the company, and technology licensing and industrial cooperation opportunities will further enhance its commercial value. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a structural diagram of a device for surface treatment based on jet plasma provided in an embodiment of the present invention;

[0036] Figure 2 Schematic diagram of a plasma jet device provided in an embodiment of the present invention processing an object to be processed;

[0037] Figure 3 1 is the voltage and current waveform of plasma jet discharge under certain conditions in an embodiment of the present invention (RF power supply: 13.56 MHz, 100 W; working gas is pure argon).

[0038] In the figure: 1. power supply; 2. high voltage electrode; 3. quartz tube; 4. upper ground electrode; 5. lower ground electrode; 6. gas flow controller; 7. gas transmission pipe; 8. gas source; 9. plasma jet plume; 10. flat ground electrode. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0040] like Figure 1 As shown, an embodiment of the present invention provides a device for surface treatment based on jet plasma, characterized in that the device mainly includes a power supply 1, a high voltage electrode 2, a quartz tube 3, an upper ground electrode 4, a lower ground electrode 5, a gas flow controller 6, a gas delivery pipe 7, and a gas source 8;

[0041] The device adopts a double ground electrode structure to stabilize the discharge plume. The high-voltage electrode 2 is placed in a quartz tube 3, and the high-voltage electrode is connected to a power source 1. The upper ground electrode 4 and the lower ground electrode 5 are annular and closely attached to the outer surface of the quartz tube 3. In the working state, the power source 1 applies high voltage to the high-voltage electrode 2, and a plasma discharge region is formed between the ground electrodes 4 and 5. The gas source adjusts the gas flow rate through a gas flow controller 6 and is injected into the plasma discharge region through a gas pipe 7. The generated plasma acts on the waste lead-acid battery in the form of a jet.

[0042] The device for surface treatment based on jet plasma provided in an embodiment of the present invention utilizes the high energy characteristics of plasma generated under the action of a high voltage electric field. First, the device provides voltage to a high voltage electrode 2 through a power supply 1. The high voltage electrode 2 is placed in a quartz tube 3, and the outside of the quartz tube is close to the annular structure of the upper ground electrode 4 and the lower ground electrode 5. This dual ground electrode design can effectively stabilize the discharge plume of the plasma, ensure that the plasma is evenly distributed in the discharge area, avoid unstable discharge phenomena, and improve the treatment effect.

[0043] When the device is started, the power supply 1 applies high voltage to the high voltage electrode 2, so that a plasma discharge region is generated in the space between the high voltage electrode and the upper and lower ground electrodes 4 and 5. In this region, the gas source 8 injects gas through the gas pipe 7, and the gas flow rate is accurately adjusted by the gas flow controller 6. After the gas enters the discharge region, it is ionized and forms plasma under the action of the high voltage electric field, generating a stable plasma jet.

[0044] The jet plasma is ejected at high speed through the outlet of the quartz tube and directly acts on the surface of the waste lead-acid battery. The high temperature and high energy state of the plasma jet can effectively remove pollutants, oxide layers or other unwanted surface layers on the surface of the lead-acid battery, while activating the battery surface material, providing conditions for subsequent surface repair or recycling. Through the energy transfer of plasma, the surface structure of the waste lead-acid battery changes, thereby achieving cleaning, repair or functional surface treatment.

[0045] In addition, the regulating function of the gas flow controller 6 ensures the stability of the plasma jet and the controllability of the energy output. By adjusting the flow rate and type of different gases, it is possible to achieve accurate treatment of the surfaces of different materials and adapt to various surface treatment requirements. In particular, for complex industrial materials such as waste lead-acid batteries, the plasma jet can remove harmful substances on the surface without damaging the battery body.

[0046] Finally, the dual ground electrode structure used in the entire device can ensure uniform electric field distribution in the plasma discharge area, making the jet plasma have better directionality and stability. By controlling the power and action time of the plasma jet, it can achieve flexible response to different surface treatment tasks, especially in the field of industrial waste material treatment, which has broad application prospects.

