Solar cell module and method for manufacturing solar cell module

Abstract

A solar cell module (1) according to one embodiment of the present invention is provided with a first substrate (10), a second substrate (11), a photoelectric conversion layer (20), a first electrode layer (30), a second electrode layer (40), and an extraction electrode layer (50). The extraction electrode layer (50) includes a metal layer and a transparent conductive layer stacked on each other, and is provided in a region on the first substrate (10) that does not overlap the photoelectric conversion layer (20) when the substrate is viewed in plan. The solar cell module (1) is further provided with a frit part (60) provided between the second substrate (11) and the extraction electrode layer (50).

Description

Technical Field

[0001] The present disclosure relates to a solar cell module and a method for manufacturing the same, and more particularly to a solar cell module in which a photoelectric conversion layer is formed on an insulating substrate such as a glass substrate and a method for manufacturing the same. Background Art

[0002] So far, solar cell modules are known in which a photoelectric conversion layer is formed on an insulating substrate such as a glass substrate. For example, Patent Document 1 discloses a solar cell module comprising a substrate, an element portion formed on the substrate, and a package for packaging the element portion, wherein a plurality of single cells of a perovskite solar cell are formed as the element portion. Patent Document 1 discloses the use of a resin such as butyl rubber as the package.

[0003] In addition, Patent Document 2 discloses a structure in which two glass substrates are bonded together using glass frit formed into a linear shape to seal an organic thin film layer as a light-emitting layer in an organic EL display device. Patent Document 2 discloses irradiating a laser along the line of the glass frit to cure the glass frit, and using an ultraviolet curing resin in a second sealing region where a metal wiring is arranged.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-021913

[0007] Patent Document 2: Japanese Patent Application Publication No. 2011-054477 Summary of the invention

[0008] As described above, in order to solidify the glass frit, heating by laser irradiation is required, for example, but the inventors have found that if the metal wiring is irradiated with laser, the wiring is damaged and the resistance increases. Therefore, in the device of Patent Document 2, an ultraviolet curing resin is used instead of glass frit in the second packaging area where the metal wiring is arranged.

[0009] A solar cell module is provided with an extraction electrode layer for extracting electric energy from the photoelectric conversion layer. However, if a glass frit is provided in a region where the extraction electrode layer is arranged and heated by laser irradiation or the like, the electrode layer is damaged and the resistance increases.

[0010] A solar cell module in one embodiment of the present invention comprises: a first substrate; a first electrode layer, which is arranged on the first substrate; a photoelectric conversion layer, which is arranged on the first electrode layer; a second electrode layer, which is arranged on the photoelectric conversion layer; an extraction electrode layer, which is arranged on the first substrate in an area that does not overlap with the photoelectric conversion layer when the substrate is viewed from above, and is composed of a metal layer and a transparent conductive layer stacked together; a second substrate, which is arranged in a manner covering the first electrode layer, the photoelectric conversion layer, the second electrode layer and the extraction electrode layer; and a glass material portion, which is arranged between the second substrate and the extraction electrode layer.

[0011] A method for manufacturing a solar cell module according to one embodiment of the present invention comprises: a first step of sequentially forming a first electrode layer, a photoelectric conversion layer and a second electrode layer on a first substrate, and forming an extraction electrode layer formed by stacking a metal layer and a transparent conductive layer in an area that does not overlap with the photoelectric conversion layer in a top view of the first substrate; a second step of providing a glass material on the second substrate; a third step of disposing a second substrate on the first substrate and bringing the extraction electrode layer prepared in the first step into contact with the glass material prepared in the second step; and a fourth step of bonding and fixing the extraction electrode layer to the second substrate using the glass material.

[0012] According to one embodiment of the present disclosure, in a solar cell module in which glass material is provided in a region where an extraction electrode layer is arranged, an increase in resistance can be suppressed. In addition, when the photoelectric conversion layer is encapsulated by providing the glass material in a ring shape so as to surround the photoelectric conversion layer, the encapsulation performance is greatly improved compared to, for example, a case where a resin encapsulation material is used on a portion of the periphery of the photoelectric conversion layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a top view of a solar cell module according to an example of the embodiment.

[0014] Figure 2 It is a cross-sectional view of a solar cell module according to an example of the embodiment, and shows the cross-sectional structure of a portion where solar cell cells are formed.

[0015] Figure 3 It is a cross-sectional view of a solar cell module according to an example of the embodiment, and shows a cross-sectional structure of an end portion of the module.

