Flexible circuit board assembly, display screen and electronic equipment

Abstract

The invention provides a flexible circuit board assembly, a display screen and electronic equipment, and relates to the field of display. The flexible circuit board assembly is applied to a display screen comprising a display module, and the flexible circuit board assembly comprises a flexible circuit board attached to the display module; the reinforcing plate is attached to the flexible circuit board and located between the flexible circuit board and the display module; wherein the area, located around the reinforcing plate, of the flexible circuit board is provided with at least one induction electrode, a gap is formed between the at least one induction electrode and a conductive foil in the display module to form at least one capacitor, and the at least one capacitor is used for detecting a mark, corresponding to the reinforcing plate area, of the display module. According to the technical scheme provided by the embodiment of the invention, the die mark on the display module caused by the reinforcing plate of the FPC can be effectively detected.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a flexible circuit board assembly, a display screen and an electronic device. Background Art

[0002] Flexible Printed Circuit (FPC), also known as FPC for short, is a printed circuit board made of a flexible substrate that can be bent, folded, and freely placed in three-dimensional space without damage. Due to its thinness, lightness, and resistance to bending, FPC can be preferably used in the display field and has become the mainstream choice in the market.

[0003] At present, in the design of FPC, setting up a reinforcement plate has become a necessary technical means for FPC punching. Although the introduction of the reinforcement plate enhances the stability and reliability of the circuit board, it also brings about mold printing problems to a certain extent. For example, when the FPC is folded back and applied to the display module, the surface of the module will be dented by the pressure of the reinforcement steel sheet, which will lead to the production of mold printing. These mold printings not only affect the external aesthetics of the product, but may also pose a potential threat to the performance and service life of the product. Today, the detection of mold printing mainly relies on human eye recognition. This method is not only inefficient, but also has obvious limitations. Not only is it difficult for human eye recognition to identify subtle mold printings, and it is prone to misjudgment and missed detection, but human eye recognition is also unable to perform quantitative analysis of mold printing, and cannot provide strong data support for improving product quality.

[0004] In view of this, how to effectively detect the mold imprint caused by the FPC reinforcement plate on the display module is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The present application provides a flexible circuit board assembly, a display screen and an electronic device, which can effectively detect the mold imprint on the display module caused by the reinforcement plate of the FPC.

[0006] In a first aspect, a flexible circuit board assembly is provided, which is applied to a display screen including a display module, and the flexible circuit board assembly includes: a flexible circuit board attached to the display module; a reinforcement plate attached to the flexible circuit board and located between the flexible circuit board and the display module; wherein at least one sensing electrode is provided in an area of ​​the flexible circuit board around the reinforcement plate, and a gap is provided between the at least one sensing electrode and a conductive foil in the display module to form at least one capacitor, and the at least one capacitor is used to detect an imprint at an area of ​​the display module corresponding to the reinforcement plate.

[0007] Through the technical solution of the embodiment of the present application, for the flexible circuit board of the display module, at least one sensing electrode can be set therein, and the at least one sensing electrode can form at least one sensing capacitor with the conductive foil in the display module. The sensing capacitor can effectively characterize the space and distance between the sensing electrode and the conductive foil, so that through the sensing capacitor, it is possible to effectively detect whether there are marks and molds in the area of ​​the display module corresponding to the reinforcement plate, and the depth of the mold can be further quantitatively evaluated through the sensing capacitor. Furthermore, by identifying and locating the mold and quantitatively analyzing the mold, the developer can obtain detailed data on the size, shape, depth, etc. of the mold, so as to have a more comprehensive understanding of the impact of the mold on the product performance. Based on these data, the developer can also formulate more effective improvement measures to improve the performance and stability of the product, which is conducive to the further promotion and use of the product.

[0008] In some possible implementations, at least one sensing electrode is connected to at least one capacitance detection channel of a touch module of the electronic device where the display module is located, so that the touch module detects at least one capacitance formed by the at least one sensing electrode and the conductive foil.

[0009] Through the technical solution of this implementation, the touch module in the electronic device can be reused to implement print detection without the need to introduce other additional capacitance detection devices, thereby effectively saving the implementation cost of the technical solution of the present application.

[0010] In some possible implementations, a plurality of sensing electrodes are provided in the flexible circuit board; the plurality of sensing electrodes are connected to the same capacitance detection channel of the touch module; or, the plurality of sensing electrodes include a plurality of groups of sensing electrodes, each group of the plurality of groups of sensing electrodes includes at least one sensing electrode, and each group of sensing electrodes is connected to the same capacitance detection channel of the touch module.

[0011] In this embodiment, the connection method of multiple sensing electrodes and capacitance detection channels can be selected according to actual needs. In some connection methods, multiple positions around the reinforcement plate can be detected, so as to have a more accurate mold detection degree, which is conducive to improving the accuracy and comprehensiveness of subsequent mold analysis. In another connection method, multiple capacitance detection channels can be shared, so as to maximize the sharing of pins of the touch module, so that the touch module can reserve more pins and capacitance detection channels for touch detection of the touch screen.

[0012] In some possible implementations, a shape of at least one sensing electrode matches a contour shape of the reinforcement plate.

[0013] Through the technical solution of this embodiment, the design of at least one sensing electrode matches the contour design of the reinforcement plate, so that the capacitance detection corresponding to the at least one sensing electrode can more accurately match the information of multiple dimensions such as the shape, size and depth of the imprint caused by the reinforcement plate, thereby facilitating the integrity and accuracy of the stencil data, and further facilitating subsequent further stencil analysis.

[0014] In some possible implementations, the reinforcement plate is a polygonal reinforcement plate, and at least one sensing electrode is disposed at at least one corner of the polygonal reinforcement plate.

[0015] Through the technical solution of this implementation, the sensing electrodes are arranged at the corner positions of the polygonal reinforcing plate, so that the stencil caused by the polygonal reinforcing plate can be more accurately identified and analyzed, and the stencil detection result of this solution is better.

[0016] In some possible implementations, at least one sensing electrode is a zigzag electrode, and parameters of the zigzag electrode satisfy at least one of the following: a fold angle of the zigzag electrode is greater than or equal to 5 degrees and less than or equal to 175 degrees; a length of each side of the zigzag electrode is greater than or equal to 100 microns; and a width of each side of the zigzag electrode is greater than or equal to 50 microns.

