Silicon wafer waste cleaning fluid residue removing equipment

Abstract

The invention discloses silicon wafer waste cleaning fluid residue removing equipment, and relates to the technical field of silicon wafer waste treatment, and the silicon wafer waste cleaning fluid residue removing equipment comprises a base; the bottom of the mounting plate is fixedly connected with the top of the base; the bottom of the rotating motor is fixedly connected with the top of the mounting plate; the top of the placing device is fixedly connected with the output end of the rotating motor, and the placing device is used for placing silicon wafer waste; the outer side of the cleaning device is fixedly connected with the top of the base; and the bottom of the air drying device is fixedly connected with the top of the mounting plate. According to the device, silicon wafer waste is cleaned through the cleaning device, cleaning liquid residues on the silicon wafer waste are washed away, meanwhile, the silicon wafer waste is driven by the rotating motor to rotate, liquid is thrown away from the surface of an object through centrifugal force, the liquid attached to the surface of a silicon wafer is reduced, and the cleaning liquid residues are removed.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer waste treatment, and in particular to a device for removing residual cleaning liquid of silicon wafer waste. Background Art

[0002] During the production and processing of silicon wafers, a large amount of silicon wafer waste is generated. These silicon wafer wastes usually need to be cleaned to remove surface impurities and cleaning fluid residues.

[0003] However, traditional cleaning methods often have some problems. Cleaning liquid is likely to remain on the surface of the silicon wafer waste after cleaning. The cleaning liquid usually contains specific chemical components, such as organic solvents, inorganic acids, alkaline hydrogen peroxide solutions, etc. If these residual cleaning liquids are not removed in time, they may have an adverse effect on the quality and performance of the silicon wafer, such as causing silicon wafer corrosion and affecting subsequent processing. In order to solve the above problems, we propose a silicon wafer waste cleaning liquid residue removal device. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention solves the technical problems thereof by adopting the following technical solutions: a device for removing residual cleaning liquid of waste silicon wafers, comprising a base; a mounting plate, the bottom of the mounting plate being fixedly connected to the top of the base; a rotating motor, the bottom of the rotating motor being fixedly connected to the top of the mounting plate; a placing device, the top of the placing device being fixedly connected to the output end of the rotating motor, the placing device being used to place waste silicon wafers; a cleaning device, the outer side of the cleaning device being fixedly connected to the top of the base; an air drying device, the bottom of the air drying device being fixedly connected to the top of the mounting plate; a recycling box, the The bottom of the recycling box is fixedly connected to the bottom of the inner cavity of the base; the cleaning device includes a cleaning component, the outer side of the cleaning component is fixedly connected to the top of the base, the bottom of the cleaning component passes through the base and is fixedly connected to a guide pipe, the bottom of the guide pipe is fixedly connected to the top of the recycling box, and the outer side of the cleaning component is fixedly connected to a water supply component. By setting up the cleaning device, the silicon wafer waste is cleaned to wash away the cleaning liquid residue on the silicon wafer waste. At the same time, the silicon wafer waste is driven to rotate by a rotating motor, and the liquid is thrown off the surface of the object by centrifugal force, thereby reducing the liquid attached to the surface of the silicon wafer and removing the cleaning liquid residue.

[0005] Preferably, the cleaning component includes a cleaning chamber, the outer side of the cleaning chamber is fixedly connected to the top of the base, an overflow groove is opened in the wall of the cleaning chamber, and a guide chamber is fixedly connected to the outer side of the cleaning chamber, and the bottom of the guide chamber is fixedly connected to the top of the guide tube. When in use, the cleaning chamber is used to hold clean water, and the overflow groove allows excess cleaning liquid to flow out. By setting up the cleaning chamber, the cleaning and treatment of silicon wafer waste can be achieved, and the silicon wafer waste can be recycled.

[0006] Preferably, a driving motor is fixedly installed at the bottom of the guide bin, and the output end of the driving motor passes through the guide bin and is fixedly connected to a lead screw. The outer side of the lead screw is threadedly connected to a shielding ring, and the inner side of the shielding ring is slidably connected to the outer side of the cleaning bin. By setting a cleaning component, the working state of the cleaning bin can be adjusted as needed, which facilitates the removal of cleaning liquid on the surface of silicon wafer waste and improves the cleaning effect and efficiency.