[0047] The design parameters of each component of the device are as follows:

[0048] (1) Plasma gas source: Plasma working gas, which can be a variety of single gases or mixed gases, such as argon, nitrogen, oxygen, helium, hydrogen, etc., is controlled by a gas source 8 through a gas flow controller 6 and enters the quartz tube 3 through a gas pipe 7. The gas flow rate can be adjusted according to the discharge effect;

[0049] (2) Power supply parameters: The power supply of the present invention can be a radio frequency or pulse power supply, the voltage can be 1-5 kV, and the power is 100-150 W. In this embodiment, the applied voltage is 3 kV. The voltage is applied to the high-voltage electrode 2 through a high-voltage cable. At this time, the working gas is ionized to generate a plasma jet discharge;

[0050] (3) Component structure: the high-voltage electrode 2 is in the shape of a long rod, the quartz tube 3 is a hollow cylindrical tube, and the upper ground electrode 4 and the lower ground electrode 5 are in the shape of a ring and fit the outer surface of the quartz tube 3;

[0051] (4) Selection of materials: The material of the high voltage electrode 2 is tungsten, the material of the quartz tube 3 is quartz, and the materials of the upper ground electrode 4 and the lower ground electrode 5 are copper;

[0052] (5) Dimension parameters: The length of the high-voltage electrode 2 is about 150 mm and the diameter is about 3 mm. The length of the quartz tube 3 is 150 mm, the outer diameter is 10 mm, and the inner diameter is 8.5 mm. The connection between the gas pipe and the quartz tube is 80 mm long. The outer diameter and inner diameter of the gas pipe connection are determined according to the size of the gas pipe 7. The width of the upper ground electrode 4 and the lower ground electrode 5 is 7 mm and the thickness is 0.3 mm. The center distance between the upper ground electrode 4 and the lower ground electrode 5 is 11 mm. The center distance between the lower electrode 5 and the lower end of the quartz tube 3 is 7.5 mm. The center distance between the high-voltage electrode 2 and the lower ground electrode 5 is 5.5 mm. It is worth noting that the end dimensional parameters of the high-voltage electrode 2, such as the end curvature or other shapes, can be adjusted according to the specific discharge effect to produce a stable and uniform plasma jet.

[0053] like Figure 2 As shown, an embodiment of the present invention provides a method for performing surface treatment based on jet plasma based on the device for performing surface treatment based on jet plasma, and the method specifically includes:

[0054] In order to enhance the processing uniformity and stability during the processing, a flat ground electrode 10 is placed at the plasma jet plume 9, and the object to be processed is placed directly under the plume, so that the plasma jet processing device is in working state, and the gas flow rate, power supply voltage, and plasma processing time can be adjusted according to different processed objects.

[0055] Figure 3 This is the voltage and current waveform of the plasma jet discharge using a radio frequency power supply (13.56MHz, 100W) and working gas as pure argon. The results show that the voltage and current remain stable and there is no voltage and current fluctuation. At the same time, a large number of micro-discharge processes in the argon provide the energy required for the reaction, resulting in a large number of high-energy electrons and other charged particles in a short period of time. The current phase is always ahead of the voltage phase, which is in line with the discharge characteristics of the dielectric barrier discharge forming a capacitive structure.

[0056] Example 1: Cleaning and repairing the surface of waste lead-acid battery plates

[0057] In this embodiment, the device of the present invention is used for cleaning and repairing the surface of the pole plate of the waste lead-acid battery. First, the pole plate of the waste lead-acid battery is disassembled from the battery and placed in the plasma jet output position of the device. The gas source 8 selects argon gas, and the gas flow controller 6 adjusts the flow rate of argon gas to 50 standard cubic centimeters per minute (sccm) to ensure stable gas flow. The power supply 1 applies a high voltage of 6kV to the high-voltage electrode 2, and the plasma discharge area forms a stable jet plasma plume between the upper and lower ground electrodes 4 and 5. The surface of the pole plate is treated by jet plasma, and the high-energy plasma can effectively remove the oxide and sulfate deposits on the surface of the pole plate, and at the same time, the surface of the pole plate is microscopically repaired to restore its conductive properties. The whole treatment process lasts for 5 minutes. The surface of the pole plate after treatment is clean and pollution-free, and the surface activity is enhanced, which is conducive to subsequent material recovery or reuse.