[0017] In this embodiment, the sensing electrode is designed to be in a zigzag shape, so that the zigzag electrode can be well matched with a conventional polygonal reinforcement plate. In addition, by designing the folding angle of the zigzag electrode (for example, the folding angle is greater than or equal to 5 degrees and less than or equal to 175 degrees), the zigzag electrode can be adapted to reinforcement plates of various angles, and by designing the length and width of the side of the zigzag electrode, the zigzag electrode can meet the process requirements (for example, the width is greater than or equal to 50 μm), and the area of ​​the zigzag electrode (for example, the length is greater than or equal to 100 μm) can also be larger, thereby achieving more accurate capacitance detection.

[0018] In some possible implementations, the corners of the zigzag electrode are rounded.

[0019] In some possible implementations, at least one sensing electrode is arc-shaped.

[0020] The rounded sensing electrodes or arc sensing electrodes provided by the above two implementations can avoid the introduction of ESD into the sensing electrodes, thereby improving the reliability and service life of the flexible circuit board where the sensing electrodes are located.

[0021] In some possible implementations, a distance between at least one sensing electrode and an orthographic projection of the reinforcement plate on the flexible circuit board is greater than 0 and less than or equal to 100 micrometers.

[0022] In this embodiment, by designing the spacing value between the sensing electrode and the orthographic projection of the reinforcement plate on the flexible circuit board, the possibility of overlapping between the reinforcement plate and the sensing electrode due to mounting errors can be reduced, thereby ensuring reliable detection of the imprint of the reinforcement plate by the sensing electrode.

[0023] In some possible implementations, at least one sensing electrode is disposed on a metal layer of the flexible printed circuit board.

[0024] In this embodiment, the metal layer in the flexible circuit board can be reused to form at least one sensing electrode, and the at least one sensing electrode can be integrally formed with other circuit structures in the flexible circuit board, which is beneficial to reducing the manufacturing cost of the at least one sensing electrode.

[0025] In some possible implementations, the flexible circuit board is a single-layer flexible circuit board or a double-layer flexible circuit board.

[0026] When the number of layers of the flexible circuit board is small, its reinforcing plate has a greater impact on the imprint of the display module. Therefore, the technical solution of this embodiment is applied to a single-layer flexible circuit board or a double-layer flexible circuit board, which can have a more excellent and effective detection effect.

[0027] In a second aspect, a display screen is provided, comprising: a display module, and a flexible circuit board assembly provided by the first aspect or any possible implementation of the first aspect, wherein the flexible circuit board assembly is electrically connected to the display module to transmit electrical signals of the display module.

[0028] In some possible implementations, the display module includes: a display panel and a conductive foil, wherein the conductive foil is disposed on a side of the display panel away from a user; and the flexible circuit board assembly is attached to the side of the conductive foil away from the user via a conductive adhesive.

[0029] In a third aspect, an electronic device is provided, comprising: a display screen provided in the first aspect or any possible implementation manner of the first aspect.

[0030] In some possible implementations, the electronic device further includes: a touch module for realizing touch detection of the electronic device by a user; at least one sensing electrode on the flexible circuit board of the display screen is connected to at least one capacitance detection channel of the touch module, so that the touch module detects at least one capacitance formed by at least one sensing electrode and the conductive foil in the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a laminated structure of a display module in an OLED display screen applicable to the embodiment of the present application.

[0032] Figure 2 It is a schematic diagram of the assembly of the FPC and its reinforcement plate and the display module provided in the embodiment of the present application.

[0033] Figure 3 It is a schematic bottom view and a schematic side view of a flexible circuit board assembly of a display module provided in an embodiment of the present application.

[0034] Figure 4 It is a schematic diagram of at least one capacitor formed by at least one sensing electrode in a flexible circuit board and a metal foil in a display module provided in an embodiment of the present application.

[0035] Figure 5 This is a connection diagram of a flexible circuit board assembly and a touch module provided in an embodiment of the present application.

[0036] Figure 6 This is another connection diagram of the flexible circuit board assembly and the touch module provided in an embodiment of the present application.

[0037] Figure 7 This is another connection diagram of the flexible circuit board assembly and the touch module provided in an embodiment of the present application.

[0038] Figure 8 It is a schematic diagram of design parameters of a sensing electrode provided in an embodiment of the present application.

[0039] Fig. 9 It is a schematic diagram of various layouts of at least one sensing electrode on a flexible circuit board provided in an embodiment of the present application.

[0040] Fig.10 It is a schematic diagram of other various layouts of at least one sensing electrode on a flexible circuit board provided in an embodiment of the present application.

[0041] Fig.11 It is a schematic structural block diagram of a display screen provided in an embodiment of the present application.

[0042] Fig.12 A schematic structural block diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0043] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0044] The present application relates to a display screen or a display device. The display screen can be applied to a variety of fields and scenarios. As an example, the display screen can be applied to 3C electronic products of computers, communications and consumer electronics, including but not limited to televisions, mobile phones, computers, laptops, tablet computers, personal digital assistants (PDAs), car computers, wearable devices, gaming devices, photographing devices, etc. The present application does not limit the specific type of electronic device where the display screen is located.

[0045] In addition, the display screen involved in the present application may be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen, a quantum dot light-emitting diode (Quantum Dot Light Emitting Diodes, QLED) display screen, etc. The present application does not limit the specific type of the display screen.

[0046] As an example, Figure 1 The figure shows a stacked structure of a display module 100 in an OLED display screen applicable to an embodiment of the present application.

[0047] like Figure 1 As shown, the display module 100 is stacked from bottom to top with: a cover plate 110 , a first optical adhesive 120 , a polarizing element 130 , a second optical adhesive 140 , a display panel 150 , a third optical adhesive 160 , a buffer layer 170 and a metal foil 180 .

[0048] The cover plate 110 faces the user's eyes. The cover plate 110 is a transparent cover plate, which is used to transmit the light signal emitted by the display panel 150 in the display module 100, and the cover plate 110 can provide a touch interface for the user to the display screen. As an example but not a limitation, the material of the cover plate 110 can be glass or resin.

[0049] The first optical adhesive 120 is used to bond the polarizing element 130 and the cover plate 110. The first optical adhesive 120 includes but is not limited to optically clear adhesive (OCA). The polarizing element 130 is used to change the polarization state of the light signal emitted by the display panel 150. The polarizing element 130 is but is not limited to a polarizer (POL).

[0050] The second optical adhesive 140 is used to bond the polarizing element 130 and the display panel 150. Optionally, the second optical adhesive 140 includes but is not limited to OCA.