[0016] Figure 4 It is a cross-sectional view of a solar cell module according to an example of the embodiment, and shows a cross-sectional structure of an end portion of the module.

[0017] Figure 5 It is a diagram for explaining a method of manufacturing a solar cell module according to an example of the embodiment.

[0018] Figure 6It is a cross-sectional view of a solar cell module according to another example of the embodiment. DETAILED DESCRIPTION

[0019] Figure 1 It is a plan view schematically showing a solar cell module 1 according to an example of the embodiment. Figure 2 It is a cross-sectional view of the solar cell module 1 , and shows the cross section of a portion where the cell 2 is formed. Figure 1 The second substrate 11 is omitted in the figure, and the outline of the second substrate 11 is shown by a single-dot chain line.

[0020] like Figure 1 and Figure 2 As shown, the solar cell module 1 includes a cell 2 including a photoelectric conversion layer 20, a first electrode layer 30, and a second electrode layer 40, a first substrate 10, and a second substrate 11 arranged opposite to the first substrate 10 and covering the cell 2. The solar cell module 1 also includes an extraction electrode layer 50 for extracting electric energy from the cell 2, and a glass material portion 60 for bonding the two substrates. The glass material portion 60 is provided between the second substrate 11 and the extraction electrode layer 50, and functions as a sealing material for sealing the cell 2.

[0021] In this embodiment, a light-transmitting substrate is used as the first substrate 10 . The first substrate 10 , the second substrate 11 , and the cell 2 are formed in a rectangular shape in plan view, and the second substrate 11 , which is slightly smaller than the first substrate 10 , covers the entire cell 2 formed on the first substrate 10 .

[0022] The first substrate 10 and the second substrate 11 may be conductive substrates with insulating layers formed on the surface, preferably insulating substrates. The first substrate 10 is preferably made of a material that is permeable to sunlight with a wavelength of 400 nm to 1000 nm and has a low water vapor permeability. Furthermore, from the perspective of adhesion and heat resistance in the frit welding process, a glass substrate is preferred. The thickness of the first substrate 10 is, for example, 0.3 mm to 3 mm.

[0023] The second substrate 11 is preferably transparent to laser light and can be a light-transmitting substrate such as a glass substrate. The second substrate 11 is preferably made of a material with a low water vapor permeability, similar to the first substrate 10. The thickness of the second substrate 11 can be less than the thickness of the first substrate 10. It should be noted that a gas barrier layer such as an aluminum oxide layer can be formed on the surface of the first substrate 10 and the second substrate 11. In the present embodiment, a flat and transparent glass substrate is used as the first substrate 10 and the second substrate 11.

[0024] The solar cell module 1 includes a first electrode layer 30 provided on a first substrate 10, a photoelectric conversion layer 20 provided on the first electrode layer 30, and a second electrode layer 40 provided on the photoelectric conversion layer 20. The photoelectric conversion layer 20, the first electrode layer 30, and the second electrode layer 40 constitute a unit 2. In addition, an extraction electrode layer 50 is provided on the first substrate 10 in a region that does not overlap with the photoelectric conversion layer 20 when the substrate is viewed from above. The extraction electrode layer 50 has a multilayer structure in which a metal layer 52 and a transparent conductive layer are stacked. Furthermore, the transparent conductive layer is provided closer to the second substrate 11 than the metal layer 52 and is in contact with the glass material portion 60 (see the following description). Figure 3 ).

[0025] In the present embodiment, when viewed from the Z direction, which is the stacking direction of the first electrode layer 30, the photoelectric conversion layer 20, and the second electrode layer 40, the glass frit portion 60 is provided in a ring shape surrounding the photoelectric conversion layer 20 (unit 2). The extraction electrode layer 50 extends from two opposite sides of the unit 2 in directions away from each other, and is formed beyond the range covered by the second substrate 11 to the vicinity of the end of the first substrate 10. The glass frit portion 60 includes a first region provided between the second substrate 11 and the extraction electrode layer 50, and a second region provided between the first substrate 10 and the second substrate 11. The glass frit portion 60 has a low water vapor permeability like the first substrate 10 and the second substrate 11, and exhibits excellent packaging performance.

