NFC souvenir medal

Abstract

The invention discloses an NFC souvenir medal which comprises a base, an inner core and a packaging sealing layer, the inner core is an anti-metal NFC module, the module is composed of a bottom-layer bonding material, a base-layer wave-absorbing material and a top-layer NFC high-frequency chip, and theme element patterns on the surface of the souvenir medal are embossment or color printing. The anti-metal NFC module is arranged in the souvenir medal, so that the anti-metal NFC module and the intelligent terminal (such as a mobile phone) are subjected to induction recognition, then subject elements of the souvenir medal can provide multi-dimensional information display for the public through the intelligent terminal, and intelligent internet of things and infinite expansion of purposes are achieved; meanwhile, enamel-imitating color paste or ceramic paint is used in the packaging sealing layer, so that surface abrasion can be prevented, hard objects are prevented from damaging the chip, and the attractiveness of the souvenir medal is improved by means of the colors of enamel and ceramic.

Description

Technical Field

[0001] The present application relates to the technical field of commemorative medals, and specifically to a metal commemorative medal with a built-in anti-metal NFC module and a surface coated with paint paste for encapsulation and protection. Background Art

[0002] Commemorative medals are a general term for commemorative medal-shaped items, including badges, collectible medals, and decorative medals. Commemorative medals available on the market are basically formed by metal stamping, die-casting, or splicing and bonding, with a single-layer structure, and oil pressure or electroplating combined with flat coloring patterns on the front and back of the medal to present the expression of relevant theme elements. The theme content is expressed in a single way, cannot be recognized by smart terminals, cannot be interoperable with computer network systems, and cannot express multi-dimensional content.

[0003] Near Field Communication (NFC) is an emerging technology. Devices that use NFC technology (such as mobile phones) can exchange data when they are close to each other. By integrating the functions of inductive card readers, inductive cards and point-to-point communication on a single chip, mobile terminals can be used to implement applications such as identity recognition and data exchange. In recent years, it has been increasingly widely used in identification and payment systems.

[0004] The patterns on commemorative medals are usually made through processes such as oil pressure, electroplating, baking varnish, and UV printing. The surface is easily oxidized or worn, and they are mostly used for display or boxed collection, which is not conducive to daily use. Summary of the invention

[0005] The purpose of this specification is to provide an NFC commemorative badge to solve the problems mentioned in the above background technology.

[0006] To achieve the above-mentioned purpose, this specification provides the following technical solutions: an NFC commemorative badge, which includes a base, an inner core, and a packaging sealing layer, wherein the inner core is an anti-metal NFC module.

[0007] The base has a circular groove structure on its upper part, which is used to place the anti-metal NFC module and the paint paste protective material for packaging and sealing. It is formed by metal die-casting or stamping, and the surface is electroplated according to the color required for the commemorative medal.

[0008] The anti-metal NFC module is bonded to the bottom of the circular groove of the base by gluing.

[0009] The encapsulation and sealing layer is a coating encapsulation and sealing layer made of a lacquer paste material on the anti-metal NFC module in the groove of the base.

[0010] Preferably, the anti-metal NFC module is an NFC high-frequency chip module with a bottom layer having a strong bonding material and a base material being an absorbing material.

[0011] Preferably, the encapsulation and sealing layer is formed by spreading lead-free resin baking varnish on the upper surface of the inner core for encapsulation, and then coating and sealing the surface with imitation enamel paste or ceramic paint.

[0012] Preferably, the cumulative thickness of the inner core and the encapsulation sealing layer is the same as the depth of the upper groove of the base, and the surrounding edges are seamlessly connected to the edges of the base groove.

[0013] Preferably, the surfaces of the base and the sealing layer have embossed or color printed patterns.

[0014] Compared with the prior art, the beneficial effects of the present application are: an anti-metal NFC module is built into the commemorative badge, so that the commemorative badge can be connected with a smart terminal (such as a mobile phone) through induction and identification, so that the theme elements of the commemorative badge can provide multi-dimensional information display to the public through the smart terminal, realize smart Internet of Things, and expand its uses infinitely; at the same time, baking varnish is used in the encapsulation and sealing layer to prevent chip oxidation, and the use of imitation enamel color paste or ceramic paint for sealing can prevent surface wear, or hard objects touching and damaging the chip, and the color of enamel and ceramic itself is used to increase the aesthetics of the commemorative badge. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the explosion structure of the NFC commemorative badge in this manual.

[0016] Figure 2 This is a cross-sectional view of the NFC badge in this manual.

[0017] Figure 3 This is a cross-sectional view of the inner core of the NFC commemorative badge in this manual.