[0051] The display panel (Panel) 150 is the core light-emitting unit of the display module 100, which is stacked by a multi-layer structure including a substrate layer, a light-emitting layer, and an electrode layer. A pixel array formed by a plurality of pixel units is arranged on the display panel 150. Each pixel unit corresponds to a pixel circuit and a light-emitting unit. By being driven by an external signal, each pixel unit in the pixel array can emit a light signal of a different color to display images and videos.

[0052] The third optical adhesive 160 is used to bond the display panel 150 and the buffer layer 170. Optionally, the third optical adhesive 160 includes but is not limited to a textured adhesive, such as an Embo adhesive. The buffer layer 170 is used to provide a buffering effect to the display panel 150, reducing the pressure and impact caused by external forces on the display panel 150. As an example, the material of the buffer layer 170 can be foam.

[0053] A metal foil 180 may be disposed below the buffer layer 170. The metal foil 180 has a certain strength and support function, and can withstand and resist the pressure and impact of external forces, and further protect the display panel 150. In addition, the metal foil 180 can also play a certain heat dissipation role. Optionally, the material of the metal foil 180 may be, for example, copper (Cu) or stainless steel.

[0054] In some specific applications, the combination of the buffer layer 170 and the metal foil 180 may be referred to as a surface conductive film (SCF) of the display module 100 .

[0055] In actual applications, the display module 100 needs to be connected to external electrical components through a connector. In the current mainstream solution, the connector uses a flexible printed circuit (FPC). FPCs are generally supported by a reinforcing plate. When the FPC is assembled with the display module 100, the FPC may be folded back and attached to the back of the display module 100 according to product design requirements. In this case, the reinforcing plate will produce a mold mark or imprint on the surface of the module due to pressure.

[0056] For ease of explanation, Figure 2 FIG. 2 shows a schematic diagram of assembling the FPC 210 and its reinforcing plate 220 with the display module 100. Figure 2 Part (a) shows an ideal situation where the display module 100 does not produce a mold print. Figure 2 Part (b) of FIG. 1 shows an abnormal situation in which the display module 100 generates a mold print. It should be noted that, for the sake of convenience, Figure 2 Only the above text is shown Figure 1 Part of the stacked layers of the display module 100 , namely the buffer layer 170 and the metal foil 180 , are shown, while other parts of the display module 100 are hidden.

[0057] exist Figure 2 In the illustrated embodiment, the FPC 210 and the reinforcing plate 220 may be bonded to the metal foil 180 by means of a conductive adhesive 201. Figure 2 As shown in part (b) of the figure, when the reinforcing plate 220 squeezes the metal foil 180, the metal foil 180 and the buffer layer 170 corresponding to the reinforcing plate 220 will deform, resulting in an imprint 101, which in turn leads to the generation of a mold mark. As an example, the imprint 101 may be a dent, a convex mark, an uneven mark, etc., and its specific form is related to the design of the reinforcing plate 220, and the present embodiment of the application does not limit this.

[0058] These marks or molds not only affect the appearance of the product, but also pose a potential threat to the performance and service life of the product. Today, the detection of molds mainly relies on human eye recognition. This method is not only inefficient, but also has obvious limitations. Due to factors such as visual differences and fatigue of the human eye, human eye recognition is often prone to misjudgment and missed detection. Especially for those subtle molds, human eye recognition is even more difficult to handle. In addition, human eye recognition cannot perform quantitative analysis of molds and cannot provide strong data support for improving product quality.

[0059] In view of this, the present application provides a new type of flexible circuit board for a display module. By adding a detection electrode for detecting imprints on the flexible circuit board, the detection electrode can generate capacitance with the conductive foil in the display module. By detecting the capacitance, the imprints on the display module can be effectively detected and further quantitatively analyzed.

[0060] Figure 3 Schematic bottom view and schematic side view of a flexible circuit board assembly 300 provided in an embodiment of the present application are shown. Figure 3 Part (a) is a bottom view, and part (b) is a side view. Optionally, the flexible circuit board assembly 300 can be applied to a display screen including a display module.

[0061] like Figure 3 As shown, the flexible circuit board assembly 300 includes: a flexible circuit board 310 and a reinforcing plate 320. The flexible circuit board 310 is attached to the display module, and the reinforcing plate 320 is attached to the flexible circuit board 310 and is located between the flexible circuit board 310 and the display module.

[0062] Optionally, in this embodiment, the display module may be Figure 1In some embodiments, similar to the display module 100 shown in FIG. Figure 2 As shown, the flexible circuit board 310 and the reinforcement plate 320 in the flexible circuit board assembly 300 can be attached to the back of the display module 100, wherein the area of ​​the reinforcement plate 320 is smaller than that of the flexible circuit board 310, and the reinforcement plate 320 can be located between the flexible circuit board 310 and the display module 100.

[0063] Continue to see Figure 3 As shown, at least one sensing electrode 311 is provided in the area of ​​the flexible circuit board 310 around the reinforcement plate 320. The sensing electrode 311 may be made of metal and have a certain graphic design. In some specific implementations, the sensing electrode 311 may be referred to as a sensing pattern. Optionally, in some embodiments, at least one sensing electrode 311 is provided on one side of the flexible circuit board 310 facing the reinforcement plate 320, and the at least one sensing electrode 311 is provided around the reinforcement plate 320. As an example and not a limitation, four sensing electrodes 311 are shown in the figure, and the four sensing electrodes 311 may be respectively provided corresponding to the four corners of the rectangular reinforcement plate 320.

[0064] There is a gap between at least one sensing electrode 311 in the flexible circuit board 310 and the conductive foil in the display module to form at least one capacitor, and the at least one capacitor can be used to detect the print at the area of ​​the display module corresponding to the reinforcement plate 320. Optionally, the conductive foil can be, for example, Figure 1 The metal foil 180 on the back of the display module 100 shown in the figure, or the conductive foil can be made of other conductive materials besides metal materials.

[0065] For ease of understanding, Figure 4 A schematic diagram of at least one capacitor formed by at least one sensing electrode 311 in the flexible circuit board 310 and the metal foil in the display module is shown. As an example, Figure 4 The buffer layer 170 and the metal foil 180 in the above display module 100 are shown. Figure 4 Part (a) shows an ideal situation where the display module 100 does not produce a mold print. Figure 4 Part (b) in FIG. 1 shows an abnormal situation in which the display module 100 generates a mold print.