[0026] The solar cell module 1 is formed with an internal space 4 encapsulated by a first substrate 10, a second substrate 11, and a glass material portion 60. The unit 2 is arranged in the internal space 4. The interval between the first substrate 10 and the second substrate 11 is, for example, 1 μm or more and 30 μm or less, and there is a gap between the unit 2 and the second substrate 11. An inert gas such as nitrogen can be sealed in the internal space 4 of the solar cell module 1. Alternatively, it can be filled with a resin such as ethylene-vinyl acetate copolymer (EVA) resin, silicone resin, polyolefin, etc.

[0027] Hereinafter, the configuration of the unit 2 according to an example of the embodiment will be described in detail. Figure 2 Although an example of a suitable layer structure of a solar cell is shown, the layer structure of the cell is not limited to this.

[0028] like Figure 2 As shown, the unit 2 is composed of a plurality of cells 3 connected in series. The cells 3 are arranged in a first direction, that is, in the X direction, along the surface of the first substrate 10, and are arranged in a Y direction (see FIG. 1 ) orthogonal to the X direction. Figure 1). Each single cell 3 has a pair of electrodes (a first electrode layer 30 and a second electrode layer 40), and a photoelectric conversion layer 20 disposed between the pair of electrodes. The unit 2 is, for example, a perovskite solar cell. In this embodiment, the first substrate 10 is light-transmissive, and the photoelectric conversion layer 20 absorbs light incident into the module from the first substrate 10 side to generate electricity.

[0029] The first electrode layer 30 is light-transmissive and does not prevent light from the photoelectric conversion layer 20 from entering. The light transmittance of the first electrode layer 30 is, for example, 85% or more in a wavelength range of 450 nm or more and 900 nm or less. In addition, the sheet resistance of the first electrode layer 30 is preferably 40 Ω / □ or less, and may be 10 Ω / □ or less. The first electrode layer 30 preferably has a single-layer structure formed of a transparent conductive layer. The details will be described later, and the transparent conductive layer is composed of a transparent conductive oxide such as indium tin oxide (ITO).

[0030] In this embodiment, the second electrode layer 40 may not have light transmittance, and includes a metal layer 42 and a transparent conductive layer. The second electrode layer 40 includes a first transparent conductive layer 41 and a second transparent conductive layer 43 as a transparent conductive layer, and has a multilayer structure in which a transparent conductive layer 41, a metal layer 42, and a transparent conductive layer 43 are stacked in order from the first substrate 10 side. The details will be described later, and the metal layer is composed of a metal such as aluminum, nickel, copper, silver, or an alloy thereof.

[0031] The photoelectric conversion layer 20 includes an electron transport layer 21, a light absorption layer 22 disposed on the electron transport layer 21, and a hole transport layer 23 disposed on the light absorption layer 22. The photoelectric conversion layer 20 has a multilayer structure in which the electron transport layer 21, the light absorption layer 22, and the hole transport layer 23 are stacked in order from the first substrate 10 side, except for a portion where a groove described later is formed. The light absorption layer 22 includes, for example, a perovskite compound represented by a composition formula ABX3 (wherein A is a monovalent cation, B is a divalent cation, and X is a halogen anion).

[0032] As the electron transport material constituting the electron transport layer 21, anatase titanium oxide, tin oxide, etc. can be exemplified. The hole transport layer 23 contains a hole transport material having a redox site. As the hole transport material constituting the hole transport layer 23, for example, 2,2',7,7'-tetrakis(N,N'-di-p-methoxyphenylamino)-9,9'-spirobifluorene (Spiro-OMeTAD) can be exemplified.

[0033] An example of A in the above-mentioned perovskite compound (ABX3) is a univalent cation represented by R1R2R3-NH. When R1 and R2 are H and R3 is CH3, A is methylammonium (CH3NH3). The functional groups R1, R2, and R3, for example, contain at least one element selected from carbon, hydrogen, nitrogen, and oxygen. When the functional groups R1, R2, and R3 contain carbon atoms, the sum of the carbon numbers of the functional groups R1, R2, and R3 is preferably 4 or less. The functional groups R1, R2, and R3 may contain Group 1 elements such as Rb and Cs.

[0034] As described above, B in ABX3 is a divalent cation. Examples of B include divalent cations of transition metals or elements of Group 13, Group 14, or Group 15. Specific examples of B include Pb 2+ ,Ge 2+ Sn 2+ B may include a compound selected from Pb 2+ Sn 2+ At least one of the following can be used to 2+ Sn 2+ A part of is replaced by other elements. Examples of the replacement element include Bi, Sb, In, Ge, Ni, etc. X of ABX3 is at least one selected from Cl, Br, and I.