[0058] Example 2: Removal of oxide layer on the surface of copper wire in electronic waste

[0059] In this embodiment, the device of the present invention is used to remove the oxide layer on the surface of copper wires in electronic waste. The gas source 8 selects nitrogen, and the gas flow controller 6 sets the flow rate of nitrogen to 30 standard cubic centimeters per minute (sccm) to ensure stable generation of plasma. The power supply 1 applies a high voltage of 8kV to the high-voltage electrode 2 to form a strong plasma jet. The copper wire disassembled from the discarded circuit board is placed within the range of action of the plasma jet. The plasma jet acts on the surface of the copper wire, quickly removes the oxide layer on its surface, and restores the smoothness of the wire surface. The treatment process lasts about 3 minutes, and the oxide layer on the surface of the treated copper wire is completely removed, and the conductivity is restored to a level close to that of a new wire. This method is suitable for large-scale electronic waste recycling and treatment processes.

[0060] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with the technical field within the technical scope disclosed by the present invention and within the spirit and principle of the present invention should be covered by the protection scope of the present invention.

Claims

1. A device for surface treatment based on jet plasma, characterized in that: The device comprises a power source (1), a high-voltage electrode (2), a quartz tube (3), an upper ground electrode (4), a lower ground electrode (5), a gas flow controller (6), a gas transmission pipe (7), and a gas source (8); wherein the high-voltage electrode (2) is placed in the quartz tube (3), the high-voltage electrode is connected to the power source (1), the upper ground electrode (4) and the lower ground electrode (5) are in a circular ring shape and are closely attached to the outer surface of the quartz tube (3), the power source (1) applies high voltage to the high-voltage electrode (2), a plasma discharge region is formed between the upper ground electrode (4) and the lower ground electrode (5), the gas source (8) adjusts the gas flow rate through the gas flow controller (6) and is injected into the plasma discharge region through the gas transmission pipe (7), and the generated plasma acts on the surface of the object to be processed in the form of a jet.

2. The device for surface treatment based on jet plasma according to claim 1, characterized in that: The gas source (8) is one or more mixed gases selected from argon, nitrogen, oxygen, helium or hydrogen. The gas flow rate is regulated by a gas flow controller (6). The gas enters the quartz tube (3) through a gas delivery pipe (7), and the flow rate is regulated according to the discharge effect.

3. The device for surface treatment based on jet plasma according to claim 1, characterized in that: The power source (1) is a radio frequency power source or a pulse power source, with an applied voltage of 1-5 kV and a power range of 100-150 W, preferably a voltage of 3 kV, for generating plasma jet discharge.

4. The device for surface treatment based on jet plasma according to claim 1, characterized in that: The material of the high-voltage electrode (2) is tungsten, the material of the quartz tube (3) is quartz, the material of the upper ground electrode (4) and the lower ground electrode (5) are copper, and the length of the high-voltage electrode (2) is 150 mm and the diameter is 3 mm.

5. The device for surface treatment based on jet plasma according to claim 1, characterized in that: The distance between the center of the high-voltage electrode (2) and the lower ground electrode (5) is 5.5 mm, the distance between the upper ground electrode (4) and the lower ground electrode (5) is 11 mm, and the end curvature of the high-voltage electrode (2) can be adjusted according to the discharge effect to achieve a stable and uniform plasma jet.

6. A surface treatment method based on jet plasma according to the device as claimed in claims 1-5, characterized in that: The following steps are involved: S1: adjusting the gas flow rate of the gas source (8) through the gas flow controller (6), and injecting the working gas such as argon, nitrogen, oxygen or helium into the quartz tube (3) through the gas pipe (7); S2: The power source (1) applies a high voltage of 1-5 kV to the high voltage electrode (2), driving the gas to form a plasma jet between the upper ground electrode (4) and the lower ground electrode (5); S3: The plasma jet acts on the waste lead-acid battery or other surface to be treated to achieve surface treatment or cleaning.

7. The method for surface treatment based on jet plasma according to claim 1, characterized in that: In step S1, the gas flow rate is precisely adjusted by a gas flow controller (6) to optimize the stability and treatment effect of the plasma jet. The gas flow rate can be adjusted according to actual needs.

8. The method for surface treatment based on jet plasma according to claim 1, characterized in that: In the step S2, a radio frequency power supply or a pulse power supply is used, and the output voltage is adjusted to 3 kV, and the power is set to 100-150 W to generate a stable plasma jet.

9. The method for surface treatment based on jet plasma according to claim 1, characterized in that: In step S3, the shape of the jet is controlled by adjusting the distance between the high-voltage electrode (2) and the lower ground electrode (5) and the shape of the end of the high-voltage electrode to achieve a more uniform surface treatment effect.

Images