[0066] See also Figure 4 As shown, the area of ​​the flexible circuit board 310 is larger than the area of ​​the reinforcement plate 320, and the flexible circuit board 310 can completely cover the reinforcement plate 320. At least one sensing electrode 311 is disposed in the flexible circuit board 310 corresponding to the area around the reinforcement plate 320, and the orthographic projections of the at least one sensing electrode 311 and the reinforcement plate 320 on the flexible circuit board 310 do not overlap each other.

[0067] There is a certain air gap 301 between each of the at least one sensing electrode 311 and the metal foil 180. Each sensing electrode 311 serves as one electrode of a capacitor, the metal foil 180 serves as another electrode of the capacitor, and the air gap 301 between the sensing electrode 311 and the metal foil 180 serves as a medium of the capacitor. At least one sensing electrode 311 can form at least one capacitor with the metal foil 180.

[0068] contrast Figure 4 As can be seen from parts (a) and (b) of FIG. 1 , in an ideal case where the display module 100 does not produce a mold mark and in an abnormal case where the display module 100 produces a mold mark, the gap space between the sensing electrode 311 in the flexible circuit board 310 and the metal foil 180 is not the same. In this case, the capacitance value of the capacitor formed by the sensing electrode 311 and the metal foil 180 is also different. In view of the different mold marks, the capacitance value of the capacitor generated by the sensing electrode 311 is different. It is possible to determine whether the area of ​​the display module 100 corresponding to the reinforcement plate 320 produces a mark to form a mold mark by detecting the capacitance value of the capacitor. Furthermore, the depth of the mark can be quantified by the capacitance value to quantitatively evaluate the depth of the mold mark.

[0069] As an example, in an ideal case where the display module 100 does not produce a mold mark, the space volume of the air gap 301 between the sensing electrode 311 and the metal foil 180 is A1, and the capacitance of the capacitor formed by the sensing electrode 311 and the metal foil 180 is C1. In an abnormal case where the display module 100 produces a mold mark, the space volume of the air gap 301 between the sensing electrode 311 and the metal foil 180 is A2, and the capacitance of the capacitor formed by the sensing electrode 311 and the metal foil 180 is C2, wherein A1>A2, then C1<C2. Therefore, the larger the capacitance of the capacitor formed by the sensing electrode 311 and the metal foil 180, the deeper the imprint is and the more obvious the mold mark is. Conversely, the smaller the capacitance of the capacitor is, the shallower the imprint is and the less visible the mold mark is.

[0070] In summary, through the technical solution of the embodiment of the present application, for the flexible circuit board of the display module, at least one sensing electrode can be arranged therein, and the at least one sensing electrode can form at least one sensing capacitor with the conductive foil in the display module, and the sensing capacitor can effectively characterize the space and distance between the sensing electrode and the conductive foil, so that through the sensing capacitor, it is possible to effectively detect whether there are marks and mold prints in the area of ​​the display module corresponding to the reinforcement plate, and the depth of the imprint can be further quantified through the sensing capacitor to quantitatively evaluate the depth of the mold print.

[0071] By identifying, locating and quantitatively analyzing the mold, developers can obtain detailed data on the size, shape, depth and other aspects of the mold, thereby gaining a more comprehensive understanding of the impact of the mold on product performance. Based on this data, developers can also develop more effective improvement measures to improve product performance and stability, which is conducive to the further promotion and use of the product.

[0072] Optionally, in some embodiments of the present application, the flexible circuit board 310 may be a single-layer flexible circuit board or a double-layer flexible circuit board. When the number of layers of the flexible circuit board 310 is small, the reinforcing plate 320 has a greater impact on the mold print of the display module. Therefore, the technical solution provided in the embodiment of the present application is applied to a single-layer flexible circuit board or a double-layer flexible circuit board, which can have a more excellent and effective detection effect.

[0073] Optionally, the single-layer flexible circuit board may be a flexible circuit board having only a single-layer metal graphic layer. The double-layer flexible circuit board may be a flexible circuit board including a double-layer metal graphic layer. The metal graphic layer (or also referred to as the metal layer) may be used to realize the signal transmission function of the flexible circuit board. In addition to the metal graphic layer, the flexible circuit board may also include a substrate layer and an adhesive layer. The specific structure of the flexible circuit board may refer to the solution in the related art, and will not be described in detail herein.

[0074] In some embodiments, at least one sensing electrode 311 may be disposed on a metal layer of the flexible circuit board 310. That is, in this embodiment, the metal layer in the flexible circuit board 310 may be reused to prepare at least one sensing electrode 311, and the at least one sensing electrode 311 may be integrally formed with other circuit structures in the flexible circuit board 310, which is conducive to reducing the manufacturing cost of the at least one sensing electrode 311.

[0075] Alternatively, in some alternative implementations, in addition to being disposed on the metal layer of the flexible circuit board 310 , the sensing electrode 311 may also have another metal layer welded thereon, and the two metal layers may together form the sensing electrode 311 in the embodiment of the present application.

[0076] Optionally, when the flexible circuit board 310 is a double-layer flexible circuit board, at least one sensing electrode 311 may be disposed in a metal layer close to the reinforcing plate 320 in the double-layer metal pattern layer.

[0077] Optionally, in some embodiments of the present application, the reinforcing plate 320 may be a plate-like structure or a sheet-like structure with a certain mechanical strength. The material of the reinforcing plate 320 may be, for example, a metal material, a composite material, a plastic material, etc., wherein the metal material includes but is not limited to: steel, aluminum, etc., the composite material includes but is not limited to: carbon fiber or glass fiber, etc., and the plastic material includes but is not limited to: polyethylene, polycarbonate, etc. polymer materials. The present embodiment of the application does not specifically limit the material of the reinforcing plate.

[0078] Optionally, in some embodiments of the present application, the reinforcing plate 320 may be attached to one side of the flexible circuit board 310, and a variety of electrical devices may be provided on the other side of the flexible circuit board 310 to meet the relevant requirements of the signal processing of the display module. As an example, the electrical devices include but are not limited to active devices, passive devices, integrated circuit chips, etc.

[0079] In order to detect at least one capacitance between at least one sensing electrode 311 on the flexible circuit board 310 and the conductive foil of the display module, the at least one sensing electrode 311 may be connected to a capacitance detection device so that the capacitance detection device detects the at least one capacitance. As an example, the capacitance detection device may be a touch module in the electronic device where the display module is located, and the touch module may be a touch chip (Touch IC, TIC) in the electronic device, and the TIC may be used to detect a user's touch on the touch screen by detecting multiple capacitances of the touch screen.