[0007] Preferably, the water supply assembly includes a water supply pipe, the outer side of the water supply pipe is fixedly connected to the top of the cleaning bin, the end of the water supply pipe away from the cleaning bin is fixedly connected to a filter shell, the bottom of the filter shell is fixedly connected to the top of the base, and the side of the filter shell away from the water supply pipe is fixedly connected to a connecting pipe. By setting up the water supply assembly, water is delivered to the silicon wafer waste to rinse the cleaning liquid remaining on the surface of the waste.

[0008] Preferably, a first sieve plate is fixedly connected to the inner side of the filter shell, and a second sieve plate is fixedly connected to the inner side of the filter shell away from the first sieve plate. By setting two sieve plates, clean water is filtered to avoid impurities in the clean water that affect the cleaning effect.

[0009] Preferably, a rotating rod is rotatably connected to one side of the first sieve plate close to the second sieve plate, and an end of the rotating rod away from the first sieve plate is rotatably connected to the outer side of the second sieve plate. A rotating blade is fixedly connected to the outer side of the rotating rod, and brushes are fixedly connected to both sides of the rotating blade. By arranging a water supply assembly, clean cleaning water can be provided to the cleaning assembly, while avoiding clogging of the sieve plate and ensuring the stability of the water supply.

[0010] Preferably, the placing device includes a connecting rod, the top of the connecting rod is fixedly connected to the output end of the rotating motor, the bottom of the connecting rod is fixedly connected to a placing bin, the top of the placing bin is slidably connected to a top cover, the inner side of the top cover is fixedly connected to a sliding column, the inner side of the sliding column is slidably connected to the outer side of the connecting rod, and the outer side of the connecting rod is fixedly connected to a connecting thread. By setting up the placing device, silicon wafer waste is placed and the position of the waste is limited to prevent the silicon wafers from flying out.

[0011] Preferably, the air-drying device includes a fan, the bottom of which is fixedly connected to the top of the mounting plate, the outer side of the fan is fixedly connected to an air supply pipe, and the end of the air supply pipe away from the fan is fixedly connected to an air outlet assembly. By setting up the air-drying device, silicon wafer waste can be air-dried, the speed at which liquid leaves can be accelerated, work efficiency can be improved, and subsequent processing time can be reduced.

[0012] Preferably, the air outlet assembly includes a knob, the bottom of the knob is rotatably connected to the top of the mounting plate, the bottom of the knob passes through the mounting plate and is fixedly connected to a threaded rod, the outer side of the threaded rod is threadedly connected to a movable seat, the top of the movable seat is fixedly connected to the bottom end of the air supply pipe, the bottom of the movable seat is fixedly connected to the air outlet pipe, the bottom end of the air supply pipe passes through the movable seat and is connected to the top of the air outlet pipe. By setting the air outlet assembly, silicon wafer waste can be air-dried and the drying speed of the silicon wafer waste can be accelerated. At the same time, the position of the airflow can be adjusted, so that the air-drying device is more flexible to use.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention cleans the waste silicon wafers by setting a cleaning device to wash away the residual cleaning liquid on the waste silicon wafers. At the same time, the waste silicon wafers are driven to rotate by a rotating motor, and the liquid is thrown off the surface of the object by centrifugal force, thereby reducing the liquid attached to the surface of the silicon wafer and removing the residual cleaning liquid.

[0014] 2. The present invention can adjust the working state of the cleaning chamber according to needs by setting a cleaning component, which is convenient for removing the cleaning liquid on the surface of the silicon wafer waste and improving the cleaning effect and efficiency.

[0015] 3. The present invention can provide clean cleaning water for the cleaning component by arranging a water supply component, while avoiding clogging of the screen plate and ensuring the stability of water supply.

[0016] 4. The present invention provides an air drying device to air dry the silicon wafer waste, thereby accelerating the drying speed of the silicon wafer waste. At the same time, the position where the air flow is blown out can be adjusted, making the air drying device more flexible to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the present invention; Figure 2 is a cross-sectional view of the present invention; Figure 3 It is a schematic structural diagram of the cleaning device of the present invention; Figure 4 is a structural sectional view of the cleaning device of the present invention; Figure 5 is a structural cross-sectional view of the filter housing of the present invention; Figure 6 It is a structural schematic diagram of the placement device of the present invention; Figure 7 It is a structural exploded diagram of the placement device of the present invention; Figure 8 It is a structural schematic diagram of the air-drying device of the present invention; Fig. 9 It is a structural schematic diagram of the air outlet component of the present invention.