[0018] Figure 4 This is a cross-sectional view of the NFC badge encapsulation sealing layer of this specification.

[0019] Figure 5 This is a photo of the NFC badge implementation example for this manual.

[0020] The meanings of the numbers in the figure are: 1. base; 101. circular groove of base; 2. inner core; 21. bottom bonding material; 22. substrate absorbing material; 23. NFC chip; 3. encapsulation sealing layer; 31. baking varnish; 32. imitation enamel paste or ceramic paint. DETAILED DESCRIPTION

[0021] The following is a detailed description of the embodiments of the invention application of this specification in conjunction with the accompanying drawings, so that the advantages and features of the application can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the application.

[0022] For examples, see Figure 1-Figure 4This specification provides a technical solution: an NFC commemorative badge, comprising: a base 1, an inner core 2, and a packaging sealing layer 3, wherein the inner core is an anti-metal NFC module.

[0023] Specifically, the base 1 is a circular or special-shaped metal body formed by die-casting or stamping and electroplating with a circular groove 101 on the upper part, and the bottom and upper ring surfaces have embossed or printed patterns.

[0024] Specifically, the inner core 2 is provided with a bottom layer adhesive material 21, the substrate is an absorbing material 22, and the chip is an NFC high-frequency chip 23, and the three are stacked in sequence to form an anti-metal NFC module.

[0025] Specifically, the encapsulation sealing layer 3 is on the surface of the NFC high-frequency chip 23, in the circular groove 101 of the base, and is first flattened and encapsulated with a resin paint 31, and then dried, and then evenly coated and sealed with an enamel-like paste or ceramic paint 32, and then left horizontally to dry naturally, and then the surface is polished, and a pattern is printed or embossed, and the pattern contains the NFC logo.

[0026] The cumulative thickness of the inner core 2 and the encapsulation sealing layer 3 is the same as the depth of the groove 101 of the base 1 and the edges thereof are seamlessly connected.

[0027] Specifically, the bonding core 2 is placed in the bottom of the upper circular groove 101 of the base 1, and then the chip 23 surface and the groove 101 are sealed and cured with baking varnish 31, and then sealed and polished with imitation enamel paste or ceramic paint 32 to beautify the surface.

[0028] Furthermore, the commemorative medal is φ45 or 50 mm round or special-shaped, made of metal with a thickness of 2.5 or 3 mm, and a groove depth of 1 to 1.5 mm.

[0029] Furthermore, the anti-metal NFC module 2 is a φ25 mm wet mark, the bottom adhesive material 21 is 0.2 mm thick, and the base absorbing material is 0.2 mm thick.

[0030] Furthermore, the bottom surface of the commemorative medal base is embossed or printed with the logo of the unit to which the commemorative medal theme element belongs, and the surface of the encapsulation sealing layer 3 is embossed or printed with the theme element pattern.

[0031] By embedding the NFC chip and encapsulating it with wear-resistant, high-hardness and beautiful materials, such as Figure 5 As shown in the implementation case photos, the commemorative badge can adapt to any scenario and be connected to the Internet of Things through NFC sensing and identification by smart terminals (such as mobile phones), greatly extending the use of the commemorative badge.

[0032] The above embodiments only express the implementation methods of this specification, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the application. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application.

[0033] The scope of protection sought in this application is defined by the appended claims and their equivalents.

Claims

1. An NFC commemorative badge, characterized by: include The base is round or special-shaped, and has a round groove structure on the upper part, which is used to place the inner core and the protective coating material to encapsulate and seal the inner core; The inner core is an anti-metal NFC module, which is used to be recognized by mobile smart terminal devices and is built into the bottom of the base groove; The encapsulation and sealing layer is made of a wear-resistant, high-hardness and beautiful paint paste material as the inner core encapsulation and sealing.

2. The NFC commemorative badge according to claim 1, characterized in that: The upper part of the base is provided with a circular groove, which is formed by metal die-casting or stamping, and the surface is electroplated.

3. The NFC commemorative badge according to claim 1, characterized in that: The inner core is an anti-metal NFC module, which is composed of a bottom layer of strong bonding material, a base material of absorbing material, and a chip of NFC high-frequency chip.

4. The NFC commemorative badge according to claim 1, characterized in that: The encapsulation sealing layer is flattened and encapsulated on the anti-metal NFC module by using resin baking varnish, and then the appearance is sealed by using imitation enamel paste or ceramic paint.

5. The NFC commemorative badge according to claim 1, characterized in that: The bottom surface of the commemorative medal base is embossed with the LOGO of the unit to which the theme element belongs or printed with a pattern, and the surface of the closed layer is embossed with the theme element or printed with a pattern.

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