[0080] Figure 5 A connection diagram of the flexible circuit board assembly 300 and the touch module 400 provided in an embodiment of the present application is shown.

[0081] like Figure 5 As shown, in the embodiment of the present application, the touch module 400 may have a plurality of capacitance detection channels 410, which may be, for example, a receiving sensing channel (also referred to as an Rx sensing channel) in a TIC. At least one sensing electrode 311 may be connected to at least one capacitance detection channel 410 in the touch module 400, so that the touch module 400 detects at least one capacitance corresponding to the at least one sensing electrode 311. Optionally, the touch module 400 may detect the at least one capacitance in a self-capacitance detection mode, in which the touch module 400 may only send and receive signals to the sensing electrode 311 for capacitance detection, and the other electrode (i.e., the conductive foil in the display module) may be considered to be grounded.

[0082] Through the technical solution of the embodiment of the present application, the touch module in the electronic device can be reused to realize the stencil detection without the need to introduce other additional capacitance detection devices, thereby effectively saving the implementation cost of the technical solution of the present application.

[0083] Optionally, in some embodiments, the touch module 400 can be set in the device area of ​​the flexible circuit board 310, and at least one sensing electrode 311 can be connected to the pin of the touch module 400 through the routing in the flexible circuit board 310 and then connected to the capacitance detection channel 410 of the touch module 400.

[0084] Alternatively, in some alternative embodiments, the touch module 400 may also be disposed at other locations of the electronic device, and at least one sensing electrode 311 may be connected to the capacitance detection channel 410 of the touch module 400 via traces on the flexible circuit board 310 and other related electrical connectors.

[0085] The at least one sensing electrode 311 can be connected to the capacitance detection channel 410 in the touch module 400 in a variety of ways. Figure 5 As shown, the four sensing electrodes 311 can be connected to the four capacitance detection channels 410 one by one. That is, in this example, at least one sensing electrode 311 on the flexible circuit board 310 can be connected to at least one capacitance detection channel 410 in the touch module 400 one by one.

[0086] Figure 6 and Figure 7 Two other connection schematic diagrams of the flexible circuit board assembly 300 and the touch module 400 provided in the embodiment of the present application are shown.

[0087] like Figure 6 As shown, the four sensing electrodes 311 can be connected to the same capacitance detection channel 410 of the touch module 400 . That is, in this example, at least one sensing electrode 311 on the flexible circuit board 310 can be connected to the same capacitance detection channel 410 in the touch module 400 .

[0088] like Figure 7 As shown, two of the four sensing electrodes 311 can be connected to one capacitance detection channel 410 of the touch module 400, and the other two of the four sensing electrodes 311 can be connected to another capacitance detection channel 410 of the touch module 400. That is, in this example, when a plurality of sensing electrodes 311 are provided on the flexible circuit board 310, the plurality of sensing electrodes 311 can include a plurality of groups of sensing electrodes 311, each group of sensing electrodes 311 can include at least one sensing electrode 311, and each group of sensing electrodes 311 can be connected to the same capacitance detection channel 410 of the touch module 400. In this example, the number of sensing electrodes 311 in each group of sensing electrodes 311 can be the same or different.

[0089] exist Figures 5 to 7 In the three examples shown, Figure 5The illustrated example method can detect multiple positions around the reinforcing plate 320, thereby having a more accurate mold detection degree, and can obtain more mold detection information and quantitative data, which is conducive to improving the accuracy and comprehensiveness of subsequent mold analysis. Figure 6 The illustrated example method can realize the sharing of multiple capacitance detection channels 410, thereby realizing the pin sharing of the touch module 400 to the greatest extent, so that the touch module 400 can reserve more pins and capacitance detection channels 410 for touch detection of the touch screen. Figure 7 The example shown can take into account the above Figure 5 and Figure 6 The advantages of the example shown are that the capacitance detection channel 410 and pins of the touch module 400 can be saved to a certain extent, and the information of the mold printing can be accurately detected to a certain extent.

[0090] It should be noted that the above three examples can be flexibly selected according to actual application requirements. For example, when the touch module 400 has sufficient capacitance detection channels 410 to implement touch detection, it can be selected Figure 5 The example shown in the figure can detect the stamp with the greatest degree of accuracy. On the contrary, if the number of capacitance detection channels 410 in the touch module 400 is relatively scarce, then Figure 6 The illustrated example method saves the number of capacitance detection channels 410 in the touch module 400 to the greatest extent, and gives priority to ensuring the performance of touch detection on the basis of achieving mold printing detection.

[0091] It should also be noted that when multiple sensing electrodes 311 are connected to the same capacitance detection channel 410, the touch module 400 can sum the multiple capacitors connected to the same capacitance detection channel 410. The sum of the capacitance values ​​of the multiple capacitors can represent the overall printing conditions of multiple areas of the display module.

[0092] Optionally, in some embodiments of the present application, the shape of at least one sensing electrode 311 matches the contour shape of the reinforcement plate 320. Specifically, the at least one sensing electrode 311 may be disposed around the contour of the reinforcement plate 320. The at least one sensing electrode 311 may be coated on the outer contour of the reinforcement plate 320.

[0093] Through the technical solution of this embodiment, the design of at least one sensing electrode 311 matches the contour design of the reinforcement plate 320, so that the capacitance detection corresponding to the at least one sensing electrode 311 can more accurately match the information of multiple dimensions such as the shape, size and depth of the impression and stencil caused by the reinforcement plate 320, thereby facilitating the integrity and accuracy of the stencil data, and further facilitating subsequent further stencil analysis.

[0094] As an example, as above Figures 5 to 7 As shown, the reinforcing plate 320 is a rectangular reinforcing plate, and the four sensing electrodes 311 can be distributed at the four corners of the rectangular reinforcing plate. Similarly, in the technical solution of this example, the reinforcing plate 320 can be a polygonal reinforcing plate, and at least one sensing electrode 311 can be set at at least one corner of the polygonal reinforcing plate.

[0095] Optionally, the reinforcing plate 320 may be an N-gon reinforcing plate, and the N sensing electrodes 311 may be arranged one-to-one at the N corners of the N-gon reinforcing plate. Alternatively, the reinforcing plate 320 may be an N-gon reinforcing plate, and the M sensing electrodes 311 may be arranged one-to-one at the M corners of the N-gon reinforcing plate. Wherein, N is a positive integer, and M is a positive integer less than N.