[0018] In the figure: 1. base; 2. mounting plate; 3. rotating motor; 4. placing device; 41. connecting rod; 42. placing bin; 43. top cover; 44. sliding column; 45. connecting thread; 5. cleaning device; 51. water supply assembly; 511. connecting pipe; 512. filter shell; 121. first sieve plate; 122. second sieve plate; 123. rotating rod; 124. rotating blade; 125. brush; 513. water supply pipe; 52. cleaning assembly; 521. cleaning bin; 522. overflow trough; 523. guide bin; 524. driving motor; 525. lead screw; 526. shielding ring; 53. guide pipe; 6. air drying device; 61. fan; 62. air supply pipe; 63. air outlet assembly; 631. knob; 632. threaded rod; 633. movable seat; 634. air outlet pipe; 7. recycling box. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses. Example 1

[0020] like Figure 1-Figure 7As shown, the present invention provides a technical solution: a device for removing residual cleaning liquid of waste silicon wafers, comprising a base 1; a mounting plate 2, the bottom of the mounting plate 2 is fixedly connected to the top of the base 1; a rotating motor 3, the bottom of the rotating motor 3 is fixedly connected to the top of the mounting plate 2; a placing device 4, the top of the placing device 4 is fixedly connected to the output end of the rotating motor 3, and the placing device 4 is used to place waste silicon wafers; a cleaning device 5, the outer side of the cleaning device 5 is fixedly connected to the top of the base 1; an air drying device 6, the bottom of the air drying device 6 is fixedly connected to the top of the mounting plate 2; a recycling box 7, the bottom of the recycling box 7 is fixedly connected to the bottom of the inner cavity of the base 1; the cleaning device 5 includes a cleaning component 52, the outer side of the cleaning component 52 is fixedly connected to the top of the base 1, and the cleaning component 52 is fixedly connected to the bottom of the inner cavity of the base 1. The bottom of the washing component 52 passes through the base 1 and is fixedly connected with a guide pipe 53. The bottom of the guide pipe 53 is fixedly connected to the top of the recovery box 7. The outer side of the washing component 52 is fixedly connected with a water supply component 51. When in use, the silicon wafer waste is placed in the placement device 4, and the rotating motor 3 drives the placement device 4 to rotate. The water supply component 51 provides clean water for the washing component 52. The washing device 5 washes the silicon wafer waste. The cleaned liquid flows into the recovery box 7 through the guide pipe 53. By setting up the washing device 5, the silicon wafer waste is washed and the residual cleaning liquid on the silicon wafer waste is washed away. At the same time, the silicon wafer waste is driven to rotate by the rotating motor 3, and the liquid is thrown off the surface of the object by centrifugal force, thereby reducing the liquid attached to the surface of the silicon wafer and removing the residual cleaning liquid.

[0021] The cleaning component 52 includes a cleaning chamber 521, the outer side of the cleaning chamber 521 is fixedly connected to the top of the base 1, an overflow groove 522 is opened in the wall of the cleaning chamber 521, and a guide chamber 523 is fixedly connected to the outer side of the cleaning chamber 521, and the bottom of the guide chamber 523 is fixedly connected to the top of the guide pipe 53. When in use, the cleaning chamber 521 is used to contain clean water, and the overflow groove 522 can allow excess cleaning liquid to flow out. When cleaning, the water supply component 51 is connected to a water source, and the water supply component 51 sends clean water into the cleaning chamber 521. The water flow gathers in the cleaning chamber 521, and the rotating motor 3 drives the silicon wafer waste to contact with the clean water. The clean water washes away the residue on the surface of the silicon wafer waste. After cleaning is completed, the clean water flows along the overflow groove 522 to the inside of the guide chamber 523, and then flows along the guide pipe 53 to the inside of the recycling box 7. By setting the cleaning chamber 521, the cleaning and treatment of the silicon wafer waste is realized, and the silicon wafer waste is recycled.