[0035] The sites of A, M, and X can be occupied by a variety of ions. Specific examples of perovskite compounds (ABX3) include CH3NH3PbI3, CH3CH2NH3PbI3, NH2CHNH2PbI3, CH3NH3PbBr3, CH3NH3PbCl3, CsPbI3, and CsPbBr3.

[0036] In this embodiment, if Figure 2 , the first electrode layer 30 of the cell 3A is electrically connected to the second electrode layer 40 of the cell 3B adjacent in the X direction. In addition, the first electrode layer 30 of the cell 3B is electrically connected to the second electrode layer 40 of the cell 3C. In this way, a plurality of cells 3 are connected in series along the X direction. In addition, the unit 2 has a plurality of grooves 24, 25, and 26. The grooves 24, 25, and 26 are formed to extend in the Y direction and be substantially parallel to each other, for example. Each groove can be formed by a conventionally known scribe method or the like.

[0037] The groove 24 is a groove that divides the electron transport layer 21 and the first electrode layer 30 of each single cell 3. The width of the groove 24 is, for example, greater than 20 μm and less than 150 μm. The groove 25 divides the light absorption layer 22, the hole transport layer 23 and the second electrode layer 40 of each single cell 3. It should be noted that the groove 25 only needs to divide the second electrode layer 40 of each single cell 3, and the light absorption layer 22 and the hole transport layer 23 may not be divided by the groove 25. The width of the groove 25 is, for example, greater than 30 μm and less than 150 μm. In the present embodiment, each single cell 3 is divided by the grooves 24 and 25.

[0038] The groove 26 is formed in each cell 3 so as to penetrate the light absorption layer 22 and the hole transport layer 23 to expose the electron transport layer 21. In addition, a second electrode layer 40 connected to the electron transport layer 21 of the adjacent cell 3 is formed in the groove 26. Thus, the second electrode layer 40 is electrically connected to the first electrode layer 30 of the adjacent cell 3. That is, the groove 26 functions as a groove for connecting the cells. The width of the groove 26 is, for example, not less than 150 μm and not more than 300 μm.

[0039] The unit 2 is produced, for example, by the following method.

[0040] (1) The first electrode layer 30 and the electron transport layer 21 are formed in this order on the first substrate 10 .

[0041] (2) Laser scribing is performed on a portion of the first electrode layer 30 and the electron transport layer 21 to form the grooves 24 .

[0042] (3) The light absorbing layer 22 and the hole transporting layer 23 are formed in this order on the electron transporting layer 21 .

[0043] (4) A portion of the light absorbing layer 22 and the hole transporting layer 23 is subjected to mechanical scribing to form the grooves 26 .

[0044] (5) The second electrode layer 40 is formed on the hole transport layer 23 .

[0045] (6) The light absorbing layer 22 , the hole transport layer 23 , and a portion of the second electrode layer 40 are mechanically scribed to form the grooves 25 .

[0046] The electron transport layer 21, the light absorption layer 22, and the hole transport layer 23 can be formed, for example, by applying a solution in which a raw material is dissolved on the surface of the first substrate 10. These layers can be formed by spin coating. The thickness of each layer is not particularly limited, and as an example, is greater than 10 nm and less than 100 nm.

[0047] Below, refer to Figure 3 and Figure 4 , while the structures of the extraction electrode layer 50 and the glass frit portion 60 are described in detail. Figure 3 and Figure 4 It is a cross-sectional view of both end portions in the X direction of the solar cell module 1 on which the extraction electrode layer 50 is formed.

[0048] like Figure 3 and Figure 4 As shown, the extraction electrode layer 50 is a conductive layer including a metal layer 52 and a transparent conductive layer. The extraction electrode layer 50 is formed from the internal space 4 beyond the position where the glass material portion 60 is provided to the end of the first substrate 10. The extraction electrode layer 50 is arranged on the first substrate 10 in an area that does not overlap with the photoelectric conversion layer 20 (unit 2) when the substrate is viewed from above. In other words, the conductive layer formed in the area that does not overlap with the photoelectric conversion layer 20 and led out from the internal space 4 to the outside is the extraction electrode layer 50. The details will be described later. By using the extraction electrode layer 50 having a multilayer structure including a metal layer 52 and a transparent conductive layer, the adhesion with the glass material portion 60 becomes good, and the resistance increase of the extraction electrode layer 50 is suppressed.