[0096] Through the technical solution of this implementation, the sensing electrodes are arranged at the corner positions of the polygonal reinforcing plate, so that the stencil caused by the polygonal reinforcing plate can be more accurately identified and analyzed, and the stencil detection result of this solution is better.

[0097] It should be noted that the polygonal reinforcing plate may be a regular polygon, such as a triangle, a quadrilateral, a hexagon, etc. Alternatively, the polygonal reinforcing plate may be an irregular polygon, which has no specific symmetry, and the lengths and positions of its sides and angles may be different. The embodiment of the present application does not specifically limit the shape of the polygonal reinforcing plate.

[0098] In addition, the reinforcing plate 320 in the embodiment of the present application may be a non-polygonal shape in addition to a polygon, such as a circle, an ellipse, a closed figure with an arc and a straight line, etc. In this case, the sensing electrode 311 may also be arranged to match the contour shape of the reinforcing plate 320. For example, for a circular reinforcing plate, the sensing electrode 311 may be designed to be an arc shape.

[0099] Figure 8 A schematic diagram of design parameters of a sensing electrode 311 provided in an embodiment of the present application is shown.

[0100] like Figure 8 As shown, the sensing electrode 311 can be a zigzag electrode, which includes two straight edges, and the endpoints of the two edges intersect to form a fold angle of the zigzag electrode. The parameters of the zigzag electrode meet at least one of the following items: the fold angle of the zigzag electrode is greater than or equal to 5° and less than or equal to 175°, the length of each edge of the zigzag electrode is greater than or equal to 100μm, and the width of each edge of the zigzag electrode is greater than or equal to 50μm.

[0101] Specifically, in Figure 8In the example shown, the zigzag electrode includes a first side and a second side, the length of the first side is H1, the width is D1, the length of the second side is H2, the width is D2, the first side and the second side form two angles (i.e., the folding angles mentioned above), wherein the first angle α1 is the angle of the inner contours of the two sides, and the second angle α2 is the angle of the outer contours of the two sides. Among them, H1 ≥ 100 μm, further, H1 ≥ 300 μm; H2 ≥ 100 μm, further, H2 ≥ 300 μm; D1 ≥ 50 μm, D2 ≥ 50 μm; 5° ≤ α1 ≤ 175°, 5° ≤ α2 ≤ 175°.

[0102] In the embodiment of the present application, the sensing electrode is designed to be in a zigzag shape, so that the zigzag electrode can be well matched with a conventional polygonal reinforcement plate. In addition, by designing the folding angle of the zigzag electrode (for example, the folding angle is greater than or equal to 5 degrees and less than or equal to 175 degrees), the zigzag electrode can be adapted to reinforcement plates of various different angles. By designing the length and width of the side of the zigzag electrode, the zigzag electrode can meet the process requirements (for example, the width is greater than or equal to 50μm), and the area of ​​the zigzag electrode (for example, the length is greater than or equal to 100μm) can also be larger, thereby achieving more accurate capacitance detection.

[0103] In order to make the sensing electrode 311 provided in the embodiment of the present application compatible with any special-shaped reinforcement plate, Figure 8 The parameters shown in can also meet the following requirements: H1 = H2 or H1≠H2; D1 = D2 or D1≠D2; α1 = α2 or α1≠α2.

[0104] Optionally, in addition to meeting the above parameter design requirements, the distance between the sensing electrode 311 and the orthographic projection of the reinforcing plate 320 on the flexible circuit board 310 may be greater than 0 and less than or equal to 100 μm. Figure 8 As shown, the distance L1 between the first side of the sensing electrode 311 and the orthographic projection of the reinforcing plate 320 on the flexible circuit board 310 may be less than or equal to 100 μm, and the distance L2 between the second side of the sensing electrode 311 and the orthographic projection of the reinforcing plate 320 on the flexible circuit board 310 may be less than or equal to 100 μm. The design of 100 μm can meet the mounting error between the reinforcing plate 320 and the flexible circuit board 310, that is, during the process of mounting and attaching the reinforcing plate 320 to the flexible circuit board 310, the mounting position may fluctuate due to the process. By designing the spacing value between the sensing electrode 311 and the reinforcing plate 320, the possibility of the reinforcing plate 320 and the sensing electrode 311 overlapping each other due to the mounting error can be reduced, and reliable detection of the imprint of the reinforcing plate 320 by the sensing electrode 311 can be ensured.

[0105] Optionally, the lengths of the two sides of the sensing electrode 311 may be related to the lengths of the two sides of the reinforcement plate 320 corresponding to the two sides. For example, the ratio of the lengths of the two sides of the sensing electrode 311 may be equal to the ratio of the lengths of the two sides of the reinforcement plate 320 corresponding to the two sides. Specifically, the first side of the sensing electrode 311 corresponds to the first side of the reinforcement plate 320, the second side of the sensing electrode 311 corresponds to the second side of the reinforcement plate 320, the lengths of the first side and the second side of the sensing electrode 311 are H1 and H2 respectively, the lengths of the first side and the second side of the reinforcement plate 320 are H1' and H2' respectively, wherein H1 / H2=H1' / H2'. Through the technical solution of this embodiment, the side length of the sensing electrode 311 can match the side length of the reinforcement plate 320, so that the stencil caused by the reinforcement plate 320 can be better detected.

[0106] In addition, in some embodiments of the present application, when a plurality of sensing electrodes 311 are provided on the flexible circuit board 310, the shapes of the plurality of sensing electrodes 311 are the same. Alternatively, in some alternative embodiments, the shapes of the plurality of sensing electrodes 311 may be different from each other, or only some of the plurality of sensing electrodes 311 may have the same shapes. The shape design of each sensing electrode 311 in the flexible circuit board 310 may be adapted and designed according to the reinforcing plate 320, so as to achieve good detection of the corresponding mold print of the reinforcing plate 320.

[0107] Fig. 9 Schematic diagrams of various layouts of at least one sensing electrode 311 on a flexible circuit board 310 provided in an embodiment of the present application are shown.

[0108] As an example, in Fig. 9 In the embodiment shown, each sensing electrode 311 can be connected to the above Figure 8 The sensing electrodes 311 in the illustrated embodiment have similar shapes, that is, zigzag electrodes. In the case where a plurality of sensing electrodes 311 are disposed on the flexible circuit board 310 , each of the plurality of sensing electrodes 311 has the same shape.