[0022] A driving motor 524 is fixedly installed at the bottom of the guide bin 523, and the output end of the driving motor 524 passes through the guide bin 523 and is fixedly connected to a lead screw 525. The outer side of the lead screw 525 is threadedly connected to a shielding ring 526, and the inner side of the shielding ring 526 is slidably connected to the outer side of the cleaning bin 521. When in use, the shielding ring 526 blocks the overflow groove 522, making it difficult for water to flow out of the cleaning bin 521. The water flows inside the cleaning bin 521, and the water level rises to above the silicon wafer waste. After cleaning is completed, the driving motor 524 drives the lead screw 525 to rotate, so that the shielding ring 526 slides on the outer side of the cleaning bin 521, and the shielding ring 526 is away from the overflow groove 522. At this time, the water will flow out along the overflow groove 522. By setting the cleaning component 52, the working state of the cleaning bin 521 can be adjusted as needed, which is convenient for removing the cleaning liquid on the surface of the silicon wafer waste, thereby improving the cleaning effect and efficiency.

[0023] The water supply component 51 includes a water supply pipe 513, the outer side of the water supply pipe 513 is fixedly connected to the top of the cleaning chamber 521, the end of the water supply pipe 513 away from the cleaning chamber 521 is fixedly connected to the filter shell 512, the bottom of the filter shell 512 is fixedly connected to the top of the base 1, and the side of the filter shell 512 away from the water supply pipe 513 is fixedly connected to the connecting pipe 511. When in use, the external water source sends water into the connecting pipe 511, the water flows into the filter shell 512, and then flows into the cleaning component 52 along the water supply pipe 513. By setting the water supply component 51, the water is sent to the silicon wafer waste to rinse the cleaning liquid remaining on the surface of the waste.

[0024] A first sieve plate 121 is fixedly connected to the inner side of the filter shell 512, and a second sieve plate 122 is fixedly connected to the inner side of the filter shell 512 away from the first sieve plate 121. The first sieve plate 121 and the second sieve plate 122 are arranged inside the filter shell 512. After the water flows through the two sieve plates and then flows along the water supply pipe 513 to the inside of the cleaning component 52, the two sieve plates are arranged to filter the clean water to avoid the presence of impurities in the clean water, which affects the cleaning effect.

[0025] A rotating rod 123 is rotatably connected to one side of the first sieve plate 121 close to the second sieve plate 122, and one end of the rotating rod 123 away from the first sieve plate 121 is rotatably connected to the outer side of the second sieve plate 122. A rotating blade 124 is fixedly connected to the outer side of the rotating rod 123, and brushes 125 are fixedly connected to both sides of the rotating blade 124. When in use, the rotating blade 124 on the rotating rod 123 rotates under the action of water flow, driving the brush 125 to clean the sieve plate to prevent the sieve plate from being blocked. By setting up the water supply component 51, clean cleaning water can be provided to the cleaning component 52, while preventing the sieve plate from being blocked, thereby ensuring the stability of water supply.

[0026] The placing device 4 includes a connecting rod 41, the top of the connecting rod 41 is fixedly connected to the output end of the rotating motor 3, the bottom of the connecting rod 41 is fixedly connected to a placing bin 42, the top of the placing bin 42 is slidably connected to a top cover 43, the inner side of the top cover 43 is fixedly connected to a sliding column 44, the inner side of the sliding column 44 is slidably connected to the outer side of the connecting rod 41, the outer side of the connecting rod 41 is fixedly connected to a connecting thread 45, and the sliding column 44 is provided with a thread. When in use, the top cover 43 of the placing device 4 is moved upward to the connecting thread 45, and the sliding column 44 is connected to the connecting rod 41. The threaded connection 45 is threadedly connected to fix the top cover 43 above the connecting rod 41. At this time, the silicon wafer waste is placed inside the placement bin 42, and then the top cover 43 is lowered and fixed above the placement bin 42. The top cover 43 fixes the silicon wafer waste inside the placement bin 42. During cleaning, the rotating motor 3 drives the silicon wafer waste in the placement device 4 to rotate, so that the waste is in contact with the water flow, so that the water flow washes away the cleaning liquid residue on the surface of the waste. By setting the placement device 4, the silicon wafer waste is placed and the position of the waste is limited to prevent the silicon wafer from flying out.