[0049] The extraction electrode layer 50 includes an extraction electrode layer 50A electrically connected to the first electrode layer 30 (see Figure 3 ), and an extraction electrode layer 50B electrically connected to the second electrode layer 40 (see Figure 4 ). The extraction electrode layer 50A is formed at the first end of the first substrate 10 in the X direction, and the extraction electrode layer 50B is formed at the second end of the X direction on the opposite side of the first end. It should be noted that the extraction electrode layers 50A and 50B both include a metal layer 52 and a transparent conductive layer and have the same layer structure.

[0050] The transparent conductive layer constituting the extraction electrode layer 50 preferably includes a first transparent conductive layer 51 and a second transparent conductive layer 53. The extraction electrode layer 50 has a multilayer structure in which a transparent conductive layer 51, a metal layer 52, and a transparent conductive layer 53 are stacked in order from the first substrate 10 side. That is, the extraction electrode layer 50 has a three-layer structure in which the metal layer 52 is sandwiched between the transparent conductive layers 51 and 53. In addition, a glass frit portion 60 is provided between the second substrate 11 and the extraction electrode layer 50, and the glass frit portion 60 is in contact with the transparent conductive layer 53.

[0051] In this embodiment, the second electrode layer 40 has the same multilayer structure as the extraction electrode layer 50. As described above, the second electrode layer 40 includes the first transparent conductive layer 41, the metal layer 42, and the second transparent conductive layer 43 stacked on the photoelectric conversion layer 20 in order from the first substrate 10 side. The extraction electrode layer 50B electrically connected to the second electrode layer 40 is formed continuously with the second electrode layer 40 and is separated from the first electrode layer 30 by the groove 24. On the other hand, the extraction electrode layer 50A electrically connected to the first electrode layer 30 is formed continuously with the first electrode layer 30 and is separated from the second electrode layer 40 by the groove 25.

[0052] It should be noted that each layer of the extraction electrode layer 50 is formed simultaneously with the first electrode layer 30 and the second electrode layer 40, and after the film formation, it is separated from the first electrode layer 30 or the second electrode layer 40 by forming the grooves 24 and 25. The extraction electrode layer 50 can be connected to a portion of the electrode layer formed on the photoelectric conversion layer 20 in the region adjacent to the grooves 24 and 25. Since the portion of the electrode layer is an extremely small area, it does not affect the characteristics of the photoelectric conversion layer 20.

[0053] The transparent conductive layers 51 and 53 are generally composed of transparent conductive oxides in which tungsten, tin, antimony, etc. are doped in metal oxides such as indium oxide and zinc oxide. An example of a suitable transparent conductive oxide is indium tin oxide (ITO). The transparent conductive layers 51 and 53 are formed into films with substantially the same composition and the same thickness, for example, by sputtering. An example of the thickness of the transparent conductive layers 51 and 53 is greater than 30 nm and less than 300 nm. Since the transparent conductive layers 51 and 53 are formed simultaneously with the transparent conductive layers of the first electrode layer 30 and the transparent conductive layers 41 and 43 of the second electrode layer 40, each transparent conductive layer has substantially the same composition.

[0054] The constituent material of the metal layer 52 is, for example, a metal such as aluminum, nickel, copper, silver, or an alloy thereof. Among them, silver is preferably used. The metal layer 52 may be a single-layer structure or a multi-layer structure. An example of the thickness of the metal layer 52 is greater than 80 nm and less than 500 nm. The metal layer 52 may be formed by, for example, sputtering, evaporation, or by plating. Since the metal layer 52 is formed simultaneously with the metal layer 42 of the second electrode layer 40, the metal layers 42 and 52 have substantially the same composition.

[0055] The extraction electrode layer 50A is formed by overlapping three layers separated from the second electrode layer 40 by the groove 25 and the transparent conductive layer continuous from the first electrode layer 30. The extraction electrode layer 50B is formed by overlapping three layers continuous with the second electrode layer 40 and the transparent conductive layer separated from the first electrode layer 30 by the groove 24. That is, the transparent conductive layer 51 sandwiched between the first substrate 10 and the metal layer 52 is a transparent conductive layer derived from the first electrode layer 30 and the second electrode layer 40, and its thickness is greater than the thickness of the transparent conductive layer 53 derived only from the second electrode layer 40.