[0109] Optionally, Fig. 9 The at least one sensing electrode 311 provided in the embodiments shown in parts (a) to (h) can be applied to a rectangular reinforcing plate 320. Each sensing electrode 311 can be an L-shaped electrode, and the angle between the two sides of the sensing electrode 311 is 90°. Fig. 9The at least one sensing electrode 311 provided in the embodiments shown in parts (i) to (l) can be applied to a polygonal reinforcement plate 320 including an obtuse angle, that is, the angle between the two sides of each sensing electrode 311 can be greater than 90°. In addition, the width of at least one side of the sensing electrode 311 can be a gradual width, and the inner contour angle and the outer contour angle of the two sides can be different.

[0110] like Fig. 9 As shown in parts (a) to (d) of FIG. 3 , the lengths of the two sides of each sensing electrode 311 may be equal, the widths may be equal, and the included angles of the inner and outer contours of the two sides may also be equal, that is, H1=H2, D1=D2, and α1=α2.

[0111] like Fig. 9 As shown in parts (e) to (h) of FIG. 3 , the lengths of the two sides of each sensing electrode 311 may be unequal, but the widths may be equal, and the included angles of the inner and outer contours of the two sides may also be equal, that is, H1≠H2, D1=D2, and α1=α2.

[0112] like Fig. 9 As shown in parts (i) to (l) of FIG. 3 , the lengths of the two sides of each sensing electrode 311 may be unequal, the widths may be unequal, and the included angles of the inner and outer contours of the two sides may be unequal, that is, H1≠H2, D1≠D2, and α1≠α2.

[0113] Understandably, Fig. 9 The figure only shows a partial design of at least one sensing electrode 311 , wherein the length and width of two sides of each sensing electrode 311 , and the angle between the inner and outer contours of the two sides can be adjusted according to actual conditions, and the embodiment of the present application does not specifically limit this.

[0114] Fig.10 Schematic diagrams of various other layouts of at least one sensing electrode 311 on a flexible circuit board 310 provided in an embodiment of the present application are shown.

[0115] As an example, in Fig.10 In the illustrated embodiment, each sensing electrode 311 may include a rounded corner design or an arc design.

[0116] like Fig.10 As shown in parts (a) to (d) of FIG. 3 , the sensing electrode 311 is a zigzag electrode, but each corner of the zigzag electrode is designed to be a rounded corner.

[0117] like Fig.10 As shown in parts (e) to (h) of FIG. 3 , the sensing electrode 311 is an arc-shaped electrode.

[0118] By providing a rounded sensing electrode or an arc sensing electrode in the embodiment of the present application, it is possible to avoid introducing electrostatic discharge (ESD) into the sensing electrode 311 , thereby improving the reliability and service life of the flexible circuit board 310 where the sensing electrode 311 is located.

[0119] Understandably, Fig.10 Only a schematic diagram of a sensing electrode 311 with a partially rounded corner design or an arc-shaped design is shown. The rounded corner design and the arc-shaped design of the sensing electrode 311 can be selected and adjusted according to actual conditions. The embodiment of the present application does not limit the specific shape of the rounded corner design and the arc-shaped design.

[0120] in addition, Fig. 9 and Fig.10 The various sensing electrodes 311 shown in FIG. 3 may be applicable to a quadrilateral reinforcing plate 320 , for example, may be applicable to a rectangular reinforcing plate 320 .

[0121] like Fig. 9 Part (a), (e), (i) and Fig.10 As shown in parts (a) and (e) of FIG. 3 , four sensing electrodes 311 may be disposed on the flexible circuit board 310 , and the four sensing electrodes 311 may be disposed at four corners of the reinforcing plate 320 , respectively.

[0122] like Fig. 9 Part (b), (f), (j) and Fig.10 As shown in parts (b) and (f) of the drawing, three sensing electrodes 311 may be disposed on the flexible circuit board 310 , and the three sensing electrodes 311 may be disposed at any three corners of the reinforcing plate 320 , respectively.

[0123] like Fig. 9 Sections (c) and (g), (k) and Fig.10 As shown in parts (c) and (g) of the figure, two sensing electrodes 311 may be provided on the flexible circuit board 310, and the two sensing electrodes 311 may be respectively provided at any two corners of the reinforcing plate 320. Optionally, the two sensing electrodes 311 may be respectively provided at any two opposite corners of the reinforcing plate 320.

[0124] like Fig. 9 Sections (d) and (h), (l) and Fig.10 As shown in parts (d) and (h) of FIG. 3 , only one sensing electrode 311 may be disposed on the flexible circuit board 310 , and the one sensing electrode 311 may be disposed at any corner of the reinforcing plate 320 .

[0125] It should be noted that Fig. 9and Fig.10 The design of the sensing electrode 311 for the quadrilateral reinforcing plate 320 is only schematically shown. When the reinforcing plate 320 is other polygons, the sensing electrode 311 can also be designed at at least one corner of the polygonal reinforcing plate 320 in the above manner. Alternatively, the sensing electrode 311 can also be a ring structure, arranged around the reinforcing plate 320. When the reinforcing plate 320 is non-polygonal, such as circular, the sensing electrode 311 can be arc-shaped, arranged around the circular reinforcing plate 320.

[0126] The present application also provides a display screen. Fig.11 A schematic structural block diagram of a display screen 500 provided in an embodiment of the present application is shown.

[0127] like Fig.11 As shown, the display screen 500 includes: a display module 510 and a flexible circuit board assembly 300 provided in any of the above embodiments. The flexible circuit board assembly 300 is electrically connected to the display module 510 to transmit the electrical signal of the display module 510 .

[0128] Optionally, the structure of the display module 510 can be the same as above. Figure 1 The structure of the display module 100 shown is the same. The metal foil 180 in the display module 100 may be a conductive foil that forms a capacitor with at least one sensing electrode 311 in the flexible circuit board assembly 300 .

[0129] The display screen 500 may be, for example, an OLED display screen, or may be other types of display screens, which are manufactured by including a flexible circuit board assembly 300 and a display module 510 including a conductive foil. The present application does not specifically limit the specific type of the display screen 500.

[0130] The present application also provides an electronic device. Fig.12 A schematic structural block diagram of an electronic device 600 provided in an embodiment of the present application is shown.