[0027] Working principle: When in use, the top cover 43 of the placement device 4 is moved upward to the connection thread 45, the sliding column 44 is threadedly connected with the connection thread 45, and the top cover 43 is fixed above the connecting rod 41. At this time, the waste silicon wafers are placed inside the placement bin 42, and then the top cover 43 is lowered and fixed above the placement bin 42. The top cover 43 fixes the waste silicon wafers inside the placement bin 42; During cleaning, the water supply assembly 51 is connected to a water source, and the external water source delivers water into the connecting pipe 511, and the water flows into the filter housing 512. The filter housing 512 is provided with a first sieve plate 121 and a second sieve plate 122. After the water is filtered by the two sieve plates, it flows along the water supply pipe 513 into the cleaning assembly 52. ​​At the same time, the rotating blades 124 on the rotating rod 123 rotate under the action of the water flow, driving the brush 125 to clean the sieve plate to prevent the sieve plate from being blocked. The shielding ring 526 blocks the overflow groove 522, making it difficult for the water to flow out of the cleaning chamber 521. The water gathers inside the cleaning chamber 521, and the water level rises above the silicon wafer waste. The rotating motor 3 drives the silicon wafer waste in the placement device 4 to rotate, so that the waste contacts the water flow, and the water flow washes away the cleaning liquid residue on the surface of the waste. After cleaning is completed, the driving motor 524 drives the lead screw 525 to rotate, so that the shielding ring 526 slides on the outside of the cleaning chamber 521, and the shielding ring 526 moves away from the overflow groove 522. The clean water flows along the overflow groove 522 to the inside of the guide chamber 523, and then flows along the guide pipe 53 to the recovery box 7 inside the base 1. The rotating motor 3 drives the silicon wafer waste to rotate, and uses centrifugal force to throw the liquid off the surface of the silicon wafer waste, thereby reducing the liquid adhering to the surface of the silicon wafer. Example 2

[0028] like Figure 8-Figure 9 As shown, the air-drying device 6 includes a fan 61, the bottom of the fan 61 is fixedly connected to the top of the mounting plate 2, the outer side of the fan 61 is fixedly connected to the air supply pipe 62, and the end of the air supply pipe 62 away from the fan 61 is fixedly connected with an air outlet component 63. When in use, the fan 61 on the mounting plate 2 is started, and the air flow is sent to the air outlet component 63 through the air supply pipe 62, and the air outlet component 63 drives the air flow to blow toward the waste silicon wafers. By setting the air-drying device 6, the waste silicon wafers can be air-dried, the speed of liquid leaving is accelerated, the work efficiency is improved, and the subsequent processing time is reduced.

[0029] The air outlet assembly 63 includes a knob 631, the bottom of which is rotatably connected to the top of the mounting plate 2, the bottom of the knob 631 passes through the mounting plate 2 and is fixedly connected to a threaded rod 632, the outer side of the threaded rod 632 is threadedly connected to a movable seat 633, the top of the movable seat 633 is fixedly connected to the bottom end of the air supply pipe 62, the bottom of the movable seat 633 is fixedly connected to an air outlet pipe 634, the bottom end of the air supply pipe 62 passes through the movable seat 633 and is connected to the top of the air outlet pipe 634. When in use, the threaded rod 632 is driven to rotate by the knob 631 to move the movable seat 633 on the threaded rod 632, thereby adjusting the position of the air outlet pipe 634 to air-dry the cleaned silicon wafer waste. By setting the air outlet assembly 63, the silicon wafer waste is air-dried and the drying speed of the silicon wafer waste is accelerated. At the same time, the position of the air flow can be adjusted, so that the air drying device 6 is more flexible to use.

[0030] Working principle: When in use, the threaded rod 632 is driven to rotate by the knob 631, so that the movable seat 633 moves on the threaded rod 632, thereby adjusting the position of the air outlet pipe 634 and the position where the airflow of the air-drying device 6 is blown out. After cleaning is completed, the fan 61 on the mounting plate 2 is started, and the airflow is sent to the air outlet component 63 through the air supply pipe 62. The air outlet component 63 drives the airflow to blow toward the waste silicon wafers to dry the waste silicon wafers.

[0031] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A device for removing residual cleaning liquid from waste silicon wafers, characterized in that: include: Base (1); A mounting plate (2), wherein the bottom of the mounting plate (2) is fixedly connected to the top of the base (1); A rotating motor (3), wherein the bottom of the rotating motor (3) is fixedly connected to the top of the mounting plate (2); A placing device (4), the top of which is fixedly connected to the output end of the rotating motor (3), and the placing device (4) is used to place silicon wafer waste; A cleaning device (5), the outer side of the cleaning device (5) being fixedly connected to the top of the base (1); An air drying device (6), wherein the bottom of the air drying device (6) is fixedly connected to the top of the mounting plate (2); A recovery box (7), the bottom of which is fixedly connected to the bottom of the inner cavity of the base (1); The cleaning device (5) comprises a cleaning component (52), the outer side of the cleaning component (52) being fixedly connected to the top of the base (1), the bottom of the cleaning component (52) penetrating the base (1) and being fixedly connected to a guide pipe (53), the bottom of the guide pipe (53) being fixedly connected to the top of the recovery box (7), and the outer side of the cleaning component (52) being fixedly connected to a water supply component (51).