[0056] As described above, the glass frit portion 60 includes a first region provided between the second substrate 11 and the extraction electrode layer 50, and a second region provided between the first substrate 10 and the second substrate 11. The first region is in close contact with the second substrate 11 and the extraction electrode layer 50, and the second region is in close contact with the first substrate 10 and the second substrate 11. The glass frit portion 60 is formed into a thin line shape surrounding the entire circumference of the unit 2, and functions as a sealing material for sealing the unit 2. The width of the glass frit portion 60 is not particularly limited, and as an example, is 0.1 mm or more and 1 mm or less. The thickness of the glass frit portion 60 is greater than the total thickness of the photoelectric conversion layer 20 and the extraction electrode layer 50.

[0057] The glass material portion 60 is composed of a glass material having as a main component a glass having a lower melting point than the glass constituting the first substrate 10 and the second substrate 11. The glass material is, for example, a low-melting-point glass powder, and most of the individual glass particles have a particle size of 1 μm or more and 50 μm or less. The composition of the low-melting-point glass is not particularly limited. The low-melting-point glass may, for example, have SiO2 as a main component and contain at least one element selected from Mg, Ca, Ba, Li, K, Na, Zn, Te, V, B, Pb, Al, Sn, P, Ru, Fe, Cu, Ti, W, Bi, and Sb. In addition, the glass material may contain a predetermined filler or additive.

[0058] The details will be described later, and the glass frit portion 60 is formed by forming a line of glass frit material on the first substrate 10 or the second substrate 11, superimposing the two substrates, and then irradiating the glass frit along the line. The glass frit material is melted by laser irradiation, and the glass particles are closely attached to each other, and closely attached to the substrate and the extraction electrode layer 50, forming a dense glass frit portion 60 with low water vapor permeability. The glass frit portion 60 is a laser welded portion that is melted and solidified by laser irradiation to bond the two substrates.

[0059] The glass frit portion 60 is arranged on the transparent conductive layer 53 of the extraction electrode layer 50 in the first region. That is, the glass frit portion 60 is not in contact with the metal layer 52, and the transparent conductive layer 53 is sandwiched between the glass frit portion 60 and the metal layer 52. The transparent conductive layer 53 has a linear expansion coefficient similar to that of glass compared to the metal layer 52, and also has high heat resistance. Therefore, by arranging the glass frit portion 60 on the transparent conductive layer 53, the adhesion of the glass frit portion 60 to the extraction electrode layer 50 is improved. It should be noted that the transparent conductive layer 51 sandwiched between the first substrate 10 and the metal layer 52 improves the adhesion of the extraction electrode layer 50 to the first substrate 10.

[0060] The glass frit portion 60 is heated by laser irradiation, and the extraction electrode layer 50 overlapping the glass frit portion 60 also reaches a high temperature at this time, and the metal layer 52 may be damaged by the heat. In this embodiment, since the metal layer 52 is sandwiched by the transparent conductive layers 51 and 53, even if the metal layer 52 is damaged, the transparent conductive layers 51 and 53 maintain a good conductive path, and the resistance increase of the extraction electrode layer 50 can be fully suppressed. This effect can be obtained even when only one of the transparent conductive layers 51 and 53 is provided, and the effect of suppressing the resistance increase becomes more significant by providing the transparent conductive layers 51 and 53 with the metal layer 52 sandwiched therebetween.

[0061] Below, refer to Figure 5 , while describing in detail a method for manufacturing the solar cell module 1 having the above-mentioned structure. Figure 5 and Figure 3 Likewise, the cross-sectional structure of the first end portion of the solar cell module 1 in the X direction is shown.

[0062] like Figure 5 As shown, the manufacturing process of the solar cell module 1 includes the following steps, for example.

[0063] (1) A first step of sequentially forming a first electrode layer 30, a photoelectric conversion layer 20, and a second electrode layer 40 on a first substrate 10, and forming an extraction electrode layer 50 formed by laminating a metal layer and a transparent conductive layer in a region that does not overlap with the photoelectric conversion layer 20 in a plan view of the first substrate 10.

[0064] (2) Second step of providing the glass material 60 z on the second substrate 11

[0065] (3) A third step of placing the second substrate 11 on the first substrate 10 and bringing the extraction electrode layer 50 prepared in the first step into contact with the glass material 60z prepared in the second step.