[0131] like Fig.12 As shown, the electronic device 600 includes: Fig.11 The display screen 500 shown. Optionally, the electronic device 600 may further include a touch module 400, which can realize the touch detection of the electronic device 600 by the user. At least one sensing electrode 311 on the flexible circuit board 310 of the display screen 500 can be connected to at least one capacitance detection channel 410 of the touch module 400, so that the touch module 400 detects at least one capacitance formed by at least one sensing electrode 311 and the conductive foil in the display screen 500.

[0132] Specifically, the touch module 400 can refer to the relevant description of the above embodiment, and the touch module 400 can be, for example, a touch chip (TIC) in an electronic device. The electronic device 600 can include a touch panel, and the TIC can detect multiple capacitors on the touch panel to achieve user touch detection on the touch panel.

[0133] The touch module 400 can detect at least one capacitance formed by at least one sensing electrode 311 in the flexible circuit board 310 and the conductive foil in the display screen 500 while realizing touch detection, thereby realizing the detection of marks and mold prints caused by the reinforcement plate 320 in the flexible circuit board 310 .

[0134] It can be seen from the above description that the technical solutions provided by the above embodiments of the present application may have the following advantages:

[0135] (1) Improve the efficiency and accuracy of mold printing detection: This application realizes the automatic detection of mold printing on FPC by introducing induction electrode detection around the reinforcement plate. Compared with the traditional human eye recognition method, electronic design can quickly scan and accurately identify a large number of products in a short time, greatly improving the detection efficiency.

[0136] (2) Reduce interference from human factors: When human eyes recognize molds, they are easily affected by factors such as visual fatigue, lighting conditions, and individual differences, resulting in unstable test results. Electronic design can overcome the interference of these human factors and ensure the objectivity and consistency of test results. This helps companies establish a more reliable quality control system and improve the overall quality level of their products.

[0137] (3) Quantitative analysis of mold printing: This application can not only identify and locate mold printing, but also quantitatively analyze mold printing through algorithms. This means that companies can obtain detailed data on the size, shape, depth, etc. of mold printing, so as to have a more comprehensive understanding of the impact of mold printing on product performance. Based on this data, companies can formulate more effective improvement measures (such as the selection of metal foil substrates in display modules) to improve product performance and stability.

[0138] In the several embodiments provided in the present application, it should be understood that the disclosed devices, apparatuses and modules can be implemented in other ways. For example, the device embodiments described above are merely schematic, for example, the division of the modules or components is only a logical function division, and there may be other division methods in actual implementation, for example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of the device or module, which can be electrical, mechanical or other forms.

[0139] It should be understood that the specific examples in this article are only intended to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application.

[0140] It should also be understood that the various implementation methods described in this specification can be implemented individually or in combination, and the embodiments of the present application are not limited to this.

[0141] The directional words appearing in the above description are all directions shown in the figures, and do not limit the specific structure of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0142] The term "and / or" in this application is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists, A and B exist at the same time, and B exists.

[0143] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as those commonly understood by technicians in the technical field of this application; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0144] Mentioning "embodiment" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In various embodiments of the present application, the size of the sequence number of each process does not mean the order of execution, and the order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application.

[0145] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A flexible circuit board assembly, characterized in that: Applied to a display screen including a display module, the flexible circuit board assembly includes: A flexible circuit board, attached to the display module; A reinforcing plate, attached to the flexible circuit board and located between the flexible circuit board and the display module; The flexible circuit board is provided with at least one sensing electrode in the area around the reinforcing plate, and a gap is provided between the at least one sensing electrode and the conductive foil in the display module to form at least one capacitor, and the at least one capacitor is used to detect the imprint of the display module corresponding to the reinforcing plate area.

2. The flexible circuit board assembly according to claim 1, characterized in that: The at least one sensing electrode is connected to at least one capacitance detection channel of a touch control module of the electronic device where the display module is located, so that the touch control module detects the at least one capacitance formed by the at least one sensing electrode and the conductive foil.

3. The flexible circuit board assembly according to claim 2, characterized in that: A plurality of sensing electrodes are arranged in the flexible circuit board; The multiple sensing electrodes are connected to the same capacitance detection channel of the touch control module; or, The plurality of sensing electrodes include a plurality of groups of sensing electrodes, each group of the plurality of groups of sensing electrodes includes at least one sensing electrode, and each group of sensing electrodes is connected to the same capacitance detection channel of the touch control module.

4. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The shape of the at least one sensing electrode matches the contour shape of the reinforcement plate.

5. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The reinforcement plate is a polygonal reinforcement plate, and the at least one sensing electrode is arranged at at least one corner of the polygonal reinforcement plate.

6. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The at least one sensing electrode is a zigzag electrode, and parameters of the zigzag electrode satisfy at least one of the following items: a fold angle of the zigzag electrode is greater than or equal to 5 degrees and less than or equal to 175 degrees; a length of each side of the zigzag electrode is greater than or equal to 100 microns; and a width of each side of the zigzag electrode is greater than or equal to 50 microns.

7. The flexible circuit board assembly according to claim 6, characterized in that: The corners of the zigzag electrode are rounded.

8. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The at least one sensing electrode is arc-shaped.

9. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: A distance between the at least one sensing electrode and an orthographic projection of the reinforcing plate on the flexible circuit board is greater than 0 and less than or equal to 100 micrometers.

10. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The at least one sensing electrode is disposed on the metal layer of the flexible circuit board.

11. The flexible circuit board assembly according to any one of claims 1 to 3, characterized in that: The flexible circuit board is a single-layer flexible circuit board or a double-layer flexible circuit board.

12. A display screen, characterized in that: include: A display module, and a flexible circuit board assembly as claimed in any one of claims 1 to 11, wherein the flexible circuit board assembly is electrically connected to the display module to transmit electrical signals of the display module.

13. The display screen according to claim 12, characterized in that: The display module comprises: a display panel and a conductive foil, wherein the conductive foil is arranged on a side of the display panel away from a user; The flexible circuit board assembly is attached to the side of the conductive foil away from the user by conductive adhesive.

14. An electronic device, characterized in that: include: A display screen as claimed in claim 12 or 13.

15. The electronic device according to claim 14, characterized in that: Also includes: A touch module, used to detect the touch of the electronic device by the user; At least one sensing electrode on the flexible circuit board of the display screen is connected to at least one capacitance detection channel of the touch module, so that the touch module detects at least one capacitance formed by the at least one sensing electrode and the conductive foil in the display screen.

Images