2. The device for removing residual silicon wafer cleaning liquid according to claim 1, characterized in that: The cleaning assembly (52) comprises a cleaning chamber (521), the outer side of the cleaning chamber (521) being fixedly connected to the top of the base (1), an overflow groove (522) being provided in the wall of the cleaning chamber (521), a guide chamber (523) being fixedly connected to the outer side of the cleaning chamber (521), and the bottom of the guide chamber (523) being fixedly connected to the top of the guide tube (53).

3. The device for removing residual silicon wafer cleaning liquid according to claim 2, characterized in that: A driving motor (524) is fixedly mounted on the bottom of the guide bin (523); an output end of the driving motor (524) passes through the guide bin (523) and is fixedly connected to a lead screw (525); a shielding ring (526) is threadedly connected to the outer side of the lead screw (525); and the inner side of the shielding ring (526) is slidably connected to the outer side of the cleaning bin (521).

4. The device for removing residual silicon wafer cleaning liquid according to claim 2, characterized in that: The water supply assembly (51) comprises a water supply pipe (513), the outer side of the water supply pipe (513) being fixedly connected to the top of the cleaning chamber (521), one end of the water supply pipe (513) away from the cleaning chamber (521) being fixedly connected to a filter shell (512), the bottom of the filter shell (512) being fixedly connected to the top of the base (1), and one side of the filter shell (512) away from the water supply pipe (513) being fixedly connected to a connecting pipe (511).

5. The device for removing residual silicon wafer cleaning liquid according to claim 4, characterized in that: A first sieve plate (121) is fixedly connected to the inner side of the filter housing (512), and a second sieve plate (122) is fixedly connected to the inner side of the filter housing (512) at a side away from the first sieve plate (121).

6. The device for removing residual silicon wafer cleaning liquid according to claim 5, characterized in that: A rotating rod (123) is rotatably connected to a side of the first sieve plate (121) close to the second sieve plate (122); an end of the rotating rod (123) away from the first sieve plate (121) is rotatably connected to the outer side of the second sieve plate (122); a rotating blade (124) is fixedly connected to the outer side of the rotating rod (123); and brushes (125) are fixedly connected to both sides of the rotating blade (124).

7. The device for removing residual silicon wafer cleaning liquid according to claim 1, characterized in that: The placement device (4) comprises a connecting rod (41), the top of the connecting rod (41) is fixedly connected to the output end of the rotating motor (3), the bottom of the connecting rod (41) is fixedly connected to a placement bin (42), and the top of the placement bin (42) is slidably connected to a top cover (43).

8. The device for removing residual silicon wafer cleaning liquid according to claim 7, characterized in that: The inner side of the top cover (43) is fixedly connected to a sliding column (44), the inner side of the sliding column (44) is slidably connected to the outer side of the connecting rod (41), and the outer side of the connecting rod (41) is fixedly connected to a connecting thread (45).

9. The device for removing residual silicon wafer cleaning liquid according to claim 1, characterized in that: The air drying device (6) comprises a fan (61), the bottom of the fan (61) being fixedly connected to the top of the mounting plate (2), the outer side of the fan (61) being fixedly connected to an air supply pipe (62), and the end of the air supply pipe (62) away from the fan (61) being fixedly connected to an air outlet assembly (63).

10. The device for removing residual silicon wafer cleaning liquid according to claim 9, characterized in that: The air outlet assembly (63) comprises a knob (631), the bottom of the knob (631) being rotatably connected to the top of the mounting plate (2), the bottom of the knob (631) passing through the mounting plate (2) and being fixedly connected to a threaded rod (632), the outer side of the threaded rod (632) being threadedly connected to a movable seat (633), the top of the movable seat (633) being fixedly connected to the bottom end of the air supply pipe (62), and the bottom of the movable seat (633) being fixedly connected to an air outlet pipe (634).

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