[0066] (4) A fourth step of bonding and fixing the extraction electrode layer 50 and the second substrate 11 by using the glass material 60z

[0067] In the above-mentioned first step, the unit 2 including the first electrode layer 30, the photoelectric conversion layer 20 and the second electrode layer 40 is manufactured by the above-mentioned method. The extraction electrode layer 50 is formed at the same time as the first electrode layer 30 and the second electrode layer 40, and in this embodiment, like the second electrode layer 40, includes a transparent conductive layer 51, a metal layer 52 and a transparent conductive layer 53. It should be noted that the second electrode layer 40 and the extraction electrode layer 50 can also be formed in other steps. In this case, the second electrode layer 40 can be a single-layer structure formed of the metal layer 42. However, from the perspective of improving productivity, it is preferred that the second electrode layer 40 and the extraction electrode layer 50 are formed at the same time, and the extraction electrode layer 50 includes the same layer structure as the second electrode layer 40.

[0068] In the second step, the glass material 60z is applied on the second substrate 11 in a paste state containing an organic solvent, and then the solvent is removed by volatilization by heat treatment. The paste of the glass material 60z is applied on the second substrate 11 by a conventionally known printing method. The paste of the glass material 60z can be applied on the first substrate 10 on which the extraction electrode layer 50 is formed, but is preferably formed on the second substrate 11 from the viewpoint of suppressing the thermal influence on the cell 2. The glass material 60z is preferably formed in a linear and ring shape along the periphery of the second substrate 11.

[0069] In the third step, the glass frit portion 60z is disposed on the extraction electrode layer 50 by making the surface provided with the glass frit portion 60z face the first substrate 10 side and overlap with the second substrate 11. In the present embodiment, the glass frit material 60z is formed in the first region disposed between the second substrate 11 and the extraction electrode layer 50 and in the second region disposed between the first substrate 10 and the second substrate 11. The glass frit portion 60z in the first region is in contact with the transparent conductive layer 53 of the extraction electrode layer 50.

[0070] In the fourth step, the glass material 60z is irradiated with the laser beam α from the side opposite to the metal layer through the second substrate 11. The laser beam α has a wavelength of, for example, 800 nm to 1500 nm. Figure 5 In the example shown, laser α is irradiated along the line of the glass material 60z from the second substrate 11. As a result, the glass material 60z is melted, the glass particles constituting the material adhere to each other, and the glass particles adhere to the first substrate 10, the second substrate 11, and the extraction electrode layer 50. The laser device can use, for example, a YAG laser.

[0071] In the fourth step, the glass material 60z is melted by irradiation with laser light α, and the glass material portion 60 that functions as a sealing material is formed. At this time, even if the metal layer 52 of the extraction electrode layer 50 is heated and damaged, since the metal layer 52 is sandwiched by the transparent conductive layers 51 and 53, for example, even if the metal layer 52 is broken, a good conductive path can be maintained by the transparent conductive layers 51 and 53. As a result, the resistance increase of the extraction electrode layer 50 can be fully suppressed.

[0072] Figure 6 It is a cross-sectional view showing a modified example of the above-mentioned embodiment. Figure 6 The illustrated embodiment is the same as the above-described embodiment in that the extraction electrode layer 50 has a three-layer structure including a metal layer 52 and transparent conductive layers 51 and 53, and the glass frit portion 60 is in contact with the transparent conductive layer 53. On the other hand, the second electrode layer 40 has a single-layer structure formed of a transparent conductive layer, and the first electrode layer 30 has a three-layer structure including a metal layer 32 and transparent conductive layers 31 and 33, which is different from the above-described embodiment. Figure 6 In the example shown, the extraction electrode layer 50 and the first electrode layer 30 are continuously formed.

[0073] Figure 6 In the illustrated embodiment, the transparent conductive layer 53 sandwiched between the metal layer 52 and the glass frit portion 60 is a transparent conductive layer derived from the first electrode layer 30 and the second electrode layer 40, and its thickness is greater than the thickness of the transparent conductive layer 51 derived only from the first electrode layer 30. In addition, in this case, it is configured so that light can be incident from the second substrate 11 side, for example, the hole transport layer 23 is formed between the first electrode layer 30 and the light absorbing layer 22, and the electron transport layer 21 is formed between the light absorbing layer 22 and the second electrode layer 40.

[0074] As described above, according to the solar cell module 1 having the above-described configuration, since the glass frit portion 60 is provided in a ring shape around the entire periphery of the cell 2 including the region for forming the extraction electrode layer 50 , excellent sealing performance can be obtained.

[0075] In order to verify the encapsulation performance of the solar cell module 1, a durability test was conducted at a temperature of 85°C and a humidity of 85% using a calcium film having the above-mentioned three-layer structure of the extraction electrode layer 50 connected at both ends. The structure provided for the test is the same as that of the solar cell module 1 except that a calcium film is used instead of the unit 2. In the case where the calcium film absorbs water without excellent encapsulation performance, the resistance of the calcium film increases significantly, but no increase in resistance was confirmed in this durability test. That is, it was confirmed that the encapsulation performance of the solar cell module 1 is excellent.

[0076] Furthermore, according to the solar cell module 1 , even if the metal layer 52 of the extraction electrode layer 50 is damaged by irradiating the glass frit material 60 z with the laser beam α, the transparent conductive layers 51 and 53 sandwiching the metal layer 52 can highly suppress an increase in resistance of the extraction electrode layer 50 .

[0077] It should be noted that the above-mentioned embodiments may be appropriately changed in design within a range that does not impair the purpose of the present disclosure. For example, as a means for heating the glass material, a hot press, a heating furnace, etc. may be used instead of laser irradiation.

[0078] Description of Reference Numerals

[0079] 1 Solar cell module, 2 Unit, 3 Single cell, 4 Internal space, 10 First substrate, 11 Second substrate, 20 Photoelectric conversion layer, 21 Electron transport layer, 22 Light absorption layer, 23 Hole transport layer, 24, 25, 26 Grooves, 30 First electrode layer, 40 Second electrode layer, 41, 51 Transparent conductive layer, 42, 52 Metal layer, 43, 53 Transparent conductive layer, 50 Extraction electrode layer, 60 Glass material portion.

Claims

1. A solar cell module comprising: 1st substrate; a first electrode layer disposed on the first substrate; A photoelectric conversion layer, which is disposed on the first electrode layer; a second electrode layer, which is disposed on the photoelectric conversion layer; a take-out electrode layer, which is disposed on the first substrate in a region not overlapping with the photoelectric conversion layer when the substrate is viewed from above, and is formed by laminating a metal layer and a transparent conductive layer; a second substrate provided so as to cover the first electrode layer, the photoelectric conversion layer, the second electrode layer, and the extraction electrode layer; and A glass frit portion is provided between the second substrate and the extraction electrode layer.

2. The solar cell module according to claim 1, wherein: The transparent conductive layer of the extraction electrode layer is disposed closer to the second substrate than the metal layer. The glass frit portion is in contact with the transparent conductive layer.

3. The solar cell module according to claim 2, wherein: The transparent conductive layer includes a first transparent conductive layer and a second transparent conductive layer. The extraction electrode layer has a multilayer structure in which the first transparent conductive layer, the metal layer, and the second transparent conductive layer are stacked in order from the first substrate side. The glass frit portion is in contact with the second transparent conductive layer.

4. The solar cell module according to any one of claims 1 to 3, wherein: The second electrode layer includes the metal layer and the transparent conductive layer. The extraction electrode layer and the second electrode layer are formed continuously.

5. The solar cell module according to any one of claims 1 to 3, wherein: The first electrode layer includes the metal layer and the transparent conductive layer. The extraction electrode layer is formed continuously with the first electrode layer.

6. The solar cell module according to any one of claims 1 to 3, wherein: The glass material portion is configured to be a ring that surrounds the photoelectric conversion layer when viewed from the stacking direction of the first electrode layer, the photoelectric conversion layer and the second electrode layer, and includes a first region set between the second substrate and the extraction electrode layer, and a second region set between the first substrate and the second substrate.

7. The solar cell module according to any one of claims 1 to 3, wherein: The photoelectric conversion layer comprises: Electron transport layer; a light absorbing layer disposed on the electron transport layer, comprising a perovskite compound represented by a composition formula ABX3, wherein A is a monovalent cation, B is a divalent cation, and X is a halogen anion; and The hole transport layer is disposed on the light absorbing layer.

8. A method for manufacturing a solar cell module, comprising: A first step of sequentially forming a first electrode layer, a photoelectric conversion layer, and a second electrode layer on a first substrate, and forming an extraction electrode layer formed by laminating a metal layer and a transparent conductive layer in a region that does not overlap with the photoelectric conversion layer in a plan view of the first substrate; A second step of placing a glass material on the second substrate; a third step of disposing the second substrate on the first substrate and bringing the extraction electrode layer prepared in the first step into contact with the glass material prepared in the second step; and The fourth step is to bond and fix the extraction electrode layer and the second substrate using the glass material.

9. The method for manufacturing a solar cell module according to claim 8, wherein: In the fourth step, the glass material is irradiated with laser light via the first substrate or the second substrate.

Images